2SK3814-AZ

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PART NUMBER PACKAGE 2SK3814 TO-251 (MP-3) 2SK3814-Z TO-252 (MP-3Z) FEATURES • Super low on-state resistance (TO-251) RDS(on)1 = 8.7 mΩ MAX. (VGS = 10 V, ID = 30 A) RDS(on)2 = 10.5 mΩ MAX. (VGS = 4.5 V, ID = 30 A) • Low C iss: C iss = 5450 pF TYP. ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Drain to Source Voltage (VGS = 0 V) VDSS 60 V Gate to Source Voltage (VDS = 0 V) VGSS ±20 V Drain Current (DC) (TC = 25°C) ID(DC) ±60 A ID(pulse) ±240 A Total Power Dissipation (TC = 25°C) PT1 84 W Total Power Dissipation (TA = 25°C) PT2 1.0 W Channel Temperature Tch 150 °C Tstg −55 to +150 °C EAS 102 mJ IAR 32 A EAR 102 mJ (TO-252) Drain Current (pulse) Note1 Storage Temperature Single Avalanche Energy Note2 Repetitive Avalanche Current Note3 Repetitive Avalanche Energy Note3 Notes 1. PW ≤ 10 μs, Duty Cycle ≤ 1% 2. Starting Tch = 25°C, VDD = 30 V, RG = 25 Ω, VGS = 20 → 0 V, L = 100 μH 3. Tch(peak) ≤ 150°C, RG = 25 Ω The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. D16740EJ2V0DS00 (2nd edition) Date Published August 2006 NS CP(K) Printed in Japan The mark shows major revised points. The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. 2004 2SK3814 ELECTRICAL CHARACTERISTICS (TA = 25°C) CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Zero Gate Voltage Drain Current IDSS VDS = 60 V, VGS = 0 V 10 μA Gate Leakage Current IGSS VGS = ±20 V, VDS = 0 V ±100 nA VGS(off) VDS = 10 V, ID = 1 mA 1.5 2.0 2.5 V | yfs | VDS = 10 V, ID = 30 A 22 44 RDS(on)1 VGS = 10 V, ID = 30 A 7.0 8.7 mΩ RDS(on)2 VGS = 4.5 V, ID = 30 A 7.9 10.5 mΩ Gate Cut-off Voltage Forward Transfer Admittance Note Drain to Source On-state Resistance Note S Input Capacitance Ciss VDS = 10 V 5450 pF Output Capacitance Coss VGS = 0 V 550 pF Reverse Transfer Capacitance Crss f = 1 MHz 350 pF Turn-on Delay Time td(on) VDD = 30 V, ID = 30 A 23 ns VGS = 10 V 8.5 ns RG = 0 Ω 85 ns 7.7 ns Rise Time tr Turn-off Delay Time td(off) Fall Time tf Total Gate Charge QG VDD = 48 V 95 nC Gate to Source Charge QGS VGS = 10 V 17 nC QGD ID = 60 A 26 nC Gate to Drain Charge Body Diode Forward Voltage Note VF(S-D) IF = 60 A, VGS = 0 V 0.95 Reverse Recovery Time trr IF = 60 A, VGS = 0 V 36 ns Reverse Recovery Charge Qrr di/dt = 100 A/μs 40 nC 1.5 V Note Pulsed TEST CIRCUIT 1 AVALANCHE CAPABILITY D.U.T. RG = 25 Ω D.U.T. L 50 Ω PG. VGS = 20 → 0 V TEST CIRCUIT 2 SWITCHING TIME RL RG PG. VDD VGS VGS Wave Form 0 VGS 10% 90% VDD VDS 90% BVDSS IAS VDS ID VDS τ τ = 1 μs Duty Cycle ≤ 1% TEST CIRCUIT 3 GATE CHARGE D.U.T. IG = 2 mA PG. 2 50 Ω 0 10% 10% tr td(off) Wave Form VDD Starting Tch 90% VDS VGS 0 RL VDD Data Sheet D16740EJ2V0DS td(on) ton tf toff 2SK3814 TYPICAL CHARACTERISTICS (TA = 25°C) TOTAL POWER DISSIPATION vs. CASE TEMPERATURE 120 100 PT - Total Power Dissipation - W dT - Percentage of Rated Power - % DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 100 80 60 40 20 80 60 40 20 0 0 0 25 50 75 100 125 150 175 0 25 TC - Case Temperature - °C 50 75 100 125 150 175 TC - Case Temperature - °C FORWARD BIAS SAFE OPERATING AREA 1000 100 100 μs 10 ms ID(DC) = 60 A 10 1 ms Power Dissipation Limited DC TC = 25°C Single pulse 1 0.1 1 10 100 VDS - Drain to Source Voltage - V TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1000 rth(t) - Transient Thermal Resistance - °C/W ID - Drain Current - A ID(pulse) = 240 A RDS(on) Limited (at VGS = 10 V) Rth(ch-A) = 125°C/W 100 10 Rth(ch-C) = 1.49°C/W 1 0.1 Single pulse 0.01 100 μ 1m 10 m 100 m 1 10 100 1000 PW - Pulse Width - s Data