NLU3G16MUTAG

NLU3G16 Triple Non-Inverting Buffer The NLU3G16 MiniGatet is an advanced high-speed CMOS triple non-inverting buffer in ultra-small footprint. The NLU3G16 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. Features http://onsemi.com MARKING DIAGRAMS 8 1 UDFN8 1.8 x 1.2 CASE 517AJ UYM G • • • • • • • High Speed: tPD = 3.5 ns (Typ) @ VCC = 5.0 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C Power Down Protection Provided on inputs Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra-Small Packages These are Pb-Free Devices 1 IN A1 1 8 VCC 1 OUT Y3 2 7 OUT Y1 ULLGA8 1.45 x 1.0 CASE 613AA ULLGA8 1.6 x 1.0 CASE 613AB RM LRM G IN A2 3 6 IN A3 1 ULLGA8 1.95 x 1.0 CASE 613AC LRM G GND 4 5 OUT Y2 UY, R or LR = Specific Device Code M = Date Code G = Pb-Free Package Figure 1. Pinout (Top View) PIN ASSIGNMENT IN A1 IN A2 IN A3 1 1 1 1 OUT Y2 OUT Y2 OUT Y3 2 3 4 5 6 7 8 IN A1 OUT Y3 IN A2 GND OUT Y2 IN A3 OUT Y1 VCC Figure 2. Logic Symbol FUNCTION TABLE A L H Y L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2008 1 March, 2008 - Rev. 2 Publication Order Number: NLU3G16/D NLU3G16 MAXIMUM RATINGS Symbol VCC VIN VOUT IIK IOK IO ICC IGND TSTG TL TJ MSL FR ILATCHUP DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Source/Sink Current DC Supply Current Per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Moisture Sensitivity Flammability Rating Oxygen Index: 28 to 34 VIN < GND VOUT < GND Parameter Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 -20 ±20 ±12.5 ±25 ±25 -65 to +150 260 150 Level 1 UL 94 V-0 @ 0.125 in ±500 mA Unit V V V mA mA mA mA mA °C °C °C Latchup Performance Above VCC and Below GND at 125°C (Note 2) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT TA Dt/DV Positive DC Supply Voltage Digital Input Voltage Output Voltage Operating Free-Air Temperature Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V Parameter Min 1.65 0 0 -55 0 0 Max 5.5 5.5 5.5 +125 100 20 Unit V V V °C ns/V http://onsemi.com 2 NLU3G16 DC ELECTRICAL CHARACTERISTICS TA = 25 5C Min 0.75 x VCC 0.70 x VCC 0.25 x VCC 0.30 x VCC 1.9 2.9 4.4 2.58 3.94 0 0 0 0.1 0.1 0.1 0.36 0.36 ±0.1 1.0 2.0 3.0 4.5 1.9 2.9 4.4 2.48 3.80 0.1 0.1 0.1 0.44 0.44 ±1.0 10 Typ Max TA = +855C Min 0.75 x VCC 0.70 x VCC 0.25 x VCC 0.30 x VCC 1.9 2.9 4.4 2.34 3.66 0.1 0.1 0.1 0.52 0.52 ±1.0 40 mA mA V 0.25 x VCC 0.30 x VCC V V Max TA = -555C to +1255C Min Max Unit V Symbol VIH Parameter Low-Level Input Voltage Conditions VCC (V) 1.65 2.3 to 5.5 VIL Low-Level Input Voltage 1.65 2.3 to 5.5 VOH High-Level Output Voltage VIN = VIH or VIL IOH = -50 mA VIN = VIH or VIL IOH = -4 mA IOH = -8 mA 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 0 to 5.5 5.5 V VOL Low-Level Output Voltage VIN = VIH or VIL IOL = 50 mA VIN = VIH or VIL IOL = 4 mA IOL = 8 mA IIN ICC Input Leakage Current Quiescent Supply Current 0 v VIN v 5.5 V 0 v VIN v VCC AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) TA = 25 5C Min Typ 4.5 6.4 3.5 4.5 4.0 5.0 8.0 Max 7.1 10.6 5.5 7.5 10 TA = +855C Min Max 8.5 12 6.5 8.5 10 TA = -555C to +1255C Min Max 10 14.5 8.0 10 10 pF pF Unit ns Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y VCC (V) 3.0 to 3.6 4.5 to 5.5 Test Condition CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CIN CPD Input Capacitance Power Dissipation Capacitance (Note 3) 3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. http://onsemi.com 3 NLU3G16 SWITCHING WAVEFORMS TEST POINT VCC 50% A tPLH 50% VCC Y *Includes all probe and jig capacitance tPHL GND DEVICE UNDER TEST OUTPUT CL * Figure 3. Switching Waveforms Figure 4. Test Circuit ORDERING INFORMATION Device NLU3G16MUTAG NLU3G16AMX1TCG NLU3G16BMX1TCG NLU3G16CMX1TCG Package UDFN8 (Pb-Free) ULLGA8, 1.95 x 1.0, 0.5P (Pb-Free) ULLGA8, 1.6 x 1.0, 0.4P (Pb-Free) ULLGA8, 1.45 x 1.0, 0.35P (Pb-Free) Shipping† 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLU3G16 PACKAGE DIMENSIONS UDFN8 1.8x1.2, 0.4P CASE 517AJ-01 ISSUE O D 0.10 C AB L1 E DETAIL A NOTE 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. DIM A A1 A3 b b2 D E e L L1 L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF 0.10 C 0.05 C 0.05 C (b2) 1 4 (L2) 8 5 8X b ÉÉÉ e/2 PIN ONE REFERENCE TOP VIEW (A3) A A1 C SEATING PLANE SIDE VIEW e DETAIL A 8X L MOUNTING FOOTPRINT SOLDERMASK DEFINED 8X BOTTOM VIEW 0.10 0.05 M M CAB C NOTE 3 7X 0.66 0.22 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS http://onsemi.com 5 NLU3G16 PACKAGE DIMENSIONS ULLGA8 1.45x1.0, 0.35P CASE 613AA-01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 SEATING PLANE MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 PIN ONE REFERENCE 0.10 C 0.10 C 0.05 C 8X 0.05 C e/2 e 1 4 7X L1 1.18 ÉÉÉ ÉÉÉ ÉÉÉ 8 E TOP VIEW A SIDE VIEW A1 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* 7X NOTE 4 L 0.48 8X 0.22 5 8X b 0.10 C A B 0.05 C NOTE 3 0.53 1 PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NLU3G16 PACKAGE DIMENSIONS ULLGA8 1.6x1.0, 0.4P CASE 613AB-01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 SEATING PLANE MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 PIN ONE REFERENCE 0.10 C 0.10 C 0.05 C 8X 0.05 C e/2 e 1 4 7X L1 1.24 ÉÉÉ ÉÉÉ ÉÉÉ 8 E TOP VIEW A SIDE VIEW A1 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* 7X 0.49 L NOTE 4 8X 0.26 5 8X b 0.10 C A B 0.05 C NOTE 3 0.53 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLU3G16 PACKAGE DIMENSIONS ULLGA8 1.95x1.0, 0.5P CASE 613AC-01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 PIN ONE REFERENCE 0.10 C 0.10 C 0.05 C 8X 0.05 C L1 1.24 MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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