Stepping Motor Driver series
High Performance, High Reliability
36V Stepping Motor Driver Series
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
No.12009EAT04
●Description
BD6387EFV, BD6385EFV, BD6383EFV, BD6389FM are the high-grade type that provides the highest function and highest
reliance in the ROHM stepping motor driver series. This series has the perfect various protection circuits and reduces IC’s
generation of heat by adopting low-ON resistance DMOS and high heat-radiation power package.
As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power supply’s rated
voltage of 36V and rated output current of 1.0A～2.2A. For the input interface, the CLK-IN drive mode and the parallel IN
drive mode are compatible with each other, so please choose an input mode according to needs of application. There are
excitation modes of FULL STEP & HALF STEP (2 kinds), QUARTER STEP mode, and for current decay mode, the ratio of
FAST DECAY & SLOW DECAY can be freely set, so the optimum control conditions for every motor can be realized. In
addition, being able to drive with one system of power supply makes contribution to the set design’s getting easy.
●Feature
1) Power supply: one system drive (rated voltage of 36V)
2) Rated output current: 1.0A, 1.5A, 2.0A, 2.2A
3) Low ON resistance DMOS output
4) CLK-IN drive mode (built-in translator circuit)
5) Parallel IN drive mode
6) Stepping motor／DC motor(×2) drives are selectable
7) PWM constant current control (self oscillation)
8) Built-in spike noise cancel function (external noise filter is unnecessary)
9) FULL STEP & HALF STEP (two kinds), applicable to QUARTER STEP
10) Applicable to the μSTEP drive
11) Current decay mode switching function (linearly variable FAST/SLOW DECAY ratio)
12) Normal rotation & reverse rotation switching function
13) Power save function
14) Built-in logic input pull-down resistor
15) Power-on reset function
16) Thermal shutdown circuit (TSD)
17) Over current protection circuit (OCP)
18) Under voltage lock out circuit (UVLO)
19) Over voltage lock out circuit (OVLO)
20) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention)
21) Electrostatic discharge: 6kV (HBM specification)
22) Adjacent pins short protection
23) Inverted mounting protection
24) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package
(BD6387EFV/BD6385EFV/BD6383EFV)
25) FIN heat-radiating type HSOP package (BD6389FM)
26) Pin-compatible line-up (BD6387EFV/BD6385EFV/BD6383EFV or BD6389FM)
●Application
PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo
printer, FAX, scanner, mini printer, toy, and robot etc.
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© 2012 ROHM Co., Ltd. All rights reserved.
1/8
2012.02 - Rev.A
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
●Absolute maximum ratings(Ta=25℃)
Item
Supply voltage
Symbol
VCC0,1,2
Power dissipation
Pd
Input voltage for control pin
RNF maximum voltage
VIN
VRNF
IOUT
Maximum output current
Operating temperature range
Storage temperature range
Junction temperature
※1
※2
※3
※4
※5
BD6387EFV
BD6385EFV
BD6383EFV
-0.2～+36.0
1
1.6※
4.7※2
BD6389FM
2.8※3
5.2※4
-0.2～+5.5
0.5
5
1.5※5
2.0※
Topr
Tstg
Tjmax
1.0※5
2.2※5
-25～+75
-55～+150
150
Unit
V
W
W
V
V
A/phas
e
℃
℃
℃
70mm×70mm×1.6mm glass epoxy board. Derating in done at 12.8mW/℃ for operating above Ta=25℃.
4-layer recommended board. Derating in done at 37.6mW/℃ for operating above Ta=25℃.
70mm×70mm×1.6mm glass epoxy board. Derating in done at 22.4mW/℃ for operating above Ta=25℃.。
4-layer recommended board. Derating in done at 41.6mW/℃ for operating above Ta=25℃.
Do not, however exceed Pd, ASO and Tjmax=150℃.
●Operating conditions(Ta= -25～+75℃)
Item
Supply voltage
Symbol
VCC0,1,2
BD6387EFV
IOUT
1.7※6
Output current(DC)
BD6385EFV
BD6383EFV
10～28
1.2※6
0.7※6
BD6389FM
1.9※6
Unit
V
A/phas
e
※6 Do not however exceed Pd, ASO.
●Electrical characteristics
Applicable to all the series (Unless otherwise specified Ta=25℃, Vcc0,1,2=24V)
Limit
Item
Symbol
Min.
Typ.
Max.
