FSV12150V

Ultra-Low VF Schottky Rectifier, 12 A, 150 V FSV12150V Features • • • • • • • Ultra−Low Forward Voltage Drop Low Thermal Resistance Very Low Profile: Typical Height of 1.1 mm Trench Schottky Technology Green Molding Compound as per IEC61249 Standard Non−DAP Option Only These Devices are Pb−Free, Halogen Free and are RoHS Compliant www.onsemi.com Anode 1 3 Cathode Anode 2 Schottky Rectifier 3 Specifications ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Symbol Parameter Value Unit VRRM Peak Repetitive Reverse Voltage 150 V VRWM Working Peak Reverse Voltage 150 V VRMS RMS Reverse Voltage 106 V DC Blocking Voltage 150 V IF(AV) Average Rectified Peak Forward Surge Current 12 A IFSM Non−Repetitive Peak Forward Surge Current 220 A Operating Junction Temperature Range −55 to +150 °C Storage Temperature Range −55 to +150 °C VR TJ TSTG Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2015 April, 2020 − Rev. 3 1 2 1 TO−277 CASE 340BQ MARKING DIAGRAM $Y&Z&3 FSV12150V $Y &Z &3 FSV12150V = ON Semiconductor Logo = Assembly Plant Code = Date Code (Year & Week) = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Publication Order Number: FSV12150V/D FSV12150V THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 1) Symbol Parameter Minimum Land Pattern Maximum Land Pattern Unit RqJA Junction−to−Ambient Thermal Resistance 100 40 °C/W ΨJL Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Anode 15 12 °C/W Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Cathode 6 5 1. The thermal resistances (RqJA & ΨJL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1 and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2). Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils. F S F S F S F S F S Figure 1. Minimum Land Pattern of 2 oz Copper Figure 2. Maximum Land Pattern of 2 oz Copper ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol BVR Parameter Conditions Min Typ Max Unit 150 − − V Breakdown Voltage IR = 0.5 mA VF Forward Voltage Drop IF = 12 A − − 0.82 V IR Reverse Current VR = 150 V − − 30 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ORDERING INFORMATION Part Number Top Mark Package Shipping† FSV12150V FSV12150V TO−277 3L (Pb−Free/Halogen Free) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 2 FSV12150V TYPICAL PERFORMANCE CHARACTERISTICS 100 10 IR, Leakage Current (mA) IF, Forward Current (A) 100 TA = 150°C TA = 125°C 1 TA = 100°C TA = 75°C 0.1 TA = 25°C TA = 150°C 1 TA = 125°C TA = 100°C 0.1 TA = 75°C 0.01 TA = 25°C 1E−3 0.2 0.4 0.6 0.8 1.0 20 30 40 50 60 70 80 90 100 VF, Forward Voltage (V) Percent of Rated Reverse Voltage (%) Figure 3. Typical Forward Characteristics Figure 4. Typical Reverse Characteristics 1400 14 1200 12 IF, Forward Current (A) CJ, Junction Capacitance (pF) 0.01 0.0 10 1000 800 600 400 10 8 6 4 2 200 0 1 10 0 100 25 50 75 100 125 150 VR, Reverse Bias Voltage (V) TC, Case Temperature (5C) Figure 5. Typical Junction Capacitance Figure 6. Forward Current Derating Curve www.onsemi.com 3 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−277−3LD CASE 340BQ ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13861G TO−277−3LD DATE 30 SEP 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative