SSRD8620CTRG-VF01

Final Product/Process Change Notification Document # : FPCN21107ZAB Issue Date: 16 March 2017 Qualify ON Semiconductor Vietnam (OSV) as an additional Automotive site for Assembly/Test of specified products in DPAK package. Title of Change: Proposed Changed Material First Ship Date: 16 September 2017 or earlier upon customer request Current Material Last Order Date: N/A Current Material Last Delivery Date: N/A Product Category: Active components – Discrete components Contact information Contact your local ON Semiconductor Sales Office or Samples Contact your local ON Semiconductor Sales Office to place sample order. Sample requests are to be submitted no later than 45 days after publication of this change notification. Sample Availability Date: 15 March 2017 PPAP Availability Date: 15 May 2017 Additional Reliability Data Contact your local ON Semiconductor Sales Office or . Type of Notification This is a Final Product/Process Change Notification (FPCN) sent to customers. This FPCN is being issued 6 months prior to implementation because this change provides an alternate source to an ON manufacturing facility utilizing the same BOM. ON Semiconductor will consider this proposed change and it’s conditions acceptable, unless an inquiry is made in writing within 30 days of delivery of this notice. To do so, contact . Change Category: Type of Change Process – Assembly Move of all or part of assembly to a different location/site/subcontractor. Process – Assembly Change of product marking. Test Flow Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor. Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process. Equipment Description and Purpose: This Final Notification announces the plan to qualify ON Semiconductor Vietnam (OSV) as an additional Assembly and Test site for operations of Automotive discrete DPAK packaged products. Upon the expiration of this FPCN, new OSV part numbers will be available to allow specified products to be sourced from either the Seremban or Vietnam locations using the same Bill of Material. ON Semiconductor Vietnam (OSV) is qualified site for DPAK Standard discrete packaged products and is ISO TS16949 certified. Products sourced from OSV have been qualified to Automotive requirements and continue remain as Pb-free, Halide free and RoHS compliant.  Reason / Motivation for Change: TEM001092 Rev. L Change benefits for customer: o Unconstrained Automotive Sourcing o Seamless dual source Mfg alternatives, ensuring capacity availability o Instantaneous capacity available for growth; Short lead times; Lines down aversion  Risk for late release for customer: Limited capacity. Page 1 of 5 Final Product/Process Change Notification Document # : FPCN21107ZAB Issue Date: 16 March 2017 Anticipated impact on fit, form, function, reliability, product safety or manufacturability The device has been qualified and validated based on the same Product Specification. The device has successfully passed the qualification tests. Potential impacts can be identified, but due to testing performed by ON Semiconductor in relation to the PCN, associated risks are verified and excluded. No anticipated impacts. Sites Affected: All site(s) not applicable Marking of Parts/ Traceability of Change: