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E_contents.fm Page 0 Friday, July 20, 2007 3:19 PM CONTENTS Advanced Measures for Environmental Conservation as Management Policy........................................................... PACKAGES 2 STN CSTN TFT CG Silicon LCD Modules ....................................................................... CSP (Chip Size Package)..................................................... LGA (Land Grid Array Package) ........................................... SiP (System in Package) ...................................................... SOF (System On Film) ......................................................... Package Lineup .................................................................... 55 56 57 59 60 8 EL EL Display Modules.............................................................. 14 LSI REG CMOS IMAGE SENSORS CMOS Camera Modules ...................................................... 15 CCDs Higher-resolution CCDs ....................................................... 1/3-type CCDs...................................................................... 1/3.8-type CCD .................................................................... 1/4-type CCDs...................................................................... 1/3-type CCDs with Dual-power-supply (5 V/12 V) Operation ............................................................................. CCD Peripheral ICs/LSIs...................................................... 16 16 17 17 17 18 LSIs FOR LCDs/ANALOG ICs For Notebook PCs, PC Monitors and LCD TVs.................... For Mobile Equipment .......................................................... For Mobile Phones ............................................................... Peripheral ICs for LSIs for LCDs .......................................... 25 26 27 29 SYSTEM LSIs Special-function LSIs ........................................................... 31 IPs ........................................................................................ 32 SMART CARD SYSTEMS Smart Cards/LSI Modules for Smart Cards ......................... 33 Reader/Writer for Smart Cards ............................................ 34 SDK (Software Development Kit) for Smart Cards............... 34 FLASH MEMORIES AND COMBINATION MEMORIES FLASH MEMORIES ............................................................. SYSTEM-FLASH ................................................................. HIGHLY FUNCTIONAL FLASH MEMORIES Boot Block Type 3 V Page Mode Flash Memories................ STANDARD FLASH MEMORIES Boot Block Type 3 V Flash Memories................................... SYSTEM-FLASH Fast-Reprogramming System-Flash for Digital Equipment .. System-Flash for Amusement Products............................... System-Flash for Automotive Use ........................................ System-Flash for Network Equipment.................................. COMBINATION MEMORIES Boot Block Type Flash Memory + Pseudo SRAM ................ 35 36 38 38 39 39 40 40 41 POWER DEVICES/ANALOG ICs Low Power-Loss Voltage Regulators.................................... Surface Mount Type Low Power-Loss Voltage Regulators ... Surface Mount Type Chopper Regulators (DC-DC Converters)............................................................. Chopper Regulators (DC-DC Converters) ........................... Power Supply ICs for CCDs/CCD Camera Modules ............ Power Supply ICs for TFT-LCDs........................................... Fail Safe IC........................................................................... LED Drivers.......................................................................... Laser Diode Drivers ............................................................. ANALOG ICs Video Interface ICs for TFT-LCDs......................................... Power Amplifiers for Wireless LAN....................................... ICs for Audio Equipment ...................................................... 42 44 48 49 50 50 51 51 52 53 53 54 OPTO OPTOELECTRONICS Photocoupler Index Tree .................................................... Photocouplers Phototransistor Output....................................................... OPIC Output ...................................................................... Phototriac Coupler Index Tree ........................................... Phototriac Couplers .............................................................. Solid State Relay Index Tree .............................................. Solid State Relays ................................................................ Photointerrupter Index Tree ............................................... Photointerrupters ................................ Single Phototransistor Output............................................ Darlinton Phototransistor Output ....................................... OPIC Output ...................................................................... Photointerrupters ..................................... Single Phototransistor Output............................................ Darlinton Phototransistor Output ....................................... OPIC Output ...................................................................... Photointerrupters for Specific Applications ........................... Transmissive Type.............................................................. Reflective Type................................................................... Phototransistor Index Tree................................................. Phototransistors.................................................................... Photodiodes/OPIC Light Detectors PIN Photodiodes................................................................... PSD (Position Sensitive Detector) ........................................ Blue Sensitive Photodiodes .................................................. Laser Power Monitoring Photodiodes for Optical Disc System ........................................................ RGB Color Sensor................................................................ Ambient Light Sensors ......................................................... Infrared Emitting Diode Index Tree.................................... Infrared Emitting Diodes ....................................................... Optical-Electric Sensor Index Tree .................................... Distance Measuring Sensor Lineup...................................... Wide Angle Sensor Lineup ................................................... High-Precision Displacement Sensor ................................... Paper Size Sensor Lineup .................................................... Dust Sensor Unit Lineup....................................................... Color Toner Concentration (Deposition Amount) Sensor Lineup................................................................................... Distance Measuring Sensors................................................ Wide Angle Sensors ............................................................. Paper Size Sensors .............................................................. High-Precision Displacement Sensor ................................... Dust Sensor Units................................................................. Color Toner Concentration (Deposition Amount) Sensors .... Fiber Optics Index Tree ...................................................... Fiber Optics Lineup for Audio Equipment ............................. 67 68 72 75 76 78 79 82 83 83 85 85 87 87 88 88 89 89 91 92 93 94 94 94 95 95 95 100 101 102 102 102 102 102 102 102 103 104 105 106 106 106 107 107 E_contents.fm Page 1 Friday, July 20, 2007 3:19 PM Transmission/Reception Devices for MOST Compatible Optical Fiber......................................................................... Fiber Optic Transmitters ....................................................... Fiber Optic Receivers........................................................... Optical Transmission Device ................................................ Optical Reception Device ..................................................... 107 108 109 110 110 Two-In-One RF Units ............................................................ Analog Terrestrial RF Front-End Unit.................................... RF Front-End Units............................................................... 1-Segment Digital Terrestrial Module.................................... 1-segment/3-segment Digital Terrestrial Module .................. USB Interface Wireless LAN Module .................................... 127 128 128 129 129 130 LCD LED LED IR DEVICE 131 132 133 134 135 IC Infrared Data Communication Device Index Tree ............ Infrared Data Communication Devices ................................. Infrared Wireless Audio Transmission Device ....................... IR Detecting Unit for Remote Control Index Tree ............. IR Detecting Units for Remote Control ................................. POWER LASER LASER DIODE Laser Diodes ........................................................................ 120 Switching Power Supplies (Custom)..................................... 137 Switching Power Supply with Integrated High/Low Voltage Circuit (Custom).................................................................... 137 PCB PRINTED CIRCUIT BOARD Advanced Flex Printed Circuit Boards .................................. 138 Flexible Build-up Multilayer PCBs......................................... 139 Flexible Printed Circuit Boards ............................................. 140 RF RF COMPONENTS Low Noise Blockdown Converter Europe: LNB for Broadcasting Satellite ................................ U.S.A.: LNB for FSS Broadcast/(Others: LNB for Communication) ................................................................... Japan/Asia/Australia: LNBs for CS Digital Satellite Broadcast ............................................................................. Japan: LNBs for BS/CS 110° Satellite Broadcast................. Digital DBS Front-End Units................................................. QPSK Demodulator Circuit Built-in Type .............................. 8 PSK Demodulator Circuit Built-in Type.............................. Combination Front-End for Digital Terrestrial and Digital Satellite Broadcasting .......................................................... Digital Terrestrial Front-End Unit .......................................... Front-End Units for ISDB-T/DVB-T....................................... 121 121 122 122 123 124 124 UNIT PICKUP Slim Combo Drive Pickup ..................................................... 141 Slim DVD-ROM Drive Pickup................................................ 141 DVD Pickup for Automotive Use ........................................... 141 125 126 126 INDEX ................................................................................ 142 Optoelectronics LED / Laser Diode 119 119 IR RF Component IR Device 111 113 115 116 117 117 118 118 118 NOTICE .............................................................................. 143 Device for Optical Discs High-Luminosity LED Lamps................................................ LED Lamps .......................................................................... Dichromatic LED Lamps ...................................................... High-Luminosity Chip LEDs ................................................. Chip LEDs ............................................................................ High-Luminosity Dichromatic Type Chip LEDs..................... Dichromatic Type Chip LEDs................................................ High-Luminosity White Type Chip LEDs............................... Pastel Color Chip LEDs........................................................ High-Luminosity Dichromatic Type Chip LEDs (RGB 3-color) ....................................................................... LEDs for Camera Data Back ................................................ Advanced Measures for Environmental Conservation In accordance with environmental guidelines established under Sharp’s Basic Environmental Philosophy, the Sharp Group Charter of Corporate Behavior, and the Sharp Code of Conduct, Sharp is pursuing environmental conservation in all aspects of its business activities. Since fiscal 2004, when the mediumterm brand objective of becoming an environmentally advanced company was first set, Sharp has been promoting the Super Green Strategy to achieve its corporate vision and to establish sustainable manufacturing systems. Basic Environmental Philosophy Creating an Environmentally Conscious Company with Sincerity and Creativity The Sharp Group Charter of Corporate Behavior Contribution to Conservation of the Global Environment The Sharp Group will fulfill our responsibility for environmental conservation by promoting the creation of proprietary technologies that contribute to protection of the global environment, and by carrying out our product development and business activities in an environmentally conscious manner. The Sharp Code of Conduct Contribution to Conservation of the Global Environment 1. To Conserve the Environment: 1 We will comply with all applicable environmental laws, regulations and territorial agreements, and work to practice efficient use and conservation of resources and energy voluntarily, in the recognition that environmental conservation is an essential facet of corporate and individual pursuits. 2 We will ensure proper use and control of chemical substances in our business activities including research, development and manufacturing, meeting or exceeding levels determined by laws and regulations. 3 We will engage in the active acquisition, reporting and promotion of environmental information at an international level, as the Sharp Group companies promote communication with shareholders and local residents. 4 We understand the importance of internal company systems and related details in acquiring third-party certification and recertification of our ISO environmental management systems, and we will conduct our business operations in accordance with relevant internal guidelines. 2. To Develop Environmentally Conscious Products and Services, and Conduct Our Business Operations in an Environmentally Conscious Manner: 1 We will engage positively in the minimization of resource use, reduction in the size and weight of products, use of recycled materials, and the development of long-lasting, energy-saving, energy-creating products. 2 We will work to compile information related to harmful substances that might damage the environment or human health, and will not, as a matter of principle, make use of these harmful substances in our products, services and business activities. 3 We will use recyclable materials wherever possible, with product development focused as a matter of policy on structures that are detachable or capable of dismantling, and suited to recycling. 4 We will work aggressively to reduce greenhouse gas emissions in the full range of our business activities, in order to contribute to the prevention of global warming. 5 We will work to conduct our business in such a way to select and purchase materials that are harmless to the global environment, and to local residents and employees, for the resources needed for business activities (equipment, raw materials, subsidiary materials, tools, etc.). 6 We realize that waste material is a valuable resource, and we will actively conduct our business operations in such a way as to maximize the 3Rs (reduce, recycle and reuse) and will contribute to minimizing the amount of waste sent for permanent landfill disposal. * The Sharp Group Charter of Corporate Behavior and the Sharp Code of Conduct were instituted in May 2005 as a revised edition of the preceding Sharp Charter of Conduct (instituted in 2003). The section above is an excerpt from descriptions of Sharp's environmental conservation efforts. For more information: http://sharp-world.com/corporate/eco/report/index.html 2 as Management Policy Corporate Vision of Achieving “Zero Global Warming Impact by 2010” Sharp will limit to the greatest extent possible the amount of the greenhouse gas emissions resulting from its business activities around the world, while at the same time, significantly help reduce greenhouse gas emissions based on the energy-creating effects of solar cells and the energy-saving effects of products. The idea is for the amount of greenhouse gas emissions reduced to exceed the amount emitted by fiscal 2010. Sharp’s greenhouse gas emissions in fiscal 2006 were approximately 1.73 million t-CO2. At the same time, it is estimated that the solar cells Sharp produced over the 20 years up to fiscal 2005 generated approximately 1,322 GWh*1 in fiscal 2006. This is equivalent to a reduction in greenhouse gas emissions of approximately 0.56 million t-CO2*2 *1 Calculation based on 844 MW, Sharp's total solar cell production over 20 years from 1986 to 2005. *2 Calculated using a CO2 emission unit of 0.425 kg/kWh (fiscal 2005) at the receiving end, announced by the Federation of Electric Power Companies of Japan. Reduce greenhouse gas emissions from worldwide business activities Boost the level of reductions in greenhouse gas emissions from energy created by solar cells and energy saved by products Super Green Strategies to Become an Environmentally Advanced Company SGP/D Super Green Products and Devices SGP/D SGT Super Green Technologies Creating products and devices with high environmental performance Developing unique environmental technologies that contribute to environmental conservation SGT SGR Super Green Recycling Recycling used products to promote resource recycling SGM Super Green Management Enhancing environmental sustainability management SGR SGF SGF Super Green Factories Factories with high environmental consciousness and trust from communities SGM 3 Becoming an Environmentally Advanced Company— Developing Super Green Technologies To achieve Sharp’s corporate vision of becoming a company that has “zero global warming impact by 2010,” the development of superior environmental technologies is an essential factor in the environmental performance of products and devices and the reduction of environmental impact during production. Sharp conducts research and development in four areas of environmental technology: reduction of CO2 emissions, effective use of resources, elimination of use of harmful One-of-a-Kind environmental technological development fields substances, and promotion of health and that give birth to Super Green Technologies cleanliness. Sharp recognizes the most important have no impact on globa l w ar m ies that technologies in these areas as one-of-a kind nolog in g h c e T environmental technologies-key technologies CO2 emission reductions (Energy creation, energy saving) for achieving global environmental conservation-and develops them under a One-of-a-Kind company-wide development strategy. Environmental These technologies enhance environmental Technologies Elimination of performance of products and devices, reduce Health, cleanliness harmful substances environmental impact at plants, and facilitate Effective use of resources recycling. Unique technologies, evolving from (Reduce, reuse, recycle) these developments, are what Sharp calls T ec n h n ol a ti o o gie s n s erv Super Green Technologies. o c l th a a t n t c o n t r i b u t e t o e n v ir o n m e Development of Green Devices and Super Green Devices Sharp calls its environmentally conscious devices “Green Devices.” To define criteria for development and design based on seven concepts such as low energy consumption and recyclability, Sharp established the Green Device Guidelines, which it began applying in fiscal 2004. In fiscal 2005, Sharp began certifying Green Devices that attain the highest possible levels of environmental performance as “Super Green Devices.” The development of Green Devices begins at the planning and designing stage, where every aspect of the product’s environmental impact is discussed. Sharp then sets specific objectives based on the Green Device Standard Sheet. Finally, in the trial manufacture and mass production stages, Sharp determines how well the actual product has met its objectives. In fiscal 2006, both Green Devices and Super Green Devices exceeded their sales ratio targets. In the coming years, Sharp plans to raise these figures even higher. *1 Certification criteria for Green Devices and Super Green Devices in fiscal 2006: Green Devices had to satisfy at least 90% or more of all 20 assessment items (9 of which are compulsory) listed in the Environmental Performance Criteria. Super Green Devices will have to satisfy at least 95% or more the 20 assessment items (10 of which are compulsory) listed in the Environmental Performance Criteria. At the same time, they must be either the industry's No.1, or the industry's first devices in at least one item of the External Environmental Claim Standards. 4 The Green Device concept Energy saving Reduce total power consumption and reduce power consumed in standby mode compared to previous models Recyclability Use standard plastic or materials that are easy to separate and disassemble (target: LCD devices) Resource saving Reduce weight or volume compared to previous models Green material Control usage of chemical substances contained in parts and materials and use no substances prohibited under Sharp standards Long life Extend the life of the product with exchangeable parts and consumables (target: LCD devices) Packaging Reduce packaging materials Information disclosure Provide information on chemical substances Super Green Technologies, Devices and Factories Achievement of a Super Green Factory Sharp is systematically acting to enhance the environmental consciousness of its production sites worldwide. Sharp has established proprietary assessment standards to rank factories with high environmental consciousness as Green Factories, and those with extremely high environmental consciousness as Super Green Factories, Sharp is planning to convert all its production sites around the world into Green Factories or higher by fiscal 2007. The Green Factory concept Greenhouse gases Minimize emission of greenhouse gases Atmosphere, water, soil Minimize environmental burden on the atmosphere, water and soil Energy Minimize energy consumption Harmony with nature Endeavor to preserve nature both on and off site Waste Minimize discharge of waste Harmony with the community Encourage harmony with the local community Resources Minimize resource consumption Environmental consciousness High environmental awareness among employees Chemical substances Minimize risk of environmental pollution and accidents caused by chemical substances Information disclosure Disclose information on the environment Certification of Green Factories and Super Green Factories Quantified environmental performance criteria are used to assess and approve a plant for certification. A plant must score 70 or more points out of a possible 100 in the assessment process to earn Green Factory certification, while scoring 90 or more points will result in Super Green Factory certification. Plans call for turning all Sharp Corporation production sites in Japan into Super Green Factories and all production sites in the Sharp Group to Green Factories or higher by the end of fiscal 2007. In fiscal 2006, three domestic bases and two overseas bases achieved Super Green Factory status, while a total of 10 bases in Japan and overseas earned Green Factory certification. Process required to achieve Super Green Factories Existing factories New factories Green Factory Concept Approach based on environmental impact assessments The plant's environmental performance is assessed from an objective third-party point of view and performance is defined for each item based on the assessment results Assessments based on 21 quantified environmental performance criteria 90 points or more Super Green Factory 90 points or more Super Green Factory 70 points or more Green Factory 5 From “Green” Factories to “Super Green” Factories Sharp’s First Super Green Factory Kameyama Plant AVC Liquid Crystal Display Group (Kameyama, Mie Prefecture) The Kameyama Plant is Sharp's first “Super Green Factory”, a compilation of the company's environmental protection technologies. In preparing for construction, we gave a great deal of careful consideration to protecting the environment, beginning at the initial design stage. Working in consultation with local governments and with nearby residents, we carefully selected the parameters that would be subject to environmental protection measures. We chose the standards that would apply, and confirmed them through evaluation by independent experts. Also, when building the Kameyama Plant No. 2, we took the opportunity to introduce the latest environmental technology to make it one of the world’s most advanced “Super Green” factories. The Kameyama Plant Receives Japan Sustainable Management Award The Kameyama Plant in Japan was recognized for its outstanding environmental sustainability management by being chosen from among 125 applicants for the highest honor, the Sustainable Management Pearl Award, in the 2004 Japan Sustainable Management Awards* (sponsored by the Japan Sustainable Management Awards Committee and Mie Prefecture). This award shows the high esteem for the environmental measures—including 100% recycling of manufacturing process wastewater, the introduction of an LNG cogeneration system and the installation of a photovoltaic power system—taken by the Kameyama Plant, Sharp’s first Super Green Factory. The Kameyama Plant received the first Minister of Economy, Trade and Industry Award in the 8th Japan Water Prize (2006) and the Energy Saving Encouraging Prize in the 4th Excellent Cogeneration System Commendation (FY 2005) sponsored by the Japan Cogeneration Center. * The Japan Sustainable Management Awards honor all organizations across the nation, no matter what their size or type of business—including private companies, NPOs and schools—that demonstrate outstanding results of their environmental sustainability management efforts. An Efficient and Environment-Friendly Integrated Production System The entire process is carried out in a single plant—from fabricating the LCD panels to final assembly. This system makes it possible to consolidate technical departments and strengthen our development capabilities, as well as shorten the lead-time from order to shipping. Eliminating the need to ship sub-assemblies between distant plants has also enabled us to slash the amount of packaging materials required for shipping and reduce emissions such as carbon dioxide (CO2). Countering Global Warming by Unifying Diverse Power Sources Distributed over a Wide Area The Kameyama plant generates one-third of its annual electricity consumption and has reduced CO2 emissions to about 40% lower than previous levels by means of a cogeneration system* using liquefied natural gas (LNG) (approx. 26,400 kW), as well as one of the largest fuel cell systems in Japan (approx. 1,000 kW), and one of the world’s largest photovoltaic (PV) power generation systems (5,210 kW). * Cogeneration system: A system designed to save energy by using city gas to generate electricity. The waste heat generated is then used in applications such as air conditioning, hot water supply and steam electricity generation. Creating Energy at the Factory for Energy-Saving Products, Using One of the World’s Largest* PV Power Generation Systems In addition to the existing 60-kW photovoltaic (PV) power generation system, new PV power generation systems, in a total area of approx. 47,000 m2 and with a total output of 5,150 kW, have been installed. Located at the large-screen LCD TV factory, the distribution building, and on the roof and curtain wall of the Kameyama Plant No. 2, these systems generate an annual electricity output that would power 1,300 average Japanese households. * As a building-installed system. Survey by Sharp. Water Purifying System—100% Water Recycling in the Production Process The plant collects all the wastewater from the production process of liquid crystal panels, etc. (max. 28,300 tons a day) and recycles it 100% with water purification techniques using microorganism treatment. Malodorous wastewater containing chemicals is deodorized using peat moss* from Ishikari River, Hokkaido. * Bog moss decomposed and piled up for several thousands of years. Mie Plant Becomes First Existing Factory to Achieve Super Green Status Mobile Liquid Crystal Display Groups (Taki, Mie Prefecture) The results described above are major efforts in upgrading to a Super Green Factory. Fluoric Acid Effluent Recycling System Honored at 2004 WASTEC Award The Mie Plant No. 3 uses fluoric acid in its continuous grain silicon production process. The plant developed this system and has been using it since 2004 to recover and recycle the fluoric acid effluent. This system was recognized for its excellence and won the Business Activity Category Prize at the 2004 WASTEC (Waste Control and Recycling Technology Exhibition) Awards in Japan in November 2004. Prior to the introduction of this system, the fluoric acid from the effluent was used to make cement. Now it can be used repeatedly at the production site, while the distilled water from the effluent can be used as pure water. Waste Reduction Efforts In 2004, we achieved zero discharge to landfill, eliminating waste by recycling all possible waste materials. Efforts are being made to further reduce emission of waste products by expanding the sale of valuable materials for reuse. Energy-Saving Efforts Since its completion, the Mie Plant has been strongly focused on energy conservation. In fiscal 2006 our efforts were recognized with an Agency for Natural Resources and Energy Director-General Prize for energy-efficient plant management. In addition, three members of the Mie Environmental Safety Promotion Center, who have been engaged in energy-saving efforts for many years, received prizes in recognition of their achievements in energy management. These awards are a testament to Sharp’s energy management and energysaving efforts. CO2 Emissions Reduced through PV Power System Installation The Mie Plant No. 3 installed a 180-kW photovoltaic power system on its south exterior wall. The system began generating electricity in March 2005. Used mainly to provide lighting for all non-manufacturing rooms, the system generated 141,000 kWh of power in 2006 and contributed to the reduction of about 60 tons of CO2 emissions. 6 Participation in Environmental Education Programs at Local Schools As part of our community outreach program, we have been cooperating with eight local schools in the town of Taki (one senior high, two junior high, and five elementary schools) on various educational projects, including factory tours, classes taught by visiting lecturers, and joint environmental activities. Participation in Local Environmental Activities The Mie Plant is actively involved in mitigating the impact of the plant on the surrounding environment, and is also engaged in local environmental preservation activities focused on the area’s mountains, rivers, and roads. We have received acclaim from local people for our participation in these activities, including the upkeep of the local forest as a water source, the maintenance of the neighboring forests and mountains, the cleaning of the Sanagawa River as the plant’s effluent stream, and the planting of flowers on National Route 42. Green Factory Activities at Key Electronic Device Factories Advanced Development and Planning Center/ Corporate Research and Development Group (Tenri, Nara Prefecture) ISO 14001 certification: December 3, 1996 Adoption of a cogeneration system* About 26% of facility power is provided through private power generation. Waste heat is used for heating or cooling and also supplied to a steam generator for power generation. This cuts facility CO2 emissions by about 13%. Municipal gas is supplied by pipeline, so there is no discharge of CO2, nitrogen oxides or other pollutants from truck transport. * An energy saving system that generates power using municipal gas and uses the produced waste heat for heating or cooling, hot water supply and steam electricity generation, etc. Installation of a solar generation system Installation of solar panels with a generating capacity of 40 kW. Relations with the local community As the only Sharp establishment that has an ancient burial mound on its grounds, the center’s employees are actively involved in the maintenance of the mound. In August of each year, the center invites employees and their families and local people to a “Sharp Festa.” An environmental exhibition space is prepared to showcase the environmental activities of the center. Waste fluid processing system based on natural purification* Waste and the pollution load of released water are reduced by using a waste fluid treatment system for waste water containing alcohol or other organic components. After treatment, water is given further high-level treatment and used as intermediate factory water, to ensure more effective use of water resources. * A natural purification system based on micro-organisms, developed independently by Sharp. (Patented) Promotion of zero emissions* Zero emissions were achieved in 2002 through reclamation of waste into useful resources for other business fields. Efforts will continue to further reduce waste emissions. LSI Group (Fukuyama, Hiroshima Prefecture) ISO 14001 certification: September 24, 1996 Inauguration of a non-dilution nitrogen treatment plant The Group built a new plant that uses the world’s first non-dilution treatment technology on the nitrogen contained in semiconductor plant wastewater. The technology combines “micro-nanobubble technology” with a unique microorganism treatment technology Sharp developed in June 2005. Operation of the plant began in July 2006. Promotion of zero emissions* Zero emissions were achieved in 2001 through ongoing efforts such as in-house treatment of developing fluid by means of our own micro-organism treatment technology, reduction of the volume of process sludge produced, and recycling of waste into useful material. Prevention of global warming An energy conservation committee has been formed to promote energy conservation efforts involving the entire Group. Efforts such as building a unique energy-saving outer air treatment system have been highly regarded, and the Group received a “2005 Excellent Energy Conservation Factory & Building (electricity category)” award from the Directorgeneral of the Agency for Natural Resources and Energy. Relations with the local community In August of each year, employees and their families and local people are invited to the “Family Day in Sharp (Summer Festival).” At this festival, an environmental exhibition space is prepared to provide an opportunity for people to experience nature and to introduce the environmental protection efforts of the facility. The plant also implemented the semiconductor industry's first full-scale risk communication (July 2005), and in cooperation with the local community, jointly produced a large communication panel (4 m x 6 m) called “Daimoncho—Yesterday and Today.” The panel is on display at our premises and is being used to introduce our business and Daimoncho to visitors. Communication activities such as these have been highly evaluated, and the Group received the “2005 PRTR Prize” sponsored by the Center for Environmental Information Science. Solar Systems Group Electronic Components Group (Katsuragi, Nara Prefecture) ISO 14001 certification: June 25, 1996 Prevention of water pollution All waste water from production processes and laboratories is purified at a waste water treatment station within the factory. Water is released into the sewer only after treatment based on voluntary standards stricter than environmental standards. Prevention of air pollution Waste gases from acids and organic solvents produced by production processes and laboratories are purified with two types of waste gas treatment equipment, depending on the properties of the chemical substances. Eight acid scrubbers and 11 solvent scrubbers are installed on the roof of the Katsuragi Plant, and these keep atmospheric emissions of chemical substances below 1/10th of regulatory levels. Promotion of zero emissions* In 2001, the factory achieved zero emissions through recycling of all materials. It is now working to reduce waste volume with the goal of a final disposal rate of 0.2%. Installation of solar generation system In 2003, solar panels were installed at the solar park on the roof of the No. 3 Plant and on the employee recreation building. At present the solar generation system has a total capacity of 194.5 kW, and this electricity is used for tasks such as air conditioning. Relations with the local community In October of each year, the factory holds a “Katsuragi Festa” to improve relations with the local community and showcase the site's environmental activities. From a Green Factory to a Super Green Factory With the aim of becoming a Super Green Factory in 2007, the site is working to reduce emissions of harmful chemical substances used in processes and to recycle cleaning water used in production. Electronic Components Group Mihara Plant (Mihara, Hiroshima Prefecture) ISO 14001 certification: November 17, 2003 Prevention of global warming The precise air-conditioning necessary for production activities is maintained by operating coolers and boilers on municipal gas, which produces little CO2. The turbo coolers provided in air-conditioning equipment use a waste heat recovery system. A remover optimized for greenhouse gases is provided to suppress emission of such gases and prevent global warming. Promotion of zero emissions* Zero waste emission has been achieved through active efforts to reduce and reclaim waste, instituted from the beginning of the facility. Efforts to prevent pollution After treatment at an in-house facility, all process waste water is discharged into the public sewer only after clearing voluntary standards stricter than waste water standards. Sludge produced in waste water treatment is sorted by type and reclaimed. Measures are taken such as installing equipment indoors to prevent noise escaping to the surrounding area from noisy equipment, such as large fans and large compressors. Noise levels at the site boundary are within regulation values. The plant is working to improve management of chemical substances, prevent accidents and environmental disasters, and reduce environmental impact. Efforts to contribute to the local community Through efforts such as inviting local people to festivals and activities to protect forests, the plant aims to deepen relations with people in the local area and protect the environment. Efforts are being made to beautify the area by participating in greenification activities in the Mihara Western Industrial District where this facility is located. Efforts are being made to issue a pamphlet introducing the facility and to disclose information. The pamphlet contains environmental activity records and other information. * Sharp defines this as bringing the amount of buried waste (final disposal amount) as close to zero as to be negligible. In figures, a final disposal rate of less than 0.5% (final disposal rate = buried amount / total discharged amount x 100) is taken to be zero emissions. 7 Device_E.book Page 8 Wednesday, July 18, 2007 1:03 PM STN/CSTN/TFT/CG Silicon LCD MODULES ✩New product/Under development ■ LCD Modules (1) Display size Model No. 28.3′′ (72cm) LQ283G1TW11 28.1′′ (71cm) LQ281L1LW11 ✩LQ281L1LW14 Number of pixels (dot) H×V Pixel pitch (mm) H×V Display colors Power LumiInput video connance signal sumption (cd/m2) (W) 2 560 × RGB 0.219 × × 2 048 0.219 16.77 M 225 4ch TMDS 2 048 × RGB 0.246 × × 2 048 0.246 16.77 M 225 4ch LVDS 1 600 × RGB 0.294 × 0.294 × 1 200 16.77 M 103.2 96.0 TBD Outline dimensions (mm) W×H×D Weight (g) Backlight 640.0 × 530.0 Max. 15 000 18CCFT Built-in inverter × 60.0 594.0 × 594.0 × 83.0 15 000 18CCFT Built-in inverter Built-in inverter LQ231U1LW01 23.1′′ (59cm) 20.1′′ (51cm) 19.0′′ (48cm) 15.0′′ (38cm) LQ231U1LW21 LQ201U1LW11Z LQ201U1LW21 LQ190E1LW01 LQ190E1LW41 1 600 × XYZ 256 (gray × 1 200 0.255 × scales) 1 600 × RGB 0.255 16.77 M × 1 200 1 280 × RGB 0.294 × 0.294 × 1 024 250 LDI 54.9 530.0 × 432.8 × 32.5 700 2ch LVDS 8 bit XYZ 32.9 436.0 × 335.0 × 27.5 Max. 3 800 250 2ch LVDS 8 bit RGB 33.8 432.0 × 331.5 × 25.0 3 200 25.5 404.2 × 330.0 × 20.0 Max. 2 800 4CCFT 38.3 404.2 × 330.0 × 22.0 Max. 3 200 6CCFT 331.6 × 254.76 × 12.5 300 16.77 M 450 2ch LVDS 8 bit RGB LQ150X1LGB1 600 16.0 LQ150X1LGN2A 260 9.8 LQ150X1LGN2E 350 LQ150X1LW71N 1 024 × RGB 0.297 × × 768 0.297 16 M 250 LVDS 6 bit + 2FRC RGB 10.4 18.1 TFT Remarks LQ150X1LW72 350 ✩LQ150X1LGB2 (200) LQ121S1DG41 370 LQ121S1DG61 450 TBD 370 LQ121S1LG61 450 331.6 × 254.76 × 12.5 6CCFT 1 200±50 4CCFT Max. 1 100 2CCFT Max. 1 300 4CCFT Max. 1 350 Advanced Super View LCD (331.6 × 254.76 (Max. 1 400) 2CCFT VeilView × 16.0) Max. 660 Digital 6 bit RGB 8.3 LQ121S1LG41 326.0 × 252.0 × 11.5 Max. 5 500 6CCFT Expanded backlight brightness adjustment area 276.0 × 209.0 × 11.0 Max. 800 Strong LCD2 Max. 660 2CCFT 12.1′′ (31cm) ✩LQ121S1LG64 800 × RGB 0.3075 × × 600 0.3075 Max. 800 260 k (450) LQ121S1LW01 250 ✩LQ121S7LY01 (200) ✩LQ121S7LY11 (300) LVDS 6 bit RGB LQ104S1DG21 350 LQ104S1DG31 10.4′′ (26cm) 8 ✩LQ104S1DG61 LQ104S1LG21 800 × RGB × 600 0.264 × 0.264 Digital 6 bit RGB 420 (8.3) 276.0 × 209.0 × 14.5 8.5 276.0 × 209.0 × 11.0 350 ✩LQ104S1LG31 350 ✩LQ104S1LG61 420 LVDS 6 bit RGB Low reflection LCD module (1 200) Advanced Super View LCD Max. 800 (Max. 800) 2CCFT Super Mobile LCD 15.5 276.0 × 216.0 × 16.0 6.5 246.5 × 179.4 × 15.5 Max. 620 6.6 243.0 × 183.8 × 11.5 Max. 600 (6.3) 246.5 × 179.4 × 13.7 260 k Strong LCD2 (Max. 900) 4CCFT Strong LCD2 Max. 620 6.6 246.5 × 179.4 × 15.5 (6.6) 243.0 × 183.8 × 11.5 (600) (6.3) 246.5 × 179.4 × 13.7 Max. 620 2CCFT Strong LCD2 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details, please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 9 Wednesday, July 18, 2007 1:03 PM LCD MODULES ✩New product/Under development (2) Model No. Number of pixels (dot) H×V Pixel pitch (mm) H×V Display colors Power LumiInput video connance signal sumption (cd/m2) (W) LQ104V1DG21 350 LQ104V1DG51 TFT 10.4′′ (26cm) LQ104V1DG61 ✩LQ104V1DG64 Digital 6 bit RGB 640 × RGB × 480 0.330 × 0.330 450 LVDS 6 bit RGB LQ104V1DW02 8.9′′ (22cm) LM089HB1T04 ✩LQ085Y3DG03 TFT 8.5′′ ✩LQ085Y3DG04 (22cm) STN 8.4′′ TFT (21cm) 800 × RGB × 480 LM085YB1T01 800 × 480 ✩LQ084S3DG01 800 × RGB × 600 ✩LQ084S3LG01 ✩LQ084V3DG01 LQ084V1DG21 STN 640 × 240 8.1′′ (21cm) LM081HB1T01B 7.7′′ (20cm) LM077VS1T01 7.5′′ ✩LQ075V3DG01 (19cm) 800 × RGB × 600 640 × RGB × 480 0.330 × Blue and 0.330 white 0.231 × 0.231 0.213 × 0.213 0.270 × 0.270 0.267 × 0.270 260 k TFT LQ064V3DG04 ✩LQ057V3DG01 5.7′′ (14cm) LQ057Q3DC12 STN TFT LQ050Q5DR01 LM050QC1T01 4.6′′ (12cm) LM046QB1S02 3.8′′ (10cm) LQ038Q3DC01 3.5′′ ✩LQ035Q3DG01 (9cm) (Min. 130) 246.5 × 179.4 × 13.7 246.5 × 179.4 × 15.5 2.3 Digital 6 bit RGB TBD Max. 700 Max. 620 Strong LCD2 TBD (212.0 × 134.0 × 12.5) TBD Wide Wide 222.7 × 134.0 × 68.5 300 260 k 350 Digital 6 bit RGB 3.7 199.5 × 149.5 × 11.6 Max. 405 16 M (400) LVDS 6 bit + 2FRC RGB TBD 199.5 × 149.5 × 12.05 TBD 5.5 216.0 × 152.4 × 12.0 Max. 430 260 249.0 × 99.4 × 8.5 0.246 × 0.246 – (C-STN) 150 8 bit parallel 2.5 195.2 × 137.5 × 8.0 0.237 × 0.237 260 k 400 640 × RGB × 480 0.204 × 0.204 260 k 640 × RGB × 480 0.180 × 0.180 320 × RGB × 240 0.360 × 0.360 Wide 1CCFT 2.4 Digital 6 bit RGB Advanced Super View LCD 222.7 × 135.4 × 12.5 8 bit parallel 300 Low reflection LCD module 320 200 400 2CCFT Max. 620 Black and white 260 k Remarks 258.8 × 109.8 × 10.0 1.6 640 × RGB × 480 Weight (g) Backlight (246.5 × 179.4 Max. 1 000 × 17.2) 4 bit parallel 2CCFT Strong LCD2 1CCFT 2CCFT TBD Digital 6 bit RGB 5.7 179.0 × 139.5 × 12.7 Digital 6 bit RGB 4.7 161.3 × 117.0 × 12.0 Max. 280 TBD 144.0 × 104.6 × 12.3 TBD 3.9 144.0 × 104.6 × 13.0 Max. 240 4 bit parallel 1.2 166.0 × 109.0 × 7.5 160 1CCFT Strong LCD2 350 320 × 240 5.0′′ (13cm) 8 bit parallel 6.3 150 LM32019P TFT 250 246.5 × 179.4 × 15.5 0.300 × Black and 0.300 white 640 × 240 LM32019T STN Digital 6 bit RGB (250) LQ064V3DG01 6.4′′ (16cm) 380 265.0 × 195.0 × 11.5 246.5 × 179.4 × 13.7 260 k LQ104V1LG61 STN 6.4 Outline dimensions (mm) W×H×D LCD Display size 320 × RGB × 240 320 × 240 290 (430) 260 k 500 Digital 6 bit RGB 2CCFT Best viewing angle: 3 o’clock direction Ideal for vertical use Strong LCD2 Blue and white 70 Black and white 100 0.3165 × 0.3115 260 k 380 Digital 6 bit RGB 4.2 119.4 × 89.1 × 12.7 Max. 170 0.315 × 0.315 – (C-STN) 100 8 bit parallel 1.7 134.0 × 100.0 × 8.5 145 0.295 × Black and 0.295 white 100 4 bit parallel 0.9 134.0 × 100.0 × 8.5 140 1CCFT 0.7 90.6 × 79.9 × 9.9 Max. 105 LED LED backlight TBD 76.9 × 63.9 × TBD TBD LED LED backlight 0.36 × 0.36 0.240 × 320 × RGB 0.240 × 240 0.2205 × 0.2205 240 260 k TBD Digital 6 bit RGB 1CCFT Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details, please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 9 Device_E.book Page 10 Wednesday, July 18, 2007 1:03 PM TFT LCD MODULES ✩New product ★Under development Display size (cm) [ ′′ ] Model No. Number of pixels*1 Dot format H×V (dot) Outline Active area Number dimensions*2 Video interface H×V of colors Backlight (Input video signal) W × H × D (TYP.) (mm) (color) (mm) LK645D3LZ2U 1 080 × 1 920 803.52 × × RGB 1 428.48 907.0 × 1 555.3 × 100.0 LK645D3LZ29 1 920 × RGB 1 428.48 × × 1 080 803.52 1 555.3 × 907.0 × 100.0 163.8 [65] 2 073 600 TFT Built-in 16.77M 132.1 [52] LK520D3LZ19 1 920 × RGB 1 152.0 × × 1 080 648.0 1 219.0 × 706.7 × 69.8 116.8 [46] LK460D3LZ19 1 920 × RGB 1 018.0 × × 1 080 573.0 1 083.0 × 627.0 × 65.7 LVDS*3 (8-bit digital) Remarks Portrait Advanced Super View LCD High luminance: 450cd/m2 Wide viewing angle: L/R 176°/ U/D 176° High contrast: 2 000:1 High-speed response [G to G]: 6ms (Ave.) Advanced Super View LCD High luminance: 450cd/m2 Wide viewing angle: L/R 176°/ U/D 176° High contrast: 2 000:1 High-speed response [G to G]: 6ms (Ave.) Advanced Super View LCD High luminance: 450cd/m2 Wide viewing angle: L/R 176°/ U/D 176° High contrast: 1 800:1 High-speed response [G to G]: 6ms (Ave.) Advanced Super View LCD High luminance: 450cd/m2 Wide viewing angle: L/R 176°/ U/D 176° High contrast: 1 800:1 High-speed response [G to G]: 6ms (Ave.) *1 Pixel means a set of each RGB dot. *2 Excluding FPC for connection and other excessing parts. *3 LVDS: Low Voltage Differential Signaling (Note) Please note that the specifications are subject to change without prior notice for production improvement. Display size (cm) [ ′′ ] 132.1 [52] Model No. LK520D3LZxx Number of pixels*1 2 073 600 Dot format H×V (dot) 1 920 × RGB × 1 080 Outline Active area Number dimensions*2 Video interface H×V of colors Backlight (Input video signal) W × H × D (TYP.) (mm) (color) (mm) 1 152 × 648 (1 219 × 706.7 × 69.8) Built-in 16.77M TFT 116.8 [46] LK460D3LZxx 2 073 600 1 920 × RGB × 1 080 1 018 × 573 (1 083 × 627 × 65.7) LVDS*3 (8-bit digital) Remarks Advanced Super View LCD High luminance: 450cd/m2 Wide viewing angle: L/R 176°/ U/D 176° High contrast: (1 500:1) 120Hz drive compatible Advanced Super View LCD High luminance: 500cd/m2 Wide viewing angle: L/R 176°/ U/D 176° High contrast: (1 500:1) 120Hz drive compatible *1 Pixel means a set of each RGB dot. *2 Excluding FPC for connection and other excessing parts. *3 LVDS: Low Voltage Differential Signaling (Note) Please note that the specifications are subject to change without prior notice for production improvement. 10 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details, please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 11 Wednesday, July 18, 2007 1:03 PM LCD MODULES ✩New product ★Under development Display size (cm) [ ′′ ] Model No. Dot format H×V (dot) Pixel pitch H×V (mm) Active Input area signal H×V system (mm) Input video signal Power Outline LumiWeight Back- nance consump- dimensions*10 (g) 2 light (cd/m ) tion (mW) W × H × D (TYP.) (TYP.) (TYP.) (mm) (TYP.) 7.8 [3.1] LQ031B5DG01 270 × RGB 0.273 × × 96*1 0.273 73.7 × 26.2 6-bit digital RGB 8.3 [3.3] LQ033B5DG02 160 × RGB 0.351 × × 176*2 0.349 56.2 × 61.4 6-bit digital RGB 6-bit digital Built-in 1CCFT 290 1 800 73 × 78.3 × 12.5 8.9 [3.5] ★LQ035Q5DG02 320 × RGB 0.222 × × 240*3 0.222 71.0 × 53.3 6-bit digital RGB 6-bit digital Built-in LED 500 TBD 86.4 × 84 × 6.7 15 [6.1] ✩LQ061T5GG01 500 3 200 149 × 82.9 × 7.2 400 3 300 155 × 89.2 × 8.8 TFT 16 [6.5] 6-bit digital Built-in LED 350 700 85.4 × 38.8 × 8.65 TFT 480 × RGB 0.284 × 136.1 × NTSC/ specific Built-in × 234*4 0.308 72.0 PAL*11 analog 1CCFT RGB*12 TFT 400 × RGB 0.359 × 143.4 × NTSC/ specific Built-in LQ065T5GG61 5 11 × 234* 0.339 79.3 PAL* analog 1CCFT RGB*12 6-bit 400 × RGB 0.359 × 143.4 × ✩LQ065T5DG02 digital × 240*6 0.331 79.3 RGB 6-bit digital Built-in 1CCFT 620 4 100 155 × 89.2 × 9.1 6-bit 400 × RGB 0.359 × 143.4 × digital 0.331 79.3 × 240*6 RGB 6-bit digital Built-in 1CCFT 250 5 200 155 × 89.2 × 12.5 ✩LQ065T9DZ03 LCD (1) ● LQ065T9DZ03/LQ088H9DZ03: operating temperature (panel surface temperature) –40 to +85°C / storage temperature –40 to +95°C ● LQ070Y5DG06/LQ080Y5DG03: operating temperature (panel surface temperature) –30 to 85°C / storage temperature –40 to 95°C ● Other models: operating temperature (panel surface temperature) –30 to 85°C / storage temperature –40 to +85°C Remarks "Compact LCD" suitable for display in meter, Wide screen (8 : 3), LED back44 light, 260K-color display, Wide viewing angle, RoHS compliant "Compact LCD" suitable for display in meter, Highspeed response (low tem90 perature), 260K-color display, Wide viewing angle, RoHS compliant "Compact LCD" suitable for display in meter, LED backlight, High luminance, Thin, High-speed TBD response (low temperature), 260K-color display, Wide viewing angle, RoHS compliant Wide QVGA (17:9), Thin, 160 High luminance, (Max.) Wide viewing angle, RoHS compliant Wide QVGA (16:9), Thin, 175 Wide viewing angle, (Max.) RoHS compliant Wide QVGA (16:9), Digital I/F, 260K-color display, 170 High luminance, Wide viewing angle, RoHS compliant "Super Mobile LCD" with high visibility under bright ambient light, Wide QVGA 205 (16:9), Wide viewing (Max.) angle, Gray-scale inversion free, 260K-color display, RoHS compliant *1 Number of pixels: 25 920 *2 Number of pixels: 28 160 *3 Number of pixels: 76 800 *4 Number of pixels: 112 320 *5 Number of pixels: 93 600 *6 Number of pixels: 96 000 *7 Number of pixels: 384 000 *8 Number of pixels: 115 200 *9 Number of pixels: 153 600 *10 Excluding FPC for connection and other protruding parts. *11 MBK-PAL system is adopted as PAL. The LCD panel has 234 (240) scanning lines, and displays a picture of 273 (274) virtual scanning lines. *12 Video interface: External (Device specific external video interface IC is available.) (Note) Please refer to the latest relevant specificaiont sheets before using these devices. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details, please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 11 Device_E.book Page 12 Wednesday, July 18, 2007 1:03 PM TFT LCD MODULES ✩New product ★Under development (2) ● LQ065T9DZ03/LQ088H9DZ03: operating temperature (panel surface temperature) –40 to +85°C / storage temperature –40 to +95°C ● LQ070Y5DG06/LQ080Y5DG03: operating temperature (panel surface temperature) –30 to 85°C / storage temperature –40 to 95°C ● Other models: operating temperature (panel surface temperature) –30 to 85°C / storage temperature –40 to +85°C Display size (cm) [ ′′ ] Model No. Dot format H×V (dot) Pixel pitch H×V (mm) Active Input area signal H×V system (mm) Input video signal Power Outline LumiWeight Back- nance consump- dimensions*10 (g) 2 light (cd/m ) tion (mW) W × H × D (TYP.) (TYP.) (TYP.) (mm) (TYP.) TFT specific Built-in analog 1CCFT RGB*12 LQ070T5GG21 480 × RGB 0.326 × 156.2 × NTSC/ 0.352 82.4 PAL*11 × 234*4 ★LQ070T5DR05 6-bit 480 × RGB 0.321 × 154.1 × digital × 240*8 0.363 87.0 RGB 6-bit digital LQ070Y5DG05 6-bit 800 × RGB 0.195 × 156.0 × digital × 480*7 0.1725 82.8 RGB ★LQ070Y5DG06 500 3 500 Built-in 2CCFT 400 5 100 6-bit digital Built-in 1CCFT 460 3 600 6-bit 800 × RGB 0.191 × 152.4 × digital 0.191 91.4 × 480*7 RGB 6-bit digital Built-in LED 430* TBD LQ070Y5DE02 6-bit 800 × RGB 0.195 × 156.0 × digital 82.8 × 480*7 0.1725 RGB 6-bit digital Built-in LED 320* 5 250 ★LQ080Y5DG03 6-bit 800 × RGB 0.2175 × 174.0 × digital × 480*7 0.2175 104.4 RGB 6-bit digital Built-in LED 430* TBD ✩LQ080Y5DG04 6-bit 800 × RGB 0.2175 × 174.0 × digital × 480*7 0.2175 104.4 RGB 6-bit digital Built-in 2CCFT 625 5 900 ★LQ080Y5CGXX 800 × RGB 0.222 × 177.6 × × 480*7 0.207 99.4 NTSC/ PAL/ Built-in Composite PAL 1CCFT (60) 400 10 400 ✩LQ088H9DZ03 6-bit 640 × RGB 0.327 × 209.3 × digital × 240*9 0.327 78.5 RGB 250 7 100 18 [7] TFT 20 [8] 22 [8.8] 6-bit digital Built-in 2CCFT Remarks Wide QVGA (17:9), Thin, 195 High luminance, (Max.) Wide viewing angle, RoHS compliant Wide QVGA (16:9), Digital 170.1 × 103.4 280 I/F, 260K-color display, × 14.2 (Max) Wide viewing angle High resolution (wide VGA/17:9), Thin, W-QVGA 196 (GG21) vertical/horizontal 167 × 93 × 7.2 (Max.) compatible, 260K-color display, Wide viewing angle, RoHS compliant High resolution (wide VGA/15:9), High color purity (65% of NTSC), High-speed response (low 170 × 104 TBD temperature), LED back× 8.0 light, Thin, 260K-color display, Wide viewing angle, RoHS compliant, * Luminosity at eye point Dual directional viewing LCD, Wide screen (17:9), LED backlight, Thin, 215 167.5 × 93.2 260K-color display, × 6.5 to 9.0 (Max.) Wide viewing angle, RoHS compliant, * DV luminosity at eye point High resolution (wide VGA/15:9), High color purity (65% of NTSC), High-speed response (low 190 × 120 TBD temperature), LED back× 8.0 light, Thin, 260K-color display, Wide viewing angle, RoHS compliant, * Luminosity at eye point High resolution (wide VGA/15:9), High-speed 190 × 120 response (low tempera392 × 13 ture), High luminosity, 260K-color display, Wide viewing angle High resolution (wide VGA/16:9), All-in-one, 198 × 117 391 × 17.9 Wide viewing angle, RoHS compliant "Super Mobile LCD" with high visibility under bright ambient light, Wide screen 231.6 × 103.25 370 (8:3), Wide viewing angle, × 14.4 (Max.) Gray-scale inversion free, 260K-color display, RoHS compliant 167 × 93 × 6.9 *1 Number of pixels: 25 920 *2 Number of pixels: 28 160 *3 Number of pixels: 76 800 *4 Number of pixels: 112 320 *5 Number of pixels: 93 600 *6 Number of pixels: 96 000 *7 Number of pixels: 384 000 *8 Number of pixels: 115 200 *9 Number of pixels: 153 600 *10 Excluding FPC for connection and other protruding parts. *11 MBK-PAL system is adopted as PAL. The LCD panel has 234 (240) scanning lines, and displays a picture of 273 (274) virtual scanning lines. *12 Video interface: External (Device specific external video interface IC is available.) (Note) Please refer to the latest relevant specificaiont sheets before using these devices. The Tenri site NF3 (JQA-AU0121-1) and plants No. 1 and No. 2 (JQA-AU0121-2) at the Mie site of the Mobile Liquid Crystal Display Group have been certified under the ISO/TS 16949:2002 Quality Management System. [Certifying organization: Japan Quality Assurance Organization (JQA)] 12 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details, please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 13 Wednesday, July 18, 2007 1:03 PM LCD MODULES ✩New product ★Under development Active Dot Pixel pitch area format H×V H×V H×V (mm) (dot) (mm) Model No. 6.4 [2.5] ✩LS025A8DZ01 6.8 [2.7] LS027T3DG01 6.4 [2.5] ★LQ025A3DS01 960 × 240*1 CG Silicon TFT Input signal system Input video signal Power Outline LumiWeight Back- nance consump- dimensions*5 (g) light (cd/m2) tion (mW) W × H × D (TYP.) (TYP.) (TYP.) (mm) (TYP.) 0.052 × 49.9 × 0.156 37.4 (Dot pitch) 480 × RGB × 240*2 0.062 × 0.139 59.49 × NTSC/ 33.48 PAL*3 0.104 × 0.156 49.87 × 37.44 8-bit digital RGB Built-in LED 250 230 56.2 × 47.8 × 2.7 21 250 220 65 × 45 × 2.5 13 250 180 60.0 × 44.3 × 2.7 14 Remarks Super Mobile LCD with high outdoor visibility due to transflectivity, Top/bottom and left/right angle of view 160°, Delta configuration, High contrast, Low power consumption RGB delta configuration, FPC side positioning, RoHS compliant, Lead-free solder compatible LCD Display size (cm) [ ′′ ] *1 Number of Pixels: 230 400 *2 Number of Pixels: 115 200 *3 MBK-PAL system is adopted as PAL. The LCD panel has 234 (220) scanning lines, and displays a picture of 273 (256) virtual scanning lines. *4 Video interface: Internal *5 Excluding FPC for connection and other excessing parts. * CG Silicon ... Continuous grain silicon technology developed jointly with Semiconductor Energy Laboratory Co. Ltd. is used. (Note) Please refer to the latest relevant specification sheets before using these devices. Display size (cm) [ ′′ ] CG Silicon Model No. 5.6 [2.2] ★LS022Q8UX05 7.0 [2.75] LS028B7UX01 Dot format H×V (dot) Pixel pitch H×V (mm) Active area H×V (mm) 240 × RGB 0.1395 × 0.1395 × 320*1 33.48 × 44.64 240 × RGB × 400 36.0 × 60.0 0.05 × 0.15 Input video signal Outline Weight Contrast ratio Luminance dimensions*4 Back(g) (Transmissive/ (cd/m2) W×H×D light (TYP.) (TYP.) Reflective) (mm) (TYP.) 400 : 1 16-bit (Transmissive)/ parallel 10 : 1 CPU Built-in (Reflective) LED CPU bus 400 : 1 300 250 Remarks Super Mobile LCD with high outdoor visibility due to transflectivity, Top/bottom and left/ 39.2 × 58.35 T.B.D. right angle of view 160° × 2.3 (CR75), High contrast, 260k-color display, RoHS compliant Transmissive type, 41.8 × 70.5 10 260k-color display, × 2.3 RoHS compliant *1 Number of Pixels: 76 800 *2 Number of Pixels: 20 480 *3 Number of Pixels: 16 384 *4 Excluding FPC for connection and other excessing parts. * CG Silicon ... Continuous grain silicon technology developed jointly with Semiconductor Energy Laboratory Co. Ltd. is used. (Note) Please refer to the latest relevant specification sheets before using these devices. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details, please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 13 Device_E.book Page 14 Wednesday, July 18, 2007 1:03 PM EL EL DISPLAY MODULES ■ EL Display Modules Display size (cm) [ ′′ ] Model No. LJ64H034 23 [8.9] LJ089MB2S01 Areal Power Outline Active area Supply Weight Operating luminance consumption dimensions*2 H×V voltage (g) Remarks temperature 2 W×H×D (cd/m ) (W) (mm) (V) (TYP.) (°C) (TYP.) (mm) (TYP.) (TYP.) 246.0 × 175.0 High luminance, 450 110*1 × 19.0 Wide viewing angle 191.9 × +5, +12 11 –5 to +55 640 × 400 0.30 × 0.30 119.9 246.0 × 158.0 60 390 Wide viewing angle × 26.0 Dot format H×V (dot) Dot pitch H×V (mm) *1 In case of frame frequency = 120 Hz *2 Excluding FPC for connection and other excessing parts. (Note) Please refer to the latest relevant specification sheets before using these devices. LJ089MB2S01 14 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details, please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 15 Wednesday, July 18, 2007 1:03 PM LSI CMOS IMAGE SENSORS ★Under development ■ CMOS Camera Modules Optical Image format format 1/3.2 type Optical function Model No. LZ0P3955 Macro function LZ0P39AG UXGA LZ0P395V – 1/4 type Auto focus function LZ0P39DS Macro function LZ0P393D SXGA LZ0P393M LZ0P394K 1/6 type VGA – LZ0P399A Features • UXGA to SubQCIF • 10 fps at UXGA/ 30 fps at SVGA • 5x electronic zoom at QVGA size (MAX.) • Image inversion function (right and left) • UXGA to SubQCIF • 15 fps at UXGA/ 30 fps at SVGA • 5x electronic zoom at QVGA size (MAX.) • Image inversion function (right and left) Output pixels (H x V) MAX. Lens F No. Con- Horizontal figuration viewing angle (°) Output signal Supply voltage (V) F3.4 1 600 x 1 200 1 280 x 1 024 • VGA to SubQCIF • 30 fps at VGA • 2x electronic zoom at QVGA size (MAX.) • Image inversion function (right and left) 640 x 480 Package*1 290 (at 7.5 fps) 28LCC type 240 (at 7.5 fps) 53 24LCC type F2.8 200 (at 15 fps) 3 pcs. • SXGA to SubQCIF • 15 fps at SXGA/ 30 fps at 640 x 512 • 4.2x electronic zoom at QVGA size (MAX.) • Image inversion function (right and left) Power consumption (mW) TYP. 2.8/1.8 (I/O : 1.8 or 2.8) F3.2 56 30FPC type*2 220 (at 15 fps) UYVY CMOS Image Sensors/ CCDs Module configuration : CMOS image sensor, CDS/AGC/10-bit ADC, timing generator, DSP, lens (for UXGA/SXGA/VGA) CMOS image sensor, CDS/AGC/8-bit ADC, timing generator, DSP, lens (for CIF) Color filter : R, G, B primary color mosaic filters Operating temperature : –20 to 60°C F3.4 54 110 (at 30 fps) 2 pcs. 24LCC type 52 F2.8 LZ0P392N 1/7 type CIF LZ0P396K • CIF/QCIF • 30 fps at CIF • Image inversion function (right and left) Single 352 x 288 58 2.5 35 (I/O : 2.8) (at 15 fps) 2 pcs. 52 *1 Contact a SHARP sales office regarding socket availability. *2 Contact a SHARP sales office regarding FPC type package. ● Outline Dimensions LZ0P3955 LZ0P39AG LZ0P395V LZ0P39DS LZ0P393D LZ0P393M LZ0P394K LZ0P399A LZ0P392N LZ0P396K Package*1 9.5 x 9.5 x (H) 7.0 8.0 x 8.0 x (H) 4.8 8.0 x 8.0 x (H) 4.4 8.5 x 8.5 x (H) 5.4 8.4 x 8.4 x (H) 5.3 8.0 x 8.0 x (H) 4.9 6.5 x 6.2 x (H) 4.3 5.8 x 5.8 x (H) 3.7 6.5 x 6.5 x (H) 4.5 6.0 x 6.0 x (H) 3.1 28LCC type CMOS camera module LZ0P395V 24LCC type 30FPC type*2 Lens Model No. ● System Configuration Example Outline dimensions (mm) TYP. 24LCC type CMOS image sensor CDS/AGC/ 10-bit ADC Timing generator DSP with camera system controller Digital output for UYVY I2C bus control (H) : Module height *1 Contact a SHARP sales office regarding socket availability. *2 Contact a SHARP sales office regarding FPC type package. 15 Device_E.book Page 16 Wednesday, July 18, 2007 1:03 PM LSI CCDs ■ Higher-resolution CCDs Optical Total format pixels Color filter Model No. RJ21W3BB0ET 1/1.7 type 10 540 k RJ21W3BC0ET Resolution 30 fps VGA movie Image pixels (H x V) Pixel size H x V (µm2)
3 704 x 2 784 2.05 x 2.05 1.88 x 1.88 (25 fps VGA movie) RJ21Y3BA0ET (22 fps VGA movie) 4 040 x 3 032 8 500 k RJ21V3BC0ET
3 320 x 2 496 RJ23S3BD0ET
RJ23S3CD0ET – 2.2 x 2.2 2 600 x 1 944 R,G,B primary color mosaic filters
RJ23S3CE0BT – RJ23T3BB0ET
RJ23T3CB0ET – RJ23T3BC0BT
RJ23T3CC0BT – RJ23U3BA0ET
RJ23U3CA0ET – RJ23U3BC0BT
RJ23U3CC0BT – RJ23V3BA0BT
RJ23V3CA0BT – 6 360 k 2 872 x 2 160 1/2.5 type 100 105 5 190 k RJ23S3BE0BT Package P-SOP032-0525
12 520 k 1/1.8 type Sensitivity Smear ratio (mV) TYP. (dB) TYP. 130 2.05 x 2.05 –88 100 P-SOP028-0400 7 400 k 3 096 x 2 328 8 500 k 3 320 x 2 496 95 –83 105 –88 100 –85 1.9 x 1.9 1.75 x 1.75 ■ 1/3-type CCDs Total pixels Standard Model No. Resolution Horizontal TV lines Image pixels (H x V) Pixel size H x V ( µ m 2) 512 x 492 9.6 x 7.5 1 300 –120 2 000 –130 9.6 x 6.3 1 300 –120 9.6 x 6.34 2 000 –130 800 –105 1 500 –120 6.5 x 6.3 750 –105 6.53 x 6.39 1 500 –120 RJ2311AA0PB 270 k NTSC Sensitivity Smear ratio (mV) TYP. (dB) TYP. RJ2311BA0PB P-DIP016-0500C 330 RJ2321AA0PB 320 k Package 512 x 582 PAL RJ2321BA0PB Color RJ2351AA0BB 410 k 768 x 494 NTSC 6.4 x 7.5 RJ2351BA0AB N-DIP016-0450 480 RJ2361AA0BB 470 k 752 x 582 PAL RJ2361BA0AB 16 Device_E.book Page 17 Wednesday, July 18, 2007 1:03 PM CCDs ★Under development ■ 1/3.8-type CCD Total pixels 290 k Standard Color NTSC Model No. ★RJ2311AA0PB* Resolution Horizontal TV lines Image pixels (H x V) Pixel size H x V ( µ m 2) 330 532 x 512 7.2 x 5.6 Image pixels (H x V) Pixel size H x V (µm2) Sensitivity Smear ratio (mV) TYP. (dB) TYP. 1 200 –120 Package P-DIP014-0400A * Suitable for intense light exposure. ■ 1/4-type CCDs Standard Model No. Resolution Horizontal TV lines Sensitivity Smear ratio (mV) TYP. (dB) TYP. Package RJ2411AA0PB* 800 –105 1 200 –120 7.2 x 4.7 720 –105 7.2 x 4.73 1 100 –120 400 –90 600 –114 5.0 x 4.7 400 –90 5.0 x 4.77 600 –114 RJ2411AB0PB 270 k NTSC 512 x 492 7.2 x 5.6 RJ2411BA0PB* 330 RJ2411BB0PB RJ2421AB0PB 320 k Color PAL P-DIP014-0400A 512 x 582 RJ2421BB0PB RJ2451AA0PB 410 k NTSC 768 x 494 CMOS Image Sensors/ CCDs Total pixels 4.9 x 5.6 RJ2451BA0PB 480 RJ2461AA0PB PAL 470 k 752 x 582 RJ2461BA0PB * Suitable for intense light exposure. ■ 1/3-type CCDs with Dual-power-supply (5 V/12 V) Operation*1 Total pixels Standard 270 k EIA Model No. LZ2316A3 B/W 320 k Resolution Horizontal TV lines Image pixels (H x V) Pixel size H x V ( µ m 2) 512 x 492 9.6 x 7.5 3 300*2 512 x 582 9.6 x 6.3 3 000*2 Sensitivity Smear ratio (mV) TYP. (dB) TYP. 380 CCIR *1 With mirror image function LZ2326A3 –110 Package N-DIP016-0500C *2 When IR cut-off filter is not used. 17 Device_E.book Page 18 Wednesday, July 18, 2007 1:03 PM LSI CCDs ★Under development ■ CCD Peripheral ICs/LSIs Description ( Single-chip driver Timing generator + Synchronous signal generator Signal processor V driver Model No. ) For 270-k/320-kpixel CCDs with dual-power-supply operation (5 V/12 V) IR3Y30M2 Available for signal processing from CCD output to 75 Ω video output, for B/W CCDs, comparator for electronic exposure, high-speed S/H circuit, H aperture, LPF, AGC P-QFP048-0707 LR366851 Vertical pulse driver for CCDs, 2-level output x 2, 3-level output x 4, 2-level output circuit for electronic shutter P-SSOP024-0275 LR36687U/Y Vertical pulse driver for CCDs, 2-level output x 10, 3-level output x 10, 2-level output circuit for electronic shutter P-VQFN064-0808/ TFBGA068-0606 LR36689U Vertical pulse driver for CCDs, 2-level output x 4, 3-level output x 8, 2-level output circuit for electronic shutter P-VQFN036-0505 IR3Y48A3/A5 Low power consumption [80 mW (TYP.) ], high-speed S/H circuit, high-gain PGA circuit, 10-bit ADC (18 MHz), 10-bit digital output P-QFP048-0707/ P-VQFN052-0707 ★IR3Y48B1 Low power consumption [80 mW (TYP.) ], high-speed S/H circuit, high-gain PGA circuit, 10-bit ADC (18 MHz), 10-bit digital output P-QFP048-0707 IR3Y60U6 Low power consumption [69 mW (TYP.) ], high-speed S/H circuit, high-gain PGA circuit, 10-bit ADC (20 MHz), 10-bit digital output P-VQFN032-0505 IR3Y50U6 Low power consumption [75 mW (TYP.) ], high-speed S/H circuit, high-gain PGA circuit, 12-bit ADC (25 MHz), 12-bit digital output P-VQFN036-0606 For 1/2.5-type 5 190-kpixel CCDs with/without movie function Monitoring mode/still mode For 1/2.5-type 6 360-kpixel CCDs Vertical pulse driver for CCDs, with/without movie function 2-level output x 10, 3-level output x 10, For 1/2.5-type 7 400-kpixel CCDs 2-level output circuit for electronic shutter with/without movie function 30 MHz (LR38667)/ 36 MHz (LR38675/LR38678/LR38677), For 1/1.8-type 8 500-kpixel, high-speed S/H circuit, high-gain PGA circuit, 1/1.7-type 10 540-kpixel CCDs 12-bit ADC, 12-bit digital output with movie function LFBGA192-1010 For 1/2.5-type 5 190-kpixel, Programmable timing generator 6 360-kpixel, 7 400-kpixel, 8 500-kpixel CCDs with/without Vertical pulse driver for CCDs, movie function, 2-level output x10, 3-level output x10 For 1/1.8-type 8 500-kpixel, 2-level output circuit for electronic shutter 1/1.7-type 10 540-kpixel, 12 520-kpixel CCDs with movie 40 MHz, high-speed S/H circuit, high-gain PGA circuit, function 22-bit ADC, 16-bit digital output LFBGA140-0909 LR38667 LR38675 LR38678 LR38677 ★LR36B11 LR386431/33 V driver + CDS/PGA/ADC + DSP For 270-k/320-k/410-k/ 470-kpixel CCDs LR38653 18 Package LR385851 CDS/PGA/ADC Timing generator + V driver + CDS/PGA/ADC Features Electronic shutter, electronic exposure, mirror image function, P-QFP048-0707 for B/W CCDs, level shifter, smooth shutter, line lock function Vertical pulse driver for CCDs, 2-level output x 2, 3-level output x 2, 2-level output circuit for electronic shutter 18 MHz, high-speed S/H circuit, high-gain PGA circuit, 10-bit ADC 9-bit DAC, synchronous signal generation circuit, CCD drive timing generator, AE control function, AWB control function, mirror image function, YUV digital output, NTSC/PAL analog output LFBGA168-1212/ LFBGA171-0811 Vertical pulse driver for CCDs, 2-level output x 2, 3-level output x 2, 2-level output circuit for electronic shutter 25 MHz, high-speed S/H circuit, high-gain PGA circuit, 12-bit ADC 10-bit DAC, synchronous signal generation circuit, CCD drive timing generator, AE control function, AWB control function, lens shading correction function, auto white blemish compensation function, mirror image function, YUV digital output, NTSC/PAL analog output LFBGA171-0811 Device_E.book Page 19 Wednesday, July 18, 2007 1:03 PM CCDs ★Under development ■ CCD Peripheral ICs/LSIs (cont’d) V driver + CDS/PGA/ADC + DSP Model No. LR38654 Features Vertical pulse driver for CCDs, 2-level output x 2, 3-level output x 2, 2-level output circuit for electronic shutter 25 MHz, high-speed S/H circuit, high-gain PGA circuit, 12-bit ADC 10-bit DAC, synchronous signal generation circuit, built-in CCD drive timing generator, AE control function, AWB control function, lens shading correction function, auto white blemish compensation function, mirror image function, electronic optical axis adjustment function*1, YUV digital output, NTSC/PAL analog output LFBGA171-0811 9-bit DAC, synchronous signal generation circuit, built-in CCD drive timing generator, AE control function, AWB control function, mirror image function, YUV digital output, NTSC/PAL analog output P-LQFP080-1212 9-bit DAC, synchronous signal generation circuit, built-in CCD drive timing generator, AE control function, AWB control function, mirror image function, YUV digital output, NTSC/PAL analog output, Y/C separation analog output, line lock function P-LQFP100-1414 10-bit DAC, synchronous signal generation circuit, built-in CCD drive timing generator, AE control function, AWB control function, lens shading correction function, auto white blemish compensation function, mirror image function, YUV digital output, NTSC/PAL analog output P-TQFP128-1414 For 5 190-kpixel to 12 520-kpixel CCDs Input voltage range : 11.5 to 16 V, Constant current range : 1 to 5.5 mA, ON/OFF control for constant current B-VQFN8 (1.50 mm x 1.50 mm) For 270-k/320-kpixel CCDs Input voltage range : 4.5 to 16 V, PWM control + charge pump system, output voltage : three outputs (15 V/12 V, –8 V/–5 V, 3.3 V), power sequencing circuit, overcurrent protection circuit For 270-k/290-k/320-k/410-k/ 470-kpixel CCDs Input voltage range : 4.5 to 10 V, PWM control + charge pump system, output voltage : four outputs (15 V, –8 V, 3.3 V, 1.8 V), power sequencing circuit, overcurrent protection circuit For 270-k/290-k/320-k/410-k/ 470-kpixel CCDs LR386032 DSP LR386071 For 270-k/320-k/410-k/ 470-kpixel CCDs LR38627 Buffer IC for CCD output circuit ★IR3T47G IR3M55U*2 Power supply IC for CCDs and peripheral ICs/LSIs Package IR3M59U CMOS Image Sensors/ CCDs Description P-VQFN032-0505 IR3M61U*2 IR3M63U *1 Only support for 290-kpixel CCD. *2 For in-vehicle use 19 Device_E.book Page 20 Wednesday, July 18, 2007 1:03 PM LSI CCDs ★Under development ● System Configuration Examples • High-resolution Digital Camera System with Three-chip Configuration Analog output for RGB/NTSC/PAL Four-power-supply CCD Timing generator + V driver + CDS/PGA/ADC Buffer IC for CCD output circuit ★IR3T47G* Digital LCD interface Image processing LSI for digital cameras SDRAM LCD panel Interface USB Interface CompactFlashTM or SmartMediaTM or SD memory card Flash memory *Refers to the following table regarding adaptable CCDs with IR3T47G. Four-power-supply CCDs and peripheral IC/LSIs 30 fps VGA movie CCD RJ21W3BB0ET 10 540 k pixels 1/1.7 type 1/1.8 type RJ21W3BC0ET 12 520 k pixels RJ21Y3BA0ET
(22 fps VGA movie) 8 500 k pixels RJ21V3BC0ET
RJ23S3BD0ET
RJ23S3CD0ET – RJ23S3BE0BT
RJ23S3CE0BT – RJ23T3BB0ET
RJ23T3CB0ET – RJ23T3BC0BT
5 190 k pixels 6 360 k pixels 1/2.5 type RJ23T3CC0BT – RJ23U3BA0ET
RJ23U3CA0ET – RJ23U3BC0BT
7 400 k pixels RJ23U3CC0BT – RJ23V3BA0BT
RJ23V3CA0BT – 8 500 k pixels 20
(25 fps VGA movie) Buffer IC for CCD output circuit Timing generator + V driver + CDS/PGA/ADC – LR38677/★LR36B11 ★IR3T47G ★ LR36B11 LR38677/★LR36B11 – LR38667/★LR36B11 ★IR3T47G – LR38675/★LR36B11 ★IR3T47G – LR38678/★LR36B11 ★IR3T47G ★ LR36B11 Device_E.book Page 21 Wednesday, July 18, 2007 1:03 PM CCDs ★Under development • Color Security Camera System with Two-chip Configuration [Low Power Consumption Type] Analog output for NTSC/PAL V driver + CDS/PGA/12-bit ADC + DSP Power supply voltage –8 V Input voltage 4.5 to 10 V Power Power Power supply supply supply voltage voltage voltage 1.8 V 3.3 V 15 V Power supply IC IR3M63U Digital output for YUV E2PROM DSP serial control Four-power-supply CCDs and peripheral IC/LSIs CCD V driver + CDS/PGA/ADC + DSP Power supply IC RJ2311AA0PB 270 k pixels CMOS Image Sensors/ CCDs Four-power-supply CCD RJ2311BA0PB — RJ2321AA0PB 320 k pixels RJ2321BA0PB LR38653/LR38654 1/3 type RJ2351AA0BB 410 k pixels RJ2351BA0AB IR3M63U RJ2361AA0BB — 470 k pixels RJ2361BA0AB 1/3.8 type 290 k pixels ★RJ2411CA0PB LR38654 RJ2411AA0PB RJ2411AB0PB IR3M63U 270 k pixels RJ2411BA0PB RJ2411BB0PB RJ2421AB0PB 1/4 type LR38653/LR38654 320 k pixels RJ2421BB0PB RJ2451AA0PB — RJ2451BA0PB IR3M63U 410 k pixels RJ2461AA0PB — RJ2461BA0PB IR3M63U 470 k pixels 21 Device_E.book Page 22 Wednesday, July 18, 2007 1:03 PM LSI CCDs • Color Security Camera System with Two-chip Configuration Analog output for NTSC/PAL Four-power-supply CCD V driver + CDS/PGA/10-bit ADC + DSP Power Power Power supply supply supply voltage voltage voltage –8 V 3.3 V 15 V Input voltage Power supply IC 4.5 to 16 V IR3M59U Digital output for YUV E2PROM DSP serial control Four-power-supply CCDs and peripheral IC/LSIs CCD V driver + CDS/PGA/ADC + DSP Power supply IC RJ2311AA0PB 270 k pixels RJ2311BA0PB RJ2321AA0PB 320 k pixels RJ2321BA0PB — 1/3 type RJ2351AA0BB 410 k pixels RJ2351BA0AB RJ2361AA0BB 470 k pixels RJ2361BA0AB RJ2411AA0PB LR386431/LR386433 RJ2411AB0PB 270 k pixels RJ2411BA0PB IR3M59U RJ2411BB0PB RJ2421AB0PB 1/4 type 320 k pixels RJ2421BB0PB RJ2451AA0PB 410 k pixels RJ2451BA0PB — RJ2461AA0PB 470 k pixels RJ2461BA0PB 22 Device_E.book Page 23 Wednesday, July 18, 2007 1:03 PM CCDs ★Under development • Color Security Camera System with Four-chip Configuration Analog output for NTSC/PAL Four-power-supply CCD CDS/PGA/ADC Digital output for YUV DSP V driver LR366851 Power supply IC DSP serial control Four-power-supply CCDs and peripheral ICs/LSIs (1) V driver CCD CDS/PGA/ADC DSP Power supply IC RJ2311AA0PB 270 k pixels RJ2311BA0PB CMOS Image Sensors/ CCDs E2PROM RJ2321AA0PB 320 k pixels RJ2321BA0PB 1/3 type — RJ2351AA0BB 410 k pixels RJ2351BA0AB RJ2361AA0BB 470 k pixels RJ2361BA0AB LR366851 RJ2411AB0PB IR3Y60U6 IR3Y48A3/A5/B1★ IR3Y48A3/A5/B1★ + + + LR386071, LR386032, LR386071 270 k pixels RJ2411BB0PB IR3M59U RJ2421AB0PB 320 k pixels RJ2421BB0PB 1/4 type RJ2451AA0PB 410 k pixels RJ2451BA0PB — RJ2461AA0PB 470 k pixels RJ2461BA0PB 23 Device_E.book Page 24 Wednesday, July 18, 2007 1:03 PM LSI CCDs Four-power-supply CCDs and peripheral ICs/LSIs (2) V driver CCD CDS/PGA/ADC DSP Power supply IC RJ2311AA0PB 270 k pixels RJ2311BA0PB — RJ2321AA0PB 320 k pixels RJ2321BA0PB 1/3 type RJ2351AA0BB 410 k pixels RJ2351BA0AB IR3M63U RJ2361AA0BB — 470 k pixels RJ2361BA0AB LR366851 IR3Y50U6 LR38627 RJ2411AB0PB 270 k pixels IR3M63U RJ2411BB0PB RJ2421AB0PB 320 k pixels RJ2421BB0PB 1/4 type RJ2451AA0PB — RJ2451BA0PB IR3M63U 410 k pixels RJ2461AA0PB — RJ2461BA0PB IR3M63U 470 k pixels • B/W Security Camera System Dual-power-supply CCD Analog output for EIA/CCIR Analog signal processor IR3Y30M2 Single-chip driver with level shifter LR385851 Power supply voltage 12 V Power supply voltage 5 V Dual-power-supply CCDs and peripheral IC/LSI for analog interface CCD 270 k pixels LZ2316A3 320 k pixels LZ2326A3 1/3 type 24 Single-chip driver (Timing generator + Synchronous signal generator) Signal processor LR385851 IR3Y30M2 Device_E.book Page 25 Wednesday, July 18, 2007 1:03 PM LSIs FOR LCDs ■ For Notebook PCs, PC Monitors and LCD TVs ● TFT-LCD Drivers Model No. Source driver No. of Display Clock LCD drive voltage frequency outputs (V) MAX. (MHz) MAX. 384 2.7 to 3.6 LH16B6 402/414 420/432 2.3 to 3.6 64 levels 480/504/ 516/528 13.5 LH16B5 630/642 LH16B9 684/690/ 702/720 LH16AE 384 15 LH16BP 384/402/ 408/414/ 420 16.5 LH16AW 384/414/ 420 16 LH16AF 480 15 LH1691 240 33 85 - LH169J Package Low EMI*1 driver using RSDSTM*2 interface, built-in reference voltage generation circuit, R-DAC system SOF 2.7 to 3.6 0.1 LH1694 Description 2.7 to 3.6 2.3 to 3.6 256 levels Gate driver Supply voltage (V) LH16AM LH16AD Dot inversion drive Gray scale 256 42 200/240/ 256/263/ 270 45 0.2 Selectable 1-pulse (normal) or 2-pulse (continuous/jumping) scanning, 3.0 to 5.5 usable with both positive/negative power supplies Output signal masking function, usable 2.7 to 3.6 with both positive/negative power supplies, enables chain connection 2.4 to 4.2 Output signal masking function, enable constructing the module without substrate CMOS Image Sensors/ CCDs Drive function TCP/SOF/ COG TCP/SOF SOF *1 EMI : Electro-Magnetic Interference *2 RSDSTM : Reduced Swing Differential Signaling 25 Device_E.book Page 26 Wednesday, July 18, 2007 1:03 PM LSI LSIs FOR LCDs ■ For Mobile Equipment ● TFT-LCD Drivers Drive function Dot inversion drive No. of Display Supply Clock LCD drive voltage frequency voltage outputs (V) MAX. (MHz) MAX. (V) 402/480/ 516 LH16AV LH168Y Source driver Gray scale Model No. 64 levels 13.5 65 240 35 Line inversion drive LH16AR LH1687 480 Analog LH1691 Gate driver 240 12.5 33 240/244/ 258 40 0.1 – LH169H Package Built-in reference voltage generation circuit, R-DAC system, power saving function Built-in reference voltage generation circuit, 2.5 to 5.5 R-DAC system, power saving function, polarity inversion of input data COG Built-in R-DAC system, power saving function, 2.5 to 3.6 polarity inversion of input data 5.5 240 2.7 to 3.6 Description Selectable three-point simultaneous or normal sampling (Sampling frequency : 25 MHz), power saving function, 3 V drive (MIN.), 3.0 to 5.5 prechargeless output Selectable 1-pulse (normal) or 2-pulse (continuous/jumping) scanning, usable with both positive/negative power supplies TCP/SOF/COG 2.5 to 3.6 Output signal masking function, enables chain connection COG ● STN-LCD Drivers Drive technology Drive function Model No. LH1583 No. of LCD drive outputs Duty ratio 160 to 1/240 Data input 4/8-bit parallel +5.5 Segment New drive technology*1 Display voltage (V) MAX. LH1580 240 to 1/480 LH1537 200/240 1/200,1/240 8/12-bit parallel +45 – Common LH1538 120/128 to 1/480 +80 LH1542 80 to 1/240 +30 4-bit parallel Clock frequency (MHz) MAX. 12 (at 2.4 V) / 20 (at 5 V) 30 (at 2.5 V) / 55 (at 5 V) 3 (at 2.4 V) / 4 (at 5 V) 3 (at 2.5 V) / 4 (at 5 V) Supply voltage (V) Package 2.4 to 5.5 2.5 to 5.5 2.4 to 5.5 8 12 (at 2.5 V) / LH1549 Segment 160 4/8-bit parallel 20 (at 5 V) to 1/480 +42 12 (at 2.5 V) / LH1548 240 TCP/SOF 8/12-bit parallel 25 (at 5 V) 3 (at 2.5 V) / to 1/480 LH1530 Common +42 120 – 4 (at 5 V) Conventional 2.5 to 5.5 [Segment mode] 8 to 1/240 drive LH1565 +30 [Common mode] 4 technology*2 [Segment mode] 160 8 (at 2.5 V) / Segment LH1560 14 (at 5 V) or 4/8-bit parallel Common (at segment drive) [Common mode] 4 to 1/480 +42 [Segment mode] (Pin-selectable) 12 (at 2.5 V) / LH1562 240 20 (at 5 V) [Common mode] 4 *1 New drive technology : A drive technology which drives LCDs with low voltage of 5 V on segment side and drives LCDs with high voltage on common side. Driving with low voltage on segment side enables LCDs to reduce power consumption and shadowing. *2 Conventional drive technology : A drive technology which drives LCDs with high voltage on both segment and common sides. ● Power Supply IC for STN-LCD Drivers Model No. Description Supply voltage (V) Package DC-DC converter for LCD drive power supply, 2.4 to 3.3 (VDD, VP) P-QFP072-1010 built-in bias voltage generation circuit for LCD drive, electronic volume control circuit * New drive technology : A drive technology which drives LCDs with low voltage of 5 V on segment side and drives LCDs with high voltage on common side. Driving with low voltage on segment side enables LCDs to reduce power consumption and shadowing. LR3697A 26 For STN LCD drivers with new drive technology* Device_E.book Page 27 Wednesday, July 18, 2007 1:03 PM LSIs FOR LCDs ■ For Mobile Phones ● TFT-LCD Controller/Driver with Two-chip Configuration (LR38825 + LH169C) LR38825 No. of LCD Display Display RAM drive outputs colors capacity a-Si Source Gate MAX. (bit) 528 240 x 176 x 18
– 262 144 colors LH169C – – 240
Function • Versatile graphic functions • Window display function • Write mask function • Bit built function • Built-in gray-scale control circuit • Built-in timing generator • Built-in DC-DC converter, VCOM generation circuit CPU interface External image interface Supply voltage (V) Package Core Host I/F Display 80-family RGB : (8/16/18-bit respective 1.65 to 1.95 1.65 to 3.6 4.75 to 5.25 parallel, 6-bit parallel serial) COG – – CPU interface External image interface 26.5 (MAX.) 2.75 to 3.3 LSIs for LCDs Model No. ● Single-chip TFT-LCD Controller/Driver Model No. LR38826 No. of LCD Display Display RAM drive outputs capacity a-Si colors Source Gate (bit) MAX. 396 176 262 144 176 x 132 x 18
colors Function • Versatile graphic functions • Window display function • Write mask function • Bit built function • Built-in gray-scale control circuit • Built-in timing generator, DC-DC converter, VCOM generation circuit Supply voltage (V) Package Core Host I/F 80-family RGB : (8/16/18-bit respective 1.65 to 1.95 1.65 to 3.6 parallel, 6-bit parallel, serial) YUV format Display 2.75 to 3.3 Using built-in power supply COG ·Source : 4.0 to 5.5 ·Gate : 20 to 27.5 ● TFT-LCD Controllers Model No. LR38822A LCD Display Display RAM a-Si interface capacity colors (pixel) MAX. MAX. (bit) 176 x 240 • Built-in timing generator, 65 536 176 x 240 x 16 clock generator colors LR388D1 262 144 240 x 400 x 18 colors LR38869A • MDDI* compliant • Built-in IrSimple™ and IrDA functions • Main/sub LCD controller • Graphic processing • MDDI* compliant • Main/sub LCD controller • Graphic processing • Parallel bus host interface 240 x 400 16 770k colors LR388D0 Function – • DAC type LCD controller • Built-in voltage generation circuit for LCD • Built-in common drive circuit • Built-in level shifter for panel control • Built-in timing generator External image interface CPU interface Supply voltage (V) Package Core Host I/F 80-family RGB : (8/16-bit respective 2.25 to 2.75 3.0 to 3.6 TFBGA112-1010 parallel, serial) 6-bit parallel VFBGA144-0808 MDDI* for MSM series/ 80-family (8/9/16/ 18-bit parallel) – 1.65 to 1.95 1.65 to 3.6 TFBGA176-0909 – RGB : respective 8-bit parallel VFBGA144-0808 * MDDI (Mobile Display Digital Interface) : The serial interface standard developed by QUALCOMM. ● TFT-LCD Driver Model No. No. of LCD drive outputs LTPS* Function Source LH16AP 240
• Built-in timing generator, DC-DC converter, VCOM generation circuit External image interface RGB : respective 6-bit parallel Supply voltage (V) Display MAX. 2.2 to 3.6 5.5 Package COG/SOF * LTPS : Low Temperature Poly-Silicon 27 Device_E.book Page 28 Wednesday, July 18, 2007 1:03 PM LSI LSIs FOR LCDs ● Color STN-LCD Controllers/Drivers Display colors MAX. Drive function Model No 256 colors LH15H1 4 096 colors LH15JA 65 536 colors 262 144 colors Segment and Common LH15KA LH15LA No. of LCD drive outputs Display RAM capacity (bit) Duty ratio Display voltage (V) MAX. Data input 66 96 x 66 x 8 1/10, 1/18, 1/26, 1/34, 1/42, 1/50, 1/58, 1/66 +13.2 8/16-bit parallel, serial 132 132 x 132 x 12 1/33, 1/39, 1/68, 1/74, 1/133, 1/139 +18 8-bit parallel, serial 176 to 1/176 132 x 176 x 16 (Selectable per 1 line) +18.6 to 1/162 132 x 162 x 18 (Selectable per 1 line) ±18 Segment Common 288 396 162 Clock Supply frequency voltage (MHz) MAX. (V) 4 (at 3 V) 1.8 to 3.3 TCP/SOF 3 (at 2.5 V) 1.65 to 3.3 COG 4 (at 3 V) 8/16-bit parallel, serial Package 1.8 to 3.3 COG Core : 1.65 to 1.95 6.25 (at 1.65 to 1.95) Host I/F : COG 1.65 to 3.6 ● Color STN-LCD Controller Model No. LR38844A 28 LCD Display interface colors (pixel) MAX. MAX. Function/Feature • High-speed host access • Display colors selectable : 256/4 096/65 536 colors 65 536 128 x 164 • Power saving function reduces the colors power consumption in standby mode • Built-in CPU interface, LCD interface, clock generator, display memory Recommended to be used together with LH15H1 CPU interface Display RAM capacity (bit) Supply voltage (V) TYP. 68-family/ 80-family (8/16 bits) 128 x 164 x 16 2.5 Package TFBGA081-0808 Device_E.book Page 29 Wednesday, July 18, 2007 1:03 PM LSIs FOR LCDs ★Under development ■ Peripheral ICs for LSIs for LCDs ● Video Interface ICs for TFT-LCDs IR3Y18A1 Input signal Composite Y/color Analog OSD video difference RGB (Digital)
Color decode NTSC/PAL
*3 IR3Y26A2/A6 LCD panel Serial ± power + power Low voltage Digital data source source source input control

