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NCP639HMN10TCG

NCP639HMN10TCG

  • 厂商:

    ONSEMI(安森美)

  • 封装:

  • 描述:

    NCP639HMN10TCG - 1A CMOS Low-Dropout Voltage Regulator - ON Semiconductor

  • 数据手册
  • 价格&库存
NCP639HMN10TCG 数据手册
NCP693 1A CMOS Low-Dropout Voltage Regulator The NCP693 series of fixed output low dropout linear regulators are designed for portable battery powered applications with high output current requirement up to 1 A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, a current limit circuits for over−current and thermal−shutdown. A standby mode with ultra low supply current can be realized with the chip enable function. The device is housed in the DFN 1.8x2, 0.50P surface mount package. Standard voltage versions are 0.8 V, 1.0 V, 1.2 V, 2.5 V and 3.3 V. Features http://onsemi.com MARKING DIAGRAM XXX XMM UDFN6, 1.8x2, 0.5P CASE 517BA XXXX MM 1 • • • • • • • • • Maximum Operating Voltage of 6.5 V Low Output Voltage Option down to 0.8 V High Accuracy Output Voltage of 1.0% Built−in Auto Discharge Function for D Version These are Pb−Free Devices Battery Powered Instruments Hand−Held Instruments Camcorders and Cameras Portable communication equipments = Specific Device Code = Lot Number Typical Applications PIN DESCRIPTION Vout 1 Vout 2 GND 3 (Top View) 1 2 3 (Top View) 6 Vin 5 Vin 4 CE 6 5 4 ORDERING AND MARKING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. © Semiconductor Components Industries, LLC, 2009 September, 2009 − Rev. 0 1 Publication Order Number: NCP639/D NCP693 Vin Vin Vout Vout Vin Vin Vout Vout Vref Vref CE Current Limit & Thermal Shutdown GND CE Current Limit & Thermal Shutdown GND Version H (NCP693HMNxxTCG) Version D (NCP693DMNxxTCG) Figure 1. Internal Block Diagram PIN FUNCTION DESCRIPTION Pin No. 1 2 3 4 5 6 EP Pin Name Vout Vout GND CE Vin Vin GND Regulated output voltage. Regulated output voltage. Power supply ground. This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. Positive power supply input voltage. Positive power supply input voltage. Power supply ground. Description MAXIMUM RATINGS Rating Input Voltage Enable Voltage Output Voltage Operating Junction Temperature Operating Ambient Temperature Storage Temperature Symbol Vin VCE Vout TJ TA Tstg Value 7 −0.3 to Vin −0.3 to Vin + 0.3 +150 −40 to +85 −55 to +125 Unit V V V °C °C °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per (JEDEC 22−A114−B) Machine Model Method 200 V THERMAL CHARACTERISTICS Rating Junction−to−Ambient PSIJ−Lead 2 Power Dissipation NOTE: Symbol RqJA YJ−L2 PD Test Conditions 1 oz Copper Thickness, 100 mm2 1 oz Copper Thickness, 100 mm2 Typical Value 114 25 880 Unit °C/W °C/W mW Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12. http://onsemi.com 2 NCP693 unless otherwise noted) ELECTRICAL CHARACTERISTICS (Vin = Vout(nom) + 1.0 V, VCE = Vin, Cin = 2.2 mF, Cout = 2.2 mF, TA = 25°C, Characteristic Output Voltage (TA = 25°C, Iout = 10 mA) 0.8 V 1.0 V 1.2 V 2.5 V 3.3 V Output Voltage (TA = − 40°C to 85°C, Iout = 10 mA) 0.8 V 1.0 V 1.2 V 2.5 V 3.3 V Output Current Input Voltage Line Regulation (Vin = Vout + 1.0 V to 