DATASHEET
ICS557-01
PCI-EXPRESS CLOCK SOURCE
Description
Features
The ICS557-01 is a clock chip designed for use in
PCI-Express Cards as a clock source. It provides a pair of
differential outputs at 100 MHz in a small 8-pin SOIC
package.
• Supports PCI-ExpressTM HCSL Outputs
•
•
•
Using IDT’ patented Phase-Locked Loop (PLL) techniques,
the device takes a 25 MHz crystal input and produces
HCSL (Host Clock Signal Level) differential outputs at 100
MHz clock frequency. LVDS signal levels can also be
supported via an alternative termination scheme.
•
•
•
•
•
•
0.7 V current mode differential pair
Supports LVDS Output Levels
Packaged in 8-pin SOIC
Available in RoHS 5 (green ) or RoHS 6 (green and lead
free) compliant packaging
Operating voltage of 3.3 V
Low power consumption
Input frequency of 25 MHz
Short term jitter 100 ps (peak-to-peak)
Output Enable via pin selection
Industrial temperature range available
NOTE: EOL for non-green parts to occur on 5/13/10
per PDN U-09-01
Block Diagram
VDD
CLK
Phase Lock
Loop
X1
25 MHz
crystal /clock
X2
Clock
Buffer/
Crystal
Oscillator
Crystal Tuning Capacitors
GND
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
CLK
1
OE
RR(IREF)
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Pin Assignment
OE
1
8
V DD
X1
2
7
CL K
X2
3
6
CL K
GN D
4
5
I RE F
8 P i n ( 1 5 0 mi l ) S OI C
Pin Descriptions
Pin
Number
Pin
Name
Pin
Type
1
OE
Input
Output Enable signal
(H = outputs are enabled, L = outputs are disabled/tristated).
Internal pull-up resistor.
2
X1
Input
Crystal or clock input. Connect to a 25 MHz crystal or single ended clock.
3
X2
XO
4
GND
Power
5
IREF
Output A 475Ω precision resistor connected between this pin and ground
establishes the external reference current.
6
CLK
Output HCSL differential complementary clock output.
7
CLK
Output HCSL differential clock output.
8
VDD
Power
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
Pin Description
Crystal Connection. Connect to a parallel mode crystal.
Leave floating if clock input.
Connect to ground.
Connect to +3.3 V.
2
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Applications Information
Output Structures
External Components
A minimum number of external components are required for
proper operation.
IREF
=2.3 mA
6*IREF
Decoupling Capacitors
Decoupling capacitors of 0.01 µF should be connected
between VDD and the ground plane (pin 4) as close to the
VDD pin as possible. Do not share ground vias between
components. Route power from power source through the
capacitor pad and then into IDT pin.
Crystal
See Output Termination
R R 475W Sections - Pages 3 ~ 5
A 25 MHz fundamental mode parallel resonant crystal with
CL = 16 pF should be used. This crystal must have less than
300 ppm of error across temperature in order for the
ICS557-01 to meet PCI Express specifications.
Crystal Capacitors
General PCB Layout Recommendations
Crystal capacitors are connected from pins X1 to ground
and X2 to ground to optimize the accuracy of the output
frequency.
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
1. Each 0.01µF decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible.
CL= Crystal’s load capacitance in pF
Crystal Capacitors (pF) = (CL- 8) * 2
2. No vias should be used between decoupling capacitor
and VDD pin.
For example, for a crystal with a 16 pF load cap, each
external crystal cap would be 16 pF. (16-8)*2=16.
3. The PCB trace to VDD pin should be kept as short as
possible, as should the PCB trace to the ground via.
Distance of the ferrite bead and bulk decoupling from the
device is less critical.
Current Source (Iref) Reference Resistor - RR
If board target trace impedance (Z) is 50Ω, then RR = 475Ω
(1%), providing IREF of 2.32 mA. The output current (IOH) is
equal to 6*IREF.
4. An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers (any ferrite beads and bulk decoupling capacitors can
be mounted on the back). Other signal traces should be
routed away from the ICS557-01.This includes signal traces
just underneath the device, or on layers adjacent to the
ground plane layer used by the device.
