STT8205S
Elektronische Bauelemente 6 A, 20V,RDS(ON) 28mΩ
N-Channel Enhancement Mode Power Mos.FET
RoHS Compliant Product
Description
The STT8205S provide the designer with best combination of fast switching, low on-resistance and cost-effectiveness. The TSSOP-6 package is universally used for all commercialindustrial surface mount applications.
Features
* Low Drive Current * Low On-Resistance * Capable of 2.5V Gate Drive
D1 S1 5 D2 4
D1
D2
6
REF. A A1 A2 c D E E1
Date Code
8205S
G1
G2
1 G1 2 S2 3 G2
S1
S2
Millimeter Min. Max. 1.10 MAX. 0 0.10 0.70 1.00 0.12 REF. 2.70 3.10 2.60 3.00 1.40 1.80
REF. L L1 b e e1
Millimeter Min. Max. 0.45 REF. 0.60 REF. 0° 10° 0.30 0.50 0.95 REF. 1.90 REF.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current,VGS@4.5V Continuous Drain Current,VGS@4.5V Pulsed Drain Current 1 Total Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Range Tj, Tstg
3 3
Symbol
VDS VGS ID@TA=25 C ID@TA=70 C IDM PD@TA=25 C
o o o
Ratings
20
±8 6 4.8 20 1.14 0.01 -55~+150
Unit
V V A A A W
W/ C
o o
C
Thermal Data
Parameter
Thermal Resistance Junction-ambient3 (Max)
Symbol
Rthj-a
Ratings
110
o
Unit
C /W
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Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 1 of 4
STT8205S
Elektronische Bauelemente 6 A, 20V,RDS(ON) 28mΩ
N-Channel Enhancement Mode Power Mos.FET
Electrical Characteristics( Tj=25 C Unless otherwise specified)
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25oC) Drain-Source Leakage Current (Tj=70 C) Static Drain-Source On-Resistance2
o
o
Symbol
BVDSS BVDS/ Tj VGS(th) IGSS IDSS
Min.
20
_
Typ.
_
Max.
_ _
Unit
V V/ oC V uA uA uA
Test Condition
VGS=0V, ID= 250uA Reference to 25oC ,ID= 1mA VDS=VGS, ID= 250uA VGS=± 8V VDS=20V,VGS=0 VDS= 16V,VGS=0 VGS=4.5 V, ID= 6 A
0.03
_ _ _ _
0.5
_ _ _ _
1.5
± 100
1 25 28
_ _ 23 4.5 7 30 70 40 65 1035 320 150 20
RDS(ON) Qg Qgs Qgd Td(ON) Tr Td(Off) Tf Ciss Coss Crss Gfs
_ _ _ _ _ _ _ _ _ _ _
mΩ
38
_ _ _ _ _ _ _ _ _ _
VGS= 2.5V, ID=5.2 A
Total Gate Charge 2 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time2 Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance
nC
ID=6 A VDS= 20V VGS= 5V
VDD= 10V ID= 1 A nS VGS=5 V RG=6 Ω RD=10 Ω
pF
VGS=0V VDS= 20V f=1.0MHz
_
_
S
VDS=10 V, ID=6 A
Source-Drain Diode
Parameter
Forward On Voltage 2
Symbol
VS D
Min.
_
Typ.
_
Max.
1.2
Unit
V
Test Condition
IS=1.7 A , VGS=0V.
Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse width≦300us, dutycycle≦2%.
3.Surface mounted on 1 in copper pad of FR4 board; 180 OC/W when mounted on min. copper pad.
2
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Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 2 of 4
STT8205S
Elektronische Bauelemente 6 A, 20V,RDS(ON) 28mΩ
N-Channel Enhancement Mode Power Mos.FET
Characteristics Curve
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. RDSON v.s. Junction Temperature
Fig 4. Normalized On-Resistance v.s. Junction Temperature
Fig 5. Forward Characteristics of Reverse Diode
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Fig 6. Gate Threshold Voltage v.s. Junction Temperature
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 3 of 4
STT8205S
Elektronische Bauelemente 6 A, 20V,RDS(ON) 28mΩ
N-Channel Enhancement Mode Power Mos.FET
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
180
/W
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
http://www.SeCoSGmbH.com/
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 4 o f 4
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