Whole
Circuit current at standby
ICCST
1.0
3.0
Circuit current
ICC
4.5
10
Control input (SELECT, CW_CCW, CLK, PS, MODE0, MODE1, ENABLE)
H level input voltage
VINH
2.0
L level input voltage
VINL
0.8
H level input current
IINH
35
50
85
L level input current
IINL
-10
0
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Unit
mA
mA
PS=L
PS=H, VREFX=2V
V
V
μA
μA
VIN=5V
VIN=0V
Output ON resistance (BD6387EFV)
RON
-
0.8
1.04
Ω
Output ON resistance (BD6385EFV)
RON
-
1.0
1.3
Ω
Output ON resistance (BD6383EFV)
RON
-
1.5
1.95
Ω
Output ON resistance (BD6389FM)
RON
-
0.7
0.91
Ω
ILEAK
-
-
10
μA
IRNFS
IRNF
IVREF
VREF
IMTH
VMTH
VCTH
tONMIN
-2.0
-40
-2.0
0
-2.0
0
0.36
0.3
-0.2
-20
-0.1
-0.1
0.4
0.7
2.0
3.5
0.44
1.2
μA
μA
μA
V
μA
V
V
μs
Output leak current
Current control
RNFXS input current
RNFX input current
VREFX input current
VREFX input voltage range
MTHX input current
MTHX input voltage range
Comparator threshold
Minimum on time
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2/8
Condition
IOUT =±1.5A,
Sum of upper and lower
IOUT =±1.0A,
Sum of upper and lower
IOUT =±0.5A,
Sum of upper and lower
IOUT =±1.7A,
Sum of upper and lower
RNFXS =0V
RNFX=0V
VREFX=0V
MTHX=0V
VREFX=2V
R=39kΩ,C=1000pF
2012.02 - Rev.A
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
●Terminal function
1) BD6387EFV / BD6385EFV / BD6383EFV
Pin
Pin name
Function
No.
1
NC
2
RNF1
3
RNF1S
4
NC
5
OUT1B
6
NC
7
OUT1A
8
NC
9
VCC1
10
NC
11
CR1
12
NC
Pin
No.
Pin name
Function
Non connection
Connection terminal of resistor for output
current detection
21
VCC0
22
NC
Non connection
Input terminal of current limit comparator
23
GND
Ground terminal
Non connection
24
MODE0
Motor excitation mode setting terminal
H bridge output terminal
25
MODE1
Motor excitation mode setting terminal
Non connection
26
ENABLE
Output enable terminal
H bridge output terminal
27
VREF2
Output current value setting terminal
Non connection
28
MTH2
Current decay mode setting terminal
Power supply terminal
29
NC
Non connection
30
CR2
Connection terminal of CR for setting PWM
frequency
31
NC
Non connection
32
VCC2
Power supply terminal
Non connection
Connection terminal of CR for setting PWM
frequency
Non connection
Power supply terminal
13
MTH1
Current decay mode setting terminal
33
NC
14
VREF1
Output current value setting terminal
34
OUT2A
Input mode select terminal
35
NC
Motor rotating direction setting terminal
36
OUT2B
Non connection
Clock input terminal
for advancing the electrical angle.
37
NC
38
RNF2S
Power save terminal
39
RNF2
Connection terminal of resistor for output
current detection
Terminal for testing
(used by connecting with GND)
40
GND
Ground terminal
15
SELECT
16
CW_CCW
17
NC
18
CLK
19
PS
20
TEST
2) BD6389FM
Pin
Pin name
No.
1
NC
2
CR1
3
4
Function
Pin
No.
Non connection
H bridge output terminal
Non connection
H bridge output terminal
Non connection
Input terminal of current limit comparator
Pin name
Function
Non connection
Connection terminal of CR for setting PWM
frequency
19
VCC2
20
NC
Non connection
MTH1
Current decay mode setting terminal
21
NC
Non connection
VREF1
Output current value setting terminal
22
OUT2A
Input mode select terminal
23
NC
Motor rotating direction setting terminal
Clock input terminal
for advancing the electrical angle.
24
OUT2B
25
NC
Power save terminal
Terminal for testing
(used by connecting with GND)
Fin terminal
(used by connecting with GND)
26
RNF2S
27
RNF2
FIN
FIN
Ground terminal
28
RNF1
RNF1S
Power supply terminal
H bridge output terminal
5
SELECT
6
CW_CCW
7
CLK
8
PS
9
TEST
FIN
FIN
10
GND
11
MODE0
Motor excitation mode setting terminal
29
12
MODE1
Motor excitation mode setting terminal
30
NC
13
ENABLE
Output enable terminal
31
OUT1B
14
VREF2
Output current value setting terminal
32
NC
15
MTH2
33
OUT1A
16
CR2
Current decay mode setting terminal
Connection terminal of CR for setting PWM
frequency
34
NC
35
VCC1
Power supply terminal
36
VCC0
Power supply terminal
17
NC
Non connection
18
NC
Non connection
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3/8
Non connection
H bridge output terminal
Non connection
Input terminal of current limit comparator
Connection terminal of resistor for output
current detection
Fin terminal
(used by connecting with GND)
Connection terminal of resistor for output
current detection
Input terminal of current limit comparator
Non connection
H bridge output terminal
Non connection
H bridge output terminal
Non connection
2012.02 - Rev.A
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
●Block diagram･Application circuit diagram･Input output equivalent circuit diagram
Set the PWM frequency.
