MC10EL52, MC100EL52
5V ECL Differential Data
and Clock D Flip‐Flop
Description
http://onsemi.com
MARKING
DIAGRAMS*
8
1
SOIC−8
D SUFFIX
CASE 751
1
1
1
> 100 V Machine Model
• PECL Mode Operating Range: VCC = 4.2 V to 5.7 V
•
•
•
•
•
•
•
with VEE = 0 V
NECL Mode Operating Range: VCC = 0 V
with VEE = −4.2 V to −5.7 V
Internal Input Pulldown Resistors on D and CLK
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level 1
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen: Index 28 to 34
Transistor Count = 48 devices
Pb−Free Packages are Available
KEL52
ALYW
G
1
8
HL52
ALYWG
G
4Y M G
G
• 365 ps Propagation Delay
• 2.0 GHz Toggle Frequency
• ESD Protection: > 1 kV Human Body Model,
8
HEL52
ALYW
G
8
8
TSSOP−8
DT SUFFIX
CASE 948R
Features
8
1
4
1
KL52
ALYWG
G
2N M G
G
The MC10EL/100EL52 is a differential data, differential clock D
flip-flop with reset. The device is functionally equivalent to the E452
device with higher performance capabilities. With propagation delays
and output transition times significantly faster than the E452, the
EL52 is ideally suited for those applications which require the ultimate
in AC performance.
Data enters the master portion of the flip-flop when the clock is
LOW and is transferred to the slave, and thus the outputs, upon a
positive transition of the clock. The differential clock inputs of the
EL52 allow the device to also be used as a negative edge triggered
device.
The EL52 employs input clamping circuitry so that under open input
conditions (pulled down to VEE) the outputs of the device will remain
stable.
The 100 Series contains temperature compensation.
1
4
DFN8
MN SUFFIX
CASE 506AA
H = MC10
K = MC100
4Y = MC10
2N = MC100
A = Assembly Location
L
Y
W
M
G
= Wafer Lot
= Year
= Work Week
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 6
1
Publication Order Number:
MC10EL52/D
MC10EL52, MC100EL52
Table 1. TRUTH TABLE
D 1
D
8
D
2
7
VCC
Q
D*
CLK*
Q
L
H
Z
Z
L
H
Z = LOW to HIGH Transition
* Pin will default low when left open.
CLK
CLK
3
6
4
5
Table 2. PIN DESCRIPTION
Q
PIN
VEE
Figure 1. Logic Diagram and Pinout Assignment
FUNCTION
D, D
CLK, CLK
Q, Q
VCC
VEE
ECL Data Input
ECL Clock Input
ECL Data Output
Positive Supply
Negative Supply
EP
(DFN8 only) Thermal exposed
pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative
supply (GND) or leave unconnected, floating open.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 SOIC
8 SOIC
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 SOIC
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 TSSOP
8 TSSOP
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 TSSOP
41 to 44 ± 5%
°C/W
Tsol
Wave Solder
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