Sheet D16740EJ2V0DS 3 2SK3814 DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE FORWARD TRANSFER CHARACTERISTICS 300 1000 VGS = 10 V ID - Drain Current - A ID - Drain Current - A 250 200 4.5 V 150 100 100 Tch = −55°C 25°C 75°C 125°C 150°C 10 1 0.1 50 VDS = 10 V Pulsed Pulsed 0 0.01 0 1 2 3 4 5 6 0 1 VDS - Drain to Source Voltage - V 3 2.5 2 1.5 1 0.5 0 25 75 125 | yfs | - Forward Transfer Admittance - S VGS(off) - Gate Cut-off Voltage - V VDS = 10 V ID = 1 mA -25 VDS = 10 V Pulsed 10 Tch = −55°C 25°C 75°C 125°C 150°C 1 0.1 0.1 175 15 VGS = 4.5 V 10 V Pulsed 0 10 100 1000 RDS(on) - Drain to Source On-state Resistance - mΩ RDS(on) - Drain to Source On-state Resistance - mΩ 20 1 10 100 DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 16 14 12 10 ID - Drain Current - A 4 1 ID - Drain Current - A DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT 5 5 100 Tch - Channel Temperature - °C 10 4 FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT 4 -75 3 VGS - Gate to Source Voltage - V GATE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE 3.5 2 8 6 4 ID = 30 A Pulsed 2 0 0 5 10 15 VGS - Gate to Source Voltage - V Data Sheet D16740EJ2V0DS 20 DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE 20 100000 15 VGS = 4.5 V 10 V 5 ID = 30 A Pulsed 10000 1000 -25 25 75 125 10 0.01 175 0.1 1 10 100 VDS - Drain to Source Voltage - V SWITCHING CHARACTERISTICS DYNAMIC INPUT/OUTPUT CHARACTERISTICS 1000 12 60 VDS - Drain to Source Voltage - V td(on), tr, td(off), tf - Switching Time - ns Crss VGS = 0 V f = 1 MHz Tch - Channel Temperature - °C td(off) 100 tf td(on) tr 10 ID = 60 A 10 50 VDD = 48 V 30 V 12 V 40 8 6 30 VGS 4 20 10 2 VDS 0 1 0.1 1 10 0 100 20 40 60 80 0 100 QG - Gate Charge - nC ID - Drain Current - A SOURCE TO DRAIN DIODE FORWARD VOLTAGE REVERSE RECOVERY TIME vs. DIODE FORWARD CURRENT 1000 trr - Reverse Recovery Time - ns 1000 IF - Diode Forward Current - A Coss 100 0 -75 Ciss VGS - Gate to Source Voltage - V 10 Ciss, Coss, Crss - Capacitance - pF RDS(on) - Drain to Source On-state Resistance - mΩ 2SK3814 100 VGS = 10 V 10 0V 1 0.1 100 10 di/dt = 100 A/μs VGS = 0 Pulsed 1 0.01 0 0.5 1 1.5 0.1 1 10 100 IF - Diode Forward Current - A VF(S-D) - Source to Drain Voltage - V Data Sheet D16740EJ2V0DS 5 2SK3814 SINGLE AVALANCHE CURRENT vs. INDUCTIVE LOAD SINGLE AVALANCHE ENERGY DERATING FACTOR 100 IAS = 32 A EAS = 102 mJ 10 VDD = 30 V RG = 25 Ω VGS = 20 → 0 V Starting Tch = 25°C 1 1μ Energy Derating Factor - % IAS - Single Avalanche Current - A 100 80 60 40 20 0 10 μ 100 μ 1m 10 m 25 50 75 100 125 150 Starting Tch - Starting Channel Temperature - °C L - Inductive Load - H 6 VDD = 30 V RG = 25 Ω VGS = 20 → 0 V IAS ≤ 32 A Data Sheet D16740EJ2V0DS 2SK3814 PACKAGE DRAWINGS (Unit: mm) 1) TO-251 (MP-3) 2) TO-252 (MP-3Z) 1.1±0.2 4 5.5 ±0.2 3 13.7 MIN. 2 7.0 MIN. 1 5.5±0.2 1.6±0.2 4 1 2 3 +0.2 Note 2.3 ±0.2 0.5 ±0.1 Note 1.0 ±0.5 0.4 MIN. 0.5 TYP. 2.5 ±0.5 4.4 ±0.2 1.5 −0.1 5.0 ±0.2 0.5±0.1 5.6 ±0.3 +0.2 6.5 ±0.2 9.5 ±0.5 5.0±0.2 2.3±0.2 1.5-0.1 6.5±0.2 0.5 ±0.1 0.5 ±0.1 2.3 ±0.3 +0.2 0.5-0.1 +0.2 0.5-0.1 0.75 2.3 2.3 2.3 ±0.3 0.15 ±0.15 1. Gate 2. Drain 3. Source 4. Fin (Drain) 1.Gate 2.Drain 3.Source 4.Fin (Drain) Note The depth of notch at the top of the fin is from 0 to 0.2 mm. EQUIVALENT CIRCUIT Drain Body Diode Gate Source Remark Strong electric field, when exposed to this device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Data Sheet D16740EJ2V0DS 7 2SK3814 • The information in this document is current as of August, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1