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ISL43L120IR

ISL43L120IR

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    WDFN8

  • 描述:

    IC SWITCH DUAL SPST 8TDFN

  • 数据手册
  • 价格&库存
ISL43L120IR 数据手册
ISL43L120, ISL43L121, ISL43L122 ® Data Sheet June 23, 2006 Ultra Low ON-Resistance, Single Supply, Dual SPST Analog Switches The Intersil ISL43L120, ISL43L121, ISL43L122 devices are low ON-resistance, low voltage, bidirectional, precision, dual single-pole/single-throw (SPST) analog switches designed to operate from a single +1.65V to +3.6V supply. Targeted applications include battery powered equipment that benefit from low RON (0.16Ω), low power consumption (0.12µW) and fast switching speeds (tON = 13ns, tOFF = 13ns). Cell phones, for example, often face ASIC functionality limitations. The number of analog input or GPIO pins may be limited and digital geometries are not well suited to analog switch performance. This family of parts may be used to switch in additional functionality while reducing ASIC design risk. The ISL43L12X are offered in an 8 Ld MSOP package, alleviating board space limitations. The ISL43L120, ISL43L121, ISL43L122 are dual singlepole/single-throw (SPST) devices. The ISL43L120 has two normally open (NO) switches; the ISL43L121 has two normally closed (NC) switches; the ISL43L122 has one normally open (NO) and one normally closed (NC) switch and can be used as an SPDT. Table 1 summarizes the performance of this family. TABLE 1. FEATURES AT A GLANCE ISL43L120 ISL43L121 ISL43L122 NUMBER OF SWITCHES 2 2 2 SW 1/SW 2 NO/NO NC/NC NO/NC 1.8V RON 0.26Ω 0.26Ω 0.26Ω 1.8V tON/tOFF 30ns/25ns 30ns/25ns 30ns/25ns 3V RON 0.16Ω 0.16Ω 0.16Ω 3V tON/tOFF 13ns/13ns 13ns/13ns 13ns/13ns PACKAGES FN6091.2 Features • Low ON Resistance (RON) - V+ = 3.0V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.16Ω - V+ = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.26Ω • RON Matching Between Channels . . . . . . . . . . . . 0.005Ω • RON Flatness Over Signal Range . . . . . . . . . . . . . . 0.008Ω • Single Supply Operation. . . . . . . . . . . . . . . . +1.65V to +3.6V • Low Power Consumption (PD) . . . . . . . . . . . . . . . . . 8kV • 1.8V Logic Compatible (+3V Supply) • Available in 8-Ld thin DFN and 8-Ld MSOP Packages • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Battery Powered, Handheld, and Portable Equipment - Cellular/Mobile Phones - Pagers - Laptops, Notebooks, Palmtops • Portable Test and Measurement • Medical Equipment • Audio and Video Switching 8Ld 3x3 TDFN, 8Ld MSOP Related Literature Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)”. Application Note AN557 “Recommended Test Procedures for Analog Switches”. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2004, 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL43L120, ISL43L121, ISL43L122 Pinouts (Note 1) ISL43L120 (MSOP, TDFN) TOP VIEW V+ ISL43L122 (MSOP, TDFN) TOP VIEW 8 COM1 1 NO1 2 8 COM1 IN2 NO1 2 IN1 3 7 IN 2 6 COM2 NC1 2 6 COM2 5 GND NC2 4 5 GND NO2 4 V+ 1 7 IN1 3 V+ ISL43L121 (MSOP, TDFN) TOP VIEW NC2 4 8 COM1 1 7 IN1 3 IN2 6 COM2 5 GND NOTE: 1. Switches Shown for Logic “0” Input. Ordering Information Truth Table PART MARKING TEMP. RANGE (°C) ISL43L120IU L120 -40 to 85 8 Ld MSOP ISL43L120IR L10 -40 to 85 8 Ld 3x3 TDFN L8.3x3A ISL43L121IU L121 -40 to 85 8 Ld MSOP ISL43L121IR L11 -40 to 85 8 Ld 3x3 TDFN L8.3x3A ISL43L122IU L122 -40 to 85 8 Ld MSOP ISL43L122IR L12 -40 to 85 8 Ld 3x3 TDFN L8.3x3A PIN ISL43L120IUZ L120Z (Note) -40 to 85 8 Ld MSOP (Pb-free) V+ ISL43L120IRZ L10Z (Note) -40 to 85 8 Ld 3x3 TDFN L8.3x3A (Pb-free) ISL43L121IUZ L121Z (Note) -40 to 85 8 Ld MSOP (Pb-free) ISL43L121IRZ L11Z (Note) -40 to 85 8 Ld 3x3 TDFN L8.3x3A (Pb-free) ISL43L122IUZ L122Z (Note) -40 to 85 8 Ld MSOP (Pb-free) ISL43L122IRZ L12Z (Note) -40 to 85 8 Ld 3x3 TDFN L8.3x3A (Pb-free) PART NUMBER* PACKAGE PKG. DWG. # M8.118 M8.118 M8.118 M8.118 M8.118 ISL43L120 ISL43L121 LOGIC SW 1, 2 SW 1, 2 SW 1 SW 2 0 OFF ON OFF ON 1 ON OFF ON OFF NOTE: ISL43L122 Logic “0” ≤ 0.5V. Logic “1” ≥ 1.4V with a 3V Supply. Pin Descriptions FUNCTION System Power Supply Input (+1.65V to +3.6V) GND Ground Connection IN Digital Control Input COM Analog Switch Common Pin NO Analog Switch Normally Open Pin NC Analog Switch Normally Closed Pin M8.118 *Add “-T” suffix for tape and reel NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2 FN6091.2 June 23, 2006 ISL43L120, ISL43L121, ISL43L122 Absolute Maximum Ratings Thermal Information V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 4.7V Input Voltages IN (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V) NO, NC (Note 2) . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V) Output Voltages COM (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V) Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . 300mA Peak Current, IN, NO, NC, or COM (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . 500mA ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>8kV Thermal Resistance (Typical, Note 3) θJA (°C/W) 8 Ld 3x3 TDFN Package . . . . . . . . . . . . . . . . . . . . . 110 8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . 190 Maximum Junction Temperature (Plastic Package). . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to 150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C (Lead Tips Only) Operating Conditions Temperature Range ISL43L12XIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 2. Signals on NC, NO, COM, or IN exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings. 3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications - 3V Supply PARAMETER Test Conditions: V+ = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Note 4, 6), Unless Otherwise Specified TEST CONDITIONS TEMP (°C) MIN (NOTE 5) TYP MAX (NOTE 5) UNITS Full 0 - V+ V 25 - 0.17 0.25 Ω Full - - 0.3 Ω 25 - 0.005 0.02 Ω Full - - 0.04 Ω 25 - 0.008 0.06 Ω Full - - 0.07 Ω 25 -3 - 3 nA Full -60 - 60 nA 25 -3 - 3 nA Full -80 - 80 nA 25 - 15 25 ns Full - - 30 ns 25 - 15 25 ns Full - - 30 ns ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG ON Resistance, RON V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V to V+ See Figure 4 RON Matching Between Channels, ∆RON V+ = 2.7V, ICOM = 100mA, VNO or VNC = Voltage at Max RON, Note 8 RON Flatness, RFlat(ON) V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V to V+, Note 9 NO or NC OFF Leakage Current, INO(OFF) or INC(OFF) V+ = 3.3V, VCOM = 0.3, 3V, VNO or VNC = 3V, 0.3V COM ON Leakage Current, ICOM(ON) V+ = 3.3V, VCOM = 0.3V, 3V, or VNO or VNC = 0.3V, 3V DYNAMIC CHARACTERISTICS Turn-ON Time, tON V+ = 2.7V, VNO or VNC = 1.5V, RL = 50Ω, CL = 35pF, VIN = 0 to 2.7V, See Figure 1, Note 7 V+ = 2.7V, VNO or VNC = 1.5V, RL = 50Ω, CL = 35pF, VIN = 0 to 2.7V, See Figure 1, Note 7 Turn-OFF Time, tOFF Charge Injection, Q CL = 1.0nF, VG = 0V, RG = 0Ω, See Figure 2 25 - -125 - pC OFF Isolation RL = 50Ω, CL = 5pF, f = 100kHz, VCOM = 1 VRMS, See Figure 3 25 - 62 - dB Crosstalk (Channel-to-Channel) RL = 50Ω, CL = 5pF, f = 100kHz, VCOM = 1 VRMS, See Figure 5 25 - -94 - dB 25 - 182 - pF NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6 3 FN6091.2 June 23, 2006 ISL43L120, ISL43L121, ISL43L122 Electrical Specifications - 3V Supply PARAMETER Test Conditions: V+ = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Note 4, 6), Unless Otherwise Specified (Continued) TEST CONDITIONS TEMP (°C) MIN (NOTE 5) TYP MAX (NOTE 5) UNITS COM OFF Capacitance, CCOM(OFF) f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6 25 - 182 - pF COM ON Capacitance, CCOM(ON) f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6 25 - 290 - pF Full 1.65 - 3.6 V 25 - - 30 nA Full - - 750 nA Input Voltage Low, VINL Full - - 0.5 V Input Voltage High, VINH Full 1.4 - - V Full -0.5 - 0.5 µA POWER SUPPLY CHARACTERISTICS Power Supply Range Positive Supply Current, I+ V+ = 1.65V to 3.6V, VIN = 0V or V+, all channels on or off DIGITAL INPUT CHARACTERISTICS Input Current, IINH, IINL V+ = 3.3V, VIN = 0V or V+ (Note 7) NOTES: 4. VIN = input voltage to perform proper function. 5. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. 6. Parts are 100% tested at +25°C. Limits across the full temperature range are guaranteed by design and correlation. 7. Guaranteed but not tested. 8. RON matching between channels is calculated by subtracting the channel with the highest max Ron value from the channel with lowest max Ron value. 9. Flatness is defined as the difference between maximum and minimum value of on-resistance over the specified analog signal range. Electrical Specifications - 1.8V Supply PARAMETER Test Conditions: V+ = +1.65V to +2.0V, GND = 0V, VINH = 1.0V, VINL = 0.4V (Note 4, 6), Unless Otherwise Specified TEST CONDITIONS TEMP (°C) MIN (NOTE 5) TYP MAX (NOTE 5) UNITS Full 0 - V+ V 25 - 0.26 0.35 Ω Full - - 0.4 Ω 25 - 0.005 - Ω Full - 0.005 - Ω 25 - 0.074 - Ω Full - 0.082 - Ω 25 -3 - 3 nA Full -60 - 60 nA 25 -3 - 3 nA Full -80 - 80 nA 25 - 30 40 ns Full - - 45 ns 25 - 25 35 ns Full - - 40 ns 25 - -80 - pC ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG ON Resistance, RON V+ = 1.8V, ICOM = 100mA, VNO or VNC = 0V to V+, See Figure 4, Note 7 RON Matching Between Channels, ∆RON V+ = 1.8V, ICOM = 100mA, VNO or VNC = Voltage at Max RON, Note 8 RON Flatness, RFLAT(ON) V+ = 1.8V, ICOM = 100mA, VNO or VNC = 0V to V+, Note 9 NO or NC OFF Leakage Current, INO(OFF) or INC(OFF) V+ = 2.0V, VCOM = 0.3V, 1.8V, VNO or VNC = 1.8V, 0.3V COM ON Leakage Current, ICOM(ON) V+ = 2.0V, VCOM = 0.3V, 1.8V, or VNO or VNC = 0.3V, 1.8V DYNAMIC CHARACTERISTICS Turn-ON Time, tON V+ = 1.65V, VNO or VNC = 1.0V, RL =50Ω, CL = 35pF, VIN = 0 to 1.65V, See Figure 1, Note 7 V+ = 1.65V, VNO or VNC = 1.0V, RL =50Ω, CL = 35pF, VIN = 0 to 1.65V, See Figure 1, Note 7 Turn-OFF Time, tOFF CL = 1.0nF, VG = 0V, RG = 0Ω, See Figure 2 Charge Injection, Q 4 FN6091.2 June 23, 2006 ISL43L120, ISL43L121, ISL43L122 Electrical Specifications - 1.8V Supply Test Conditions: V+ = +1.65V to +2.0V, GND = 0V, VINH = 1.0V, VINL = 0.4V (Note 4, 6), Unless Otherwise Specified (Continued) TEMP (°C) MIN (NOTE 5) TYP 25 - 62 - dB 25 - -94 - dB NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6 25 - 182 - pF COM OFF Capacitance, CCOM(OFF) f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6 25 - 182 - pF COM ON Capacitance, CCOM(ON) f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6 25 - 290 - pF 25 - - 30 nA Full - - 750 nA Input Voltage Low, VINL Full - - 0.4 V Input Voltage High, VINH Full 1.0 - - V Full -0.5 - 0.5 µA PARAMETER TEST CONDITIONS OFF Isolation RL = 50Ω, CL = 5pF, f = 100kHz, VCOM = 1 VRMS, See Figure 3 and Figure 5 Crosstalk (Channel-to-Channel) MAX (NOTE 5) UNITS POWER SUPPLY CHARACTERISTICS Positive Supply Current, I+ V+ = 1.65V to 3.6V, VIN = 0V or V+, all channels on or off DIGITAL INPUT CHARACTERISTICS