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Si3443DV
Si3443DV
P-Channel 2.5V Specified PowerTrench MOSFET
General Description
Features
This P-Channel 2.5V specified MOSFET is produced
using Fairchild's advanced PowerTrench process that
has been especially tailored to minimize on-state
resistance and yet maintain low gate charge for
superior switching performance.
Fast switching speed.
These devices have been designed to offer exceptional
power dissipation in a very small footprint for
applications where the larger packages are impractical.
Low gate charge (7.2nC typical).
Applications
Load switch
Battery protection
Power management
High performance trench technology for extremely
low RDS(ON).
SuperSOTTM-6 package: small footprint (72% smaller
than standard SO-8); low profile (1mm thick).
D
-4 A, -20 V. RDS(ON) = 0.065 Ω @ VGS = -4.5 V
RDS(ON) = 0.100 Ω @ VGS = -2.5 V
S
1
6
2
5
3
4
D
SuperSOT TM-6
D
D
G
Absolute Maximum Ratings
Symbol
Parameter
VDSS
Drain-Source Voltage
VGSS
Gate-Source Voltage
ID
Drain Current
- Continuous
Drain Current
- Pulsed
PD
TA = 25°C unless otherwise noted
Power Dissipation for Single Operation
TJ, Tstg
Ratings
Units
-20
V
±8
-4
V
(Note 1)
(Note 1a)
-20
(Note 1a)
1.6
(Note 1b)
0.8
Operating and Storage Junction Temperature Range
A
W
-55 to +150
°C
Thermal Characteristics
RθJA
Thermal Resistance, Junction-to-Ambient
(Note 1a)
78
°C/W
RθJC
Thermal Resistance, Junction-to-Case
(Note 1)
30
°C/W
Package Outlines and Ordering Information
Device Marking
Device
Reel Size
Tape Width
Quantity
.443
Si3443DV
7’’
8mm
3000 units
2001 Semiconductor Components Industries, LLC.
September-2017, Rev.1
Publication Order Number:
Si3443DV/D
Symbol
TA = 25°C unless otherwise noted
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0 V, ID = -250 µA
∆BVDSS
∆TJ
IDSS
Breakdown Voltage Temperature
Coefficient
ID = -250 µA, Referenced to 25°C
Zero Gate Voltage Drain Current
VDS = -16 V, VGS = 0 V
IGSSF
Gate-Body Leakage Current, Forward
VGS = 8 V, VDS = 0 V
100
µA
nA
IGSSR
Gate-Body Leakage Current, Reverse
VGS = -8 V, VDS = 0 V
-100
nA
-1.5
V
On Characteristics
-20
V
-16
mV/°C
-1
(Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = -250 µA
∆VGS(th)
∆TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
ID = -250 µA, Referenced to 25°C
2.5
Static Drain-Source
On-Resistance
0.054
0.076
0.077
ID(on)
On-State Drain Current
VGS = -4.5 V, ID = -4 A
VGS = -4.5 V, ID = -4 A, TJ=125°C
VGS = -2.5 V, ID = -3.2 A
VGS = -4.5 V, VDS = -5 V
gFS
Forward Transconductance
VDS = -5 V, ID = -4 A
-0.4
-0.7
mV/°C
0.065
0.105
0.100
-10
Ω
A
9
S
640
pF
Dynamic Characteristics
VDS = -10 V, VGS = 0 V
f = 1.0 MHz
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
tf
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
180
pF
90
pF
(Note 2)
VDD = -10 V, ID = -1 A
VGS = -4.5 V, RGEN = 6 Ω
11
20
ns
19
30
ns
Turn-Off Delay Time
26
42
ns
Turn-Off Fall Time
35
55
ns
7.2
10
nC
VDS = -10 V, ID = -4 A
VGS = -4.5 V,
1.7
nC
1.6
nC
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
VSD
Drain-Source Diode Forward Voltage
VGS = 0 V, IS = -1.3 A
(Note 2)
-0.75
-1.3
A
-1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface
of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 78° C/W when mounted on a 1.0 in2 pad of 2 oz. copper.
b) 156° C/W when mounted on a minimum pad of 2 oz.copper.
