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DATA SHEET
Freescale Semiconductor
Technical
Data for PowerQUICC
Clock
Generator
MPC9850
Rev 5, 4/2005
MPC9850
III
Clock Generator for PowerQUICC III
The MPC9850 is a PLL based clock generator specifically designed for
Freescale Microprocessor and Microcontroller applications including the
PowerQUICC III. This device generates a microprocessor input clock plus the
500 MHz Rapid I/O clock. The microprocessor clock is selectable in output
frequency to any of the commonly used microprocessor input and bus
frequencies. The Rapid I/O outputs are LVDS compatible. The device offers eight
low skew clock outputs organized into two output banks, each configurable to
support different clock frequencies. The extended temperature range of the
MPC9850 supports telecommunication and networking requirements.
MICROPROCESSOR
CLOCK GENERATOR
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
8 LVCMOS outputs for processor and other circuitry
2 differential LVDS outputs for Rapid I/O interface
Crystal oscillator or external reference input
25 or 33 MHz Input reference frequency
Selectable output frequencies include = 200, 166, 133,125, 111, 100, 83, 66,
50, 33 or 16 MHz
Buffered reference clock output
Rapid I/O (LVDS) Output = 500, 250 or 125 MHz
Low cycle-to-cycle and period jitter
100-lead PBGA package
100-lead Pb-free Package Available
3.3V supply with 3.3V or 2.5V output LVCMOS drive
Supports computing, networking, telecommunications applications
Ambient temperature range –40°C to +85°C
SCALE 2 1
VF SUFFIX
VM SUFFIX (PB-FREE)
100 MAPBGA PACKAGE
CASE 1462-01
Functional Description
The MPC9850 uses either a 25 or 33 MHz reference frequency to generate 8 LVCMOS output clocks, of which, the frequency
is selectable from 16 MHz to 200 MHz. The reference is applied to the input of a PLL and multiplied to 2 GHz. Output dividers,
divide this frequency by 10, 12, 15, 16, 18, 20, 24, 30, 40, 60 or 120 to produce output frequencies of 200, 166, 133, 125, 111,
100, 83 66 50 33 or 16 MHz. The single-ended LVCMOS outputs are divided into two banks of 4 low skew outputs each, for use
in driving a microprocessor or microcontroller clock input as well as other system components. The 2 GHz PLL output frequency
is also divided to produce a 125, 250 or 500 MHz clock output for Rapid I/O applications such as found on the PowerQUICC III
communications processor. The input reference, either crystal or external input is also buffered to a separate output that my be
used as the clock source for a Gigabit Ethernet PHY if desired.
The reference clock may be provided by either an external clock input of 25 MHz or 33 MHz. An internal oscillator requiring a
25 MHz crystal for frequency control may also be used. The external clock source my be applied to either of two clock inputs and
selected via the CLK_SEL control input. Both single ended LVCMOS and differential LVPECL inputs are available. The crystal
oscillator or external clock input is selected via the input pin of REF_SEL. Other than the crystal, no external components are
required for crystal oscillator operation. The REF_33MHz configuration pins is used to select between a 33 and 25 MHz input
frequency.
The MPC9850 is packaged in a 100 lead MAPBGA package to optimize both performance and board density.
IDT™ Clock Generator for PowerQUICC III
MPC9850
© Timing
Freescale
Semiconductor,
Inc.,has
2005.
All acquired
rights reserved.
