NE5534N

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A Single Low Noise Operational Amplifier The NE/SA/SE5534/5534A are single high-performance low noise operational amplifiers. Compared to other operational amplifiers, such as TL083, they show better noise performance, improved output drive capability, and considerably higher small-signal and power bandwidths. This makes the devices especially suitable for application in high quality and professional audio equipment, in instrumentation and control circuits and telephone channel amplifiers. The op amps are internally compensated for gain equal to, or higher than, three. The frequency response can be optimized with an external compensation capacitor for various applications (unity gain amplifier, capacitive load, slew rate, low overshoot, etc.). Features http://onsemi.com SOIC−8 D SUFFIX CASE 751 8 1 8 1 PDIP−8 N SUFFIX CASE 626 • • • • • • • • • • • • • Small-Signal Bandwidth: 10 MHz Output Drive Capability: 600 W, 10 VRMS at VS = "18 V Input Noise Voltage: 4 nV Hz DC Voltage Gain: 100000 AC Voltage Gain: 6000 at 10 kHz Power Bandwidth: 200 kHz Slew Rate: 13 V/ms Large Supply Voltage Range: "3.0 to "20 V Pb−Free Packages are Available PIN CONNECTIONS D, N Packages BALANCE INVERTING INPUT NON-INVERTING V− 1 2 3 4 8 7 6 5 BALANCE/ COMPENSATION V+ OUTPUT COMPENSATION Top View Applications DEVICE MARKING INFORMATION See general marking information in the device marking section on page 8 of this data sheet. Audio Equipment Instrumentation and Control Circuits Telephone Channel Amplifiers Medical Equipment ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 2 1 Publication Order Number: NE5534/D NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A 1 8 5 7 2 3 6 4 Figure 1. Equivalent Schematic MAXIMUM RATINGS Rating Supply Voltage Input Voltage Differential Input Voltage (Note 1) Operating Temperature Range NE SA SE Storage Temperature Range Junction Temperature Power Dissipation at 25°C N Package D Package N Package D Package Symbol VS VIN VDIFF Tamb Value "22 "V Supply "0.5 0 to +70 −40 to +85 −55 to +125 −65 to +150 150 1150 750 130 158 Indefinite 230 Unit V V V °C Tstg Tj PD °C °C mW Thermal Resistance, Junction−to−Ambient RqJA °C/W Output Short-Circuit Duration (Note 2) Lead Soldering Temperature (10 sec max) − Tsld − °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6 V. Maximum current should be limited to "10 mA. 2. Output may be shorted to ground at VS = "15 V, Tamb = 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating is not exceeded. http://onsemi.com 2 NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A DC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) (Notes 3, 4 and 5) NE/SA5534/5534A Characteristic Symbol VOS Offset Voltage DVOS/DT IOS Offset Current DIOS/DT IB Input Current DIB/DT Supply Current Per Op Amp Common Mode Input Range Common Mode Rejection Ratio Power Supply Rejection Ratio Large-Signal Voltage Gain ICC VCM CMRR PSRR AVOL RL ≥ 600 W, VO = "10 V Overtemperature RL w 600 W Overtemperature RL w 600 W; VS = "18 V RL w 2.0 kW Overtemperature Input Resistance Output Short Circuit Current RIN ISC Overtemperature Overtemperature Overtemperature Overtemperature Test Conditions Min − − − − − − − − − − − "12 70 − 25 15 "12 "10 "15 "13 "12 30 − Typ 0.5 − 5.0 20 − 200 500 − 5.0 4.0 − "13 100 10 100 − "13 "12 "16 "13.5 "12.5 100 38 Max 4.0 5.0 − 300 400 − 1500 2000 − 8.0 10 − − 100 − − − − − − − − − Min − − − − − − − − − − − "12 80 − 50 25 "12 "10 "15 "13 "12 50 − SE5534/5534A Typ 0.5 − 5.0 10 − 200 400 − 5.0 4.0 − "13 100 10 100 − "13 "12 16 "13.5 "12.5 100 38 Max 2.0 3.0 − 200 500 − 800 1500 − 6.5 9.0 − − 50 − − − − − − − − − kW mA V Unit mV mV mV/°C nA nA pA/°C nA nA nA/°C mA V dB mV/V V/mV Output Swing VOUT 3. For NE5534/5534A, TMIN = 0°C, TMAX = 70°C. 4. For SA5534/5534A, TMIN = −40°C, TMAX = +85°C. 5. For SE5534/5534A, TMIN = −55°C, TMAX = +125°C. http://onsemi.com 3 NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A AC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) NE/SA5534/5534A Characteristic Output Resistance Symbol ROUT Test Conditions AV = 30 dB closed-loop f = 10 kHz; RL = 600 W; CC = 22 pF Voltage-follower , VIN = 50 mV RL = 600 W, CC = 22 pF, CL = 100 pF tR − VIN = 50 mV, RL = 600 W, CC = 47 pF, CL = 500 pF tR − AV f = 10 kHz, CC = 0 f = 10 kHz, CC = 22 pF CC = 22 pF, CL = 100 pF CC = 0 CC = 22 pF VOUT = "10 V, CC = 0 pF VOUT = "10 V, CC = 22 pF VOUT = "14 V, RL = 600 W, CC = 22 pF, VCC = "18 V − − − − − − − − − − 50 35 6.0 2.2 10 13 6.0 200 95 70 − − − − − − − − − − − − − − − − − − − − 50 35 6.0 2.2 10 13 6.0 200 95 70 − − − − − − − − − − ns % V/mV − − 20 20 − − − − 20 20 − − ns % Min − Typ 0.3 Max − Min − SE5534/5534A Typ 0.3 Max − Unit W Transient Response Rise Time Overshoot Transient Response Rise Time Overshoot Gain Gain Bandwidth Product Slew Rate Power Bandwidth GBW SR − MHz V/ms kHz ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 15 V, unless otherwise noted.) NE/SA/SE5534 Characteristic Input Noise Voltage Input Noise Current Broadband Noise Figure Symbol VNOISE INOISE − Test Conditions fO = 30 Hz fO = 1.0 kHz fO = 30 Hz fO = 1.0 kHz f = 10 Hz to 20 kHz; RS = 5.0 kW f = 1.0 kHz; RS = 5.0 kW Min − − − − − Typ 7.0 4.0 2.5 0.6 − Max − − − − − NE/SA/SE5534A Min − − − − − Typ 5.5 3.5 1.5 0.4 0.9 Max 7.0 4.5 − − − Unit nV/√Hz pA/√Hz dB Channel Separation − − 110 − − 110 − dB http://onsemi.com 4 NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A TYPICAL PERFORMANCE CHARACTERISTICS 120 16 VS = +15V CC GAIN (dB) 5 8 60 TYPICAL VALUES 40 CC = 0; RF = 10kW; RE = 100W TYPICAL VALUES 80 GAIN (dB) CC = 0 40 CC = 22pF 12 S8 (V/ms) TYP 4 20 CC = 0; RF = 9kW; RE = 1kW 0 0 CC = 22pF; RF = 1kW; RE = ∞ -40 10 102 103 104 f (Hz) 105 106 107 0 0 40 CC(pF) 80 -20 103 104 105 106 f (Hz) 107 108 Figure 2. Open-Loop Frequency Response Figure 3. Slew Rate as a Function of Compensation Capacitance Figure 4. Closed−Loop Frequency Response 40 VS = +15V TYPICAL VALUES 30 CC = 0pF 22pF 47pF 80 VS = +15V 60 1,4 VS = +15V 1,2 (V) Vo(p-p) 20 IO 40 (mA) TYP II (mA) 0,8 TYP 10 20 0,4 0 102 103 104 105 f (Hz) 106 107 0 -55 0 -25 0 25 50 75 100 +125 -55 -25 0 25 50 75 100 +125 Tamb (oC) Tamb (oC) Figure 5. Large−Signal Frequency Response Figure 6. Output Short−Circuit Current Figure 7. Input Bias Current 30 TYPICAL VALUES 6 IO = 0 TYP 102 20 VIN (V) 10 NEG IP IN 4 10 TYP POS (mA) (nV 2 Hz) 1 10−1 0 0 10 Vp; -VN (V) 20 0 0 10 Vp; -VN (V) 20 10−2 10 102 f (Hz) 103 104 Figure 8. Input Common−Mode Voltage Range Figure 9. Supply Current Per Op Amp Figure 10. Input Noise Voltage Density http://onsemi.com 5 NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A TYPICAL PERFORMANCE CHARACTERISTICS 106 102 105 104 10 In(rms) (pA Hz) 1 10−1 Vn(rms) (nV TYP Hz) 103 102 10 1 10−1 10−2 10 102 103 104 10−2 10 102 THERMAL NOISE OF SOURCE RESISTANCE 103 104 RS (W) 105 106 10−1 1kHz Vn(rms) (mV) 1 200Hz TO 4kHz TYPICAL VALUES 10 10Hz TO 20kHz 102 TYPICAL VALUES 10Hz 10−2 0 f (Hz) 10 