NCN9252

NCN9252 High-Speed USB 2.0 (480 Mbps) DP3T Switch for USB/UART/Data Multiplexing http://onsemi.com Brief Description USB Connector The NCN9252 is a DP3T switch for combined UART and USB 2.0 high−speed data applications. It allows portable systems to use a single external port to transmit and receive signals to and from three separate locations within the portable system. It is comprised of two switches, each with a single common I/O that alternates between 3 terminals. They are operated together to allow three data sources, such as a USB or UART transceiver, to pass differential data through a shared USB connector port. The NCN9252 features low RON− 4 W (max) at 4.2 V VCC, 5 W (typ) at a 3.3 V VCC. It also features low CON, < 30 pF (max) across the supply voltage range. This performance makes it ideal for both USB full−speed and high−speed applications that require both low RON and CON for effective signal transmission. The NCN9252 is capable of accepting control input signals down to 1.4 V, over a range of VCC supply voltages with minimal leakage current. The NCN9252 is offered in a Pb−Free, 12 pin, 1.7 x 2.0 x 0.5 mm, UQFN package. Features MARKING DIAGRAM 1 UQFN12 MU SUFFIX CASE 523AE AD M G AD = Specific Device Code M = Date Code G = Pb−Free Package APPLICATION DIAGRAM NCN9252 D+ D− D+ D− R L Remote Data USB XCVR • • • • • • • • • • • • • USB 2.0 Signal Routing −3 dB Bandwidth: 525 MHz RON: 4 W Max @ VCC = 4.2 V CON: < 20 pF @ VCC = 3.3 V OVT Protection up to 5.25 V on Common Pins VCC Range: 1.65 V to 4.5 V 3 kV ESD Protection 1.7 x 2.0 x 0.5 mm UQFN12 Package This is a Pb−Free Device USB/UART/Data Multiplexing Shared USB Connector Mobile Phones Portable Devices Rx Tx UART XCVR IN[1:0] From Baseband ORDERING INFORMATION Device NCN9252MUTAG Package UQFN12 (Pb−Free) Shipping† 3000 / Tape & Reel Typical Applications †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2010 May, 2010 − Rev. 0 1 Publication Order Number: NCN9252/D NCN9252 FUNCTIONAL BLOCK DIAGRAM AND PINOUT 1S1 1S2 IN1 PIN DESCRIPTIONS 11 Pin# 1 COM1 2 3 Name 1S2 1S3 VCC 2S3 2S2 2S1 IN2 COM2 GND COM1 IN1 1S1 Direction I/O I/O Input I/O I/O I/O Input I/O Input I/O Input I/O Description Switch #1 Position 2 Signal Line Switch #1 Position 3 Signal Line Power Supply Switch #2 Position 3 Signal Line Switch #2 Position 2 Signal Line Switch #2 Position 1 Signal Line Bit 1 Control Input Select Line Switch #2 Common Signal Line Ground Switch #1 Common Signal Line Bit 0 Control Input Select Line Switch #1 Position 1 Signal Line 1 12 1S3 2 10 VCC 3 Control Logic 9 GND 4 5 6 2S3 4 8 COM2 2S2 5 6 2S1 (Top View) 7 IN2 7 8 9 10 11 12 Figure 1. Internal Block Diagram FUNCTION TABLE IN1 [0] 0 1 0 1 IN2 [1] 0 0 1 1 COM1 Closed to: No Connect 1S1 1S2 1S3 1S1 COM1 1S2 1S3 COM2 Closed to: No Connect 2S1 2S2 2S3 2S1 COM2 2S2 2S3 IN1 IN2 Control Logic Figure 2. Functional Block Diagram http://onsemi.com 2 NCN9252 OPERATING CONDITIONS MAXIMUM RATINGS Symbol VCC VIS VIN ICC IIS_CON