Freescale
Solutions
Organization
been
by Integrated Device Technology, Inc
1
MPC9850
Clock Generator for PowerQUICC III
CLK
0
PCLK
PCLK
1
NETCOM
1
0
1
REF_CLK_SEL
÷N
Ref
QA0
0
QA1
PLL
2000 MHz
XTAL_IN
QA2
OSC
XTAL_OUT
QA3
REF_SEL
÷N
QB0
PLL_BYPASS
QB1
REF_33MHz
QB2
QB3
÷4, 8, 16, 40
QC0
QC0
CLK_A[0:5]
CLK_B[0:5]
RIO_C[0:1]
QC1
QC1
MR
REF_OUT
Figure 1. MPC9850 Logic Diagram
Table 1. Pin Configurations
Pin
I/O
Type
Function
Supply
Active/State
CLK
Input
LVCMOS
PLL Reference Clock Input (pull-down)
VDD
PCLK, PCLK
Input
LVPECL
PLL Reference Clock Input (PCLK - pull-down, PCLK - pull-up and
pull-down)
VDD
QA0, QA1, QA2, QA3 Output
LVCMOS
Bank A Outputs
VDDOA
QB0, QB1, QB2, QB3 Output
LVCMOS
Bank B Outputs
VDDOB
QC0, QC1, QC0,
QC1
Output
LVDS
Bank C Outputs
VDDOC
REF_OUT
Output
LVCMOS
Reference Output (25 MHz or 33 MHz)
VDD
XTAL_IN
Input
LVCMOS
Crystal Oscillator Input Pin
VDD
XTAL_OUT
Output
LVCMOS
Crystal Oscillator Output Pin
VDD
REF_CLK_SEL
Input
LVCMOS
Select between CLK and PCLK Input (pull-down)
VDD
High
REF_SEL
Input
LVCMOS
Select between External Input and Crystal Oscillator Input (pull-down) VDD
High
REF_33MHz
Input
LVCMOS
Selects 33 MHz Input (pull-down)
VDD
High
MR
Input
LVCMOS
Master Reset (pull-up)
VDD
Low
PLL_BYPASS
Input
LVCMOS
Select PLL or static test mode (pull-down)
VDD
High
(1)
Input
LVCMOS
Configures Bank A clock output frequency (pull-up)
VDD
High
CLK_B[0:5](2)
Input
LVCMOS
Configures Bank B clock output frequency (pull-up)
VDD
High
RIO_C [0:1]
Input
LVCMOS
Configures Bank C clock output frequency (pull-down)
VDD
CLK_A[0:5]
VDD
3.3 V Supply
VDDA
Analog Supply
VDDOA
Supply for Output Bank A
VDDOB
Supply for Output Bank B
VDDOC
Supply for Output Bank C
GND
Ground
1. PowerPC bit ordering (bit 0 = msb, bit 5 = lsb)
2. PowerPC bit ordering (bit 0 = msb, bit 5 = lsb)
PowerPC bit ordering (bit 0 = msb, bit 1 = lsb)
MPC9850
IDT™ Clock
Generator for PowerQUICC III
Freescale Timing Solutions Organization has been acquired by Integrated Device Technology, Inc
2
2
MPC9850
Advanced Clock Drivers Devices
Freescale Semiconductor
MPC9850
Clock Generator for PowerQUICC III
NETCOM
Table 2. Function Table
Control
Default
0
1
REF_CLK_SEL
0
CLK
PCLK
REF_SEL
0
CLK or PCLK
XTAL
PLL_BYPASS
0
Normal
Bypass
REF_33MHz
0
Selects 25 MHz Reference
Selects 33 MHz Reference
MR
1
Reset
Normal
CLK_A, CLK_B, and RIO_C control output frequencies. See Table 3 and Table 4 for specific device configuration
Table 3. Output Configurations (Banks A & B)
CLK_x[0:5](1)
CLK_x[0]
(msb)
CLK_x[1]
CLK_x[2]
CLK_x[3]
CLK_x[4]
CLK_x[5]
(lsb)
N
Frequency
(MHz)
111111
1
1
1
1
1
1
126
15.87
111100
1
1
1
1
0
0
120
16.67
101000
1
0
1
0
0
0
80
25.00
011110
0
1
1
1
1
0
60
33.33
010100
0
1
0
1
0
0
40
50.00
001111
0
0
1
1
1
1
30
66.67
001100
0
0
1
1
0
0
24
83.33
001010
0
0
1
0
1
0
20
100.00
001001
0
0
1
0
0
1
18
111.11
001000
0
0
1
0
0
0
16
125.00
000111
0
0
0
1
1
1
15
133.33
000110
0
0
0
1
1
0
12
166.67
000101
0
0
0
1
0
1
10
200.00
0
(2)
000100
0
0
0
1
0
8
250
1. PowerPC bit ordering (bit 0 = msb, bit 5 = lsb)
2. Minimum value for N
Table 4. Output Configurations (Bank C)
RIO_C[0:1]
Frequency (MHz)
00
50 (test output)
01
125
10
250
11
500
IDT™ Clock Generator for PowerQUICC III
Advanced
Clock Drivers
Devices has been acquired by Integrated Device Technology, Inc
Freescale
Timing Solutions
Organization
Freescale Semiconductor
3
MPC9850
MPC9850
3
MPC9850
Clock Generator for PowerQUICC III
NETCOM
OPERATION INFORMATION
Output Frequency Configuration
The MPC9850 was designed to provide the commonly
used frequencies in PowerQUICC, PowerPC and other
microprocessor systems. Table 3 lists the configuration
values that will generate those common frequencies. The
MPC9850 can generate numerous other frequencies that
may be useful in specific applications. The output frequency
(fout) of either Bank A or Bank B may be calculated by the
following equation.