Supply voltage (V) TYP. Power consumption (mW) TYP. Package 4.5/12 or 4.5/–7.5 130 P-QFP048-0707 140 P-QFP048-1010/ P-QFP048-0707
– 5/7.5 IR3Y29A1/B1

NTSC/PAL IR3Y31M1

NTSC/PAL
IR3Y34M1
(Common terminal) IR3Y37A1
*3 RB5P0010M2
–
–
–
190
4.5/12 or 4.5/–7.5 160
3/12 88

3/6.5

RB5P0020M2
(Common terminal)
–
RB5P0050M2
(Common terminal)
–

RB5P0060M2

NTSC/PAL

RB5P006AM2

NTSC/PAL

RB5P0070M*1

RB5P0090M

*3 LRS5751*2

LRS5752*2 ★IR3Y63M *1 *2 *3 *4 *5




*3

*4

NTSC/PAL NTSC/PAL (automatic identification)
NTSC/PAL
NTSC/PAL (automatic identification)
NTSC/PAL/ (Built-in) SECAM 106/88*5 P-QFP048-0707 3/12 or 3/4.5/–7.5 92 3/5 70/57*5 LSIs for LCDs Model No. 95/80*5 3/5/13 120 P-QFP048-1010
3/7 330 P-QFP072-1010
5/13 250 P-QFP048-1010 3.3/5/7.5 197 P-LQFP100-1414