IIS_PK IIN TSTG Pins VCC 1Sx, 2Sx COMx IN1, IN2 VCC 1Sx, 2Sx COMx 1Sx, 2Sx COMx IN1, IN2 Control Input Voltage Positive DC Supply Current Analog Signal Continuous Current Analog Signal Peak Current Control Input Current Storage Temperature Range Parameter Positive DC Supply Voltage Analog Signal Voltage Value −0.5 to +5.5 −0.5 to VCC + 0.3 −0.5 to 5.3 −0.5 to 4.6 50 $300 $500 $20 −65 to 150 Closed Switch 10% Duty Cycle V mA mA mA mA °C Condition Unit V V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIS VIN TA Pins VCC 1Sx, 2Sx COMx IN1, IN2 Control Input Voltage Operating Temperature Range Parameter Positive DC Supply Voltage Analog Signal Voltage Value 1.65 to 4.5 GND to VCC GND to 4.5 GND to VCC −40 to 85 V °C Condition Unit V V Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for each section, where applicable. These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions. ESD PROTECTION Pins All Pins Description Human Body Model Minimum Voltage 3 kV http://onsemi.com 3 NCN9252 DC ELECTRICAL CHARACTERISTICS CONTROL INPUT (TYPICAL: T = 255C; VCC = 3.3 V) Symbol VIH Pins INx Parameter Control Input High Test Conditions Figures 3 VCC 2.7 V 3.3 V 4.2 V 2.7 V 3.3 V 4.2 V Min 1.25 1.35 1.50 0.4 0.4 0.5 $1.0 Typ Max Unit V VIL INx Control Input Low Figures 3 V IIN INx Control Input Leakage VIS = GND mA SUPPLY CURRENT AND LEAKAGE (TYPICAL: T = 255C; VCC = 3.3 V, VIN = VCC or GND) Symbol INO/NC (OFF) ICOM (ON) ICC IOFF Pins NC, NO COM VCC Parameter OFF State Leakage ON State Leakage Quiescent Supply Power OFF Leakage VIS = VCC or GND, ID = 0; VIS = GND Test Conditions VCOM = 3.6 V VNC = 1.0 V VCC Min Typ Max $1.0 $1.0 1.0 1.0 Unit mA mA mA mA ON RESISTANCE (TYPICAL: T = 255C; VCC = 3.3 V) Symbol RON Pins Parameter Test Conditions ION = −8 mA, VIS = 0 to VCC; VCC 2.7 V 3.3 V 4.2 V 2.7 V 3.3 V 4.2 V 2.7 V 3.3 V 4.2 V 0.35 Min Typ 5 4 3.5 Max 6 5 4.5 1.3 1.4 1.6 Unit W 1Sx, 2Sx COMx ON Resistance RFLAT 1Sx, 2Sx COMx RON Flatness ION = −8 mA, VIS = 0 to VCC; W DRON 1Sx, 2Sx COMx RON Matching ION = −8 mA, VIS = 0 to VCC; W http://onsemi.com 4 NCN9252 AC ELECTRICAL CHARACTERISTICS TIMING/FREQUENCY (TYPICAL: T = 255C; VCC = 3.3 V, RL = 50 W, CL = 5 pF, f = 1 MHz) Symbol BW THD tON tOFF tBBM 1Sx to 1Sy, 2Sx to 2Sy 1Sy to 1Sx, 2Sy to 2Sx 1Sx to 1Sy, 2Sx to 2Sy Pins Parameter −3 dB Bandwidth Total Harmonic Distortion Turn On Time Turn Off Time Break Before Make 2.0 20 Hz to 20 kHz, 1.0 VPP Test Conditions Min Typ 525 0.01 13 12 30 25 Max Unit MHz % nS nS nS CROSSTALK: (TYPICAL: T = 255C; VCC = 3.3V, RL = 50 W, CL = 35 pF, f = 1MHz) Symbol OIRR Xtalk Pins 1Sx or 2Sx Parameter Off Isolation VIN = 0 Test Conditions Min Typ −60 −60 Max Unit dB dB COMx to COMy Non−Adjacent Channel CAPACITANCE (TYPICAL: T = 255C; VCC = 3.3V, RL = 50 W, CL = 5 pF, f = 1 MHz) Symbol CIN CON COFF Pins INx 1Sx or 2Sx to COM Parameter Control Input Through Switch VCC = 0 V VCC = 3.3 V, VIN = 0 V VCC = VIN = 3.3 V Test Conditions Min Typ 3 16 8 20 Max Unit pF pF pF 