Input Current, IINH, IINL V+ = 2.0V, VIN = 0V or V+ (Note 7) Test Circuits and Waveforms V+ LOGIC INPUT V+ tr < 5ns tf < 5ns 50% 0V tOFF SWITCH V INPUT NO SWITCH INPUT VOUT VOUT NO or NC COM IN 90% SWITCH OUTPUT C 90% LOGIC INPUT 0V CL 35pF RL 50Ω GND tON Logic input waveform is inverted for switches that have the opposite logic sense. Repeat test for all switches. CL includes fixture and stray capacitance. RL -----------------------------V OUT = V (NO or NC) R + R L ( ON ) FIGURE 1B. TEST CIRCUIT FIGURE 1A. MEASUREMENT POINTS FIGURE 1. SWITCHING TIMES V+ SWITCH OUTPUT VOUT ∆VOUT RG NO or NC C VOUT COM V+ LOGIC INPUT ON ON OFF 0V VG GND IN CL LOGIC INPUT Q = ∆VOUT x CL FIGURE 2A. MEASUREMENT POINTS FIGURE 2B. TEST CIRCUIT FIGURE 2. CHARGE INJECTION 5 FN6091.2 June 23, 2006 ISL43L120, ISL43L121, ISL43L122 Test Circuits and Waveforms (Continued) V+ V+ C C RON = V1/100mA SIGNAL GENERATOR NO or NC NO or NC VNX INX 1mA 0V or V+ 0V or V+ COM COM ANALYZER IN V1 GND GND RL FIGURE 3. OFF ISOLATION TEST CIRCUIT FIGURE 4. RON TEST CIRCUIT V+ C V+ C SIGNAL GENERATOR NO1 or NC1 COM1 50Ω NO or NC IN1 0V or V+ COM2 ANALYZER INX IN2 0V or V+ NO2 or NC2 GND RL 0V or V+ IMPEDANCE ANALYZER NC FIGURE 5. CROSSTALK TEST CIRCUIT COM GND FIGURE 6. CAPACITANCE TEST CIRCUIT Detailed Description Supply Sequencing and Overvoltage Protection The ISL43L12X family of devices are bidirectional, single pole/single throw (SPST) analog switches that offer precise switching capability from a single 1.65V to 3.6V supply with low on-resistance (0.16Ω) and high speed operation (tON = 13ns, tOFF = 13ns). The device is especially well suited for portable battery powered equipment due to its low operating supply voltage (1.65V), low power consumption (2.7µW max), low leakage currents (80nA max), and the tiny TDFN and MSOP packaging. The ultra low on-resistance and RON flatness provide very low insertion loss and distortion to application that require signal reproduction. With any CMOS device, proper power supply sequencing is required to protect the device from excessive input currents which might permanently damage the IC. All I/O pins contain ESD protection diodes from the pin to V+ and to GND (see Figure 7). To prevent forward biasing these diodes, V+ must be applied before any input signals, and the input signal voltages must remain between V+ and GND. If these conditions cannot be guaranteed, then one of the following two protection methods should be employed. 6 Logic inputs can easily be protected by adding a 1kΩ resistor in series with the input (see Figure 7). The resistor limits the input current below the threshold that produces permanent damage, and the sub-microamp input current produces an insignificant voltage drop during normal operation. FN6091.2 June 23, 2006 ISL43L120, ISL43L121, ISL43L122 This method is not acceptable for the signal path inputs. Adding a series resistor to the switch input defeats the purpose of using a low RON switch, so two small signal diodes can be added in series with the supply pins to provide overvoltage protection for all pins (see Figure 7). These additional diodes limit the analog signal from 1V below V+ to 1V above GND. The low leakage current performance is unaffected by this approach, but the switch signal range is reduced and the resistance may increase, especially at low supply voltages. Logic-Level Thresholds This switch family is 1.8V CMOS compatible (0.5V and 1.4V) over a supply range of 2V to 3.6V (see Figure 14). At 3.6V the VIH level is about 1.27V. This is still below the 1.8V CMOS guaranteed high output minimum level