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
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2
Si3443DV
Electrical Characteristics
Si3443DV
Typical Characteristics
1.6
VGS = -4.5V
RDS(ON), NORMALIZED
-3.5V
-3.0V
15
-2.5V
10
-2.0V
5
-1.5V
0
DRAIN-SOURCE ON-RESISTANCE
-ID, DRAIN-SOURCE CURRENT (A)
20
VGS = -2.5V
1.4
-3.0V
1.2
-3.5V
-4.0V
-4.5V
1
0.8
0
1
2
3
4
5
0
4
8
Figure 1. On-Region Characteristics.
20
0.25
ID = - 4A
VGS = - 4.5V
1.4
RDS(ON), ON-RESISTANCE (OHM)
RDS(ON), NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
16
Figure 2. On-Resistance Variation
with Drain Current and Gate Voltage.
1.5
1.3
1.2
1.1
1
0.9
0.8
ID = -2A
0.2
0.15
0.1
TA = 125oC
TA = 25oC
0.05
0
0.7
-50
-25
0
25
50
75
100
125
1
150
2
3
4
5
-VGS, GATE TO SOURCE VOLTAGE (V)
o
TJ, JUNCTION TEMPERATURE ( C)
Figure 3. On-Resistance Variation
with Temperature.
Figure 4. On-Resistance Variation
with Gate-to-Source Voltage.
100
10
-IS, REVERSE DRAIN CURRENT (A)
TA = -55oC
VDS = -5V
-ID, DRAIN CURRENT (A)
12
- ID, DRAIN CURRENT (A)
-VDS, DRAIN-SOURCE VOLTAGE (V)
25oC
8
125oC
6
4
2
VGS = 0V
10
T = 125oC
1
25oC
-55oC
0.1
0.01
0.001
0
0.4
0.8
1.2
1.6
2
2.4
0
Figure 5. Transfer Characteristics.
0.2
0.4
0.6
0.8
1
1.2
-VSD, BODY DIODE FORWARD VOLTAGE (V)
-VGS, GATE TO SOURCE VOLTAGE (V)
Figure 6. Body Diode Forward Voltage
Variation with Source Current
and Temperature.
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3
1.4
(continued)
5
1250
f = 1 MHz
VGS = 0 V
VDS = -5V
-10V
-15V
ID = -4A
4
1000
CAPACITANCE (pF)
-VGS, GATE-SOURCE VOLTAGE (V)
Si3443DV
Typical Characteristics
3
2
1
750
CISS
500
250
COSS
CRSS
0
0
0
2
4
6
8
10
0
5
Qg, GATE CHARGE (nC)
10
15
20
-VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Gate-Charge Characteristics
Figure 8. Capacitance Characteristics
100
5
10
10ms
100ms
1s
DC
1
VGS= -4.5V
SINGLE PULSE
o
RθJA= 156 C/W
0.1
POWER (W)
1ms
TA = 25oC
3
2
1
o
TA= 25 C
0.01
0
0.1
1
10
100
0.1
1
10
100
1000
SINGLE PULSE TIME (SEC)
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9. Maximum Safe Operating Area
Figure 10. Single Pulse Maximum
Power Dissipation
r(t), NORMALIZED EFFECTIVE
1
TRANSIENT THERMAL RESISTANCE
-ID, DRAIN CURRENT (A)
SINGLE PULSE
RθJA = 156oC/W
4
100µs
RDS(ON) LIMIT
0.5
D = 0.5
0.2
0.1
0.05
R θJA (t) = r(t) * R θJA
R θJA = 156°C/W
0.2
0.1
P(pk)
0.05
t1
0.02
0.02
0.01
t2
TJ - TA = P * R θJA (t)
0.01
Duty Cycle, D = t 1 / t 2
Single Pulse
0.005
0.00001
0.0001
0.001
0.01
0.1
t1 , TIME (sec)
1
Figure 11. Transient Thermal Response Curve.
10
100
Thermal characterization performed using the conditions described in Note 1b.
Transient themal response will change depending on the circuit board design.
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ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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