SURA8240T3G

MURA230T3G, MURA240T3G, SURA8240T3G Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features • • • • • • www.onsemi.com ULTRAFAST RECTIFIERS 2 AMPERES, 300−400 VOLTS Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.95 V Max @ 2.0 A, TJ = 150°C) SURA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant SMA CASE 403D STYLE 1 PLASTIC MARKING DIAGRAM Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 70 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal U5x AYWW G Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: ♦ Human Body Model > 4000 V (Class 3) ♦ Machine Model > 400 V (Class C) U5Fx = Device Code x = F for MURA230T3 G for MURA240T3 A = Assembly Location** Y = Year WW = Work Week G = Pb−Free Package ** The Assembly Location Code (A) is front side optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), the front side assembly code may be blank. ORDERING INFORMATION Package Shipping† MURA230T3G SMA (Pb−Free) 5,000/Tape & Reel MURA240T3G SMA (Pb−Free) 5,000/Tape & Reel SURA8240T3G* SMA (Pb−Free) 5,000/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2012 May, 2017 − Rev. 5 1 Publication Order Number: MURA230T3/D MURA230T3G, MURA240T3G, SURA8240T3G MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA230T3G MURA240T3G/SURA8240T3G VRRM VRWM VR Average Rectified Forward Current @ TL = 150°C @ TL = 125°C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction Temperature Range TJ Value Unit V 300 400 1.0 2.0 35 −65 to +175 A A °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (TL = 25°C) (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1) Symbol Value Unit PsiJL (Note 2) RqJA 24 °C/W 216 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL. ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (iF = 2.0 A, TJ = 25°C) (iF = 2.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 3) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) trr Max 1.30 1.05 5.0 150 65 Unit V mA ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. www.onsemi.com 2 MURA230T3G, MURA240T3G, SURA8240T3G IR, REVERSE CURRENT (mA) TJ = 175°C 10 TJ = 100°C 1 0.1 TJ = 25°C 0.01 IF, INSTANTANEOUS FORWARD CURRENT (A) 1000 50 100 150 200 300 250 350 100 TJ = 100°C 10 TJ = 25°C 50 100 150 200 250 300 350 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current 10 100°C TC = 175°C 25°C 1 0.1 0.01 TJ = 175°C 1 400 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 IF, INSTANTANEOUS FORWARD CURRENT (A) IR, REVERSE CURRENT (mA) 100 10 100°C TC = 175°C 25°C 1 0.1 0.01 0.5 0.6 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage www.onsemi.com 3 400 1.5 MURA230T3G, MURA240T3G, SURA8240T3G 30 30 NOTE: TYPICAL CAPACITANCE AT 0 V = 26 pF 20 15 10 8 12 16 20 24 28 32 36 15 10 0 4 8 12 16 20 24 28 32 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance Figure 6. Maximum Capacitance 4 dc 3 2 SQUARE WAVE 1 80 90 0 40 100 110 120 130 140 150 160 170 180 IF(AV), AVERAGE FORWARD CURRENT (A) 4 0.25 0 20 0 40 60 100 120 140 Figure 8. Current Derating, Ambient (FR−4 Board with Minimum Pad) dc SQUARE WAVE 1.5 1 0.5 0.5 80 TA, AMBIENT TEMPERATURE (°C) 3 0 180 SQUARE WAVE 0.5 3.5 0 160 0.75 4 2 40 dc Figure 7. Current Derating, Lead 2.5 36 1 TL, LEAD TEMPERATURE (°C) PF, AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) 0 5 0 20 5 5 0 NOTE: MAXIMUM CAPACITANCE AT 0 V = 29 pF 25 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 25 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation www.onsemi.com 4 3.5 MURA230T3G, MURA240T3G, SURA8240T3G PACKAGE DIMENSIONS SMA CASE 403D ISSUE H HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.97 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.10 2.20 0.10 0.20 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.078 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.083 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.087 0.008 0.064 0.016 0.115 0.180 0.220 0.060 A L c A1 SOLDERING FOOTPRINT* 4.000 0.157 2.000 0.079 2.000 0.079 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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