fout = 2000 / N
where fout is in MHz and N = 2 * CLK_x[0:5]
This calculation is valid for all values of N from 8 to 126.
Note that N = 15 is a modified case of the configuration inputs
CLK_x[0:5]. To achieve N = 15 CLK_x[0:5] is configured to
00111 or 7.
Crystal Input Operation
TBD
Power-Up and MR Operation
Figure 2 defines the release time and the minimum pulse
length for MR pin. The MR release time is based upon the
power supply being stable and within VDD specifications. See
Table 11 for actual parameter values. The MPC9850 may be
configured after release of reset and the outputs will be stable
for use after lock indication is obtained.
VDD
MR
treset_rel
treset_pulse
Figure 2. MR Operation
Power Supply Bypassing
The MPC9850 is a mixed analog/digital product. The
architecture of the MPC9850 supports low noise signal
operation at high frequencies. In order to maintain its superior
signal quality, all VDD pins should be bypassed by
high-frequency ceramic capacitors connected to GND. If the
spectral frequencies of the internally generated switching
noise on the supply pins cross the series resonant point of an
individual bypass capacitor, its overall impedance begins to
look inductive and thus increases with increasing frequency.
The parallel capacitor combination shown ensures that a low
impedance path to ground exists for frequencies well above
the noise bandwidth.
VDD
VDD
22 µF
0.1 µF
MPC9850
15 Ω
VDDA
0.1 µF
Figure 3. VCC Power Supply Bypass
MPC9850
IDT™ Clock
Generator for PowerQUICC III
Freescale Timing Solutions Organization has been acquired by Integrated Device Technology, Inc
4
4
MPC9850
Advanced Clock Drivers Devices
Freescale Semiconductor
MPC9850
Clock Generator for PowerQUICC III
NETCOM
Table 5. Absolute Maximum Ratings(1)
Symbol
Characteristics
Min
Max
Unit
VDD
Supply Voltage (core)
–0.3
3.8
V
VDDA
Supply Voltage (Analog Supply Voltage)
–0.3
VDD
V
VDDOx
Supply Voltage (LVCMOS output for Bank A or B)
–0.3
VDD
V
DC Input Voltage
–0.3
VDD+0.3
V
–0.3
VDDx+0.3
V
DC Input Current
±20
mA
DC Output Current
±50
mA
125
°C
VIN
VOUT
IIN
IOUT
TS
DC Output Voltage
(2)
Storage Temperature
–65
Condition
1. Absolute maximum continuous ratings are those maximum values beyond which damage to the device may occur. Exposure to these
conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation at absolute-maximum-rated
conditions is not implied.
