DATA SHEET
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Hex Inverting Schmitt
Trigger
14
1
SOIC−14 NB
CASE 751A−03
MM74HCT14
Description
14
The MM74HCT14 utilizes advanced silicon−gate CMOS
technology to achieve the low power dissipation and high noise
immunity of standard CMOS, as well as the capability to drive
10 LS−TTL loads.
The 74HCT logic family is functionally and pinout−compatible
with the standard 74LS logic family. Inputs are protected from damage
due to static discharge by internal diode clamps to VCC and ground.
1
SOIC14
CASE 751EF
14
1
TSSOP−14 WB
CASE 948G
Features
•
•
•
•
•
•
•
•
Typical Propagation Delay: 10 ns
Wide Power Supply Range: 4.5 V – 5.5 V
Low Quiescent Current: 10 mA Maximum
Low Input Current: 1 mA Maximum
Fanout of 10 LS−TTL Loads
Typical Hysteresis Voltage: 0.6 V at VCC = 4.5 V
TTL, LS Pin−out and Input Threshold Compatible
This Device is Pb−Free, Halide Free and is RoHS Compliant
SOIC−14
14
HCT14A
AWLYWW
1
Connection Diagram
VCC
14
MARKING DIAGRAMS
A6 Y6
Y5
A4
A5
13
11
10
12
9
Y4
8
TSSOP−14
14
HCT
14A
ALYWG
G
1
1
A1
2
Y1
3
A2
4
Y2
5
A3
6
7
Y3 GND
HCT14A
A
WL, L
Y
WW, YW
Figure 1. Pin Assignments
Schematic Diagram
= Specific Device Code
= Assembly Location
= Wafer Lot Number
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information on page 4
of this data sheet.
Figure 2. Schematic
© Semiconductor Components Industries, LLC, 1983
November, 2022 − Rev. 2
1
Publication Order Number:
MM74HCT14/D
MM74HCT14
ABSOLUTE MAXIMUM RATINGS
Symbol
Rating
Min
Max
Unit
VCC
Supply Voltage
−0.5
+7.0
V
VIN
DC Input Voltage
−0.5
VCC + 0.5
V
DC Output Voltage
−0.5
VCC + 0.5
V
VOUT
IIK, IOK
Clamp Diode Current
±20
mA
IOUT
DC Output Current, Per Pin
±25
mA
ICC
DC VCC or GND Current, Per Pin
TSTG
TL
Storage Temperature Range
−65
Lead Temperature (Soldering 10 second)
±50
mA
+150
°C
+260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
TA
Parameter
Min
Supply Voltage
Max
Unit
4.5
5.5
V
0
VCC
V
−40
+85
°C
DC Input or Output Voltage
Operating Temperature Range
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
VT+
Parameter
Positive−Going
Threshold Voltage
Conditions
Typ
4.5
1.5
1.2
1.2
5.5
1.7
1.4
1.4
4.5
1.5
1.9
1.9
5.5
1.7
2.1
2.1
4.5
0.9
0.5
0.5
5.5
1.0
0.6
0.6
4.5
0.9
1.2
1.2
5.5
1.0
1.4
1.4
4.5
0.6
0.4
0.4
5.5
0.7
0.4
0.4
4.5
0.6
1.4
1.4
5.5
0.7
1.5
1.5
VIN = VIH or VIL,
⎪IOUT⎪ = 20 mA
4.5
VCC
VCC − 0.1
VCC − 0.1
VIN = VIH or VIL,
⎪IOUT⎪ = 4.0 mA
4.5
4.20
3.98
3.84
VIN = VIH or VIL,
⎪IOUT⎪ = 4.8 mA
5.5
5.20
4.98
4.98
VIN = VIH or VIL,
⎪IOUT⎪ = 20 mA
4.5
0
0.1
0.1
VIN = VIH or VIL,
⎪IOUT⎪ = 4.0 mA
4.5
0.2
0.26
0.33
VIN = VIH or VIL,
⎪IOUT⎪ = 4.8 mA
5.5
0.2
0.26
0.33
VIN = VCC or GND,
VIH or VIL
5.5
±0.1
±1.0
Minimum
Maximum
VT−
Negative−Going
Threshold Voltage
Minimum
Maximum
VH
Hysteresis Voltage
Minimum
Maximum
VOH
VOL
IIN
Minimum HIGH Level
Output Voltage
Maximum LOW Level
Voltage
Maximum Input Current
TA = −40 to +85°C
VCC
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2
Guaranteed Limits
Unit
V
V
V
V
V
mA
MM74HCT14
DC ELECTRICAL CHARACTERISTICS (continued)
TA = +25°C
Symbol
Parameter
ICC
Maximum Quiescent