6.5 V, Iout = 10 mA) Load Regulation (Iout = 1 mA to 300 mA, Vin = Vout + 2.0 V) Load Regulation (Iout = 1 mA to 1 A, Vin = Vout + 2.0 V) Supply Current (Iout = 0 A, Vin = 6.5 V) Standby Current (VCE = 0 V, Vin = 6.5 V) Short Current Limit (Vout = 0 V) Output Voltage Temperature Coefficient Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Enable Pulldown Current Drop Output Voltage (TA = 25°C, Iout = 300 mA) 0.8 V 1.0 V 1.2 V 2.5 V 3.3 V Drop Output Voltage (TA = 25°C, Iout = 1 A) 0.8 V 1.0 V 1.2 V 2.5 V 3.3 V Ripple Rejection (Ripple 200 mVpp, Iout = 100 mA, f = 1 kHz) Output Noise (BW = 10 Hz to 100 kHz, Iout = 1 mA) Thermal Shutdown Temperature/Hysteresis RDS(on) of additional output transistor (D version only) Vin−Vout Symbol Vout Min 0.785 0.985 1.185 2.475 3.267 0.760 0.960 1.160 2.435 3.214 Typ 0.8 1.0 1.2 2.5 3.3 0.8 1.0 1.2 2.5 3.3 1 1.6 − − − 0.05 20 80 65 0.15 250 − 1.0 − $100 − − 0.3 0.670 0.450 0.300 0.150 0.130 1.150 1.000 0.870 0.500 0.430 70 45 165/30 30 0.780 0.610 0.500 0.310 0.170 1.650 1.450 1.380 1.100 0.650 − − 0.4 6.5 0.1 40 120 90 0.6 Max 0.815 1.015 1.215 2.525 3.333 0.827 1.027 1.227 2.545 3.359 Unit V Vout V Iout Vin Regline Regload03 Regload1 Iss Istby Ish Tc VthCE A V %/V mV mV mA mA mA ppm/°C V mA V Vin−Vout V PSRR Vnoise Tshd/Hyst RDS(on) dB mVrms °C W 2. Maximum package power dissipation limits must be observed. 3. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. http://onsemi.com 3 NCP693 APPLICATIONS INFORMATION A typical application circuit for the NCP693 series is shown in Figure 2. Input Decoupling (C1) A 2.2 mF capacitor either ceramic or tantalum is recommended and should be connected as close as possible to the pins of NCP693 device. Higher values and lower ESR will improve the overall line transient response. Output Decoupling (C2) (NCP693DMNxxTCG) have additional circuitry in order to reach the turn−off speed faster than normal type. When the mode is into standby with CE signal, auto discharge transistor turns on. Hints The minimum decoupling value is 2.2 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. If a tantalum capacitor is used, and its ESR is large, the loop oscillation may result. Because of this, select C2 carefully considering its frequency characteristics. Larger values improve noise rejection and load regulation transient response. Enable Operation Please be sure the Vin and GND lines are sufficiently wide. If their impedance is high, noise pickup or unstable operation may result. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. Thermal The enable pin CE will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to Vin. The D version devices As power across the NCP693 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP693 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. Figure 2. Typical Application Circuit http://onsemi.com 4 NCP693 0.9 0.8 OUTPUT VOLTAGE (V) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 OUTPUT CURRENT (A) 1.4 1.6 Vin = 1.4 V 1.6 V 2.0 V 2.5 V TA = 25°C OUTPUT VOLTAGE (V) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 OUTPUT CURRENT (A) 1.4 1.6 Vin = 