Output Termination
The PCI-Express differential clock outputs of the ICS557-01
are open source drivers and require an external series
resistor and a resistor to ground. These resistor values and
their allowable locations are shown in detail in the
PCI-Express Layout Guidelines section.
The ICS557-01can also be configured for LVDS compatible
voltage levels. See the LVDS Compatible Layout Guidelines
section
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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PCI-Express Layout Guidelines
Common Recommendations for Differential Routing
L1 length, Route as non-coupled 50 ohm trace.
L2 length, Route as non-coupled 50 ohm trace.
L3 length, Route as non-coupled 50 ohm trace.
RS
RT
Dimension or Value
0.5 max
0.2 max
0.2 max
33
49.9
Unit
inch
inch
inch
ohm
ohm
Figure
1,2
1,2
1,2
1,2
1,2
Notes
Differential Routing on a Single PCB
L4 length, Route as coupled microstrip 100 ohm differential trace.
L4 length, Route as coupled stripline 100 ohm differential trace.
Dimension or Value
2 min to 16 max
1.8 min to 14.4 max
Unit
inch
inch
Figure
1
1
Notes
Differential Routing to a PCI Express Connector
L4 length, Route as coupled microstrip 100 ohm differential trace.
L4 length, Route as coupled stripline 100 ohm differential trace.
Dimension or Value
0.25 to 14 max
0.225 min to 12.6 max
Unit
inch
inch
Figure
2
2
Notes
Figure 1: PCI-Express Device Routing
L1
L2
L4
RS
L1’
L4’
L2’
RS
RT
ICS557-01
Output
Clock
L3’
RT
L3
PCI-Express
Load or
Connector
Typical PCI-Express (HCSL) Waveform
700 mV
0
tOR
500 ps
500 ps
0.52 V
0.175 V
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
tOF
0.52 V
0.175 V
4
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LVDS Compatible Layout Guidelines
LVDS Recommendations for Differential Routing
L1 length, Route as non-coupled 50 ohm trace.
L2 length, Route as non-coupled 50 ohm trace.
RP
RQ
RT
L3 length, Route as coupled 50 ohm differential trace.
L3 length, Route as coupled 50 ohm differential trace.
Dimension or Value
0.5 max
0.2 max
100
100
150
Unit
inch
inch
ohm
ohm
ohm
Figure 3: LVDS Device Routing
L1
L3
RQ
L3’
L1’
RT
RT
ICS557-01
Clock
Output
RP
L2’
L2
LVDS
Device
Load
Typical LVDS Waveform
1325 mV
1000 mV
tOR
500 ps
500 ps
1250 mV
1150 mV
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
tOF
1250 mV
1150 mV
5
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Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS557-01. These ratings are stress
ratings only. Functional operation of the device at these or any other conditions above those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for
extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended
operating temperature range.
Item
Rating
Supply Voltage, VDD, VDDA
5.5 V
All Inputs and Outputs
-0.5 V to VDD+0.5 V
Ambient Operating Temperature (commercial)
0 to +70° C
Ambient Operating Temperature (industrial)
-40 to +85° C
Storage Temperature
-65 to +150° C
Junction Temperature
125° C
Soldering Temperature
260° C
ESD Protection (Input)
2000 V min. (HBM)
DC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C
Parameter
Symbo
l
Supply Voltage
Input High Voltage1
Input Low Voltage
1
2
Input Leakage Current
Operating Supply Current
Output Capacitance
Min.
Typ.
Max.
Units
V
3.135
3.465
VIH
2.0
VDD +0.3
V
VIL
VSS-0.3
0.8
V
-5
5
µA
IIL
0 < Vin < VDD
IDD
With 50Ω and 2 pF load
55
mA
OE =Low
35
mA
Input pin capacitance
7
pF
Output pin capacitance
6
pF
5
nH
IDDOE
Input Capacitance
Conditions
CIN
COUT
Pin Inductance
LPIN
Output Resistance
Rout
CLK outputs
Pull-up Resistor
RPUP
OE
3.0
kΩ
60
kΩ
1 Single edge is monotonic when transitioning through region.
2 Inputs with pull-ups/-downs are not included.
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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AC Electrical Characteristics - CLK/CLK
Unless stated otherwise, VDD=3.3 V ±5%, Ambient Temperature -40 to +85° C
Parameter
Symbo
l
Conditions
Min.
