BD5331

Voltage Detector IC Series Free Delay Time Setting CMOS Voltage Detector IC Series BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series No.09006EBT03  Description ROHM’s BD52□□G/FVE and BD53□□G/FVE series are highly accurate, low current consumption reset IC series with a built-in delay circuit. The lineup was established with tow output types (Nch open drain and CMOS output) and detection voltages range from 2.3V to 6.0V in increments of 0.1V, so that the series may be selected according the application at hand.  Features 1) Detection voltage: 2.3V to 6.0V (Typ.), 0.1V steps 2) High accuracy detection voltage: ±1.0% 3) Ultra-low current consumption: 0.8µA (Typ.) 4) Nch open drain output (BD52□□G/FVE), CMOS output (BD53□□G/FVE) 5) Compact packages VSOF5: BD52□□FVE, BD53□□FVE SSOP5: BD52□□G, BD53□□G  Applications All electronic devices that use micro controllers and logic circuits  Selection Guide No. 1 Specifications Output Circuit Format Detection Voltage Package Description 2:Open Drain Output, 3:CMOS Output Example: Displays VS over a 2.3V to 6.0V range in 0.1V increments. Part Number : BD5 1 2 3 2 3 G:SSOP5 / FVE:VSOF5  Lineup Marking PW PV PU PT PS PR PQ PP PN PM PL PK PJ PH PG PF PE PD PC Detection Voltage 6.0V 5.9V 5.8V 5.7V 5.6V 5.5V 5.4V 5.3V 5.2V 5.1V 5.0V 4.9V 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V Part Number BD5260 BD5259 BD5258 BD5257 BD5256 BD5255 BD5254 BD5253 BD5252 BD5251 BD5250 BD5249 BD5248 BD5247 BD5246 BD5245 BD5244 BD5243 BD5242 Marking PB PA MV MU MT MS MR MQ MP MN MM ML MK MJ MH MG MF ME MD Detection Voltage 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V Part Number BD5241 BD5240 BD5239 BD5238 BD5237 BD5236 BD5235 BD5234 BD5233 BD5232 BD5231 BD5230 BD5229 BD5228 BD5227 BD5226 BD5225 BD5224 BD5223 Marking RW RV RU RT RS RR RQ RP RN RM RL RK RJ RH RG RF RE RD RC Detection Voltage 6.0V 5.9V 5.8V 5.7V 5.6V 5.5V 5.4V 5.3V 5.2V 5.1V 5.0V 4.9V 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V Part Number BD5360 BD5359 BD5358 BD5357 BD5356 BD5355 BD5354 BD5353 BD5352 BD5351 BD5350 BD5349 BD5348 BD5347 BD5346 BD5345 BD5344 BD5343 BD5342 Marking RB RA QV QU QT QS QR QQ QP QN QM QL QK QJ QH QG QF QE QD Detection Voltage 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V Part Number BD5341 BD5340 BD5339 BD5338 BD5337 BD5336 BD5335 BD5334 BD5333 BD5332 BD5331 BD5330 BD5329 BD5328 BD5327 BD5326 BD5325 BD5324 BD5323 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/9 2009.06 - Rev.B BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series  Absolute maximum ratings (Ta=25°C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output *1*3 SSOP5 Power *2*3 Dissipation VSOF5 Operating Temperature Ambient Storage Temperature Technical Note Symbol VDD-GND VOUT Pd Topr Tstg Limits -0.3 ~ +10 GND-0.3 ~ +10 GND-0.3 ~ VDD+0.3 540 210 -40 ~ +105 -55 ~ +125 Unit V V mW °C °C *1 Use above Ta=25°C results in a 5.4mW loss per degree. *2 Use above Ta=25°C results in a 2.1mW loss per degree. *3 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted.  Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) Parameter Detection Voltage Symbol VDET Condition VDD=HL, RL=470kΩ VDET =2.3-3.1V VDET =3.2-4.2V VDD=VDET-0.2V VDET =4.3-5.2V VDET =5.3-6.0V VDET =2.3-3.1V VDET =3.2-4.2V VDD=VDET+2.0V VDET =4.3-5.2V VDET =5.3-6.0V VOL≤0.4V, Ta=25~105°C, RL=470kΩ VOL≤0.4V, Ta=-40~25°C, RL=470kΩ VDS=0.5V VDD=1.2V VDS=0.5V VDD=2.4V VDS=0.5V VDD=4.8V VDET=2.3-4.2V VDS=0.5V VDD=6.0V VDET=4.3-5.2V VDS=0.5V VDD=8.0V VDET=5.3-6.0V VDD=VDS=10V VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ CT pin Threshold Voltage VCTH VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ Output Delay Resistance CT pin Output Current Detection