BD7700GU

System LED Drivers for Mobile Phones Charge Pump type for Flash BD7700GU No.11041EAT19 ●Description BD7700GU is a maximum of 300mA LED flash (three-channel total) driver IC. Flash mode and torch mode are controllable by two external control signals. The flash mode timer ability for a maximum of 1s is carried, and management of flash lighting time is easy and safe. ●Features 1) Current regulation for LED 2) 3ch High side current Driver 3) Flash LED High side Current driver (Max 100mA@1ch) 4) Torch LED High side Current driver (Max 20mA@1ch) 5) Indicate LED High side Current driver (Max 1mA) 6) High efficiency up to 80% 7) 2port control Flash and Torch and Indicate mode 8) Charge pump step-up DC/DC converter (Max 300mA) Three charge pump mode (×1, ×1.5, ×2.0) 9) Automatically transition to each mode 10) Over-voltage protection / In rush current prevention (soft start) / Over current limiter 11) Under Voltage Lockout threshold / Thermal shutdown 12) Small and thin CSP package ●Applications Flash and torch of camera for mobile phone ●Absolute Maximum Ratings (Ta=25℃) Parameter Maximum applied voltage Input voltage Power dissipation Operating temperature range Storage temperature range Symbol VMAX Ratings 7 GND-0.3 ~ VBAT+0.3 1062.5 (Note1) -30 ~ -55 ~ +85 +150 Unit V V mW ℃ ℃ Vdin Pd Topr Tstg (Note1) The measurement value, which was mounted on the PCB by ROHM. Temperature deleting : 8.5mW/℃ from Ta>25℃ ●Operating conditions (Ta=-30 ~ 85℃) Parameter Battery Power Supply voltage Symbol VBAT Ratings 2.7 - 5.5 Unit V www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/12 2011.04 - Rev.A BD7700GU ●Electrical Characteristics (Unless otherwise noted, Ta = 25℃, VBAT=3.6V) Parameter Logic control terminal Low threshold voltage High threshold voltage High level Input current Low level Input current DC/DC Converter Quiescent Current Flash Current Accuracy Torch Current Accuracy Indicate Current Accuracy Current Consumption 1 Current Consumption 2 Current Consumption 3 ISET Voltage Switching frequency Sat Voltage Over voltage protection Under voltage lock-out Start up time Iq Iflash Itorch Iind Idd1 Idd2 Idd3 Viset Fsw Vsat Vovp Vuvlo Tstart -15 -15 -30 0.5 1.0 150 5.5 1.8 0.1 0 0 0 1.0 6.0 9.0 0.6 1.25 250 2.0 1.0 15 15 30 2.0 9.0 12.0 0.7 1.5 350 2.2 3 μA % % % mA mA mA V MHz mV V V ms VthL2 VthH2 IinH2 IinL2 1.2 -1 18.3 0 0.4 33 V V μA μA Symbol Limits Min. Typ. Max. Units Technical Note Condition CNT0 and CNT1 port CNT0 and CNT1 port CNT0 or CNT1 = 5.5V CNT0 or CNT1 = 0V CNT0 and CNT1 = ‘0’ 100mA 20mA 1mA,LED2 Terminal X1.0 mode, LED current = 0mA X1.5 mode, LED current = 0mA X2.0 mode, LED current = 0mA VOUT-LED Voltage(VLED=3V) VOUT Limit UVLO Detect Voltage Stand by → Torch,Flash,Indicate www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/12 2011.04 - Rev.A BD7700GU ●Package Outline Technical Note Fig.1. Package outline Fig.1. Package outline www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/12 2011.04 - Rev.A BD7700GU ●Block Diagram C1 C1N VBAT CHPREG CIN C1P C2N C2 C2P VOUT Technical Note CHP_TOP COUT CNT0 CNT1 VOUTDET LEDDRVTOP LEDDRV LEDDRV LEDDRV LED1 LED2(Indicate out) LED3 DIGTOP OSC REF_DP ISET RSET GND C1, C2, CIN : 2.2µF COUT :4.7µF ISETDRV Fig-2. Block Diagram ●Pin Location Bottom View D C1N C2N C2P C1P C GND CNT0 CNT1 VBAT B ISET LED3 VOUT A GND 1 VBAT 2 LED2 3 LED1 4 Fig-3. Pin Location www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/12 