HD74LS240FPEL

HD74LS240 Octal Buffers / Line Drivers / Line Receivers (inverted three-state outputs) REJ03D0459–0200 Rev.2.00 Feb.18.2005 Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS240P DILP-20 pin PRDP0020AC-B (DP-20NEV) P — HD74LS240FPEL SOP-20 pin (JEITA) PRSP0020DD-B (FP-20DAV) FP EL (2,000 pcs/reel) HD74LS240RPEL SOP-20 pin (JEDEC) PRSP0020DC-A (FP-20DBV) RP EL (1,000 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement 1G 1 20 VCC 1A1 2 19 2G 2Y4 3 18 1Y1 1A2 4 17 2A4 2Y3 5 16 1Y2 1A3 6 15 2A3 2Y2 7 14 1Y3 1A4 8 13 2A2 2Y1 9 12 1Y4 GND 10 11 2A1 (Top view) Rev.2.00, Feb.18.2005, page 1 of 5 HD74LS240 Function Table Inputs G H L L Output Y Z L H A X H L Note: H; high level, L; low level, X; irrelevant, Z; off (high-impedance) state of a 3-state output Block Diagram (1/2) A1 Y1 A2 Y2 A3 Y3 A4 Y4 G Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage VCC 7 V Input voltage VIN 7 V Power dissipation PT 400 mW Tstg –65 to +150 °C Storage temperature Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output current Operating temperature Rev.2.00, Feb.18.2005, page 2 of 5 Symbol Min Typ Max Unit VCC 4.75 5.00 5.25 V IOH — — –15 mA IOL — — 24 mA Topr –20 25 75 °C HD74LS240 Electrical Characteristics (Ta = –20 to +75 °C) Item Input voltage Hysteresis Symbol VIH VIL VT+ – VT– typ.* — — 0.4 — — — — — — — — — max. — 0.8 — — — 0.4 0.5 20 –20 20 –0.2 0.1 Unit V V V II min. 2.0 — 0.2 2.4 2.0 — — — — — — — IOS –40 — –225 mA VCC = 5.25 V — 13 23 — 26 44 mA VCC = 5.25 V VOH Output voltage VOL Off-state output current Input current Short-circuit output current IOZH IOZL IIH IIL Outputs high Supply current** Outputs low ICC All outputs — 29 disabled Input clamp voltage VIK — — Notes: * VCC = 5 V, Ta = 25°C ** ICC is measured with all outputs open. V V µA µA µA mA mA Condition VCC = 4.75 V VIL = 0.8 V, IOH = – 3 mA VCC = 4.75 V, VIH = 2 V VIL = 0.5 V, IOH = – 15 mA IOL = 12 mA VCC = 4.75 V, VIH = 2 V, V IL = 0.8 V IOL = 24 mA VO = 2.7 V VCC = 5.25 V, VIH = 2 V, VIL = 0.8 V VO = 0.4 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V 50 –1.5 V VCC = 4.75 V, IIN = –18 mA Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Propagation delay time Output enable time Output disable time Symbol tPLH tPHL tZL tZH tLZ tHZ min. — — — — — — typ. 9 12 20 15 15 10 max. 14 18 30 23 25 18 Unit Condition ns ns ns ns ns CL = 45 pF, RL = 667 Ω CL = 5 pF, RL = 667 Ω Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)". Rev.2.00, Feb.18.2005, page 3 of 5 HD74LS240 Package Dimensions JEITA Package Code P-DIP20-6.3x24.5-2.54 RENESAS Code PRDP0020AC-B Previous Code DP-20NEV MASS[Typ.] 1.26g D 11 E 20 1 10 b3 0.89 Z Dimension in Millimeters Min Nom Max A Reference Symbol A1 e D 24.50 E 6.30 L θ c e1 A1 0.51 b p 0.40 b 3 JEITA Package Code P-SOP20-5.5x12.6-1.27 RENESAS Code PRSP0020DD-B *1 Previous Code FP-20DAV 0.48 0.56 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 1.27 L 2.54 MASS[Typ.] 0.31g D NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 20 7.00 1.30 Z ( Ni/Pd/Au plating ) 25.40 5.08 A bp e 7.62 1 11 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Z e *3 bp Nom Max D 12.60 13.0 E 5.50 A2 10 1 A1 x Dimension in Millimeters Min M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 2.20 A L1 bp b1 c A c 1 θ 0° HE A1 θ y L Detail F e 8° 1.27 x 0.12 y 0.15 0.80 Z 0.50 L L Rev.2.00, Feb.18.2005, page 4 of 5 7.50 1 0.70 1.15 0.90 HD74LS240 JEITA Package Code P-SOP20-7.5x12.8-1.27 RENESAS Code PRSP0020DC-A *1 Previous Code FP-20DBV MASS[Typ.] 0.52g D F 20 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" @ DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT @ INCLUDE TRIM OFFSET. 11 HE c *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 12.80 13.2 E 7.50 A2 10 1 Z e *3 bp x A1 M 0.10 0.20 0.30 0.34 0.40 0.46 0.20 0.25 0.30 10.40 10.65 A L1 2.65 bp b1 c A c A1 θ L y 1 θ 0° HE 10.00 8° 1.27 e x 0.12 y 0.15 0.935 Z Detail F L L Rev.2.00, Feb.18.2005, page 5 of 5 0.40 1 0.70 1.45 1.27 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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