0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
HD74LS245P

HD74LS245P

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    DIP20

  • 描述:

    HD74LS245P

  • 数据手册
  • 价格&库存
HD74LS245P 数据手册
To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: 8. 9. 10. 11. 12. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. HD74LS245 Octal Bus Transceivers (with three-state outputs) REJ03D0464–0300 Rev.3.00 Jul.15.2005 This octal bus transceiver is designed for synchronous two-way communication between data buses. The control function implementation minimizes external timing requirements. The device allows data transmission from the A bus to the B bus or from the B bus to the A bus depending upon the logic level at the direction control (DIR) input. The enable input (G) can be used to disable the device so that the buses are effectively isolated. Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS245P DILP-20 pin PRDP0020AC-B (DP-20NEV) P — HD74LS245FPEL SOP-20 pin (JEITA) PRSP0020DD-B (FP-20DAV) FP EL (2,000 pcs/reel) HD74LS245RPEL SOP-20 pin (JEDEC) PRSP0020DC-A (FP-20DBV) RP EL (1,000 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement DIR 1 20 VCC A1 2 19 Enable G A2 3 18 B1 A3 4 17 B2 A4 5 16 B3 A5 6 15 B4 A6 7 14 B5 A7 8 13 B6 A8 9 12 B7 GND 10 11 B8 (Top view) Rev.3.00, Jul.15.2005, page 1 of 5 HD74LS245 Function Table Enable G L L H Direction Control DIR L H X Operation B data to A bus A data to B bus Isolation Note: H; high level, L; low level, X; irrelevant Block Diagram Enable G Transceiver (1/8) B A Direction Control DIR Absolute Maximum Ratings Item Symbol Supply voltage Ratings Unit VCC 7 V DIR, G VIN 7 V A, B VIN 5.5 V PT 400 mW Storage temperature Tstg –65 to +150 °C Operating temperature Topr –20 to +75 °C Input voltage Power dissipation Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output current Operating temperature Rev.3.00, Jul.15.2005, page 2 of 5 Symbol Min Typ Max Unit VCC 4.75 5.00 5.25 V IOH — — –15 mA IOL — — 24 mA Topr –20 25 75 °C HD74LS245 Electrical Characteristics (Ta = –20 to +75 °C) Item Input voltage Hysteresis Symbol VIH VIL VT+ – VT– min. 2.0 — 0.2 2.4 2 — — — — — — — — typ.* — — 0.4 — — — — — — — — — — max. — 0.8 — — — 0.4 0.5 20 –200 20 –0.2 0.1 0.1 Unit IOS –40 — –225 mA VCC = 5.25 V ICCH ICCL — — 48 62 70 90 mA VCC = 5.25 V VOH Output voltage VOL Off-state output current Input current A or B DIR or G Short-circuit output current Supply current** IOZH IOZL IIH IIL II Condition V V V V µA µA mA mA VCC = 4.75 V IOH = – 3 mA VCC = 4.75 V, VIH = 2 V, IOH = – 15 mA VIL = 0.8 V IOL = 12 mA VCC = 4.75 V, VIH = 2 V, V IL = 0.8 V IOL = 24 mA VO = 2.7 V VCC = 5.25 V, G = 2 V VO = 0.4 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 5.5 V VCC = 5.25 V, VI = 7 V — 64 95 ICCZ Input clamp voltage VIK — — –1.5 V VCC = 4.75 V, IIN = –18 mA Notes: * VCC = 5 V, Ta = 25°C ** With all outputs open, ICC is measured with transceivers enabled in one direction only, or with all transceivers disabled. Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Propagation delay time Output enable time Output disable time Symbol tPLH tPHL tZL tZH tLZ tHZ min. — — — — — — typ. 8 11 27 25 15 15 max. 15 15 40 40 25 25 Unit Condition CL = 45 pF, RL = 667 Ω ns CL = 5 pF, RL = 667 Ω Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)". Rev.3.00, Jul.15.2005, page 3 of 5 HD74LS245 Package Dimensions JEITA Package Code P-DIP20-6.3x24.5-2.54 RENESAS Code PRDP0020AC-B MASS[Typ.] 1.26g Previous Code DP-20NEV D 11 E 20 1 10 b3 0.89 Z Dimension in Millimeters Min Nom Max A Reference Symbol A1 e D 24.50 E 6.30 L A θ bp e 7.62 1 c e1 JEITA Package Code P-SOP20-5.5x12.6-1.27 RENESAS Code PRSP0020DD-B *1 Previous Code FP-20DAV A1 0.51 b p 0.40 b 3 0.48 0.56 1.30 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 1.27 L 2.54 MASS[Typ.] 0.31g D NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 20 7.00 5.08 Z ( Ni/Pd/Au plating ) 25.40 11 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Z e *3 bp Nom Max D 12.60 13.0 E 5.50 A2 10 1 A1 x Dimension in Millimeters Min M 0.00 0.10 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 0.20 2.20 bp b1 c A c 1 θ 0° HE A1 θ y L Detail F e 8° 1.27 x 0.12 y 0.15 0.80 Z L L Rev.3.00, Jul.15.2005, page 4 of 5 7.50 0.50 1 0.70 1.15 0.90 HD74LS245 JEITA Package Code P-SOP20-7.5x12.8-1.27 RENESAS Code PRSP0020DC-A *1 Previous Code FP-20DBV MASS[Typ.] 0.52g D F 20 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" @ DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT @ INCLUDE TRIM OFFSET. 11 HE c *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 12.80 13.2 E 7.50 A2 1 Z 10 e *3 bp x A1 M 0.10 0.20 0.34 0.40 0.46 0.20 0.25 0.30 10.40 10.65 A L1 0.30 2.65 bp b1 c A c A1 θ L y 1 θ 0° HE 10.00 e 8° 1.27 x 0.12 y 0.15 0.935 Z Detail F L L Rev.3.00, Jul.15.2005, page 5 of 5 0.40 1 0.70 1.45 1.27 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: (408) 382-7500, Fax: (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: (1628) 585-100, Fax: (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: 2265-6688, Fax: 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: (2) 2715-2888, Fax: (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: (21) 6472-1001, Fax: (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: 6213-0200, Fax: 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: 2-796-3115, Fax: 2-796-2145 Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: 7955-9390, Fax: 7955-9510 © 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .3.0
HD74LS245P 价格&库存

很抱歉,暂时无法提供与“HD74LS245P”相匹配的价格&库存,您可以联系我们找货

免费人工找货