Setting range is
C:470pF～4700pF
R:10kΩ～100kΩ.
Buffer
VREF1
Resistor for current. detecting
Setting range is
0.1Ω～0.3Ω.
Current Limit Comp.
DAC
VCC1
OUT1A
CR1
1000pF
39kΩ
Predriver
Logic
CR
Timer
OUT1B
RNF1
OCP
MTH1
CLK
MODE0
MODE1
CW_CCW
ENABLE
SELECT
Set the PWM frequency.
Setting range is
C:470pF～4700pF
R:10kΩ～100kΩ.
TSD
Reg
VCC0
OVLO
GND
UVLO
RESET
VREF2
Be sure to short VCC0, VCC1 &
100uF
Translator
Buffer
0.2Ω
RNF1S
Bypass capacitor.
Setting range is
100uF～470uF(electrolytic)
0.01uF～0.1uF(multilayer ceramic etc.)
PS
Current Limit Comp.
DAC
0.1uF
VCC2
OUT2A
CR2
1000pF
39kΩ
CR
Timer
Logic
Predriver
OUT2B
RNF2
MTH2
OCP
TEST
0.2Ω
RNF2S
Resistor for current. detecting.
Setting range is
0.1Ω～0.3Ω.
Terminal for testing.
Pleaseconnect to GND.
Fig.1 Block diagram & Application circuit diagram of BD6387EFV/BD6385EFV/BD6383EFV/BD6389FM
●Points to notice for terminal description
○CLK／Clock input terminal for advancing the electrical angle
CLK is reflected at rising edge. The Electrical angle advances by one for each CLK input.
Motor’s misstep will occur if noise is picked up at the CLK terminal, so please design the pattern in such a way that
there is no noise plunging.
○MODE0,MODE1／Motor excitation mode setting terminal
Set the motor excitation mode.
MODE0
MODE1
Excitation mode
L
H
L
H
L
L
H
H
FULL STEP
HALF STEP A
HALF STEP B
QUARTER STEP
○CW_CCW Terminal／Motor rotating direction setting terminal
Set the motor’s rotating direction. Change in setting is reflected at the CLK’s rising edge immediately after the change
in setting
CW_CCW
Rotating direction
L
H
Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current)
Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s current)
○ENABLE Terminal／Output enable terminal
Turn off forcibly all the output transistors (motor output is open).
At the time of ENABLE=L, electrical angle or operating mode is maintained even if CLK is inputted.
Please be careful because the electrical angle at the time of ENABLE being released (ENABLE=L→H) is different from
the released occasion at the section of CLK=H and from the released occasion at the section of CLK＝L.
ENABLE
Motor output
L
H
OPEN (electrical angle maintained)
ACTIVE
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4/8
2012.02 - Rev.A
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
Technical Note
○PS／Power save terminal
PS can make circuit standby state and make motor output OPEN. In standby state, translator circuit is reset (initialized)
and electrical angle is initialized.
Please be careful because there is a delay of 40μs(max.) before it is returned from standby state to normal state and
the motor output becomes ACTIVE.
PS
State
L
Standby state (RESET)
H
ACTIVE
The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows.
Please be careful because the initial state at the time of FULL STEP is different from those of other excitation modes.
Excitation mode
Initial electrical angle
FULL STEP
HALFSTEP A
HALFSTEP B
QUARTER
STEP
45°
0°
0°
0°
○SELECT Terminal／Input mode switching terminal
This is the terminal to set the input mode.
SELECT
Input mode
L
H
CLK-IN drive
Parallel IN drive
●Power dissipation
○HTSSOP-B40 Package (BD6387EFV/BD6385EFV/BD6383EFV)
HTSSOP-B40 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the
back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power
dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a
possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation
efficiency.
5.0
4.7W
4
Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
3
Board size：70*70*1.6mm
(With through holes on the board)
The exposed metal of the backside is connected to the board with
solder.
