ERT801

Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Specification ERT801 SSC Drawn Approval CUSTOMER Approval Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet ERT801 1. Features 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Outline Dimension 6. Packing 7. Soldering 8. Precaution for use Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet ERT801 Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. 사진 ERT801 Features • Industry Standard PLCC SMT package • High brightness using AlInGaP and InGaN dice technologies • Available in multiple colors • High volume, high reliability Applications • Interior automotive • Electronic Signs and Signals • Office Automation, Electrical Appliances, Industrial Equipment Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 1. Features • RED colored SMT package • Material AlGaInP • Suitable for all SMT assembly methods Suitable for all soldering methods • RoHS Compliant Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Symbol Pd IF IFM *2 VR Topr Tstg Value 80 30 90 5 -40 ~ +100 -40 ~ +100 Unit mW mA mA V oC oC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric characteristics Parameter Forward Voltage Reverse Current Luminance Intensity *1 Peak Wavelength Dominant Wavelength Spectral Bandwidth 50% Viewing Angle *2 Symbol VF IR IV Condition IF =20mA VR=5V IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA Min 1.7 50 630 Typ 2.0 90 650 635 18 120 Max 2.3 10 130 640 Unit V µA mcd nm nm nm deg. λP λd ∆λ 2θ ½ *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. Document No. : SSC-QP-7-07-24 (Rev.00) Relative Luminous Intensity Iv/Iv [Rel] Forward Current IF [mA] Forward Current IF [mA] Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Forward Current vs. Forward Voltage (Ta=25 OC ) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 10 1 1.6 1.7 1.8 1.9 2.0 2.1 0 5 10 15 20 25 30 Forward Voltage VF (V) Forward Current IF [mA] Forward Curve 40 Current Derating (Ta=25 OC ) Radiation Diagram 0 30 -3 0 30 20 -6 0 60 10 -9 0 0 -40 -20 0 20 40 60 80 100 120 90 Ambient Temperature TA [OC] Document No. : SSC-QP-7-07-24 (Rev.00) Cathode Cathode Mark 2.2 ( Tolerance: ±0.2, Unit: mm ) 6. packing 1.75±0.1 2 .0 ± 0 .0 5 4 .0 ±0 .1 1 .5 5 ± 0 .0 5 0 .2 2 ±0 .0 5 3.5±0.1 8±0.1 5° 1 .0 ±0 .1 3 .1 ±0 .1 8° 3.83±0.1 11.4 ± 0.1 180 +0 -3 2.0 ± 0.2 LABLE 13 ±0.2 9.0 ± 0.3 30° 10 22 (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 60 Document No. : SSC-QP-7-07-24 (Rev.00) 1.8 2 .2 2 ±0 .1 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 5.outline dimension Recommended Solder Pattern 2.8 2.2 0.15 0.8 1.9 0.8 Anode 1.8 1.6 3.2 2.4 1.6 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUM BER : SEOUL SEMICONDUCT OR CO., LTD. HUMIDIT Y INDICATOR DE SI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUM BER : XXXXXXXXXX PART NUMBER : SEOUL SEM IC ONDU CTOR CO., LTD. Outer Box Structure M aterial : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c QUANTITY : XXXX LOT NUM BER : XXXXXXXXXX PART NUMBER : SEOUL SEM IC ONDU CTOR CO., LTD. RoHS 1 b a Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 7. soldering (1) Lead Solder Lead Solder Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150℃ 120 sec. Max. 240℃ Max. 10 sec. Max. 2.5~5 C / sec. 2.5~5 o C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder L ea d -fra m e Solder Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200℃ 120 sec. Max. 260℃ Max. 10 sec. Max. 1~5 o C / sec. 1~5 o C / sec. Pre-heating 150~200 o C 26 0 oC M ax. 10 sec. M ax. 60sec. M a x. A b o ve 220 oC 120sec. M ax. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 8. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. Document No. : SSC-QP-7-07-24 (Rev.00)