3.3/5/13 257

3.3/5 300 P-TQFP100-1414 For digital signal input panels Built-in timing generator Two inputs Digital RGB input is also available. At analog input for RGB 29 Device_E.book Page 30 Wednesday, July 18, 2007 1:03 PM LSI LSIs FOR LCDs ● Power Supply ICs for TFT-LCDs Model No. IR3M16U IR3M30M/U Application/Function Oscillation frequency (kHz) Supply voltage (V) Package 100 2.6 to 3.6 P-HQFN020-0404 70 to 1 000 2.7 to 5.5 For small TFT-LCD panels, charge pump system DC-DC converter (15.3 V, 5.1 V, –10.2 V) For small/medium TFT-LCD panels, PWM switching system DC-DC converter (Output voltage (3ch) : External setting) P-QFP048-0707/ P-VQFN036-0505 IR3M58M/U 70 to 500 4.5 to 28 ● Gray-scale ICs for TFT-LCDs Model No. Panel type IR3E2015 IR3E2045 • Small panels • Line inversion drive Function γ correction, gray-scale voltage generator for LCD drive, built-in dividing resistors IR3E3XX* No.of output circuits Output current (mA) MAX. Common output current (mA) MAX. ±1 ±1 10 5 IR3E11P1 IR3E11A1 IR3E11M1 • Large panels • Up to 20-inch panels • SXGA/UXGA • Dot inversion drive IR3E12M1 IR3E13N/U 4.5 to 5.5 P-MFP018 4.6 to 5.5 P-SSOP012-0225/ P-HQFN020-0404 7 to 14 P-QFP048-0707 ±150 ±15 6 * SHARP can offer semi-custom-made gray-scale ICs in accordance with the characteristics of LCD panels. 30 Package 7 to 15 10 γ correction, gray-scale voltage generator for LCD drive 7 to 14 P-TQFP048-0707 7 to 15 18 • Medium/large panels • Dot inversion drive Supply voltage (V) ±50 5 to 15 P-MFP018/ P-VQFN020-0404 Device_E.book Page 31 Wednesday, July 18, 2007 1:03 PM SYSTEM LSIs ■ Special-function LSIs LR388D1 Function WQVGA LCD controller with a built-in IrSimple™ function based on MDDI LR38888 LR35501/Y LR38886 LR38875 LR388733 • Built-in video memory : 240 x 400 pixels, 260 k colors (18 bits) • MDDI*1 TYPE I compliant • Supports 80-family CPU bus (8/9/16/18 bits) • Built-in modulation and demodulation IP for IrSimple™, IrDA, and IR remote controller • Built-in graphic engine (built-in zoom, scroll functions, etc.) • Supports dual displays for both main WQVGA and Sub CPU panels Supply voltage (V) Package Core : 1.8 (TYP.) VFBGA144-0808 I/O : 1.8 to 3.3 • Simple function LSI for IrSimple™, IrDA, and IR remote controller • Built-in 4 160-byte buffer • System proposal with SHARP front-end module Core : 1.8 (TYP.) IrSS™ controller with JPEG decoder • High-speed 4-Mbps infrared communication • IrSimple™ 1.0-compliant one-way communication function • Built-in JPEG decoder • SDTV and HDTV video outputs Core : 1.2 (TYP.) H. 264 decoder for one-segment digital terrestrial TV broadcasting • Built-in video (H. 264) and audio (MPEG2-AAC + SBR) decoding functions • Low power consumption : 150 mW • Fast play • Built-in memory (DRAM) • Input signal : MPEG2-TS • Image size : QVGA • Frame rate : 15 frames/s • Output signal format : Image UYVY/RGB for video, I2S for audio • Output interface : CPU bus, camera interface Home & amusement processor • Capable of moving picture transmission/play, thanks to real-time image compression and extension technology • Real images, backgrounds and sprites can be superimposed • Built-in sprite processor • Built-in color object detector • Built-in Bluetooth® interface • Built-in sound generator (ADPCM/PSG) • Built-in CMOS camera module interface • Built-in video encoder : NTSC/PAL composite signal output • Analog RGB signal output • CPU : Z80 compatible • PIO, UART, SIO, NAND flash memory I/F, ADC, PWM, SPI, etc. Front-end LSI for IrSimple™, LR388B6/B61 IrDA, and IR remote controller LR388B3 Features I/O : 1.8 to 3.3 TFBGA056-0808/ VFBGA057-0505 TFBGA180-1313 System LSIs Model No. I/O : 3.3 (TYP.) Core : 1.3 (TYP.) TFBGA208-1010 I/O : 1.8 / 3.3 Core : 1.8 ± 0.18 I/O : 3.3 ± 0.3 P-QFP128-1420/ TFBGA160-1212 Image detection engine • High-speed image processing : 960 MOPS (MAX.) • Built-in camera interface : 8-bit digital input (UYVY etc.), Can be connected to a camera directly, up to 4-million pixel camera Core : 1.8 (TYP.) • Built-in SDRAM interface : 512 Mbits (MAX.) • Universal I/O : 15 ports (MAX.) P-LQFP176-2424 • Serial interface (SPI) I/O : 3.3 (TYP.) • Bus interface (Bus Master) • Built-in PLL (200 MHz (MAX.)) • Automatic control of power consumption according to amount of data processed RSDS transmitter • RSDSTM*2 spec. V095 compliant • Low EMI*3 generation • Low current consumption : 50 mA (MAX. at 85 MHz) • High noise rejection • Data rate : 50 to 180 Mbps (CLK : at 25 to 90 MHz) • Clock delay timing of RSDSTM*2 output can be controlled by external register • RSDSTM*2 swing output voltage can be controlled by external load resistor USB On-The-Go controller • USB2.0 supplemental standard OTG1.0 compliant • Connectable to a product whose data transfer speed 12 Mbps and 1.5 Mbps • Built-in 2-ch USB line driver (2-port root HUB function) • Asynchronous SRAM-compatible interface • Supports 4 transfer modes (control, bulk, interrupt and isochronous) 3.3 ± 0.3 P-TQFP100-1414 Core : 3.3 (TYP.) P-QFP072-1010 I/O (USB) : 3.3/5 *1 MDDI (Mobile Display Digital Interface) : The serial interface standard developed by QUALCOMM *2 RSDSTM : Reduced Swing Differential Signaling *3 EMI : Electro-Magnetic Interference 31 Device_E.book Page 32 Wednesday, July 18, 2007 1:03 PM LSI IPs The IPs contribute to shorter development time, effective use of existing software and improvement in reliability. SHARP is promoting a comprehensive range of IPs to provide support for top-down design using logic synthesis. ■ CPU Cores IP ARM Macro Function ARM7TDMI 32-bit RISC ARM7TDMI CPU Core (16-bit Ins. mode supported) ARM720T ARM7TDMI + MMU + 8-Kbyte Cache ARM922T ARM9TDMI + MMU + 8-Kbyte I-cache + 8-Kbyte D-cache ARM946E-S ARM9E + PU + I-cache (configurable) + D-cache (configurable) + TCM (configurable) ARM926EJ-S ARM9E + MMU + I-cache (configurable) + D-cache (configurable) + TCM (configurable) + Java Data type Hard Soft ■ Peripherals IP Macro Function Data type Hard Soft Bus Interface PCMCIA1 PCMCIA PC card interface 82365SL PCMCIA card interface controller IEEE1284 1284 IEEE 1284 host parallel port I2C I2C I2C bus interface FDC78 High performance PC compatible floppy disk controller system (82078SL) 765A78 Extended features floppy disk controller core for FM and MFM formats PCMCIA FDD-cntl Microcontroller & Microprocessor 8051 8-bit-cntl High performance industry compatible 8-bit microcontroller with 2 timers Microprocessor Peripheral Synchronous DRAM Controller SDRAMC 8237A DMA General purpose programmable 4-channel DMA controller Color LCD Controller (TFT, HR-TFT, CSTN, STN, DMTN) LCDC PIT 8254 Extended feature 3-channel Programmable Interval Timer (PIT) RTC 146818 Ultra-low-power real time clock with up to 114 bytes of RAM PIC 8259A 8-channel cascadable Programmable Interrupt Controller (PIC) PPI 8255 General purpose Programmable Peripheral Interface (PPI) Interrupt Controller INTC Serial Communication Universal Serial Bus On The Go Controller Full Speed (12 MHz)/ Low Speed (1.5 MHz)/High Speed (480 MHz) USB-OTG USART 8251A Universal Synchronous/Asynchronous Receiver/Transmitter (USART) SSP Synchronous Serial Port SCC UART 85C30 SCC 2-channel Serial Communications Controller with FIFOs 16550A Universal Asynchronous Receiver/Transmitter (UART) with FIFO 6402 Compact Universal Asynchronous Receiver/Transmitter (UART) ■ Analog Cells IP ADC DAC Macro Function High Speed ADC 8-bit AD (80 MHz), 10-bit AD (80 MHz), 6-bit AD (80 MHz) Voice ADC 12-bit AD/14-bit AD (8 to 32 kHz) Audio ADC 20-bit AD (44.1 kHz) High Speed DAC 8-bit DA/9-bit DA (30 MHz) Voice DAC 10-bit DA (8 to 32 kHz) Audio DAC 20-bit DA (44.1 kHz) Data type Hard Soft ■ Analog PLL (Phase Locked Loop) IP Fout : 100 to 200 MHz PLL Fout : 200 to 400 MHz PLL Fout : 400 to 800 MHz Fin : 32 kHz, Fout : 33 to 134 MHz ■ Others IP 32 Macro LVDS LVDS Receiver RSDS RSDS Transmitter Function Input signal : 7-bit 3 ch (6 bits for RGB), 85 MHz (MAX.) Input signal : 7-bit 4 ch (8 bits for RGB), 85 MHz (MAX.) Input signal : 8 bits for RGB, 90 MHz (MAX.) Contact a SHARP sales office about applicable series. A use-fee and license-fee are required for use of the above IPs. Data type Hard Soft Device_E.book Page 33 Wednesday, July 18, 2007 1:03 PM SMART CARD SYSTEMS ★Under development Type Contact Communication standards Protocol Transmission speed (kbps) MAX. ISO/IEC7816 T=1 19.2 SJCard 211 Contactless ISO/IEC14443 Type B ISO/IEC14443-4 424 Contact ISO/IEC7816 T = 0, 1 76.8 Contactless ISO/IEC14443 Type B ISO/IEC14443-4 424 Contact ISO/IEC7816 T = 0, 1 76.8 Contactless ISO/IEC14443 Type B JCOP* (Under development) ISO/IEC14443-4 Nonvolatile memory capacity Cycling capability CPU Security system 1 Mbyte (Flash memory) 100 000 times 16 bits RSA, DES, T-DES, etc. high-speed cryptographic authentication with built-in coprocessor, hardware-based random number generator 1 Mbyte (Flash memory) 100 000 times 16 bits 1 Mbyte (Flash memory) 100 000 times 32-bit MIPS Smart Card Systems ■ Smart Cards/LSI Modules for Smart Cards (Under development) 424 SJ card211 JCOP* card ★32-bit MIPS card • Java CardTM 2.1.1 compliance • Capable of developing applications using Java language • Java CardTM 2.2 compliance • GP (Global Platform) 2.1.1 compliance • EMV 2000 compliance • Capable of developing applications using Java language • With built-in 32-bit MIPS on CPU • Security upgrades thanks to secure controller, MIPS32TM 4KSdTM *JCOP : JCOP means IBM's Java Card Open Platform, which was developed by IBM Corporation as an embedded Operating System (OS) for smart cards which conforms to the standards of Java and Global Platform. This platform ensures the security of applications working on various mobile terminals, such as a USB key and a smart card suitable for multiple applications. 33 Device_E.book Page 34 Wednesday, July 18, 2007 1:03 PM LSI SMART CARD SYSTEMS ■ Reader/Writer for Smart Cards Type Model No. Communication standard Host interface Transmission speed between smart card and RW (kbps) Smart card operation method Outline dimensions WxHxD (mm) Mass (g) Power supply RW-4040 ISO/IEC7816 (T = 0, 1) USB1.1 9.6 to 153.6 70.4 x 14.1 x 60.5 Approx. 65 DC 5 V (USB connector) RW-4020 (LR550R03) ISO/IEC7816 (T = 0, 1) PC card interface Type II 10.8 to 344.1 Manual insertion/ Manual ejection 54 x 5 x 85.6 Approx. 30 DC 5 V (PC card connector) Contact type Contact type reader/writer RW-4040 Contact type reader/writer RW-4020 (LR550R03) • High-speed data communication • Conforms to PC/SC standard • USB interface • High-speed data communication • PC card interface Type II ■ SDK (Software Development Kit) for Smart Cards SDK type For SJCard 211 For JCOP 34 Contents Development kit CD for SJCard SJCard simulator Contact type reader/writer (1 set) Development kit CD for JCOP31id Card Device_E.book Page 35 Wednesday, July 18, 2007 1:03 PM LSI FLASH MEMORIES ■ Highly Functional Flash Memories ● Boot Block Type 3 V Page Mode Flash Memories: LH28FXXXBF Series 64 M 128 M Bit Erasable block configuration size x 16 x 16 Operating temp. (°C) Model No. Top boot –40 to 85 LH28F640BFH-PTTL Bottom boot –40 to 85 LH28F640BFH-PBTL Top boot –40 to 85 LH28F128BFH-PTTL Bottom boot –40 to 85 LH28F128BFH-PBTL Remarks 4 Kwords x 8, 32 Kwords x 127 • Built-in dual work function • Built-in OTP function [4 words (factory area) + 4 words (user area) ] Smart Card Systems Capacity (bit) 4 Kwords x 8, 32 Kwords x 255 ■ Standard Flash Memories ● Boot Block Type 3 V Flash Memories: LH28FXXXBJ Series Capacity (bit) Bit Erasable block configuration size Operating temp. (°C) 0 to 70 Model No. Remarks LH28F800BJ-PTTL Top boot 8M x 8/ x 16 –40 to 85 4 Kwords x 8, 32 Kwords x 15 (or 8 Kbytes x 8, 64 Kbytes x 15) LH28F800BJH-PTTL • Built-in OTP function [4 words (factory area) + 3 963 words (user area) ] 0 to 70 LH28F800BJ-PBTL Bottom boot 16 M x 8/ x 16 4 Kwords x 8, 32 Kwords x 31 (or 8 Kbytes x 8, 64 Kbytes x 31) Top boot –40 to 85 LH28F800BJH-PBTL –40 to 85 LH28F160BJH-PTTL – Bottom boot –40 to 85 LH28F160BJH-PBTL 35 Device_E.book Page 36 Wednesday, July 18, 2007 1:03 PM LSI SYSTEM-FLASH ■ Fast-Reprogramming System-Flash for Digital Equipment Capacity (bit) Bit Erasable block configuration size Operating temp. (°C) Model No. Remarks LHF00L24 Top boot –40 to 85 LHF00L28 16 M x 16 4 Kwords x 8 + 32 Kwords x 1, 64 Kwords x 15 LHF00L25 Bottom boot –40 to 85 LHF00L29 LHF00L08 Top boot 32 M x 16 –40 to 85 LHF00L10 • Fast-programming (4-Kword blocks) • Built-in OTP function [4 words (factory area) + 4 words (user area) ] LHF00L14 4 Kwords x 8 + 32 Kwords x 1, 64 Kwords x 31 LHF00L09 Bottom boot –40 to 85 LHF00L11 LHF00L15 ■ System-Flash for Amusement Products Capacity (bit) Operating temp. (°C) Model No. Remarks 32 M x 16 4 Kwords x 8 + 32 Kwords x 1, 64 Kwords x 31 Top boot 0 to 70 LHF00L34 • 44 SOP industry standard package 64 M x 16 4 Kwords x 8, 32 Kwords x 127 Top boot 0 to 70 LH28F640BF-PTTL • 44 SOP industry standard package 256 M x 16 16 Kwords x 4, 64 Kwords x 255 Top boot 0 to 85 LH28F256BF-PTSL • 70 SSOP industry standard package 0 to 70 LH28F512BFBD-PTSL • Compact FBGA (CSP) package 0 to 85 LH28F512BFND-PTSL • 70 SSOP industry standard package 512 M 36 Bit Erasable block configuration size x 16 16 Kwords x 4, 64 Kwords x 255 x 2 Top/Top boot Device_E.book Page 37 Wednesday, July 18, 2007 1:03 PM LSI SYSTEM-FLASH ■ System-Flash for Automotive Use 32 M Bit Erasable block configuration size x 16 4 Kwords x 8, 32 Kwords x 63 x 16 4 Kwords x 8, 32 Kwords x 127 Operating temp. (°C) Top boot –40 to 85 Remarks LH28F320BFH-PTTL LH28F640BFH-PTTL Top boot 64 M Model No. –40 to 85 LH28F640BFH-PBTL Bottom boot • Employs copper frame x 16 4 Kwords x 8, 32 Kwords x 255 x 16 4 Kwords x 8, x2 32 Kwords x 127 Top/Bottom boot x 16 4 Kwords x 8, x2 32 Kwords x 255 Top/Top boot –40 to 85 128 M 256 M LH28F128BFH-PTTL Top boot LH28F128BFH-PWTL –40 to 85 LH28F256BFH-PTTL Flash Memories/ Combination Memories Capacity (bit) ■ System-Flash for Network Equipment Capacity (bit) Bit Erasable block configuration size Operating temp. (°C) Model No. Remarks 64 M x 8/ x 16 64 Kwords x 64 or 128 Kbytes x 64 Symmetrical block –40 to 85 LH28F640SPH-PL • 56 TSOP industry standard package 128 M x 8/ x 16 64 Kwords x 128 or 128 Kbytes x 128 Symmetrical block –40 to 85 LH28F128SPH-PTL • 56 TSOP industry standard package 37 Device_E.book Page 38 Wednesday, July 18, 2007 1:03 PM LSI HIGHLY FUNCTIONAL/STANDARD FLASH MEMORIES ■ Highly Functional Flash Memories Boot Block Type 3 V Page Mode Flash Memories: LH28FXXXBF Series Supply voltage Capacity Bit (bit) configuration 64 M 128 M x 16 x 16 64 M : VCC = 2.7 to 3.6 V, VPP = 1.65 to 3.6 V or 9.0 to 10.0 V 128 M : VCC = 2.7 to 3.6 V, VPP = 2.7 to 3.6 V or 9.0 to 10.0 V Erasable block size Parameter : 4 Kwords x 8 Main : 32 Kwords x 127 Model No. Top boot Bottom boot Top Parameter : 4 Kwords x 8 boot Main : 32 Kwords x 255 Bottom boot Page mode Read current Standby Operating Access time (mA) MAX. current temp. access time (ns) MAX. f = 5 MHz (µA) MAX. (°C) (ns) MAX. (CMOS) (CMOS) P-TSOP048-1220 (Normal bend) LH28F640BFHE-PTTLHFA 70 30 25 Package 20 TFBGA048-0808 LH28F640BFHG-PTTL70A LH28F640BFHE/G-PBTL70A 70 30 25 20 LH28F128BFHT/B-PTTL75A 75 25 35 40 LH28F128BFHT/B-PBTL75A 75 25 35 40 P-TSOP048-1220 –40 to 85 (Normal bend)/ TFBGA048-0808 P-TSOP056-1420 (Normal bend)/ LFBGA072-0811 Contact a SHARP sales office for other packages and top boot/bottom boot models other than those listed above. ■ Standard Flash Memories Boot Block Type 3 V Flash Memories: LH28FXXXBJ Series Supply voltage Capacity Bit (bit) configuration 8M x 8/ x 16 VCC = 2.7 to 3.6 V, VCCW = 2.7 to 3.6 V or 11.7 to 12.3 V Erasable block size Boot : Top 4 Kwords (8 Kbytes) x 2 boot Parameter : 4 Kwords (8 Kbytes) x 6 Main : Bottom 32 Kwords (64 Kbytes) x 15 boot Model No. Read current Standby Operating Access time (mA) MAX. current temp. f = 5 MHz (µA) MAX. (ns) MAX. (°C) (CMOS) (CMOS) LH28F800BJE-PTTL90 0 to 70 90 25 15 LH28F800BJHE-PTTL90 –40 to 85 LH28F800BJE-PBTL90 0 to 70 90 25 P-TSOP048-1220 (Normal bend) 15 LH28F800BJHE-PBTL90 Top Boot : 4 Kwords (8 Kbytes) x 2 25 70 LH28F160BJHE-PTTL70 x 8/ Parameter : boot 16 M Bottom x 16 4 Kwords (8 Kbytes) x 6 70 25 LH28F160BJHE-PBTL70 Main : 32 Kwords (64 Kbytes) x 31 boot Contact a SHARP sales office for other packages and top boot/bottom boot models other than those listed above. 38 Package –40 to 85 15 –40 to 85 15 –40 to 85 P-TSOP048-1220 (Normal bend) Device_E.book Page 39 Wednesday, July 18, 2007 1:03 PM SYSTEM-FLASH ■ Fast-Reprogramming System-Flash for Digital Equipment Capacity Bit (bit) configuration 16 M 32 M x 16 x 16 VCC = 2.7 to 3.6 V, VPP = 11.7 to 12.3 V Erasable block size Parameter : 4 Kwords x 8 + 32 Kwords x 1 Main : 64 Kwords x 15 Parameter : 4 Kwords x 8 + 32 Kwords x 1 Main : 64 Kwords x 31 Model No. Top boot Bottom boot Top boot Bottom boot Read current Standby 4-Kword Access time (mA) MAX. current programming (ns) MAX. f = 5 MHz (µA) MAX. time (s) (CMOS) (CMOS) Operating temp. (°C) LHF00L24 Package TFBGA048-0608 70 0.31 17 10 –40 to 85 70 0.31 17 10 –40 to 85 LHF00L28 LHF00L25 P-TSOP048-1220 (Normal bend) TFBGA048-0608 LHF00L29 P-TSOP048-1220 (Normal bend) LHF00L08 TFBGA048-0608 LHF00L10 90 0.31 10 17 –40 to 85 TFBGA048-0707 LHF00L14 P-TSOP048-1220 (Normal bend) LHF00L09 TFBGA048-0608 LHF00L11 90 0.31 10 17 –40 to 85 TFBGA048-0707 P-TSOP048-1220 (Normal bend) LHF00L15 Contact a SHARP sales office for other packages and top boot/bottom boot models other than those listed above. Flash Memories/ Combination Memories Supply voltage ■ System-Flash for Amusement Products Supply voltage Capacity Bit (bit) configuration 32 M/64 M : VCC = 2.7 to 3.6 V 256 M/512 M : VCC = 1.7 to 1.95 V, VCCQ = 2.7 to 3.6 V, VPP = 0.9 to 1.95 V or 8.5 to 9.5 V Erasable block size Model No. Read Standby Operating Access time Page mode current current (mA) MAX. access time temp. (µA) MAX. (ns) MAX. f = 5 MHz (ns) MAX. (°C) (CMOS) (CMOS) Package 32 M x 16 Parameter : 4 Kwords x 8 + 32 Kwords x 1 Main : 64 Kwords x 31 Top boot LHF00L34 90 – 17 10 0 to 70 P-SOP044-0600 64 M x 16 Parameter : 4 Kwords x 8 Main : 32 Kwords x 127 Top boot LH28F640BFN-PTTLZ1A 90 35 25 25 0 to 70 P-SOP044-0600 256 M x 16 Parameter : 16 Kwords x 4 Main : 64 Kwords x 255 Top boot LH28F256BFN-PTSLZ2 100 25 22 60 0 to 85 P-SSOP070-0500 LH28F512BFBD-PTSLZ4 85 0 to 70 LFBGA072-0811 LH28F512BFBD-PTSLZ2 90 25 22 120 LH28F512BFND-PTSLZ1 100 0 to 85 P-SSOP070-0500 512 M x 16 Parameter : Top/ 16 Kwords x 4 x 2 Top Main : boot 64 Kwords x 255 Contact a SHARP sales office for other packages and top boot/bottom boot models other than those listed above. 39 Device_E.book Page 40 Wednesday, July 18, 2007 1:03 PM LSI SYSTEM-FLASH ■ System-Flash for Automotive Use Supply voltage Capacity Bit (bit) configuration 32 M 64 M 128 M 256 M x 16 x 16 x 16 x 16 VCC = 2.7 to 3.6 V, VCCQ = 2.7 to 3.6 V Erasable block size Model No. Parameter : Top 4 Kwords x 8 Main : boot 32 Kwords x 63 Parameter : Top 4 Kwords x 8 Main : boot 32 Kwords x 127 Parameter : Bottom 4 Kwords x 8 Main : boot 32 Kwords x 127 Parameter : Top 4 Kwords x 8 Main : boot 32 Kwords x 255 Parameter : Top/ 4 Kwords x 8 x 2 Bottom Main : boot 32 Kwords x 127 Parameter : Top/ 4 Kwords x 8 x2 Top Main : boot 32 Kwords x 255 Page Read Standby Access mode current current Operating time access (mA) temp. (µA) (ns) time MAX. (°C) MAX. MAX. (ns) f = 5 MHz (CMOS) MAX. (CMOS) LH28F320BFHE-PTTLE0 70 25 25 20 –40 to 85 LH28F640BFHE-PTTLH1A 70 30 25 20 –40 to 85 Package P-TSOP048-1220 (Normal bend) P-TSOP048-1220 (Normal bend) LH28F640BFHE-PBTLHK 70 30 25 20 –40 to 85 LH28F128BFHT-PTTLT1A 75 25 35 40 –40 to 85 P-TSOP056-1420 (Normal bend) LH28F128BFHED-PWTLT2 70 30 25 40 –40 to 85 P-TSOP048-1220 (Normal bend) LH28F256BFHTD-PTTLZ3 75 25 40 80 –40 to 85 P-TSOP056-1420 (Normal bend) ■ System-Flash for Network Equipment Supply voltage Capacity Bit (bit) configuration 40 VCC = 2.7 to 3.6 V, VPP = 2.7 to 3.6 V or 9.0 to 10.0 V Erasable block size Model No. Page Read Standby Access mode current current Operating access time (mA) temp. (µA) time (ns) MAX. (°C) MAX. (ns) f = 5 MHz MAX. (CMOS) MAX. (CMOS) Package 64 M x 8/ x 16 64 Kwords x 64 or 128 Kbytes x 64 Symmetrical block LH28F640SPHT-PL12B 120 25 15 120 –40 to 85 P-TSOP056-1420 128 M x 8/ x 16 64 Kwords x 128 or 128 Kbytes x 128 Symmetrical block LH28F128SPHT-PTL12B 120 25 15 120 –40 to 85 P-TSOP056-1420 Device_E.book Page 41 Wednesday, July 18, 2007 1:03 PM COMBINATION MEMORIES ★Under development ■ Boot Block Type Flash Memory + Pseudo SRAM ● 1.8 V models with 1.8 V I/O voltage LRS1890A Bottom boot LRS18A6 LRS1897 LRS18CCA LRS18CP Capacity (bit) [Bit configuration] Access time (ns) MAX. Supply voltage (V) Flash memory Pseudo SRAM Flash Pseudo Flash Pseudo I/O SRAM Page Synchronous Random Page Synchronous memory memory SRAM Random voltage mode mode burst mode mode mode burst mode core voltage core voltage 256 M [x 16] 64 M [x 16] 1.7 to 1.95 1.7 to 1.95 1.7 to 1.95 LFBGA072-0811 85 25 – 70 20 – 128 M [x 16] Bottom/Top 512 M [x 16] 128 M [x 16] boot Bottom/Top/ 740 M [x 16] 256 M [x 16] Bottom boot Bottom boot 128 M [x 16] 64 M [x 16] Package 85 25 – 70 20 93 25 52 MHz 70 20 85 25 – 70 20 – 1.7 to 1.9 2.7 to 3.1 1.7 to 1.9 LFBGA072-0811 1.7 to 1.9 2.7 to 3.1 1.7 to 1.9 LFBGA072-0811 83 MHz 1.7 to 1.95 1.7 to 1.95 1.7 to 1.95 LFBGA088-0912 – 1.7 to 1.95 1.7 to 1.95 1.7 to 1.95 LFBGA072-0811 ● 1.8 V models with 3 V I/O voltage Model No. Flash memory block configuration LRS18CJ Top boot LRS18CK Bottom boot LRS18BK Top boot Capacity (bit) [Bit configuration] 128 M [x 16] ★LRS18C8C LRS18BN 256 M [x 16] LRS18B0* 32 M [x 16] 85 25 64 M [x 16] – 65 20 – 1.7 to 1.95 2.7 to 3.1 2.7 to 3.1 54 MHz 85 25 64 M [x 16] Bottom boot LRS18AZ* Supply voltage (V) Flash memory Pseudo SRAM Flash Pseudo Flash Pseudo I/O SRAM Synchronous Random Page Synchronous memory memory SRAM Random Page voltage mode burst mode mode mode burst mode core voltage core voltage mode 64 M [x 16] 16 M [x 16] LRS18BL Access time (ns) MAX. LFBGA072-0811 LFBGA088-0811 65 20 – 1.7 to 1.95 2.7 to 3.1 2.7 to 3.1 – LFBGA072-0811 54 MHz LFBGA088-0811 54 MHz 85 Package 25 Flash Memories/ Combination Memories Model No. Flash memory block configuration LFBGA088-0811 65 20 – 1.7 to 1.95 2.7 to 3.1 2.7 to 3.1 – LFBGA072-0811 * This flash memory is divided into two banks, each including an enable signal. ● 3 V models with 3 V I/O voltage Model No. LRS18BT Flash memory block configuration Capacity (bit) [Bit configuration] Top boot LRS1872A Bottom boot LRS18831 Top boot LRS18841 Bottom boot Supply voltage (V) Flash memory Pseudo SRAM Flash Pseudo Flash Pseudo I/O SRAM Page Synchronous Random Page Synchronous memory memory SRAM Random mode voltage burst mode mode mode burst mode core voltage core voltage mode Bottom boot 32 M [x 16] 8 M [x 16] LRS1871A Access time (ns) MAX. Package 85 – – 85 – – 2.7 to 3.1 2.7 to 3.1 2.7 to 3.1 LFBGA072-0811 16 M [x 16] 85 35 – 85 – – 2.7 to 3.3 2.7 to 3.1 2.7 to 3.1 LFBGA072-0811 32 M [x 16] 70 35 – 60 – – 2.7 to 3.1 2.7 to 3.1 2.7 to 3.1 LFBGA072-0811 64 M [x 16] 41 Device_E.book Page 42 Wednesday, July 18, 2007 1:03 PM REG POWER DEVICES ■ Low Power-Loss Voltage Regulators ● TO-220 type (Ta = 25°C) PQxxRD08J00H series PQ3RD083J00H 5, 9, 12 ASO protection function 0.8 20 1.25 10 PQ6RD083J00H PQxxRA11J00H series Low dissipation current at OFF state (Iqs : 1µA (MAX.)) ASO protection function PQxxxRDA1SZH series PQxxxRDA2SZH series ASO protection function, low dissipation current at OFF state (Iqs : 5 µA (MAX.)) PQ3RD13J000H ASO protection function PQxxxEF02SZH series 35 1.5 5, 9, 12 1 20 15 1.4 24 5, 8, 9, 12 – 2 – Minimum operating input voltage : 2.35 V (4 terminals) 1.4 10 15 2 35 1.5 PQxxRF21J00H series PQ070XF01SZH PQ070XF02SZH PQ070VK01FZH PQ070VK02FZH PQ15RW08J00H PQ15RW11J00H PQ15RW21J00H Minimum operating input voltage : 2.35 V (5 terminals) ASO protection function, minimum operating input voltage : 3.5 V ASO protection function PQ20RX05J00H Variable output voltage, output ON/OFF control PQ20RX11J00H PQ150VB01FZH PQ150VB02FZH Overheat shutdown circuit, minimum operating input voltage : 2.35 V (5 terminals) PQ30RV11J00H PQ30RV31J00H PQ7RV4J0000H *1 *2 *3 *4 *5 *6 *7 42


B



B


A


A











A


A





E





E


A


A


A


A




C




C



E



E ±3 ±2.5 0.5 15 1.5 to 7 ±2*4 1.25 10 15 3.0 to 15 – ±2.5*4 10 3.0 to 20 1.25 12.5 1.5 to 15 2 15 1.5 35 2 4.6 10 1.8 ±2*4 A
B B TO-220 B

o*6

B 6

o*

B 20

o*6

B 18 1.5 to 7

o*
18 1.5 to 30 Variable output voltage 3 Lead forming available
0.5 2 Variable output voltage A 1 1 PQ30RV21J00H A A 2 17
A
1 1 A

10 24

2 –

2 PQ150RWA2SZH


1 1.4

B
3.3 20
A

1.8 0.8

1.5, 1.8, 2.5, 3.3 18 1.4

1.5 Minimum operating input voltage : 2.35 V (4 terminals)

5, 9, 12 3.5 A

15 High output current


35 General purpose


5, 9, 12 2 PQ3RF23J000H PQ3RF33J000H 1.4

3.3 20 ASO protection function A ±3 18 1.5
±2.5 ±2.5 PQ3RD23J000H PQxxRD21J00H series ±3
Package shape type*7 3.3 1 General purpose ±2.5
Package 3.3, 5, 9, 12 20 1 PQxxRF11J00H series PQxxRH11J00H series ±3 6.3 PQxxRD11J00H series PQxxxEF01SZH series 3.3 Low dissipation current at OFF state Power Output Input Output Output Dropout dissipation current voltage voltage voltage voltage (W) Io Vin Vo*3 precision VI-O*5 (A) (V) (V) TYP. (%) (V) Pd*1 Pd*2 ON/OFF control Features Built-in functions Overcurrent protection Model No. Electrical characteristics Overheat protection Absolute maximum ratings 6 At self-cooling With infinite heat sink attached The xx/xxx in the model No. refer to the output voltage values of the model (e.g. 05/050 for 5 V, 12/120 for 12 V, 015 for 1.5 V). Reference voltage accuracy Current ratings are defined individually. o : Available by adding circuit Refer to page 65 B Device_E.book Page 43 Wednesday, July 18, 2007 1:03 PM POWER DEVICES ● High output current type [TO-220 high heat radiation type, TO-3P type] PQ5EV3J0000H PQ5EV5J0000H 3.5 High output current, minimum operating input voltage : 2.35 V PQ5EV7J0000H *1 *2 *3 *4 Pd*2 5 7 1.6 1.5 to 5 45 ±1*3 0.5 7.5









Package TO-220
(heat sink exposure)
At self-cooling With infinite heat sink attached Reference voltage accuracy Current ratings are defined individually. ● Low output current type [TO-92 type] (Ta = 25°C) Features Power Output Input Output Output Dropout dissipacurrent voltage voltage voltage voltage tion Io Vin Vo precision VI-O Pd*1 (A) (V) (V) TYP. (%) (V) (W) PQ033ES1MXPQ PQ050ES1MXPQ PQ033ES3MXPQ 16 5 Low output current type with general purpose TO-92 package (for auxiliary power supply) 3.3 9 5 Package
±2 0.52 0.3 PQ050ES3MXPQ 0.4 (Io = 150
mA) 3.3 0.15 Overcurrent protection Model No. Electrical characteristics Built-in functions Overheat protection Absolute maximum ratings Power Devices/ Analog ICs Pd*1 Output Output Dropout voltage voltage voltage Vo precision VI-O*4 (V) (%) (V) Variable output voltage Power dissipation (W) ON/OFF control Output Input current voltage Io Vin (A) (V) Built-in functions Overcurrent protection Features Model No. (Ta = 25°C) Electrical characteristics Overheat protection Absolute maximum ratings TO-92 0.7 (Io = 300
mA)
*1 At self-cooling 43 Device_E.book Page 44 Wednesday, July 18, 2007 1:03 PM REG POWER DEVICES ✩New product ■ Surface Mount Type Low Power-Loss Voltage Regulators ● SOT-23-5 type (Ta = 25°C) Absolute maximum ratings 1.8, 2.5, 2.8, 3.0, 3.3, 3.5, 5.0 16 0.35 0.18 *3 ± 2.0 (3.0 V output) *4 ± 2.0 9 Low dissipation current at OFF state PQ1XAxx1MZPH series Compact, ceramic capacitor compatible Compact, ceramic capacitor compatible, high reliability Output Dropout voltage voltage precision VI-O (%) (V) Output voltage Vo*2 (V) TYP. ON/OFF control PQ1Xxx1M2ZPH series Compact, low output current Power Input Output dissipavoltage current tion Vin Io Pd*1 (V) (A) (W) Overcurrent protection PQ1Uxx1M2ZPH series Features Built-in functions Overheat protection Model No. Electrical characteristics







SOT-23-5



0.26 (Io = 60 mA) Package *1 When mounted on a board *2 The xx in the model No. refer to the output voltage values of the model (e.g. 50 for 5.0 V, 18 for 1.8 V). *3 1.5, 1.8, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.3, 3.5, 3.7, 4.0, 4.5, 5.0 *4 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 ● SOT-23L type (Ta = 25°C) PQ1KAxx3MZPH series – 16 9 Output voltage Vo*2 (V) TYP. 0.18 0.4 0.3 – 15 Output Dropout voltage voltage precision VI-O (%) (V) ± 2.7 0.26
(3.0 V output) (Io = 60 mA) *3 1.8, 2.5, 3.0, ± 2.0 0.7
3.3, 3.6, 5.0 (3.0 V (Io = 1.5, 1.8, 2.5, output) 300 mA)
3.3, 5.0, 9.0 Low dissipation current at OFF state PQ1Kxx3M2ZPH series Compact, surface mount type, low dissipation current at OFF state (Iqs : 0.1 µA (MAX.)) Compact, surface mount type, high ripple rejection, output current of up to 300 mA Compact, surface mount type, output current of up to 300 mA, ceramic capacitor compatible Power Output Input Output dissipacurrent voltage current tion Vin Io Io Pd*1 (V) (A) (A) (W) ON/OFF control PQ1RxxJ0000H series Features Built-in functions Overheat protection Model No. Electrical characteristics Overcurrent protection Absolute maximum ratings





SOT-23L


Package *1 When mounted on a board *2 The xx in the model No. refer to the output voltage values of the model (e.g. 25 for 2.5 V, 47 for 4.7 V, 50 for 5.0 V). *3 1.8, 2.0, 2.3, 2.5, 2.7, 2.8, 2.9, 3.0, 3.2, 3.3, 3.4, 3.5, 3.7, 3.8, 4.0, 4.2, 4.4, 4.7, 4.9, 5.0, 5.2 ● SOT-89 type (Ta = 25°C) PQ1LAxx5MSP series PQ1LAX95MSPQ PQ1Mxx5M2SPQ PQ1MX55M2SPQ PQ1Nxx3MxSPQ ✩PQ1MGxx8MSPQ ✩PQ1MGX38MSPQ PQ2Lxxx2MSPQ 44 *1 *2 *3 *4 *5 *6 16 1.5, 1.8, 2.5, 3.0, 3.2, 3.3, 5.0 ± 2.0 (3.0 V 1.5, 1.8, 2.5, output) 3.3, 5.0, 9.0 0.3 15 0.5 0.9 9 0.35 0.8 0.25/ch Output Dropout voltage voltage precision VI-O*3 (%) (V) 0.7








1.5, 1.8, 2.5, 3.3, 5.0 ± 2.0


1.5 to 9.0 ± 2.0*6


1.8, 2.5, 3.3, 5.0 ± 2.0 (5.0 V output)


1.3 to 5.0 ± 2.0*6


2.5, 3.3 ± 2.0

0.8, 1.0, 1.2 ± 2.0 –

0.5 to 3.5 ± 2.0 –

*5 – 0.4

0.7 Variable output voltage Output voltage Vo*2 (V) TYP. Low dissipation current at OFF state PQ1LAxx3MSPQ Compact, high radiation package, low dissipation current at OFF state (Iqs : 1 µA (MAX.)) Compact, high radiation package, low dissipation current at OFF state (Iqs : 1 µA (MAX.)), ceramic capacitor compatible Compact, high radiation package, ceramic capacitor compatible Ceramic capacitor compatible, variable output voltage Compact, high output current, ceramic capacitor compatible Ceramic capacitor compatible, variable output voltage Reset signal output function*4, ceramic capacitor compatible Compact, ceramic capacitor compatible Compact, ceramic capacitor compatible, variable output type Compact, high radiation package, 2 outputs Power Output Input dissipacurrent voltage tion Io Vin Pd*1 (A) (V) (W) ON/OFF control PQ1Lxx3M2SPQ Features Built-in functions Overcurrent protection Model No. Electrical characteristics Overheat protection Absolute maximum ratings
SOT-89
6 9 When mounted on a board The xx in the model No. refer to the output voltage values of the model (e.g. 25 for 2.5 V, 50 for 5.0 V). [Except PQ2Lxxx2MSPQ] Current ratings are defined individually. Reset detection voltage : 4.2 V, 3.8 V Output voltage combination : 3.3/3.3 V, 3.3/2.5 V, 3.3/1.8 V, 3.3/1.5 V, 2.5/1.8 V, 2.5/1.5 V Reference voltage accuracy Package
Device_E.book Page 45 Wednesday, July 18, 2007 1:03 PM POWER DEVICES ★Under development ● SC-63 type       Low dissipation current at OFF state Variable output voltage  ON/OFF control   F   F    F     F      F      G      F      F      F      G      G      G –      1.0      F 0.5      F      F      F    G    G    G       F       F       G       G       G      G  PQ3DZ53J000H  Package shape type*6 1.5 to 7 ±2.0*3 10 Package Taped package Reset signal generation function (input voltage drop detection) Overcurrent protection PQ07VR5MAPH series Features Built-in functions Overheat protection Model No. (Ta = 25°C) Absolute maximum ratings Electrical characteristics Output current Power Output Output Input Dropout IO dissi- voltage voltage voltage voltage (A) pation VO*2 preciVin VI-O*5 Pd*1 (V) sion (V) (V) (W) TYP. (%) 0.5 1 1.5  PQ3DZ13J000H PQxxDZ51J00H series  ASO protection function, low dissipation current at OFF state (Iqs: 5 mA (MAX.))   PQxxDZ11J00H series Ceramic capacitor compatible, ASO protection function, low disPQxxxDNA1ZPH series sipation current at OFF state (Iqs: 5 mA (MAX.)), solder dip compatible lead shape Low dissipation current at OFF PQxxxDZ01ZPH series state (Iqs: 5 µA (MAX.)) PQxxxEZ5MZPH series PQxxxEZ01ZPH series Minimum operating input voltage: 2.35 V  Minimum operating input voltage: 2.35 V, ceramic capacitor compat★PQxxxENA1ZPH series ible, solder dip compatible lead shape PQxxxENAHZPH series 10   (2 A) PQ070XZ01ZPH PQ070XN01ZPH PQ070XNA1ZPH PQ070XNAHZPH ★PQ070XNB1ZPH Minimum operating input voltage: 2.35 V, solder dip compatible lead shape Minimum operating input voltage: 2.35 V, ceramic capacitor compatible, solder dip compatible lead shape 1.5, 1.8, ±2.5 2.5, 3.3 1.2, 1.5, 1.8, 2.5, ±2.0 3.3 1.5, 1.8, – 2.5, 3.3 1.5, 1.8, 2.5, 3.0, 3.3 ±2.5*4 1.5, 1.8, 2.5  3.7 1.0, 1.2  ±30 mV SC-63 G –  5.5  Minimum operating input voltage: 1.1 V (Dual power supply type), ceramic capacitor compatible, solder dip compatible lead shape Minimum operating input voltage: 2.35 V 8  Minimum operating input voltage: 2.35 V PQxxxGN01ZPH series Minimum operating input voltage: 1.7 V (Dual power supply type), ceramic capacitor compatible, solPQxxxGN1HZPH series der dip compatible lead shape PQ070XZ5MZPH series 1.5, 1.8, 2.5, 3.0, ±2.5*4 3.3  PQxxxEZ02ZPH series ★PQxxxGM02ZPH 3.3, 5   PQxxxFZ01ZPH series 9, 10  PQxxxENA1ZPH series Minimum operating input voltage: 1.7 V (Dual power supply type) 3.3, 5, 8, 9, 12 0.5  PQxxxFZ5MZPH series ±3.0  Minimum operating input voltage: PQxxxEN01ZPH series 2.35 V, solder dip compatible lead shape PQxxxEZ1HZPH series 5, 9, 12 24 Power Devices/ Analog ICs 3.3 – 0.8, 1.0, 1.2  (2 A) ±2.0 0.3   ±2.0*3 0.5  10 1.5 to 7   – –  ±2.0 *1 With infinite heat sink attached *2 The xx/xxx in the model No. refer to the output voltage values of the model (e.g. 033 for 3.3 V, 05/050 for 5 V, 12/120 for 12 V). *3 Reference voltage accuracy *4 The value is defined as ± 50 mV in some models. *5 Current ratings are defined individually. *6 Refer to page 65 45 Device_E.book Page 46 Wednesday, July 18, 2007 1:03 PM REG POWER DEVICES ★Under development ● SC-63 type (cont’d) PQ015YZ01ZPH PQ035ZN01ZPH PQ035ZN1HZPH ★PQ035ZM02ZPH PQ20VZ51J00H PQ20VZ11J00H PQ20WZ51J00H PQ20WZ11J00H PQ200WNA1ZPH PQ200WN3MZPH  Reference voltage (Vref): 1.0 V, minimum operating input voltage: 1.7 V (Dual power supply type)  Reference voltage (Vref): 0.6 V, minimum operating input voltage: 1.7 V (Dual power supply type), ceramic capacitor compatible, solder dip compatible lead shape Minimum operating input voltage: 1.1 V (Dual power supply type), ceramic capacitor compatible, solder dip compatible lead shape Minimum operating input voltage: 4.5 V 1.0       F 0.5       F     F     F     G     G    G             F       F       F       1.0 to ±3.0*3 1.5 3.7 – ±30 mV 5.5  0.8 to 3.5  (2 A) ±2.0 8  0.3 1.5 to ±2.0*3 20  Minimum operating input voltage:  3.5 V, ASO protection function, low dissipation current at OFF  state (Iqs: 5 µA (MAX.)) 3.0 to ±2.5*3 20 24 SC-63 F 0.5 3.0 to 20 ±2.5*3 6.8 5.0 to 20 G    *1 With infinite heat sink attached *2 The xx/xxx in the model No. refer to the output voltage values of the model (e.g. 033 for 3.3 V, 05/050 for 5 V, 12/120 for 12 V). *3 Reference voltage accuracy *4 The value is defined as ± 50 mV in some models. *5 Current ratings are defined individually. 46 Low dissipation current at OFF state Variable output voltage Package shape type*6 Package 1.5 to 7 ±2.0*3 10  Minimum operating input voltage: 3.5 V, ASO protection function, low dissipation current at OFF  state (Iqs: 5 µA (MAX.)) ceramic capacitor compatible, solder dip compatible lead shape Minimum operating input voltage: 3.5 V, low dissipation current at  OFF state (Iqs: 5 µA (MAX.)), (0.3) ceramic capacitor compatible, current limit: 800 mA Taped package PQ015YZ5MZPH  (2 A) ON/OFF control PQ070XZ02ZPH  Minimum operating input voltage: 2.35 V Overcurrent protection PQ070XZ1HZPH Features Built-in functions Overheat protection Model No. (Ta = 25°C) Absolute maximum ratings Electrical characteristics Output current Power Output Output Input Dropout IO dissi- voltage voltage voltage voltage (A) pation VO*2 preciVin VI-O*5 Pd*1 (V) sion (V) (V) (W) TYP. (%) 0.5 1 1.5    *6 Refer to page 65 Device_E.book Page 47 Wednesday, July 18, 2007 1:03 PM POWER DEVICES ● TO-263 type (Ta = 25°C) PQxxxY053ZPH 1.0



1.5 to 5 1.0*3



1.5, 2.5, 3.3 1.0



1.5 to 5 1.0*3







1.5 to 7 ±2.0*3



1.5, 1.8, 2.5







Taped package Low dissipation current at OFF state 1.5, 2.5, 3.3 Power Output Input dissipa- Output Output Dropout current voltage tion voltage voltage voltage Vin Io Vo*2 precision VI-O*4 Pd*1 (V) (A) (%) (V) TYP. (V) (W) Variable output voltage ON/OFF control Features Built-in functions Overcurrent protection Model No. Electrical characteristics Overheat protection Absolute maximum ratings Package
5.0 PQxxxY3H3ZPH High output current (minimum operating input voltage : 2.35 V)

7
3.5 PQ05VY3H3ZPH 1.5, 1.8, 2.5 PQxxxEH02ZPH 2 A output (minimum operating input voltage : 2.35 V)

0.5 35 ±2.5 TO-263
2.0 PQ070XH02ZPH

10 PQxxxEH01ZPH 1 A output (minimum operating input voltage : 2.35 V) ±2.5
1.0 1.5 to 7 ±2.0*3 PQ070XH01ZPH *1 With infinite heat sink attached *3 Reference voltage accuracy

*2 The xxx in the model No. refer to the output voltage values of the model (e.g. 015 for 1.5 V, 025 for 2.5 V, 033 for 3.3 V). *4 Current ratings are defined individually. ● SOP-8 type (Ta = 25°C) Built-in sink source function (For DDR memory) ±0.8 6 0.6 Output voltage Vo (V) TYP. Output voltage precision (mV) Taped package PQ1DX125MZPQ Built-in sink source function (For DDR II memory) Power Output Input dissipacurrent voltage tion Vin Io Pd* (V) (A) (W) Overcurrent protection PQ1DX095MZPQ Features Electrical characteristics Built-in functions Overheat protection Absolute maximum ratings Model No. Power Devices/ Analog ICs PQ05VY053ZPH VDD x 1/2 (VDDQ : 1.5 V (MIN.) ) –


VDD x 1/2 (VDDQ : 2.3 V (MIN.) ) ± 35


Package SOP-8 * When mounted on a board 47 Device_E.book Page 48 Wednesday, July 18, 2007 1:03 PM REG POWER DEVICES ★Under development ■ Surface Mount Type Chopper Regulators (DC-DC Converters) Model No. No. of Output type Built-in Input voltage Switch output Step Step Inver- SW range current circuits down up sion Tr Vin (V) Isw (A) PQ6CU11X1APQ • High voltage CMOS output : 30 V (MAX.) • White LED driver for back light • Output ON/OFF control function • Overvoltage/overcurrent protection circuits • Soft start function

PQ6CB11X1AP • High voltage CMOS output : 30 V (MAX.) • White LED driver for back light (Capable of driving up to 4 LEDs in series connection) • Output ON/OFF control function • Overvoltage/overcurrent protection circuits • Soft start function

PQ6CB11X1CP • High voltage CMOS output : 30 V (MAX.) • White LED driver for back light (Capable of driving up to 6 LEDs in series connection) • Output ON/OFF control function • Overvoltage/overcurrent protection circuits • Soft start function

PQ6CU12X2APQ • High switching voltage : 40 V (MAX.) • For tuner power supply • Output ON/OFF control function

PQ7L2010BP • Possible to correspond also to operation in the minute lighting mode • High frequecny PWM control for brightness adjustment • Output ON/OFF control function

PQ1CZ38M2ZPH series


PQ1CZ21H2ZPH • PWM chopper regulator • Output ON/OFF control function • Overcurrent/overheat protection circuits • Low dissipation current at OFF state (Standby crrent : 1 µA (MAX.) )


1
PQ1CX12H2ZPQ • Bootstrap system for high efficiency (Efficiency 90% (TYP.) ) • Low dissipation current

from 0.8 up to 40 ★PQ1CX41H2ZPQ • Bootstrap system for high efficiency (Efficiency 91% (TYP.) ) • Low voltage output : 0.8 V (MIN.) • Ceramic capacitor compatible



up to 28 1.5* 1 3.5*1 2M USB-10 Switchable between USB-6 2.0 M and 1.2 M 300 k VREF*2 to 35*5 (step-down type)/ –VREF*2 100 k to –30*5 (inverting type) VREF*3 to 24*5 150 k (step-down type) SC-63 VREF*2 to 35*5 (step-down type)/ –VREF*2 to –30*5 (inverting type) (Determined by external Tr) 4.5 to 22 150 k TO-263 6 (Determined 100 k to by external 1 M*7 Tr) 2.2 to 6.0 External SOP-8 VREF*4 to 24*5 400 k (step-down type) 3.3, 5.0* (TYP.)


2.5*1
up to 40
300 k to SOT-23-6W 800 k*7 300 k up to 33
IR3M19N up to 30

• High transient load characteristics from built-in current control circuit • Soft start function • Overcurrent/overvoltage/undervoltage protection circuits • Internal reference voltage accuracy (±1%) up to 36
• Bootstrap system for high efficiency (Efficiency 90% (TYP.) ) • Low dissipation current • Low voltage output : 1.2 V (MIN.) IR3M18N 3.0 to 5.5
PQ1CX22H2ZPQ • Soft start function • Undervoltage protection circuit • Timer latch short-circuit protection circuit • Standby function USB-6 up to 30 1.5*1 • PWM chopper regulator (high oscillation frequency) • Output ON/OFF control function • Overcurrent/overheat protection circuits PQ1CYxx3HZPH series PQ1CYxx3LZPH series 1.2 M 0.8*1 PQ1CZ41H2ZPH • PWM chopper regulator • Fixed output voltage : 3.3 V or 5 V • Output ON/OFF control function • Overheat protection circuit SOT-23-6 — 2.7 to 5.5 • PWM chopper regulator (high oscillation frequency) • Output ON/OFF control function • Overcurrent/overheat protection circuits • For light load PQ1CY1032ZPH Output Oscillation voltage frequency Package Vo (V) fo (Hz) TYP. 0.25*1
• PWM chopper regulator • Output ON/OFF control function • Overheat protection/overcurrent shutdown circuits • High output current type up to 5.5 2.7 to 5.5 • PWM chopper regulator • Sleep mode function (by switching between PWM and PFM) • Overvoltage/overcurrent protection circuits • Soft start function ★PQ5CB11X1AP 48 Features (Ta = 25°C) P-SSOP008-0150 1.24 to input voltage 220 k *1 Peak current (absolute maximum ratings) *2 VREF nearly equal to 1.26 V (TYP.) *3 VREF nearly equal to 1 V (TYP.) *4 VREF nearly equal to 0.8 V (TYP.) *5 Output voltage variable range *6 The xx in the model No. refer to the output voltage values of the model (e.g. 33 for 3.3 V, 50 for 5.0 V). *7 Selectable oscillation frequency range Device_E.book Page 49 Wednesday, July 18, 2007 1:03 PM POWER DEVICES ★Under development ■ Surface Mount Type Chopper Regulators (DC-DC Converters) (cont’d) Model No. ★IR3M56N IR3M17U ★IR3M57N IR3M30M/U IR3M58M/U No. of Output type Built-in Input voltage output Step Step Inver- SW range circuits down up sion Tr Vin (V) Features • High efficiency synchronous rectified step-down converter • Current mode control • Soft start function • Overcurrent/overvoltage/undervoltage/overheat protection circuits
1 • Standby function (output ON/OFF control function for each channel) • Soft start function • Undervoltage protection circuit External 4.5 to 36 Switch current Isw (A)


(Determined by external Tr) External
4.5 to 36


• ON/OFF sequence setting • Timer latch short-circuit protection circuit • Soft start function • Overcurrent/undervoltage/overheat protection circuits


• ON/OFF sequence setting without external control • Timer latch phase fault protection circuit • Soft start function • Overcurrent/undervoltage/overheat protection circuits

o*1

4.5 to 28
70 k to 1M*3 External setting External 0.4*2 (when using setting internal Tr)


External 3 200 k/ 300 k/ 400 k/ 0.8 to 6.3 500 k/ P-TSSOP028-0225 external sync. 1*2 (when using 2.7 to 5.5 internal Tr) o*1 External Package (Determined 100 k to by external 500 k*3/ P-HQFN020-0404 Tr) external sync. 2.2 to 6.5 2 Output Oscillation voltage frequency Vo (V) fo (Hz) TYP. (Determined 200 k/300 k/ by 0.8 to 6.3 400 k/500 k/ P-TSSOP016-0225 external Tr) external sync.
• High efficiency two channel synchronous rectified step-down converter • Current mode control • Soft start function • Overcurrent/overvoltage/undervoltage/ overheat protection circuits (Ta = 25°C) P-QFP048-0707/ P-VQFN036-0505 70 k to 500 k*3 External setting *1 Built-in SW Tr can be used in step-up mode ; external SW Tr is required in step-down or inverting mode. *2 Constant current (MAX.) *3 Selectable oscillation frequency range ■ Chopper Regulators (DC-DC Converters) ● TO-220 type (Ta = 25°C) Absolute maximum ratings Model No. PQ1CG38M2FZH PQ1CG38M2RZH PQ1CG21H2FZH PQ1CG21H2RZH Power Switch Input dissipacurrent voltage tion Vin Isw Pd*1 (V) (A) (W) Features • PWM chopper regulator (high oscillation frequency) • Built-in overcurrent/overheat protection circuits • Output ON/OFF control function • For light load Electrical characteristics Output voltage Vo*2 (V) Output Oscillation saturation frequency voltage fo (kHz) Vsat TYP. (V) TYP. Package Outline shape type*5 E 3 0.8* 300 0.9 D E • PWM chopper regulator • Built-in overcurrent/overheat protection circuits • Output ON/OFF control function 100 1.0 D 1.5*3 PQ1CG41H2FZH PQ1CG41H2RZH PQ1CG2032FZH PQ1CG2032RZH • PWM chopper regulator (high oscillation frequency) • Built-in overcurrent/overheat protection circuits • Output ON/OFF control function 40 14 VREF*4 to 35 (step-down type)/ –VREF*4 to –30 (inverting type) E 300 TO-220 PQ1CG3032RZH PQ2CF1J0000H 70 D 1.4 • PWM chopper regulator (high oscillation frequency) • Built-in overcurrent/overheat protection circuits • Output ON/OFF control function • PWM chopper regulator • Built-in overcurrent/overheat protection circuits *1 With infinite heat sink attached *2 Output voltage variable range D E • PWM chopper regulator • Built-in overcurrent/overheat protection circuits • Output ON/OFF control function 3.5*3 PQ1CG3032FZH 0.9 E 150 D 2.5*3 35 *3 Peak current 15 4.5 to 35 (step-up type) 50 *4 VREF nearly equal to 1.26 V (TYP.) 0.6 *5 Refer to page 65 E 49 Device_E.book Page 50 Wednesday, July 18, 2007 1:03 PM LSI POWER DEVICES ■ Power Supply ICs for CCDs/CCD Camera Modules Model No. No. of Input voltage output range (V) circuits Output voltage (V) System 15 Step-up type PWM + REG Switching frequency (Hz) SW Tr Switching Drive capacity current (mA) (pF) [Built-in SW Tr] [External SW Tr] Built-in 20 (DC) – External – 1 000 100 (DC) – 100 (DC) – 100 (DC) – 1.2 (DC) – Package 1M –8 IR3M52Y7 5 Inverting type PWM 2.7 to 5.5 2.5 to 3.3 REG 2.5 to 3.3 REG 1.8/1.2 REG 15 Charge pump – 200 k IR3M61U*1/63U – 41WL-CSP*2 – –8 Negative charge pump 2.5 (DC) – 3.3 Step-down type PWM + REG 120 (DC) – 1.8 Step-down type PWM + REG 50 (DC) – 15 Step-up type PWM + REG 600 (DC) – – 1 000 – 1 000 170 (DC) – 10/20 (DC) – 2/5 (DC) – 150 (DC) – 6 (DC) – 7 (DC) – 50 (DC) – P-VQFN032-0505 4.5 to 10 1M Built-in 4 IR3M49U6 2.7 to 5.5 Step-up, step-down, step-up/down type PWM External setting 4.5 to 16 –8/–5 Negative charge pump 3.3 Step-down type PWM + REG 15 Charge pump + REG P-VQFN036-0505 External – – 200 k – Charge pump 15/12 IR3M55U* /59U 1M Inverting type PWM REG 1 Built-in 1M Built-in P-VQFN032-0505 3 300 k IR3M48U6 2.7 to 3.2 – –8 Negative charge pump + REG 1.8 REG – System Switching frequency (Hz) P-VQFN032-0505 *1 For automotive use *2 3.97 mm x 3.97 mm x 0.82 mm (TYP.) ■ Power Supply ICs for TFT-LCDs Model No. No. of Input voltage output range (V) circuits Output voltage (V) Step-up (20 V (MAX.) )/ step-down type PWM IR3M58M/U IR3M30M/U IR3M16U 50 4.5 to 28 3 2.7 to 5.5 2.6 to 3.6 External setting External setting Step-down type PWM Step-down, inverting type PWM Step-up, step-down, step-up/down type PWM Step-up, step-down, step-up/ down, inverting type PWM Step-up, step-down, step-up/ down, inverting type PWM 15.3 Charge pump 5.1 Charge pump + REG –10.2 Negative charge pump 70 k to 500 k 70 k to 1M 100 k SW Tr Switching Drive capacity current (mA) (pF) [Built-in SW Tr] [External SW Tr] Built-in (Step-up type) 400 External – External – Built-in (Step-up type) Built-in (Step-up type) Package 1 000 1 000 – 1 000 – External – 1 000 – 0.1 (DC) – – 5 (DC) – – 0.1 (DC) – P-QFP048-0707/ P-VQFN036-0505 P-HQFN020-0404 Device_E.book Page 51 Wednesday, July 18, 2007 1:03 PM POWER DEVICES ■ Fail Safe IC Model No. Operating voltage Features • Malfunction detection • Built-in 8-bit ADC • Built-in timer circuit • Built-in key detection output OR gate IR3T46U/46U6* VBAT (V) VBAC (V) VIO (V) 3.2 to 4.5 3.0 to 3.3 2.6 to 3.0 Dissipation current (µA) Operating temp. (°C) TYP. 10 –20 to +85 * 46U: Tray package 46U6: Taped package ■ LED Drivers Model No. Function Features Input Output No. of Number Booster Built-in Built-in voltage current 1 Oscillation constant * frequency output of SW range current (mA) (Hz) circuits LEDs method circuit Tr (V) TYP. MAX. PQ6CU11X1APQ PQ6CB11X1AP PQ6CB11X1CP PQ7L2010BP IR2E46Y6 IR2E47U6 IR2E49U IR2E51Y6 *1 *2 *3 *4 • High voltage CMOS output: 30 V (MAX.) • Output ON/OFF control function • Overvoltage/overcurrent protection circuits White LED driver • Softstart function for back light (for small panels) 1 3 (Series connection) *1
4 (Series connection) *1
to 5.5 Package SOT-23-6 1.2 M PWM USB-6 6 (Series connection) * 4 (Series connection) *1
1 250*2
2.7 to 5.5 • Possible to correspond also to operation in the minute lighting mode • High frequency PWM control for brightness adjustment • Output ON/OFF control function • I2C bus control • Illumination mode (64 levels/ch) RGB LED driver • Picture light mode (32 levels/ch) for picture lights • Brightness adjustment and illuminations • Standby function/soft start function • Overcurrent/undervoltage/overheat protection circuits • Independent current control for two systems (4 outputs and 2 outputs) White LED driver • LED non-connected judging function for back light (for small panels) • Brightness adjustment • Undervoltage/overheat protection circuits 3 3 PWM

155/ch 2.7 to 4.5 (in picture 1.2 M 33WL-CSP*4 light mode) 6 4+2 Charge pump
– 2.7 to 5.5 • Buit-in 150 mA driver for each channel • Step-up DC-DC output short-circuit White LED driver protection function • Current driver output open detection for back light • Capable of external brightness adjustment (for medium using PWM input signal panels) • Overcurrent/overvoltage/undervoltage/ overheat protection circuits 5 40 PWM
• Capable of direct connection of ambient light sensor • Brightness adjustment by ambient illuminance feedback (16-step ambient illuminance/128-level illuminance) (for main LCDs) • Non-external coil thanks to charge pump drive • Capable of driving 4 main-LEDs, 2 sub-LEDs, and 3 call alert LEDs with a single device. • I2C interface • Standby function/power on reset function/ soft start function 9 LED driver for back light and call alert display LED driver (auto brightness adjustment) Power Devices/ Analog ICs ● Built-in step up circuit 4 + 2 Charge + 3 pump
2.0 M USB-10 20/ch External 6 to 28 150/ch*2 – 3.0 to 4.5 (for drive)/ 2.3 to 3.2 (for control) 25/ch 1M P-HQFN024-0404 100 k to P-VQFN036-0606 1 M*3 660 k 35WL-CSP*4 Constant current (MAX.) Use this IC within the range of power dissipation. Selectable oscillation frequency range 3.57 mm x 3.57 mm x 0.82 mm (TYP.) 51 Device_E.book Page 52 Wednesday, July 18, 2007 1:03 PM LSI POWER DEVICES ● External power supply for LEDs Model No. Function Features IR2D20U 24-dot LED panel driver with constant-current sink outputs • Output current (constant current sink output) : 30 mA (MAX.) (setup by external resistor) • Gradation function (clock cycle setting or external synchronization) • Independent current control for three systems (for RGB LED) • LED drive voltage : 15 V • Rated output voltage : 20 V (MAX.) • fCLK : 20 MHz (MAX.)/16.6 MHz (MAX.) (at cascade connection) IR2D071 16-dot LED panel driver with constant current sink outputs • Output current (constant-current sink output) : 60 mA (MAX.) (setup by external resistor) • Rated output voltage : 7 V (MAX.) • fCLK : 20 MHz (MAX.)/16.6 MHz (MAX.) (at cascade connection) Supply voltage (V) Package 4.5 to 5.5 P-HQFN052-0707 3.0 to 5.5 P-SDIP028-0400 ■ Laser Diode Drivers Model No. Application Function Drive mode Maximum output current (mA) MIN. Applicable SHARP diode type Supply voltage (V) — 2.4 to 3.5 IR3C14N1 For Mini Disc players Built-in 100 mA driver, APC function DC mode 100 IR3C22N For CD/DVD players Built-in APC function, with inhibit input pin — 150 Package P-SSOP008-0150 52 P 4.5 to 5.5 (Single power supply) Device_E.book Page 53 Wednesday, July 18, 2007 1:03 PM ANALOG ICs ✩New product ★Under development ■ Video Interface ICs for TFT-LCDs IR3Y18A1 Input signal Composite Y/color Analog OSD video difference RGB (Digital)
LCD panel Serial ± power + power Low voltage Digital data source source source input control Color decode NTSC/PAL
*3 IR3Y26A2/A6

–

Supply voltage (V) TYP. Power consumption (mW) TYP. Package 4.5/12 or 4.5/–7.5 130 P-QFP048-0707 140 P-QFP048-1010/ P-QFP048-0707 5/7.5 IR3Y29A1/B1

NTSC/PAL IR3Y31M1

NTSC/PAL
IR3Y34M1

(Common terminal) IR3Y37A1
*3 RB5P0010M2
–
–
–
190
4.5/12 or 4.5/–7.5 160
3/12 88

3/6.5

RB5P0020M2
(Common terminal)
–
RB5P0050M2
(Common terminal)
–

RB5P0060M2

NTSC/PAL

RB5P006AM2

NTSC/PAL

RB5P0070M*1

RB5P0090M

*3 LRS5751*2

LRS5752*2 ✩IR3Y63M
*3


*1 For digital signal input panels
*4

NTSC/PAL NTSC/PAL (automatic identification)
NTSC/PAL
*3 Two inputs 3/12 or 3/4.5/–7.5 92 3/5 70/57*5 95/80*5 3/5/13 120 P-QFP048-1010
3/7 330 P-QFP072-1010
5/13 250 P-QFP048-1010 3.3/5/7.5 197 P-LQFP100-1414 NTSC/PAL (automatic identification)
NTSC/PAL/ (Built-in) SECAM *2 Built-in timing generator 106/88*5 P-QFP048-0707 Power Devices/ Analog ICs Model No.