1.8 V 3.0 V 2.4 V TA = 25°C Figure 3. Output Voltage vs. Output Current NCP693xMN08TCG 3.0 TA = 25°C 2.5 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 2.0 1.5 1.0 0.5 0.0 0.0 Vin = 2.9 V 3.8 V 3.3 V 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.0 Figure 4. Output Voltage vs. Output Current NCP693xMN12TCG Vin = 3.6 V 5.0 V 4.3 V TA = 25°C 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 5. Output Voltage vs. Output Current NCP693xMN25TCG 70.0 60.0 Figure 6. Output Voltage vs. Output Current NCP693xMN33TCG 70.0 60.0 SUPPLY CURRENT (mA) 50.0 40.0 30.0 20.0 10.0 0.0 Iout = 0 V 0 1 2 3 4 5 INPUT VOLTAGE (V) 6 7 SUPPLY CURRENT (mA) 50.0 40.0 30.0 20.0 10.0 0.0 Iout = 0 V 0 1 2 3 4 5 INPUT VOLTAGE (V) 6 7 Figure 7. Supply Current vs. Input Voltage NCP693xMN08TCG Figure 8. Supply Current vs. Input Voltage NCP693xMN12TCG http://onsemi.com 5 NCP693 70.0 60.0 SUPPLY CURRENT (mA) 50.0 40.0 30.0 20.0 10.0 0.0 Iout = 0 A 0 1 2 3 4 5 INPUT VOLTAGE (V) 6 7 SUPPLY CURRENT (mA) 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 0 1 2 3 4 5 INPUT VOLTAGE (V) Iout = 0 V 6 7 Figure 9. Supply Current vs. Input Voltage NCP693xMN25TCG 0.804 Vout = 0.8 V 0.802 0.800 0.798 0.796 0.794 0.792 −40.0 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 1.210 1.205 1.200 1.195 1.190 1.185 1.215 Figure 10. Supply Current vs. Input Voltage NCP693xMN33TCG Vout = 1.2 V −20.0 0.0 20.0 40.0 60.0 80.0 −40 −20 0 20 40 60 80 TEMPERATURE (°C) TEMPERATURE (°C) Figure 11. Output Voltage vs. Temperature NCP693xMN08TCG Figure 12. Output Voltage vs. Temperature NCP693xMN12TCG 2.520 2.515 OUTPUT VOLTAGE (V) 2.510 2.505 2.500 2.495 2.490 2.485 2.480 −40 −20 0 20 40 60 80 Vout = 2.5 V OUTPUT VOLTAGE (V) 3.310 Vout = 3.3 V 3.300 3.290 3.280 3.270 −40 −20 0 20 40 60 80 TEMPERATURE (°C) TEMPERATURE (°C) Figure 13. Output Voltage vs. Temperature NCP693xMN25TCG Figure 14. Output Voltage vs. Temperature NCP693xMN33TCG http://onsemi.com 6 NCP693 1.4 1.2 DROPOUT VOLTAGE (V) DROPOUT VOLTAGE (V) 1.0 0.8 0.6 0.4 0.2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 TA = 25°C TA = −40°C TA = 85°C 1.0 0.8 0.6 0.4 0.2 0 0.1 TA = −40°C TA = 85°C TA = 25°C 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 15. Dropout Voltage vs. Output Current NCP693xMN08TCG Figure 16. Dropout Voltage vs. Output Current NCP693xMN12TCG 0.6 0.5 DROPOUT VOLTAGE (V) 0.4 0.3 0.2 0.1 0.0 TA = −40°C TA = 25°C TA = 85°C 0.6 0.5 0.4 0.3 0.2 0.1 0.0 TA = −40°C TA = 25°C TA = 85°C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 DROPOUT VOLTAGE (V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 17. Dropout Voltage vs. Output Current NCP693xMN25TCG 90 80 70 60 PSRR (dB) 50 40 30 20 10 0 0.1 1.0 10.0 FREQUENCY (kHz) 100.0 1000 IOUT = 100 mA PSRR (dB) IOUT = 1 mA 90 80 70 60 50 40 30 20 10 0 Figure 18. Dropout Voltage vs. Output Current NCP693xMN33TCG IOUT = 1 mA IOUT = 100 mA 0.1 1.0 10.0 FREQUENCY (kHz) 100.0 1000 Figure 19. PSRR vs. Frequency NCP693xMN08TCG Figure 20. PSRR vs. Frequency NCP693xMN12TCG http://onsemi.com 7 NCP693 90 80 70 PSRR (dB) 60 50 40 30 20 10 0 0.1 1.0 10.0 FREQUENCY (kHz) 100.0 1000 IOUT = 100 