2011.04 - Rev.A BD7700GU ●Terminals No. C4 A2 C2 C3 B4 A4 A3 B3 B1 D4 D1 D3 D2 C1 A1 Pin Name VBAT VBAT CNT0 CNT1 VOUT LED1 LED2 LED3 ISET C1P C1N C2P C2N GND GND In/ Out In In Out Out Out Out In In/Out In/Out In/Out In/Out Type A A G G A D D D B B A B A F F ESD Diode for Power VBAT VBAT VBAT VBAT VBAT VBAT VBAT for GND GND GND GND GND GND GND GND GND GND GND GND GND GND Functions Battery power supply pin Battery power supply pin LED control input ‘1’: On, ‘0’: Off LED control input ‘1’: On, ‘0’: Off Output Voltage Current drive out for Torch,Flash Technical Note Current drive out for Torch,Flash,Indicate Current drive out for Torch,Flash Resistor connection for LED current setting Positive terminal of transfer capacitor 1 Negative terminal of transfer capacitor 1 Positive terminal of transfer capacitor 2 Negative terminal of transfer capacitor 2 Ground pin Ground pin Total : 15 Pin Type-A PAD GND Type-D PAD GND Type-G VBAT PAD GND VOUT Type-B VBAT PAD GND Type-E PAD GND Type-C VBAT PAD GND VBAT Type-F VBAT PAD www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/12 2011.04 - Rev.A BD7700GU ●Functional Description 1. “FLASH” and “TORCH” and “Indicate” pin control “FLASH” and “TORCH” select “FLASH” and “TORCH” is selected by “CNT0” and “CNT1” pin. Status is as bellows. CNT1 0 0 1 1 CNT0 0 1 0 1 All LED OFF Indicate TORCH FLASH Status Technical Note “FLASH” control “FLASH” status turns “High”, Flash LED Current is occurred, and “FLASH” status turns “Low”, Flash LED Current is OFF. “FLASH” status is set by CNT0 pin = “1” and CNT1 pin = “1”. Flash term is maximum 1s by internal timer. CNT1 CNT0 1s 300mA ILED (0mA) Fig-4. FLASH control and LED Current CNT1 CNT0 1s 300mA ILED (0mA) Fig-5. FLASH control and LED Current (with Timer Limit) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/12 2011.04 - Rev.A BD7700GU Technical Note “TORCH” control “TORCH” status turns “High”, LED Current is occurred at 60mA(Torch Mode, 3 channel total), and “TORCH” status turns “Low”, LED Current is OFF. “TORCH” status is set by CNT0 pin = “0” and CNT1 pin = “1”. CNT1 CNT0 ILED (0mA) 60mA Fig-6. TORCH control and LED Current “Indicate” control “Indicate” status turns “High”, LED2 Current is occurred at １ mA.LED1 and LED3 Current is occurred at 0mA.Indicate” status turns “Low”, LED Current is OFF. “Indicate” status is set by CNT0 pin = “1” and CNT1 pin = “0”. CNT1 CNT0 ILED1 (0mA) 1mA Fig-7. Indicate LED control and Indicate LED Current 2. LED Current control by “Rset” The setting of Rset controls LED current, and following equation shows the LED current(@1ch). ILED = 1200 / Rset (Flash) ILED = 240 / Rset (Torch) ILED = 12 / Rset (Indicate) Then, follows Table shows the LED current(@1ch) for some Rset settings.(Typical) Rset ILED(FLASH) ILED(TORCH) ILED(Indicate) 120kΩ 10mA 2mA 0.1mA 62kΩ 20mA 4mA 0.2mA 30kΩ 40mA 8mA 0.4mA 20kΩ 60mA 12mA 0.6mA 15kΩ 80mA 16mA 0.8mA 12kΩ 100mA 20mA 1mA Ratio of Flash and Torch current deviates from 5:1 by RSET value in light-load of LED current. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/12 2011.04 - Rev.A BD7700GU Technical Note 3. Charge pump mode transition The charge pump mode is automatically and optimally changed. (From x1 mode to x1.5 mode) (From x1.5 mode to x2.0 mode) Power supply voltage goes down and this IC can’t keep constant LED current, then the mode transition will start. (From x1.5 mode to x1 mode) (From x2.0 mode to x1.5 mode) Power supply voltage goes up and the detection of VOUT and VBAT is worked, then the mode transition will start. 