NVB6413ANT4G

NTB6413AN, NTP6413AN, NVB6413AN MOSFET – Power, N-Channel 100 V, 42 A, 28 mW www.onsemi.com Features • • • • • Low RDS(on) High Current Capability 100% Avalanche Tested NVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant V(BR)DSS ID MAX (Note 1) RDS(ON) MAX 100 V 42 A 28 mW @ 10 V N−Channel D MAXIMUM RATINGS (TJ = 25°C Unless otherwise specified) Parameter Drain−to−Source Voltage Gate−to−Source Voltage − Continuous Continuous Drain Current RqJC Steady State Power Dissipation RqJC Steady State TC = 25°C Symbol Value Unit VDSS 100 V VGS $20 V ID 42 A TC = 100°C 136 W IDM 178 A TJ, Tstg −55 to +175 °C IS 42 A Single Pulse Drain−to−Source Avalanche Energy (VDD = 50 Vdc, VGS = 10 Vdc, IL(pk) = 36.5 A, L = 0.3 mH, RG = 25 W) EAS 200 mJ Lead Temperature for Soldering Purposes, 1/8″ from Case for 10 Seconds TL 260 °C Symbol Max Unit Junction−to−Case (Drain) Steady State RqJC 1.1 °C/W Junction−to−Ambient (Note 1) RqJA 35 tp = 10 ms Operating Junction and Storage Temperature Range Source Current (Body Diode) S 4 28 PD Pulsed Drain Current TC = 25°C G 4 1 2 3 1 2 D2PAK CASE 418B STYLE 2 TO−220AB CASE 221A STYLE 5 3 4 Drain MARKING DIAGRAM & PIN ASSIGNMENT 4 Drain THERMAL RESISTANCE RATINGS Parameter Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Surface mounted on FR4 board using 1 sq in pad size, (Cu Area 1.127 sq in [2 oz] including traces). NTB 6413ANG AYWW NTP 6413ANG AYWW 1 Gate 3 Source 2 Drain 1 Gate 2 Drain 3 Source 6413AN = Specific Device Code G = Pb−Free Device A = Assembly Location Y = Year WW = Work Week ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2015 May, 2019 − Rev. 4 1 Publication Order Number: NTB6413AN/D NTB6413AN, NTP6413AN, NVB6413AN ELECTRICAL CHARACTERISTICS (TJ = 25°C Unless otherwise specified) Characteristics Symbol Test Condition Min V(BR)DSS VGS = 0 V, ID = 250 mA 100 Typ Max Unit OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current V(BR)DSS/TJ IDSS V 115 VGS = 0 V, VDS = 100 V mV/°C TJ = 25°C 1.0 TJ = 125°C 100 IGSS VDS = 0 V, VGS = $20 V VGS(th) VGS = VDS, ID = 250 mA $100 mA nA ON CHARACTERISTICS (Note 2) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On−Resistance VGS(th)/TJ 2.0 4.0 8.1 V mV/°C RDS(on) VGS = 10 V, ID = 42 A 25.6 gFS VGS = 5 V, ID = 20 A 17.9 S 1800 pF Forward Transconductance 28 mW CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance Ciss VDS = 25 V, VGS = 0 V, f = 1 MHz Output Capacitance Coss Reverse Transfer Capacitance Crss 280 100 Total Gate Charge QG(TOT) 51 Threshold Gate Charge QG(TH) nC 2.0 VGS = 10 V, VDS = 80 V, ID = 42 A Gate−to−Source Charge QGS 10 Gate−to−Drain Charge QGD Plateau Voltage VGP 5.8 V Gate Resistance RG 2.4 W 13 ns 26 SWITCHING CHARACTERISTICS, VGS = 10 V (Note 3) Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time td(on) tr td(off) VGS = 10 V, VDD = 80 V, ID = 42 A, RG = 6.2 W tf 84 52 71 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage VSD Reverse Recovery Time trr Charge Time ta Discharge Time tb Reverse Recovery Charge IS = 42 A TJ = 25°C 0.92 TJ = 125°C 0.83 73 VGS = 0 V, IS = 42 A, dISD/dt = 100 A/ms QRR www.onsemi.com 2 V ns 56 17 230 2. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 3. Switching characteristics are independent of operating junction temperatures. 1.3 nC NTB6413AN, NTP6413AN, NVB6413AN TYPICAL CHARACTERISTICS 100 ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) 6.5 V 60 6.0 V 40 5.5 V 20 5.0 V 1 2 3 4 80 60 40 20 TJ = −55°C 5 2 5 6 7 Figure 2. Transfer Characteristics RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) VDS, DRAIN−TO−SOURCE VOLTAGE (V) 0.04 0.03 0.02 5 6 7 8 9 10 VGS, GATE−TO−SOURCE VOLTAGE (V) VGS = 10 V 0.06 TJ = 125°C 0.04 TJ = 25°C 0.02 TJ = −55°C 0.00 10 10000 IDSS, LEAKAGE (nA) 2 1.5 1 25 50 75 100 125 150 20 30 40 ID, DRAIN CURRENT (A) VGS = 0 V ID = 42 A VGS = 10 V 0 TJ = 175°C Figure 4. On−Resistance versus Drain Current and Gate Voltage 3 −25 8 0.08 Figure 3. On−Region versus Gate Voltage RDS(on), DRAIN−TO−SOURCE RESISTANCE (NORMALIZED) 4 Figure 1. On−Region Characteristics 0.05 0.5 −50 3 VGS, GATE−TO−SOURCE VOLTAGE (V) ID = 42 A TJ = 25°C 2.5 TJ = 25°C TJ = 125°C 0 0.06 0.01 VDS w 10 V 7.5 V 80 0 0 RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) 100 10 V TJ = 25°C TJ = 150°C 1000 TJ = 125°C 100 175 10 TJ, JUNCTION TEMPERATURE (°C) 20 30 40 50 60 70 80 VDS, DRAIN−TO−SOURCE VOLTAGE (V) Figure 5. On−Resistance Variation with Temperature 90 100 Figure 6. Drain−to−Source Leakage Current versus Voltage www.onsemi.com 3 NTB6413AN, NTP6413AN, NVB6413AN TJ = 25°C VGS = 0 V 3000 Ciss 2000 1000 0 Coss Crss 0 10 20 30 40 50 60 70 80 90 VDS, DRAIN−TO−SOURCE VOLTAGE (V) 10 VGS, GATE−TO−SOURCE VOLTAGE (V) C, CAPACITANCE (pF) 4000 100 VDS td(on) 1 60 4 40 2 0 20 ID = 42 A TJ = 25°C 0 IS, SOURCE CURRENT (A) t, TIME (ns) td(off) 1 Qgd 10 20 30 40 Qg, TOTAL GATE CHARGE (nC) 50 0 TJ = 25°C VGS = 0 V 40 tr tf 10 80 Figure 8. Gate−to−Source Voltage and Drain−to−Source Voltage versus Total Charge VDS = 80 V ID = 42 A VGS = 10 V 100 VGS Qgs 6 Figure 7. Capacitance Variation 1000 100 QT 8 VDS, DRAIN−TO−SOURCE VOLTAGE (V) TYPICAL CHARACTERISTICS 10 RG, GATE RESISTANCE (W) 30 20 10 0 0.4 100 Figure 9. Resistive Switching Time Variation versus Gate Resistance 0.5 0.6 0.7 0.8 0.9 VSD, SOURCE−TO−DRAIN VOLTAGE (V) 1.0 Figure 10. Diode Forward Voltage versus Current 1000 200 AVALANCHE ENERGY (mJ) ID, DRAIN CURRENT (A) ID = 56 A 100 10 ms 100 ms 10 VGS = 10 V SINGLE PULSE TC = 25°C 1 0.1 1 ms 10 ms dc RDS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 1 10 100 VDS, DRAIN−TO−SOURCE VOLTAGE (V) 1000 150 100 50 0 25 Figure 11. Maximum Rated Forward Biased