of 1.4V, but noise margin is reduced. The digital input stages draw supply current whenever the digital input voltage is not at one of the supply rails. Driving the digital input signals from GND to V+ with a fast transition time minimizes power dissipation. High-Frequency Performance OPTIONAL PROTECTION DIODE V+ OPTIONAL PROTECTION RESISTOR INX VNO or NC VCOM GND OPTIONAL PROTECTION DIODE FIGURE 7. OVERVOLTAGE PROTECTION Power-Supply Considerations The ISL43L12x construction is typical of most single supply CMOS analog switches, in that they have two supply pins: V+ and GND. V+ and GND drive the internal CMOS switches and set their analog voltage limits. Unlike switches with a 4V maximum supply voltage, the ISL43L12X 4.7V maximum supply voltage provides plenty of room for the 10% tolerance of 3.6V supplies, as well as room for overshoot and noise spikes. The minimum recommended supply voltage is 1.65V but the part will operate with a supply below 1.5V. It is important to note that the input signal range, switching times, and onresistance degrade at lower supply voltages. Refer to the electrical specification tables and Typical Performance curves for details. V+ and GND also power the internal logic and level shifters. The level shifters convert the input logic levels to switched V+ and GND signals to drive the analog switch gate terminals. In 50Ω systems, signal response is reasonably flat even past 20MHz with a -3dB bandwidth of 175MHz (see Figure 15). The frequency response is very consistent over a wide V+ range, and for varying analog signal levels. An OFF switch acts like a capacitor and passes higher frequencies with less attenuation, resulting in signal feedthrough from a switch’s input to its output. Off Isolation is the resistance to this feedthrough, while Crosstalk indicates the amount of feedthrough from one switch to another. Figure 16 details the high Off Isolation and Crosstalk rejection provided by this family. At 100kHz, Off Isolation is about 62dB in 50Ω systems, decreasing approximately 20dB per decade as frequency increases. Higher load impedances decrease Off Isolation and Crosstalk rejection due to the voltage divider action of the switch OFF impedance and the load impedance. Leakage Considerations Reverse ESD protection diodes are internally connected between each analog-signal pin and both V+ and GND. One of these diodes conducts if any analog signal exceeds V+ or GND. Virtually all the analog leakage current comes from the ESD diodes to V+ or GND. Although the ESD diodes on a given signal pin are identical and therefore fairly well balanced, they are reverse biased differently. Each is biased by either V+ or GND and the analog signal. This means their leakages will vary as the signal varies. The difference in the two diode leakages to the V+ and GND pins constitutes the analogsignal-path leakage current. All analog leakage current flows between each pin and one of the supply terminals, not to the other switch terminal. This is why both sides of a given switch can show leakage currents of the same or opposite polarity. There is no connection between the analog signal paths and V+ or GND. This family of switches cannot be operated with bipolar supplies, because the input switching point becomes negative in this configuration. 