3.3/5/13 257

3.3/5 300 *4 Digital RGB input is also available. P-TQFP100-1414 *5 At analog input for RGB ■ Power Amplifiers for Wireless LAN Model No. IRM046U7 ★IRM065U7 IRM047U7 ★IRM060U7 IRM063U7 IRM048U7 ★IRM053U7 Application Operating frequency (GHz) Supply Output power voltage (V) TYP. (dBm) TYP. For 2.4 GHz wireless LAN (IEEE 802.11b/g) 2.4 to 2.5 18 (at EVM 3%) 105 30
– For 5 GHz wireless LAN (IEEE 802.11a) 4.9 to 5.9 18 (at EVM 2%) 140 25
– For 2.4 GHz wireless LAN (IEEE 802.11b/g) 2.4 to 2.5 18 (at EVM 3%) 130 29
Built-in (IN/OUT) For 5 GHz wireless LAN (IEEE 802.11a) 4.9 to 5.9 18 (at EVM 3%) 160 30
Built-in (IN/OUT) 18 (at EVM 3%) 105 30
– 16 (at EVM 2%) 75 28
Built-in (IN/OUT) 18 (at EVM 3%) 120 30
Built-in (IN/OUT) 140 25
– 150 31
For 5 GHz wireless LAN (IEEE 802.11a) Package P-HQFN024-0404 For 2.4 GHz wireless LAN* (IEEE 802.11b/g) For 2.4 GHz wireless LAN (IEEE 802.11b/g) Supply Gain Detection Matching current circuit (mA) TYP. (dB) TYP. function 3.3 2.4 to 2.5 4.9 to 5.9 18 (at EVM 2%) P-HQFN016-0303 P-HQFN024-0404 P-HQFN010-0202A P-HQFN024-0404 Built-in (IN/OUT) P-HQFN010-0202A * Can be used as a power amp for PHS and DECT (1.9 GHz band), or as a driver amp for FWA (1.9 to 2.6 GHz band). 53 Device_E.book Page 54 Wednesday, July 18, 2007 1:03 PM LSI ANALOG ICs ■ ICs for Audio Equipment Model No. IR3R55M1 Description RF amp IC for Mini Disc players IR3R58M1 54 Function Supply voltage (V) Package 2.4 to 3.3 P-TQFP048-0707 ±1.2 to ±3.25 P-SSOP024-0275 2.4 to 3.5 P-SSOP008-0150 Built-in RF amp, ADIP detection circuit, connectable to hologram pickup Built-in 2x speed RF amp, ADIP detection circuit, connectable to hologram pickup IR3R59N1 Audio amp IC Built-in serial control input ATT and filter amp IR3C14N1 Laser diode driver for Mini Disc players Built-in 100 mA driver, APC function Device_E.book Page 55 Wednesday, July 18, 2007 1:03 PM LSI PACKAGES ■ CSP ● CSP (Chip Size Package) The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and digital cameras. ● FBGA (CSP) Compact and lightweight Ability to create a near-chip size and lighter-weight package in comparison with conventional plastic packages. ● High reliability Comparable high reliability with that of conventional plastic packages. ● Mountability Conventional mounting system is available for CSP. SOP and QFP can be mounted together with CSP. Terminal pitch 0.8 mm 0.65 mm 0.5 mm 0.4 mm Maximum terminal counts 288 (16 mm x 16 mm) 352 (16 mm x 16 mm) 424 (14 mm x 14 mm) 264 (10 mm x 10 mm) Nominal dimensions 6 mm x 6 mm to 16 mm x 16 mm Gold wire Bare chip Packages Features 5 mm x 5 mm to 10 mm x 10 mm Mold resin Package height 1.2 mm (MAX.)* Cross section example Substrate Cu pattern Diameter : 0.45 mm 0.4 mm 0.3 mm 0.24 mm Lead-free solder ball Terminal pitch : 0.8 mm 0.65 mm 0.5 mm 0.4 mm * At 0.8 mm terminal pitch ● Wafer-level CSP The wafer-level CSP (WL-CSP) is a kind of chip-size package which is manufactured by assembling directly onto the finished wafer. ● Compact and thinner size It makes it possible to create an almost bare-chip-size and lighter-weight package. ● Features Mountability The conventional CSP mounting system can be also used in that of wafer-level CSP, which facilitates chip mounting more than bare-chip mounting does. It can be mounted together with other existing packages and passive components. (The use of underfill is recommended to improve the reliability of assembly.) Chip size* 4 mm x 4 mm 3.5 mm x 3.5 mm 3 mm x 3 mm 2.5 mm x 2.5 mm Pad pitch 0.5 mm 0.4 mm 0.5 mm 0.4 mm 0.5 mm 0.4 mm 0.5 mm 0.4 mm Maximum terminal counts 49 (7 x 7) 81 (9 x 9) 36 (6 x 6) 49 (7 x 7) 25 (5 x 5) 36 (6 x 6) 16 (4 x 4) 25 (5 x 5) * Rectangular chip form is also available. Cu pattern Bare chip Cross section example Package height 0.5 mm to 1 mm Passivation layer Lead-free solder ball 55 Device_E.book Page 56 Wednesday, July 18, 2007 1:03 PM LSI PACKAGES ■ LGA ● LGA (Land Grid Array Package) The LGA package has basically the same structure as the CSP, enabling a thin package by removing the solder balls from the bottom of the package. The LGA package contributes to the compact and thinner design of applications, such as mobile phones and digital cameras. ● Lower package height Achieves 0.5 mm Max. in package height. ● High reliability Comparable high reliability with that of conventional plastic package. Features ● Excellent mountability Conventional mounting system is available for LGA. SOP and QFP can be mounted together with LGA. Terminal pitch 0.5 mm Maximum terminal count 216 (10 mm x 10 mm) Nominal dimensions 6 mm x 6 mm ~ 10 mm x 10 mm Bare chip Cross section example Gold wire Package height 0.5 mm (MAX.) Cu pattern 56 Mold resin Substrate Land Terminal pitch : 0.5 mm Device_E.book Page 57 Wednesday, July 18, 2007 1:03 PM PACKAGES ■ SiP (System in Package) ● Wide variety of lineup It is possible to provide a wide lineup of stacked CSPs, including 2-chip, 3-chip, 4-chip and 5-chip stacked CSPs, to respond to customer needs. ● Compact and thinner size Encapsulating multiple bare chips into an existing plastic package contributes to decreasing the mounting area. In addition, SHARP's wafer thinning technology makes it possible to achieve 1.4 mm package height. ● Multiple functions Multiple bare chips of different sizes and functions, such as logic LSIs and memories, can be incorporated in a single package, making possible multiple functions. ● Same-size chip stacking technology SHARP's stacking technology enables stacking of multiple same-size bare chips, contributing to higher memory density. Features Packages System in Package is an original SHARP high-density mounting technology that achieves high-density memory capacity and multiple functions by stacking multiple bare chips or multiple packages. This technology has two major streams. One method refers to a chipstacked package technology that can achieve up to 5-chip mounting by stacking chips in a single package. The other method refers to a package stack technology with which it is possible to stack a package of over 5 chips, by stacking multiple packages in which 1 to 2 chips are stacked. The System in Package technology contributes to higher functionality of applications, such as mobile phones and digital cameras, as well as to reduction in size and weight. ● Chip Stacked CSP (4-chip stacked CSP) When using a SHARP four-chip stacked CSP, the mounting area and weight of a package can be decreased by half in comparison with using two 2-chip stacked CSPs, or a 3-chip stacked CSP and a conventional CSP. (5-chip stacked CSP) Gold wire Mold resin Bare chip Cross section example Package height 1.4 mm (MAX.)* 1.6 mm (MAX.)* Substrate Cu pattern Diameter : 0.45 mm 0.30 mm Lead-free solder ball Terminal pitch : 0.8 mm 0.5 mm * At 0.8 mm terminal pitch ● Chip Stacked TSOP/QFP*/VQFN/HQFN ● Decreased mounting area By encapsulating two identical or different types of bare chips into a single conventional plastic package, the mounting area of the package can be decreased. ● Multiple functions Thanks to the incorporation of different sizes and functions of multiple bare chips, such as logic LSIs and memories, the functionality increases. ● Higher memory density When incorporating two identical memory bare chips into a single package, memory density doubles on the same mounting area. Features (TSOP, TQFP) Cross section example Gold wire Bare chip Lead Package height 1.2 mm (MAX.) Bare chip (VQFN) Gold wire Mold resin Package height 1.0 mm (MAX.) * Including TQFP and LQFP. Mold resin (HQFN) Gold wire Mold resin Package height 1.0 mm (MAX.) 57 Device_E.book Page 58 Wednesday, July 18, 2007 1:03 PM LSI PACKAGES ● Package Stacked Features ● Multi stacking The package stacking technology makes it possible to increase the memory capacity and create a combined system with memory and logic LSI. In the case of combination memories, memory capacity can be increased by stacking multiple 0.5 mm height packages in which 1 to 2 chips are stacked. ● Decreased mounting area and height The package stacked technology makes it possible to decrease the mounting area by stacking multiple packages in which 1 to 2 chips are stacked, also achieving 1.5 mm height when six chips are stacked. ● Multiple functions Thanks to the combination of packages in which various kinds of LSIs are mounted, such as a memory and ASIC, achieving an increase in and enhancement of functionality is easy. LSI : 1 chip Mold resin LSI : 2 chips Mold resin Gold wire Substrate Substrate Through hole Through hole Gold wire Lead-free solder ball Lead-free solder ball Terminal pitch : 0.5 mm Gold wire LSI : 3 chips Terminal pitch : 0.5 mm Mold resin Substrate Lead-free solder ball Terminal pitch : 0.5 mm Cross section example Examples of 3D-SiP composition • High-density combination memory (3-package stacking) 6 chips 1.5 mm (MAX.) 1.5 mm (MAX.) 2 chips 2 chips 2 chips • System LSI (Logic LSI + Memory) (2-package stacking) 4 chips 1.8 mm (MAX.) 58 1.8 mm (MAX.) 3 chips 1 chip Device_E.book Page 59 Wednesday, July 18, 2007 1:03 PM PACKAGES ■ SOF ● SOF (System On Film) SOF is a highly flexible thin film package, created from SHARP’s TCP technologies. It can be easily bent, and contributes to thin and compact design of products. Peripheral circuit components can also be mounted. ● Highly flexible and thin film package By using highly flexible and thin film, SOF contributes to creating thin and compact products. It can also achieve finer terminal pitches and multiple outputs easily, and pattern layout on a film under the chip makes it possible to improve the flexibility of the pattern layout. Features ● Multiple chip mounting Bare chip Cross section example Packages Plural bare chip mounting and incorporation of peripheral components contribute to the higher functionality of products. Cu pattern Solder resist 38 µm Thickness 0.6 mm (MIN.) 1.0 mm (TYP.) Under fill material Gold bump Film width : W1 Maximum pattern layout area : W2 35 mm super wide 48 mm super wide 70 mm wide 28.6 mm 41.6 mm 59.0 mm Maximum device pitch : L 15 sprockets 8 µm Copper foil thickness Copper foil type Rolled or electrolytic Copper foil plating Tin (Sn) Minimum pattern pitch 0.029 mm Sprocket hole : A 1.981 mm (wide) /1.42 mm (super wide) Sprocket hole : B 1.981 mm (wide) /1.42 mm (super wide) 4.75 mm Sprocket hole pitch B A W1 W2 L Other components Maximum pattern layout area Film specifications Bare chips and peripheral circuit components can be mounted on the film. In addition to the SOF described above, a conventional TCP (Tape Carrier Package) is also available. 59 Device_E.book Page 60 Wednesday, July 18, 2007 1:03 PM LSI PACKAGES ★Under development ■ Package Lineup ● Surface-mount Type Package type Appearance (Package material) Package code No. of terminals Terminal pitch Nominal dimensions mm mm LFBGA048-0606 TFBGA048-0608 48 TFBGA048-0808 TFBGA056-0808 56 TFBGA060-0811 60 (48)* TFBGA064-0811 64 TFBGA072-0811 LFBGA072-0811 81 LFBGA085-0811 85 LFBGA087-0811 87 LFBGA088-0811 LFBGA088-0912 FBGA (CSP) (Plastic) 6.0 x 6.0 x (1.4) 6x 8 6.0 x 8.0 x (1.2) 8x 8 8.0 x 8.0 x (1.2) 8 x 11 8.0 x 11.0 x (1.2) 8.0 x 11.0 x (1.4) / (1.6) 88 8x 8 8.0 x 8.0 x (1.2) 8 x 11 8.0 x 11.0 x (1.4) / (1.6) 9 x 12 9.0 x 12.0 x (1.4) / (1.6) 8 x 11 8.0 x 11.0 x (1.4) / (1.6) LFBGA090-0811 90 TFBGA096-1010 96 LFBGA107-0912 107 TFBGA111-1010 111 TFBGA112-1010 112 LFBGA115-0914 115 9 x 14 9.0 x 14.0 x (1.4) / (1.6) LFBGA116-1010 116 10 x 10 10.0 x 10.0 x (1.4) / (1.6) LFBGA130-1013 130 10 x 13 10.0 x 13.0 x (1.4) / (1.6) TFBGA144-1111 144 11 x 11 11.0 x 11.0 x (1.2) TFBGA160-1212 160 12.0 x 12.0 x (1.2) LFBGA168-1212 168 12.0 x 12.0 x (1.4) / (1.6) TFBGA180-1212 180 TFBGA184-1212 184 TFBGA240-1414 240 LFBGA280-1616 280 ★LFBGA352-1616 352 0.8 10 x 10 10.0 x 10.0 x (1.2) 9 x 12 9.0 x 12.0 x (1.4) / (1.6) 10 x 10 10.0 x 10.0 x (1.2) 12 x 12 12.0 x 12.0 x (1.2) 14 x 14 14.0 x 14.0 x (1.2) 16 x 16 16.0 x 16.0 x (1.5) 6.0 x 6.0 x (1.2) TFBGA064-0606 64 6x 6 LFBGA144-0909 140 9x 9 9.0 x 9.0 x (1.4) LFBGA160-1010 160 10 x 10 10.0 x 10.0 x (1.4) / (1.6) TFBGA180-1313 180 LFBGA192-1010 192 LFBGA208-1212 208 LFBGA224-1313 224 TFBGA260-1313 260 * Figures in brackets indicate available terminal counts. 60 6x 6 72 (64)* TFBGA081-0808 Package width & length x (seated height [MAX.]) mm 0.65 13 x 13 13.0 x 13.0 x (1.2) 10 x 10 10.0 x 10.0 x (1.4) / (1.6) 12 x 12 12.0 x 12.0 x (1.4) / (1.6) 13 x 13 13.0 x 13.0 x (1.4) / (1.6) 13.0 x 13.0 x (1.2) Device_E.book Page 61 Wednesday, July 18, 2007 1:03 PM PACKAGES ★Under development ● Surface-mount Type (cont’d) Appearance (Package material) Package code No. of terminals LFBGA064-0606 64 TFBGA068-0606 68 VFBGA081-0606 81 TFBGA084-0606 84 Terminal pitch Nominal dimensions mm mm 6.0 x 6.0 x (1.1) 6x 6 6.0 x 6.0 x (0.9) 100 7.0 x 7.0 x (0.9) TFBGA100-0707 VFBGA108-0707 TFBGA108-0707 VFBGA120-0707 TFBGA120-0707 7.0 x 7.0 x (1.1) 108 7x 7 TFBGA152-0808 FBGA (CSP) VFBGA171-0811 LFBGA171-0811 VFBGA176-0909 TFBGA176-0909 TFBGA180-0909 VFBGA188-1111 TFBGA188-0909 VFBGA208-1010 TFBGA208-1010 TFBGA245-1010 LFBGA245-1010 (Plastic) 7.0 x 7.0 x (1.1) 7.0 x 7.0 x (1.1) 8x 8 144 LFBGA144-0811 7.0 x 7.0 x (0.9) 7.0 x 7.0 x (0.9) 120 VFBGA144-0808 LFBGA144-0808 6.0 x 6.0 x (0.9) 6.0 x 6.0 x (1.1) VFBGA100-0606 VFBGA100-0707 Package width & length x (seated height [MAX.]) mm 8.0 x 8.0 x (0.9) 8.0 x 8.0 x (1.3) / (1.5) 8 x 11 8.0 x 11.0 x (1.3) 152 8x 8 8.0 x 8.0 x (1.1) 171 8 x 11 0.5 9x 9 180 11 x 11 188 9x 9 10 x 10 245 WFBGA144-0606 144 ★WFBGA121-0606 121 TFBGA168-0707 168 TFBGA204-0808 204 9.0 x 9.0 x (1.1) 11.0 x 11.0 x (0.9) 9.0 x 9.0 x (1.1) 10.0 x 10.0 x (0.9) 208 424 8.0 x 11.0 x (0.9) 8.0 x 11.0 x (1.3) / (1.5) 9.0 x 9.0 x (0.9) 176 FBGA424-1414 Packages Package type 10.0 x 10.0 x (1.1) 10.0 x 10.0 x (1.3) 14 x 14 6x 6 0.4 14.0 x 14.0 x (1.8) 6.0 x 6.0 x (0.75) 6.0 x 6.0 x (0.8) 7x 7 7.0 x 7.0 x (1.0) 8x 8 8.0 x 8.0 x (1.0) 61 Device_E.book Page 62 Wednesday, July 18, 2007 1:03 PM LSI PACKAGES ★Under development ● Surface-mount Type (cont’d) Package type Appearance (Package material) Package code FLGA (LGA) Package width & length x (seated height [MAX.]) mm to 36 6x 6 6.0 x 6.0 x (1.2) TFBGAXXX-0707 to 49 7x 7 7.0 x 7.0 x (1.2) TFBGAXXX-0808 to 81 8x 8 8.0 x 8.0 x (1.2) TFBGAXXX-0909 to 100 9x 9 9.0 x 9.0 x (1.2) TFBGAXXX-1010 to 121 10 x 10 10.0 x 10.0 x (1.2) TFBGAXXX-1111 to 144 11 x 11 11.0 x 11.0 x (1.2) TFBGAXXX-1212 to 196 12 x 12 12.0 x 12.0 x (1.2) TFBGAXXX-1313 to 216 13 x 13 13.0 x 13.0 x (1.2) 14 x 14 14.0 x 14.0 x (1.2) 15 x 15 15.0 x 15.0 x (1.2) TFBGAXXX-1515 (Plastic) Terminal pitch Nominal dimensions mm mm TFBGAXXX-0606 TFBGAXXX-1414 FBGA (CSP) No. of terminals 0.8 to 240 TFBGAXXX-1616 to 280 16 x 16 16.0 x 16.0 x (1.2) TFBGAXXX-0606 to 49 6x 6 6.0 x 6.0 x (1.2) TFBGAXXX-0707 to 81 7x 7 7.0 x 7.0 x (1.2) TFBGAXXX-0808 to 121 8x 8 8.0 x 8.0 x (1.2) TFBGAXXX-0909 to 144 9x 9 9.0 x 9.0 x (1.2) TFBGAXXX-1010 to 196 10 x 10 10.0 x 10.0 x (1.2) TFBGAXXX-1111 to 224 11 x 11 11.0 x 11.0 x (1.2) TFBGAXXX-1212 to 256 12 x 12 12.0 x 12.0 x (1.2) TFBGAXXX-1313 to 272 13 x 13 13.0 x 13.0 x (1.2) TFBGAXXX-1414 to 304 14 x 14 14.0 x 14.0 x (1.2) TFBGAXXX-1515 to 320 15 x 15 15.0 x 15.0 x (1.2) TFBGAXXX-1616 to 352 16 x 16 16.0 x 16.0 x (1.2) TFBGAXXX-0606 to 100 6x 6 6.0 x 6.0 x (1.1) TFBGAXXX-0707 to 132 7x 7 7.0 x 7.0 x (1.1) TFBGAXXX-0808 to 164 8x 8 8.0 x 8.0 x (1.1) TFBGAXXX-0909 to 192 9x 9 9.0 x 9.0 x (1.1) TFBGAXXX-1010 to 216 10 x 10 10.0 x 10.0 x (1.1) TFBGAXXX-1111 to 244 11 x 11 11.0 x 11.0 x (1.1) TFBGAXXX-1212 to 268 12 x 12 12.0 x 12.0 x (1.1) TFBGAXXX-1313 to 296 13 x 13 13.0 x 13.0 x (1.1) TFBGAXXX-1414 to 320 14 x 14 14.0 x 14.0 x (1.1) TFBGAXXX-1515 to 348 15 x 15 15.0 x 15.0 x (1.1) TFBGAXXX-1616 to 372 16 x 16 16.0 x 16.0 x (1.1) TFBGAXXX-0505 to 100 5x 5 5.0 x 5.0 x (1.0) TFBGAXXX-0606 to 144 6x 6 6.0 x 6.0 x (1.0) TFBGAXXX-0707 to 168 7x 7 7.0 x 7.0 x (1.0) TFBGAXXX-0808 to 204 8x 8 8.0 x 8.0 x (1.0) TFBGAXXX-0909 to 228 9x 9 9.0 x 9.0 x (1.0) TFBGAXXX-1010 to 264 10 x 10 10.0 x 10.0 x (1.0) XFLGA100-0707 100 0.5 7x 7 7.0 x 7.0 x (0.5) ★PBGA0356-2121 356 1.0 21 x 21 21.0 x 21.0 x (2.2) PBGA0476-3535 476 1.27 35 x 35 35.0 x 35.0 x (2.63) PBGA0528-3535 528 0.65 0.5 0.4 (Plastic) PBGA (BGA) XXX: Terminal counts 62 Device_E.book Page 63 Wednesday, July 18, 2007 1:03 PM PACKAGES ● Surface-mount Type (cont’d) Appearance (Package material) SOP SSOP MFP (Plastic) TSOP (Plastic) Package code TQFP (Plastic) VQFN 1.27 (50) 15.2 (600) 13.2 x 28.2 x (3.1)

8 0.65 4.5 (150) 3.0 x 3.0 x (1.1) –
P-SSOP012-0225 12 0.75 5.7 (225) 4.4 x 5.0 x (1.8)
– P-SSOP024-0275 24 7.0 (275) 6.0 x 7.8 x (1.27) –
P-SSOP040-0300 40 7.6 (300) 6.3 x 13.5 x (1.8) –
P-SSOP070-0500 70 0.8 12.7 (500) 12.7 x 28.6 x (3.05) –
P-MFP018 18 0.8
– P-MFP020 20 0.75 P-TSOP040-1020 40 P-TSOP048-1220 48 P-TSOP056-1420 56 48 P-QFP064-1010 64 P-QFP072-1010 72 P-QFP128-1420 128 P-QFP156-1420 156 P-LQFP080-1212 0.65 0.5 0.5 – 6.0 x 7.5 x (1.8)
– 10 x 20 10.0 x 18.4 x (1.2)

12 x 20 12.0 x 18.4 x (1.2)

14 x 20 14.0 x 18.4 x (1.2)