2. VDDx references power supply pin associated with specific output pin.
Table 6. General Specifications
Symbol
Characteristics
Min
Typ
Max
VDD ÷ 2
VTT
Output Termination Voltage
HBM
ESD Protection (Human Body Model)
2000
CDM
Unit
Condition
V
V
ESD Protection (Charged Device Model)
500
V
LU
Latch-Up Immunity
100
mA
CIN
Input Capacitance
4
pF
Inputs
CPD
Power Dissipation Capacitance
10
pF
Per Output
θJA
Thermal Resistance (junction-to-ambient)
54.5
°C/W
Air flow = 0
TA
Ambient Temperature
–40
85
°C
Table 7. DC Characteristics (TA = –40°C to 85°C)
Symbol
Characteristics
Min
Typ
Max
Unit
Condition
200
mA
VDD + VDDA
pins
Maximum Quiescent Supply Current (Analog Supply)
15
mA
VDDIN pins
Maximum Bank A and B Supply Current
175
mA
VDDOA and
VDDOB pins
200
mA
VDD + VDDA
pins
Maximum Quiescent Supply Current (Analog Supply)
15
mA
VDDIN pins
Maximum Bank A and B Supply Current
100
mA
VDDOA and
VDDOB pins
Supply Current for VDD = 3.3 V ± 5%, VDDOA = 3.3 V ± 5 and VDDOB = 3.3 V ± 5%
IDD + IDDA Maximum Quiescent Supply Current (Core)
IDDA
IDDOA,
IDDOB
Supply Current for VDD = 3.3 V ± 5%, VDDOA = 2.5 V ± 5% and VDDOB= 2.5 V ± 5%
IDD + IDDA Maximum Quiescent Supply Current (Core)
IDDA
IDDOA,
IDDOB
IDT™ Clock Generator for PowerQUICC III
Advanced
Clock Drivers
Devices has been acquired by Integrated Device Technology, Inc
Freescale
Timing Solutions
Organization
Freescale Semiconductor
5
MPC9850
MPC9850
5
MPC9850
Clock Generator for PowerQUICC III
NETCOM
Table 8. LVDS DC Characteristics (TA = –40°C to 85°C)
Symbol
Characteristics
Min
Typ
Max
Unit
Condition
Differential LVDS Clock Outputs (QC0, QC0 and QC1, QC1) for VDD = 3.3 V ± 5%
VPP
Output Differential Voltage(1) (peak-to-peak)
(LVDS)
100
400
mV
VOS
Output Offset Voltage
(LVDS)
1050
1600
mV
1. VPP is the minimum differential input voltage swing required to maintain AC characteristics including tPD and device-to-device skew.
Table 9. LVPECL DC Characteristics (TA = –40°C to 85°C)(1)
Symbol
Characteristics
Min
Typ
Max
Unit
Condition
Differential LVPECL Clock Inputs (CLK1, CLK1) for VDD = 3.3 V ± 0.5%
VPP
VCMR
Differential Voltage(2) (peak-to-peak)
Differential Input Crosspoint Voltage
(3)
(LVPECL)
250
(LVPECL)
1.0
mV
VDD – 0.6
V
1. AC characteristics are design targets and pending characterization.
2. VPP is the minimum differential input voltage swing required to maintain AC characteristics including tPD and device-to-device skew.
3. VCMR (AC) is the crosspoint of the differential input signal. Normal AC operation is obtained when the crosspoint is within the VCMR (AC)
range and the input swing lies within the VPP (AC) specification. Violation of VCMR (AC) or VPP (AC) impacts the device propagation delay,
device and part-to-part skew.
Table 10. LVCMOS I/O DC Characteristics (TA = –40°C to 85°C)
Symbol
Characteristics
Min
Typ
Max
Unit
Condition
LVCMOS for VDD = 3.3 V ± 5%
VIH
Input High Voltage
VIL
Input Low Voltage
IIN
Input Current(1)