ON Semiconductor site(s) : ON Seremban, Malaysia ON Dong Nai Province, Vietnam External Foundry/Subcon site(s) Product from ON Semiconductor Vietnam (OSV) will be marked with site code “VN” prior to the date code while the Seremban device does not have site code marking. Reliability Data Summary: QV DEVICE NAME: MJD340T4G (Bipolar) PACKAGE: DPAK Test Specification Condition Interval Result HTRB JESD22-A108 Ta = 150 °C, bias = 80% of rated V 1008 hrs 0/84 HTSL JESD22-A103 Ta = 150 °C 1008 hrs 0/84 IOL MIL-STD-750 (M1037) AEC-Q101 Ta=+25°C, deltaTj=100°C max, Ton = Toff = 2min 15000 cyc TC JESD22-A104 Temp = -65°C to +150°C 1000 cyc 0/84 AC JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/84 H3TRB JESD22-A101 Temp = 85°C, RH=85%, bias = 100V max 1008 hrs 0/84 PC J-STD-020 JESD-A113 MSL 1 @ 260 °C 0/336 RSH JESD22- B106 Ta = 265°C, 10 sec 0/30 SD JSTD002 Ta = 245°C, 10 sec 0/15 0/84 QV DEVICE NAME: MJD350T4G (Bipolar) PACKAGE: DPAK Test Specification Condition Interval Result HTRB JESD22-A108 Ta = 150 °C, bias = 80% of rated V 1008 hrs 0/84 HTSL JESD22-A103 Ta = 150 °C 1008 hrs 0/84 IOL MIL-STD-750 (M1037) AEC-Q101 Ta=+25°C, deltaTj=100°C max, Ton = Toff = 2min 15000 cyc TC JESD22-A104 Temp = -65°C to +150°C 1000 cyc 0/84 AC JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/84 H3TRB JESD22-A101 Temp = 85°C, RH=85%, bias = 100V max 1008 hrs 0/84 PC J-STD-020 JESD-A113 MSL 1 @ 260 °C 0/336 RSH JESD22- B106 Ta = 265°C, 10 sec 0/30 SD JSTD002 Ta = 245°C, 10 sec 0/15 TEM001092 Rev. L 0/84 Page 2 of 5 Final Product/Process Change Notification Document # : FPCN21107ZAB Issue Date: 16 March 2017 QV DEVICE NAME: NTD6414ANT4G (Mosfet) PACKAGE: DPAK Test Specification Condition Interval Result HTRB JESD22-A108 Ta = 175 °C, bias = 80% of rated V 1008 hrs 0/84 HTGB JESD22-A108 Ta = 175 °C, 100% max rated Vgss 1008 hrs 0/84 HTSL JESD22-A103 Ta = 175 °C 1008 hrs 0/84 IOL MIL-STD-750 (M1037) AEC-Q101 Ta=+25°C, deltaTj=100°C max, Ton = Toff = 2min 15000 cyc TC JESD22-A104 Temp = -55°C to +150°C 1000 cyc 0/84 AC JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/84 H3TRB JESD22-A101 Temp = 85°C, RH=85%, bias = 80% of rated V 1008 hrs 0/84 PC J-STD-020 JESD-A113 MSL 1 @ 260 °C 0/336 RSH JESD22- B106 Ta = 265°C, 10 sec 0/30 SD JSTD002 Ta = 245°C, 10 sec 0/15 0/84 QV DEVICE NAME: NTD110N02RT4G (Mosfet) PACKAGE: DPAK Test Specification Condition Interval Result HTRB JESD22-A108 Ta = 175 °C, bias = 80% of rated V 1008 hrs 0/84 HTGB JESD22-A108 Ta = 175 °C, 100% max rated Vgss 1008 hrs 0/84 HTSL JESD22-A103 Ta = 175 °C 1008 hrs 0/84 IOL MIL-STD-750 (M1037) AEC-Q101 Ta=+25°C, deltaTj=100°C max, Ton = Toff = 2min 15000 cyc TC JESD22-A104 Temp = -55°C to +150°C 1000 cyc 0/84 AC JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/84 H3TRB JESD22-A101 Temp = 85°C, RH=85%, bias = 80% of rated V 1008 hrs 0/84 PC J-STD-020 JESD-A113 MSL 1 @ 260 °C 0/336 RSH JESD22- B106 Ta = 265°C, 10 sec 0/30 SD JSTD002 Ta = 245°C, 10 sec 0/15 TEM001092 Rev. L 0/84 Page 3 of 5 Final Product/Process Change Notification Document # : FPCN21107ZAB Issue Date: 16 March 2017 QV DEVICE NAME: MURHD560T4G (Ultrafast Rectifier) PACKAGE: DPAK Test Specification Condition Interval Result HTRB JESD22-A108 Ta = 150 °C, Tj(est) = 175 °C, bias = 80% of