7.0 x 7.0 x (1.65)
– 10.0 x 10.0 x (1.82)
–
–
–
–
– – 7x 7 0.75 10 x 10 0.5 10.0 x 10.0 x (1.8) 14 x 20 14.0 x 20.0 x (2.3) 80 12 x 12 12.0 x 12.0 x (1.7)
P-LQFP100-1414 100 14 x 14 14.0 x 14.0 x (1.7)
– P-LQFP144-2020 144 20 x 20 20.0 x 20.0 x (1.7) –
24 x 24 24.0 x 24.0 x (1.7) –
28 x 28 28.0 x 28.0 x (1.7) –
7x 7 7.0 x 7.0 x (1.2)
–
– P-LQFP176-2424 176 ★ P-LQFP256-2828 256 P-TQFP048-0707 48 P-TQFP100-1414 100 P-TQFP128-1414 128 P-VQFN020-0404 20 P-VQFN028-0505 28 0.4 0.5 0.4 0.5 14 x 14 14.0 x 14.0 x (1.2) 4x 4 4.2 x 4.2 x (1.0) 5x 5 5.2 x 5.2 x (1.0) 0.4 0.5
– –
–
–
P-VQFN032-0505 32 P-VQFN036-0606 36 6x 6 6.2 x 6.2 x (1.0) –
P-VQFN048-0707 48 7x 7 7.2 x 7.2 x (1.0) –
P-VQFN036-0505 36 5x 5 5.2 x 5.2 x (1.0) –
P-VQFN052-0707 52 7x 7 7.2 x 7.2 x (1.0) –
P-VQFN064-0808 64 8x 8 8.2 x 8.2 x (1.0) –
2.0 x 2.0 x (0.35) –
2.2 x 2.2 x (0.35) –
2.2 x 2.2 x (0.55) –
3.0 x 3.0 x (0.85) –
–
–
4.0 x 4.0 x (0.85) –
4.2 x 4.2 x (1.0) –
5x 5 5.0 x 5.0 x (1.0) –
7x 7 7.2 x 7.2 x (1.0) –
★ P-HQFN010-0202B 10 ★ P-HQFN014-0202 14 P-HQFN016-0303 P-HQFN016-0404 P-HQFN020-0404 (Plastic) Lead frame material Alloy42 Copper alloy 44 P-HQFN010-0202A HQFN* Package width & length x (seated height [MAX.]) mm P-SSOP008-0150 P-QFP048-1010 LQFP Terminal pitch Nominal dimensions mm (mil) mm (mil) P-SOP044-0600 P-QFP048-0707 QFP No. of terminals 16 0.4 0.5 24 P-HQFN028-0505 28 P-HQFN052-0707 52 2x 2 3x 3 0.65 20 P-HQFN024-0404 * HQFN is a higher heat dissipation package of VQFN. 0.4 4.0 x 4.0 x (1.0) 4x 4 0.5 0.4 Packages Package type 100 mil = 2.54 mm 63 Device_E.book Page 64 Wednesday, July 18, 2007 1:03 PM LSI PACKAGES ● For CCDs Package type Package code No. of terminals Terminal pitch mm Nominal dimensions mm (mil) Package width & length x (seated height) mm P-DIP014-0400A 14 1.27 10.16 (400) 10.0 x 10.0 P-DIP016-0500C 16 1.78 12.7 (500) 12.4 x 14.0 P-DIP020-0400 20 1.00 10.16 (400) 10.0 x 10.0 1.27 11.43 (450) 11.4 x 12.2 1.78 12.7 (500) 12.4 x 14.0 Appearance (Package material) DIP (Plastic) N-DIP016-0450 16 N-DIP016-0500C (Ceramic) P-SOP028-0400 28 0.69 10.16 (400) 10.0 x 10.0 x (3.5) P-SOP032-0525 32 0.78 13.3 (525) 12.0 x 13.8 x (3.9) N-LCC028-S450A 28 0.80 11.5 11.5 x 11.5 x (1.62) N-LCC032-R543 32 0.80 13.8 12.9 x 13.8 x (1.35) SOP (Plastic) LCC (Ceramic) 100 mil = 2.54 mm Nominal dimensions FBGA (CSP) FLGA (LGA) PBGA (BGA) VQFN HQFN 64 SOP SSOP MFP TSOP DIP LCC FBGA : fine-pitch ball grid array package QFP FLGA : fine-pitch land grid array package LQFP : low profile quad flat package : quad flat package PBGA : plastic ball grid array package TQFP : thin quad flat package SOP : small outline package VQFN : very thin quad flat non-leaded package SSOP : shrink small outline package HQFN : heat sink quad flat non-leaded package MFP : mini flat package DIP : dual inline package TSOP : thin small outline package LCC : leadless chip carrier QFP LQFP TQFP Device_E.book Page 65 Wednesday, July 18, 2007 1:03 PM PACKAGES ● Lead-inserting Type Packages [For regulators: PQ series] Appearance (Package material) Package type TO-220 (Heat sink exposure) [Lead forming type] No.of terminals Terminal pitch mm Outline dimensions (Width x Thickness x Height) mm Lead frame material 5 (1.7)*1 10.2 (MAX.) x 3.5 x 25.2*2 Cu 4 2.54 10.2 (MAX.) x 4.5 x 29.1*2 Cu 4 2.54 10.2 (MAX.) x 4.5 x 29.1*2 Cu 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu 3 2.5 5.2 (MAX.) x 4.2 (MAX.) x 18.2 (MAX.)*2 Cu (Plastic) A TO-220 (Plastic) B TO-220 (Full mold) Packages (Plastic) C TO-220 (Full mold) [Lead forming type] (Plastic) D TO-220 [Lead forming type] (Plastic) E TO-220 [Lead forming type] (Plastic) TO-92 (Plastic) *1 The figure in parentheses indicates reference value. *2 Including lead length ● Surface-mount Type Packages [For regulators/LED drivers: PQ series] Appearance (Package material) Package type TO-263 No.of terminals Terminal pitch mm Outline dimensions (Width x Height x Thickness) mm Lead frame material 5 (Heat sink not included) (1.7)*1 10.6 (MAX). x 13.7 (MAX.)*2 x 3.5 Cu 5 (Heat sink not included) (1.27)*1 6.6 (MAX.) x 9.7 (MAX.)*2 x 2.3 Cu 5 (Heat sink included) (1.27)*1 6.6(MAX.) x 9.7 (MAX.)*2 x 2.1 Cu 8 1.27 5 x 6.2*2 x 1.55*2 Cu (Plastic) F SC-63 (Plastic) G SC-63 (Plastic) SOP-8 (Plastic) *1 The figure in parentheses indicates reference value. *2 Including lead length 65 Device_E.book Page 66 Wednesday, July 18, 2007 1:03 PM LSI PACKAGES ● Surface-mount Type Packages [For regulators/LED drivers: PQ series] (cont’d) No.of terminals Terminal pitch mm Outline dimensions (Width x Height x Thickness) mm Lead frame material 6 1.5 4.5 x 4.3*2 x 1.5 Cu 6 0.95 2.9 x 2.8*2 x 1.3 Cu 6 0.95 2.9 x 2.8*2 x 1.3 Cu 6 (0.95)*1 (3.4)*1 x 3.3*2 x 1.4 (MAX.) Cu 5 (0.95)*1 (2.9)*1 x 2.8*2 x 1.3 (MAX.) Cu USB-6 6 0.5 2.0 x 1.8 x 0.8 Cu (Terminal material)/ Au plating (Terminal finish) USB-10 10 0.5 2.8 x 2.0 x 0.8 — Package type Appearance (Package material) SOT-89 (Plastic) SOT-23-6 (Plastic) SOT-23-6W (Plastic) SOT-23-L (Plastic) SOT-23-5 (Plastic) *1 The figure in parentheses indicates reference value. *2 Including lead length The companies listed below own the trademarks of the relevant LSIs. ARM, ARM7TDMI, ARM720T, ARM922T, ARM946E-S, ARM926EJ-S and Developer Suite are trademarks of ARM Ltd. Windows is a trademark of Microsoft Corporation. Ball Grid Array and BGA are trademarks of Motorola Nippon Ltd. RSDS is a trademark of National Semiconductor Corporation. Java and Java Card are trademarks of Sun Microsystems, Inc. SmartMedia is a trademark of Toshiba Corporation. Z80 is a trademark of ZiLOG, Inc. CompactFlash is a trademark of SanDisk Corporation. MIPS, MIPS32, 4KSd are trademarks of MIPS Technologies, Inc. QUALCOMM and MSM are trademarks of QUALCOMM Incorporated. IrSS and IrSimple are trademarks of Infrared Data Association®. Bluetooth is a trademark of Bluetooth SIG, Inc. All other product or company names are trademarks of their respective holders. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 66 Device_E.book Page 67 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOCOUPLER INDEX TREE ■ Photocoupler Lineup Output type Single phototransistor Features Model No. (series) General purpose, High collector-emitter voltage, etc. PC35x series/PC451J00000F 68 Low input current PC367NJ0000F 68 PC354NJ0000F 68 Low input current PC364NJ0000F 68 AC input response Darlington phototransistor Compact, Half pitch (lead space), SMT type Single phototransistor High sensitivity, High collector-emitter voltage PC355NJ0000F 68 Low input current PC365NJ0000F 68 PC3Hx series 69 Low input current PC3H71xNIP0F 69 High collector-emitter voltage PC4H510NIP0F 69 AC input response PC3H3J00000F/PC3H4J00000F 69 PC3H41xNIP0F 69 PC3Q62J0000F ▲/PC3Q67QJ000F ▲ 69 PC3Q71xNIP0F ▲ 69 PC3Q63J0000F ▲/PC3Q64QJ000F ▲ 69 PC3Q41xNIP0F ▲ 69 General purpose, High collector-emitter voltage, etc. ▲ Low input current 4-channel output Low input current AC input response Low input current Darlington phototransistor General purpose PC3H5J00000F 69 PC3H510NIP0F 69 High collector-emitter voltage PC4H520NIP0F ▲ 69 4-channel output PC3Q65J0000F ▲ 69 Low input current PC3Q510NIP0F ▲ 69 Isolation thickness: 0.4 mm or more Creepage distance: 6.4 mm or more PC123J00000F series 70 Low input current PC1231xNSZ0F 70 Low input current DIP type (4/16-pin) Single phototransistor Approved by safety standards other than UL General purpose, High collector-emitter voltage, etc. PC817XJ0000F/PC847XJ0000F/ PC851XJ0000F 70 Low input current PC817xxNSZ0F 70 PC814XJ0000F/PC844XJ0000F 70 Low input current PC8141xNSZ0F 70 Built-in SBD/High response speed PC81100NSZ0F 70 General purpose, High collector-emitter voltage PC815XJ0000F/PC845XJ0000F/ PC852XJ0000F/PC853XJ0000F 70 PC81510NSZ0F 70 AC input response Darlington phototransistor Low input current DIP type (6-pin) Page Single phototransistor General purpose, High collector-emitter voltage, etc. PC7xxV0NSZXF 71 Darlington phototransistor General purpose, High collector-emitter voltage, etc. PC7x5V0NSZXF 71 Optoelectronics Package type 4-pin SOP Compact, SMT type Package type Output type Compact, SMT type DIP type, SMT type Features Model No. (series) Page Digital output General purpose, High response speed, 2ch, etc. PC4xxJ00000F/PC456L0NIP0F/ PC41xS0NIP0F/PC410L0NIP0F/ PC411L0NIP0F/PC4D10SNIP0F Analog/Digital output High CMR PC457S0NIP0F/PC457L0NIP0F 73 Digital output General purpose, High response speed, etc. PC9xxV0NSZXF/PC956L0NSZ0F/ PC910L0NSZ0F/PC911L0NSZ0F/ PC912L0NSZ0F ▲ 73 Built-in base amplifier For inverter control/For inverter control, Built-in short-circuit protection circuit PC928J00000F▲/PC929J00000F ▲/ PC942J00000F/PC92xL0NSZ0F series 74 Analog/Digital output High speed, High CMR, etc. PC957L0NSZ0F 74 ▲ 72 The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. 67 Device_E.book Page 68 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOCOUPLERS ■ Photocouplers Output Type ◆ Phototransistor Output Model No. Single phototransistor output Features UL (Ta = 25°C) Absolute maximum ratings Electro-optical characteristics Isolation Current transfer ratio Response time CollectorForward voltage emitter Package current (AC) tr voltage CTR RL VCE VCE IF IC Viso IF (%) (µs) VCEO (mA) (Ω) (V) (mA) (V) (mA) (rms) MIN. TYP. (V) (kV) General purpose ❇ 50 3.75 80 50 5 5 4 2 100 2 General purpose, high resistance to noise* 1 High collector-emitter voltage  50 3.75 80 90 5 5 4 2 100 2 ❇ 50 3.75 350 40 5 5 4 2 100 2 PC367NJ0000F Low input current, high CMR (MIN. 10kV/µs)  10 3.75 80 100 0.5 5 4 2 100 2 PC354NJ0000F AC input response ❇ ±50 3.75 80 20 ±1 5 4 2 100 2 PC364NJ0000F Low input current, high resistance to noise* 1, AC input response  ±10 3.75 70 50 ±0.5 5 4 2 100 2 PC355NJ0000F High sensitivity ❇ 50 3.75 35 600 1 2 60 2 100 2 PC365NJ0000F High sensitivity, low input current  10 3.75 35 600 0.5 2 60 2 100 2 PC357NJ0000F Darlington phototransistor output Internal connection diagram : Approved, o: Under application Approved by safety standards*2 PC352NJ000F PC451J00000F Mini-flat 4-pin *1 CMR: MIN.10 kV/µs *2 Please refer to Specification Sheets for model numbers approved by safety standards. ❇ A VDE approved type is optionally available. PC357NJ0000F (Mini-flat 4-pin) *PC353TJ0000F only: Same shape, 5-pin 68 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 69 Wednesday, July 18, 2007 1:03 PM PHOTOCOUPLERS ★Under development Model No. ★PC3HU7NYIP0F Single phototransistor output Features UL Reinforced insulation (internal insulation distance: MIN. 0.4 mm), low-profile package High resistance to noise* 1 PC3H7J00000F Standard PC3H3J00000F *4, 5 High resistance to noise* 1, low input current AC input response, high resistance to noise *1 (Ta = 25°C) Absolute maximum ratings Electro-optical characteristics Isolation Current transfer CollectorResponse time ratio Forward voltage emitter Package current (AC) voltage CTR tr Viso IF VCE IC RL VCE IF VCEO (µs) (%) (mA) (rms) (mA) (Ω) (V) (mA) (V) (V) TYP. MIN. (kV) Lowprofile 50 3.75 80 50 5 5 4 2 100 2 mini-flat 4-pin  50 2.5 80 20 1 5 4 2 100 2  *2 50 2.5 80 20 1 5 4 2 100 2  10 2.5 80 100 0.5 5 4 2 100 2 ±50 2.5 80 20 ±1 5 4 2 100 2 ±50 2.5 80 20 ±1 5 4 2 100 2   *2 Mini-flat 4-pin PC3H4J00000F AC input response PC3H41xNIP0F AC input response, high resistance to noise* 1, low input current  ±10 2.5 80 50 ±0.5 5 4 2 100 2 PC4H510NIP0F High collector-emitter voltage  50 2.5 350 40 5 5 4 2 100 2 PC3Q67QJ000F ▲ 4-ch type  *2 50 2.5 80 50 5 5 4 2 100 2  50 2.5 80 20 1 5 4 2 100 2  10 2.5 80 100 0.5 5 4 2 100 2 ±50 2.5 80 20 ±1 5 4 2 100 2  *2 ±50 2.5 80 20 ±1 5 4 2 100 2  ±10 2.5 80 50 ±0.5 5 4 2 100 2 50 2.5 35 600 1 2 60 2 100 2 10 2.5 35 600 0.5 2 60 2 100 2 50 2.5 350 1 000 1 2 100 2 100 2 50 2.5 35 600 1 2 60 2 100 2 10 2.5 35 600 0.5 2 60 2 100 2 PC3Q62J0000F ▲ PC3Q71xNIP0F ▲ PC3Q63J0000F ▲ Darlington phototransistor output Internal connection diagram PC3H2J00000F PC3H71xNIP0F : Approved, o: Under application Approved by safety standards*3 noise *1, High resistance to 4-ch type High resistance to noise *1, 4-ch type, low input current AC input response, high resistance to noise* 1, 4-ch type  PC3Q64QJ000F ▲ AC input response, 4-ch type PC3Q41xNIP0F ▲ AC input response, high resistance to noise* 1, low input current, 4-ch type PC3H5J00000F High sensitivity  *2 PC4H520NIP0F ▲ High sensitivity, low input current High collector-emitter voltage PC3Q65J0000F ▲ 4-ch type, high sensitivity  *2 PC3Q510NIP0F ▲ 4-ch type, high sensitivity, low input current  PC3H510NIP0F Mini-flat 16-pin  Mini-flat 4-pin  Mini-flat 16-pin Optoelectronics Type ◆ Phototransistor Output *1 CMR: MIN.10 kV/µs *2 A VDE approved type is optionally available. *3 Please refer to Specification Sheets for model numbers approved by safety standards. *4 VDE, CSA approved *5 In conformance with BSI, SEMKO, DEMKO, NEMKO, and FIMKO The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. PC3HU7NYIP0F PC3H2J00000F (Mini-flat 4-pin) PC3Q64QJ000F▲ (Mini-flat 16-pin) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 69 Device_E.book Page 70 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOCOUPLERS Output Type ◆ Phototransistor Output Model No. Internal connection diagram     – PC817XJ0000F* 5, *6, *7 High isolation voltage   – PC847XJ0000F* 5, *9 High isolation voltage (4-ch)   – High isolation voltage, low input current, high resistance to noise *4 High isolation voltage, high collector-emitter voltage  – –  – – PC814XJ0000F* 5, *6 High isolation voltage, AC input response   – PC844XJ0000F High isolation voltage, AC input response (4-ch)   – PC8141xNSZ0F High isolation voltage, AC input response, low input current, high resistance to noise *4  – – PC81100NSZ0F Built-in schottky barrier diode, toff: 35µs TYP. (In saturation, RL = 100kΩ)  – – PC815XJ0000F High isolation voltage, high sensitivity  – – PC845XJ0000F High isolation voltage, high sensitivity (4-ch)  – – PC81510NSZ0F High isolation voltage, high sensitivity, low input current  – – High isolation voltage, high collector-emitter voltage High isolation voltage, high collector-emitter voltage   –   – Single phototransistor output PC8171xNSZ0F PC851XJ0000F Schottky barrier diode Darlington phototransistor output Features  PC1231xNSZ0F PC852XJ0000F* 5, *6 PC853XJ0000F* 5, *6 (Ta = 25°C) Electro-optical characteristics Current transfer ratio Response time CTR (%) MIN. IF (mA) tr RL (µs) (Ω) TYP. 50 5.0 70 50 5 4 100 10 5.0 70 50 0.5 4 100 50 5.0 80 50 5 4 100 50 5.0 80 50 5 4 100 10 5.0 70 100 0.5 4 100 50 5.0 350 40 5 4 100 ±50 5.0 80 20 ±1 4 100 ±50 5.0 80 20 ±1 4 100 ±10 5.0 80 50 ±0.5 4 100 50 5.0 70 50 5 4-pin DIP 50 5.0 35 600 1 60 100 16-pin DIP 50 5.0 35 600 1 60 100 10 5.0 35 600 0.5 60 100 50 5.0 350 1 000 1 100 100 50 5.0 350 1 000 1 100 100 4-pin DIP 16-pin DIP 4-pin DIP 16-pin DIP 4-pin DIP 4-pin DIP ton: TYP. 100 9 Wide lead spacing type (F type) is also available. Creepage distance PC123: 6.4 mm or more, PC123F: 8 mm or more Optionally available. BSI, SEMKO, DEMKO, NEMKO, FIMKO, CSA CMR: 10 kV/µs MIN. Lead forming type (I type) is also available for surface mounting. Taped package of lead forming type for surface mounting is also available. Wide lead spacing type (F type) is also available. Lead forming type (FI type) of F type is also available.Taped package is also available for I and FI type of lead forming type. Please refer to Specification Sheets for model numbers approved by safety standards. Approved by UL as multi-channel type of PC817. PC817XJ0000F (4-pin DIP) 70 Absolute maximum ratings Isolation CollectorForward Package current voltage emitter (AC) voltage VDE Others IF UL Viso (rms) VCEO *2 *3 (mA) (kV) (V) High isolation voltage, long creepage distance High isolation voltage, long creepage distance, low input current, high resistance to noise *4 PC123J00000F* 1 *1 *2 *3 *4 *5 *6 *7 *8 *9 : Approved, o: Under application Approved by safety standards*8 PC847XJ0000F (16-pin DIP) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 71 Wednesday, July 18, 2007 1:03 PM PHOTOCOUPLERS Darlington phototransistor output Single phototransistor output Output Type ◆ Phototransistor Output Model No. Internal connection diagram : Approved, o: Under application Features UL (Ta = 25°C) Absolute maximum ratings Electro-optical characteristics Isolation Collector- Current transfer Response Forward ratio time emitter Package current voltage (AC) voltage CTR IF tr RL I F Viso (rms) VCEO (%) (mA) (µs) (Ω ) VDE*1 (mA) (V) (kV) MIN. TYP. Approved by safety standards*2 PC714V0NSZXF High isolation voltage   50 5.0 80 50 5 4 100 PC724V0NSZXF High isolation voltage, large input current  – 150 5.0 35 20 100 4 100 PC713V0NSZXF High isolation voltage, with base terminal   50 5.0 80 50 5 4 100 6-pin DIP PC715V0NSZXF High isolation voltage, high sensitivity   50 5.0 35 600 1 60 100 PC725V0NSZXF High isolation voltage, high sensitivity, high collector-emitter voltage, high power   50 5.0 300 1 000 1 100 100 Optoelectronics *1 Optionally available. *2 Please refer to Specification Sheets for model numbers approved by safety standards. PC713V0NSZXF (6-pin DIP) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 71 Device_E.book Page 72 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOCOUPLERS ◆ OPIC∗ Output (1-1) ∗  “OPIC” (Optical IC) is a trademark of SHARP Corporation. An OPIC consists of a light-   detecting element and a signal-processing circuit integrated onto a single chip.  : Approved, o: Under application Model No. Internal connection diagram (Ta = 25°C) Absolute maximum Electro-optical characteristics*1 ratings Low level output voltage Threshold input current Isolation Package Forward voltage current IFLH V OL IFHL (AC) IF RL Ta IOL IF (mA) (mA) UL VDE*3 Viso (rms) (V) (mA) (mA) (Ω ) (°C) (mA) MAX. MAX. MAX. (kV) Approved by safety standards*2 Features PC400J00000F A Digital output, normal-off operation  – 50 3.75 0.4 0 to +70 16 4 2.0 – 280 PC401J00000F A Digital output, normal-on operation  – 50 3.75 0.4 0 to +70 16 0 – 2.0 280 PC456L0NIP0F A   25 3.75 0.6 –40 to +85 4.4 10 5.0 – 20 k   20 3.75 0.6 –40 to +85 13 5 5.0 – 350   20 3.75 0.6 –40 to +85 13 5 5.0 – 350 –*4 3.75 1 –40 to +85 4 VIN = VIL – – – 20 3.75 0.1 –40 to +85 0.02 12 6.0 – – 20 3.75 0.1 –40 to +85 0.02 12 6.0 – – 20 3.75 0.6 –40 to +85 5 5.0 – – PC410L0NIP0F PC410S0NIP0F PC412S0NIP0F PC411L0NIP0F PC411S0NIP0F PC4D10SNIP0F Built-in preamplifier, high speed transmission (2 Mb/s), For flow soldering High speed (10 Mb/s), High CMR (10 kV/µs), For flow soldering High speed (10 Mb/s), High CMR (10 kV/µs), For flow soldering, Solder heat resistance: 270°C High speed (25 Mb/s), High CMR (10 kV/µs), For flow soldering, Solder heat resistance: 270°C High speed (15 Mb/s), High CMR (10 kV/µs), For flow soldering High speed (15 Mb/s), High CMR (10 kV/µs), For flow soldering, Solder heat resistance: 270°C High speed (10 Mb/s), For flow soldering, Solder heat resistance: 270°C 2ch output Mini-flat 5-pin SOP 8-pin  –     Mini-flat 5-pin SOP 8-pin  – 13 A: Rated voltage circuit *1 Each item is measured at Vcc=5V. (PC400, PC401) *2 Please refer to Specification Sheets for model numbers approved by safety standards. *3 Optionally available. *4 No forward current rating for voltage input (rated input voltage: –0.5 to 6.0 V). 72 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 73 Wednesday, July 18, 2007 1:03 PM PHOTOCOUPLERS (1-2) Internal connection diagram Features UL High speed (1 Mb/s), high CMR (15 kV/µs), For flow soldering High speed (1 Mb/s), high CMR (15 kV/µs), For flow soldering, Solder heat resistance: 270°C PC457L0NIP0F PC457S0NIP0F   Mini-flat 5-pin 25 3.75 19 16 0.4 4.5 0.2 0.6 1 900 16   SOP 8-pin 25 3.75 19 16 0.4 4.5 0.2 0.6 1 900 16 *1 Please refer to Specification Sheets for model numbers approved by safety standards. PC400J00000F (Mini-flat 5-pin) Internal connection diagram : Approved, o: Under application Features A PC901V0NSZXF A PC956L0NSZ0F A PC910L0NSZ0F (Ta = 25°C) Electro-optical characteristics*1 Threshold input Isolation Low level output voltage current Package Forward voltage current (AC) IFLH V OL FHL I IF IF VDE RL Ta IOL Viso (rms) (V) (mA) (mA) (mA) (mA) (mA) *4 (Ω ) (°C) (kV) MAX. MAX. MAX. Digital output, normal-off operation   Digital output, normal-on operation       Built-in preamplifier, high speed transmission (2 Mb/s) For soldering flow Digital output, High speed (10 Mb/s), high CMR (20 kV/µs) For soldering flow Absolute maximum ratings Approved by safety standards*6 UL PC900V0NSZXF* 2, *3 *2 Optionally available. PC412S0NIP0F (SOP 8-pin) ◆ OPIC Output Model No. (Ta = 25°C) Absolute maximum Electro-optical characteristics ratings Isolation Current transfer ratio Propagation delay time Package Forward voltage current tPLH CTR PHL t (AC) VO VCC IF RL IF IF VDE*2 Viso (rms) (%) (mA) (V) (V) (µs) (µs) (Ω) (mA) (mA) TYP. TYP. MIN. (kV) 50 5.0 0.4 0 to +70 16 4 2.0 – 280 50 5.0 0.4 0 to +70 16 0 – 2.0 280 25 5.0 0.6 –40 to +85 2.4 10 5.0 – 20 k 20 5.0 0.6 –40 to +85 13 5 5.0 – 350 12 6.0 – – VIN = VIL – – – Optoelectronics Model No. : Approved, o: Under application Approved by safety standards*1 6-pin DIP 8-pin DIP PC911L0NSZ0F High speed (15 Mb/s), high CMR (10 kV/µs), For soldering flow   20 5.0 0.1 –40 to +85 0.02 PC912L0NSZ0F ▲ Digital output, High speed (25 Mb/s), high CMR (20 kV/µs)   –*5 5.0 1.0 –40 to +85 4 A: Rated voltage circuit *1 Each item is measured at Vcc=5V. *2 Lead forming type (I type) is also available for surface mounting. *3 Taped package of lead forming type for surface mounting is also available. *4 Optionally available. *5 No forward current rating due to voltage input. (rated input voltage: –0.5 to 6.0 V) *6 Please refer to Specification Sheets for model numbers approved by safety standards. The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. PC90xV0NSZXF series (6-pin DIP) PC910L0NSZ0F (8-pin DIP) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 73 Device_E.book Page 74 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOCOUPLERS ◆ OPIC Output Model No. Internal connection diagram PC942J00000F Interface Amplifier PC923L0NSZ0F* 1 Interface Amplifier PC924L0NSZ0F* 1 Interface Amplifier PD Interface OPIC PC925L0NSZ0F Tr1 Tr2 IGBT protection circuit PC928J00000F▲ Interface Voltage regulator Amplifier IGBT protection circuit PC929J00000F▲ Interface Voltage regulator Amplifier : Approved, o: Under application Approved by safety standards*3 Features Package (Ta = 25°C) Absolute maximum ratings Electro-optical characteristics Isolation Propagation delay time Forward Output voltage current current tPHL tPLH (AC) IF IF RL1 RL2 IO1 VCC Viso (rms) (µs) (µs) (A) (mA) (V) (mA) (Ω) (Ω) (kV) TYP. TYP. UL VDE *2   25 5.0 0.5 2.0 2.0 6 5 5 10   20 5.0 0.1 0.3 0.3 24 5 RG = 47 –   25 5.0 0.1 1.0 1.0 24 10 RG = 47 – – – – 5.0 2.5 24 10 RG = 10 – For driving inverter IGBT, built-in short protection circuit   25 4.0 0.1 1.0 1.0 24 10 RG = 47 – For driving inverter IGBT, high speed, built-in short protection circuit  20 4.0 0.1 0.3 0.3 24 5 RG = 47 – For controlling invertercontrolled air-conditioner • Built-in drive circuit directly connectable to MOS-FET and IGBT • Low dissipation current (Icc = TYP. 1.3 mA) • High resistance to noise (CMR: MIN. 15 kV/µs) • Built-in drive circuit directly connectable to MOS-FET and IGBT • Low dissipation current (Icc = TYP. 1.3 mA) • High resistance to noise (CMR: MIN. 15 kV/µs) • Built-in drive circuit directly connectable to MOS-FET and IGBT • Peak output current: 2.5 A • Low dissipation current (Icc = TYP. 5 mA) • High resistance to noise (CMR: MIN. 15 kV/µs) 8-pin DIP MAX. MAX. 0.5 0.5 14-pin SMT (Half pitch lead)  *1 Lead forming type (I type) is also available for surface mounting. Taped package of lead forming type for surface mounting is also available. *2 A VDE approved type is optionally available. *3 Please refer to Specification Sheets for model numbers approved by safety standards. The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. ◆ OPIC Output Model No. PC957L0NSZ0F Internal connection diagram : Approved, o: Under application Approved by safety standards*3 Features High speed (1 Mb/s), high CMR (15 kV/µs), for flow soldering UL VDE*2   Absolute maximum ratings Isolation Package Forward voltage current (AC) IF Viso (rms) (mA) (kV) 8-pin DIP 25 5.0 (Ta = 25°C) Electro-optical characteristics Current transfer ratio Propagation delay time*1 CTR (%) MIN IF (mA) VO (V) VCC (V) tPHL tPLH (µs) (µs) TYP. TYP. 19 16 0.4 4.5 0.2 RL (Ω ) 0.6 1 900 IF (mA) 16 *1 Vcc = 5V *2 Optionally available. *3 Please refer to Specification Sheets for title(s) of safety standards. PC92xL0NSZ0F (8-pin DIP) 74 PC928J00000F (14-pin SMT (Half pitch lead)) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 75 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOTRIAC COUPLER INDEX TREE ■ Phototriac Coupler Lineup Mini-flat (SMD) Applied voltage AC 200 V lines (VDRM = 600V) ON-state current (rms) 0.05 A Features Model No. Page S2S3000F*4 / S2S5A00F*4 76 S2S4000F*4 76 PC3SG11YIZ0F ▲*4 76 PC3SG21YIZ0F ▲*4 76 PC3ST11NSZAF 76 PC3ST21NSZBF* 3 77 PC3SH11YFZAF* 4 / PC3SH13YFZAF* 4 76 PC3SH21YFZBF* 3 77 General purpose (5th-pin cut) PC2SD11NTZAF* 4 76 General purpose (5th-pin cut) PC3SD12NTZAF* 4 / PC3SD11NTZAF ▲*4 / PC3SD11NTZBF* 3 / PC3SD11NTZCF* 2 / PC3SD11YTZDF* 1 / PC3SD21YTZEF* 5 General purpose Built-in zero-cross circuit Reinforced isolation Built-in zero-cross circuit DIP type AC 200 V lines (VDRM = 600V) 0.1 A General purpose (4-pin) Built-in zero-cross circuit Reinforced isolation Built-in zero-cross circuit DIP type AC 100 V lines (VDRM = 400V) 0.1 A (6-pin) AC 200 V lines (VDRM = 600V) 0.1 A Built-in zero-cross circuit Reinforced isolation (5th-pin cut) Built-in zero-cross circuit AC 200 V lines (VDRM = 800V) 0.1 A General purpose Built-in zero-cross circuit Reinforced isolation Built-in zero-cross circuit 76/77 PC3SD21NTZBF* 3 / PC3SD21NTZCF* 2 / PC3SD21NTZDF* 1 / PC3SD23YTZCF* 2 77 PC3SF11YVZAF* 4 / PC3SF11YVZBF* 3 76 PC3SF21YVZAF* 4 / PC3SF21YVZBF* 3 / PC3SF23YVZSF* 3 77 PC4SD11NTZBF* 3 / PC4SD11NTZCF* 2 76 PC4SD21NTZCF* 2 / PC4SD21NTZDF* 1 77 PC4SF11YVZAF* 4 / PC4SF11YVZBF* 3 76 PC4SF21YVZBF* 3 / PC4SF21YVZCF* 2 77 Optoelectronics Package Minimum trigger current: *1 IFT & 3 mA, *2 IFT & 5 mA, *3 IFT & 7 mA, *4 IFT & 10 mA, *5 IFT & 2 mA The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. 75 Device_E.book Page 76 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOTRIAC COUPLERS ■ Phototriac Couplers : Approved, o: Under application Absolute maximum ratings Approved by safety standards*4 Type Model No. Features UL Repetitive Isolation Package ON-state peak voltage current OFF-state IFT (AC) Others T (rms) voltage I VDE Viso (rms) (mA) *5 VDRM (A) MAX. (kV) (V) VD (V) RL (Ω ) 10 6 100 10 6 100 S2S3000F 200 V lines, compact   *6  S2S5A00F 200 V lines, compact   *6  PC3SG11YIZ0F ▲ 200 V lines, reinforced insulation (isolation thickness: 0.4 mm)   – 10 6 100 PC3ST11NSZAF 200 V lines, compact   *6  10 6 100 200 V lines, compact, reinforced isolation 200 V lines, compact, reinforced isolation, High noise resistance    *2 10 6 100    *2 10 6 100 PC2SD11NTZAF* 7 100 V lines  –  10 6 100 PC3SD12NTZAF* 8 200 V lines   *6  10 6 100 PC3SD11NTZAF 200 V lines   *6  10 6 100 PC3SD11NTZBF 200 V lines   *6  7 6 100 PC4SD11NTZBF 200 V lines, repetitive peak-OFF-state voltage   *6  7 6 100 PC3SD11NTZCF 200 V lines   *6  5 6 100 3 6 100 5 6 100 10 6 100 7 6 100 10 6 100 7 6 100 PC3SH11YFZAF PC3SH13YFZAF For triggering Internal connection diagram (Ta = 25°C) Electro-optical characteristics Min. trigger current PC3SD11YTZDF 200 V lines, low input drive    PC4SD11NTZCF 200 V lines, repetitive peak-OFF-state voltage   *6  PC3SF11YVZAF 200 V lines, reinforced isolation    *2 Mini-flat 4-pin 4-pin DIP 0.05 0.1 600 600 3.75 5.0 400 600 800 6-pin DIP*1, 3 0.1 600 800 5.0 600 PC3SF11YVZBF PC4SF11YVZAF PC4SF11YVZBF 200 V lines, reinforced isolation    *2 200 V lines, reinforced isolation, repetitive peak-OFF-state voltage 200 V lines, reinforced isolation, repetitive peak-OFF-state voltage    *2 800    *2 For the note *1 to *9, see next page. The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. 76 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 77 Wednesday, July 18, 2007 1:03 PM PHOTOTRIAC COUPLERS ■ Phototriac Couplers (cont’d) Model No. Internal connection diagram S2S4000F Zero-cross circuit PC3SG21YIZ0F ▲ PC3ST21NSZBF PC3SH21YFZBF Zero-cross circuit PC3SD21NTZBF PC3SD21NTZCF* 9 For triggering PC3SD23YTZCF PC3SD21NTZDF PC3SD21YTZEF PC4SD21NTZCF PC4SD21NTZDF PC3SF21YVZAF PC3SF21YVZBF PC3SF23YVZSF PC4SF21YVZBF PC4SF21YVZCF Zero-cross circuit (Ta = 25°C) Electro-optical Absolute maximum ratings Approved by characteristics safety standards*4 Repetitive Isolation Min. trigger current Package ON-state peak voltage current IFT OFF-state (AC) RL VD Others T (rms) I UL VDE VDRM Viso (rms) (mA) (V) (Ω ) *5 (A) MAX. (V) (kV) Features 200 V lines, compact, built-in zero-cross circuit 200 V lines, reinforced insulation (isolation thickness: 0.4 mm), built-in zero-cross circuit 200 V lines, compact, built-in zero-cross circuit 200 V lines, compact, reinforced isolation, built-in zero-cross circuit 200 V lines, low zero-cross voltage: MAX. 20 V, built-in zero-cross circuit 200 V lines, low zero-cross voltage: MAX. 20 V, built-in zero-cross circuit 200 V lines, built-in zero-cross circuit, High pulse/noise resistance (TYP. 2 kV) 200 V lines, low zero-cross voltage: MAX. 20 V, built-in zero-cross circuit 200 V lines, built-in zero-cross circuit, Low input drive 200 V lines, built-in zero-cross circuit, repetitive peak-OFF-state voltage 200 V lines, built-in zero-cross circuit, repetitive peak-OFF-state voltage 200 V lines, reinforced isolation built-in zero-cross circuit 200 V lines, reinforced isolation built-in zero-cross circuit 200 V lines, reinforced isolation, built-in zero-cross circuit, High pulse/ noise resistance (TYP. 2 kV) 200 V lines, reinforced isolation, built-in zero-cross circuit, repetitive peak-OFF-state voltage 200 V lines, reinforced isolation, built-in zero-cross circuit, repetitive peak-OFF-state voltage   *6  Mini-flat 4-pin 0.05 600 3.75 10 6 100 0.05 600 3.75 10 6 100 0.1 600 5.0 7 4 100 0.1 600 5.0 7 4 100   –   *6     *2   *6  0.1 600 5.0 7 4 100   *6  0.1 600 5.0 5 4 100    0.1 600 5.0 5 4 100   *6  0.1 600 5.0 3 4 100    0.1 600 5.0 2 4 100   *6  0.1 800 5.0 5 4 100   *6  0.1 800 5.0 3 4 100    *2 0.1 600 5.0 10 4 100    *2 0.1 600 5.0 7 4 100    *2 0.1 600 5.0 7 4 100    *2 0.1 800 5.0 7 4 100    *2 0.1 800 5.0 5 4 100 4-pin DIP 6-pin DIP*1, 3 Optoelectronics Type : Approved, o: Under application *1 Lead forming type for surface mounting is also available. *2 In conformance with BSI, SEMKO, DEMKO, NEMKO, and FIMKO *3 These are molded pin No. 5. *4 Please refer to Specification Sheets for model numbers approved by safety standards. *5 CSA approval *6 Optionally available *7 An equivalent model (IFT MAX.: 15 mA) with overseas brand compatibility is also available. (PC1S3021NTZF) *8 An equivalent model with overseas brand compatibility is also available. (PC1S3052NTZF) *9 An equivalent model with overseas brand compatibility is also available. (PC1S3063NTZF) The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. S2S3000F (Mini-flat 4-pin) PC2SD series (PC3SD series, PC4SD series) (6-pin DIP) PC3SF series (PC4SF series) (6-pin DIP) PC3ST11NSZAF (PC3ST21NSZBF) (4-pin DIP) PC3SH11YFZAF  PC3SH21YFZBF,   PC3SH13YFZAF  (4-pin DIP) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 77 Device_E.book Page 78 Wednesday, July 18, 2007 1:03 PM OPTO SOLID STATE RELAY INDEX TREE ■ Solid State Relay Lineup Package DIP 6-pin DIP 8-pin Applied voltage Model No. General purpose PR22MA11NTZF 79 AC 200 V lines General purpose PR31MA11NTZF / PR32MA11NTZF 79 AC 100 V lines General purpose PR23MF11NSZF / PR26MF series / PR29MF series 79 Built-in zero-cross circuit PR26MF21NSZF / PR29MF21NSZF 79 General purpose PR33MF51NSZF / PR36MF series / PR39MF series / PR3BMF11NSZF ▲ 79 Built-in zero-cross circuit PR36MF series / PR39MF series / PR3BMF21NSZF 79 General purpose S102T01F▲ / S108T01F▲ / S101S05F▲ / S102S01F▲ / S112S01F▲ / S116S01F▲ 80 Built-in zero-cross circuit S102T02F▲ / S108T02F▲ / S101S06F▲ / S102S02F▲ / S116S02F▲ 80 Built-in snubber circuit S102S11F▲ 80 Built-in zero-cross/snubber circuit S101S16F▲ / S102S12F▲ 80 General purpose S202T01F▲ / S208T01F▲ / S202S01F▲ / S212S01F▲ / S216S01F▲ 80 Built-in zero-cross circuit S202T02F▲ / S208T02F▲ / S201S06F▲ / S202S02F▲ / S216S02F▲ 80/81 Built-in snubber circuit S202S15F▲ / S202S11F▲ 80/81 Built-in zero-cross/snubber circuit S202S12F▲ 81 Reinforced isolation S202SE1F▲ / S216SE1F▲ 81 S202SE2F▲ / S216SE2F▲ 81 AC 100 V lines Sx0xT0xF series AC 200 V lines Built-in zero-cross circuit The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. 78 Page AC 100 V lines AC 200 V lines SIP 4-pin Features Device_E.book Page 79 Wednesday, July 18, 2007 1:03 PM SOLID STATE RELAYS ■ Solid State Relays Internal connection diagram (Ta = 25°C) Absolute maximum ratings Electrical characteristics Repetitive Isolation Min. trigger current ON-state voltage peak Package current IFT OFF-state (AC) RL VD IT (rms) UL CSA VDE*2 voltage Viso (rms) (mA) (V) (Ω) (A) MAX. (kV) VDRM (V) Features 200 V lines, compact    100 V lines, 150 mA output in a small package 200 V lines, 150 mA output in a small package       PR23MF11NSZF 100 V lines, compact   – PR33MF51NSZF 200 V lines, compact   PR26MF11NSZF 100 V lines, compact  PR26MF12NSZF 100 V lines, compact, low input current PR29MF11NSZF 600 5.0 10 6 100 400 5.0 10 6 100 600 5.0 10 6 100 0.3 400 4.0 10 6 100  0.3 600 4.0 10 6 100  – 0.6 400 4.0 10 6 100   – 0.6 400 4.0 5 6 100 100 V lines, compact   – 0.9 400 4.0 10 6 100 100 V lines, compact, low input current 100 V lines, compact (built-in zero-cross circuit) 100 V lines, compact (built-in zero-cross circuit)   – 0.9 400 4.0 5 6 100   – 0.6 400 4.0 10 6 100   – 0.9 400 4.0 10 6 100 PR36MF51NSZF 200 V lines, compact    0.6 600 4.0 10 6 100 PR36MF12NSZF 200 V lines, compact, low input current    0.6 600 4.0 5 6 100 PR39MF11NSZF ▲ 200 V lines, compact    0.9 600 4.0 10 6 100 PR39MF12NSZF 200 V lines, compact, low input current    0.9 600 4.0 5 6 100 PR39MF51NSZF 200 V lines, compact    0.9 800 4.0 10 6 100 PR3BMF11NSZF ▲ 200 V lines, compact, High-temperature operation 200 V lines, compact (built-in zerocross circuit), low input current 200 V lines, compact (built-in zerocross circuit), low input current 200 V lines, compact (built-in zerocross circuit) 200 V lines, compact (built-in zerocross circuit) 200 V lines, compact (built-in zerocross circuit)    1.2 600 4.0 10 6 100    0.6 600 4.0 5 6 100    0.9 600 4.0 5 6 100 0.6 600 4.0 10 6 100 PR31MA11NTZF PR22MA11NTZF PR32MA11NTZF PR29MF12NSZF PR26MF21NSZF PR29MF21NSZF Zerocross circuit PR36MF22NSZF PR39MF22NSZF PR36MF21NSZF PR39MF21NSZF PR3BMF21NSZF Zerocross circuit 0.06 6-pin DIP 8-pin DIP 8-pin DIP 0.15       0.9 600 4.0 10 6 100    1.2 600 4.0 10 6 100 Optoelectronics Model No. : Approved, o: Under application Approved by safety standards*1 *1 Please refer to Specification Sheets for model numbers approved by safety standards. *2 Optionally available. The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. PR22MA11NTZF (6-pin DIP) PR26MF21NSZF (8-pin DIP) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 79 Device_E.book Page 80 Wednesday, July 18, 2007 1:03 PM OPTO SOLID STATE RELAYS (1) Model No. : Approved, o: Under application Internal connection diagram S102T01F▲ Electrical characteristics Min. trigger current UL IFT (mA) MAX. VD (V) RL (Ω ) 8 12 30 8 12 30 15 12 30 8 12 30 8 12 30 8 12 30 8 12 30 8 12 30 15 6 30 8 6 30 8 6 30 4.0 8 12 30 3.0 15 6 30 4.0 8 6 30 8 12 30 8*2 8 12 30 8 12 30 8 12 30 8 12 30 10 12 30 8 12 30 8 12 30 15 6 30 8 6 30 8 6 30 Features 100 V lines, low profile  Absolute maximum ratings Repetitive Isolation ON-state voltage peak TÜV Package current OFF-state (AC) IT (rms) CSA EN voltage Viso (rms) (A) 60950 (kV) VDRM(V)  – S108T01F▲ 100 V lines, low profile – – – S101S05F▲ 100 V lines   – S102S01F▲ 100 V lines   – Low profile 4-pin SIP 2 400 3*3 4-pin SIP 400   – S116S01F▲ 100 V lines   – S102T02F▲ 100 V lines, low profile (built-in zero-cross circuit) 100 V lines, low profile (built-in zero-cross circuit)   – – – – 100 V lines (built-in zero-cross circuit)   – 3*3 100 V lines (built-in zero-cross circuit)   – 8*2 S101S06F▲ S102S02F▲ S116S02F▲ Zerocross circuit   100 V lines (built-in snubber circuit)   – S101S16F▲ 100 V lines (built-in snubber circuit, built-in zero-cross circuit) 100 V lines (built-in snubber circuit, built-in zero-cross circuit)   –   – 200 V lines, low profile   – S202T01F▲ Low profile 4-pin SIP 2 400 4-pin SIP 8*1 8*1 Low profile 4-pin SIP 2 600 – S202S01F▲ 200 V lines   – 8*2 S212S01F▲ 200 V lines – – – 12*4 S216S01F▲ 200 V lines – – – S202S15F▲ 200 V lines, built-in snubber circuit – – – S202T02F▲ 200 V lines, low profile (built-in zero-cross circuit) 200 V lines, low profile (built-in zero-cross circuit)   – – – – 200 V lines (built-in zero-cross circuit)   – 200 V lines (built-in zero-cross circuit)   – S216S02F▲ 200 V lines (built-in zero-cross circuit) 400 400 – S202S02F▲ 400 3*3 – Zerocross circuit 3.0 16*5 200 V lines, low profile S201S06F▲ 3.0 8*2 S208T01F▲ S208T02F▲ 4.0 16*5 – S102S11F▲ S102S12F▲ 12*4 4.0 100 V lines (built-in zero-cross circuit) Zerocross circuit 3.0 8*2 100 V lines S108T02F▲ 3.0 8*2 S112S01F▲ Zerocross circuit (Ta = 25°C) Approved by safety standards*6 – – 4-pin SIP – 600 3.0 2 8*2 3*3 4-pin SIP 4.0 16*5 8*6 Low profile 4-pin SIP 600 3.0 3.0 600 8*2 4.0 16*5 *1 to *6: Please refer to the next page. The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. 80 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 81 Wednesday, July 18, 2007 1:03 PM SOLID STATE RELAYS Model No. : Approved, o: Under application Internal connection diagram S202S11F▲ S202S12F▲ Zerocross circuit Electrical characteristics Min. trigger current UL IFT (mA) MAX. VD (V) RL (Ω ) Features Absolute maximum ratings Repetitive Isolation ON-state voltage peak TÜV Package current OFF-state (AC) IT (rms) CSA EN voltage Viso (rms) (A) 60950 (kV) VDRM(V) 200 V lines (built-in snubber circuit)   – 8*1 600 4.0 8 12 30 200 V lines (built-in snubber circuit, built-in zero-cross circuit)   – 8*1 600 4.0 8 6 30    8 12 30 600 3.0 8 12 30 8 6 30 8 6 30 S202SE1F▲ 4-pin SIP 8*2 200 V lines, reinforced isolation S216SE1F▲ S202SE2F▲ S216SE2F▲ Zerocross circuit (Ta = 25°C) Approved by safety standards*6 200 V lines (built-in zero-cross circuit), reinforced isolation – –  16*5    8*2 600 – –  16*5 *1 Tc & 88°C *2 Tc & 80°C *3 Tc & 100°C *4 Tc & 70°C *6 Please refer to Specification Sheets for model numbers approved by safety standards. The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. S102T01 series (Low profile 4-pin SIP) 3.0 *5 Tc & 60°C Optoelectronics (2) S102S01 series (4-pin SIP) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 81 Device_E.book Page 82 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOINTERRUPTER INDEX TREE ■ Photointerrupter Lineup Output type Single phototransistor Package type Compact Outline General purpose Mounting method High resolution PWB mounting type/ Soldering reflow GP1S2xJ0000F series/GP1S092HCPIF/ GP1S9xJ0000F series/ GP1S09xHCZ0F series/ GP1S19xHCZ0F/GP1S19xHCxSF 83 Two-phase PT output PWB mounting type GP1S39J0000F 83 General purpose Snap-in GP1S566VJ00F 83 84 84 PWB mounting type, etc. GP1S5x series/GP1S5xVJ000F series/ GP1S56x series Horizontal slit, High resolution PWB mounting type GP1S59J0000F/GP1S525VJ00F 84 With connector General purpose Snap-in GP1S74PJ000F 84 Case type General purpose PWB mounting type, etc. GP1L5xJ series/GP1L5xV series 85 Wide gap PWB mounting type GP1L57J0000F 85 85 High resolution Darlington phototransistor Page GP1S2x series/GP1S37J0000F High response speed Case type Model No. (series) PWB mounting type High sensitivity Digital output Compact Low voltage operation PWB mounting type GP1A91 series/GP1A98HCZ0F (OPIC output) Case type High resolution PWB mounting type GP1A5x series 86 Wide gap Both-side/PWB mounting type GP1A5xHR series/GP1A52LRJ00F 86 General purpose Screw mounting type/Snap-in GP1A05 series/GP1A7x series/ GP1A07x series 87 With connector Output type Single phototransistor Package type Compact, DIP Mounting method Model No. (series) Page PWB mounting type GP2S2x series 87 Long focal distance PWB mounting type GP2S40J0000F 87 Leadless Long focal distance PWB mounting type GP2S700HCP 87 Compact, thin (leadless) General purpose PWB mounting type GP2S60 87 Compact, DIP General purpose PWB mounting type GP2L24J0000F 88 With connector Light modulation type, Sensitivity adjusted Screw mounting type/ Compact snap-in/ Inverter light countermeasures GP2A2x series, GP2A200LCS0F/ GP2A231LRSAF, GP2A240LCS0F 88 High response speed Darlington phototransistor Outline General purpose High sensitivity OPIC output Detection type Transmissive type Outline (Output type etc.) Page Snap-in GP1S44S1J00F 89 Snap-in GP1A44E1J00F 89 Compact, [built-in ball] (2-phase PT output) 3 direction detection PWB mounting type GP1S36J0000F 90 (2-phase PT output) 4 direction detection PWB mounting type GP1S036HEZ 90 Resolution: Disk slit pitch: 0.7 mm Side mounting type GP1A3xR series 90 Resolution: Linear scale slit pitch: 0.17/0.14 mm PWB mounting type GP1A038RBK0F/GP1A046RBZLF/ GP1A047RBZLF/GP1A038RCK0F/ GP1A044RCKLF 90 Resolution: Linear scale slit pitch: 0.085 PWB mounting type GP1A037RDKJF/GP1A047RDZLF 90 Phase A (digital output) Phase B (digital output) 82 Model No. (series) With connector With actuator (OPIC output) Case type With encoder function Reflective type Mounting method With connector With actuator (Phototransistor output) Injection For prism system (Single phototransistor) Screw mounting GP2S29SJ000F 91 For amusement industry – GP2A221HRKA/GP2A222HCKA 91 Device_E.book Page 83 Wednesday, July 18, 2007 1:03 PM PHOTOINTERRUPTERS ■ Photointerrupters ◆ Single phototransistor output Internal connection diagram Features GP1S25J0000F ▲ Side lead type, For soldering reflow GP1S27J0000F ▲ PWB mounting type Height: 2.9 mm, For soldering reflow, with positioning boss PWB mounting type Wide gap, low profile (3.1 mm) Wide gap, low profile (2.9 mm) Wide gap, with positioning pin Wide gap, with positioning pin, PWB mounting type (5.5 × 2.6 × 4.8 mm) High resolution, thin detector type Low profile (3.5 × 2.6 × 3.1 mm) Low profile (3.5 × 2.6 × 2.9 mm) Compact, wide gap, size: 3.7 × 2.0 × 2.7 mm Compact, wide gap, surface mount compatible, size: 3.5 × 2.0 × 2.7 mm Compact, Low profile (3.1 × 2.0 × 2.7 mm) Surface mount, for soldering reflow, compact, low profile (3.1 × 2.0 × 2.7 mm) High resolution, wide gap, with mounting hole, PWB mounting type High resolution, wide gap, with mounting hole (4.5 × 2.6 × 4.5 mm) GP1S092HCPIF GP1S37J0000F ▲ GP1S93J0000F ▲ GP1S093HCZ0F GP1S94J0000F ▲ GP1S094HCZ0F GP1S95J0000F ▲ GP1S96J0000F ▲ GP1S096HCZ0F GP1S194HCZ0F GP1S195HCZSF GP1S195HCPSF GP1S196HCZ0F GP1S196HCZSF GP1S97J0000F ▲ GP1S097HCZ0F PT1 GP1S39J0000F ▲ PT2 PWB mounting type, two-phase output type 1.6 0.3 1.0 5 5 35 0.1 1 000 5 0.9 0.8 4.3 1.5 5 50 0.1 1 000 5 2.0 0.3 2.0 5 5 50 0.1 1 000 5 2.0 2.0 2.0 3.5 0.8 0.3 0.3 0.3 1 2.0 2.0 0.8 3 5 5 5 5 5 5 5 50 50 50 50 0.1 0.1 0.1 0.1 1 000 1 000 1 000 1 000 5 5 5 5 3.0 0.3 0.8 5 5 50 0.1 1 000 5 1.6 1.0 1.0 0.3 0.3 0.3 1.0 2.0 2.0 5 5 5 5 5 5 35 50 50 0.1 0.1 0.1 1 000 1 000 1 000 5 5 5 1.7 0.3 1.0 5 5 – – – – 1.5 0.3 1.0 5 5 – – – – 1.1 0.3 2.0 5 5 50 0.1 1 000 5 1.1 0.3 2.0 5 5 50 0.1 1 000 5 2.2 0.3 1.6 5 5 50 0.1 1 000 5 2.0 0.3 2.0 5 5 50 0.1 1 000 5 1.5 0.6*1 3.3 4 5 50 0.1 1 000 5 Optoelectronics Model No. (Ta = 25°C) Electro-optical characteristics Detecting and Current transfer ratio Response time Slit width emitting tr CTR (mm) F V CE RL VCE IC I gap (µs) (%) (mA) (V) (mA) (Ω) (V) (mm) TYP. MIN. ❇ Topr: –25 to +85 °C *1 Reading pitch The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. GP1S25J0000F▲ GP1S27J0000F▲ GP1S092HCPIF GP1S37J0000F▲ GP1S93J0000F▲ GP1S093HCZ0F GP1S94J0000F▲ GP1S094HCZ0F GP1S95J0000F▲ GP1S96J0000F▲ GP1S096HCZ0F GP1S194HCZ0F GP1S195HCPSF GP1S195HCZSF GP1S196HCZ0F GP1S196HCZSF GP1S97J0000F▲ GP1S097HCZ0F GP1S39J0000F▲ Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 83 Device_E.book Page 84 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOINTERRUPTERS Model No. (Ta = 25°C) Internal connection diagram Electro-optical characteristics Detecting and Current transfer ratio Response time Slit width emitting tr CTR (mm) F V CE RL VCE IC I gap (µs) (%) (mA) (V) (mA) (Ω) (V) (mm) TYP. MIN. Features GP1S566VJ00F Long case, snap-in mounting type 3.0 0.5 2.5 20 5 3 2 100 2 GP1S50J0000F High resolution, both-side mounting type 3.0 0.5 2.5 20 5 3 2 100 2 GP1S51VJ000F* 1 High resolution, side mounting type 3.0 0.5 2.5 20 5 3 2 100 2 GP1S52VJ000F* 1 High resolution, PWB mounting type 3.0 0.5 2.5 20 5 3 2 100 2 GP1S53VJ000F High resolution, PWB mounting type 5.0 0.5 2.5 20 5 3 2 100 2 3.0 0.5 2.5 20 5 3 2 100 2 2.0 0.15 2.0 20 5 38 0.5 1 000 2 5.0 0.5 2.5 20 5 3 2 100 2 4.2 0.5 2.5 20 5 3 2 100 2 5.0 0.5 3.25 20 10 3 2 100 2 High resolution, with positioning pin, PWB mounting type High resolution, with positioning pin, PWB mounting type High resolution, with positioning pin, PWB mounting type High resolution, horizontal slit, with positioning pin, PWB mounting type Short lead type with easy board mounting, horizontal slit, high precision positioning (lead: within ø1.2 mm) GP1S54J0000F GP1S56TJ000F GP1S58VJ000F GP1S59J0000F GP1S525VJ00F ❇ Topr: –25 to +85 °C *1 High reliability types: GP1SQ51VJ00F, and GP1SQ52J000F are also available. GP1S566VJ00F GP1S50J0000F GP1S51VJ000F GP1S52VJ000F GP1S53VJ000F GP1S54J0000F GP1S56TJ000F GP1S58VJ000F GP1S59J0000F GP1S525VJ00F Model No. GP1S74PJ000F Internal connection diagram (Ta = 25°C) Electro-optical characteristics Detecting and Current transfer ratio Response time Slit width emitting tr CTR (mm) VCE RL VCE IC IF gap (µs) (%) (mA) (V) (mA) (Ω) (V) (mm) TYP. MIN. Features Snap-in mounting type with connector Applicable to 3 kinds of thickness of mounting boards 5.0 0.5 2.5 20 5 3 2 100 2 ❇ Topr: –25 to +85 °C GP1S74PJ000F 84 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 85 Wednesday, July 18, 2007 1:03 PM PHOTOINTERRUPTERS ✩New product ◆ Darlington phototransistor output Model No. Internal connection diagram (Ta = 25°C) Electro-optical characteristics Detecting and Current transfer ratio Response time Slit width emitting tr CTR (mm) VCE RL VCE IC IF gap (µs) (%) (mA) (V) (mA) (Ω) (V) (mm) TYP. MIN. Features GP1L50J0000F High resolution, both-side mounting type 3.0 0.5 50 1 2 80 2 100 2 GP1L51J0000F High resolution, side mounting type 3.0 0.5 50 1 2 80 2 100 2 GP1L52VJ000F High resolution, PWB mounting type 3.0 0.5 50 1 2 80 2 100 2 GP1L53VJ000F High resolution, PWB mounting type 5.0 0.5 30 1 2 80 2 100 2 GP1L57J0000F Wide gap, PWB mounting type 10.0 1.8 70 1 2 130 2 100 2 ❇ Topr: –25 to +85 °C GP1L50J0000F GP1L51J0000F GP1L52VJ000F GP1L53VJ000F GP1L57J0000F “OPIC” (Optical IC) is a trademark of SHARP Corporation. An OPIC consists of a ◆ OPIC type ( light-detecting element and signal-processing circuit integrated onto a single chip. ) Amplifier GP1A91LRJ00F ▲ (15 kΩ) GP1A91LCJ00F ▲ (15 kΩ) Amplifier ✩GP1A98HCZ0F Detecting and emitting gap (mm) Slit width (mm) Compact, PWB mounting, low operating voltage (1.4 V to 7.0 V) 1.2 (0.23) *1 – 3.5 3 10.0 3.0 5 3 000 3 Compact, PWB mounting, low operating voltage (1.4 V to 7.0 V) 1.2 (0.23) *1 – 3.5 3 10.0 3.0 5 2 500 3 Compact, PWB mounting 3.0 0.5 8 – 3.3 to 24 10.0 2.0 10 3 900 3.3 to to 24 20 000 Features Voltage regulator Amplifier Optoelectronics Model No. Internal connection diagram (Ta = 25°C) Electro-optical characteristics Threshold input current Propagation delay time IFHL tPLH tPHL IFLH RL VCC IF (mA) (mA) (µs) (µs) (Ω ) (V) (mA) MAX. MAX. TYP. TYP. VCC (V) ❇ Topr = –25 to +85°C *1 Resolution of detecting portion The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. GP1A91LRJ00F (GP1A91LCJ00F) GP1A98HCZ0F Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 85 Device_E.book Page 86 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOINTERRUPTERS Model No. (Ta = 25°C) Internal connection diagram GP1A50HRJ00F GP1A51HRJ00F GP1A52HRJ00F Voltage regulator Amplifier GP1A53HRJ00F Features GP1A58HRJ00F Threshold input current IFHL IFLH VCC (mA) (mA) (V) MAX. MAX. tPLH (µs) TYP. Propagation delay time tPHL RL IF (µs) (mA) (Ω) TYP. VCC (V) Both-side mounting type 3.0 0.5 5 – 5 3 5 5 280 5 Side mounting type 3.0 0.5 5 – 5 3 5 5 280 5 PWB mounting type 3.0 0.5 5 – 5 3 5 5 280 5 PWB mounting type 5.0 0.5 8 – 5 3 5 8 280 5 10.0 1.8 7 – 5 3 5 7 280 5 5.0 0.5 8 – 5 3 5 8 280 5 3.0 0.5 – 5 5 5 3 5 280 5 PWB mounting type, with positioning pin PWB mounting type, with positioning pin GP1A57HRJ00F Detecting and Slit width emitting (mm) gap (mm) Electro-optical characteristics Voltage regulator Amplifier GP1A52LRJ00F PWB mounting type ❇ Topr = –25 to +85°C GP1A50HRJ00F 86 GP1A51HRJ00F GP1A52LRJ00F (GP1A52HRJ00F) GP1A53HRJ00F  GP1A58HRJ00F   with positioning pin  GP1A57HRJ00F Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 87 Wednesday, July 18, 2007 1:03 PM PHOTOINTERRUPTERS “OPIC” (Optical IC) is a trademark of SHARP Corporation. An OPIC consists of a ◆ OPIC type ( light-detecting element and signal-processing circuit integrated onto a single chip. Internal connection diagram Model No. GP1A05AJ000F Features Detecting and Slit width emitting (mm) gap (mm) ) (Ta = 25°C) Electro-optical characteristics Low level output voltage Supply voltage VCC VOL VCC Light IOL (V) (V) (mA) (V) cut-off MIN. MAX. MAX. Either-side mounting type 5.0 0.5 4.5 5.5 0.35 No 16 5 GP1A05A2J00F Either-side mounting type 5.0 0.5 4.5 5.5 0.35 No 16 5 GP1A05A5J00F Either-side mounting type 5.0 0.5 4.5 5.5 0.35 No 16 5 5.0 0.5 4.5 5.5 0.35 No 4 5 5.0 0.5 2.7 5.5 0.35 No 4 5 5.0 0.5 4.5 5.5 0.35 Yes 16 5 5.0 0.5 4.5 5.5 0.4 Yes 16 5 5.0 0.5 4.5 5.5 0.4 Yes 16 5 GP1A73AJ000F Voltage regulator Amplifier GP1A073LCS Voltage regulator Amplifier GP1A75EJ000F Voltage regulator Amplifier GP1A05EJ000F 15 kΩ GP1A05E2J00F with 3-pin connector Voltage regulator Amplifier Compact, snap-in mounting type Compact, snap-in mounting type, low voltage operation Either-side mounting type Either-side mounting type Screw mounting type GP1A05AJ000F (GP1A05EJ000F) GP1A05A2J00F (GP1A05E2J00F) GP1A05A5J00F GP1A73AJ000F, GP1A073LCS Optoelectronics ❇ Topr: –20 to +75°C GP1A75EJ000F ■ Photointerrupters ◆ Single Phototransistor output Model No. (Ta = 25°C) Internal connection diagram Focal distance (mm) Features Electro-optical characteristics Current transfer ratio Response time VCE tr (µs) IC RL CTR (%) IF (mA) (V) TYP. (mA) (Ω ) MIN. VCE (V) GP2S24J0000F Compact (DIP), visible light cut-off 0.7 0.5 4 2 20 0.1 1 000 2 GP2S27J0000F Compact, allow reflow soldering, visible light cut-off 0.7 0.5 4 2 20 0.1 1 000 2 GP2S40J0000F Compact, long focal distance, visible light cut-off 3 2.5 20 5 50 0.1 1 000 2 GP2S700HCP Compact, long focal distance, surface mounting leadless type 3 1.5 4 2 20 0.1 1 000 2 GP2S60 Thin (3.2 × 1.7 × t: 1.1 mm), leadless type (0.5) 1.75*1 TYP. 4 2 20 0.1 1 000 2 ❇ Topr: –25 to +85°C GP2S24J0000F *1 Detection area GP2S27J0000F GP2S40J0000F GP2S700HCP GP2S60 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 87 Device_E.book Page 88 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOINTERRUPTERS ◆ Darlington Phototransistor output Model No. Internal connection diagram GP2L24J0000F (Ta = 25°C) Focal distance (mm) Features Compact (DIP), visible light cut-off Electro-optical characteristics Current transfer ratio Response time VCE tr (µs) IC RL CTR (%) IF (mA) (V) TYP. (mA) (Ω) MIN. 0.7 12.5 4 2 80 10 VCE (V) 100 2 GP2L24J0000F “OPIC” (Optical IC) is a trademark of SHARP Corporation. An OPIC consists of a ◆ OPIC output ( light-detecting element and signal-processing circuit integrated onto a single chip. Model No. GP2A22J0000F ▲ GP2A200LCS0F GP2A240LCS0F OPIC output GP2A250LCS0F GP2A25J0000F GP2A231LRSAF GP2A25NJJ00F GP2A25BJ000F GP2A28AJ000F Internal connection diagram Features Multi types of paper detectable, light modulation type, with connector, sensitivity adjusted Multi types of paper detectable, light modulation type, with connector, sensitivity adjusted Improved light-resistance characteristic for inverter lighting (500 lx), light modulation type, connector output Static electricity resistant, improved light-resistance characteristic for inverter lighting (500 lx), light modulation type, connector output Multi types of paper detectable, light modulation type, (Following with connector, sensitivity adjusted diagram) Compact, Hook type, Multi types of paper detectable, light modulation type, with connector, sensitivity adjusted Multi types of paper detectable, light modulation type, sensitivity adjusted, applicable to inverter fluorescent lamp, built-in visible light cut filter Multi types of paper detectable, light modulation type, with connector, sensitivity adjusted Multi types of paper detectable, light modulation type, with connector, sensitivity adjusted, detecting portion with flat configuration ) (Ta = 25°C) Electro-optical characteristics Optimum Supply voltage Dissipation current Low level output voltage detecting VCC ICC VOL distance VCC VCC (V) (mA) (V) (mm) (V) (V) MAX. MAX. MIN. MAX. 9 to 15 4.75 5.25 30*1 5 0.4 5 5 to 15 4.75 5.25 30*1 5 0.4 5 5 to 15 4.75 5.25 30*1 5 0.4 5 5 to 15 4.75 5.25 30*1 5 0.4 5 3 to 7 4.75 5.25 30*1 5 0.4 5 3 to 7 4.75 5.25 20*1 5 0.4 5 3 to 6 4.75 5.25 30*1 5 0.4 5 3 to 7 4.75 5.25 30*1 5 0.4 5 3 to 7 4.75 5.25 30*1 5 0.4 5 ❇ Topr: –10 to +60°C (GP2A22J0000F, GP2A25J0000F, GP2A25BJ000F) *1 Smoothing value RL = ∞ The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. [Internal connection diagram] Amplifier Comparator Voltage regulator Demodulator Synchronous detector Oscillator GP2A22J0000F GP2A250LCS0F 88 GP2A25J0000F  GP2A25NJ, GP2A28AJ000F, GP2A200LCS0F,   GP2A240LCS0F  GP2A25BJ000F GP2A231LRSAF Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 89 Wednesday, July 18, 2007 1:03 PM PHOTOINTERRUPTERS ■ Photointerrupters for Specific Applications ◆ Transmissive type Model No. Internal connection diagram Features Spring lever type actuator United with connector GP1S44S1J00F (Ta = 25°C) Actuator lever starting torque (Initial) MAX. Electro-mechanical characteristics*1 Light beam interrupted Light beam uninterrupted Dissipation current Collector current Dissipation current Collector current VCC VO ICC2 IC2 VCC IC1 VCC VCC VO ICC1 (µA) (V) (V) (V) (V) (mA) (V) (mA) (mA) (V) 1 × 10-4 N•m or less 20 MAX. 5 50 MAX. 5 5 20 MAX. 0.25 MIN. 5 5 5 ❇ Topr: –25 to +75 °C *1 Operating voltage: 4.5 to 5.5 V GP1S44S1J00F Voltage regulator Amplifier GP1A44E1J00F 15 kΩ Features Spring lever type actuator, United with connector Electromechanical characteristics Electro-mechanical characteristics*1 Supply Output voltage current IOL VCC (V) (mA) Actuator lever starting torque Light beam interrupted Light beam uninterrupted Dissipation current Low level output voltage Dissipation current High level output voltage ICCL VCC VOL VCC IOL ICCH VCC VOH VCC RL (mA) (V) (V) (kΩ) (V) (V) (mA) (mA) (V) (V) 10 50 1 × 10–4 N•m 20 or less MAX. 5 0.4 MAX. 5 16 20 MAX. 5 Vcc × 0.9 MIN. 5 Optoelectronics Model No. Internal connection diagram (Ta = 25°C) Absolute maximum ratings 47 ❇ Topr: –25 to +75 °C *1 Operating voltage: 4.5 to 5.5 V GP1A44E1J00F Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 89 Device_E.book Page 90 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOINTERRUPTERS Model No. Internal connection diagram GP1S36J0000F ▲ PT1 PT2 GP1S036HEZ▲ (Ta = 25°C) Electro-optical characteristics Current transfer ratio Response time CTR tr VCE RL VCE IF IC (%) (µs) (mA) (V) (mA) (Ω) (V) MIN. TYP. Features Built-in ball (2 phase output), compact, PWB mounting type Built-in ball (2 phase output), compact, PWB mounting type, 4-direction detection 1.2 5 5 50 0.1 1 000 5 1.1 5 5 50 0.1 1 000 5 ❇ Topr: –25 to +85 °C The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. GP1S36J0000F GP1S036HEZ (Ta = 25°C) Absolute maximum ratings Electro-optical characteristics Response frequency Dissipation current (output side) (kHz) IF (mA) Icc (mA) MAX. MAX. Model No. Vcc (V) Topr (°C) Operating voltage Vcc (V) GP1A30RJ000F ▲ 7 0 to +70 4.5 to 5.5 Disk slit pitch 0.7 (mm) 5 30 20 GP1A038RBK0F* 1, *3 7 0 to +70 2.7 to 5.5 Linear scale slit pitch 0.17 (mm) 20 11 5 GP1A038RCK0F* 1, *3 7 0 to +70 2.7 to 5.5 Linear scale slit pitch 0.14 (mm) 20 11 5 Output signal Resolution GP1A037RDKJF* 1, *3 7 0 to +70 40 25 10 — –10 to +60 2.7 to 5.5 Phase A (Digital output) 2.7 to 5.5 Phase B (Digital output) Linear scale slit pitch 0.0847 (mm) GP1A044RCKLF* 1 Linear scale slit pitch 0.14 (mm) 20 15 5 GP1A046RBZLF* 1 — –10 to +60 2.7 to 5.5 Linear scale slit pitch 0.17 (mm) 20 20 5 GP1A047RBZLF — 0 to +60 2.7 to 5.5 Linear scale slit pitch 0.17 (mm) 20 20 7 GP1A047RDZLF — –10 to +60 2.7 to 5.5 Linear scale slit pitch 0.0847 (mm) 120 20 7 *1 High precision read and low affection of angle error from vibration thanks to the multi-segment PD system *2 Duty ratio: 50±10%, phase difference: 90±30° *3 Duty ratio: 50±20%, phase difference: 90±45° The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. GP1A30RJ000F ▲ 90 GP1A044RCKLF GP1A038RBK0F (GP1A038RCK0F, GP1A037RDKJF) GP1A046RBZLF GP1A047RBZLF (GP1A047RDZLF) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 91 Wednesday, July 18, 2007 1:03 PM PHOTOINTERRUPTERS ◆ Reflective type Model No. Internal connection diagram (Ta = 25°C) Focal distance (mm) Features Long focal distance (with prism system), compact, screw mounting type GP2S29SJ000F ❇ Topr: –25 to +85°C *1 Electro-optical characteristics Current transfer ratio Response time VCE tr (µs) IC RL CTR (%) IF (mA) (V) TYP. (mA) (Ω) MIN. 1.0*1 20 5 38 0.5 1 000 VCE (V) 2 *1 Space between prism and sensor is 8 mm. GP2S29SJ000F Model No. (Ta = 25°C) Electro-optical characteristics Dissipation current Response frequency Supply voltage Vcc f (Hz) Icc (mA) Features GP2A221HRKA Employs reflective type, pinball detector, connector with lock GP2A222HCKA Employs reflective type, pinball detector, connector with lock In conjunction with an IC, detects beam interuption*1 4.5 to 15 MAX. 10 MAX. 500 4.5 to 16.5 MAX. 10 MAX. 500 Optoelectronics *1 Used together with interface IC for control (IR3N184) GP2A221HRKA (GP2A222HCKA) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 91 Device_E.book Page 92 Wednesday, July 18, 2007 1:03 PM OPTO PHOTOTRANSISTOR INDEX TREE ■ Phototransistor Lineup Package Epoxy resin with lens (ø3 mm) Epoxy resin with lens Output type General purpose High sensitivity ±20° PT381 PT381F Single phototransistor General purpose/Narrow acceptance ±13° PT480E00000F PT480FE0000F Compact, thin ±35° PT4800E0000F PT4800FE000F / PT4850FE000F Single phototransistor Single phototransistor Darlington phototransistor PT380 PT380F High sensitivity/Narrow acceptance ±13° PT481E00000F PT481FE0000F High sensitivity/Narrow acceptance/Long lead ±13° — PT483F1E000F PT4810FJE00F High sensitivity/Compact, thin ±35° PT4810E0000F High sensitivity/Intermediate acceptance ±40° — PT491FE0000F High sensitivity/Intermediate acceptance/Long lead ±40° — PT493FE0000F Narrow acceptance ±6° PT501 ▲ — Narrow acceptance/With base terminal ±6° PT510 ▲ — Narrow acceptance/With base terminal ±6° PT550 ▲ — Wide acceptance/With base terminal ±50° PT550F ▲ — Compact ±60° PT600T — Compact (surface mounting type) ±70° PT200MC0NP — Compact (infrared cut type) ±60° PT202MR0MP1 — Compact (side view/top view mounting possible) ±15° PT100MC0MP PT100MF0MP Compact ±60° PT601T — Compact (side view/top view mounting possible) ±15° — PT100MF1MP The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. 92 ±20° Visible light cut-off Standard Darlington phototransistor Darlington phototransistor Surface mounting leadless type Model No. Half sensitivity angle Single phototransistor Darlington phototransistor TO-18 Features Device_E.book Page 93 Wednesday, July 18, 2007 1:03 PM PHOTOTRANSISTORS Model No. Package Ee (mW/cm2) MAX. VCE (V) Dq (°) TYP. λp (nm) TYP. 35 50 –25 to +85 0.16 1.17 5 Ev, 100 Ix 1 × 10–7 20 ±20 800 50 –25 to +85 0.095 0.9 5 Ev, 100 Ix 1 × 10–7 20 ±20 860 PT600T 35 50 –25 to +85 0.7 TYP. 3.5 5 5 1 × 10–7 20 ±60 880 PT200MC0NP 50 50 –25 to +85 0.016 0.059 5 0.1 1 × 10–7 20 ±70 930 5 5 –30 to +85 — TYP. 0.043 1.5 Ev, 100 Ix 1 × 10–7 1.5 ±60 620 35 75 –30 to +85 1.7 5.1 5 1 1 × 10–7 20 ±15 900 PT202MR0MP1* 2 ø3 epoxy resin Surface mounting leadless type PT100MC0MP Single MIN. ICEO(A) Ic (mA) VCE MAX. (V) 35 PT380 PT380F*1 PT100MF0MP*1 35 75 –30 to +85 1.15 3.45 5 1 1 × 10–7 20 ±15 910 PT480E00000F 35 75 –25 to +85 0.4 TYP. 1.7 5 1 1 × 10–7 20 ±13 800 PT480FE0000F* 1 35 75 –25 to +85 0.25 TYP. 0.8 5 1 1 × 10–7 20 ±13 860 35 75 –25 to +85 0.12 TYP. 0.4 5 1 1 × 10–7 20 ±35 800 PT4800FE000F* 1 35 75 –25 to +85 0.08 TYP. 0.25 5 1 1 × 10–7 20 ±35 860 PT4850FE000F* 1 35 75 –25 to +85 0.12 0.56 5 1 1 × 10–7 20 ±35 860 PT501 ▲ 45 75 –25 to +125 2.5 TYP. 10 5 10 1 × 10–7 30 ±6 800 35 75 –25 to +125 2.5 TYP. 20.0 5 10 1 × 10–7 30 ±6 800 35 50 –25 to +85 0.12 1.5 10 Ev, 2 Ix 1 × 10–6 10 ±20 800 35 50 –25 to +85 0.07 1.08 10 Ev, 2 Ix 1 × 10–6 10 ±20 860 PT481E0000F 35 75 –25 to +85 1.5 25 2 0.1 1 × 10–6 10 ±13 800 PT481FE0000F* 1 35 75 –25 to +85 0.9 27 2 0.1 1 × 10–6 10 ±13 860 PT4810E0000F 35 75 –25 to +85 0.45 7.0 2 0.1 1 × 10–6 10 ±35 800 35 75 –25 to +85 0.27 6.0 2 0.1 1 × 10–6 10 ±35 860 PT483F1E000F* 1 35 75 –25 to +85 1.5 4.0 2 0.1 1 × 10–6 10 ±13 860 PT491FE0000F* 1 35 75 –25 to +85 0.2 0.8 2 Ev, 2 Ix 1 × 10–6 10 ±40 860 PT493FE0000F* 1 35 75 –25 to +85 0.2 0.8 2 Ev, 2 Ix 1 × 10–6 10 ±40 860 PT550 ▲ 35 150 –25 to +125 3 TYP. 20.0 5 0.1 1 × 10–6 10 ±6 800 35 150 –25 to +125 3 TYP. 20.0 5 1.0 1 × 10–6 10 ±50 800 10–6 10 ±60 880 10 ±15 860 PT4800E0000F PT510 ▲ PT381 PT381F*1 Darlington (Ta = 25°C) Absolute maximum ratings VCEO Topr PC (mW) (°C) (V) PT4810FJE00F* 1 PT550F ▲ PT601T PT100MF1MP*1 Epoxy resin with lens TO-18 ø3 epoxy resin Epoxy resin with lens TO-18 Leadless chip type Surface mounting leadless type 35 50 –25 to +85 0.03 0.3 10 0.01 1× 35 75 –30 to +85 0.2 1.2 5 0.01 1 × 10–6 Optoelectronics Type ■ Phototransistors *1 Visible light cut-off type *2 Infrared cut-off type Note) Some products are handled by the Compound Semiconductor Division. The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. PT600T (PT601T) PT4800E0000F  PT4800FE000F,   PT4810E0000F,   PT4810FJ00F,   PT4810FJE00F,   PT4850FE000F  PT200MC0NP PT483F1E000F PT202MR0MP1 PT501 ▲ PT100MF0MP  PT100MF1MP,   PT100MC0MP:   Transparent resin  PT510 ▲ (PT550 ▲) PT380  PT380F, PT381   PT381F  PT491FE0000F PT493FE0000F PT480E00000F  PT480FE0000F,   PT481E00000F,   PT481FE0000F  PT550F ▲ Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 93 Device_E.book Page 94 Wednesday, July 18, 2007 1:03 PM OPTO PHOTODIODES ■ PIN Photodiodes Model No. (Ta = 25°C) Package (Material) Features PD49PIE0000F▲*1 PD410PI2E00F* 1 PD411PI2E00F PD412PI2E00F* 2 PD413PI2E00F* 1 PD60T PD100MC0MP PD100MF0MP*1 Active area (mm2) Topr (°C) Isc (µA) MIN. Ev (Ix) Id (A) MAX. VR (V) tr, tf (µs) TYP. VR (V) RL (kΩ) λp (nm) TYP. 7.73 –25 to +85 2.4 100 3 × 10–8 10 0.2 10 1 1 000 3.31 –25 to +85 2.5 100 1 × 10–8 10 0.2 10 1 1 000 3.31 –25 to +85 5.0 100 1 × 10–8 10 0.2 10 1 960 3.31 –25 to +85 3.5 100 1 × 10–8 10 0.25 10 1 800 1 × 10–8 10 0.2 10 1 960 1 × 10–8 10 0.1 10 1 960 10–8 10 0.01 15 0.18 820 10 0.01 15 0.18 850 Visible light cut-off epoxy resin Visible light cut-off epoxy resin with condenser (lens) PIN type Epoxy resin with transparent condenser (lens) Epoxy resin with transparent condenser (lens) PIN type Visible light cut-off epoxy IrDA1.0 resin with condenser (lens) Chip device type Transparent resin Surface mounting Transparent epoxy resin leadless type board with lens Surface mounting Visible light cut-off epoxy leadless type resin board with lens 3.31 –25 to +85 – –25 to +85 MIN. 4.5 100 (TYP. 5.4) TYP. 4 1 000 – –30 to +85 0.6 100 1× – –30 to +85 0.4 100 1 × 10–8 *1 Visible light cut-off type *2 Tape packaging type (PD412TNE00F) The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. PD49PIE0000F▲ PD410PIE00F PD60T  PD411PI2E00F: transparent; PD412PI2E00F: transparent,   PD413PI2E00F  PD100MC0MP (PD100MF0MP: black) ■ PSD (Position Sensitive Detector) Model No. Features PD3122FE000F ▲ Package (Material) (Ta = 25°C) Topr (°C) Active area (mm2) Position sensitive detector Visible light 1.2 –25 to +85 With mounting hole cut-off epoxy resin (1.0 × 1.2 mm) IL (µA) MIN. 6.4 Ev (Ix) Interelectrode resistance VR (kΩ) (V) TYP. 1 000 110 to 170 1 tr, tf (µs) TYP. VR (V) 5 1 Position detection RL error (kΩ) (µm) MAX. 1 ±25 Custom-made products (detecting portion changed products) are also available. The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. PD3122FE000F ■ Blue Sensitive Photodiodes Model No. BS520E0F Features Planer type (Ta = 25°C) Package (Material) Active area (mm2) Topr (°C) Isc (µA) MIN. Resin (black) 5.34 –20 to +60 0.4 Ev (Ix) 100 Id (A) MAX. 1 × 10–11 VR (V) 1 λp (nm) TYP. 560 BS520E0F (with filter) 94 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 95 Wednesday, July 18, 2007 1:03 PM OPTO OPIC LIGHT DETECTORS ✩New product ■ Laser Power Monitoring Photodiodes for Optical Disc System Model No. PD101SC0SS0F Features High response speed (cut-off frequency: 400 MHz) Package (Material) Active area (mm) Topr (°C) Isc (mA) TYP. Transparent epoxy resin ø0.8 –25 to +85 450 (Ta = 25°C) Ev (Ix) Id (A) MAX. VR (V) λp (nm) TYP. 100 1 × 10–9 5 820 PD101SC0SS0F ■ RGB Color Sensor ✩PD30CMC31MZ Features Package RGB 3-color LED compatible 3PD structure Filter-on chip structure allows for both infrared light reducing characteristics and a more compact size (1.1 mm thick) Surface mounting 3 x 4 mm Light receiving sensitivity (A/W) TYP. Blue Green Red Blue Green Red 460 540 620 0.18 0.23 0.16 Topr (°C) –40 to +85 Optoelectronics Model No. (Ta = 25°C) Peak sensitivity wavelength (nm) PD30CMC31MZ (Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a ) ■ Ambient Light Sensors ( “OPIC” light-detecting element and signal-processing circuit integrated onto a single chip. Absolute maximum ratings Model No. IS485E IS486E Type Package Built-in schmidt trigger circuit, amplifier and voltage regulator Transparent epoxy resin with condenser (lens) VCC (V) P IO (mW) (mA) Topr (°C) EVLH EVHL (Ix) (Ix) MAX. MAX. (Ta = 25°C) Electro-optical characteristics tPLH tPHL (µs) (µs) VCC VCC (V) TYP. TYP. (V) EV (Ix) RL (Ω ) –0.5 to +17 175 50 –25 to +85 – 35 5 5 3 5 50 280 –0.5 to +17 175 50 –25 to +85 35 – 5 3 5 5 50 280 IS485E (IS486E) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 95 Device_E.book Page 96 Wednesday, July 18, 2007 1:03 PM OPTO OPIC LIGHT DETECTORS (Ta = 25°C) Absolute maximum ratings Model No. IS489E Type Package Built-in Schmidt trigger circuit and amplifier Transparent epoxy resin with condenser (lens) Topr (°C) Operating supply voltage (V) –25 to +85 1.4 to 7.0 P IO (mW) (mA) 80 2 Electro-optical characteristics tPHL tPLH EVLH EVHL (µs) (µs) (Ix) (Ix) VCC (V) TYP. TYP. MAX. MAX. – 15 3 1.3 8.5 VCC (V) EV (Ix) RL (Ω ) 3 125 3 000 IS489E (Ta = 25°C) Absolute maximum ratings Model No. IS471FE*1, *3 Type Package VCC (V) Built-in pulse driver circuit at the emitter Visible light side, synchronous cut-off epoxy detector circuit, resin amplifier circuit and demodulator circuit –0.5 to +16 Topr (°C) VOL (V) MAX. –25 to +60 0.35 P IO (mW) (mA) 250 50 Electro-optical characteristics*2 tPHL tPLH VOH (V) (µs) (µs) VCC MIN. (V) TYP. TYP. 4.97 400 400 5 RL (Ω ) External disturbing light illuminance EVDX(Ix) TYP. 280 7 000 *1 IS471FE is less susceptible to disturbing effects thanks to the light modulation system *2 Vcc = 5 V *3 Straight lead type (IS471FSE) is also available. IS471FE (Ta = 25°C) Electro-optical characteristics Model No. GA220T2L1IZ Type 2PD, differential type Package Transparent epoxy resin 18-pin Recommended supply voltage VCC (V) VOH (V) MIN. VOL (V) MAX. 4.5 to 5.5 4.9 0.6 H → L delay time variation ∆tPHL (ns) MAX. ±8.5 GA220T2L1IZ 96 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 97 Wednesday, July 18, 2007 1:03 PM OPIC LIGHT DETECTORS ✩New product (Ta = 25°C) Absolute maximum ratings Type Built-in amplification circuit Peak sensitivity characteristic close to human visual sensitivity ✩GA1A2S100SS Output characteristic: Linear current output for illuminance Lead frame (straight) type Built-in amplification circuit Peak sensitivity characteristic close to human visual sensitivity ✩GA1A2S100LY Output characteristic: Linear current output for illuminance Lead frame (L bend) type Built-in amplification circuit Peak sensitivity characteristic close ✩GA1A1S201WP to human visual sensitivity Output characteristic: Logarithmic current output for illuminance GA1A2S100SS Package Output current Recommended Recommended Current Peak Topr supply voltage illuminance consumption sensitivity Io2 Io1 (°C) VCC Icc (µA) wavelength (µA) range (µA) (V) Ex (lx) TYP. λp (nm) TYP. TYP. VCC (V) IO (mA) 7.0 5 –40 to +85 2.7 to 3.6 10 to 10 000 500 555 48 480 (at Ev = (at Ev = 1000 lx) 100 lx) 7.0 5 –40 to +85 2.7 to 3.6 10 to 10 000 500 555 480 48 (at Ev = (at Ev = 1000 lx) 100 lx) 7.0 1 –40 to +85 2.3 to 3.2 3 to 55 000 70 555 20 30 (at Ev = (at Ev = 100 lx) 1000 lx) Transparent epoxy resin (3 × 4 mm) Compact (2.0 mm × 1.6 mm) Leadless GA1A2S100LY GA1A1S201WP Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Optoelectronics Model No. Electro-optical characteristics 97 Device_E.book Page 98 Wednesday, July 18, 2007 1:03 PM OPTO OPIC LIGHT DETECTORS ✩New product (Ta = 25°C) Absolute maximum ratings Model No. IS1682Q GA250T6C3SY GA250T6C4SY Type Package IS1684Q GA210TXV8SY ▲*3 ✩GA230TXW6SY ✩GA230TXR1ZY GA202TXV15K▲ GA202TXV15J GA301TXW5MZ ▲ Topr (°C) Built-in amplifier circuit, built-in RF addition amplifier (6-division PINPD + IC), for ×50 CD-ROM Transparent 10-pin package 6.0 – –30 to +80 14.8 5 (72/70) 72/70 5 –81 23.1M Built-in amplifier circuit, (6-division PINPD + IC), for CD player Low operating voltage (MIN. 2.5 V) Transparent 10-pin package 7.0 – –20 to +75 5 5/0.3 5 (–78) 2.8M Transparent flat 10-pin package 6.0 5.3/3.8*2 3 –90 720k Built-in amplifier circuit, (8-division PINPD + IC), switchable of sensitivity due to playback/ recording mode for MD Built-in RF amplifier, for ×6 DVD-ROM drive IS1623Q Vcc P (V) (mW) Electro-optical characteristics Response frequency Output noise level Icc Vn Main Ch. fc*1 (mA) Vcc Vcc f TYP. (V) (MHz) (V) (dBm) (Hz) TYP. TYP. Transparent flat 10-pin package Transparent flat For 2-wavelength laser (For DVD player), 12-pin package 10-division PD pattern (4 x 5.0 mm) For ×16 DVD-R/RW, +R/W ultra-writable drive Transparent flat High-precision 3-step gain compatible 14-pin package DVD-ROM: for MAX. ×16 read only Transparent flat CD-ROM: for MAX. ×52 read only 14-pin package CD-R: for MAX. ×52 writable drive CD-RW: for MAX. ×32 writable drive Transparent Gull wing lead For 2-wavelength laser (For DVD player), 12-pin 10-division PD pattern package (3 x 4 mm) Flat lead For ×16 DVD-R/RW, +R/W ultra-writable drive For MAX. ×60 CD-R writable drive (For HiHi combo drive), Leadless settling time: 13 ns chip-type DVD-ROM: for MAX. ×16 read only, built-in bypass condenser for power supply, WPP system (Gain ×4 switching) 150 –20 to +70 6 4.2/ 3 4.6*2 6.0 – –30 to +80 14.8 5 (70/60) 70/50 5 –81 23.1M 6.0 – –10 to +70 17 5 –/75 5 –80 23M 6.0 – –30 to +85 – 5 140 5 – – 6.0 – –20 to +85 40 5 140 5 –80 72M 6.0 – –30 to +80 57/57 50/50 5 – – 6.0 – –20 to +85 110 5 (–78) 72M MAX. 5 19 38 5 *1 (RF/main) ... 650 nm, RF/main ... 780 nm *2 Playback/recording mode *3 We can supply custom orders for modified PD patterns, packages, and lead shapes for 2-wavelength laser compatible OPIC light detectors. *4 L gain mode/M gain mode The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. IS1682Q (IS1684Q, GA250T6C3SY, GA250T6C4SY) GA230TXR1ZY 98 IS1623Q GA202TXV15K▲ GA230TXW6SY GA202TXV15J GA210TXV8SY▲ GA301TXW5MZ▲ Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 99 Wednesday, July 18, 2007 1:03 PM OPIC LIGHT DETECTORS (Ta = 25°C) Absolute maximum ratings Model No. GA104T1M1MZ ▲ Type Package For ×48 CD-R writable drive Leadless chip-type built-in amplifier circuit [3.0 x 3.5 mm] Vcc (V) P (mW) Topr (°C) 6.0 – –20 to +70 Electro-optical characteristics Response frequency Icc fc (mA) Vcc Vcc (MHz) TYP. (V) (V) MIN. 20 5 50 5 *1 Power monitoring photodiodes are also available. Please refer to the page for photodiodes. The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. Optoelectronics GA104T1M1MZ▲ Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 99 Device_E.book Page 100 Wednesday, July 18, 2007 1:03 PM OPTO INFRARED EMITTING DIODE INDEX TREE ■ Infrared Emitting Diode Lineup Type Single-end lead Package Epoxy resin with lens (ø3 mm type) (Top view type) Epoxy resin (Arch type) Single-end lead General purpose ±13° High output type ±13° GL380 GL381 High speed signal transmission (12 MHz) ±17° GL382 ±18° GL390 ±18° GL390V General purpose/Narrow beam angle ±13° GL480E00000F Compact and thin ±30° GL4800E0000F Flat epoxy resin Wide beam angle ±90° GL4100E0000F Epoxy resin with lens Compact package, bi-directional emitting type Bidirectional GL453E00000F ▲ TO-18 High reliability ±50° GL513F ▲ High reliability/Narrow beam angle ±7° GL514 ▲ Low forward voltage type ±21° GL560 Low forward voltage type/Narrow beam angle ±13° GL561 High output type ±25° GL537 High output type/Narrow beam angle ±13° GL538 Leadless Compact ±60° GL610T Epoxy resin with lens/ leadless Compact/Narrow beam angle ±10° GL100MN0MP ±10°/±9° GL100MN1MP / GL100MN3MP ±80° GL100MD1MP1 Epoxy resin with lens Epoxy resin with lens (ø5 mm type) High output type (Output: radiant flux/ radiant intensity indicated) (Mountable for Top view/ Side view type) Compact/Wide beam angle The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. 100 Model No. General purpose (Top view type) Surface mount type Half intensity angle Low forward voltage type (Side view type) Single-end lead Features Device_E.book Page 101 Wednesday, July 18, 2007 1:03 PM INFRARED EMITTING DIODES ■ Infrared Emitting Diodes GL380 GL381 GL382 GL390 GL390V Package, features ø3 epoxy resin ø3 epoxy resin, for high speed signal transmission:12 MHz Arch type GL453E00000F ▲ Resin with bidirectional lens GL480E00000F GL4800E0000F GL4100E0000F GL513F ▲ GL514 ▲ Epoxy resin with lens Side-view flat type, Epoxy resin TO-18 Φe (mW) MIN. TYP. IF (mA) TYP. MAX. IF (mA) ∆θ (°) TYP. VF (V) λp (nm) TYP. 60 6 150 –25 to +85 4.5*1 11*1 50 1.3 1.5 50 ±13 950 60 6 150 –25 to +85 8.5*1 20*1 50 1.3 1.5 50 ±13 950 60 4 – –25 to +85 6 18 50 1.5 1.7 50 ±17 880 13*1 60 6 150 –25 to +85 7*1 50 1.3 1.5 50 ±18 950 60 6 150 –25 to +85 9*1 16*1 50 1.3 1.5 50 ±18 950 50 6 75 –25 to +85 0.85 1.3 20 1.2 1.5 20 (Bidirectional) 950 50 6 75 –25 to +85 0.7 – 20 1.2 1.4 20 ±13 950 50 6 75 –25 to +85 0.7 1.6 20 1.2 1.4 20 ±30 950 950 50 6 75 –25 to +85 1.0 – 20 1.2 1.4 20 ±90 150 6 250 –40 to +125 1.44 2.88 100 1.35 1.6 100 ±50 950 150 6 250 –40 to +125 3.31 5.35 100 1.35 1.6 100 ±7 950 GL560 100 6 150 –25 to +85 5*1 14*1 50 1.25 1.37 50 ±21 940 GL561 100 6 150 –25 to +85 12*1 25*1 50 1.25 1.37 50 ±13 940 100 6 150 –25 to +85 6*1 13*1 50 1.3 1.5 50 ±25 950 100 6 150 –25 to +85 15*1 30*1 50 1.3 1.5 50 ±13 950 50 6 150 –25 to +85 0.7 2 20 1.3 1.5 50 ±60 950 50 6 75 –30 to +85 1.0 3.0 (MAX.) 20 1.2 1.4 20 ±10 940 50 6 75 –30 to +85 2.0 6.0 (MAX.) 20 1.2 1.5 20 ±10 940 50 6 75 –30 to +85 3.0*1 6.0*1 20 1.25 1.5 20 ±9 940 50 6 75 –30 to +85 – 6.0 (MAX.) 20 – 1.5 20 ±80 940 GL537 ø5 epoxy resin GL538 GL610T GL100MN0MP GL100MN1MP GL100MN3MP GL100MD1MP1 Leadless chip type Surface mounting leadless type, Epoxy resin board with lens Surface mounting leadless type, Epoxy resin board with lens, high output type Surface mounting leadless type, Epoxy resin board with lens, high output type Surface mounting leadless type, Epoxy resin board with lens, wide beam angle Optoelectronics Model No. (Ta = 25°C) Absolute maximum ratings IF P Topr VR (°C) (mA) (V) (mW) *1 Radiant intensity mW/sr Note) Some products are handled by the Compound Semiconductor Division. The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. GL380 (GL381, GL382) GL513F ▲ GL390 (GL390V) GL514 ▲ GL453E00000F ▲ GL560 (GL561) GL480E00000F GL537 (GL538) GL4800E0000F GL610T GL4100E0000F GL100MN0MP  GL100MN1MP, GL100MN3MP,   GL100MD1MP1  Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 101 Device_E.book Page 102 Wednesday, July 18, 2007 1:03 PM OPTO OPTICAL-ELECTRIC SENSOR INDEX TREE ■ Distance Measuring Sensor Lineup Range of distance measuring Output 1-bit digital output according to distance measuring Features 3 to 30 cm 1-bit digital output (detected distance: 15/17.5/13 cm) 10 to 80 cm 1-bit digital output (detected distance: 24 cm) Model No. GP2D150AJ00F/GP2D150MJ00F/ GP2Y0D413K0F GP2D15J0000F General purpose 20 to 150 cm Output according to distance measuring GP2Y0D21YK0F 1-bit digital output (detected distance: 80 cm) GP2Y0D02YK0F Battery drive compatible, compact, operating supply voltage (2.7 V to 6.2 V), 1-bit digital output (detected distance: 5/10 cm) GP2Y0D805Z0F/GP2Y0D810Z0F Compact, thin 1-bit digital output (detected distance: 10/40 cm) GP2Y0D310K/GP2Y0D340K Battery drive compatible, compact, operating supply voltage (2.7 V to 6.2 V), 1-bit digital output (detected distance: 1.5 cm) Capable of operation at high temperature GP2Y5D91S00F 4 to 30 cm Analog voltage output GP2D120XJ00F/GP2Y0A41SK0F 10 to 80 cm Analog voltage output GP2D12J0000F General purpose GP2Y0A21YK0F 20 to 150 cm Analog voltage output GP2Y0A02YK0F 100 to 550 cm Analog voltage output GP2Y0A710K0F ■ Wide Angle Sensor Lineup Range of distance measuring Output Voltage output according to distance measuring Detection angle of view Model No. 4 to 30 cm 25° (When using 5 beams) GP2Y3A001K0F 20 to 150 cm 25° (When using 5 beams) GP2Y3A002K0F 40 to 300 cm 25° (When using 5 beams) GP2Y3A003K0F ■ High-Precision Displacement Sensor Range of distance measuring Output Voltage output according to distance measuring 4.5 to 6.0 mm Features Model No. Resolution: 50 µm GP2Y0AH01K0F ■ Paper Size Sensor (Using Optical Distance Measuring Method) Lineup Output 8-bit serial output Features Model No. GP2D06J0000F/GP2D061J000F/ GP2D062J000F 1-beam Thin type (T: 11 mm) GP2Y2E101K0F 2-beam GP2D03J0000F/GP2D032J0000F 3-beam GP2D07J0000F/GP2D071J000F/ GP2D072J000F Thin type (T: 11 mm) GP2Y2E301K0F 1-bit output 1-beam (detection height: 60 mm) Thin type (T: 11.5 mm) GP2Y2D160K0F Analog output relative to measuring distance 1-beam (detection height: 80 mm) Thin type (T: 11.5 mm) GP2Y2A180K0F 2-beam (detection height: 80 mm) Thin type (T: 11.5 mm) GP2Y2A280K0F ■ Dust Sensor Unit Lineup Output Analog output Features Model No. With peak-hold circuit GP2U06J0000F Pulse analog output, single-shot detection of house dust, Gener al purpose GP2Y1010AU0F ■ Color Toner Concentration (Deposition Amount) Sensor Lineup Output Analog output 102 Features Model No. Employs diffuse reflection system GP2TC1J0000F Employs diffuse reflection system + mirror reflection system GP2Y40010K0F Device_E.book Page 103 Wednesday, July 18, 2007 1:03 PM OPTICAL SYSTEM DEVICE ✩New product ■ Distance Measuring Sensors (1) (Ta = 25°C) Electro-optical characteristics*1 Distance Dissipation current MeaVOL VOH Topr measuring sured (V) (V) Operating Standby distance (°C) range MIN. MAX. (mA) (µA) (cm) (cm) VO (TYP.) = 0.4 V (at L = 80 cm), –10 to +60 10 to 80 MAX. 50 – – ∆VO (TYP.) = 2.0 V (at L: 80 cm → 10 cm) VO (TYP.) = 0.4 V (at L = 80 cm), –10 to +60 10 to 80 MAX. 40 – – ∆VO (TYP.) = 1.9 V (at L: 80 cm → 10 cm) VO (TYP.) = 0.4 V (at L = 30 cm), –10 to +60 4 to 30 MAX. 50 – – ∆VO (TYP.) = 2.25 V (at L = 30 cm → 4 cm) Model No. Features Vcc (V) GP2D12J0000F Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit, Linear voltage output –0.3 to +7 GP2Y0A21YK0F Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit, Linear voltage output –0.3 to +7 GP2D120XJ00F Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit, Linear voltage output –0.3 to +7 GP2Y0D805Z0F GP2Y0D810Z0F ✩GP2Y5D91S00F GP2Y0D310K GP2Y0D340K GP2D15J0000F GP2Y0D21YK0F GP2Y0A41SK0F Light detector, infrared LED and signal processing circuit, short distance measuring sensor unit, battery drive compatible (operating power supply: 2.7 to 6.2 V) Light detector, infrared LED and signal processing circuit, short distance measuring sensor unit, battery drive compatible (operating power supply: 2.7 to 6.2 V) Light detector, infrared LED and signal processing circuit, short distance measuring sensor unit, battery drive compatible (operating power supply: 2.7 to 6.2 V), Capable of operation at high temperature Digital voltage output according to the measured distance of GP2Y0D340K Compact, thin type (15 x 9.6 x 8.7 mm: sensor part), Light detector, infrared LED and signal processing circuit,Digital voltage output according to the measured distance Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit, Digital voltage output Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit, Digital voltage output Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit, Short measuring cycle (16.5 ms) Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit, Digital voltage output Distance measuring sensor united with PSD ❇, GP2D150MJ00F ▲ infrared LED and signal processing circuit, Digital voltage output Distance measuring sensor united with PSD ❇, GP2Y0D413K0F infrared LED and signal processing circuit, Digital voltage output Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit, GP2Y0D02YK0F long distance measuring sensor unit (No external control signal required), Digital voltage output according to the measured distance GP2D150AJ00F –0.3 to +7 –10 to +60 – Vcc –0.6 0.6 MAX. 6.5 MAX. 8 5 –0.3 to +7 –10 to +60 – Vcc –0.6 0.6 MAX. 6.5 MAX. 8 10 –0.3 to +7 –30 to +105 – Vcc –0.6 0.6 TYP. 7 – 1.5 –0.3 to +7 –10 to +60 – Vcc –0.3 0.6 MAX. 35 – 10 –0.3 to +7 –10 to +60 – Vcc –0.3 0.6 MAX. 35 – 40 –0.3 to +7 –10 to +60 10 to 80 Vcc –0.3 0.6 MAX. 50 – 24 –0.3 to +7 –10 to +60 10 to 80 Vcc –0.3 0.6 MAX. 40 – 24 –0.3 to +7 –10 to +60 4 to 30 VO (TYP.) = 0.4 V (at L = 30 cm), ∆VO (TYP.) = 2.25 V (at L = 30 cm → 4 cm) MAX. 22 – – –0.3 to +7 –10 to +60 3 to 30 Vcc –0.3 0.6 MAX. 50 – – –0.3 to +7 –10 to +60 3 to 30 Vcc –0.3 0.6 MAX. 50 – 17.5 –0.3 to +7 –10 to +60 3 to 30 Vcc –0.3 0.6 – – 13 –0.3 to +7 –10 to +60 20 to 150 Vcc –0.3 0.6 MAX. 50 – 80 *1 Vcc = 5 V The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. Optoelectronics Absolute maximum ratings ❇ PSD: Position Sensitive Detector Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 103 Device_E.book Page 104 Wednesday, July 18, 2007 1:03 PM OPTO OPTICAL SYSTEM DEVICE ✩New product ■ Distance Measuring Sensors (2) (Ta = 25°C) Electro-optical characteristics*1 Distance Dissipation current MeaVOL VOH Topr measuring sured (V) (V) Operating Standby distance (°C) range MIN. MAX. (mA) (µA) (cm) (cm) VO (TYP.) = 0.4 V (at L = 150 cm), MAX. 50 – – –10 to +60 20 to 150 ∆VO (TYP.) = 2.0 V (at L = 150 cm → 20 cm) VO (TYP.) = 2.5 V (at L = 100 cm), TYP. 30 – – –10 to +60 100 to 550 ∆VO (TYP.) = 0.7 V (at L = 100 cm → 200 cm) Absolute maximum ratings Model No. Features Vcc (V) GP2Y0A02YK0F Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit –0.3 to +7 ✩GP2Y0A710K0F Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit –0.3 to +7 ❇ PSD: Position Sensitive Detector *1 Vcc = 5 V GP2Y5D91S00F GP2Y0D805Z0F (GP2Y0D810Z0F) GP2Y0D340K (GP2Y0D310K) GP2D15J0000F  GP2D12J0000F, GP2D120XJ00F,   GP2D150AJ00F, GP2Y0A21YK0F,   GP2Y0D21YK0F, GP2Y0A41SK0F   GP2D150MJ00F, GP2Y0D413K:    without mounting hole GP2Y0D02YK0F (GP2Y0A02YK0F) ■ Wide Angle Sensors (Ta = 25°C) Absolute maximum ratings Model No. Features Vcc (V) Topr (°C) Distance measuring range (cm) Electro-optical characteristics Output Output Input voltage (V) terminal voltage voltage difference LEDL VINH (V) (V) GP2Y3A001K0F Distance measuring sensor united with PSD ❇, infrared LED and signal processing circuit, Distance measuring sensor application product, Wide range (field of view) detection using 5 infrared beams –0.3 to +7 –10 to +60 4 to 30 TYP. 2.8*1 TYP. 1.6*4 MIN. 4.5 MAX. 0.5 –0.3 to +7 –10 to +60 20 to 150 TYP. 2.3*2 TYP. 1.6*5 MIN. 4.5 MAX. 0.5 –0.3 to +7 –10 to +60 40 to 300 TYP. 2.2*3 TYP. 1.2*6 MIN. 4.5 MAX. 0.5 GP2Y3A002K0F GP2Y3A003K0F ❇ PSD: Position Sensitive Detector Reflector used: White paper (Gray chart R-27/white surface, made by Kodak Corp., reflectance 90%) *1 L = 4 cm *4 Change in output voltage from L = 4 cm to 10 cm *2 L = 20 cm *5 Change in output voltage from L = 20 cm to 80 cm *3 L = 40 cm *6 Change in output voltage from L = 40 cm to 100 cm GP2Y3A001K0F 104 GP2Y0A710K0F GP2Y3A002K0F L = Reflector - Sensor distance GP2Y3A003K0F Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 105 Wednesday, July 18, 2007 1:03 PM OPTICAL SYSTEM DEVICE ■ Paper Size Sensors Operating temperature Supply voltage Topr (°C) Vcc (V) 8-bit serial output using optical distance measuring method (2-beam) 0 to +60 5 ±0.5 TYP. 60 TYP. 21 MAX. ±6 0.7 or less*1 TYP. 30 8-bit serial output using optical distance measuring method (1-beam) 0 to +60 5 ±0.5 TYP. 60 – MAX. ±6 0.7 or less*1 TYP. 33 0 to +60 5 ±0.5 TYP. 85 – MAX. ±6 0.7 or less*1 – –10 to +60 5 ±0.5 TYP. 60 – MIN. ±7.5 0.7 or less*1 – 0 to +60 5 ±0.5 TYP. 60 TYP. 36 MAX. ±6 0.7 or less*1 TYP. 33 0 to +60 5 ±0.5 TYP. 85 TYP. 33 MAX. ±6 0.7 or less*1 – –10 to +60 5 ±0.5 TYP. 80 – – – MAX. 25 –10 to +60 5 ±0.5 TYP. 80 – – – MAX. 50 Model No. GP2D03J0000F GP2D032J0000F* 4 GP2D06J0000F GP2D061J000F* 2 GP2D062J000F* 2 GP2Y2E101K0F GP2Y2D160K0F GP2D07J0000F GP2D071J000F* 3 GP2Y2E301K0F GP2Y2A180K0F GP2Y2A280K0F Features Thin type (T: 11 mm) 8-bit serial output using optical distance measuring method (1-beam) Thin type (T: 11.5 mm) using optical distance measuring method (1-beam) Digital output (1-bit) 8-bit serial output using optical distance measuring method (3-beam) Thin type (T: 11 mm) 8-bit serial output using optical distance measuring method (3-beam) Thin type (T: 11.5 mm) Analog output using optical distance measuring method (1-beam) Thin type (T: 11.5 mm) Analog output using optical distance measuring method (2-beam) Approved value of LED beam paper pitch position sliding ∆x Lp (mm) (mm) Paper detection density Dissipation current OD Icc (mA) This table shows the characteristics when configured in the paper size sensor system. Reflectivity: 18% or more, OD = log (1/T), T: Reflectivity Paper detection height GP2D061: TYP. 45 mm GP2D062: TYP. 90 mm Paper detection height GP2D071: TYP. 45 mm Paper detection height GP2D032: TYP. 45 mm GP2D03J0000F (GP2D032J000F) GP2D06J0000F (GP2D061J000F/GP2D062J000F) GP2D07J0000F (GP2D071J000F) GP2Y2E101K0F GP2Y2E301K0F Optoelectronics ❇ *1 *2 *3 *4 (Ta = 25°C) Paper detection height H (mm) GP2Y2D160K0F GP2Y2A180K0F GP2Y2A280K0F Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 105 Device_E.book Page 106 Wednesday, July 18, 2007 1:03 PM OPTO OPTICAL SYSTEM DEVICE ✩New product ■ High-Precision Displacement Sensor Model No. Features GP2Y0AH01K0F Resolution: 50 µm (Ta = 25°C) Topr (°C) Operating supply voltage (V) Dissipation current (mA) Distance measuring range (mm) Distance characteristic of output –10 to +60 4.5 to 5.5 TYP. 20 4.5 to 6.0 TYP. 1.73 V Variation in output over range (4.5 to 6.0 mm) GP2Y0AH01K0F ■ Dust Sensor Units Model No. GP2U06J0000F ▲ GP2Y1010AU0F (Ta = 25°C) Topr (°C) Features Built-in infrared emitting diode, photodiode and signal processing circuit Compact, single-shot detection of house dust Electro-optical characteristics Output voltage Operating Dissipation Detection at no dust supply voltage current sensitivity 3 Voc (V) (V) (mA) V/(0.1 mg/m ) Output voltage range VOH (V) –10 to +65 4.5 to 5.5 TYP. 15 TYP. 0.5 MAX. 1 MIN. 3.2 –10 to +65 4.5 to 5.5 TYP. 11 TYP. 0.5 TYP. 0.9 MIN. 3.4 The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. GP2U06J0000F GP2Y1010AU0F ■ Color Toner Concentration (Deposition Amount) Sensors Model No. Features Employs diffuse reflection system, high-precision detection of toner concentration on photo-sensitive drum, 2-line analog output Employs diffuse reflection system + mirror reflection system, ✩GP2Y40010K0F high-precision detection of toner concentration on transfer belt, 2-line analog output GP2TC1J0000F Topr (°C) (Ta = 25°C) Electro-optical characteristics Dissipation current Output voltage Output voltage (mA) V01 (V) V02 (V) 0 to +60 TYP. 4*1 TYP. 1.06*2 TYP. 2.63*2 0 to +60 MAX. 10 MAX. 1.61 MAX. 3.5 *1 Dissipation current with LED drive current of I F = 0 mA *2 With reflection object A (Reflectance: 15.6%) GP2TC1J0000F 106 GP2Y40010K0F Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 107 Wednesday, July 18, 2007 1:03 PM OPTO FIBER OPTICS INDEX TREE ■ Fiber Optics Lineup for Audio Equipment Model No. Square connector Type Features Fiber optic transmitter Supply voltage 2.5 V Supply voltage 3.0 V Supply voltage 5.0 V GP1FM513TZ0F/ GP1FM55HTZ0F** Compact (without mounting hole) High speed signal transmission (13.2 Mb/s MAX., 15.5 Mb/s MAX.*, 50 Mb/s MAX.**), With shutter – GP1FM313TZ0F*/ GP1FMV31TK0F* with mounting hole High speed signal transmission (13.2 Mb/s MAX. [15.5 Mb/s MAX.*, 25 Mb/s MAX.**, 50 Mb/s MAX.***]) – GP1FAV30TK0F* (EIAJ RC-5720B) TTL drive compatible With shutter – GP1FAV31TK0F* Vertical mounting type GP1FSV31TK0F TTL drive compatible Vertical mounting type GP1FSV51TK0F High speed signal transmission Electric jack integrated type (Transmission speed 13.2 Mb/s) Fiber optic receiver (JIS C6560 & EIAJ RC5720B) Fiber optic transmitter – – – GP1FAV51TK0F – GP1FAV55TK0F*** GP1FP513TK0F Compact (without mounting hole) – GP1FMV31RK0F* GP1FMV51RK0F with mounting hole High speed signal transmission (13.2 Mb/s MAX. [15.5 Mb/s MAX.*, 25 Mb/s MAX.**]) – GP1FAV30RK0F* GP1FAV50RK0F With shutter – GP1FAV31RK0F* GP1FAV51RK0F With shutter – – GP1FP513RK0F GP1FD210TP0F GP1FD310TP0F/ GP1FD320TP0F – GP1FD210RP0F – – GP1FA51HRZ0F** Thin type (t: 4.2 mm) Fiber optic receiver – GP1FAV50TK0F High speed signal transmission (13.2 Mb/s MAX., 15.5 Mb/s MAX.*), With shutter Electric jack integrated type (Transmission speed 13.2 Mb/s) ø3.5 mm Optical mini-jack With shutter – Thin type (t: 4.2 mm) Optoelectronics Connector type Low operating voltage ■ Transmission/Reception Devices for MOST*1 Compatible Optical Fiber Connector type MOST ver1.1 standard compatible Type Features Transmission speed Operating voltage Model No. Optic transmission device Wide operating temperature range (–40°C to +105°C) 25Mb/s as optic fiber link (Biphase) 5V GP5FM5T01AZ Optic reception device Wide operating temperature range (–40°C to +105°C) 25Mb/s as optic fiber link (Biphase) 5V GP5FM5R01AZ *1 “MOST” is a registered trademark of MOST Cooperation. 107 Device_E.book Page 108 Wednesday, July 18, 2007 1:03 PM OPTO FIBER OPTICS ✩New product ■ Fiber Optic Transmitters (Square Connector) (Ta = 25°C) Absolute maximum ratings Model No. GP1FM313TZ0F GP1FMV31TK0F GP1FM513TZ0F GP1FMV51TK0F GP1FM55HTZ0F GP1FAV30TK0F GP1FAV50TK0F GP1FAV51TK0F ✩GP1FSV51TK0F GP1FAV31TK0F ✩GP1FSV31TK0F GP1FAV55TK0F GP1FP513TK0F Features Vcc (V) Compact (without mounting hole), With shutter, High response speed (up to x2) Compact (without mounting hole), With shutter, High response speed (up to x2) Compact (without mounting hole), With shutter, High response speed (up to x2) Compact (without mounting hole), With shutter, High response speed (up to x2) Compact (without mounting hole), With shutter, High response speed (up to x2) With mounting hole, Low voltage drive, High response speed (up to x2) With mounting hole, Mass-market model, High response speed (up to x2), TTL drive compatible With mounting hole, Mass-market model, High response speed, With shutter, TTL drive compatible With mounting hole, Vertical mounting, With shutter, Low voltage drive, High response speed With mounting hole, With shutter, Low voltage drive, High response speed With mounting hole, Vertical mounting, With shutter, Low voltage drive, High response speed With mounting hole, High response speed (50 Mb/s), With shutter Electric jack/optical connector integrated type Vin (V) Supply voltage (V) Topr (°C) Electro-optical characteristics Propagation Dissipation Pulse Transmisdelay time width sion speed current T Icc distortion tPLH tPHL ∆tw (Mb/s) (mA) (ns) (ns) (ns) MAX. MAX. MAX. MAX. –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 2.7 to 3.6 180 180 12 ±15 15.5 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 2.7 to 5.25 180 180 12 ±15 15.5 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 4.75 to 5.25 180 180 13 ±15 13.2 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 4.75 to 5.25 180 180 13 ±15 13.2 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 4.75 to 5.25 180 180 13 ±15 50 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 2.7 to 5.25 180 180 12 ±15 15.5 4.75 to 5.25 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 Input voltage: 180 MIN. 2.0 V 180 13 ±15 13.2 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 4.75 to 5.25 180 180 13 ±15 13.2 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 4.75 to 5.25 180 180 13 ±15 13.2 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 2.7 to 5.25 180 180 12 ±15 15.5 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 2.7 to 5.25 180 180 13 ±15 15.5 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 4.75 to 5.25 180 180 13 ±15 50 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 4.75 to 5.25 180 180 13 ±15 13.2 ■ Fiber Optic Transmitters (ø3.5 mm Optical Mini-jack) (Ta = 25°C) Absolute maximum ratings Model No. GP1FD210TP0F GP1FD310TP0F GP1FD320TP0F 108 Features Vcc (V) Compact, Thin type (t: 4.2 mm), Optical mini-jack (low voltage type) Compact, Thin type (t: 4.2 mm), Optical mini-jack (low voltage type) Compact, Thin type (t: 4.2 mm), Optical mini-jack (low voltage type) Vin (V) Topr (°C) Supply voltage (V) Electro-optical characteristics Propagation Dissipation Pulse Transmisdelay time width sion speed current Icc distortion T tPLH tPHL (mA) ∆tw (Mb/s) (ns) (ns) (ns) MAX. MAX. MAX. MAX. –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 2.2 to 3.0 180 180 10 ±30 8 –0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 2.7 to 3.6 180 180 12 ±30 8 – – 12 – 25 – – –20 to +70 2.3 to 5.5 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 109 Wednesday, July 18, 2007 1:03 PM FIBER OPTICS ■ Fiber Optic Receivers (Square Connector) (Ta = 25°C) Absolute maximum ratings GP1FMV31RK0F GP1FMV51RK0F GP1FAV30RK0F GP1FAV50RK0F GP1FAV51RK0F GP1FAV31RK0F GP1FA51HRZ0F GP1FP513RK0F Features Vcc (V) Compact (without mounting hole), With shutter, High response speed (up to x2) Compact (without mounting hole), With shutter, High response speed (up to x2) With mounting hole, Low voltage drive, High response speed With mounting hole, Mass-market model, High response speed (up to x2) Topr (°C) IOL (mA) –0.5 to +7 10 –20 to +70 High response speed (up to x2), with shutter 180 180 15 ±20 15.5 –0.5 to +7 10 –20 to +70 4.75 to 5.25 180 180 25 ±20 13.2 –0.5 to +7 10 –20 to +70 180 180 15 ±20 15.5 –0.5 to +7 10 –20 to +70 4.75 to 5.25 180 180 25 ±20 13.2 –0.5 to +7 10 –20 to +70 4.75 to 5.25 180 180 25 ±20 13.2 – – 15 – 15.5 – – 15 – 25 180 25 ±20 13.2 With mounting hole, With shutter, Low voltage drive, High response speed (up to x2) With mounting hole, High response speed (up to x4), with shutter Electric jack/optical connector integrated type Supply voltage (V) 2.7 to 3.6 2.7 to 3.6 – – –20 to +70 2.7 to 3.6 – – –20 to +70 4.75 to 5.25 –0.5 to +7 10 –20 to +70 4.75 to 5.25 180 ■ Fiber Optic Receivers (ø3.5 mm Optical Mini-jack) (Ta = 25°C) Absolute maximum ratings Model No. Jack GP1FD210RP0F ø3.5 Features Thin (thickness: 4.2 mm), optical mini-jack (low voltage drive) GP1FM313 series (GP1FM513 series) GP1FSV31TK0F (GP1FSV51TK0F) Vcc (V) IOL (mA) –0.5 to +7 4 Topr (°C) GP1FAV51TK0F Supply voltage (V) –20 to +70 2.4 to 3.0 GP1FMV31 series (GP1FMV51 series)  GP1FAV31TK0F,   GP1FAV55TK0F,   GP1FAV51RK0F,   GP1FAV31RK0F  Electro-optical characteristics Propagation Dissipation Pulse Transmisdelay time width sion speed current T Icc distortion tPLH tPHL ∆tw (Mb/s) (mA) (ns) (ns) (ns) MAX. MAX. MAX. MAX. GP1FP513TK0F (GP1FP513RK0F) 180 180 7.5 ±30 Optoelectronics Model No. Electro-optical characteristics Propagation Dissipation Pulse Transmisdelay time current width sion speed T Icc distortion tPLH tPHL ∆tw (Mb/s) (mA) (ns) (ns) (ns) MAX. MAX. MAX. MAX. 8 GP1FAV50TK0F  GP1FAV50RK0F,   GP1FAV30TK0F,   GP1FAV30RK0F  GP1FD210TP0F  GP1FD210RP0F,   GP1FD310TP0F,   GP1FD320TP0F  Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 109 Device_E.book Page 110 Wednesday, July 18, 2007 1:03 PM OPTO FIBER OPTICS ■ Optical Transmission Device Model No. GP5FM5T01AZ Features • MOST standard compatible • Wide operating temperature range Operating temperature (°C) Optic output (dBm) Operating voltage (V) –40 to +105 –9 to –1.5 4.75 to 5.25 Operating temperature (°C) Optic output (dBm) Operating voltage (V) –40 to +105 –24 to –2 4.75 to 5.25 Transmission speed T (Mb/s) 25 (Biphase) GP5FM5T01AZ ■ Optical Reception Device Model No. GP5FM5R01AZ Features • MOST standard compatible • Wide operating temperature range Transmission speed T (Mb/s) 25 (Biphase) GP5FM5R01AZ 110 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 111 Wednesday, July 18, 2007 1:03 PM LED HIGH-LUMINOSITY LED LAMPS ■ High-Luminosity (AIGaInP) LED Series (Ta = 25°C) Radiation color Green Yellow-green Amber Sunset orange Orange Red Series Dominant emission wavelength (nm) Radiation material ZG, JG ZE, JE ZV, JV, YV ZS, JS, YS ZJ, JJ, YJ ZR, JR JU (560) (572) (588) (605) (618) (630) (638) AlGaInP on GaAs ■ High-Luminosity (InGaN) LED Series ■ White Type LED Series (Ta = 25°C) Radiation color Blue Green Series Dominant emission wavelength (nm) Radiation material BC GC (470) (Ta = 25°C) Radiation color Series Color range (x, y) Radiation material (525) InGaN ■ Pastel Color LED Series Radiation color Light blue Series Color range (x, y) BW (0.31, 0.31) InGaN + Fluorescent powder (Ta = 25°C) Lemon yellow Purple CA CY CV (0.17, 0.20) (0.42, 0.48) (0.35, 0.15) Radiation material White InGaN + Fluorescent powder ■ LED Series (Ta = 25°C) HS, S HD, D HA, A 555 565 565 585 610 635 650 660 GaP GaP GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP Green Series Peak emission wavelength (nm) KG, K Yellow Sunset orange Red Red Red (Highluminosity) UR, U PR, P 660 695 GaAlAs on GaAlAs on GaAs GaAlAs Single hetero Double hetero Red LED HY, H Red (Highluminosity) TR, T Radiation color Radiation material Yellow-green Yellow-green (Highluminosity) EG, E, C* FG, F GaP * C is the opposite polarity of EG’s. ■ High-Luminosity (AlGaInP) LED Lamps (IF = 20 mA, Ta = 25°C) High-luminosity 85 400 GL3ZS402B0SE GL3ZV802B0SE 200 ● GL3JV404B0SE ● GL3JV804B0SE ● ● ● Cylinder ø3 GL3ZV402B0SE Model No. 400 GL3ZJ402B0SE 400 GL3ZS802B0SE 210 GL3ZJ802B0SE 230 280 GL3JS404B0SE 280 GL3JJ404B0SE 200 110 GL3JS804B0SE 120 GL3JJ804B0SE 100 GL3JE402B0SE 200 Model No. GL3ZR402B0SE 250 GL3JR402B0S3 200 GL3ZR802B0SE 150 ● GL5ZV152B0SE 2 700 GL5ZS152B0SE 3 000 GL5ZJ152B0SE 3 000 GL5ZR152B0SE 2 000 ● GL5ZV302B0SE 900 GL5ZS302B0SE 1 000 GL5ZJ302B0SE 900 GL5ZR302B0SE 600 ● GL5JV302B0SE 640 GL5JS302B0SE 680 GL5JJ302B0SE 570 ø10 ● GL0ZV042B0S 16 900 GL0ZS042B0S 22 600 GL0ZJ042B0S 18 500 Long: 5.8 Short: 4.6 ● GL6ZV27 ● GL5JV7D2D0SE 210 ø5 Oval Model No. ZR, JR, JU (Red) Luminous intensity (mcd) TYP. Model No. Model No. ZJ, JJ (Orange) Luminous intensity (mcd) TYP. GL3JG402B0SE JS, ZS (Sunset orange) Luminous intensity (mcd) TYP. Model No. JV, ZV (Amber) Luminous intensity (mcd) TYP. JE, ZE (Yellow-green) Luminous intensity (mcd) TYP. JG, ZG (Green) Luminous intensity (mcd) TYP. Radiation shape (mm) Colored diffusion Colored transparency Colorless transparency Milky diffusion Appearance Resin type 750 GL6ZS27 850 GL5JS7D2D0SE 230 GL6ZJ27 750 GL5JJ7D2D0SE 190 GL6ZR27 360 Taped model is also available. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 111 Device_E.book Page 112 Wednesday, July 18, 2007 1:03 PM LED HIGH-LUMINOSITY LED LAMPS ✩New product ■ High-Luminosity LED Lamps ● ● ● ø3 ● GL3BC302B0S2 900 GL3B2402B0SC 650 GL3TR8 60 GL3UR8 GL3TR44 110 GL3UR44 250 GL3TR43 20 GL3UR43 100 GL3UR402B0S 350 ● ● GL3G2402B0SC ● Cylinder GL5TR8 80 ● ● Rectangle 850 GL5UR2K 2 000 GL5UR3K 3 000 2 000 ● GL5UR3K1 3 000 ● GL6UR11T*1 300 ● GL6UR31 950 GL6UR26T*1 400 GL8UR21 16 GL5TR43 500 ● 2.0 × 5.0 ● GL8TR21 4 1.8 × 3.9 ● GL8TR42 4 *1 With tie-bar Taped model is also available. GL3UR8 GL3UR43 GL3MM402B0SM series GL3ZS802B0S series GL3JV404B0SE series GL5UR2K GL5UR3K GL5UR2K1 GL5UR3K1 GL5ZR302B0SE series GL5JV302B0SE series GL6UR11T GL6UR26T GL6ZR27 series GL5JV7D2D0SE series 112 GL5UR44 GL5UR2K1 ● Long: 5.8 Short: 4.6 Oval 300 2 800 ● ø5 Model No. Luminous intensity (mcd) TYP. Model No. UR, U (Red) Luminous intensity (mcd) TYP. Model No. TR, T (Red) Luminous intensity (mcd) TYP. Model No. GC (Green) Luminous intensity (mcd) TYP. BC (Blue) Milky diffusion Radiation shape (mm) Colored diffusion Colored transparency Colorless transparency Resin type Appearance (IF = 20 mA, Ta = 25°C) High-luminosity GL6UR31 GL0ZV042B0S series GL8TR21 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 113 Wednesday, July 18, 2007 1:03 PM LED LAMPS ■ LED Lamps ● HD PR Sunset orange Red Red (555 nm) GL3KG8 30 GL3EG8 ● ● Cylinder 40 GL3PR8 8 GL3HY44 100 GL3HS44 100 GL3HD44 110 GL3PR44 12 GL3HY43 25 GL3HS43 25 GL3HD43 25 GL3PR43 3 ● GL3KG62 22 GL3EG62 65 GL3HY62 40 GL3HS62 40 GL3HD62 50 GL3KG63 6 18 GL3HY63 16 GL3HS63 15 GL3HD63 17 GL3PR63 GL3EG63 LT3E31W*2 18 LT3E65W*2 25 ● 3 110 GL4HS8 80 GL4HD8 15 GL5HD4 25 GL5PR4 3 150 GL5HY8 120 GL5HS8 80 GL5HD8 80 GL5PR8 15 70 GL5EG41 160 GL5HY41 100 GL5HS41 100 GL5HD41 150 GL5PR41 15 70 GL5EG44 160 GL5HY44 100 GL5HS44 100 GL5HD44 100 GL5PR44 15 100 GL5EG4 20 GL5KG8 60 GL5EG8 GL5KG41 GL5KG44 GL5EG261B0SB 150 GL5EG40 ● GL5KG43 120 GL5EG43 ● GL5EG60 ● 250 300 GL5FG43 15 ● GL6EG26T*3 140 ● GL2EG6 15 2.5 × 5.0 ● GL8EG2 30 GL8EG4 50 ● GL8KG42 2.0 × 3.2 ● 1.5 GL8EG42 15 35 250 GL5HS40 200 GL5HD40 250 GL5PR40 600 GL5HY43 250 GL5HS43 250 GL5HD43 300 GL5HS47 GL2HY6 6 12 GL5HD60 8 GL5HD47 8 GL2HD6 12 GL2PR6 GL8HD2 30 GL8HD4 40 5 GL8HY42 6 GL8HD42 5 GL8EG5 28 GL8HY5 25 GL8HD5 22 9 GL8EG25 12 GL8HY25 12 GL8HS25 10 GL8HD25 GL8KG29 5 GL8EG29 12 GL8HY29 10 GL8HS29 7 GL8EG23 6 GL8HY23 8 ● GL8KG21 4 GL8EG21 8 GL8HY21 8 ● GL8KG26 4 GL8EG26 8 GL8HY26 8 Square 5.0 × 5.0 ● GL8KG22 3.5 GL8EG22 6 GL8HY22 5 Triangle 80 GL5PR261B0SB GL5HY40 GL8KG25 2.0 × 4.5 ● 2.0 × 5.0 110 GL4PR8 GL6EG11T*3 120 GL5EG47 ● GL5HD261B0SB 23 ● 1.9 × 3.9 2 LT3D31W*2 15 LT3P31W*2 1.5 LT3H65W*2 25 LT3S65W*2 25 LT3D65W*2 25 LT3P65W*2 30 GL4EG8 ● 1.8 × 3.9 ● LT3H31W*2 15 GL4HY8 GL4KG8 ● ø5 Rectangle 60 GL3HD8 38 ● 2.0 × 3.2 ● 55 GL3HS8 130 ● 2.0 × 3.1 GL3HY8 20 GL3EG43 ● Arch (695 nm) 60 GL3EG44 ● ø2 (635 nm) GL3KG43 ● Convex 130 (610 nm) GL3KG44 ● ø5 (Inverted cone) Long: 5.8 Oval Short: 4.6 60 GL3EG41 (585 nm) ● ● ø4 (565 nm) Isosceles ● triangle *1 PR series (Red): I F = 5 mA (GL8PR25, GL8PR29: IF = 10 mA) *2 Taped model *3 With tie-bar HL: High-luminosity GL8HS21 GL8HS22 8 5 LED ø3 (565 nm) Luminous intensity (mcd) TYP. HS Yellow Luminous intensity (mcd) TYP. HY Yellow-green (HL) Luminous intensity (mcd) TYP. FG Yellow-green Luminous intensity (mcd) TYP. EG Green Luminous intensity (mcd) TYP. KG Luminous intensity (mcd) TYP. Milky diffusion Colorless transparency Colored transparency Radiation shape (mm) Colored diffusion Appearance Resin type Luminous intensity (mcd) TYP. (I F = 20 mA*1, Ta = 25°C) 1.5 GL8PR42 0.7 12 GL8PR25 1.5 GL8PR29 3 0.7 GL8HD23 6 GL8HD21 8 GL8PR21 GL8HD26 8 GL8PR26 0.7 GL8HD22 8 GL8PR22 1.2 GL8PR28 0.9 Taped model is also available. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 113 Device_E.book Page 114 Wednesday, July 18, 2007 1:03 PM LED LED LAMPS Cylinder GL3PR8 series GL3PR44 series GL3HY43 series GL3KG62 series LT3E31W series GL3PR63 series LT3E65W series GL4PR8 series GL5PR4 series GL5HS8 series GL5KG41 series GL5PR44 series GL5EG40 series GL5HY43 series GL5EG60 series GL6EG11T Oval Convex GL6EG26T GL5HD47 series Arch GL2HY6 GL8EG2 series GL8HD4 series GL8HS21 series GL8HY26 series Rectangle GL8KG42 series GL8KG25 series Square GL8HD22 series 114 GL8HY29 series GL8HD23 series Triangle GL8PR28 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 115 Wednesday, July 18, 2007 1:03 PM DICHROMATIC LED LAMPS Cylinder ● GL5EJJ502C0X* 2 110/170 ø5 E H H P Yellow+ Yellow green Yellow + Red ● GL5EP5 GL5CU44 100/240 GL6CU7 120/250 40/9 ● ● GL3ED8 20/15 GL5ED5 40/25 GL5ED44 80/50 GL5ED60 11/8 1.9 × 3.9 ● GL8ED5 10/6.5 2.0 × 5.0 ● GL9ED2 8/3 5.0 × 5.0 ● GL9ED4 7/4 ❇ CU series: Common anode pin connection GL5EJJ502C0X GL5ED5 series GL5HP5 GL9EH2 6/2 15/9 GL8HP5 3/1.5 GL9HP2 1/0.8 *2 Taped model HL: High-luminosity GL5ED44 series GL5ED60 series LED GL3ED8 *1 P (Red) and H (yellow): I F = 10 mA Luminous intensity (mcd) TYP. E D Yellow+ Red green Luminous intensity (mcd) TYP. E P Yellow+ Red green Luminous intensity (mcd) TYP. Yellow- Red + green (HL) Luminous intensity (mcd) TYP. Yellow- Orange + green (HL) Luminous intensity (mcd) TYP. C U ● ø3 Rectangle ❇ E JJ Milky diffusion Colorless transparency Colored transparency Radiation shape (mm) Colored diffusion Appearance Resin type (I F = 20 mA*1, Ta = 25°C) (The values in luminous intensity are radiation color order) Luminous intensity (mcd) TYP. ■ Dichromatic LED Lamps GL6CU7 GL8HP5 series GL9ED2 series GL9ED4 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 115 Device_E.book Page 116 Wednesday, July 18, 2007 1:03 PM LED HIGH-LUMINOSITY CHIP LEDs ✩New product ★Under development ■ High-Luminosity (AlGaInP) Chip LEDs (Taped Models Only) 1.6 × 0.8 (T: 0.55) ● GM1JE55200AE*1 2.0 × 1.25 (T: 0.8) 3.2 × 2.8 (T: 1.9) 6.0 × 5.0 (T: 2.5) 6.0 × 5.0 (T: 2.3) (board insertion type) 2.8 × 1.2 (T: 0.8) (Side emitting) 5.0 × 5.0 (T: 1.5) GM1JV35200AE*1 18.8 GM1JS35200AE*1 GM1JV55200AE*1 16.8 GM1JS55200AE*1 75 GM1ZS80300AE ZR JR Orange 19 GM1JJ35200AE*1 19 20.9 GM1JJ55200AE*1 19 75 GM1ZJ80300AE GM1JR35200AE*1 13 75 GM1ZR80300AE 55 GM1ZR40300AE 55 ● GM1ZV80300AE ● LT1JV67A*1 ● GM1ZV40300AE 60 GM1ZS40300AE 78 GM1ZJ40300AE 60 ● GM1JV40300AE 11 GM1JS40300AE 12 GM1JJ40300AE 9.5 16.5 LT1JS67A*1 Red Luminous intensity (mcd) TYP. 13 GM1JE35200AE*1 Sunset orange Amber ZJ JJ SJ Luminous intensity (mcd) TYP. 13 ● ZS JS Luminous intensity (mcd) TYP. Yellow-green 1.6 × 0.8 (T: 0.35) 1.6 × 0.8 (T: 0.8) ZV JV Luminous intensity (mcd) TYP. JE SE Luminous intensity (mcd) TYP. Milky diffusion Colorless transparency Colored transparency Outline dimensions (mm) Colored diffusion Resin type (I F = 20 mA, Ta = 25°C*3) 14.1 ● ★GM5ZV96270A 600 ★GM5ZR96270A 600 ● ✩GM5ZV96260AE 320 ✩GM5ZR96260AE 300 ● GM5ZV01200A*2 500 GM5ZR01200A*2 400 ● GM5SE01200A*2 GM5ZS01200A*2 GM5ZJ01200A*2 500 GM5SJ01250AL 1 050 GM5ZJ03200Z*2 500 GM5ZR03200Z*2 400 (150) ✩GM4ZJ83200AE (150) GM4ZR83200AE (90) GM5ZR05240A 3 000 700 400 ● GM5ZV03200Z*2 ● ✩GM4ZV83200AE 500 GM5ZS03200Z*2 (100) ✩GM4ZS83200AE 700 ● *1 LT1JS67A, LT1JV67A, GM1JV55200AE series, GM1JV35200AE series, GM1JV40300AE series: I F = 5 mA *2 GM5ZR01200A series, GM5ZR03200Z series: IF = 60 mA *3 GM5ZV96260AE series, GM5ZV96270A series, GM5ZV01200A series, GM5ZV03200Z series: Tc= 25°C ■ High-Luminosity (InGaN) Chip LEDs (Taped Models Only) 1.6 × 0.8 (T: 0.35) 1.6 × 0.8 (T: 0.55) 3.2 × 2.8 (T: 1.9) 6.0 × 5.0 (T: 2.5) 6.0 × 5.0 (T: 2.3) board insertion type 2.8 × 1.2 (T: 0.8) Side emitting 5.0 × 5.0 (T: 1.5) *1 *2 *3 *4 *5 116 Milky diffusion Colorless transparency Colored transparency Outline dimensions (mm) Colored diffusion Resin type ● (I F = 10 mA, Ta = 25°C*5) BC GC Blue Green Luminous intensity (mcd) TYP. Luminous intensity (mcd) TYP. GM1BC35370AC*1 23 ● ✩GM1BC55255AC*1 23 ✩GM1GC55310AC*4 ● ★GM5BC96270A* 2 500 ★GM5GC96270A ● ✩GM5BC96260AC*2 300 ✩GM5GC96260AC*2 700 ● ✩GM5BC01250AC*3 400 ✩GM5GC01250AC*3 1 200 ● ✩GM5BC03210Z* 3 400 ✩GM5GC03210Z* 3 1 200 ● ★GM4BC83200AC*2 (150) ★GM4GC83200AC*2 (300) ● ★GM5BC05240AC*2 2 000 ★GM5GC05240AC*2 4 000 100 1 300 GM1BC35370AC, GM1BC55255AC: IF = 5 mA GM5BC96260AC series, GM5BC96270A series, GM4BC83200AC series, GM5BC05240AC series: I F = 20 mA GM5BC01250AC series, GM5BC03210Z series: I F = 50 mA GM1GC55310AC: IF = 10 mA GM5BC96260AC series, GM5BC96270A series, GM5BC01250AC series, GM5BC03210Z series: Tc= 25°C Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 117 Wednesday, July 18, 2007 1:03 PM CHIP LEDs ■ Chip LEDs (Taped Models Only) 3.8 ● LT1K40A 5 ● ● ● ● GM1HY55200A 11.5 23 LT1H67A 8.3 19 18.1 LT1H40A 10.8 U UR D HD Sunset orange GM1HS55200A LT1S67A LT1S40A 11.4 6.9 9.4 ● Red GM1HD55200A LT1D67A LT1D40A GM5HD95200A P Red (HL) Luminous intensity (mcd) TYP. Milky diffusion S HS Luminous intensity (mcd) TYP. 1.6 × 0.8 (T: 0.55) 1.6 × 0.8 (T: 0.8) 2.0 × 1.25 (T: 0.8) 3.2 × 2.8 (T: 1.9) Colorless transparency 12.5 8.8 11.9 13.8 GM1UR55200A LT1U67A LT1U40A GM5UR95200A 29.7 29.7 35.6 80 Red LT1P67A LT1P40A *1 P (Red) series: IF = 5 mA HL: High-luminosity LT1D67A series LT1JS67A series GM1ZV80300AE series GM1EG55200A series GM1JV55200AE series GM1BC55255AC series GM4ZV83200AE series GM4BC83200AC series LT1E40A series GM1JV40300AE series GM1ZV40300AE series GM5ZR05240A GM5BC05240AC series GM5ZR01200A series GM5BC01250AC series GM1JV35200AE series GM1EG35200A GM1BC35370AC GM5EG95200A series GM5ZV96260AE series, GM5BC96260AC series GM5BC96270A series GM5ZV03200Z series GM5BC03210Z series Taped model ■ High-Luminosity Dichromatic Type Chip LEDs (Taped Models Only) 6.0 × 5.0 (T: 2.5) ● Milky diffusion Colorless transparency Colored transparency Colored diffusion Resin type Outline dimensions (mm) 1.3 1.3 (I F = 40 mA, Tc = 25°C) BC GC BC ZR GC ZR Blue + Green Blue + Red Green + Red Luminous intensity (mcd) TYP. GM5BG01210A 300/860 LED Outline dimensions (mm) Colored transparency Colored diffusion Resin type 19 19 Luminous intensity (mcd) TYP. 2.0 × 1.25 (T: 0.8) 3.2 × 2.8 (T: 1.9) Yellow Luminous intensity (mcd) TYP. LT1K67A Luminous intensity (mcd) TYP. ● GM1EG35200A GM1EG55200A LT1E67A LT1F67A LT1F67AF LT1E40A GM5EG95200A Milky diffusion Yellow-green Green ● ● 1.6 × 0.8 (T: 0.8) H HY E FEG Luminous intensity (mcd) TYP. K Luminous intensity (mcd) TYP. 1.6 × 0.8 (T: 0.35) 1.6 × 0.8 (T: 0.55) Colorless transparency Outline dimensions (mm) Colored transparency Colored diffusion Resin type (IF = 20 mA*1, Ta = 25°C) Luminous intensity (mcd) TYP. GM5ZRB01210A 300/580 Luminous intensity (mcd) TYP. GM5ZRG01210A 860/580 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 117 Device_E.book Page 118 Wednesday, July 18, 2007 1:03 PM LED CHIP LEDs ✩New product ★Under development ■ Dichromatic Type Chip LEDs (Taped Models Only) (I F = 20 mA, Ta = 25°C) 1.6 × 1.6 (T: 0.8) E H Milky diffusion Colorless transparency Colored diffusion Outline dimensions (mm) Colored transparency Resin type Yellow-green + Yellow Luminous intensity (mcd) TYP. ● GM5BG01210A series E D LT1EH67A Yellow-green + Red Luminous intensity (mcd) TYP. 19/8.3 LT1ED67A 19/8.3 Color coordinates (x, y) Radiation color 2.8 × 1.2 (T: 0.8) Side view type (0.30, 0.29) White (Ta = 25°C*4) White (0.30, 0.29) White 3.85 × 1.0 (T: 0.5) Side view type (0.30, 0.29) White GM4BW83380A* 1 1 700 ✩GM4BW83390A* 1 1 900 GM4BW63360A* 1 1 550 ✩GM4BW63370A* 1 1 800 ★GM5BW53340A* 1 1 800 ✩GM5BW96320A* 1 1 400 ★GM5BW96370A* 1 2 000 3.2 × 2.8 (T: 1.9) (0.31, 0.31) White 3.2 × 2.8 (T: 1.4) (0.31, 0.31) White ✩GM5BW94320A* 1 3 800 5.0 × 5.0 (T: 1.5) (0.31, 0.31) White GM5BW05340A* 1 10 000 5.0 × 5.0 (T: 1.6) (0.31, 0.31) White ★GM5BW05343A* 2 20 000 White GM5BW01300A* 2 4 200 GM5BW01301A* 3 1 800 ★GM5BW01311A* 3 3 300 (0.31, 0.31) (0.31, 0.31) White GM5BW83380 series, GM4BW63360A series, GM4BW53340A, GM5BW96320A, GM5BW96370A, GM5BW94320A, GM5BW05340A: I F = 20 mA GM5BW05343A, GM5BW01300A: IF = 35 mA/chip GM5BW01301A series: IF = 40 mA GM5BW96320A, GM5BW96370A, GM5BW01300A, GM5BW01301A series: Tc = 25°C ■ Pastel Color Chip LEDs (Taped Models Only) 3.2 × 2.8 (T: 0.9) (I F = 20 mA, Tc = 25°C) CA Outline dimensions (mm) 118 3.8/6.9 Luminous intensity (mcd) TYP. 3.85 × 1.2 (T: 0.6) Side view type 6.0 × 5.0 (T: 2.5) 4-terminal leadless LT1KS67A BW Outline dimensions (mm) 6.0 × 5.0 (T: 1.5) 6-terminal leadless Green + Sunset orange Luminous intensity (mcd) TYP. LT1ED67A series ■ High-Luminosity White Type Chip LEDs (Taped Models Only) *1 *2 *3 *4 K S CY Light blue Color Luminous coodinates intensity (x, y) (mcd) TYP. ✩GM5CA96320A (0.17, 0.20) 1 000 CV Lemon yellow Color Luminous coodinates intensity (x, y) (mcd) TYP. ★GM5CY96320A (0.42, 0.48) 1 500 Purple Color Luminous coodinates intensity (x, y) (mcd) TYP. ★GM5CV96320A (0.35, 0.15) 500 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 119 Wednesday, July 18, 2007 1:03 PM CHIP LEDs / LEDs FOR CAMERA DATA BACK ✩New product ★Under development GM5BW96320A GM5BW96370A GM5CA96320A series GM5BW01300A GM5BW01301A GM5BW01311A GM4BW83380A series GM4BW53340A GM5BW05340A GM5BW05343A GM4BW63360A series GM4WA10200A GM4WA25300A ■ High-Luminosity Dichromatic Type Chip LEDs (RGB 3-color) (Taped Models Only) (Ta = 25°C*11) WA 1.6 × 1.6 (T: 0.55) 2.7 × 1.35 (T: 1.0) Side view type 3.2 × 2.8 (T: 1.4) 6.0 × 5.0 (T: 2.3 [resin part]) 6-terminal GM1WA55311A*5 ● ✩GM4WA10200A*5 ● 20/70/23 10 to 40/16 to 100/10 to 42 ✩GM5WA94200A*7 (920) [Mixed color] ★GM4WA25300A*8 (2 000) [Mixed color] ● GM5WA06250A*2 1 400 [Mixed color] ● GM5WA06260A*1 1 725 [Mixed color] ● GM5WA06256A*6 1 500 [Mixed color] ● GM5WA06270A*3, 4 3 000 [Mixed color] ● GM5WA06250Z*2 1 400 [Mixed color] ● GM5WA06256Z*6 1 500 [Mixed color] GM5WA06260A: IF = 40 mA (Red, Green), IF = 20 mA (Blue) GM5WA06250A, GM5WA06250Z: IF = 35 mA (Red, Green), IF = 20 mA (Blue) GM5WA06270A: IF = 35 mA (Red, Green, Blue) GM5WA06270A: T: 2.4 mm GM1WA55311A/GM4WA10200A: IF = 5 mA (Red, Green, Blue) GM5WA06256A: IF = 22 mA (Red), IF = 35 mA (Green), IF = 13 mA (Blue) GM5WA94200A: IF = 17 mA (Red), IF = 20 mA (Green), IF = 10 mA (Blue) GM4WA25300A: IF = 21 mA (Red), IF = 25 mA (Green), IF = 7 mA (Blue) GM5WA94200A, GM4WA10200A, GM4WA25300A, GM5WA06250A series: Tc = 25°C GM1WA55311A GM5WA06250A GM5WA06260A GM5WA06256A GM5WA06250Z GM5WA06256Z GM5WA06270A LED *1 *2 *3 *4 *5 *6 *7 *8 *9 Luminous intensity (mcd) TYP. ● ● 5.0 × 2.5 (T: 2.5) 6.0 × 5.0 (T: 2.5) 6-terminal leadless Red + Green + Blue Milky diffusion Colorless transparency Colored transparency Colored diffusion Resin type Outline dimensions (mm) GM5WA94200A ■ LEDs for Camera Data Back Model No. GW01M59001PE (I F = 1 mA, Ta = 25°C) No. of dots Outline dimensions (mm) Radiation color 7 2.6 × 2.9 (T: 0.9) Surface-mount type Amber Luminous intensity (mcd) (MIN. 0.4 TYP. 0.8) ( ) indicates reference value. GW01M59001PE Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 119 Device_E.book Page 120 Wednesday, July 18, 2007 1:03 PM LASER LASER DIODES ✩New product ■ Laser Diodes ◆ Model Configurations Package Optical power output (Pulse) (mW) MAX. Wavelength (nm) 405 band 650 band 20*1 ø5.6 mm Metal type ✩GH04020A2GE 240 GH06P24A2C ø3.3 mm Metal type 1.8 mm t Resin type GH16P24A8C ✩GH16P30A8C 300 ✩GH16P35A8C 350 780 band ø5.6 mm Resin type 5*1 GH07805C2K 25*1 GH07825C2K 240 GH07P24C1C GH07P24C4C GH17P24C8C 280 GH07P28A1C GH07P28A4C ✩GH17P28A8C GH17805B2AS *1 Optical power output (CW) MAX. (mW) ◆ Specifications (Tc = 25°C) Optical power Wave- output (mW) Model No. length MAX. (nm) CW Pulse 405 GH04020A2GE 20 — band GH06P24A2C 100 240 GH16P24A8C 100 240 650 band GH16P30A8C 120 300 GH16P35A8C 125 350 Features ø5.6 mm CAN package, operating temperature: 70°C MAX. Next generation DVD playback E Double-layer DVD ×4 writing Double-layer DVD ×4 writing Double-layer DVD ×8 writing Double-layer DVD ×16 writing B GH17805B2AS 5 — GH07805C2K 5 — GH07825C2K 25 — 120 150 240 280 ø5.6 mm CAN package, operating temperature: 75°C MAX. (pulse drive) 1.8 mm frame package, operating temperature: 75°C MAX. (pulse drive) 1.8 mm frame package, operating temperature: 75°C MAX. (pulse drive) 1.8 mm frame package, operating temperature: 75°C MAX. (pulse drive) ø5.6 mm frame package, operating temperature: 70°C MAX., with built-in monitor PD ø5.6 mm CAN package, operating temperature: 60°C MAX., with built-in monitor PD ø5.6 mm CAN package, operating temperature: 60°C MAX., with built-in monitor PD ø5.6 mm CAN package, operating temperature: 75°C MAX. (pulse drive) ø5.6 mm CAN package, operating temperature: 75°C MAX. (pulse drive) 120 240 ø3.3 mm CAN package, operating temperature: 75°C MAX. (pulse drive) GH07P28A4C 150 280 ø3.3 mm CAN package, operating temperature: 75°C MAX. (pulse drive) GH17P24C8C 120 240 1.8 mm frame package, operating temperature: 75°C MAX. (pulse drive) GH17P28A8C 150 280 1.8 mm frame package, operating temperature: 75°C MAX. (pulse drive) GH07P24C1C GH07P28A1C 780 band GH07P24C4C Terminal connections Applications C CD-ROM, CD-Audio A Printer, copier, complex machine D Printer, copier, complex machine CD-R/RW (MAX. ×48 to ×52 writing) CD-R/RW (MAX. ×48 to ×52 writing) CD-R/RW (H/H, slim dual-purpose) (MAX. ×48 to ×52 writing) CD-R/RW (H/H, slim dual-purpose) (MAX. ×48 to ×52 writing) CD-R/RW (H/H, slim dual-purpose) (MAX. ×48 to ×52 writing) CD-R/RW (H/H, slim dual-purpose) (MAX. ×48 to ×52 writing) B C • Terminal Connections A 1 Laser diode B 3 Photodiode 2 Stem 120 1 3 Laser diode 2 Stem C D E 3 GND 2 Stem 2 Stem Laser diode 1 4 2 Photodiode Laser diode 3 1 Laser diode 3 1 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 121 Wednesday, July 18, 2007 1:03 PM RF LOW NOISE BLOCKDOWN CONVERTER ■ Europe: LNB for Broadcasting Satellite ◆ Features (1) (2) (3) (4) Wide band type receiving all broadcasting channels (analog & digital) of Europe. [Universal LNB] Originally developed feed-horn waveguide makes the wide-band, low-noise characteristics possible. One of the industry’s most compact and lightweight package Low consumption current design for energy saving [80 mA (TYP.): BS1R8EL100A] ◆ Specifications Destination Receiving polarization Model No. Input frequency (GHz) Output frequency (MHz) Local oscillation frequency (GHz) NF (dB) Conversion gain (dB) Phase noise Cross-polar discrimination (dB) Europe, Astra/Eutelsat Satellite etc. Horizontal/Vertical polarization BS1R8EL500A BS1R8EL400A BS1R8EL200A BS1R8EL100A 10.7 to 11.7 [Low band], 11.7 to 12.75 [High band] 950 to 1 950 [Low band], 1 100 to 2 150 [High band] 9.75 [Low band], 10.6 [High band] 0.7 (TYP.) 56 (TYP.) –55 dBc/Hz @1 kHz (TYP.) 25 (TYP.) Vertical polarization 11.5 to 14.0 (0/22 kHz) Supply voltage (V DC) (Polarization switching voltage) Horizontal polarization 16.0 to 19.0 (0/22 kHz) Power consumption (mA) 210 (TYP.)/250 (MAX.) 310 (TYP.)/350 (MAX.) 190 (TYP.)/250 (MAX.) 80 (TYP.)/120 (MAX.) Waveguide Feed-horn (F/D = 0.6) 75 Output impedance ( Ω) 4-output 2-output 1-output 4-output Output connector (F-type) (H/V, High and low switching) (H/V, High and low switching) (H/V, High and low switching) (H/H, H/L, V/H, V/L) Outline dimensions (mm) 133.0 × 103.6 × 60.0 133.0 × 103.6 × 60.0 123.5 × 97.0 × 60.0 107.3 × 60.0 × 60.0 Weight (g) Approx. 255 Approx. 256 Approx. 215 Approx. 110 BS1R8EL400A BS1R8EL200A BS1R8EL100A RF Components BS1R8EL500A ■ U.S.A.: LNB for FSS Broadcast/(Others: LNB for Communication) ◆ Specifications Receiving system Receiving polarization Model No. Input frequency (GHz) Output frequency (MHz) Local oscillation frequency (GHz) NF (dB) Conversion gain (dB) Phase noise Cross-polar discrimination (dB) Supply voltage (V DC) Power consumption (mA) Waveguide Output impedance ( Ω) Output connector (F-type) Outline dimensions (mm) Weight (g) U.S.A.: FSS, Japan and others: for communication Horizontal/vertical polarization BS1C1UR100A 11.7 to 12.2 950 to 1 450 10.75 0.7 (TYP.)/0.9 (MAX.) 50 to 62 -60 dBc/Hz @1 kHz (TYP.) — 12 to 24 120 (TYP.)/150 (MAX.) WR-75 75 1-output 48.6 × 96.3 × 45.5 Approx. 100 BS1C1UR100A Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 121 Device_E.book Page 122 Wednesday, July 18, 2007 1:03 PM RF LOW NOISE BLOCKDOWN CONVERTER ■ Japan/Asia/Australia: LNBs for CS Digital Satellite Broadcast ◆ Specifications Destination Receiving polarization Model No. Input frequency (GHz) Output frequency (MHz) Local oscillation frequency (GHz) NF (dB) Conversion gain (dB) Phase noise Cross-polar discrimination (dB) Vertical polarization Supply voltage (V DC) (Polarization switching voltage) Horizontal polarization Power consumption (mA) Waveguide Output impedance ( Ω) Output connector (F-type) Outline dimensions (mm) Weight (g) Japan, Asia, Australia, CS Satellite Horizontal/Vertical polarization BS1R8AR100A 11.70 to 12.75 1 000 to 2 050 10.7 0.7 (TYP.) / 0.9 (MAX.) 55 to 64 –75 dBc/Hz @1 kHz (TYP.) 25 (TYP.) 11.5 to 14.0 16.0 to 19.0 80 (TYP.)120 (MAX.) Feed-horn (F/D = 0.6) 75 1-output (H/V switching) 107.3 × 60 × 60 Approx. 110 BS1R8AR100A ■ Japan: LNBs for BS/CS 110° Satellite Broadcast ◆ Features (1) Can receive 2 satellite broadcasts of 110° BS/CS digital [Employs wide-band (1 GHz) circular’ linear polarization conversion technology (septum waveguide structure)] (2) Outstanding noise figure (NF) characteristics enabling compact design of antenna diameter. [NF: 0.45 dB (TYP.)/BS1F6JU300A] (3) Low current consumption design for improved energy saving. [80 mA (TYP.)] ◆ Standard Specifications Destination Receiving polarization Model No. Input frequency (GHz) Output frequency (MHz) Local oscillation frequency (GHz) NF (dB) Conversion gain (dB) Phase noise Cross-polar discrimination (dB) Right circular polarization Supply voltage (V DC) (Polarization switching voltage) Left circular polarization Power consumption (mA) Waveguide Output impedance ( Ω) Output connector (F-type) Outline dimensions (mm) Weight (g) 122 Japan BS/CS 110° Satellite Right/Left circular polarization BS1F6JU300A BS1F6JP300A BS1F6JP100A 11.71023 to 12.751 1 032.23 to 2 073 10.678 0.45 (TYP.) / 0.7 (TYP.) / 1.1 (MAX.) 0.6 (MAX.) 48 to 60 -65 dBc/Hz @1 kHz (TYP.) 25 (TYP.)/20 (MIN.) 9.5 to 18.0 13.5 to 16.5 — 9.5 to 12.0 80 (TYP.)/110 (MAX.) Feed-horn (F/D=0.5) 75 1-output 1-output (R/L switching) 96 × 53.07 × 71 Approx. 130 (not including outer cabinet) Right circular polarization BS1F6JP300A * Outer cabinet is made upon request. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 123 Wednesday, July 18, 2007 1:03 PM DIGITAL DBS FRONT-END UNITS ■ Digital DBS Front-End Units unit for digital broadcasting features high quality of signal transmission and improved elimination ability of various D BSkindsfront-end of rejection thanks to using Sharp’s original ICs. ◆ Features (1) Equipped with a direct conversion IC developed by Sharp. Reliability is improved by reducing power consumption and component counts. (2) Wide-band reception design also covering CS broadcast band. [Reception frequency: 950 to 2 150 MHz] (3) Wide product line-up of LINK integrated types for contributing to set development time reduction. [Compatible with DVB-S/DVB-S2/ISDB-S demodulation] (4) User support tools can be provided. [Sample/evaluation boards and software are available.] ◆ Standard Specifications Destination Global Demodulator system DVB-S ISDB-S/DVB-S2 Input type 1-input/1-loop through output 1-input Model No. BS2S7HZ0502 BS2S7HZ6306 Input frequency (MHz) 950 to 2 150 Input signal level (dBm) –65 to –25 The 1st intermediate frequency (MHz) Zero-IF (Direct conversion) Base band frequency bandwidth 10 to 30, 2.0 MHz step (BB LPF) RF input local leak (dBm) PLL phase noise (dBc/Hz) –70 and below 10 kHz offset –80 (TYP.) 1 kHz offset –75 (TYP.) –80 (TYP.) Output type I/Q PLL (I2C-bus)*1 Channel selection system Noise figure (dB) Tuning voltage (V DC) 7 (TYP.) Shared with a 3.3 V power source Supply voltage (V DC) LNB power supply 3.3 DC 25 V, 400 mA (MAX.) Input impedance ( Ω) Outline dimensions (mm) BS2S7HZ0502 –85 (TYP.) 75 29.6 × 29.4 × 13.0 BS2S7HZ6306 30.6 × 25.0 × 13.0 RF Components ❇ Contact SHARP for custom design product. (Vertical chassis compatible) *1 I2C-bus is a trademark of Philips Corporation. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 123 Device_E.book Page 124 Wednesday, July 18, 2007 1:03 PM RF DIGITAL DBS FRONT-END UNITS ■ Digital DBS Front-End Units (QPSK Demodulator Circuit Built-in Type) ◆ Specifications Destination Global Input type 1-input, 1-loop through output Model No. BS2F7VZ7395 Input frequency (MHz) 950 to 2 150 Input signal level (dB m) –65 to –25 The 1st intermediate frequency (MHz) Zero-IF (Direct conversion) Base band frequency bandwidth (MHz) 10 to 30, 2.0 MHz step (BB LPF) RF input local leak (dB m) –70 and below Output type TS parallel/serial Symbol rate (M baud) 45 (MAX.) Eb/No = 5.5 dB (Max.) [PR = 3/4, BER = 2 x 10 –4] BER (Viterbi output) PLL (I2C-bus)*1 Channel selection system Noise figure (dB) 7 (TYP.) Tuning voltage (V DC) Shared with a 3.3 V power source Supply voltage (V DC) 3.3, 2.5 LNB power supply 25 V DC, 400 mA (MAX.) Input impedance ( Ω) 75 BS2F7VZ7395 57.5 × 29.6 × 13.2 Outline dimensions (mm) ❇ Contact SHARP for custom design product. *1 I2C-bus is a trademark of Philips Corporation. ■ Digital DBS Front-End Units (8 PSK Demodulator Circuit Built-in Type) ◆ Specifications Destination Japan (ISDB-S) Input type/Features Model No. 1-input BS2F7HZ6460 BS2F7VZ0460 Input frequency (MHz) –65 to –25 The 1st intermediate frequency (MHz) Zero-IF (Direct conversion) Base band frequency bandwidth (MHz) 22 (BB LPF) variable type RF input local leak (dB m) 10 to 30 –70 and below Serial transport output Symbol rate (M baud) BS2F7HZ6460 Parallel/serial transport output 28.86 10 to 30 PLL (I2C-bus)*1 Channel selection system Noise figure (dB) 7 (TYP.) Tuning voltage (V DC) Shared with a 3.3 V power source Supply voltage (V DC) 3.3, 1.5 LNB power supply 3.3, 1.25 25 V DC, 400 mA (MAX.) Input impedance ( Ω) Outline dimensions (mm) BS2F7VZ0165 950 to 2 150 Input signal level (dB m) Output type Europe (DVB-S2) 1-input, 1-loop through output 75 65.8 × 26.5 × 14.6 BS2F7VZ0165 55.1 × 37.9 × 13.2 *1 I2C-bus is a trademark of Philips Corporation. 124 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 125 Wednesday, July 18, 2007 1:03 PM COMBINATION FRONT-END FOR DIGITAL TERRESTRIAL AND DIGITAL SATELLITE BROADCASTING ■ Combination Front-End for Digital Terrestrial, Analog Terrestrial and Digital Satellite Broadcasting ◆ Features (1) Enables simultaneous reception of digital terrestrial and digital satellite, or analog terrestrial and digital satellite, broadcasting. (2) Contributes to making LCD TVs, etc. thinner. ◆ Standard Specifications Destination Japan Model No. VA1R5JF7002 RF circuit system Digital terrestrial Input frequency (MHz) Input signal level*1 (dBm) Output type Analog terrestrial Digital DBS Single conversion type Direct conversion type VHF, UHF, CATV VHF Low: 93 to 167 VHF High: 173 to 399 UHF: 405 to 767 1 049.48 to 2 053 –75 to –20 – –65 to –25 Serial transport CVBS/SIF Serial transport IF bandwidth (MHz) IQ Base band frequency bandwidth Noise figure (dB) PLL phase noise (dBc/Hz) Image rejection (dB) Channel selection system Supply voltage (V DC) Outline dimensions (mm) 6 – – 10 MHz to 30 MHz, 2.0 MHz step (BB LPF) 6 (TYP.) 6 (TYP.) –90 (TYP.) at 10kHz offset –80 (TYP.) at 10kHz offset 65 (TYP.) – VA1R5JF7002 PLL (I2C-bus)*2 1.5, 2.5, 3.3, 5.0 85.5 × 45.2 × 12.7 RF Components *1 It conforms to the ARIB standard. *2 I2C-bus is a trademark of Philips Corporation. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 125 Device_E.book Page 126 Wednesday, July 18, 2007 1:03 PM RF DIGITAL TERRESTRIAL FRONT-END UNIT ■ Front-End Units for ISDB-T/DVB-T ◆ Features (1) (2) (3) (4) Low phase noise characteristics, high elimination of adjacent channel interference. Transport stream output front-end units with built-in OFDM demodulation IC. [VA1L5JF6013/VA1J5ED5055] Compact, low power consumption. Other types are available with various forms of chassis (vertical or horizontal type) and input connectors (F or DIN type), etc. ◆ Standard Specifications Destination Japan Europe/Asia ISDB-T/S front end (built-in OFDM/8PSK demodulation) Product name Model No. VA1J5JF7007 VHF, UHF, CATV VHF Low: 93 to 167 VHF High: 173 to 399 UHF: 405 to 767 Input frequency (MHz)* 1 DVB-T front end (IF output) VA1T1ED5065 1 049.48 to 2 053 IF bandwidth (MHz) 6 VHF: 146 to 430 UHF: 430 to 862 Direct IF Transport stream (Built-in OFDM demodulation) — Mode 7, 8, selectable Mode 1, 2, 3 Input sensitivity Phase noise Image rejection (dB) 2k, 8k, both compatible –79 dBm (TYP.) [in mode 3, 64 QAM, CR = 7/8 (QEF)] –85 dBm (TYP.) 6 (TYP.) Noise figure (dB) –81 dBm (TYP.) [at 2 k, 64 QAM, CR = 2/3 (QEF)] — 8 (TYP.) 6 (TYP.) –90 dBc/Hz (TYP.) [at 10 kHz offset] –80 dBc/Hz (TYP.) –90 dBc/Hz (TYP.) [at 10 kHz offset] 65 (TYP.) — 21.5 dB (TYP.) [at input level: –45 dBm, in mode 3, 64 QAM, CR = 7/8 (QEF)] C/N — 0.75 1.2, 2.5, 3.3, 5 Outline dimensions (mm) — 17.2 dB (TYP.) [at input level: –50 dBm, 64 QAM, CR = 2/3 (QEF)] PLL (I2C-bus)*2 2.0*3 Power consumption (W) 55 (TYP.) 85 dB (TYP.) [8PSK, PC = 2/3 BW = 28.9 MHz] Channel selection/control system Supply voltage (V DC) VA1K5ED5255 VHF: 143.5 to 430 UHF: 430 to 862 Transport stream (Built-in OFDM/8PSK demodulation) Output VA1H1ED5265 DVB-T front end (built-in OFDM demodulation) 0.85 5 (DC-DC converter) 70.0 x 36.9 x 12.5 52.0 x 35.9 x 13.4 47.7 x 29.6 x 13.2 1.33 5, 3.3, 1.8 (DC-DC converter) 70.0 x 29.6 x 13.2 *1 Enables simultaneous reception of digital terrestrial and digital satellite broadcasting. *2 I2C-bus is a trademark of Philips Corporation. *3 During simultaneous OFDM/8PSK demodulation operation. VA1J5JF7007 126 VA1S1ED5056 (VA1S8ED5056) VA1K5ED5255 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 127 Wednesday, July 18, 2007 1:03 PM TWO-IN-ONE RF UNIT ■ Two-In-One RF Units (RF Front-End Unit + PIF Unit) ◆ Features (1) High performance RF front-end unit and PIF unit are integrated in one unit, resulting in a short developing time. (2) A composite unit structure improves operability during mounting. (3) Horizontal shaped models for LCD TVs/LCD monitors are available. (Vertical shaped models are also available.) ◆ Specifications Receiving channels (ch) Input frequency Analog band split Video Analog intermediate frequency (MHz) Audio Digital intermediate frequency (MHz) Digital IF bandwidth (MHz) Phase noise Detection system Terminals Input impedance ( Ω) RF with loop through B voltage (V DC) Noise figure (dB) Type RF Channel selection system front-end Image rejection (dB) IF rejection (dB) Video output level (Vp-p) Video output S/N (dB) Noise limit sensitivity (dBµ) at S/N = 30 dB IF Audio output level (mVrms) Audio output S/N (dB) Audio frequency characteristics (at 70 kHz) SIF output Outline dimensions (mm) North America VA1Y2UF2307/VA1Y2UF2312 VHF UHF Air CATV CATV Air A5 to W+12 to 1 to 13 14 to 69 W+11 W+84 BL: 2 to 6, A5 to B BH: 7 to 13, C to W+11 BU: 14 to 69, W+12 to W+84 Europe VA1Y2ED1401 China/Asia VT2W5CD551 VHF UHF Air CATV CATV Air 1A, Z1 to Z34 to 1 to 12 13 to 57 Z33 Z38 BL: 1 to 5, 1A, Z1 to Z4 BH: 6 to 12, Z5 to Z33 BU: 13 to 57, Z34 to Z38 VHF-Low: 50.5 to 142.5 MHz VHF-High: 149.5 to 426 MHz UHF: 434 to 858 MHz 42 42 42 — — — — 290 45 — — –0 (at 10 kHz) 65.0 × 40.4 × 15.0 Possible to SIF output 61.5 × 35.2 × 10.9 60.9 × 41.5 × 15.0 BL: 2 to 4, X to S6 BH: 5 to 12, S7 to S36 BU: 13 to 69, S37 to S41 B/G, I, D/K, L: 39.875 45.75 38.0 L': 33.125 D/K, L: 33.375 I: 33.875 41.25 D/K: 31.5, I: 32.0, B/G: 32.5, M/N: 33.5 B/G: 34.375 L': 39.625 44 36.0 — 6 7/8 (switchable) — -80dBc/Hz (Typ.) at 20kHz offset -85dBc/Hz (Typ.) at 10kHz offset — Pseudo synchronization detection system, split-carr ier audio receiving system Input: F-type junction, SO Input: DIN type terminal Input: DIN type terminal 75 —*2 — —*2 MB: 5 MB: 5/BT: 31 MB: 5/BT: 31 6 6 7 7 Typ. 6 6 7 6 6 Digital analog receiver front end PLL (I2C-bus)*1 VL: 65, VH: 65 60 Typ. 65 VL: 70, VH: 70 55 100 Typ. 100 VL: 50 to 70, VH: 90 90 VL: 75, VH: 85 1.0 1.0 1.0 48 50 44 RF Components TV system Model No. *1 I2C-bus is a trademark of Philips Corporation. *2 Compatible with RF loop through type. VA1Y2UF2307 VA1Y2UF2312 VA1Y2ED1401 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 127 Device_E.book Page 128 Wednesday, July 18, 2007 1:03 PM RF ANALOG TERRESTRIAL RF FRONT-END UNIT ■ RF Front-End Units ◆ Features (1) Miniature size achieved using thin profile, low height design in industry standard RF front-end unit (terminal shape and terminal pin arrays) (2) Model lineup corresponding to domestic product standards of Europe, China, Japan and the United States. DIN-type junction input type With RF output terminal type ◆ Specifications (Major models of VT1Y series) Destination Europe Type Model No. VT1Y5ED211 VHF Receiving channel (ch) Band split Intermediate frequency (MHz) U.S.A. China/Asia With PLL, for frequency CS, for frequency synthesizer, F-type junction synthesizer input IF output*1: No equilibrium Air CATV CATV GB, hyper, for frequency synthesizer VT1Y5UF201 UHF Air VHF Air With PLL, for frequency With PLL, for frequency synsynthesizer thesizer, with RF output VT1Y5CD201 UHF CATV CATV Japan Air VHF Air VT1Y5JF201 UHF CATV CATV Air VHF Air VT1Y5JB201 UHF CATV CATV VHF Air Air CATV CATV Air W+12 X to S37 to 21 to A-5 to 14 to 1A, Z1 Z34 to 13 to C13 to C53 to 13 to C13 to C53 to 13 to 2 to 12 2 to 13 to 1 to 12 1 to 12 1 to 12 S36 S41 C57 W+11 69 to Z33 Z38 57 C52 C63 62 C52 C63 62 W+84 BL: 2 to 6, A-5 to B BL: 1 to 5, 1A, Z1 to Z4 BL: 1 to 3, C13 to C22 BL: 1 to 3, C13 to C22 BL: 2 to 4, X to S6 BH: 5 to 12, S7 to S36 BH: 6 to 12, Z5 to Z33 BH: 4 to 12, C23 to C52 BH: 4 to 12, C23 to C52 BH: 7 to 13, C to W+11 BU: 21 to C57, S37 to S41 BU: 14 to 69, W+12 to W+84 BU: 13 to 57, Z34 to Z38 BU: 13 to 62, C53 to C63 BU: 13 to 62, C53 to C63 Video 38.9 45.75 38.0 58.75 Audio 33.4 41.25 31.5 54.25 +B: 5/BT: 31 +B: 5/BT: 31.5 +B: 5/BT: 31 +B: 5/BT: 31.5 B voltage (V DC) Input impedance ( Ω) VSWR UHF 75 2 2 2 1.5 1.5 1.5 2 2 2 1.5 1.5 1.5 – – – Noise figure (dB) 5 7 6 5 5 6 5 7 6 4 5 4.5 8 9 8.5 Power gain (dB) 40 38 40 39 39 37 40 38 40 40 37 40 36 33 36 Image rejection (dB) IF rejection (dB) VL: 70 VH: 65 VL: 70 VH: 90 60 90 Outline dimensions (mm) VL: 70 VH: 60 VL: 80 VH: 90 60 85 VL: 70 VH: 65 VL: 70 VH: 90 60 90 VL: 85 VH: 85 VL: 85 VH: 85 80 100 VL: 85 VH: 85 VL: 85 VH: 85 80 100 53.0 × 33.6 × 14.3 (Note) The figures in the table are typical values. *1 Available IF output equilibrium model 128 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 129 Wednesday, July 18, 2007 1:03 PM MOBILE DIGITAL TERRESTRIAL MODULE ■ 1-Segment Digital Terrestrial Module ◆ Features (1) (2) (3) (4) High sensitivity: Compact and thin design: Low power consumption: Output interface: -109 dBm [typ.] (GPSK, CR1/2 ch13) 9.0 x 9.0 x 1.5 mm 95 mW*1 TS serial output VA35JZ9910 ◆ Standard Specifications Destination Japan Model No. VA35JZ9910 Input frequency 470 to 770 MHz (UHF: 13 to 62) Input signal level -109 dBm [typ.] (GPSK, CR1/2) 2.9 V (RF) 1.5 V (OFDM Core) 1.8 V to 2.9 V (I/O) Supply voltage 95 mW*1 Power consumption Operating temperature -20 to 85°C I2C-bus*2 Control I/F Power off function OFF for RF/OFDM power supply, 2 µA (MAX.) for I/O power supply (ON state) *1 Average value when current consumption is controlled by software *2 I2C-bus is a trademark of Philips Corporation. ■ 1-segment/3-segment Digital Terrestrial Module ◆ Features (1) High sensitivity: -109 dBm [typ.] (QPSK, CR1/2 ch15) -110 dBm [typ.] (QPSK, CR1/2 ch7) (2) Compact and thin design: 9.0 x 9.0 x 1.5 mm (3) Low power consumption: 125 mW (at 3-segment), 120 mW (at 1-segment) (4) Output interface: TS serial output RF Components VA35JZ9910 ◆ Standard Specifications Destination Japan Model No. VA35JZ9904 Input frequency Input signal level Supply voltage Power consumption Operating temperature Control I/F Power off function 188 to 198 MHz (UHF: 7, 8) 470 to 770 MHz (UHF: 13 to 62) -109 dBm [typ.] (GPSK, CR1/2, ch7) -110 dBm [typ.] (GPSK, CR1/2, ch15) 1.8 V (RF) 1.2 V (OFDM Core) 1.8 V to 2.8 V (I/O) 125 mW (at 3-segment), 120 mW (at 1-segment) -20 to 85°C I2C-bus*1 All power supplies can be OFF. *1 I2C-bus is a trademark of Philips Corporation. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 129 Device_E.book Page 130 Wednesday, July 18, 2007 1:03 PM RF EMBEDDED WIRELESS LAN MODULE ■ USB Interface Wireless LAN Module ◆ Features (1) Interface: USB2.0 (2) Supports security functions. [Encryption method: WEP (64 bit/128 bit), TKIP, AES Authentic method: IEEE802.1x (TLS/PEAP/LEAP), WPA (TLS/PEAP)] DC2J1AZxxx ◆ Specifications Standard IEEE802.11b (option: IEEE802.11g) Model No. DC2J1AZxxx (Japan)*1 Output connector Power amp. Current FTP throughput (Mbps) Clock (MHz) Voltage (V DC) Outline dimensions (mm) B to B, 10 pin & Antenna connector Included Uplink (FTP): 440 mW (typ.)*2 Downlink (FTP): 410 mW (typ.)*2 4.5 (typ.) [Using FTP ‘get’ command]*2 40 (included) 3.3±5% 20 × 30 × 3.8 Driver software consults separately. *1 Different models are available in accordance with the laws of the country where the product is to be sold or used. *2 Measurement of FTP of specifications description. 130 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 131 Wednesday, July 18, 2007 1:03 PM IR INFRARED DATA COMMUNICATION DEVICE INDEX TREE ■ Infrared Data Communication Device Lineup Communication system IrDA data Transmission speed FIR 4 Mb/s Transmission distance 100 cm Operating supply voltage Features Model No. Compact, thin (height: 2.5 mm), low voltage operation type, LP/HP mode switching function 2.4 to 3.6 V GP2W1004YP0F Compact 2.7 to 5.5 V GP2W1001YP0F (IrDA 1.x) 70 cm LP/HP mode switching function GP2W1010YP0F 50/20 cm LP/HP mode switching and remote control transmission functions GP2W3120YP0F 50/20 cm LP/HP mode switching function 2.7 to 3.6 V GP2W1320YP0F FIR LP 4 Mb/s 70/20 cm LP/MP/HP mode switching and remote control transmission functions 2.6 to 3.3 V GP2W3104YP0F MIR 1.152 Mb/s 100 cm Compact, low dissipation current 2.4 to 3.6 V GP2W1002YP0F 70 cm 2.4 to 3.6 V GP2W1302YP0F 50 cm 2.4 to 3.6 V GP2W1304YP SIR 115.2 kb/s SIR LP 115.2 kb/s 100 cm Compact, low dissipation current 2.4 to 5.5 V GP2W0004YP0F/ GP2W0004XP0F 80 cm Remote control transmission function, compact, low dissipation current 2.4 to 5.5 V GP2W3020YP 20 cm Built-in LED constant current circuit, 3-state output 2.0 to 3.6 V GP2W0110VX/ GP2W0110VY Compact 2.0 to 3.6 V GP2W0116YP0F (Height: 1.5 mm) 2.4 to 3.6 V GP2W0150YP0F 2.0 to 3.6 V GP2W0114YP0F Built-in LED constant current circuit, 3-state output, top view type Compact 2.0 to 3.6 V GP2W0118YP0F (Height: 2.1 mm) 2.4 to 3.6 V GP2W0150XP0F Built-in LED constant current circuit, 3-state output, low voltage operation type, low dissipation current type 1.8 to 2.5 V GP2W0112YP0F Remote control transmission function (built-in drive circuit) λp: 870, 940 nm 2.4 to 3.6 V GP2W3240YP λp: 890 nm 2.4 to 3.6 V GP2W3250YP (Height: 1.5 mm) 2.4 to 3.6 V GP2W3270YP0F Top view type GP2W3270XP0F 2.4 to 3.6 V IR Device FIR LP 4 Mb/s ■ Infrared Wireless Audio Transmission Device Lineup Communication system Infrared system (1-bit audio transmission) Features For designing compact, low-power-consumption audio transmission systems Operating supply voltage 2.4 to 3.6 V Model No. GP2WVR01YP0F/ GP2WVC01MP0F (Transmission LSI) 131 Device_E.book Page 132 Wednesday, July 18, 2007 1:03 PM IR INFRARED DATA COMMUNICATION DEVICES ✩New product ★Under development ■ Infrared Data Communication Devices ◆ IrDA FIR Compliant Devices Model No. Communication system ✩GP2W3120YP0F Bi-directional (half-duplex) communication Bi-directional (half-duplex) communication Bi-directional (half-duplex) communication Bi-directional (half-duplex) communication ✩GP2W1010YP0F ★GP2W1004YP0F GP2W1001YP0F Transmission rate 9.6 k to 4 Mb/s 9.6 k to 4 Mb/s 9.6 k to 4 Mb/s 9.6 k to 4 Mb/s ✩GP2W1320YP0F Bi-directional (half-duplex) communication 9.6 k to 4 Mb/s ✩GP2W3104YP0F Bi-directional (half-duplex) communication 9.6 k to 4 Mb/s Transmission Supply voltage Outline distance (cm) (V DC) dimensions (mm) Description With remote control transmission function, LP/HP mode switching function 50/20*1 2.4 to 3.6 7.16 × 2.73 × 1.82 LP/HP mode switching function 70 2.4 to 3.6 7.9 × 2.85 × 2.15 LP/HP mode switching function 100 2.4 to 3.6 7.9 × 2.85 × 2.5 100 2.7 to 5.5 10.01 × 4.4 × 3.5 50/20*1 2.7 to 3.6 7.16 × 2.73 × 1.82 70/20*2 2.6 to 3.3 7.9 × 2.85 × 2.5 Compact, thin, low dissipation current during shutdown (Icc: TYP. 0.45 mA) Compact, thin, with remote control transmission function, LP/MP/HP mode switching function *1 MIN. 20 cm at 150 mA MIN. 50 cm at 250 mA *2 MIN. 21 cm at 150 mA MIN. 70 cm at 450 mA GP2W3120YP0F GP2W1010YP0F GP2W1004YP0F (GP2W3104YP0F) GP2W1001YP0F GP2W1320YP0F ◆ IrDA MIR Compliant Devices Model No. GP2W1002YP0F GP2W1302YP0F GP2W1304YP Transmission rate Bi-directional (half-duplex) 9.6 k to 1.152 communication Mb/s Bi-directional (half-duplex) 9.6 k to 1.152 communication Mb/s Bi-directional (half-duplex) 9.6 k to 1.152 communication Mb/s Communication system GP2W1304YP Transmission Supply voltage Outline distance (cm) (V DC) dimensions (mm) Description Compact, compatible with 2.15 mm height for mobile phone Compact, compatible with 1.82 mm height for mobile phone GP2W1302YP0F 100 2.4 to 3.6 8.0 × 3.0 × 2.5 70 2.4 to 3.6 7.9 × 2.85 × 2.15 50 2.4 to 3.6 7.16 × 2.73 × 1.82 GP2W1002YP0F ◆ IrDA SIR Compliant Front-Ends Model No. GP2W0004YP0F GP2W0004XP0F GP2W3020YP Transmission rate Bi-directional (half-duplex) 9.6 k to 115.2 communication kb/s Bi-directional (half-duplex) 9.6 k to 115.2 communication kb/s Communication system Low dissipation current (Icc: 130 µA MAX.) Low dissipation current (Icc: 130 µA MAX.) With remote control transmission function Bi-directional (half-duplex) 9.6 k to 115.2 (Transmission distance TYP. 7 m, IF = 350 mA) communication kb/s Low dissipation current during shutdown (Icc: 130 µA MAX.) GP2W0004YP0F 132 Description GP2W0004XP0F Transmission Supply voltage Outline distance (cm) (V DC) dimensions (mm) 100 2.4 to 5.5 9.21 × 3.76 × 2.71 100 2.4 to 5.5 9.2 × 3.35 × 2.95 80 2.4 to 5.5 7.9 × 2.85 × 2.15 GP2W3020YP Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 133 Wednesday, July 18, 2007 1:03 PM INFRARED DATA COMMUNICATION DEVICE ◆ IrDA SIR LP Compliant Front-Ends Model No. Communication system Transmission rate Description Top-view and side view compatible (Model Bi-directional (half-duplex) 2.4 k to 115.2 name is prescribed based on the packaging communication kb/s status.), lead-free type available Low voltage operation, low dissipation current, Bi-directional (half-duplex) 2.4 k to 115.2 GP2W0112YP0F ▲ 3-state output type, independent power supply communication kb/s for light-emitting and light-detecting circuits Bi-directional (half-duplex) 2.4 k to 115.2 Compact, thin, low dissipation current GP2W0150YP0F communication kb/s (Icc: 100 µA MAX.) Compact, thin, low dissipation current Bi-directional (half-duplex) 2.4 k to 115.2 GP2W0150XP0F (Icc: 100 µA MAX.) communication kb/s Top view type Bi-directional (half-duplex) 2.4 k to 115.2 Compact, thin, low dissipation current GP2W0116YP0F ▲ communication kb/s (Icc: 120 µA MAX.) Compact, thin, low dissipation current Bi-directional (half-duplex) 2.4 k to 115.2 GP2W0118YP0F ▲ (Icc: 120 µA MAX.) communication kb/s Top view type With remote control transmit function Bi-directional (half-duplex) 2.4 k to 115.2 GP2W3240YP▲ (with remote control drive circuit) (λp = 940 nm) communication kb/s IR communication part (λp = 870 nm) Bi-directional (half-duplex) 2.4 k to 115.2 Remote control transmission function, shared GP2W3250YP communication kb/s IR communication section ( λp = 890 nm) Bi-directional (half-duplex) 2.4 k to 115.2 Remote control transmission function, shared GP2W3270YP0F communication kb/s IR communication section ( λp = 890 nm) Remote control transmission function, shared Bi-directional (half-duplex) 2.4 k to 115.2 GP2W3270XP0F IR communication section ( λp = 890 nm) communication kb/s Top view type GP2W0110VX/VY Transmission Supply voltage Outline distance (cm) (V DC) dimensions (mm) 20 2.0 to 3.6 6.8 × 2.35 × 2.1 20 1.7 to 2.5 7.9 × 2.85 × 2.15 20 2.4 to 3.6 7.6 × 2.4 × 1.5 20 2.4 to 3.6 8.3 × 2.1 × 1.7 20 2.0 to 3.6 7.2 × 2.75 × 1.85 20 2.0 to 3.6 7.9 × 2.25 × 2.0 20 2.4 to 3.6 8.6 × 2.85 × 1.85 20 2.4 to 3.6 7.2 × 2.55 × 1.85 20 2.4 to 3.6 7.6 × 2.4 × 1.5 20 2.4 to 3.6 8.3 × 2.1 × 1.7 The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. GP2W0110VX (GP2W0110VY) GP2W0112YP0F GP2W0150YP0F (GP2W3270YP0F) GP2W0150XP0F (GP2W3270XP0F) GP2W0116YP0F GP2W0118YP0F GP2W3240YP GP2W3250YP ■ Infrared Wireless Audio Transmission Device Communication system Features S/N ratio GP2WVR01YP0F (Reception Device) 1-bit audio transmission (1.5 MHz) Compact, low power consumption type Simple circuit configuration: Used in combination with transmission LSI (GP2WVC01MP0F) and transmission device (GP2W1004YP0F, etc.) 70 dB Supply voltage Outline (V DC) dimensions (mm) 2.4 to 3.6 IR Device Model No. 2.5 × 8 × 3 GP2WVR01YP0F Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 133 Device_E.book Page 134 Wednesday, July 18, 2007 1:03 PM IR IR DETECTING UNIT FOR REMOTE CONTROL INDEX TREE ■ IR Detecting Unit for Remote Control Lineup Package Type Form Lead L IR detecting unit bend with for remote control holder Model No. Detection position*5 (from PCB) 16.0 mm*1 Features Compact size Compact size, Strengthened resistance to electromagnetic induction noise (Mesh type) Operating voltage: 3V Operating voltage: 5V GP1UE28XK0VF series GP1UM28XK0VF series GP1UE28RK0VF series GP1UM28RK0VF series GP1UE27XK0VF series GP1UM27XK0VF series GP1UE27RK0VF series GP1UM27RK0VF series GP1UE26XK0VF series GP1UM26XK0VF series GP1UE26RK0VF series GP1UM26RK0VF series Low dissipation current 12.0 mm*2 Compact size Compact size, Strengthened resistance to electromagnetic induction noise (Mesh type) GP1UD28XK00F series Low dissipation current 6.8 mm*3 Compact size Compact size, Strengthened resistance to electromagnetic induction noise (Mesh type) GP1UD27XK00F series Low dissipation current Lead straight with holder 19.0 mm 9.6 mm GP1UD26XK00F series Compact size, Strengthened resistance to electromagnetic induction noise (Mesh type) GP1UE29QK0VF series GP1UM29QK0VF series Compact size GP1UE28YK0VF series GP1UM28YK0VF series GP1UE28QK0VF series GP1UM28QK0VF series Compact size, Strengthened resistance to electromagnetic induction noise (Mesh type) Low dissipation current 134 GP1UD28YK00F series Compact, thin type SMD (4.1 × 3.84 × 0.95 t mm) GP1US30XP series Compact type SMD (6.8 × 2.1 × 2.35 t mm) GP1UF31 series Holderless *1 *2 *3 *4 *5 Operating voltage: 3 to 5 V Lead straight 6.0 mm GP1UX31QS series GP1UX51QS series Lead L bend*4 5.3 mm GP1UX31RK series GP1UX51RK series Mesh type (strengthened resistance to electromagnetic induction noise): 16.4 mm Mesh type: 12.4 mm Mesh type: 7.2 mm Mesh type: 5.3 mm Lead straight: Distance from lens center to mounting board upper surface No mesh lead L bend: Distance from tip of lens to mounting board upper surface Mesh-type lead L bend: Distance from tip of mesh to mounting board upper surface Device_E.book Page 135 Wednesday, July 18, 2007 1:03 PM IR DETECTING UNIT FOR REMOTE CONTROL ✩New product ■ IR Detecting Units for Remote Control (Ta = 25°C) Electrical characteristics VOH VOL Icc (V) (V) (mA) *1 MAX. MIN. MAX. 0.6 (0.65)*18 Vcc–0.5*10 0.45*10 0.6 (0.65)*18 Vcc–0.5*10 0.45*10 0.6 (0.65)*18 Vcc–0.5*10 0.45*10 0.6 (0.65)*18 Vcc–0.5*10 0.45*10 0.6 (0.65)*18 Vcc–0.5*11 0.45*11 0.6 (0.65)*18 Vcc–0.5*11 0.45*11 0.6 (0.65)*18 Vcc–0.5*11 0.45*11 0.6 (0.65)*18 Vcc–0.5*11 0.45*11 0.6 (0.65)*18 Vcc–0.5*11 0.45*11 0.4 Vcc–0.5*9 0.45*9 0.4 Vcc–0.5*9 0.45*9 0.4 Vcc–0.5*9 0.45*9 0.4 Vcc–0.5*9 0.45*9 0.4 Vcc–0.5*14 0.45*14 0.4 Vcc–0.5*14 0.45*14 0.4 Vcc–0.5*14 0.45*14 0.4 Vcc–0.5*14 0.45*14 0.4 Vcc–0.5*14 0.45*14 0.2 (Vcc = 3 V) Vcc–0.5*9 0.5*9 0.2 (Vcc = 3 V) Vcc–0.5*9 0.5*9 0.2 (Vcc = 3 V) Vcc–0.5*9 0.5*9 0.2 (Vcc = 3 V) Vcc–0.5*9 0.5*9 fo (kHz) TYP. 40*3 40*3 40*3 40*3 40*3 40*3 40*3 40*3 40*3 40*16 40*16 40*16 40*16 40*16 40*16 40*16 40*16 40*16 40*3 40*3 40*3 40*3 Size (mm) Remarks 5.6 × 9.6 × 6.8 5.6 × 9.6 × 12.0 5.6 × 9.6 × 16.0 5.6 × 8.6 × 12.5(9.6)*2 5.6 × 9.6 × 7.2 5.6 × 9.6 × 12.4 5.6 × 9.6 × 16.4 5.6 × 9.0 × 12.5(9.6)*2 5.6 × 16.2 × 21.9(19)*2 5.6 × 9.6 × 6.8 5.6 × 9.6 × 12.0 5.6 × 9.6 × 16.0 5.6 × 8.6 × 12.5(9.6)*2 5.6 × 9.6 × 7.2 5.6 × 9.6 × 12.4 5.6 × 9.6 × 16.4 5.6 × 9.0 × 12.5(9.6)*2 5.6 × 16.2 × 21.9(19)*2 7.3 × 13.1 × 6.8 7.3 × 13.1 × 12.0 7.3 × 13.1 × 16.0 7.3 × 8.4 × 13.0(9.6)*2 0.45*11 40*3 5.6 × 6.2 × 7.6(6.0)*2 Vcc–0.5 0.45 40*3 5.6 × 6.2 × 7.6(6.0)*2 0.6 Vcc–0.5*11 0.45*11 40*16 5.5 × 5.3 × 7.5 –10 to +70 1.5 Vcc–0.5 0.45 40*3 5.5 × 5.3 × 7.5 0 to 6.0 –10 to +70 0.4 Vcc–0.5*14 0.45*14 40 5.5 × 5.3 × 7.5 GP1UX31RK*8 0 to 6.0 –10 to +70 0.4 Vcc–0.5*14 0.45*14 40 5.5 × 5.3 × 7.5 GP1US30XP*6, 17 ✩GP1UF31xXP0F ✩GP1UF31xYP0F – 0 to 6.0 0 to 6.0 –30 to +85 –30 to +85 –30 to +85 0.6 0.4 0.4 Vcc–0.5*11 Vcc–0.5 Vcc–0.5 0.45*19 0.45 0.45 40 40*20 40*20 4.1 × 3.95 × 0.95 6.8 × 2.1 × 2.0 6.8 × 2.1 × 2.0 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5 *5, Pin configuration (Pin No. 2: GND) *5, Pin configuration (Pin No. 2: GND) *5, Pin configuration (Pin No. 2: GND) *5, Pin configuration (Pin No. 2: GND), Folded lead *5, Pin configuration (Pin No. 2: GND) *5, Pin configuration (Pin No. 2: GND), Folded lead *5, Surface mount compatible *5, Surface mount compatible *5, Surface mount compatible Series No. Vcc (V) Topr (°C) 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 0 to 6.0 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 –10 to +70 GP1UV70QS00F* 13 – –10 to +70 1.5 Vcc–0.5*11 GP1UW70QS00F* 7 – –10 to +70 0.6 GP1UX51QS*13 0 to 6.0 –10 to +70 GP1UX51RK*13 0 to 6.0 GP1UX31QS*7, *8 GP1UM26XK0VF* 12 GP1UM27XK0VF* 12 GP1UM28XK0VF* 12 GP1UM28YK0VF* 12 GP1UM26RK0VF* 4, 12 GP1UM27RK0VF* 4, 12 GP1UM28RK0VF* 4, 12 GP1UM28QK0VF* 4, 12 GP1UM29QK0VF* 4, 12 GP1UE26XK0VF* 8 GP1UE27XK0VF* 8 GP1UE28XK0VF* 8 GP1UE28YK0VF* 8 GP1UE26RK0VF* 8 GP1UE27RK0VF* 8 GP1UE28RK0VF* 8 GP1UE28QK0VF* 8 GP1UE29QK0VF* 8 GP1UD26XK00F* 8 GP1UD27XK00F* 8 GP1UD28XK00F* 8 GP1UD28YK00F* 8 *1 *2 *3 *4 *5 *6 *7 *8 *9 *10 *11 *12 *13 *14 *15 *16 *17 *18 *19 *20 When no signal is input (during input light). Figures in parentheses indicate the distance to the light detection center. In addition to the fo = 40kHz type, types fo = 36, 38, 36.7, 56.8, 32.75 kHz are also available. Type with strengthened resistance to electromagnetic induction noise. A voltage regulator circuit is built-in but may be affected by the usage environment. Install with an externally mounted C and R as a power supply filter. Allows reflow soldering. Operating voltage: 2.4 to 3.6 V (2.7 to 3.6 V for fo = 56.8 kHz type) Operating voltage: 2.7 to 5.5 V Distance to transmitter on optical axis is 0.2 to 10.0 m. Ev < 10 lx when burst wave is input as shown in the right figure. Distance to transmitter on optical axis is 0.2 to 10.0 m. Ev < 10 lx when burst wave is input as shown in the right figure. (fo = 56.8 kHz: 0.2 to 9.0 m) Distance to transmitter on optical axis is 0.2 to 8.5 m. Ev < 10 lx when burst wave is input as shown in the right figure. (fo = 56.8 kHz: 0.2 to 7.0 m, fo = 32.75 kHz: 0.2 to 6.5 m) GP1UM series operating voltage: 4.5 to 5.5 V Operating voltage: 4.5 to 5.5 V Distance to transmitter on optical axis is 0.2 to 8.0 m. Ev < 10 lx when burst wave is input as shown in the right figure. Distance to transmitter on optical axis is 0.2 to 6.5 m. Ev < 10 lx when burst wave is input as shown in the right figure. Types fo = 32.75, 36, 36.7, and 38 kHz are also available. Operating voltage: 2.4 to 5.5 V fo = 56.8 kHz Distance to transmitter on optical axis is 0.2 to 5.0 m. Ev < 10 lx when burst wave is input as shown in the right figure. In addition to the fo = 40 kHz type, types fo = 36, 36.7, and 38 kHz are also available. 