2.0
VDD + 0.3
V
LVCMOS
0.8
V
LVCMOS
± 200
µA
VIN = VDDL or GND
V
IOH = –24 mA
V
IOL = 24 mA
LVCMOS for VDD = 3.3 V ±5%, VDDOA = 3.3 V ± 5 and VDDOB = 3.3 V ± 5%
VOH
Output High Voltage
VOL
Output Low Voltage
ZOUT
Output Impedance
2.4
0.5
Ω
14 – 17
LVCMOS for VDD = 3.3 V ±5%, VDDOA = 2.5 V ± 5% and VDDOB= 2.5 V ± 5%
VOH
Output High Voltage
VOL
Output Low Voltage
ZOUT
Output Impedance
1.9
0.4
18 – 22
V
IOH = –15 mA
V
IOL = 15 mA
Ω
1. Inputs have pull-down resistors affecting the input current.
MPC9850
IDT™ Clock
Generator for PowerQUICC III
Freescale Timing Solutions Organization has been acquired by Integrated Device Technology, Inc
6
6
MPC9850
Advanced Clock Drivers Devices
Freescale Semiconductor
MPC9850
Clock Generator for PowerQUICC III
NETCOM
Table 11. AC Characteristics (VDD = 3.3 V ± 5%, VDDOA = 3.3 V ± 5%,VDDOB = 3.3 V ± 5%, TA= –40°C to +85°C)(1) (2)
Symbol
Characteristics
Min
Typ
Max
Unit
250
MHz
MHz
MHz
MHz
Condition
Input and Output Timing Specification
fref
25
33
25
Input Reference Frequency (25 MHz input)
Input Reference Frequency (33 MHz input)
XTAL Input
Input Reference Frequency in PLL Bypass Mode(3)
(4)
fVCO
VCO Frequency Range
fMCX
Output Frequency
frefPW
Reference Input Pulse Width
frefCcc
Input Frequency Accuracy
2000
Bank A output
Bank B output
Bank C output
MHz
15.87
15.87
50
200
200
500
MHz
MHz
MHz
100
ppm
500
ps
20% to 80%
57
53
%
Bank A and B
Bank C
10
ms
2
tr, tf
Output Rise/Fall Time
150
DC
Output Duty Cycle
43
47
PLL bypass
PLL locked
ns
50
50
PLL Specifications
tLOCK
treset_ref
treset_pulse
Maximum PLL Lock Time
MR Hold Time on Power Up
10
ns
MR Hold Time
10
ns
Skew and Jitter Specifications
tsk(O)
Output-to-Output Skew (within a bank)
50
ps
tsk(O)
Output-to-Output Skew (across banks A and B)
400
ps
VDDOA = 3.3 V
VDDOB = 3.3 V
tJIT(CC)
Cycle-to-Cycle Jitter
200
150
ps
ps
Bank A and B
Bank C
tJIT(PER)
Period Jitter
200
ps
Bank A and C
50
ps
Bank A and C
tJIT(∅)
1.
2.
3.
4.
RMS (1 σ)
I/O Phase Jitter
AC characteristics are design targets and pending characterization.
AC characteristics apply for parallel output termination of 50Ω to VTT.
In bypass mode, the MPC9850 divides the input reference clock.
The input reference frequency must match the VCO lock range divided by the total feedback divider ratio: fref = (fVCO ÷ M) ⋅ N.
Pulse
Generator
Z = 50Ω
ZO = 50Ω
ZO = 50Ω
RT = 100Ω
RT = 50Ω
DUT MPC9850
VTT
Figure 4. MPC9850 AC Test Reference (LVDS Outputs)
Pulse
Generator
Z = 50Ω
ZO = 50Ω
RT = 50Ω
ZO = 50Ω
DUT MPC9850
RT = 50Ω
VTT
VTT
Figure 5. MPC9850 AC Test Reference (LVCMOS Outputs)
IDT™ Clock Generator for PowerQUICC III
Advanced
Clock Drivers
Devices has been acquired by Integrated Device Technology, Inc
Freescale
Timing Solutions
Organization
Freescale Semiconductor
7
MPC9850
MPC9850
7
MPC9850
Clock Generator for PowerQUICC III
NETCOM
Table 12. MPC9850 Pin Diagram (Top View)
