NS3L500MTTWG

NS3L500 3.3V, 8-Channel, 2:1 Gigabit Ethernet LAN Switch with LED Switch Features • • • • • • • • • • • • VCC Operating Range: +3.0 V to +3.6 V Low ON−State Resistance (RON = 4 W Typical) Low ON−State Capacitance (CON = 7 pF Typical) Flat ON−State Resistance (RON(flat) = 0.5 W Typical) Wide Bandwidth (800 MHz Typical) Low Crosstalk (XTALK = −37 dB Typical) Near−Zero Propagation Delay: 250 ps Low Bit−to−Bit Skew (tsk(o) = 100 ps Max) Three SPDT Channels for LED Signal Switching Packaging: 56−Pin WQFN Pin−to−Pin Compatible with PI3L500−A, TS3L500AE and MAX4927 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com MARKING DIAGRAMS 1 WQFN56 MT SUFFIX CASE 510AK A WL YY WW G NS3L500 AWLYYWWG The NS3L500 is a 8−channel 2:1 LAN switch with 3 additional built−in SPDT switches for LED routing. This switch is ideal for Gigabit LAN applications due to its low ON−state resistance and capacitance giving the switch a typical bandwidth of 800 MHz. The switch also has excellent ON−state resistance match, low bit−to−bit skew, and low crosstalk among channels. The switch is bidirectional and offers little or no attenuation of the high−speed signals at the outputs. This part can be used to replace mechanical relays in low−voltage LAN applications that interface a physical layer over CAT 5 or CAT 6 unshielded twisted pair cable through an isolation transformer. The NS3L500 is available in a 56−pin WQFN package and operates over the extended −40°C to +85°C temperature range. = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Typical Applications • • • • 10/100/1000 Base−T Ethernet Signal Switching Notebooks and Docking Stations Hub and Router Signal Switching Differential (LVDS, LVPECL) Signal Switching © Semiconductor Components Industries, LLC, 2010 July, 2010 − Rev. 0 1 Publication Order Number: NS3L500/D V GND 50 49 CC 2L E D 51 2 2L E D 52 2 GND 53 GN D LED 54 55 56 V CC 1 NS3L500 GND 1 48 0B A 2 47 1B 1 3 46 0B CC 4 45 1B 0 A V 1 1 2 2 N.C. 5 44 GND GND 6 43 2B A 2 7 42 3B A 3 8 41 2B GND 9 40 3B V CC 10 39 GND A 11 38 VCC 37 4B 36 5B 14 35 4B 15 34 5B GND 16 33 SEL 17 32 V 31 LED 19 30 6B 1 20 29 7B 4 A 5 Exposed Pad on Underside (Must be electrically connected to GND) 12 GND 13 A 6 A 7 18 CC 0 1 1 2 2 1 1 2 2 GND 6B 1 7B 1 Figure 1. Pinout (Top View) http://onsemi.com 2 28 GND 27 CC V 1 L ED 2 26 25 2 0 L ED GND 24 23 1 1 1LED 22 0 LE D GND 21 LED 2 2 NS3L500 A0 A1 2 48 3 47 46 45 A2 A3 7 43 8 42 41 40 A4 A5 11 37 12 36 35 34 A6 A7 14 32 15 31 30 29 LED 0 19 22 25 LED 1 20 23 26 LED 2 52 54 51 SEL 0B 1 1B 1 0B 2 1B 2 2B 1 3B 1 2B 2 3B 2 4B 1 5B 1 4B 2 5B 2 6B 1 7B 1 6B 2 7B 2 0LED1 0LED2 1LED1 1LED2 2LED1 2LED2 17 Figure 2. Block Diagram PIN DESCRIPTION TRUTH TABLE Pin Name Description SEL Function Ax Data I/Os L Ax to xB1: LEDx to xLED1 xBy Data I/Os H Ax to xB2: LEDx to xLED2 SEL Select Input LEDx LED I/O Port xLEDy LED I/O Port http://onsemi.com 3 NS3L500 MAXIMUM RATINGS Symbol Pins Value Unit VCC VCC Positive DC Supply Voltage Parameter −0.5 to +5.5 V VIN SEL Control Input Voltage −0.5 to +5.5 V VI/O AX, xBY, LEDX, xLEDY −0.5 to VCC +0.5 V ICC VCC DC Output Current $120 mA IIK SEL Control Input Clamp Current −50 mA II/O AX, xBY, LEDX, xLEDY $120 mA 125 °C/W −65 to +150 °C Switch I/O Voltage Range ON−State Switch Current Thermal Resistance, Junction−to−Air RqJA TS Storage Temperature Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol Pins Parameter Value Unit VCC VCC Positive DC Supply Voltage +3.0 to +3.6 V VIN SEL Control Input Voltage 0 to +5.5 V VI/O AX, xBY, LEDX, xLEDY Switch I/O Voltage Range 0 to VCC V −40 to +85 °C TA Operating Temperature Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for section, where applicable. These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions. http://onsemi.com 4 NS3L500 DC ELECTRICAL CHARACTERISTICS (Typical: T = 25°C, VCC = 3.3 V) −405C to +855C Symbol Pins Parameters Conditions Min Typ Max Unit 1000 BASE−T ETHERNET SWITCHING VIH SEL Control Input HIGH Voltage 2 5.5 V VIL SEL Control Input LOW Voltage −0.5 0.8 V VIK SEL Clamp Diode Voltage VCC = Max, IIN = −18 mA −1.2 V IIH SEL Input HIGH Current VCC = Max, VIN = VCC −1 +1 mA IIL SEL Input LOW Current VCC = Max, VIN = GND −1 +1 mA IOFF SEL Off−Leakage Current VCC = 0 V, VIN = 0 V to 3.6 V $1.5 mA ICC VCC Quiescent Supply Current VCC = 3.6 V,, VIN = VCC or GND, IO = 0 mA 600 mA ILA(OFF) AX, xBY Off−Leakage Current VCC = 3.6 V, VAX = 0.3 V, 3.3 V; VxB1 or VxB2 = 3.3 V, 0.3 V −1 +1 mA ILA_(ON) AX, xBY On−Leakage Current VCC = 3.6 V, VAX = 0.3 V, 3.3 V; VxB1 or VxB2 = 0.3 V, 3.3 V, or floating −1 +1 mA RON AX, xBY On−Resistance VCC = 3 V, 1.5 V v VIN v VCC, IO = −40 mA 4 7 W RON(FLAT) AX, xBY On−Resistance Flatness VCC = 3 V, VIN = 1.5 V and VCC, IO = −40 mA 0.5 DRON AX, xBY On−Resistance Match Between Switch Pairs VCC = 3 V, 1.5 V v VIN v VCC, IO = −40 mA 0.4 −0.7 250 W 1 W 10/100 BASE−T ETHERNET SWITCHING VIH SEL Control Input HIGH Voltage 2 5.5 V VIL SEL Control Input LOW Voltage −0.5 0.8 V VIK SEL Clamp Diode Voltage VCC = Max, IIN = −18 mA −1.2 V IIH SEL Input HIGH Current VCC = Max, VIN = VCC −1 +1 mA IIL SEL Input LOW Current VCC = Max, VIN = GND −1 +1 mA IOFF SEL Off−Leakage Current VCC = 0 V, VIN = 0 V to 3.6 V $1.5 mA ICC VCC Quiescent Supply Current VCC = 3.6 V, VIN = VCC or GND IO = 0 mA 600 mA ILA(OFF) AX, xBY Off−Leakage Current VCC = 3.6 V, VAX = 0.3 V, 3.3 V; VxB1 or VxB2 = 3.3 V, 0.3 V −1 +1 mA ILA_(ON) AX, xBY On−Leakage Current VCC = 3.6 V, VAX = 0.3 V, 3.3 V; VxB1 or VxB2 = 0.3 V, 3.3 V, or floating −1 +1 mA RON AX, xBY On−Resistance VCC = 3 V, 1.25 V v VIN v VCC, IO = −10 mA to −30 mA 4 6 W RON(FLAT) AX, xBY On−Resistance Flatness VCC = 3 V, VIN = 1.25 V and VCC, IO = −10 mA to −30 mA 0.5 DRON AX, xBY On−Resistance Match Between Switch Pairs VCC = 3 V, 1.25 V v VIN v VCC, IO = −10 mA to −30 mA 0.4 http://onsemi.com 5 −0.7 250 W 1 W NS3L500 DC ELECTRICAL CHARACTERISTICS (Typical: T = 25°C, VCC = 3.3 V) −405C to +855C Symbol Pins Parameters Conditions Min Typ Max Unit 25 W LED SWITCHING RON LEDX, xLEDY On−Resistance VCC = 3 V, 1.25 V v VIN v VCC, IO = −40 mA 15 RON(FLAT) LEDX, xLEDY On−Resistance Flatness VCC = 3 V, VIN = 1.25 V and VCC, IO = −40 mA 8 DRON LEDX, xLEDY On−Resistance Match Between Switch Pairs VCC = 3 V, 1.25 V v VIN v VCC, IO = −40 mA 1 W 2 W AC ELECTRICAL CHARACTERISTICS (Typicals: T = 25°C, VCC = 3.3 V)* −405C to +855C Symbol Parameters Pins Conditions Min Typ Max Unit SWITCHING CHARACTERISTICS tPLH, tPHL Ax, xBy tON tOFF Propagation Delay VCC = 3.0 V to 3.6 V (Figure 3) SEL, xLEDy Line Enable Time − SEL to xLEDY Output: Closed to Open VCC = 3.0 V to 3.6 V (Figure 4) SEL, xBy Lines Enable Time − SEL to xBy SEL, xLEDy Line Enable Time − SEL to xLEDY SEL, xBy Lines Enable Time − SEL to xBy Output: Open to Closed VCC = 3.0 V to 3.6 V (Figure 4) 0.25 ns 0.5 15 ns 0.5 3 ms 0.5 9 ns 0.5 35 ns tSK(O) Ax, xBy Output Skew between center port to any other port VCC = 3.0 V to 3.6 V (Calculated, Figure 3) 50 100 ps tSK(P) Ax, xBy Skew between opposite transition of the same output (tPHL – tPLH) VCC = 3.0 V to 3.6 V (Calculated, Figure 3) 50 100 ps DYNAMIC ELECTRICAL CHARACTERISTICS BW xBy, xLEDy −3 dB Bandwidth RL = 100 W (Figure 5) 800 MHz OIRR AX, LEDX Off − Isolation RL = 100 W, f = 250 MHz (Figure 6) −37 dB XTALK AX to xBY A(X+2) to (X+2)BY Crosstalk RL = 100 W, f = 250 MHz (Figure 7) −37 dB CAPACITANCE CIN SEL Control Pin Input Capacitance VIN = 0 V, f = 1 MHz 2 3 pF CON AX, xBy ON Capacitance VIN = 0 V, f = 1 MHz, Outputs Open, Switch ON 7 10 pF COFF xBy B Port Switch Capacitance VIN = 0 V, f = 1 MHz, Outputs Open, Switch OFF 5 6 pF *Guaranteed by design and/or characterization. http://onsemi.com 6 NS3L500 VCC VCC ANALOG IN ON (xBy, xLEDy) 50% tPLH tPHL CL * TEST POINT GND SELECT VOUT ANALOG OUT (Ax, LEDx) ANALOG OUT ANALOG IN 50% *Includes all probe and jig capacitance Figure 3. Propagation Delay VCC NC Vis 0.1 mF Open Input DUT 50% 50% 0V Output VOUT NO 50 W VOH 90% 35 pF 90% Output VOL SELECT tON Figure 4. tON/tOFF 50 W DUT Reference Input Output 50 W VNA Source Port 1 Control Line Figure 5. Bandwidth http://onsemi.com 7 50 W VNA Return Port 2 tOFF NS3L500 DUT NC (Sense) Transmitted 50 W Generator (Force) COM Output 50 W NO 50 W SEL Figure 6. Off−Isolation EXT TRIGGER BIAS VBIAS Network Analyzer (R&S VNA) P1 P2 VCC A0 0B1 A1 1B1 RL = 100 W 0B2 DUT A2 1B2 2B1 RL = 100 W A3 3B1 2B2 3B2 SEL VSEL 1. CL includes probe and jig capacitance. 2. A 50 W termination resistor is needed to match the loading of the network analyzer. Figure 7. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VSEL = 0 and A0 is the input, the output is measured at 1B1. All unused analog input (A) ports are connected to GND, and output (B) ports are connected to GND through 50 W pulldown resistors. http://onsemi.com 8 NS3L500 APPLICATION INFORMATION Logic Inputs Power−Supply Sequencing The logic control inputs can be driven up to +3.6 V regardless of the supply voltage. For example, given a +3.3 V supply, the output enables or select pins may be driven low to 0 V and high to 3.6 V> Driving IN Rail−to−Rail® minimizes power consumption. Proper power−supply sequencing is advised for all CMOS devices. It is recommended to always apply VCC before applying signals to the input/output or control pins. ORDERING INFORMATION Device NS3L500MTTWG Package Shipping† WQFN56 (Pb−free) 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Rail−to−Rail is a registered trademark of Nippon Motorola, Ltd. http://onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WQFN56 5x11, 0.5P CASE 510AK−01 ISSUE A SCALE 2:1 A B D ÉÉÉ ÉÉÉ ÉÉÉ PIN ONE LOCATION L DATE 02 MAR 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L1 DETAIL A ALTERNATE CONSTRUCTIONS E DIM A A1 A3 b D D2 E E2 e K L L1 ÉÉ ÉÉ EXPOSED Cu MOLD CMPD DETAIL B 0.15 C ALTERNATE CONSTRUCTION TOP VIEW 0.15 C DETAIL B (A3) 0.10 C 0.08 C SIDE VIEW NOTE 4 A A1 C RECOMMENDED SOLDERING FOOTPRINT GENERIC MARKING DIAGRAM* 5.30 XXXXXXXX XXXXXXXX AWLYYWWG SEATING PLANE 56X 0.63 2.50 0.10 C A B D2 DETAIL A 56X L 1 0.10 C A B 8.50 11.30 PKG OUTLINE 1 0.50 PITCH 56 e 56X e/2 BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: XXXXX A WL YY WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. E2 K MILLIMETERS MIN MAX 0.70 0.80 −−− 0.05 0.20 REF 0.20 0.30 5.00 BSC 2.30 2.50 11.00 BSC 8.30 8.50 0.50 BSC 0.20 MIN 0.30 0.50 −−− 0.15 b 0.10 C A B 0.05 C 56X 0.35 DIMENSIONS: MILLIMETERS NOTE 3 98AON45390E WQFN56 5x11, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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