Input Frequency
Output Frequency
Typ.
Max.
Units
25
MHz
100
MHz
1,2
VOH
660
700
850
mV
Output Low Voltage1,2
VOL
-150
0
27
mV
250
350
550
mV
140
mV
Output High Voltage
Crossing Point
Voltage1,2
Absolute
Crossing Point
Voltage1,2,4
Variation over all edges
Jitter, Cycle-to-Cycle1,3
Rise Time1,2
Fall Time
1,2
80
ps
tOR
From 0.175 V to 0.525 V
175
332
700
ps
tOF
From 0.525 V to 0.175 V
175
344
700
ps
125
ps
Rise/Fall Time
Variation1,2
Duty Cycle1,3
45
55
%
Output Enable Time5
All outputs
30
µs
Output Disable Time5
All outputs
30
µs
From power-up VDD=3.3 V
3.0
ms
3.0
ms
Stabilization Time
tSTABLE
Spread Change Time
tSPREAD Settling period after spread change
1
Test setup is RL=50 ohms with 2 pF, RR = 475Ω (1%).
2
Measurement taken from a single-ended waveform.
3
Measurement taken from a differential waveform.
4
Measured at the crossing point where instantaneous voltages of both CLKOUT and CLKOUT are equal.
5 CLKOUT
pins are tri-stated when OE is low asserted. CLKOUT is driven differential when OE is high.
Thermal Characteristics (8-pin SOIC)
Parameter
Thermal Resistance Junction to
Ambient
Symbol
θJA
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
Still air
θJA
θJA
Thermal Resistance Junction to Case
Conditions
1 m/s air flow
3 m/s air flow
θJC
7
Min.
Typ.
Max. Units
150
° C/W
140
° C/W
120
° C/W
40
° C/W
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Marking Diagram (ICS557M-01)
8
Marking Diagram (ICS557MI-01)
8
5
5
557MI01
######
YYWW
557M-01
######
YYWW
1
1
4
Marking Diagram (ICS557M-01LF)
8
4
Marking Diagram (ICS557MI-01LF)
5
8
557M-01L
######
YYWW
1
5
557MI01L
######
YYWW
4
1
4
Notes:
1. ###### is the lot code.
2. YYWW is the last two digits of the year, and the week number that the part was assembled.
3. “L” designates Pb (lead) free packaging.
4. Bottom marking: (orgin). Origin = country of origin if not USA.
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
8
E
H
INDEX
AREA
Symbol
Min
Max
Min
Max
A
1.35
1.75
.0532
.0688
A1
0.10
0.25
.0040
.0098
B
0.33
0.51
.013
.020
C
0.19
0.25
.0075
.0098
D
4.80
5.00
.1890
.1968
E
3.80
4.00
.1497
.1574
e
1 2
D
Inches*
1.27 BASIC
0.050 BASIC
H
5.80
6.20
.2284
.2440
h
0.25
0.50
.010
.020
L
0.40
1.27
.016
.050
a
0°
8°
0°
8°
*For reference only. Controlling dimensions in mm.
A
h x 45
A1
C
-Ce
B
SEATING
PLANE
L
.10 (.004)
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
C
9
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Ordering Information
Part / Order Number
Marking
557M-01*
See Page 8
Shipping Packaging
Package
Temperature
Tubes
8-pin SOIC
0 to +70° C
557M-01T*
Tape and Reel
8-pin SOIC
0 to +70° C
557M-01LF
Tubes
8-pin SOIC
0 to +70° C
557M-01LFT
Tape and Reel
8-pin SOIC
0 to +70° C
557MI-01*
Tubes
8-pin SOIC
-40 to +85° C
557MI-01T*
Tape and Reel
8-pin SOIC
-40 to +85° C
557MI-01LF
Tubes
8-pin SOIC
-40 to +85° C
557MI-01LFT
Tape and Reel
8-pin SOIC
-40 to +85° C
*NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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