1
2
3
4
5
6
7
8
9
10
A
VDDOA
VDDOA
CLKA[1]
CLKA[3]
CLKA[5]
VDD
QA1
QA2
VDDOA
VDDOA
B
VDDOA
VDDOA
CLKA[0]
CLKA[2]
CLKA[4]
QA0
VDDOA
QA3
VDDOA
VDDOA
C
RSVD
RSVD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
REF_OUT
D
VDDA
VDDA
VDD
GND
GND
GND
GND
VDD
QC0
QC0
E
REF_SEL
CLK
VDD
GND
GND
GND
GND
VDD
VDDOC
GND
F
PCLK
PCLK
VDD
GND
GND
GND
GND
VDD
QC1
QC1
G
REF_CLK_SEL
REF_33MHz
VDD
GND
GND
GND
GND
VDD
PLL_BYPASS
MR
H
XTAL_IN
XTAL_OUT
VDD
VDD
VDD
VDD
VDD
VDD
RIO_C[1]
RIO_C[0]
J
VDDOB
VDDOB
CLKB[0]
CLKB[2]
CLKB[4]
QB0
VDDOB
QB3
VDDOB
VDDOB
K
VDDOB
VDDOB
CLKB[1]
CLKB[3]
CLKB[5]
VDD
QB1
QB2
VDDOB
VDDOB
Table 13. MPC9850 Pin List
Signal
100 Pin
MAPBGA
Signal
100 Pin
MAPBGA
Signal
100 Pin
MAPBGA
Signal
100 Pin
MAPBGA
Signal
100 Pin
MAPBGA
VDDOA
A1
RSVD(1)
C1
REF_SEL
E1
REF_CLK_SEL
G1
VDDOB
J1
VDDOA
A2
RSVD(1)
C2
CLK
E2
REF_33MHz
G2
VDDOB
J2
CLKA[1]
A3
VDD
C3
VDD
E3
VDD
G3
CLKB[0]
J3
CLKA[3]
A4
VDD
C4
GND
E4
GND
G4
CLKB[2]
J4
CLKA[5]
A5
VDD
C5
GND
E5
GND
G5
CLKB[4]
J5
VDD
A6
VDD
C6
GND
E6
GND
G6
QB0
J6
QA1
A7
VDD
C7
GND
E7
GND
G7
VDDOB
J7
QA2
A8
VDD
C8
VDD
E8
VDD
G8
QB3
J8
VDDOA
A9
VDD
C9
VDDOC
E9
PLL_BYPASS
G9
VDDOB
J9
VDDOA
A10
REF_OUT
C10
GND
E10
MR
G10
VDDOB
J10
VDDOA
B1
VDDA
D1
PCLK
F1
XTAL_IN
H1
VDDOB
K1
VDDOA
B2
VDDA
D2
PCLK
F2
XTAL_OUT
H2
VDDOB
K2
CLKA[0]
B3
VDD
D3
VDD
F3
VDD
H3
CLKB[1]
K3
CLKA[2]
B4
GND
D4
GND
F4
VDD
H4
CLKB[3]
K4
CLKA[4]
B5
GND
D5
GND
F5
VDD
H5
CLKB[5]
K5
QA0
B6
GND
D6
GND
F6
VDD
H6
VDD
K6
VDDOA
B7
GND
D7
GND
F7
VDD
H7
QB1
K7
QA3
B8
VDD
D8
VDD
F8
VDD
H8
QB2
K8
VDDOA
B9
QC0
D9
QC1
F9
RIO_C[1]
H9
VDDOB
K9
VDDOA
B10
QC0
D10
QC1
F10
RIO_C[0]
H10
VDDOB
K10
1. RSVD pins must be left open.
MPC9850
IDT™ Clock
Generator for PowerQUICC III
Freescale Timing Solutions Organization has been acquired by Integrated Device Technology, Inc
8
8
MPC9850
Advanced Clock Drivers Devices
Freescale Semiconductor
MPC9850
Clock Generator for PowerQUICC III
NETCOM
PACKAGE DIMENSIONS
B
C
11
A1 INDEX
AREA
K
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED
PARALLEL TO DATUM A.
4. DATUM A, SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGING.
11
9X
0.2
4X
TOP VIEW
SIDE VIEW
1
0.5
5
0.35 A
K
J
H
9X
1
1.7 MAX
(1.18)
G
F
0.43
0.29
E
D
C
4
A
SEATING
PLANE
100X
0.12 A
0.5
B
A
100X
1
2
A1 INDEX
AREA
3
4
5
6
7
8
9
10
0.55
0.45
0.25
M
A B C
0.10
M
A
3
DETAIL K
ROTATED 90˚ CLOCKWISE
BOTTOM VIEW
VA SUFFIX
VM SUFFIX (PB-FREE)
100 MAPBGA PACKAGE
CASE 1462-01
ISSUE O
IDT™ Clock Generator for PowerQUICC III
Advanced
Clock Drivers
Devices has been acquired by Integrated Device Technology, Inc
Freescale
Timing Solutions
Organization
Freescale Semiconductor
9
MPC9850
MPC9850
9
MPC9850
MPC92459
PART NUMBERS
900
Clock
MHz
Generator
Low Voltage
forNAME
PowerQUICC
LVDS
Clock
III
Synthesizer
INSERT
PRODUCT
AND
DOCUMENT
TITLE
NETCOM
NETCOM
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