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NSS20600CF8T1G

NSS20600CF8T1G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SMD8

  • 描述:

    TRANS PNP 20V 6A 8-CHIPFET

  • 数据手册
  • 价格&库存
NSS20600CF8T1G 数据手册
ON Semiconductor’s e2 PowerEdge family of low VCE(sat) transistors are miniature surface mount devices featuring ultra low saturation voltage (VCE(sat)) and high current gain capability. These are designed for use in low voltage, high speed switching applications where affordable efficient energy control is important. Typical applications are DC−DC converters and power management in portable and battery powered products such as cellular and cordless phones, PDAs, computers, printers, digital cameras and MP3 players. Other applications are low voltage motor controls in mass storage products such as disc drives and tape drives. In the automotive industry they can be used in air bag deployment and in the instrument cluster. The high current gain allows e2PowerEdge devices to be driven directly from PMU’s control outputs, and the Linear Gain (Beta) makes them ideal components in analog amplifiers. • This is a Pb−Free Device MAXIMUM RATINGS (TA = 25°C) Rating Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current − Continuous Collector Current − Peak Electrostatic Discharge Symbol VCEO VCBO VEBO IC ICM ESD Max −20 −20 −7.0 −6.0 −7.0 Unit Vdc Vdc Vdc Adc A NSS20600CF8T1G 20 V, 7.0 A, Low VCE(sat) PNP Transistor http://onsemi.com −20 VOLTS, 7.0 AMPS PNP LOW VCE(sat) TRANSISTOR EQUIVALENT RDS(on) 50 mW COLLECTOR 1, 2, 3, 6, 7, 8 4 BASE 5 EMITTER ChipFET] CASE 1206A STYLE 4 HBM Class 3B MM Class C MARKING DIAGRAM VC M G VC = Specific Device Code M = Date Code G = Pb−Free Package THERMAL CHARACTERISTICS Characteristic Total Device Dissipation, TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Total Device Dissipation, TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Lead #1 Total Device Dissipation (Single Pulse < 10 sec) Junction and Storage Temperature Range Symbol PD (Note 1) RqJA (Note 1) PD (Note 2) RqJA (Note 2) RqJL (Note 2) PDsingle (Notes 2 & 3) TJ, Tstg Max 830 6.7 150 1.4 11.1 90 15 2.75 −55 to +150 Unit mW mW/°C °C/W W mW/°C °C/W C8 °C/W W °C C7 C6 E5 PIN CONNECTIONS 1C 2C 3C 4B Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR− 4 @ 100 mm2, 1 oz copper traces. 2. FR− 4 @ 500 mm2, 1 oz copper traces. 3. Thermal response. ORDERING INFORMATION Device NSS20600CF8T1G Package ChipFET (Pb−Free) Shipping† 3000/ Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2007 March, 2007 − Rev. 1 1 Publication Order Number: NSS20600CF8/D NSS20600CF8T1G ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic OFF CHARACTERISTICS Collector − Emitter Breakdown Voltage (IC = −10 mAdc, IB = 0) Collector − Base Breakdown Voltage (IC = −0.1 mAdc, IE = 0) Emitter − Base Breakdown Voltage (IE = −0.1 mAdc, IC = 0) Collector Cutoff Current (VCB = −20 Vdc, IE = 0) Emitter Cutoff Current (VEB = −7.0 Vdc) ON CHARACTERISTICS DC Current Gain (Note 4) (IC = −10 mA, IC = −2.0 V) (IC = −500 mA, VCE = −2.0 V) (IC = −1.0 A, VCE = −2.0 V) (IC = −2.0 A, VCE = −2.0 V) (IC = −3.0 A, VCE = −2.0 V) Collector − Emitter Saturation Voltage (Note 4) (IC = −0.1 A, IB = −0.010 A) (Note 5) (IC = −1.0 A, IB = −0.100 A) (IC = −1.0 A, IB = −0.010 A) (IC = −2.0 A, IB = −0.020 A) (IC = −3.0 A, IB = −0.030 A) (IC = −4.0 A, IB = −0.400 A) Base − Emitter Saturation Voltage (Note 4) (IC = −1.0 A, IB = −0.01 A) Base − Emitter Turn−on Voltage (Note 4) (IC = −2.0 A, VCE = −3.0 V) Cutoff Frequency (IC = −100 mA, VCE = −5.0 V, f = 100 MHz) Input Capacitance (VEB = −0.5 V, f = 1.0 MHz) Output Capacitance (VCB = −3.0 V, f = 1.0 MHz) SWITCHING CHARACTERISTICS Delay (VCC = −15 V, IC = 750 mA, IB1 = 15 mA) Rise (VCC = −15 V, IC = 750 mA, IB1 = 15 mA) Storage (VCC = −15 V, IC = 750 mA, IB1 = 15 mA) Fall (VCC = −15 V, IC = 750 mA, IB1 = 15 mA) 4. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle ≤ 2%. 5. Guaranteed by design but not tested. td tr ts tf − − − − − − − − 120 250 400 250 ns ns ns ns hFE 250 250 220 200 180 − − − − − − − − 100 − − − − 300 − − −0.007 −0.050 −0.065 −0.090 −0.140 −0.160 − − − − − − − − − − −0.010 −0.060 −0.080 −0.130 −0.180 −0.200 −0.90 −0.90 − 700 280 V V(BR)CEO V(BR)CBO V(BR)EBO ICBO IEBO −20 −20 −7.0 − − − − − − − − − − −0.1 −0.1 Vdc Vdc Vdc mAdc mAdc Symbol Min Typical Max Unit VCE(sat) VBE(sat) VBE(on) fT Cibo Cobo V V MHz pF pF http://onsemi.com 2 NSS20600CF8T1G 0.25 VCE(sat), COLLECTOR EMITTER SATURATION VOLTAGE (V) VCE(sat), COLLECTOR EMITTER SATURATION VOLTAGE (V) IC/IB = 10 0.20 VCE(sat) = 150°C 0.15 25°C 0.10 −55°C 0.05 0 0.30 IC/IB = 100 0.25 0.20 150°C 0.15 0.10 0.05 0 VCE(sat) = −55°C 0.001 0.01 0.1 1.0 10 25°C 0.001 0.01 0.1 1.0 10 IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A) Figure 1. Collector Emitter Saturation Voltage vs. Collector Current Figure 2. Collector Emitter Saturation Voltage vs. Collector Current 800 700 hFE, DC CURRENT GAIN 600 500 400 300 200 100 0.001 0.01 150°C (5 V) VBE(sat), BASE EMITTER SATURATION VOLTAGE (V) 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 IC/IB = 10 150°C (2 V) 25°C (5 V) 25°C (2 V) −55°C (5 V) −55°C (2 V) 0.1 1.0 10 −55°C 25°C 150°C 0.3 0.001 0.01 0.1 1.0 10 IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A) Figure 3. DC Current Gain vs. Collector Current Figure 4. Base Emitter Saturation Voltage vs. Collector Current VBE(on), BASE EMITTER TURN−ON VOLTAGE (V) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.001 0.01 0.1 1.0 10 150°C 25°C VCE = −1.0 V −55°C VCE, COLLECTOR−EMITTER VOLTAGE (V) 1.0 0.8 10 mA 100 mA IC = 500 mA 300 mA 0.6 0.4 0.2 0 0.01 0.1 1.0 10 100 IC, COLLECTOR CURRENT (A) IB, BASE CURRENT (mA) Figure 5. Base Emitter Turn−On Voltage vs. Collector Current http://onsemi.com 3 Figure 6. Saturation Region NSS20600CF8T1G 850 Cibo, INPUT CAPACITANCE (pF) 800 750 700 650 600 550 500 450 400 350 300 Cobo, OUTPUT CAPACITANCE (pF) Cibo (pF) 375 350 325 300 275 250 225 200 175 150 125 100 Cobo (pF) 0 1.0 2.0 3.0 4.0 5.0 6.0 0 5.0 10 15 20 25 VEB, EMITTER BASE VOLTAGE (V) VCB, COLLECTOR BASE VOLTAGE (V) Figure 7. Input Capacitance Figure 8. Output Capacitance 10 1.0 IC (A) 1.0 mS 0.1 Thermal Limit 0.01 0.01 0.1 1.0 VCE (Vdc) 10 10 mS 100 mS 1.0 S 100 Figure 9. Safe Operating Area http://onsemi.com 4 NSS20600CF8T1G PACKAGE DIMENSIONS ChipFET CASE 1206A−03 ISSUE G D 8 7 6 5 q L 5 6 3 7 2 8 1 HE 1 2 3 4 E 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE. 4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL AND VERTICAL SHALL NOT EXCEED 0.08 MM. 5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS. 6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD SURFACE. DIM A b c D E e e1 L HE q MILLIMETERS NOM MAX 1.05 1.10 0.30 0.35 0.15 0.20 3.05 3.10 1.65 1.70 0.65 BSC 0.55 BSC 0.28 0.35 0.42 1.80 1.90 2.00 5° NOM MIN 1.00 0.25 0.10 2.95 1.55 MIN 0.039 0.010 0.004 0.116 0.061 INCHES NOM 0.041 0.012 0.006 0.120 0.065 0.025 BSC 0.022 BSC 0.011 0.014 0.071 0.075 5° NOM MAX 0.043 0.014 0.008 0.122 0.067 0.017 0.079 e1 e b c A 0.05 (0.002) 2.032 0.08 0.457 0.018 SOLDERING FOOTPRINT* 2.032 0.08 0.635 0.025 1.727 0.068 0.457 0.018 0.711 0.028 0.66 0.026 SCALE 20:1 mm inches 0.178 0.007 0.711 0.028 0.66 0.026 SCALE 20:1 mm inches Basic Style 4 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ChipFET is a trademark of Vishay Siliconix. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 5 NSS20600CF8/D
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