TMA124S-L

TMA12x Series Triac (Bidirectional Triode Thyristor) Features and Benefits Description ▪ Exceptional reliability ▪ Small fully-molded SIP package with heatsink mounting for high thermal dissipation and long life ▪ VDRM of 400 or 600 V ▪ 12 ARMS on-state current ▪ Uniform switching ▪ UL Recognized Component (File No.: E118037) (suffix I) This Sanken triac (bidirectional triode thyristor) is designed for AC power control, providing reliable, uniform switching for full-cycle AC applications. D es ig ns In comparison with other products on the market, the TMA12x series provides increased isolation voltage (1800 VACRMS), guaranteed for up to 1 minute, and greater peak nonrepetitive off-state voltage, VDSM (700 V). In addition, commutation dv/dt and (dv/dt)c are improved. ew Applications Package: 3-pin SIP (TO-220F) en de d fo rN ▪ Residential and commercial appliances: vacuum cleaners, rice cookers, TVs, home entertainment ▪ White goods: washing machines ▪ Office automation power control, photocopiers ▪ Motor control for small tools ▪ Temperature control, light dimmers, electric blankets ▪ General use switching mode power supplies (SMPS) Typical Applications ot R ec o m m Not to scale N Halogen Lamp Gate Controller Heater control (for example, LBP. PPC, MFP) 28105.12 Two-phase motor control (for example, washing machine) In-rush current control (for example, SMPS) TMA12x Series Triac (Bidirectional Triode Thyristor) Selection Guide Part Number VDRM (V) UL-Recognized Component Package Packing 400 400 600 600 Yes – Yes – 3-pin fully molded SIP with heatsink mount 50 pieces per tube TMA124(I) TMA124S-L TMA126(I) TMA126S-L TMA124x VDRM Peak Non-Repetitive Off-State Voltage TMA126x TMA124x VDSM TMA126x AC RMS applied for 1 minute between lead and case VISO RMS On-State Current IT(RMS) Surge On-State Current ITSM RGREF = ∞ ew Isolation Voltage RGREF = ∞ D Peak Repetitive Off-State Voltage Notes es ig Symbol 50/60 Hz full cycle sine wave, total Conduction angle (α+) + (α–) = 360°, TC = 77°C rN Characteristic ns Absolute Maximum Ratings f = 60 Hz Full cycle sine wave, peak value, non-repetitive, initial TJ = 125°C fo f = 50 Hz Rating Units 400 V 600 V 500 V 700 V 1800 V 12 A 126 A 120 A I2t Value for 50 Hz half cycle sine wave, 1 cycle, ITSM = 120 A 72 A2 • s Peak Gate Current IGM f ≥ 50 Hz, duty cycle ≤ 10% 2 A PGM f ≥ 50 Hz, duty cycle ≤ 10% de Peak Gate Power Dissipation PGM(AV) TJ Tstg 5 W 0.5 W –40 to 125 ºC –40 to 125 ºC m Junction Temperature Storage Temperature TJ < TJ(max) en Average Gate Power Dissipation d I2t Value for Fusing m Thermal Characteristics May require derating at maximum conditions Symbol ec o Characteristic RθJC Test Conditions For AC Value Units 3.5 ºC/W R Package Thermal Resistance (Junction to Case) N T2 ot Pin-out Diagram Terminal List Table G T1 1 2 3 Number Name 1 T1 Main terminal, gate referenced Function 2 T2 Main terminal connect to signal side 3 G Gate control All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, TA, of 25°C, unless otherwise stated. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 TMA12x Series Triac (Bidirectional Triode Thyristor) ELECTRICAL CHARACTERISTICS Symbol Off-State Leakage Current IDRM On-State Voltage VTM Test Conditions Min. Typ. Max. Unit VD = VDRM, TJ = 125°C, RGREF = ∞ using test circuit 1 – – 2.0 mA VD = VDRM, TJ = 25°C, RGREF = ∞ using test circuit 1 – – 100 μA IT = 17 A, TJ = 25°C Quadrant I: T2+, G+ Gate Trigger Current Quadrant II: T2+, G– IGT VD = 12 V, RL = 20 Ω, TJ = 25°C VGD (dv/dt)c – – Quadrant I: T2+, G+ – Quadrant II: T2+, G– Critical Rising Rate of Off-State Voltage during Commutation* V V Quadrant III: T2–, G– VD = 12 V, RL = 20 Ω, TJ = 25°C VD = VDRM × 0.5, RL = 4 kΩ, TJ = 125°C 1.5 V 1.5 V – 30 mA – – 30 mA – 30 mA 0.2 – – V 10 – – V/μs ew TJ = 125°C, VD = 400 V, (di/dt)c = –6 A/ms, ITP = 2 A fo rN *Where ITP is the peak current through T2 to T1. – – – Quadrant III: T2–, G– Gate Non-trigger Voltage 1.5 1.5 es ig VGT – – D Gate Trigger Voltage – – ns Characteristics Gate Trigger Characteristics +T2 Quadrant II Quadrant I de d Test Circuit 1 m ∞ T2 [ + ] G[–] G[+] T1 [ – ] m RGREF = T2 [ + ] en T2 G T1 [ – ] –IGT T2 [ – ] ot N T2 [ – ] G[–] R ec o T1 G[+] T1 [ + ] Quadrant III +IGT T1 [ + ] –T2 Quadrant IV Polarities referenced to T1 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 3 TMA12x Series Triac (Bidirectional Triode Thyristor) Commutation Timing Diagrams Supply VAC Q es ig A ns Q4 ew D A = Conduction angle rN VGT Q ITSM ec o m m en de d fo VGATE On-State Currrent N ot R Q Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 4 TMA12x Series Triac (Bidirectional Triode Thyristor) Performance Characteristics at TA = 25°C 140 100 f = 50 Hz full cycle sine wave total Conduction angle (A+) + (A–) = 360° initial TJ = 125°C 120 TJ = 125°C 100 80 ns Surge On-State Current versus Quantity of Cycles ITSM (A) 60 TJ = 25°C 1 40 es ig Maximum On-State Current versus Maximum On-State Voltage IT (max) (A) 10 20 0 1.0 1.4 1.8 2.2 2.6 VT (max) (V) 3.0 3.4 3.8 150 20 16 8 TC (°C) rN 10 25 2 4 6 8 10 12 IT(RMS)(max) (A) 14 0 16 0 en 0 100 m VGT (–40°C) =2V VGM = 10 V m VG (V) VGT (25°C) = 1.5 V PGM = 5 W ec o PG(AV) = 500 mW R 1 ot 100 6 8 10 IT(RMS) (A) 12 14 16 Quadrant I (T2+, G+), Quadrant II (T2+, G–), and Quadrant III (T2–, G–) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 VGD = 0.2 V 1000 0 –60 –40 –20 10 000 0 20 IG (mA) 40 60 80 100 120 140 TJ (°C) N 10 Proportional Change of Typical Trigger Voltage versus Junction Temperature IGT (–40°C) = 100 mA IGT (25°C) = 30 mA 0.1 4 1.8 IGM = 2 A 10 2 2.0 VGT (TJ) (V) / VGT (TJ = 25°C ) (V) 0 de 2 77°C 50 d 4 10 10 RGREF = 1 kΩ Quadrant III (T2–, G–) 1 Proportional Change of Typical Holding Current versus Junction Temperature Quadrant I (T2+, G+) and Quadrant II (T2+, G–) 0.1 –60 –40 –20 0 20 40 60 80 100 120 140 TJ (°C) IH (TJ) (A) / IH (TJ = 25°C ) (A) IGT (TJ) (A) / IGT (TJ = 25°C ) (A) 75 fo PT(AV) (W) 100 Case Temperature versus On-State RMS Current 12 6 Proportional Change of Typical Trigger Current versus Junction Temperature 100 full cycle sine wave total Conduction angle (A+) + (A–) = 360° 125 14 Gate Voltage versus Gate Current 10 Quantity of Cycles ew full cycle sine wave total Conduction angle (A+) + (A–) = 360° 18 On-State Average Power Dissipation versus Maximum On-State RMS Current 1 D 0 0.6 1 0.1 –60 –40 –20 0 20 40 60 80 100 120 140 TJ (°C) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 5 TMA12x Series Triac (Bidirectional Triode Thyristor) Transient Thermal Impedence versus Triac Voltage Pulse Duration For AC D ew 1 d fo rN ZQJC (°C/W) es ig ns 10 0.1 0.01 0.1 de 0.001 1 10 100 N ot R ec o m m en QT (s) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 TMA12x Series Triac (Bidirectional Triode Thyristor) 4.0 –0.3 +0.2 TO-220F Package Outline Drawing 4.2 ±0.2 2.8 ±0.2 es ig 2.6 ±0.1 rN XXXXXXXX XXXXX ew 0.8 ±0.2 Branding Area D Ø3.3 ±0.2 16.9 ±0.3 8.4 ±0.2 0.5 ±0.1 × 45° 2.2 ±0.2 1.35 ±0.15 1.35 ±0.15 ns 10.0 ±0.2 +0.2 fo de d (13.5) +0.2 0.85 –0.1 3.9 ±0.2 0.45 –0.1 View A View B m m en 2.54 ±0.1 Terminal dimension at lead tips 2 3 ec o 1 0.7 MAX View B R View A 0.7 MAX N ot Gate burr: 0.3 mm (max.), mold flash may appear at opposite side Terminal core material: Cu Terminal treatment: Ni plating and Pb-free solder dip Leadform: 600 Package: TO-220F (FM20) Branding codes (exact appearance at manufacturer discretion): 1st line, type: MA12x 2nd line, lot: YM Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) Leadframe plating Pb-free. Device meets RoHS requirements. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 TMA12x Series Triac (Bidirectional Triode Thyristor) Packing Specification 7 D 530 es ig ns Tube Packing fo rN ew 35 ec o m m en de d 540 172 N ot R 110 50 pieces per tube 25 tubes per layer 3 layers per carton 3750 pieces per outer carton Dimensions in mm Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 TMA12x Series Triac (Bidirectional Triode Thyristor) rN ew D es ig ns Bulk Packing d fo 165 en 36 405 N ot R ec o m m 175 de 430 123 200 pieces per tray 5 trays per inner carton 4 inner cartons per outer carton 4000 pieces maximum per outer carton Dimensions in millimeters Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9 TMA12x Series Triac (Bidirectional Triode Thyristor) WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Precautions must be taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment. D Heatsink Mounting Method Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials SC102 Dow Corning Toray Silicone Co., Ltd. rN Diameter of Heatsink Hole: < 4 mm. The deflection of the press mold when making the hole may cause the case material to crack at the joint with the heatsink. Please pay special attention for this effect. fo • Soldering • de en m m ec o R ot N Type Torque When Tightening Mounting Screws. Thermal resistance increases when tightening torque is low, and radiation effects are decreased. When the torque is too high, the screw can strip, the heatsink can be deformed, and distortion can arise in the product frame. To avoid these problems, observe the recommended tightening torques for this product package type 0.490 to 0.686 N•m (5 to 7 kgf•cm). ew • d Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress. • Coat the back surface of the product and both surfaces of the insulating plate to improve heat transfer between the product and the heatsink. • Volatile-type silicone greases may permeate the product and produce cracks after long periods of time, resulting in reduced heat radiation effect, and possibly shortening the lifetime of the product. • Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: es ig ns The use of an isolation transformer is recommended during circuit development and breadboarding. • When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10 s 350±5°C 3s Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge • When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance to ground to prevent shock hazard. • Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. • The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 10 TMA12x Series d fo rN ew D es ig ns Triac (Bidirectional Triode Thyristor) de The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. en Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this publication is current before placing any order. m m When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users responsibility. ec o Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. ot R Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation hardness assurance (e.g., aerospace equipment) is not supported. N When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your specifications. The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited. The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or any other rights of Sanken or Allegro or any third party that may result from its use. Anti radioactive ray design is not considered for the products listed herein. Copyright © 2008-2009 Allegro MicroSystems, Inc. This datasheet is based on Sanken datasheet SSE-22885 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 11 TMA12x Series Triac (Bidirectional Triode Thyristor) ns Worldwide Contacts Singapore Sanken Electric Singapore Pte. Ltd. es ig Asia-Pacific China Sanken Electric Hong Kong Co., Ltd. 150 Beach Road, #14-03 The Gateway West Singapore 189720 Tel: 65-6291-4755, Fax: 65-6297-1744 ew D Suite 1026, Ocean Centre Canton Road, Tsimshatsui Kowloon, Hong Kong Tel: 852-2735-5262, Fax: 852-2735-5494 Europe Sanken Power Systems (UK) Limited rN Sanken Electric (Shanghai) Co., Ltd. Pencoed Technology Park Pencoed, Bridgend CF35 5HY, United Kingdom Tel: 44-1656-869-100, Fax: 44-1656-869-162 fo Room 3202, Maxdo Centre Xingyi Road 8, Changning District Shanghai, China Tel: 86-21-5208-1177, Fax: 86-21-5208-1757 North America United States Allegro MicroSystems, Inc. de m m Japan Sanken Electric Co., Ltd. Overseas Sales Headquarters en Room 1801, 18th Floor 88 Jung Shiau East Road, Sec. 2 Taipei 100, Taiwan R.O.C. Tel: 886-2-2356-8161, Fax: 886-2-2356-8261 d Taiwan Sanken Electric Co., Ltd. Allegro MicroSystems, Inc. 14 Hughes Street, Suite B105 Irvine, California 92618, U.S.A. Tel: 1-949-460-2003, Fax: 1-949-460-7837 R ec o Metropolitan Plaza Building 1-11-1 Nishi-Ikebukuro, Toshima-ku Tokyo 171-0021, Japan Tel: 81-3-3986-6164, Fax: 81-3-3986-8637 115 Northeast Cutoff Worcester, Massachusetts 01606, U.S.A. Tel: 1-508-853-5000, Fax: 1-508-853-7895 N ot Korea Sanken Electric Korea Co., Ltd. Samsung Life Yeouido Building 16F 23-10, Yeouido-Dong, Yeongdeungpo-gu Seoul 150-734, Korea Tel: 82-2-714-3700, Fax: 82-2-3272-2145 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 12