2
Board①：1-layer board(Copper foil on the back 0mm )
2
Board②：2-layer board(Copper foil on the back 15*15mm )
2
Board③：2-layer board(Copper foil on the back 70*70mm )
2
Board④：4-layer board(Copper foil on the back 70*70mm )
4.0
Power Dissipation：Pd[W]
3.6W
3
3.0
2.0
1.95W
2
1.6W
1
Board①：θja=78.1℃/W
Board②：θja=64.1℃/W
Board③：θja=34.7℃/W
Board④：θja=26.6℃/W
1.0
0
100
125
Ambient Temperature:Ta[℃]
Fig.2 HTSSOP-B40 Derating Curve
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5/8
2012.02 - Rev.A
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
Technical Note
○HSOP-M36 Package (BD6389FM/BD6388FM)
HSOP-M36 has a heat-dissipating FIN terminal on the IC side, but it is possible to greatly increase power dissipation by
taking a large heat dissipation pattern, such as with copper foil, on the back as well as the surface of the board. Also, this
terminal is a GND potential, therefore there is a possibility for malfunction or destruction if it is shorted with any potential
other than GND.
4
5.2W
Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
3
Board size：70*70*1.6mm
(With through holes on the board)
5.0
4.1W
3
3.0W
2
2.8W
1
2
Board①：1-layer board(Copper foil on the back 0mm )
2
Board②：2-layer board(Copper foil on the back 15*15mm )
2
Board③：2-layer board(Copper foil on the back 70*70mm )
2
Board④：4-layer board(Copper foil on the back 70*70mm )
Power Dissipation：Pd[W]
4.0
Board①：θja=44.6℃/W
Board②：θja=41.6℃/W
Board③：θja=30.5℃/W
Board④：θja=24.0℃/W
3.0
2.0
1.0
0
100
125
Fig.3 HSOP-M36 Derating Curve
Ambient Temperature:Ta[℃]
●Usage Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
(3) Power supply Lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
(4) GND Potential
The potential of GND pin must be minimum potential in all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Users should be aware that BD6387EFV, BD6385EFV and BD6383EFV have been designed to expose their frames at
the back of the package, and should be used with suitable heat dissipation treatment in this area to improve dissipation.
As large a dissipation pattern should be taken as possible, not only on the front of the baseboard but also on the back
surface. BD6389FM and BD6388FM are both equipped with FIN heat dissipation terminals, but dissipation efficiency can
be improved by applying heat dissipation treatment in this area. It is important to consider actual usage conditions and to
take as large a dissipation pattern as possible.
(6) Inter-pin shorts and mounting errors
When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.
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6/8
2012.02 - Rev.A
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
(7) Operation in a strong electric field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher,
coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal
operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect
peripheral equipment.
TSD on temperature [℃] (Typ.)
175
Hysteresis Temperature [℃]
25
(Typ.)
(10) Inspection of the application board
During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.
(11) Input terminal of IC
This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.
This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.
For example, when the resistance and transistor are connected to the terminal as shown in figure 4,
○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),
the P-N junction operates as a parasitic diode.
○Also, when GND＞(Terminal B) at the transistor (NPN)
The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned
parasitic diode.
Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The
operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.
Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage
that is lower than the GND (P substrate) to the input terminal.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P
+
N
P
P+
E
N
N
Pin B
B
Parasitic
element
P+
N
GND
P+
P
B
N
E
P substrate
P substrate
Parasitic element
C
Parasitic element
GND
GND
GND
Parasitic
element
Other adjacent elements
Fig. 4 Pattern Diagram of Parasitic Element
(12) Ground Wiring Patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern potential of any external components, either.
(13) TEST Terminal
Be sure to connect TEST pin to GND.
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7/8
2012.02 - Rev.A
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
●Ordering part number
B
D
6
3
8
E
3
F
V
パッケージ
EFV
: HTSSOP-B40
FM
: HSOP-M36
形名
-
E2
包装、フォーミング仕様
E2: リール状エンボステーピング
HTSSOP-B40
13.6±0.1
(MAX 13.95 include BURR)
4 +6
−4
(8.4)
1
Embossed carrier tape (with dry pack)
Quantity
2000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
20
1PIN MARK
+0.05
0.17 −0.03
1.0Max.
0.625
1.2 ± 0.2
(3.2)
7.8±0.2
0.5 ± 0.15
21
5.4±0.1
40
Tape
S
0.85±0.05
0.08±0.05
+0.05
0.24 −0.04
0.65
0.08
M
0.08 S
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
HSOP-M36
18.5 ± 0.1
(MAX 18.75 include BURR)
+6
4 −4
2.77± 0.1
0.1±0.05
2.2±0.05
9
10
1PIN MARK
0.8
+0.05
0.37 −0.04
Embossed carrier tape (with dry pack)
Quantity
1500pcs
19
Direction
of feed
1.2±0.2
27
0.5±0.15
1
0.85
2.4MAX
28
7.5±0.1
9.9±0.2
36
Tape
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
18
+0.055
0.27 −0.045
0.08 S
0.08 M
1pin
Reel
(Unit : mm)
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8/8
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2012.02 - Rev.A
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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