RS (W) 20 Figure 11. Input Noise Current Density Figure 12. Total Input Noise Density Figure 13. Broadband Input Noise Voltage http://onsemi.com 6 NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A TEST LOAD CIRCUITS V+ CC 22kW 100kW 2 CC 3 1 2 8 5 7 5534 6 VI RE 100pF 600W RS 25W + 5534 6 RF 8 5 3 + 4 V- Figure 14. Frequency Compensation and Offset Voltage Adjustment Circuit Figure 15. Closed-Loop Frequency Response CAL OSC POWER SUPPLY +VCC -VCC CAL METER BANDPASS AT 1kHz (nV Hz) 1W + DUT 10kW +40dB BANDPASS AT 30Hz GND (nV Hz) 100W TEST BOARD Figure 16. Noise Test Block Diagram http://onsemi.com 7 NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A MARKING DIAGRAMS 8 N5234 ALYWA G 8 S5234 ALYWA G 8 S5234 ALYW G NE5234xN AWL YYWWG SA5234xN AWL YYWWG SE5234xN AWL YYWWG 1 1 1 SOIC−8 D SUFFIX CASE 751 x A WL, L YY, Y WW, W G or G = Blank or A = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package PDIP−8 N SUFFIX CASE 626 ORDERING INFORMATION Device NE5534AD NE5534ADG NE5534ADR2 NE5534ADR2G NE5534AN NE5534ANG NE5534D NE5534DG NE5534DR2 NE5534DR2G NE5534N NE5534NG SA5534AD SA5534ADG SA5534ADR2 SA5534ADR2G SA5534AN SA5534ANG SA5534N SA5534NG SE5534AN SE5534ANG SE5534N SE5534NG Description 8−Pin Plastic Small Outline (SO−8) Package 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Small Outline (SO−8) Package 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Dual In−Line Package (PDIP−8) 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 8−Pin Plastic Small Outline (SO−8) Package 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Small Outline (SO−8) Package 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Dual In−Line Package (PDIP−8) 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 8−Pin Plastic Small Outline (SO−8) Package 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Small Outline (SO−8) Package 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Dual In−Line Package (PDIP−8) 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 8−Pin Plastic Dual In−Line Package (PDIP−8) 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 8−Pin Plastic Dual In−Line Package (PDIP−8) 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 8−Pin Plastic Dual In−Line Package (PDIP−8) 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) Temperature Range 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C −40 to +85°C −40 to +85°C −40 to +85°C −40 to +85°C −40 to +85°C −40 to +85°C −40 to +85°C −40 to +85°C −55 to +125°C −55 to +125°C −55 to +125°C −55 to +125°C Shipping† 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 50 Units / Rail 50 Units / Rail 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 50 Units / Rail 50 Units / Rail 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 8 NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AG −X− A 8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 B 1 S 4 0.25 (0.010) M Y M −Y− G K C −Z− H D 0.25 (0.010) M SEATING PLANE N X 45 _ 0.10 (0.004) M J ZY S X S DIM A B C D G H J K M N S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A PACKAGE DIMENSIONS 8−Pin Plastic Dual In−Line Package (PDIP−8) N SUFFIX CASE 626−05 ISSUE L NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC −−− 10_ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC −−− 10_ 0.030 0.040 8 5 − B− 1 4 F NOTE 2 − A− L C −T− SEATING PLANE J N D K M M TA M H G 0.13 (0.005) B M ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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