1Sx, 2Sx COMx Unselected Port http://onsemi.com 5 NCN9252 Detailed Description The NCN9252 is a DP3T switch designed for applications where a single USB connector is used for multiple data applications within a portable system. Two differential signals from a USB connector can be routed to 3 different end locations. The first, channel 1, is optimized for a high−speed, USB 2.0 transceiver. The second and third, channels 2 and 3, are optimized for UART or remote data applications. Control Inputs Select Logic switch, a signal can pass from the common pin to any of three terminals. Whenever COM1 is closed to terminal 1S2, COM2 will respectively be closed to terminal 2S2. The select logic is controlled by two inputs, IN1 and IN2, connecting the common pins to the terminals according to the function table found on page 2. Since there are four possible control states but only 3 possible terminals, the first combination results in a open connection for all three terminals. The NCN9252 is made up of two, 3−throw switches operating off of the same internal enable signal. For each VIH and VIL Levels 200 190 180 170 160 150 140 130 120 ICC (mA) 110 100 90 V = 3.3 V CC 80 70 60 50 40 30 20 10 0 VCC = 2.7 V 0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 VCC = 4.2 V Figure 3. ICC Leakage Current vs. VIN VIN (V) http://onsemi.com 6 NCN9252 5 4.5 4 3.5 RON (W) 2.5 2 1.5 1 0.5 0 0 0.5 1 1.5 VIN (V) 2 2.5 RON (W) 3 −40°C 85°C 25°C 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0 0.5 1 1.5 VIN (V) 2 2.5 3 85°C 25°C −40°C Figure 4. On−Resistance vs. Input Voltage @ VCC = 2.7 V Figure 5. On−Resistance vs. Input Voltage @ VCC = 3.3 V 4 3.5 3 RON (W) 85°C 25°C −40°C BW (dB) 0 0.5 1 1.5 2 VIN (V) 2.5 3 3.5 4 0 −1 −2 −3 −4 −5 −6 −7 1E06 1E07 1E08 1E09 2.5 2 1.5 1 0.5 0 FREQUENCY (Hz) Figure 6. On−Resistance vs. Input Voltage @ VCC = 4.2 V Figure 7. Bandwidth vs. Frequency 0 −10 −20 MAGNITUDE (dB) −30 THD (%) −40 −50 −60 −70 −80 −90 −100 10000 100000 1E06 1E07 1E08 1E09 0.009 0.008 0.007 0.006 0.005 0.004 0.003 0.002 0.001 0 10 100 1000 10000 100000 FREQUENCY (Hz) FREQUENCY (Hz) Figure 8. Cross Talk vs. Frequency @ 255C Figure 9. Total Harmonic Distortion vs. Frequency http://onsemi.com 7 NCN9252 PACKAGE DIMENSIONS UQFN12 1.7x2.0, 0.4P CASE 523AE−01 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH 0.03 MAX ON BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. DIM A A1 A3 b D E e K L L1 L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.70 BSC 2.00 BSC 0.40 BSC 0.20 ---0.45 0.55 0.00 0.03 0.15 REF D PIN 1 REFERENCE AB L1 DETAIL A NOTE 5 2X 2X 0.10 C 0.10 C 0.05 C 12X 0.05 C A3 8X K 5 7 DETAIL A 1 12X L L2 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative ÉÉ ÉÉ ÉÉ TOP VIEW A A1 SIDE VIEW e 11 E DETAIL B OPTIONAL CONSTRUCTION DETAIL B C SEATING PLANE MOUNTING FOOTPRINT SOLDERMASK DEFINED 2.00 12X b 0.10 0.05 M M CAB C NOTE 3 1 0.32 2.30 11X 0.40 PITCH 0.22 12X 0.69 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NCN9252/D