rated V 1008 hrs 0/252 HTSL JESD22-A103 Ta = 175 °C 1008 hrs 0/252 IOL MIL-STD-750 (M1037) AEC-Q101 Ta=+25°C, deltaTj=100°C max, Ton = Toff = 2min 15000 cyc 0/252 TC JESD22-A104 Temp = -65°C to +150°C 1000 cyc 0/252 AC JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/252 H3TRB JESD22-A101 Temp = 85°C, RH=85%, bias = 100V max 1008 hrs 0/252 PC J-STD-020 JESD-A113 MSL 1 @ 260 °C 0/1008 RSH JESD22- B106 Ta = 265°C, 10 sec 0/90 SD JSTD002 Ta = 245°C, 10 sec 0/45 QV DEVICE NAME: MBRD5H100T4G (Schottky Rectifier) PACKAGE: DPAK Test Specification Condition Interval Result HTRB JESD22-A108 Tj = 90 °C, bias = 80% of rated V 1008 hrs 0/84 HTSL JESD22-A103 Ta = 175 °C 1008 hrs 0/84 IOL MIL-STD-750 (M1037) AEC-Q101 Ta=+25 °C, deltaTj=100°C max, Ton = Toff = 2min 15000 cyc 0/84 TC JESD22-A104 Temp = -65°C to +150 °C 1000 cyc 0/84 AC JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/84 H3TRB JESD22-A101 Temp = 85 °C, RH=85%, bias = 80% of rated V 1008 hrs 0/84 PC J-STD-020 JESD-A113 MSL 1 @ 260 °C 0/336 RSH JESD22- B106 Ta = 265 °C, 10 sec 0/30 SD JSTD002 Ta = 245 °C, 10 sec 0/15 NOTE: AEC-1pager is attached. To access file attachments on pdf copy of PCN, please be guided by the steps below: 1. Download pdf copy of the PCN to your computer 2. Open the downloaded pdf copy of the PCN 3. Click on the paper clip icon available on the menu provided in the left/bottom portion of the screen to reveal the Attachment field 4. Then click on the attached file/s Electrical Characteristic Summary: Electrical characteristics are not impacted. TEM001092 Rev. L Page 4 of 5 Final Product/Process Change Notification Document # : FPCN21107ZAB Issue Date: 16 March 2017 List of Affected Standard Parts: Current SBN Part Number New OSV Part Number NRVBD650CTG NRVBD650CTG-VF01 NRVBD660CTRLG NRVBD660CTRLG-VF01 SBRD8320T4G SBRD8320T4G-VF01 SBRD8330G SBRD8330G-VF01 SBRD8330T4G SBRD8330T4G-VF01 SBRD8340G SBRD8340G-VF01 SBRD8350G SBRD8350G-VF01 SBRD8350T4G SBRD8350T4G-VF01 SBRD8340T4G SBRD8340T4G-VF01 NRVBD640CTG NRVBD640CTG-VF01 NRVBD650CTT4G NRVBD650CTT4G-VF01 NRVBD660CTG NRVBD660CTG-VF01 SBR835LT4G SBR835LT4G-VF01 SBRD81035CTLG SBRD81035CTLG-VF01 SBRD8320G SBRD8320G-VF01 SBRD8360G SBRD8360G-VF01 SBRD8360RLG SBRD8360RLG-VF01 Qualification Vehicle MBRD5H100T4G SBRD8835LG SBRD8835LG-VF01 SSRD8620CTRG SSRD8620CTRG-VF01 NRVUD320W1T4G NRVUD320W1T4G-VF01 NRVUD340T4G NRVUD340T4G-VF01 SUR620CTT4G SUR620CTT4G-VF01 SURHD8560T4G SURHD8560T4G-VF01 SURD8530T4G SURD8530T4G-VF01 NRVUD550PFT4G NRVUD550PFT4G-VF01 NRVUD620CTG NRVUD620CTG-VF01 STD110N02RT4G STD110N02RT4G-VF01 NVD3055-094T4G NVD3055-094T4G-VF01 NVD3055L170T4G NVD3055L170T4G-VF01 NVD6414ANT4G NVD6414ANT4G-VF01 NVD6415ANT4G NVD6415ANT4G-VF01 NVD6416ANLT4G-001 NVD6416ANLT4G-001-VF01 NVD6416ANT4G NVD6416ANT4G-VF01 NVD6495NLT4G NJVMJD42CT4G NVD6495NLT4G-VF01 NJVMJD42CT4G-VF01 MJD340T4G SJD127T4G SJD127T4G-VF01 MJD350T4G MURHD560T4G NTD110N02RT4G NTD6414ANT4G List of Affected Customer Specific Parts: NOTE: Please be informed that parts impacted by this PDN/PCN are Special/Customer specific parts, thus MPN & CPN info will be available to affected customers only by clicking the “Custom PCN for Selected Company Button” in the Document Analysis page of PCMS/PCN Alert. TEM001092 Rev. L Page 5 of 5