Supply Current
Conditions
VCC
VIN = VCC or GND,
IOUT = 0 mA
5.5
Typ
TA = −40 to +85°C
Guaranteed Limits
VIN = 2.4 V or 0.5 V
Unit
1.0
10.0
mA
2.4
2.4
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS
(VCC = 5.0 V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns)
Parameter
Symbol
tPHL, tPLH
Maximum Propagation Delay
Typ
Guaranteed Limit
Unit
10
18
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, VCC = 5.0 V ±10%, CL = 50 pF, tr = tf = 6 ns)
TA = +25°C
Symbol
Parameter
Conditions
tPHL, tPLH
Maximum Propagation Delay
tTLH, tTHL
Maximum Output Rise and Fall Time
CPD
Power Dissipation Capacitance (Note 1)
CIN
Maximum Input Capacitance
Typ
9
Per Gate
TA = −40 to +85°C
Guaranteed Limits
20
25
ns
15
19
ns
25
5
Unit
10
pF
10
pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. CPD determines the no−load dynamic power consumption, PD = CPD VCC2f + ICC VCC, and the no load dynamic current consumption,
IS = CPD VCC f + ICC.
Typical Applications
R
VIN
VOUT
MM74HCT14
C
Figure 4. Oscillator Input and Output Waveforms
Figure 3. Low Power Oscillator
The following equations assume t1 + t2 >> tpd0 + tpd1:
t 2 [ RCIn
V CC * V T*
V CC * V T)
(eq. 1)
1
f[
RCIn
V T)ǒV CC*V T*Ǔ
(eq. 2)
V T*ǒV CC*V T)Ǔ
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3
MM74HCT14
ORDERING INFORMATION
Device
MM74HCT14M
MM74HCT14MX
MM74HCT14MTCX
Package
Shipping†
SOIC−14 NB, Case 751A−03
(Pb−Free and Halide Free)
55 Units / Tube
SOIC14, Case 751EF
(Pb−Free and Halide Free)
2500 Units / Tape & Reel
TSSOP−14 WB, Case 948G
(Pb−Free and Halide Free)
2500 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
14
1
SCALE 1:1
D
DATE 03 FEB 2016
A
B
14
8
A3
E
H
L
1
0.25
B
M
DETAIL A
7
13X
M
b
0.25
M
C A
S
B
S
0.10
X 45 _
M
A1
e
DETAIL A
h
A
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
6.50
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
14
14X
1.18
XXXXXXXXXG
AWLYWW
1
1
1.27
PITCH
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−14
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
STYLE 1:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 2:
CANCELLED
STYLE 3:
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 5:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 6:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
STYLE 7:
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC14
CASE 751EF
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13739G
SOIC14
DATE 30 SEP 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−14 WB
CASE 948G
ISSUE C
14
DATE 17 FEB 2016
1
SCALE 2:1
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
DETAIL E
K
A
−V−
K1
J J1
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
G
D
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
GENERIC
MARKING DIAGRAM*
14
SOLDERING FOOTPRINT
XXXX
XXXX
ALYWG
G
7.06
1
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98ASH70246A
DESCRIPTION:
TSSOP−14 WB
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
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Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
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