FSUSB43L10X

DATA SHEET www.onsemi.com Low-Power, Two-Port, High-Speed, USB2.0 (480 Mbps) Switch UQFN10 1.6 y 1.20 CASE 523AZ FSUSB43 MARKING DIAGRAM Description The FSUSB43 is a bi−directional, low−power, two−port, high−speed, USB2.0 switch. Configured as a double−pole, double−throw (DPDT) switch, it is optimized for switching between two high−speed (480 Mbps) sources or a high−speed and full−speed (12 Mbps) source. The FSUSB43 is compatible with the requirements of USB2.0 and features an extremely low on capacitance (CON) of 5.7 pF. The wide bandwidth of this device (720 MHz) exceeds the bandwidth needed to pass the third harmonic, resulting in signals with minimum edge and phase distortion. Superior channel−to−channel crosstalk also minimizes interference. The FSUSB43 contains special circuitry on the switch I/O pins for applications where the VCC supply is powered−off (VCC = 0), which allows the device to withstand an over−voltage condition. This minimizes current consumption even when the control voltage applied to the SEL pin is lower than the supply voltage (VCC). This feature is especially valuable to mobile applications, such as cell phones, allowing for direct interface with the general−purpose I/Os of the baseband processor. Other applications include switching and connector sharing in portable cell phones, PDAs, digital cameras, printers, and notebook computers. Features • Over−Voltage Tolerance (OVT) on all USB Ports up to 5.25 V Pin 1 JH&K XYZ JH &K X Y Z PIN CONNECTION VCC HSD1+ 1 HS D 1 − SEL 2 8 D+ HSD2+ 3 7 D− HSD2 − 4 6 /OE without External Components 5 GND (Top View) ANALOG SYMBOL ♦ • • • • 10 9 • Low On Capacitance: 5.7 pF Typical • Low On Resistance: 3.9 Low On Resistance: 3.9 W Typical Typical • Low Power Consumption: 1 mA Maximum 20 mA Maximum ICCT over an Expanded Voltage Range (VIN = 1.8 V, VCC = 4.3 V) Wide −3 db Bandwidth: >720 MHz Packaged in 10−Lead MicroPakTM (1.6 x 2.1 mm) 8 kV ESD Rating, > 16 kV Power/GND ESD Rating Power−Off Protection on All Ports when VCC = 0 V ♦ D+/D− Pins Tolerate up to 5.25 V = Specific Device Code = 2 Digit Lot Run Code = Year = 2 Week Data Code = Plant Code HSD1+ D+ HSD2+ HSD1- D− HSD2- Typical Applications • Cell phone, PDA, Digital Camera, and Notebook • LCD Monitor, TV, and Set−Top Box Sel Control /OE ORDERING INFORMATION See detailed ordering and shipping information on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2008 June, 2022 − Rev. 4 1 Publication Order Number: FSUSB43/D FSUSB43 Table 1. PIN DESCRIPTION Pin # Name 1 HSD1+ Multiplexed Source Inputs 2 HSD1− Multiplexed Source Inputs 3 HSD2+ Multiplexed Source Inputs 4 HSD2− Multiplexed Source Inputs 5 GND 6 OE Switch Enable 7 D− USB Data Bus 8 D+ USB Data Bus 9 SEL Switch Select 10 VCC Supply Voltage Description Ground Table 2. TRUTH TABLE SEL OE Function X HIGH Disconnect LOW LOW D+, D− = HSD1+, HSD1− HIGH LOW D+, D− = HSD2+, HSD2− Table 3. ABSOLUTE MAXIMUM RATINGS Symbol VCC VCNTRL WSW IIK Parameter Min Max Unit Supply Voltage −0.5 +5.5 V DC Input Voltage (SEL, OE) (Note 1) −0.5 VCC V ALL PINS for VCC 0 to 5.5 V −0.5 5.5 V DC Input Diode Current −50 IOUT DC Output Current TSTG Storage Temperature