7 FN6091.2 June 23, 2006 ISL43L120, ISL43L121, ISL43L122 Typical Performance Curves TA = 25°C, Unless Otherwise Specified 0.26 0.19 V+ = 3V ICOM = 100mA ICOM = 100mA 0.18 0.24 V+ = 1.8V 0.17 0.22 85°C RON (Ω) RON (Ω) 0.16 0.2 0.18 0.15 25°C 0.14 0.16 V+ = 2.7V 0.13 V+ = 3V 0.14 0.12 -40°C V+ = 3.6V 0.11 0.12 0 1 2 3 0 4 0.5 1 1.5 2 2.5 3 VCOM (V) VCOM (V) FIGURE 9. ON RESISTANCE vs SWITCH VOLTAGE FIGURE 8. ON RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE 50 0.3 V+ = 1.8V ICOM = 100mA 0 V+ = 3V 85°C 0.25 Q (pC) RON (Ω) -50 0.2 V+ = 1.8V -150 25°C -40°C -100 0.15 -200 -250 0.1 0 0.5 1 1.5 0 2 0.5 1 1.5 2 2.5 3 VCOM (V) VCOM (V) FIGURE 10. ON RESISTANCE vs SWITCH VOLTAGE FIGURE 11. CHARGE INJECTION vs SWITCH VOLTAGE 80 50 70 40 60 85°C 40 85°C tOFF (ns) tON (ns) 50 25°C 30 30 -40°C 25°C 20 -40°C 20 10 10 0 1 1.5 2 2.5 3 V+ (V) 3.5 4 FIGURE 12. TURN - ON TIME vs SUPPLY VOLTAGE 8 4.5 0 1 1.5 2 2.5 3 3.5 4 4.5 V+ (V) FIGURE 13. TURN - OFF TIME vs SUPPLY VOLTAGE FN6091.2 June 23, 2006 ISL43L120, ISL43L121, ISL43L122 Typical Performance Curves TA = 25°C, Unless Otherwise Specified (Continued) NORMALIZED GAIN (dB) 1.8 1.6 V+ = 3V 0 GAIN -20 1.2 VINH 1 PHASE 0 20 VINL 40 0.8 60 0.6 80 0.4 RL = 50Ω VIN = 0.2VP-P to 2VP-P 0.2 1 1.5 2 2.5 3 3.5 4 4.5 V+ (V) 1M FIGURE 14. DIGITAL SWITCHING POINT vs SUPPLY VOLTAGE -10 100 600M FIGURE 15. FREQUENCY RESPONSE 10 V+ = 3V -20 20 Die Characteristics -30 30 SUBSTRATE POTENTIAL (POWERED UP): -40 40 -50 50 -60 60 ISOLATION -70 70 -80 80 GND OFF ISOLATION (dB) CROSSTALK (dB) 10M 100M FREQUENCY (Hz) PHASE (DEGREES) VINH AND VINL (V) 1.4 TRANSISTOR COUNT: 114 PROCESS: Submicron CMOS CROSSTALK -90 90 -100 100 -110 1k 10k 100k 1M 10M 110 100M 500M FREQUENCY (Hz) FIGURE 16. CROSSTALK AND OFF ISOLATION 9 FN6091.2 June 23, 2006 ISL43L120, ISL43L121, ISL43L122 Thin Dual Flat No-Lead Plastic Package (TDFN) L8.3x3A 2X 0.15 C A A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE D MILLIMETERS 2X 0.15 C B E SYMBOL MIN A 0.70 A1 - A3 6 INDEX AREA b TOP VIEW B 0.10 C // C SEATING PLANE SIDE VIEW D2 (DATUM B) 6 INDEX AREA 0.08 C A3 7 - 0.30 0.35 5, 8 2.40 7, 8, 9 1.60 7, 8, 9 - 2.30 - 1.50 - 0.65 BSC - k 0.25 - - - L 0.20 0.30 0.40 8 N 8 Nd 4 2 3 Rev. 3 11/04 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. NX k 4. All dimensions are in millimeters. Angles are in degrees. (DATUM A) E2 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. E2/2 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX L N N-1 NX b e 8 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 5 (Nd-1)Xe REF. 0.10 M C A B BOTTOM VIEW 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Compliant to JEDEC MO-WEEC-2 except for the “L” min dimension. CL NX (b) - 8 D2/2 1 0.80 0.05 3.00 BSC 1.40 e A 0.02 NOTES 3.00 BSC 2.20 E E2 0.75 MAX 0.20 REF 0.25 D D2 NOMINAL (A1) L1 5 10 L e SECTION "C-C" TERMINAL TIP FOR EVEN TERMINAL/SIDE 10 FN6091.2 June 23, 2006 ISL43L120, ISL43L121, ISL43L122 Mini Small Outline Plastic Packages (MSOP) M8.118 (JEDEC MO-187AA) N 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 INCHES E -B- INDEX AREA 0.20 (0.008) 1 2 A B C TOP VIEW 4X θ 0.25 (0.010) R1 R GAUGE PLANE SEATING PLANE -CA 4X θ A2 A1 b -H- 0.10 (0.004) L SEATING PLANE C MIN MAX MIN MAX NOTES A 0.037 0.043 0.94 1.10 - A1 0.002 0.006 0.05 0.15 - A2 0.030 0.037 0.75 0.95 - b 0.010 0.014 0.25 0.36 9 c 0.004 0.008 0.09 0.20 - D 0.116 0.120 2.95 3.05 3 E1 0.116 0.120 2.95 3.05 4 0.026 BSC 0.20 (0.008) C C a SIDE VIEW CL E1 0.20 (0.008) C D - 0.187 0.199 4.75 5.05 - L 0.016 0.028 0.40 0.70 6 0.037 REF N -A- 0.65 BSC E L1 e D SYMBOL e L1 MILLIMETERS 0.95 REF 8 R 0.003 R1 0 α - 8 - 0.07 0.003 - 5o 15o 0o 6o 7 - - 0.07 - - 5o 15o - 0o 6o -B- Rev. 2 01/03 END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (0.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11 FN6091.2 June 23, 2006
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