mA IOUT = 1 mA PSRR (dB) 90 80 70 60 50 40 30 20 10 0 0.1 1.0 10.0 FREQUENCY (kHz) 100.0 1000 IOUT = 100 mA IOUT = 1 mA Figure 21. PSRR vs. Frequency NCP693xMN25TCG Figure 22. PSRR vs. Frequency NCP693xMN33TCG Figure 23. Turn Off Speed NCP693DMN08TCG Figure 24. Turn Off Speed NCP693HMN08TCG Figure 25. Turn On Speed NCP693xMN08CTG Figure 26. Turn On Speed NCP693xMN08CTG http://onsemi.com 8 NCP693 3.0 2.5 INPUT VOLTAGE (V) 2.0 1.5 1.0 0.5 0.0 Output Voltage 0.820 IOUT = 100 mA COUT = 2.2 mF 0.815 VIN = step 1.8 V to 2.8 V TA = 25°C 0.810 Input Voltage 0.805 0.800 0.795 0.790 100 0 10 20 30 40 50 60 70 80 90 TIME (ms) Figure 27. Input Response NCP693xMN08TCG 6.0 5.0 INPUT VOLTAGE (V) 4.0 3.0 2.0 1.0 0.0 0 10 20 30 40 Output Voltage IOUT = 100 mA COUT = 2.2 mF VIN = step 4.3 V to 5.3 V TA = 25°C 50 60 70 80 90 TIME (ms) 3.320 3.315 3.310 3.305 3.300 3.295 OUTPUT VOLTAGE (V) Input Voltage 3.290 100 Figure 28. Input Response NCP693xMN33TCG http://onsemi.com 9 OUTPUT VOLTAGE (V) NCP693 110 100 OUTPUT CURRENT (mA) 90 80 70 60 50 40 30 20 10 0 10 20 30 40 50 TIME (ms) 60 70 80 90 0.78 100 Output Voltage 0.80 Output Current 0.1 A/ms Slope 0.88 IOUT = 50 mA to 100 mA COUT = 2.2 mF VIN = 1.8 V 0.86 TA = 25°C 0.84 0.82 Figure 29. Input Response NCP693xMN08TCG 110 100 90 80 70 60 50 40 30 20 10 0 10 20 30 40 50 60 70 80 90 3.37 IOUT = 50 mA to 100 mA 3.36 COUT = 2.2 mF 3.35 VIN = 4.3 V TA = 25°C 3.34 3.33 3.32 3.31 3.30 3.29 3.28 3.27 100 OUTPUT CURRENT (mA) 0.1 A/ms Slope Output Current Output Voltage TIME (ms) Figure 30. Input Response NCP693xMN33TCG http://onsemi.com 10 OUTPUT VALUE (V) OUTPUT VALUE (V) NCP693 ORDERING INFORMATION Device NCP693HMN08TCG NCP639HMN10TCG NCP693HMN12TCG NCP693HMN25TCG NCP693HMN33TCG NCP693DMN08TCG NCP693DMN10TCG NCP693DMN12TCG NCP693DMN25TCG NCP693DMN33TCG Nominal Output Voltage 0.8 1.0 1.2 2.5 3.3 0.8 1.0 1.2 2.5 3.3 Marking AM01 AM03 AM06 AM20 AM29 AN01 AN03 AN06 AN20 AN29 Package DFN (Pb−Free) DFN (Pb−Free) DFN (Pb−Free) DFN (Pb−Free) DFN (Pb−Free) DFN (Pb−Free) DFN (Pb−Free) DFN (Pb−Free) DFN (Pb−Free) DFN (Pb−Free) Shipping† 5000 / Tape & Reel 5000 / Tape & Reel 5000 / Tape & Reel 5000 / Tape & Reel 5000 / Tape & Reel 5000 / Tape & Reel 5000 / Tape & Reel 5000 / Tape & Reel 5000 / Tape & Reel 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 11 NCP693 PACKAGE DIMENSIONS UDFN6, 1.8x2, 0.5P CASE 517BA−01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b b1 D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.50 0.60 0.00 0.05 0.20 REF 0.15 0.30 0.20 0.40 1.80 BSC 1.50 1.70 2.00 BSC 0.90 1.10 0.50 BSC 0.20 --0.15 0.35 --0.10 EXPOSED Cu MOLD CMPD DETAIL B PIN ONE LOCATION 2X 2X E OPTIONAL CONSTRUCTIONS 0.10 C 0.10 C TOP VIEW L1 A3 A DETAIL A OPTIONAL CONSTRUCTIONS DETAIL B 0.05 C 0.05 C NOTE 4 A1 SIDE VIEW D2 C SEATING PLANE b1 DETAIL A 1 3 6X L 2X E2 K e 6 4 5X b 0.10 C A 0.05 C B 0.35 NOTE 3 BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 12 ÉÉ ÉÉ ÇÇ L 5X 6X ÍÍÍ ÍÍÍ ÍÍÍ L RECOMMENDED MOUNTING FOOTPRINT* 1.70 0.25 0.48 1.10 2.30 1 0.50 PITCH DIMENSIONS: MILLIMETERS NCP693/D
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