ESD Human Body Model: JEDEC JESD22−A114 mA 100 mA +150 °C All Pins 8 kV I/O to GND 9 Power to GND 16 −65 Charged Device Model: JEDEC JESD22−C101 2 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed. Table 4. RECOMMENDED OPERATING CONDITIONS Symbol VCC VCNTRL VSW TA Parameter Min Max Unit 2.4 4.4 V 0 VCC V Switch I/O Voltage −0.5 4.5 V Operating Temperature −40 +125 °C Supply Voltage Control Input Voltage (SEL, OE) (Note 2) Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 2. The control input must be held HIGH or LOW; it must not float. www.onsemi.com 2 FSUSB43 Table 5. DC ELECTRICAL CHARACTERISTICS TA (Note 3) Symbol Parameter Conditions IIN = −18 mA VCC (V) Min Typ 3.0 Max Unit −1.2 V VIK Clamp Diode Voltage VIH Input Voltage High 2.4 to 3.6 1.3 4.3 1.7 VIL Input Voltage Low 2.4 to 3.6 0.5 V 4.3 0.7 V V V IIN Control Input Leakage VSW = 0 V to VCC 4.3 −1.0 1.0 mA IOZ Off State Leakage 0 ≤ Dn, HSD1n, HSD2n ≤ 3.6 V 4.3 −2.0 2.0 mA IOFF Power−Off Leakage Current (All I/O Ports) VSW = 0 V to 4.3 V, VCC = 0 V (Figure 2) 0 −2 2 mA RON HS Switch On Resistance (Note 4) VSW = 0.4 V, ION = −8 mA (Figure 1) 2.4 4.5 7.5 W 3.0 3.9 6.5 HS Switch On Resistance (Note 4) VSW = 0.4 V, ION = −8 mA −40°C to 125°C (Figure 1) 2.4 4.5 9 3.0 3.9 8 HS Delta RON (Note 5) VSW = 0.4 V, ION = −8 mA 3.0 0.65 IQ Quiescent Supply Current VCNTRL = 0 or VCC, IOUT = 0 4.3 1.0 mA ICCT Increase in IQ Current per Control Voltage and VCC VCNTRL = 2.6 V, VCC = 4.3 V 4.3 10.0 mA VCNTRL = 1.8 V, VCC = 4.3 V 4.3 20.0 mA RON DRON W W Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. All typical values are 25°C, and Min / Max values are −40°C to +85°C unless otherwise specified. 4. Measured by the voltage drop between HSDn and Dn pins at the indicated current through the switch.On resistance is determined by the lower of the voltage on the two (HSDn or Dn ports). 5. Guaranteed by characterization. Table 6. AC ELECTRICAL CHARACTERISTICS TA (Note 3) Symbol Parameter Typ Max Unit 2.4 24 40 ns 3.0 to 3.6 13 30 2.4 15 35 3.0 to 3.6 12 25 0.25 Conditions VCC (V) Min tON Turn−On Time, SEL, OE to Output RL = 50 W, CL = 5 pF, VSW = 0.8 V (Figure 3), (Figure 4) tOFF Turn−Off Time, SEL, OE to Output RL = 50 W, CL = 5 pF, VSW = 0.8 V (Figure 3), (Figure 4) tPD Propagation Delay (Note 6) RL = 50 W, CL = 5 pF −40°C to 125°C (Figure 3), (Figure 5) 3.3 Break−Before−Make Time (Note 6) RL = 50 W, CL = 5 pF, VSW1 = VSW2 = 0.8 V (Figure 7) 2.4 2.0 10 3.0 to 3.6 2.0 6.5 OIRR Off Isolation (Note 6) RL = 50 W, f = 240 Mhz (Figure 9) 3.0 to 3.6 −30 dB Xtalk Non−Adjacent Channel Crosstalk (Note 6) RL = 50 W, f = 240 Mhz (Figure 10) 3.0 to 3.6 −45 dB −3dB Bandwidth (Note 6) RL = 50 W, CL = 0 pF (Figure 8) 3.0 to 3.6 720 MHz 550 MHz tBBM BW RL = 50 W, CL = 5 pF (Figure 8) ns ns ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 6. Guaranteed by characterization. www.onsemi.com 3 FSUSB43 Table 7. USB HIGH−SPEED−RELATED AC ELECTRICAL CHARACTERISTICS TA (Note 3) VCC (V) Typ Max Parameter tSK(P) Skew of Opposite Transitions of the Same Output (Note 7) RL = 50 W, CL = 5 pF (Figure 6) 3.0 to 3.6 20 ps Total Jitter (Note 7) RL = 50 W, CL = 5 pF, tr = tf = 500 ps (10−90%) at 480 Mbps (PRBS = 215 – 1) 3.0 to 3.6 200 ps tJ Conditions Min Symbol Unit Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 7. Guaranteed by characterization. Table 8. CAPACITANCE TA (Note 3) Symbol Parameter Conditions Min Typ CIN Control Pin Input Capacitance (Note 8) VCC = 0 V 1.5 CON D+/D− On Capacitance (Note 8) VCC = 3.3 V, OE = 0 V, −40°C to 125°C f = 240 Mhz (Figure 12) 5.5 COFF D1n, D2n Off Capacitance (Note 8) VCC and OE = 3.3 V (Figure 11) 2.0 8. Guaranteed by characterization. www.onsemi.com 4 Max Unit pF FSUSB43 TEST DIAGRAMS VON IDn(OFF) NC A HSDn VSW Dn Select VSW GND GND VSEL = 0 or VCC ION Select GND **Each switch port is tested separately VSEL = 0 or VCC RON = VON / ION Figure 1. On Resistance Figure 2. Off Leakage HSDn tRISE = 2,5 ns Dn VSW RL CL GND R S VOUT VCC Input − VOE, VSEL GND 10% GND VSEL 90% VCC/2 10% 90% 90% Output − VOUT VOL RL, RS, and CL are functions of the application environment (see AC Tables for specific values) CL includes test fixture and stray capacitance. Figure 3. AC Test Circuit Load tON +400 mV 400 mV Input 0V 50% 50% −400 mV tPHL tPLH VOH 50% tOFF Figure 4. Turn−On / Turn−Off Waveforms tRISE = 500 ps Output 90% VCC/2 VOH GND tFALL = 2,5 ns 50% 10% 90% 0V tFALL = 500 ps 90% 10% Output VOL tPHL Figure 5. Propagation Delay (tRtF − 500 ps) tPLH Figure 6. Intra-Pair Skew Test tSK(P) www.onsemi.com 5 FSUSB43 TEST DIAGRAMS (Continued) tRISE = 2,5 ns HSDn Dn VSW1 GND CL VSW2 RL 10% VOUT VOUT GND GND RS 90% VCC/2 Input − VSEL 0.9*VOUT 0.9*VOUT tBBM VSEL RL, RS, and CL are functions of the application environment (see AC Tables for specific values) CL includes test fixture and stray capacitance. GND Figure 7. Break−Before−Make Interval Timing Network Analyzer Network Analyzer RS RS GND VIN VS RT GND VSEL GND GND RT VSEL GND VIN GND GND VOUT VS VOUT GND RT GND GND Off isolation = 20 Log (VOUT / VIN) RS, and RT are functions of the application environment (see AC Tables for specific values). RS, and RT are functions of the application environment (see AC Tables for specific values). Figure 8. Bandwidth Figure 9. Channel Off Isolation Network Analyzer NC RS VIN GND VS GND VSEL RT GND GND GND RS, and RT are functions of the application environment (see AC Tables for specific values). 6 VOUT GND Crosstalk = 20 Log (VOUT / VIN) Figure 10. Non-Adjacent Channel-to-Channel Crosstalk www.onsemi.com RT FSUSB43 TEST DIAGRAMS (Continued) HSDn Capacitance Meter S Capacitance Meter HSDn S VSEL = 0 or VCC VSEL = 0 or VCC HSDn HSDn Figure 11. Channel Off Capacitance Figure 12. Channel On Capacitance Table 9. ORDERING INFORMATION Part Number Device Code Operating Temperature Range Package Shipping† FSUSB43L10X JH −40 to 125°C 10−Lead MicroPak (1.6 x 2.1 mm) JEDEC MO−255B 5000 / Tape and Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. www.onsemi.com 7 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN10 (MICROPAKt), 1.6X2.1, 0.5P CASE 523AZ ISSUE A DOCUMENT NUMBER: DESCRIPTION: 98AON13592G DATE 11 DEC 2019 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. UQFN10 (MICROPAKt), 1.6X2.1, 0.5P PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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