4. Over voltage and current protection This IC has VOUT over voltage and current protection for VOUT. Even if LED pins are open, VOUT voltage is kept below limit voltage. Even if VOUT pin is short to GND, current limiter works and restrains VBAT current. UVLO function This IC is shut down when VBAT is under Vuvlo voltage. This IC automatically return initial operation when VBAT is up to Vuvlo voltage, and IC will return to normal operation. Thermal shutdown function This IC has a thermal shut down function. It works above 175℃, and under the situation, IC will change the status from active to inactive. To become under 175℃, IC will return to normal operation. 5. 6. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/12 2011.04 - Rev.A BD7700GU ●Selection of external parts Recommended external parts are as shown below. When to use other parts than these, select the following equivalent parts. ・Capacitor Value 【 CIN 】 2.2µF 【 COUT 】 4.7µF 【 C1, C2 】 2.2µF MURATA GRM155B30J225ME 1.0 0.5 0.5 B MURATA GRM188B31A475KE15D 1.6 0.8 0.8 B MURATA GRM155B30J225ME 1.0 0.5 0.5 B Manufacturer Product number Vertical size Size Horizontal size Technical Note Height Temp. Chara. Rated Voltage 6.3V 10V 6.3V [LED specification] This IC targets to drive high power LED. Available VF(Forward voltage) range of LED is as follows. Typ VF 3.4V Max 5V at 100mA/1ch , Ta=25℃ Note) LED VF range has Temperature characteristics. It is necessary tochoice suitable LED characteristics at LED Current setting. Available LED terminal Voltage range is changed by LED current. LED Current vs LED Terminal Voltage 6 5.5 Max LED Voltage[V] 5 4.5 4 3.5 3 0 100 LED Current [mA] 200 Limit by OVP-0.3V Ron(x2.0)=1.76Ω www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/12 2011.04 - Rev.A BD7700GU Technical Note ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not tocause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/12 2011.04 - Rev.A BD7700GU Technical Note (12) Not connecting input terminals In terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. Unstable state occurs from the inside gate voltage of p-channel or n-channel transistor into active. As a result, power supply current may increase. And unstable state can also cause unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the power supply or GND line. (13) Thermal shutdown circuit (TSD) When junction temperatures become setting temperature or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (14) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/12 2011.04 - Rev.A BD7700GU ●Ordering part number Technical Note B Part No. D 7 Part No. 7700 7 0 0 G U - E 2 Package GU : VCSP85H2 Packaging and forming specification E2: Embossed tape and reel VCSP85H2 (BD7700GU) 1PIN MARK Tape 2.24±0.1 Embossed carrier tape 3000pcs E2 The direction is the 1pin of product is at the upper left when you hold Quantity 0.25±0.1 1.0MAX 2.24±0.1 15- φ 0.3± 0.05 0.05 A B (φ0.15)INDEX POST D C B A Direction of feed S ( reel on the left hand and you pull out the tape on the right hand ) 0.08 S A B P=0.5×3 0.37±0.1 0.37±0.1 1 P=0.5×3 2 3 4 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/12 2011.04 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. 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If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A