Voltage Temperature coefficient Hysteresis Voltage RCT ICT VDD=VDET×1.1 VCT=0.5V VCT=0.1V VDD=0.95V VCT=0.5V VDD=1.5V *1 *1 *1 Circuit Current when ON IDD1 Circuit Current when OFF IDD2 Operating Voltage Range ‘Low’ Output Current (Nch) VOPL IOL ‘High’ Output Current (Pch) Leak Current when OFF IOH Ileak *1 Min. Max. VDET(T) VDET(T) VDET(T) ×0.99 ×1.01 0.80 2.40 0.85 2.55 0.90 2.70 0.95 2.85 0.75 2.25 0.80 2.40 0.85 2.55 0.90 2.70 0.95 1.20 0.4 1.2 2.0 5.0 0.7 1.4 0.9 1.8 1.1 2.2 0.1 VDD VDD VDD ×0.30 ×0.40 ×0.60 VDD VDD VDD ×0.30 ×0.45 ×0.60 VDD VDD VDD ×0.35 ×0.50 ×0.60 VDD VDD VDD ×0.40 ×0.50 ×0.60 5.5 9 12.5 15 40 150 240 VDET ×0.03 ±100 VDET ×0.05 ±360 VDET ×0.08 Limit Typ. Unit V µA µA V mA mA µA V MΩ µA ppm/°C V VDET/∆T Ta=-40°C to 105°C ∆VS VDD=LHL, RL=470kΩ VS(T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. Designed Guarantee. (Outgoing inspection is not done on all products.) *1 Guarantee is Ta=25°C. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/9 2009.06 - Rev.B BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series  Block Diagrams BD52□□G/FVE VDD Technical Note BD53□□G/FVE VDD VOUT VOUT Vref Vref GND CT GND CT Fig.1 TOP VIEW Fig.2 TOP VIEW SSOP5 PIN No. 1 2 3 4 5 Symbol VOUT VDD GND N.C. CT Function Reset Output Power Supply Voltage GND Unconnected Terminal Capacitor connection terminal for output delay time VSOF5 PIN No. 1 2 3 4 5 Symbol VOUT SUB CT GND VDD Function Reset Output Substrate* Capacitor connection terminal for output delay time GND Power Supply Voltage *Connect the substrate to GND. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/9 2009.06 - Rev.B BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series  Reference Data (Unless specified otherwise, Ta=25°C) Technical Note "LOW" OUTPUT CURRENT ： IOL [mA] CIRCUIT CURRENT ： IDD [μA] 【BD5242G/FVE】 1.5 【BD5242G/FVE】 15 12 9 6 3 0 0.0 VDD =1.2V VDD =2.4V "HIGH" OUTPUT CURRENT ： IOH [mA] 2.0 18 45 40 35 30 25 20 15 10 5 0 0 1 2 3 4 5 6 DRAIN-SOURCE VOLTAGE ： VDS[V] VDD =6.0V VDD =4.8V VDD =8.0V 【BD5342G/FVE】 1.0 0.5 0.0 0 1 2 3 4 5 6 7 8 9 10 VDD SUPPLY VOLTAGE ：VDD [V] 0.5 1.0 1.5 2.0 2.5 DRAIN-SOURCE VOLTAGE ： VDS[V] Fig.3 Circuit Current Fig.4 “Low” Output Current Fig.5 “High” Output Current 9 OUTPUT VOLTAGE： VOUT [V] OUTPUT VOLTAGE： VOUT [V] 8 7 6 5 4 3 2 1 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.0 CT OUTPUT CURRENT ： ICT [μA] 【BD5242G/FVE】 0.8 0.6 0.4 0.2 0.0 0.0 【BD5242G/FVE】 450 400 350 300 250 200 150 100 50 0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 VDD SUPPLY VOLTAGE ： VDD [V] VDD SUPPLY VOLTAGE ： VDD [V] 【BD5242G/FVE】 Ta=25℃ Ta=25℃ VDD SUPPLY VOLTAGE ：VDD [V] Fig.6 I/O Characteristics Fig.7 Operating Limit Voltage Fig.8 CT Terminal Current DETECTION VOLTAGE： VDET[V] 5.0 Low to high(VDET+ ΔVDET) 4.6 4.2 3.8 3.4 ～ ～ 3.0 -40 High to low(VDET) 1.0 CIRCUIT CURRENT WHEN OFF ： I DD2 [μA] 【BD5242G/FVE】 CIRCUIT CURRENT WHEN ON ： IDD1 [μA] 5.4 1.5 【BD5242G/FVE】 1.5 【BD5242G/FVE】 1.0 0.5 0.5 0 40 80 0.0 -40 -20 0 20 40 60 80 100 0.0 -40 -20 0 20 40 60 80 100 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] Fig.9 Detection Voltage Release Voltage 1.5 MINIMUM OPERATING VOLTAGE ： V OPL[V] Fig.10 Circuit Current when ON Fig.11 Circuit Current when OFF RESISTANCE OF CT ： RCT [MΩ] 【BD5242G/FVE】 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 13 12 11 10 9 8 7 6 5 4 3 2 1 0 -40 -20 10000 【BD5242G/FVE】 DELAY TIME ： TPLH [ms] 1000 100 10 1 0.1 0.01 【BD5242G/FVE】 0 20 40 60 80 100 0.001 0.0001 0.001 0.01 0.1 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] CAPACITANCE OF CT ： CCT[μ F] Fig.12 Operating Limit Voltage Fig.13 Ct Terminal Circuit Resistance Fig.14 Delay Time (TPLH) and CT Terminal External Capacitance www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/9 2009.06 - Rev.B BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series Technical Note  Setting of Detector Delay Time This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal. Delay time at the rise of VDD TPLH：Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release voltage(VDET+∆VDET) TPLH = -CCT×RCT×ln CCT: VCTH: VDD-VCTH VDD CT pin Externally Attached Capacitance CT pin Threshold Voltage（P.2 VCTH refer.） RCT : CT pin Internal Impedance （P.2 RCT refer.） Ln : Natural Logarithm  Reference Data of Falling Time (TPHL) Output Examples of Falling Time (TPHL) Output Part Number tPHL[µs] -40°C tPHL[µs] ,+25°C tPHL[µs],+105°C BD5227G 30.8 30 28.8 BD5327G 26.8 26 24.8 *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use.  Explanation of Operation For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD52□□G/FVE series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD R1 Vref VOUT R2 Q3 R3 GND CT GND CT R3 Q1 R2 Q3 Q1 RL RESET Vref VDD R1 VDD RESET VOUT Q2 Fig.15 (BD52□□Type Internal Block Diagram) Fig.16 (BD53□□Type Internal Block Diagram)  Timing Waveforms Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Fig.15 and 16). 1 When the power supply is turned on, the output is unsettled from VDD after over the operating limit voltage (VOPL) until TPHL. There fore it is possible that the reset signal is not outputted when the rise time of VDET+ΔVDET ⑤ VDET VDD is faster than TPHL. 2 When VDD is greater than VOPL but less than the reset release VOPL 0V voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT) voltages will switch to L. VCT 3 If VDD exceeds the reset release voltage (VDET+∆VDET), then 1/2 VDD VOUT switches from L to H (with a delay to the CT terminal). 4 If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to L (with a delay of TPHL). VOUT TPLH TPHL TPLH 5 The potential difference between the detection voltage and the TPHL release voltage is known as the hysteresis width (∆VDET). The system is designed such that the output does not flip-flop with power ①② ③④ supply fluctuations within this hysteresis width, preventing malfunctions due to noise. Fig.17 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/9 2009.06 - Rev.B BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series  Circuit Applications 1) Examples of a common power supply detection reset circuit Technical Note VDD1 RL BD52□□□ CT CL （Noise-filtering Capacitor） ） VDD2 Application examples of BD52□□G/FVE series (Open Drain output type) and BD53□□G/FVE series (CMOS output type) are shown below. Microcontroller GND Fig.18 Open Collector Output Type CASE1: the power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use the open drain output type (BD52□□G/FVE) attached a load resistance (RL) between the output and VDD2. (As shown Fig.15) VDD1 CASE2: the power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use CMOS output type (BD53□□G/FVE) or open drain output type (BD52□□G/FVE) attached a load resistance (RL) between the output and Vdd1. (As shown Fig.16) BD53□□□ CT CL （Noise-filtering Capacitor） Microcontroller When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT). GND Fig.19 CMOS Output Type 2) The following is an example of a circuit application in which an OR connection between two types of detection voltages resets the microcontroller. VDD1 VDD2 VDD3 RL BD52□□□ NO.1 CT CT BD52□□□ NO.2 RST microcontroller GND Fig.20 When there are many power supplies of the system, power supplies VDD1 and VDD2 are being monitored separately, and it is necessary to reset the microcomputer, it is possible to use an OR connection on the open drain output type BD52□□G/FVE series to pull-up to the desired voltage (VDD3) as shown in Fig.17 and make the output “High” voltage matches the power supply voltage VDD3 of the microcontroller. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/9 2009.06 - Rev.B BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series Technical Note 3) Examples of the power supply with resistor dividers In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output oscillatory state). (Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level switches from “High” to “Low” or vice versa.) V1 IDD R2 I1 VDD Through Current R1 CIN BD52□□ BD53□□ CL GND VOUT VDD 0 Fig.21 VDET A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage to descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through output “Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again causes the through current to flow and the voltage drop. This process is repeated, resulting in oscillation. VDD - IDD Peak Current Ta=25°C 10 BU43xx BU42xx BD52xx BD53xx Temp - IDD(BD52xx) 0.4 VDD3V VDD5V VDD7V VDD10V 0.1 IDD peak current [mA] 3 4 5 6 7 VDD[V] 8 9 10 1 IDD-peak[mA] 0.3 0.2 0.01 0.1 0.001 0 -50 -30 -10 10 30 50 Temp[°C] 70 90 110 130 Fig.22 Current Consumption vs. Power Supply Voltage *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/9 2009.06 - Rev.B BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series Technical Note  Operation Notes 1 . Absolute maximum range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2 . GND potential GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if, include transient feature. 3 . Electrical Characteristics Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4 . Bypass Capacitor for Noise Rejection Please put into the capacitor of 1µF or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5 . Short Circuit between Terminal and Soldering Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6 . Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7. 8. 9. 10. The VDD line inpedance might cause oscillation because of the detection current. A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance. If 10MΩ leakage is assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD terminal would be recommended. The value of RCT depends on the external resistor that is connected to CT terminal, so please consider the delay time that is decided by τ×RCT×CCT changes. 11. External parameters The recommended parameter range for CT is 100pF~0.1µF and RL is 50kΩ~1MΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 12. Power on reset operation Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation. 13. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/9 2009.06 - Rev.B BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series  Part Number Selection Technical Note B D 5 2 2 3 G － T R BD52: Adjustable Delay Time CMOS Reset IC Open Drain Type BD53: Adjustable Delay Time CMOS Reset IC CMOS Output Type Reset Voltage Value 23: 2.3V to (0.1V step) 60: 6.0V Package G: SSOP5 FVE: VSOF5 Taping Specifications Embossed Taping SSOP5 2.9±0.2 5 4 +6° 4° −4° Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold +0.2 1.6 −0.1 2.8±0.2 1 2 3 0.2Min. ( reel on the left hand and you pull out the tape on the right hand 1pin ) +0.05 0.13 −0.03 1.25Max. 1.1±0.05 0.05±0.05 +0.05 0.42 −0.04 0.95 0.1 Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. VSOF5 0.2MAX 1.6 ± 0.05 1.0 ± 0.05 5 4 Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold (MAX 1.28 include BURR) 1.6 ± 0.05 1.2 ± 0.05 ( reel on the left hand and you pull out the tape on the right hand 1pin ) 1 2 3 0.13 ± 0.05 0.6MAX 0.5 0.22 ± 0.05 Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/9 2009.06 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. 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