NL17SH17P5T5G

NL17SH17 Single Schmitt-Trigger Buffer The NL17SH17 is a single gate CMOS Schmitt−trigger non−inverting buffer fabricated with silicon gate CMOS technology. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The NL17SH17 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the NL17SH17 to be used to interface 5 V circuits to 3 V circuits. The NL17SH17 can be used to enhance noise immunity or to square up slowly changing waveforms. http://onsemi.com MARKING DIAGRAM Features • • • • • • • High Speed: tPD = 4.0 ns (Typ) at VCC = 5.0 V Y Low Power Dissipation: ICC = 1.0 mA (Max) at TA = 25°C M Power Down Protection Provided on Inputs Balanced Propagation Delays Pin and Function Compatible with Other Standard Logic Families Y SOT−953 CASE 527AE 1 = Specific Device Code (Rotated 90°) = Month Code PIN ASSIGNMENT Chip Complexity: FETs = 101 1 IN A These Devices are Pb−Free and are RoHS Compliant 2 GND 3 NC 4 OUT Y 5 VCC IN A 1 GND 2 NC 3 5 VCC M FUNCTION TABLE 4 OUT Y Figure 1. Pinout Input A Output Y L H L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. 1 IN A OUT Y Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2012 September, 2012 − Rev. 0 1 Publication Order Number: NL17SH17/D NL17SH17 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage VOUT DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ICC DC Supply Current per Supply Pin IGND DC Ground Current per Ground Pin TSTG Storage Temperature Range Unit −0.5 to +7.0 V −0.5 to +7.0 V −0.5 to VCC + 0.5 V VIN < GND −20 mA VOUT < GND, VOUT > VCC ±20 mA ±12.5 mA ±25 mA DC Output Voltage IIK Value ±25 mA −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C MSL Moisture Sensitivity FR Flammability Rating VESD Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage ILATCHUP UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125°C (Note 5) >3000 >200 N/A V ±100 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC Positive DC Supply Voltage 1.65 5.5 V VIN Digital Input Voltage 0.0 5.5 V Output Voltage 0.0 VCC V Operating Temperature Range VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 +125 °C 0 0 No Limit No Limit ns/V FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 80°C Time, Years −55 TJ = 90°C Time, Hours TJ = 110°C Junction Temperature °C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES TJ = 120°C Input Transition Rise or Fail Rate TJ = 130°C TA Dt / DV TJ = 100°C VOUT 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 NL17SH17 DC ELECTRICAL CHARACTERISTICS TA = 255C VCC Symbol Parameter Min (V) Test Conditions Typ Max 2.0 3.0 3.6 2.2 3.15 3.85 VT+ Positive Threshold Voltage 3.0 4.5 5.5 VT− Negative Threshold Voltage 3.0 4.5 5.5 0.9 1.35 1.65 1.5 2.3 2.9 VH Hysteresis Voltage 3.0 4.5 5.5 0.3 0.4 0.5 0.57 0.67 0.74 VIN ≥ VTmin IOH = −50 mA 2.0 3.0 4.5 1.9 2.9 4.4 2.0 3.0 4.5 VIN ≥ VTmin IOH = −4 mA IOH = −8 mA 3.0 4.5 2.58 3.94 VIN ≤ VTmax IOL = 50 mA 2.0 3.0 4.5 VIN ≤ VTmax IOL = 4 mA IOL = 8 mA VOH VOL High−Level Output Voltage Low−Level Output Voltage TA v 855C Min Max 0.0 0.0 0.0 Min 2.2 3.15 3.85 0.9 1.35 1.65 1.2 1.4 1.6 *555C to 1255C 0.3 0.4 0.5 Max Unit 2.2 3.15 3.85 V 0.9 1.35 1.65 1.2 1.4 1.6 0.3 0.4 0.5 1.9 2.9 4.4 1.9 2.9 4.4 2.48 3.80 2.34 3.66 V 1.2 1.4 1.6 V V 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 $0.1 $1.0 $1.0 mA ICC Quiescent Supply Current VIN = VCC or GND 5.5 1.0 20 40 mA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL CIN Parameter Propagation Delay, A to Y VCC (V) TA = 255C Test Conditions Min TA v 855C *555C to 1255C Typ Max Min Max Min Max Unit ns 3.0 to 3.6 CL = 15 pF CL = 50 pF 7.0 8.5 12.8 16.3 1.0 1.0 15.0 18.5 1.0 1.0 17.0 20.5 4.5 to 5.5 CL = 15 pF CL = 50 pF 4.0 5.5 8.6 10.6 1.0 1.0 10.0 12.0 1.0 1.0 11.5 13.5 5.0 10 Input Capacitance 10 10 pF Typical @ 25°C, VCC = 5.0 V CPD 7.0 Power Dissipation Capacitance (Note 6) pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. http://onsemi.com 3 NL17SH17 A or B TEST POINT VCC 50% OUTPUT GND tPHL Y DEVICE UNDER TEST tPLH CL* 50% VCC *Includes all probe and jig capacitance. Figure 4. Switching Waveform Figure 5. Test Circuit ORDERING INFORMATION Device NL17SH17P5T5G Package Shipping† SOT−953 (Pb−Free) 8000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E DATE 02 AUG 2011 SCALE 4:1 X Y D 5 PIN ONE INDICATOR A 4 HE E 1 2 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 5X L2 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 GENERIC MARKING DIAGRAM* 5X BOTTOM VIEW XM b 1 0.08 X Y X M SOLDERING FOOTPRINT* *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 5X 0.35 5X 0.20 = Specific Device Code = Month Code PACKAGE OUTLINE 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON26457D SOT−953 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative