NLX2G02AMX1TCG

ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. NLX2G02 Dual 2-Input NOR Gate The NLX2G02 is an advanced high-speed dual 2-input CMOS NOR gate in ultra-small footprint. The NLX2G02 input structures provide protection when voltages up to 7.0 volts are applied, regardless of the supply voltage. www.onsemi.com Features • • • • • • • High Speed: tPD 2.5 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C 24 mA Balanced Output Sink and Source Capability Balanced Propagation Delays Overvoltage Tolerant (OVT) Input Pins This is a Pb−Free Device A1 1 8 2 7 Y1 Y2 3 6 B2 XX M G IEEE/IEC A1 B1 4 5 A2 UDFN8 1.45 x 1.0 CASE 517BZ 1 UDFN8 1.6 x 1.0 CASE 517BY 1 UDFN8 1.95 x 1.0 CASE 517CA VCC B1 GND MARKING DIAGRAMS XM XM 1 = Specific Device Code = Date Code = Pb−Free Package ORDERING INFORMATION ≥1 Y1 A2 B2 Figure 1. Pinout XM See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Y2 Figure 2. Logic Symbol PIN ASSIGNMENT Pin Function FUNCTION TABLE 1 A1 Y=A+B 2 B1 3 Y2 A B Y 4 GND L L H 5 A2 L H L 6 B2 H L L 7 Y1 H H L 8 VCC © Semiconductor Components Industries, LLC, 2016 June, 2016 − Rev. 3 Inputs Output H = HIGH Logic Level L = LOW Logic Level 1 Publication Order Number: NLX2G02/D NLX2G02 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage *0.5 to +7.0 V VIN DC Input Voltage *0.5 to +7.0 V *0.5 to VCC + 7.0 V VIN < GND *50 mA VOUT < GND *50 mA VOUT Parameter DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C qJA Thermal Resistance (Note 1) N/A °C/W PD Power Dissipation in Still Air at 85°C N/A mW MSL Moisture Sensitivity FR Flammability Rating VESD ILatchup Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125°C (Note 5) 2000 > 200 N/A V $500 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Power DC Supply Voltage VIN Digital Input Voltage (Note 6) Output Voltage VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Operating Data Retention Only VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.3 V $0.3 V VCC = 5.0 V $0.5 V Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 VCC V −55 +125 °C 0 0 0 0 20 20 10 5 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. www.onsemi.com 2 NLX2G02 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VIH High−Level Input Voltage Condition VCC (V) 1.65 2.3 to 5.5 VIL Low−Level Input Voltage Min Typ High−Level Output Voltage VIN = VIH or VIL, IOH = −100 mA VIN = VIH or VIL IOH = −4 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA VOL Low−Level Output Voltage VIN = VIH or VIL, IOL = 100 mA Min Max 0.75 x VCC 0.7 x VCC 0.25 x VCC 0.3 x VCC 2.3 to 5.5 VOH Max 0.75 x VCC 0.7 x VCC 1.65 TA = −555C to +1255C TA 3 855C TA = 255C Min 0.75 x VCC 0.7 x VCC 0.25 x VCC 0.3 x VCC VCC − 0.1 VCC VCC − 0.1 VCC − 0.1 1.65 2.3 2.7 3.0 3.0 4.5 1.29 1.9 2.2 2.4 2.3 3.8 1.5 2.1 2.4 2.7 2.5 4.0 1.29 1.9 2.2 2.4 2.3 3.8 1.29 1.9 2.2 2.4 2.3 3.8 Unit V 0.25 x VCC 0.3 x VCC 1.65 to 5.5 1.65 to 5.5 Max V V 0.1 0.1 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 V VIN = VIH or VIL IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 2.3 2.7 3.0 3.0 4.5 Input Leakage Current 0 ≤ VIN ≤ 5.5 V 0 to 5.5 $0.1 $1.0 $1.0 mA IOFF Power−Off Input Leakage Current VIN = 5.5 V 0 1.0 10 10 mA ICC Quiescent Supply Current VIN = VCC or GND 5.5 1.0 10 10 mA IIN 0.08 0.20 0.22 0.28 0.38 0.42 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns VCC Symbol tPLH tPHL Parameter Propagation Delay Input A to Output TA 3 855C TA = 255C (V) Test Condition Min Typ Max Min Max 1.65 to 1.95 RL = 1 MW, CL = 15 pF 2.0 7.4 9.5 2.0 9.7 2.3 to 2.7 RL = 1 MW, CL = 15 pF 1.2 3.3 5.4 1.2 5.8 3.0 to 3.6 RL = 1 MW, CL = 15 pF 0.8 2.6 3.9 0.8 4.3 RL = 500 W, CL = 50 pF 1.2 3.2 4.8 1.2 5.2 RL = 1 MW, CL = 15 pF 0.5 1.9 3.1 0.5 3.3 RL = 500 W, CL = 50 pF 0.8 2.5 3.7 0.8 4.0 4.5 to 5.5 TA = −555C to +1255C Min Max Unit ns CIN Input Capacitance 5.5 VIN = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 7) 3.3 5.5 10 MHz, VIN = 0V or VCC 9 11 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. www.onsemi.com 3 NLX2G02 tf = 3 ns tf = 3 ns 90% INPUT A and B VCC 90% 50% INPUT 50% OUTPUT 10% 10% tPHL GND RL CL tPLH VOH OUTPUT Y 50% A 1−MHz square input wave is recommended for propagation delay tests. 50% VOL Figure 3. Switching Waveform Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† NLX2G02DMUTCG UDFN8, 1.95 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLX2G02EMUTCG UDFN8, 1.6 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLX2G02FMUTCG UDFN8, 1.45 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 4 NLX2G02 PACKAGE DIMENSIONS UDFN8 1.6x1.0, 0.4P CASE 517BY ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 L 8X 0.26 4 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 NLX2G02 PACKAGE DIMENSIONS UDFN8 1.45x1.0, 0.35P CASE 517BZ ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ ÉÉ E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X 0.48 e/2 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 8X 0.22 L 4 L1 1.18 8 5 BOTTOM VIEW 8X 0.53 b 0.10 M C A B 0.05 M C 1 PKG OUTLINE NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 0.35 PITCH NLX2G02 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 L 8X 0.30 4 1 L1 1.24 8 5 8X BOTTOM VIEW b 0.10 M C A B 0.05 M C 0.54 NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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