Safe Operating Area 50 75 100 125 150 TJ, STARTING JUNCTION TEMPERATURE 175 Figure 12. Maximum Avalanche Energy versus Starting Junction Temperature www.onsemi.com 4 NTB6413AN, NTP6413AN, NVB6413AN TYPICAL CHARACTERISTICS 10 R(t) (°C/W) 1 D = 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 0.000001 0.00001 0.0001 0.001 0.01 t, PULSE TIME (s) 0.1 1 10 Figure 13. Thermal Response ORDERING INFORMATION Package Shipping† NTB6413ANG D2PAK (Pb−Free) 50 Units / Rail NTB6413ANT4G D2PAK (Pb−Free) 800 / Tape & Reel NTP6413ANG TO−220 (Pb−Free) 50 Units / Rail NVB6413ANT4G D2PAK (Pb−Free) 800 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−220 CASE 221A ISSUE AK DATE 13 JAN 2022 SCALE 1:1 STYLE 1: PIN 1. 2. 3. 4. BASE COLLECTOR EMITTER COLLECTOR STYLE 2: PIN 1. 2. 3. 4. BASE EMITTER COLLECTOR EMITTER STYLE 3: PIN 1. 2. 3. 4. CATHODE ANODE GATE ANODE STYLE 4: PIN 1. 2. 3. 4. MAIN TERMINAL 1 MAIN TERMINAL 2 GATE MAIN TERMINAL 2 STYLE 5: PIN 1. 2. 3. 4. GATE DRAIN SOURCE DRAIN STYLE 6: PIN 1. 2. 3. 4. ANODE CATHODE ANODE CATHODE STYLE 7: PIN 1. 2. 3. 4. CATHODE ANODE CATHODE ANODE STYLE 8: PIN 1. 2. 3. 4. CATHODE ANODE EXTERNAL TRIP/DELAY ANODE STYLE 9: PIN 1. 2. 3. 4. GATE COLLECTOR EMITTER COLLECTOR STYLE 10: PIN 1. 2. 3. 4. GATE SOURCE DRAIN SOURCE STYLE 11: PIN 1. 2. 3. 4. DRAIN SOURCE GATE SOURCE STYLE 12: PIN 1. 2. 3. 4. MAIN TERMINAL 1 MAIN TERMINAL 2 GATE NOT CONNECTED DOCUMENT NUMBER: DESCRIPTION: 98ASB42148B TO−220 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS D2PAK 3 CASE 418B−04 ISSUE L DATE 17 FEB 2015 SCALE 1:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. C E −B− V W 4 1 2 A S 3 −T− SEATING PLANE K W J G D DIM A B C D E F G H J K L M N P R S V H 3 PL 0.13 (0.005) M T B M VARIABLE CONFIGURATION ZONE N R P L M STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR L M F F F VIEW W−W 1 VIEW W−W 2 VIEW W−W 3 STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 U L M INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE STYLE 4: PIN 1. GATE 2. COLLECTOR 3. EMITTER 4. COLLECTOR STYLE 5: STYLE 6: PIN 1. CATHODE PIN 1. NO CONNECT 2. ANODE 2. CATHODE 3. CATHODE 3. ANODE 4. ANODE 4. CATHODE MARKING INFORMATION AND FOOTPRINT ON PAGE 2 DOCUMENT NUMBER: DESCRIPTION: 98ASB42761B D2PAK 3 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com D2PAK 3 CASE 418B−04 ISSUE L DATE 17 FEB 2015 GENERIC MARKING DIAGRAM* xx xxxxxxxxx AWLYWWG xxxxxxxxG AYWW AYWW xxxxxxxxG AKA IC Standard Rectifier xx A WL Y WW G AKA = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package = Polarity Indicator *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. SOLDERING FOOTPRINT* 10.49 8.38 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ASB42761B D2PAK 3 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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