600 µs 1 000 µs IR Device Absolute maximum ratings Duty = 50% GP1UD series, GP1UM series, GP1UE series have different fo values for each model. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 135 Device_E.book Page 136 Wednesday, July 18, 2007 1:03 PM IR IR DETECTING UNIT FOR REMOTE CONTROL GP1UD28XK00F GP1UM28XK0VF (GP1UE28XK0VF) GP1UM28RK0VF (GP1UE28RK0VF) GP1UM29QK0VF (GP1UE29QK0VF) GP1UD27XK00F GP1UM27XK0VF (GP1UE27XK0VF) GP1UM27RK0VF (GP1UE27RK0VF) GP1UV70QS00F (GP1UW70QS00F) GP1UD26XK00F GP1UM26XK0VF (GP1UE26XK0VF) GP1UM26RK0VF (GP1UE26RK0VF) GP1UX51QS (GP1UX31QS) GP1UD28YK00F 136 GP1UM28YK0VF (GP1UE28YK0VF) GP1UM28QK0VF (GP1UE28QK0VF) GP1US30XP GP1UF31xYP0F (GP1UF31xXP0F) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 137 Wednesday, July 18, 2007 1:03 PM POWER SWITCHING POWER SUPPLY ■ Switching Power Supplies (Custom) ◆ Features (1) (2) (3) (4) Satisfies energy saving regulations thanks to the high conversion efficiency Compact and high reliability thanks to the modulated main switching and chopper circuits EMI filter built-in, low noise design Environmentally safe types are also available. [RoHS, lead-free] ◆ Specification examples Input voltage (V AC) Input frequency (Hz) LCD TV (20 to 22′′) 90 to 110 50/60 Output voltage (V) (Current capacity) +24 (1.9 A) +12 (3.5 A) Applications Rated output power (W) Stand-by power loss (W) Protection circuit Configuration Outline dimensions (mm) 87.6 0.3 (without load) LCD TV (26 to 32′′) 90 to 264 50/60 +24 (5.0 A) +12 (4.0 A) +5 (5.5 A) +5 (1.5 A) +3.3 (3.0 A) 213 Laser-beam printer/ Scanner/FAX 85 to 138 50/60 0.1 – +3.3 (0.25 A) +5 (1.1 A) +12 (0.13 A) +24 (2.0 A) 55.9 Overcurrent and overvoltage protection On-board 140 × 244 × 35.6 204 × 124 × 40 118 × 208 × 36 * Types with input voltage of AC 100 V, 120 V, 200 V are also available. Types with other specification are also available upon request. For LCD TVs (20′′ to 22′′), an integrated power source with an inverter circuit for backlights is also available. ■ Switching Power Supply with Integrated High/Low Voltage Circuit (Custom) ◆ Features (1) Realizes compact and low cost thanks to the integrated high/low voltage circuit (2) Easy connection between high voltage and low voltage circuits (3) Highly efficiency energy saving power supply at standby mode can be installed for low voltage circuit (4) Environmentally safe types are also available. [RoHS, lead-free] ◆ Specifications Low voltage Switching power supply system Input voltage (V DC) Output voltage (kV DC) Switching power supply system Input voltage (V AC) Power capacity (W) Power Supply Device High voltage Sharp ‘Green Power Supply’ adapting with integrated high/low voltage circuit regulation Pulse width control or RCC method 24 +5.5 (+280 µA)/-5.5 (-560 µA), etc. Pulse width control or RCC method 100, 120, 230 184 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 137 Device_E.book Page 138 Wednesday, July 18, 2007 1:03 PM PCB PRINTED CIRCUIT BOARDS ■ Advanced Flex Printed Circuit Boards he advanced flex printed circuit board is a multilayered composite wiring board comprised of flexible printed circuits (FPC) laminated into a multilayer configuration. The PWBs and FPCs are connected to each other via copper-plated through holes. It is ideal for compact, light-weight equipment design. T ◆ Features (1) For selecting optimal specifications to suit specific applications, special specifications such as for mobile phones are available. • Minimum thickness in multi-layer part: 0.26 mm (4-layer), 0.33 mm (6-layer) • Minimum pattern width/pitch: 0.06/0.07 mm • Flexibility of single/double sided FPC part (dedicated for hinge): More than 200 000 times 180-degree bending of radius 3 mm (2) Capable of board-to-board connection without connectors, which enables space-saving and 3-dimensional equipment assembly. (3) Through hole plating connection of multi-layer (3 to 8) part to flexible part significantly improves reliability. (4) Blind Via Hole (BVH) forming with laser via drilling of small diameter. (5) Sheet design provides excellent mountablity, equivalent to that of PWB. ◆ Outline Specifications Type Min. base thickness Min. line width/spacing Min. through hole diameter Through hole Min. via hole land Blind via hole diameter Inner via hole Solder resist Surface finish Safety standard (UL approval) 138 Construction of Advanced Flex Board (6-layer sample) Folding type/Flying tail type 0.26 mm (4-layer), 0.33 mm (6-layer), 0.40 mm (8-layer) 0.06/0.07 mm Laser via hole (BVH) FPC PP ø0.25 mm Outer layer: ø0.5 mm, Inner layer: ø0.5 mm ø0.09 mm ø0.30 mm Multi layer: Liquid photo solder resist, FPC: Film cover ray Heat-resistant preflux, Ni-Au plating (Ni-Au plating for flying tail) 94V-0 FPC PP FPC Through hole Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 139 Wednesday, July 18, 2007 1:03 PM PRINTED CIRCUIT BOARDS ■ Flexible Build-Up Multilayer PCBs dvanced flex specifications are used for the inner layer core material of this build-up multilayer PCB, so the board can handle finer mounting patterns and achieve connectorless between-board connections using an inner layer flexible printed circuit (FPC). This facilitates greater equipment design flexibility and ultra-compact designs. A ◆ Features (1) Multiple build-up layers are connected internally with an FPC, thereby improving connection reliability between multilayer boards and reducing both connection space and connector weight. (2) Enables narrow pitch (0.5 mm) CSP and bare chip mounting, and thus greater equipment compactness through ultra-high density mounting. (3) Enables via-on-inner-via-hole configurations, and makes it possible to achieve ultra-high density wiring designs. (Facilitates a diverse range of designs for greater compactness and thinness.) ◆ Outline Specifications Type No. of build-up layers Core layer configuration Min. board thickness*1 Conformal via hole Via hole diameter Land hole diameter Stacked via hole Via-on inner via hole Inner via hole diameter Min. line width/spacing* 2 CSP mountable pitch Safety standard F1 (6- to 8-layer) 1 for each side of core layer 3 to 6 layers (Polyimide, FR-4) 0.8 mm (6-layer), 0.87 mm (8-layer) ø0.09 mm/ø0.30 mm – Available ø0.2 mm 0.09 mm/0.09 mm 0.5 mm UL (94V-0) Via directly above IVH Laser via hole RCC PP FPC PP RCC *1 Consult with SHARP if a thinner type is required for special designs. *2 Values are measured at build-up portion. Inner via hole (IVH) Printed Circuit Board Through hole Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 139 Device_E.book Page 140 Wednesday, July 18, 2007 1:03 PM PCB PRINTED CIRCUIT BOARDS ■ Flexible Printed Circuit Boards he flexible printed circuit board is designed for high space efficiency and product design flexibility, which are now aiming at more compact and higher density mounting. It also contributes to the reduction of assembly process and to the enhancement of the reliability. T ◆ Features (1) High density mounting circuit, SMT and other most suitable flexible PCB are available. (2) High precision type for COF with flip chip mounting and wire bonding capabilities and other connector mounting type are available. ◆ Standard specifications Number of layers Substrate materials Design pattern width Design pattern spacing Through-hole / land diameter Cover lay Safety standard One side Both-side through-hole Polyimido film, non-adhesive polyimido 0.02 mm (MIN.) 0.05 mm (MIN.) 0.04 mm (MIN.) 0.05 mm (MIN.) – ø0.1 mm / ø0.3 mm (MIN.) Polyimido film, heat resistant ink, liquid soldering resist UL (94V-0) ◆ Line-up 140 Other line-up Multi-layer flexible PCB Both-side flexible PCB Single-layer flexible PCB Flex-rigid PCB Bonding Ni-Au plating Highly flexible (bending capacity) Single-side high precision flexible PCB Both-side high precision flexible PCB High density SMT Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Device_E.book Page 141 Wednesday, July 18, 2007 1:03 PM UNIT PICKUP ■ Slim Combo Drive Pickup ◆ Features ● Thin type pickup compatible with half-inch-height drive (12.7 mm thickness) ● Playback speed: ×8 (DVD-ROM), ×24 (CD-ROM) ● Recording speed: ×24 (CD-R), ×24 (CD-RW) ● DVD-RAM readable ● Outline dimensions: W 38.6 × H 7.3 × D 48.7 (mm) ● Weight: Approx. 15 g ■ Slim DVD-ROM Drive Pickup ◆ Features ● Thin type pickup compatible with half-inch-height drive (12.7 mm thickness) ● Playable disk: DVD-ROM/RAM, CD-ROM ● Playback speed: ×8 (DVD-ROM), ×24 (CD-ROM) ● Outline dimensions: W 38.7 × H 7.3 × D 48.7 (mm) ● Weight: Approx. 8 g ■ DVD Pickup for Automotive Use ◆ Features Compact, thin (7.3 mm) pickup Playable disk: DVD-ROM, CD-ROM Operating temperature: –30 to +85°C Outline dimensions: W 30.2 × H 7.3 × D 48.7 (mm) Unit ● ● ● ● Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 141 E_index.fm Page 142 Friday, July 20, 2007 3:20 PM INDEX INDEX GL3HY43.........................................113 BS GH1 GL3HY44.........................................113 GL5 BS1C1UR100A............................... 121 GH16P24A8C ................................. 120 GL3HY62.........................................113 GL513F........................................... 101 BS1F6JP100A ................................ 122 GH16P30A8C ................................. 120 GL3HY63.........................................113 GL514............................................. 101 BS1F6JP300A ................................ 122 GH16P35A8C ................................. 120 GL3HY8...........................................113 GL537............................................. 101 BS1F6JU300A................................ 122 GH17805B2AS ............................... 120 GL3JE402B0SE ..............................111 GL538............................................. 101 BS1R8AR100A............................... 122 GH17P24C8C ................................. 120 GL3JG402B0SE..............................111 GL560............................................. 101 BS1R8EL100A ............................... 121 GH17P28A8C ................................. 120 GL3JJ404B0SE...............................111 GL561............................................. 101 GL3JJ804B0SE...............................111 GL5CU44........................................ 115 BS1R8EL400A ............................... 121 GL0 GL3JR402B0S3 ..............................111 GL5ED44........................................ 115 BS1R8EL500A ............................... 121 GL0ZJ042B0S ................................ 111 GL3JS404B0SE ..............................111 GL5ED5.......................................... 115 BS2F7HZ6460................................ 124 GL0ZS042B0S................................ 111 GL3JS804B0SE ..............................111 GL5ED60........................................ 115 BS2F7VZ0165 ................................ 124 GL0ZV042B0S................................ 111 GL3JV404B0SE ..............................111 GL5EG261B0SB ............................ 113 BS1R8EL200A ............................... 121 GL3JV804B0SE ..............................111 GL5EG4.......................................... 113 BS2F7VZ7395 ................................ 124 GL1 GL3KG43 ........................................113 GL5EG40........................................ 113 BS2S7HZ0502................................ 123 GL100MD1MP1 .............................. 101 GL3KG44 ........................................113 GL5EG41........................................ 113 BS2S7HZ6306................................ 123 GL100MN0MP ................................ 101 GL3KG62 ........................................113 GL5EG43........................................ 113 BS520E0F ........................................ 94 GL100MN1MP ................................ 101 GL3KG63 ........................................113 GL5EG44........................................ 113 GL100MN3MP ................................ 101 GL3KG8 ..........................................113 GL5EG47........................................ 113 GL3PR43.........................................113 GL5EG60........................................ 113 GL2 GL3PR44.........................................113 GL5EG8.......................................... 113 BS2F7VZ0460 ................................ 124 DC DC2J1AZxxx................................... 130 142 GL2EG6 .......................................... 113 GL3PR63.........................................113 GL5EJJ502C0X.............................. 115 DD GL2HD6 .......................................... 113 GL3PR8...........................................113 GL5EP5 .......................................... 115 DD-30 ............................................. 141 GL2HY6 .......................................... 113 GL3TR43.........................................112 GL5FG43........................................ 113 DD-56 ............................................. 141 GL2PR6 .......................................... 113 GL3TR44.........................................112 GL5HD261B0SB ............................ 113 GL3TR8...........................................112 GL5HD4.......................................... 113 GA GL3 GL3UR402B0S................................112 GL5HD40........................................ 113 GA104T1M1MZ ................................ 99 GL380 ............................................. 101 GL3UR43 ........................................112 GL5HD41........................................ 113 GA1A1S201WP................................ 97 GL381 ............................................. 101 GL3UR44 ........................................112 GL5HD43........................................ 113 GA1A2S100LY.................................. 97 GL382 ............................................. 101 GL3UR8 ..........................................112 GL5HD44........................................ 113 GA1A2S100SS................................. 97 GL390 ............................................. 101 GL3ZJ402B0SE ..............................111 GL5HD47........................................ 113 GA202TXV15J.................................. 98 GL390V........................................... 101 GL3ZJ802B0SE ..............................111 GL5HD60........................................ 113 GA202TXV15K ................................. 98 GL3B2402B0SC ............................. 112 GL3ZR402B0SE..............................111 GL5HD8.......................................... 113 GA210TXV8SY................................. 98 GL3BC302B0S2 ............................. 112 GL3ZR802B0SE..............................111 GL5HP5.......................................... 115 GA220T2L1IZ ................................... 96 GL3ED8 .......................................... 115 GL3ZS402B0SE..............................111 GL5HS40........................................ 113 GA230TXR1ZY................................. 98 GL3EG41 ........................................ 113 GL3ZS802B0SE..............................111 GL5HS41........................................ 113 GA230TXW6SY................................ 98 GL3EG43 ........................................ 113 GL3ZV402B0SE..............................111 GL5HS43........................................ 113 GA250T6C3SY................................. 98 GL3EG44 ........................................ 113 GL3ZV802B0SE..............................111 GL5HS44........................................ 113 GA250T6C4SY................................. 98 GL3EG62 ........................................ 113 GA301TXW5MZ ............................... 98 GL3EG63 ........................................ 113 GL4 GL5HS8.......................................... 113 GL3EG8 .......................................... 113 GL4100E0000F...............................101 GL5HY40........................................ 113 GH0 GL3G2402B0SC ............................. 112 GL453E00000F...............................101 GL5HY41........................................ 113 GH04020A2GE............................... 120 GL3HD43 ........................................ 113 GL4800E0000F...............................101 GL5HY43........................................ 113 GH06P24A2C................................. 120 GL3HD44 ........................................ 113 GL480E00000F...............................101 GL5HY44........................................ 113 GH07805C2K ................................. 120 GL3HD62 ........................................ 113 GL4EG8 ..........................................113 GL5HY8.......................................... 113 GH07825C2K ................................. 120 GL3HD63 ........................................ 113 GL4HD8 ..........................................113 GL5JJ302B0SE .............................. 111 GH07P24C1C................................. 120 GL3HD8 .......................................... 113 GL4HS8...........................................113 GL5JJ7D2D0SE ............................. 111 GH07P24C4C................................. 120 GL3HS43 ........................................ 113 GL4HY8...........................................113 GL5JS302B0SE ............................. 111 GH07P28A1C................................. 120 GL3HS44 ........................................ 113 GL4KG8 ..........................................113 GL5JS7D2D0SE............................. 111 GH07P28A4C................................. 120 GL3HS62 ........................................ 113 GL4PR8...........................................113 GL5JV302B0SE ............................. 111 GL5HS47........................................ 113 GL3HS63 ........................................ 113 GL5JV7D2D0SE............................. 111 GL3HS8 .......................................... 113 GL5KG41........................................ 113 E_index.fm Page 143 Friday, July 20, 2007 3:20 PM INDEX INDEX GL5KG43........................................ 113 GL8HD22 ........................................ 113 GM1JE35200AE..............................116 GM5BW96370A.............................. 118 GL5KG44........................................ 113 GL8HD23 ........................................ 113 GM1JE55200AE..............................116 GM5CA96320A .............................. 118 GL5KG8.......................................... 113 GL8HD25 ........................................ 113 GM1JJ35200AE ..............................116 GM5CV96320A .............................. 118 GL5PR261B0SB............................. 113 GL8HD26 ........................................ 113 GM1JJ40300AE ..............................116 GM5CY96320A .............................. 118 GL5PR4.......................................... 113 GL8HD4 .......................................... 113 GM1JJ55200AE ..............................116 GM5EG95200A .............................. 117 GL5PR40........................................ 113 GL8HD42 ........................................ 113 GM1JR35200AE .............................116 GM5GC01250AC............................ 116 GL5PR41........................................ 113 GL8HD5 .......................................... 113 GM1JS35200AE..............................116 GM5GC03210Z .............................. 116 GL5PR44........................................ 113 GL8HP5 .......................................... 115 GM1JS40300AE..............................116 GM5GC05240AC............................ 116 GL5PR8.......................................... 113 GL8HS21 ........................................ 113 GM1JS55200AE..............................116 GM5GC96260AC............................ 116 GL5TR43 ........................................ 112 GL8HS22 ........................................ 113 GM1JV35200AE..............................116 GM5GC96270A .............................. 116 GL5TR8 .......................................... 112 GL8HS25 ........................................ 113 GM1JV40300AE..............................116 GM5HD95200A .............................. 117 GL5UR2K ....................................... 112 GL8HS29 ........................................ 113 GM1JV55200AE..............................116 GM5SE01200A............................... 116 GL5UR2K1 ..................................... 112 GL8HY21 ........................................ 113 GM1UR55200A...............................117 GM5SJ01250AL ............................. 116 GL5UR3K ....................................... 112 GL8HY22 ........................................ 113 GM1WA55311A ..............................119 GM5UR95200A .............................. 117 GL5UR3K1 ..................................... 112 GL8HY23 ........................................ 113 GM1ZJ40300AE..............................116 GM5WA06250A.............................. 119 GL5UR44........................................ 112 GL8HY25 ........................................ 113 GM1ZJ80300AE..............................116 GM5WA06250Z .............................. 119 GL5ZJ152B0SE.............................. 111 GL8HY26 ........................................ 113 GM1ZR40300AE.............................116 GM5WA06256A.............................. 119 GL5ZJ302B0SE.............................. 111 GL8HY29 ........................................ 113 GM1ZR80300AE.............................116 GM5WA06256Z .............................. 119 GL5ZR152B0SE............................. 111 GL8HY42 ........................................ 113 GM1ZS40300AE .............................116 GM5WA06260A.............................. 119 GL5ZR302B0SE............................. 111 GL8HY5 .......................................... 113 GM1ZS80300AE .............................116 GM5WA06270A.............................. 119 GL5ZS152B0SE ............................. 111 GL8KG21 ........................................ 113 GM1ZV40300AE .............................116 GM5WA94200A.............................. 119 GL5ZS302B0SE ............................. 111 GL8KG22 ........................................ 113 GM1ZV80300AE .............................116 GM5ZJ01200A ............................... 116 GL5ZV152B0SE ............................. 111 GL8KG25 ........................................ 113 GL5ZV302B0SE ............................. 111 GL8KG26 ........................................ 113 GM4 GM5ZR01200A............................... 116 GL8KG29 ........................................ 113 GM4BC83200AC.............................116 GM5ZR03200Z............................... 116 GL6 GL8KG42 ........................................ 113 GM4BW63360A ..............................118 GM5ZR05240A............................... 116 GL610T........................................... 101 GL8PR21 ........................................ 113 GM4BW63370A ..............................118 GM5ZR96260AE ............................ 116 GL6CU7.......................................... 115 GL8PR22 ........................................ 113 GM4BW83380A ..............................118 GM5ZR96270A............................... 116 GL6EG11T ..................................... 113 GL8PR25 ........................................ 113 GM4BW83390A ..............................118 GM5ZRB01210A ............................ 117 GL6EG26T ..................................... 113 GL8PR26 ........................................ 113 GM4GC83200AC ............................116 GM5ZRG01210A............................ 117 GL6UR11T ..................................... 112 GL8PR28 ........................................ 113 GM4WA10200A ..............................119 GM5ZS01200A............................... 116 GL6UR26T ..................................... 112 GL8PR29 ........................................ 113 GM4WA25300A ..............................119 GM5ZS03200Z ............................... 116 GL6UR31........................................ 112 GL8PR42 ........................................ 113 GM4ZJ83200AE..............................116 GM5ZV01200A............................... 116 GL6ZJ27......................................... 111 GL8TR21 ........................................ 112 GM4ZR83200AE.............................116 GM5ZV03200Z ............................... 116 GL6ZR27 ........................................ 111 GL8TR42 ........................................ 112 GM4ZS83200AE .............................116 GM5ZV96260AE ............................ 116 GL6ZS27 ........................................ 111 GL8UR21 ........................................ 112 GM4ZV83200AE .............................116 GM5ZV96270A............................... 116 GM5ZJ03200Z................................ 116 GL6ZV27 ........................................ 111 GL9 GM5 GP1 GL8 GL9ED2 .......................................... 115 GM5BC01250AC.............................116 GP1A037RDKJF .............................. 90 GL8ED5.......................................... 115 GL9ED4 .......................................... 115 GM5BC03210Z ...............................116 GP1A038RBK0F .............................. 90 GL8EG2.......................................... 113 GL9EH2 .......................................... 115 GM5BC05240AC.............................116 GP1A038RCK0F .............................. 90 GL8EG21........................................ 113 GL9HP2 .......................................... 115 GM5BC96260AC.............................116 GP1A044RCKLF .............................. 90 GM5BC96270A ...............................116 GP1A046RBZLF............................... 90 GL8EG22........................................ 113 GL8EG23........................................ 113 GM1 GM5BG01210A...............................117 GP1A047RBZLF............................... 90 GL8EG25........................................ 113 GM1BC35370AC ............................ 116 GM5BW01300A ..............................118 GP1A047RDZLF .............................. 90 GL8EG26........................................ 113 GM1BC55255AC ............................ 116 GM5BW01301A ..............................118 GP1A05A2J00F................................ 87 GL8EG29........................................ 113 GM1EG35200A............................... 117 GM5BW01311A ..............................118 GP1A05A5J00F................................ 87 GL8EG4.......................................... 113 GM1EG55200A............................... 117 GM5BW05340A ..............................118 GP1A05AJ000F................................ 87 GL8EG42........................................ 113 GM1GC55310AC............................ 116 GM5BW05343A ..............................118 GP1A05E2J00F................................ 87 GL8EG5.......................................... 113 GM1HD55200A............................... 117 GM5BW53340A ..............................118 GP1A05EJ000F................................ 87 GL8HD2.......................................... 113 GM1HS55200A............................... 117 GM5BW94320A ..............................118 GP1A073LCS ................................... 87 GL8HD21........................................ 113 GM1HY55200A............................... 117 GM5BW96320A ..............................118 GP1A30RJ000F ............................... 90 143 E_index.fm Page 144 Friday, July 20, 2007 3:20 PM INDEX INDEX 144 GP1A44E1J00F................................ 89 GP1S196HCZ0F............................... 83 GP1UX31RK ...................................135 GP2W1320YP0F ............................ 132 GP1A50HRJ00F............................... 86 GP1S196HCZSF .............................. 83 GP1UX51QS...................................135 GP2W3020YP ................................ 132 GP1A51HRJ00F............................... 86 GP1S25J0000F ................................ 83 GP1UX51RK ...................................135 GP2W3104YP0F ............................ 132 GP1A52HRJ00F............................... 86 GP1S27J0000F ................................ 83 GP1A52LRJ00F ............................... 86 GP1S36J0000F ................................ 90 GP2 GP2W3240YP ................................ 133 GP1A53HRJ00F............................... 86 GP1S37J0000F ................................ 83 GP2A200LCS0F................................88 GP2W3250YP ................................ 133 GP1A57HRJ00F............................... 86 GP1S39J0000F ................................ 83 GP2A221HRKA.................................91 GP2W3270XP0F ............................ 133 GP1A58HRJ00F............................... 86 GP1S44S1J00F ................................ 89 GP2A222HCKA.................................91 GP2W3270YP0F ............................ 133 GP1A73AJ000F................................ 87 GP1S50J0000F ................................ 84 GP2A22J0000F.................................88 GP2WVR01YP0F ........................... 133 GP1A75EJ000F................................ 87 GP1S51VJ000F ................................ 84 GP2A231LRSAF ...............................88 GP2Y0A02YK0F............................. 104 GP1A91LCJ00F ............................... 85 GP1S525VJ00F ................................ 84 GP2A240LCS0F................................88 GP2Y0A21YK0F............................. 103 GP1A91LRJ00F ............................... 85 GP1S52VJ000F ................................ 84 GP2A250LCS0F................................88 GP2Y0A41SK0F............................. 103 GP1A98HCZ0F ................................ 85 GP1S53VJ000F ................................ 84 GP2A25BJ000F ................................88 GP2Y0A710K0F ............................. 104 GP1FA51HRZ0F............................. 109 GP1S54J0000F ................................ 84 GP2A25J0000F.................................88 GP2Y0AH01K0F ............................ 106 GP1FAV30RK0F............................. 109 GP1S566VJ00F ................................ 84 GP2A25NJJ00F ................................88 GP2Y0D02YK0F ............................ 103 GP1FAV30TK0F ............................. 108 GP1S56TJ000F ................................ 84 GP2A28AJ000F ................................88 GP2Y0D21YK0F ............................ 103 GP1FAV31RK0F............................. 109 GP1S58VJ000F ................................ 84 GP2D032J0000F.............................105 GP2Y0D310K ................................. 103 GP1FAV31TK0F ............................. 108 GP1S59J0000F ................................ 84 GP2D03J0000F...............................105 GP2Y0D340K ................................. 103 GP1FAV50RK0F............................. 109 GP1S74PJ000F ................................ 84 GP2D061J000F...............................105 GP2Y0D413K0F............................. 103 GP1FAV50TK0F ............................. 108 GP1S93J0000F ................................ 83 GP2D062J000F...............................105 GP2Y0D805Z0F ............................. 103 GP1FAV51RK0F............................. 109 GP1S94J0000F ................................ 83 GP2D06J0000F...............................105 GP2Y0D810Z0F ............................. 103 GP1FAV51TK0F ............................. 108 GP1S95J0000F ................................ 83 GP2D071J000F...............................105 GP2Y1010AU0F ............................. 106 GP1FAV55TK0F ............................. 108 GP1S96J0000F ................................ 83 GP2D07J0000F...............................105 GP2Y2A180K0F ............................. 105 GP1FD210RP0F ............................ 109 GP1S97J0000F ................................ 83 GP2D120XJ00F ..............................103 GP2Y2A280K0F ............................. 105 GP1FD210TP0F............................. 108 GP1UD26XK00F............................. 135 GP2D12J0000F...............................103 GP2Y2D160K0F............................. 105 GP1FD310TP0F............................. 108 GP1UD27XK00F............................. 135 GP2D150AJ00F ..............................103 GP2Y2E101K0F ............................. 105 GP1FD320TP0F............................. 108 GP1UD28XK00F............................. 135 GP2D150MJ00F..............................103 GP2Y2E301K0F ............................. 105 GP1FM313TZ0F............................. 108 GP1UD28YK00F............................. 135 GP2D15J0000F...............................103 GP2Y3A001K0F ............................. 104 GP1FM513TZ0F............................. 108 GP1UE26RK0VF ............................ 135 GP2L24J0000F .................................88 GP2Y3A002K0F ............................. 104 GP1FM55HTZ0F ............................ 108 GP1UE26XK0VF ............................ 135 GP2S24J0000F.................................87 GP2Y3A003K0F ............................. 104 GP1FMV31RK0F............................ 109 GP1UE27RK0VF ............................ 135 GP2S27J0000F.................................87 GP2Y40010K0F ............................. 106 GP1FMV31TK0F ............................ 108 GP1UE27XK0VF ............................ 135 GP2S29SJ000F ................................91 GP2Y5D91S00F............................. 103 GP1FMV51RK0F............................ 109 GP1UE28QK0VF ............................ 135 GP2S40J0000F.................................87 GP1FMV51TK0F ............................ 108 GP1UE28RK0VF ............................ 135 GP2S60.............................................87 GP5 GP1FP513RK0F............................. 109 GP1UE28XK0VF ............................ 135 GP2S700HCP ...................................87 GP5FM5R01AZ .............................. 110 GP1FP513TK0F ............................. 108 GP1UE28YK0VF ............................ 135 GP2TC1J0000F ..............................106 GP5FM5T01AZ .............................. 110 GP1FSV31TK0F............................. 108 GP1UE29QK0VF ............................ 135 GP2U06J0000F...............................106 GP1FSV51TK0F............................. 108 GP1UF31xXP0F ............................. 135 GP2W0004XP0F.............................132 GW GP1L50J0000F ................................ 85 GP1UF31xYP0F ............................. 135 GP2W0004YP0F.............................132 GW01M59001PE............................ 119 GP1L51J0000F ................................ 85 GP1UM26RK0VF............................ 135 GP2W0110VX.................................133 GP1L52VJ000F ................................ 85 GP1UM26XK0VF............................ 135 GP2W0110VY.................................133 HPD GP1L53VJ000F ................................ 85 GP1UM27RK0VF............................ 135 GP2W0112YP0F.............................133 HPD-66........................................... 141 GP1L57J0000F ................................ 85 GP1UM27XK0VF............................ 135 GP2W0116YP0F.............................133 GP1S036HEZ................................... 90 GP1UM28QK0VF ........................... 135 GP2W0118YP0F.............................133 IR2 GP1S092HCPIF ............................... 83 GP1UM28RK0VF............................ 135 GP2W0150XP0F.............................133 IR2D071 ........................................... 52 GP1S093HCZ0F .............................. 83 GP1UM28XK0VF............................ 135 GP2W0150YP0F.............................133 IR2D20U........................................... 52 GP1S094HCZ0F .............................. 83 GP1UM28YK0VF............................ 135 GP2W1001YP0F.............................132 IR2E46Y6 ......................................... 51 GP1S096HCZ0F .............................. 83 GP1UM29QK0VF ........................... 135 GP2W1002YP0F.............................132 IR2E47U6 ......................................... 51 GP1S097HCZ0F .............................. 83 GP1US30XP ................................... 135 GP2W1004YP0F.............................132 IR2E49U ........................................... 51 GP1S194HCZ0F .............................. 83 GP1UV70QS00F ............................ 135 GP2W1010YP0F.............................132 IR2E51Y6 ......................................... 51 GP1S195HCPSF.............................. 83 GP1UW70QS00F ........................... 135 GP2W1302YP0F.............................132 GP1S195HCZSF .............................. 83 GP1UX31QS................................... 135 GP2W1304YP.................................132 GP2W3120YP0F ............................ 132 E_index.fm Page 145 Friday, July 20, 2007 3:20 PM INDEX INDEX LH16B9 .............................................25 LHF00L11.................................... 36/39 LH16BP.............................................25 LHF00L14.................................... 36/39 IR3 IRM IR3C14N1.................................... 52/54 IRM046U7......................................... 53 IR3C22N........................................... 52 IRM047U7......................................... 53 LH2 LHF00L24.................................... 36/39 IR3E11A1 ......................................... 30 IRM048U7......................................... 53 LH28F128BFH-PBTL ........................35 LHF00L25.................................... 36/39 IR3E11M1......................................... 30 IRM053U7......................................... 53 LH28F128BFH-PTTL ...................35/37 LHF00L28.................................... 36/39 IR3E11P1 ......................................... 30 IRM060U7......................................... 53 LH28F128BFH-PWTL .......................37 LHF00L29.................................... 36/39 IR3E12M1......................................... 30 IRM063U7......................................... 53 LH28F128BFHED-PWTLT2 ..............40 LHF00L34.................................... 36/39 IR3E13N ........................................... 30 IRM065U7......................................... 53 LH28F128BFHT-PTTLT1A ................40 LHF00L15.................................... 36/39 LH28F128BFHT/B-PBTL75A ............38 LJ IR3E2015.......................................... 30 IS LH28F128BFHT/B-PTTL75A ............38 LJ089MB2S01 .................................. 14 IR3E2045.......................................... 30 IS1623Q............................................ 98 LH28F128SPH-PTL ..........................37 LJ64H034 ......................................... 14 IR3E3XX........................................... 30 IS1682Q............................................ 98 LH28F128SPHT-PTL12B ..................40 IR3M16U ..................................... 30/50 IS1684Q............................................ 98 LH28F160BJH-PBTL.........................35 LK IR3M17U .......................................... 49 IS471FE ............................................ 96 LH28F160BJH-PTTL.........................35 LK460D3LZ19 .................................. 10 IR3M18N .......................................... 48 IS485E .............................................. 95 LH28F160BJHE-PBTL70 ..................38 LK460D3LZxx................................... 10 IR3M19N .......................................... 48 IS486E .............................................. 95 LH28F160BJHE-PTTL70 ..................38 LK520D3LZ19 .................................. 10 IR3M30M ................................ 30/49/50 IS489E .............................................. 96 LH28F256BF-PTSL...........................36 LK520D3LZxx................................... 10 LH28F256BFH-PTTL ........................37 LK645D3LZ29 .................................. 10 LK645D3LZ2U.................................. 10 IR3E13U ........................................... 30 IR3M30U ................................ 30/49/50 IR3M48U6 ........................................ 50 LH1 LH28F256BFHTD-PTTLZ3 ...............40 IR3M49U6 ........................................ 50 LH1530 ............................................. 26 LH28F256BFN-PTSLZ2....................39 IR3M52Y7......................................... 50 LH1537 ............................................. 26 LH28F320BFH-PTTL ........................37 LM IR3M55U ..................................... 19/50 LH1538 ............................................. 26 LH28F320BFHE-PTTLE0..................40 LM046QB1S02 ................................... 9 IR3M56N .......................................... 49 LH1542 ............................................. 26 LH28F512BFBD-PTSL......................36 LM050QC1T01 ................................... 9 IR3M57N .......................................... 49 LH1548 ............................................. 26 LH28F512BFBD-PTSLZ2..................39 LM077VS1T01.................................... 9 IR3M58M ................................ 30/49/50 LH1549 ............................................. 26 LH28F512BFBD-PTSLZ4..................39 LM081HB1T01B ................................. 9 IR3M58U ................................ 30/49/50 LH1560 ............................................. 26 LH28F512BFND-PTSL......................36 LM085YB1T01.................................... 9 IR3M59U ........................... 19/22/23/50 LH1562 ............................................. 26 LH28F512BFND-PTSLZ1 .................39 LM089HB1T04 ................................... 9 IR3M61U ..................................... 19/50 LH1565 ............................................. 26 LH28F640BF-PTTL...........................36 LM32019P .......................................... 9 IR3M63U ........................... 19/21/24/50 LH1580 ............................................. 26 LH28F640BFH-PBTL ...................35/37 LM32019T .......................................... 9 IR3R55M1 ........................................ 54 LH1583 ............................................. 26 LH28F640BFH-PTTL ...................35/37 IR3R58M1 ........................................ 54 LH15H1............................................. 28 LH28F640BFHE-PBTLHK.................40 LQ0 IR3R59N1......................................... 54 LH15JA ............................................. 28 LH28F640BFHE-PTTLH1A...............40 LQ025A3DS01 ................................. 13 IR3T46U ........................................... 51 LH15KA............................................. 28 LH28F640BFHE-PTTLHFA ...............38 LQ031B5DG01 ................................. 11 IR3T46U6 ......................................... 51 LH15LA ............................................. 28 LH28F640BFHE/G-PBTL70A............38 LQ033B5DG02 ................................. 11 IR3T47G ...................................... 19/20 LH1687 ............................................. 26 LH28F640BFHG-PTTL70A ...............38 LQ035Q3DG01................................... 9 IR3Y18A1 .................................... 29/53 LH168Y ............................................. 26 LH28F640BFN-PTTLZ1A..................39 LQ035Q5DG02................................. 11 IR3Y26A2 .................................... 29/53 LH1691 ........................................ 25/26 LH28F640SPH-PL.............................37 LQ038Q3DC01................................... 9 IR3Y26A6 .................................... 29/53 LH1694 ............................................. 25 LH28F640SPHT-PL12B ....................40 LQ050Q5DR01................................... 9 IR3Y29A1 .................................... 29/53 LH169C............................................. 27 LH28F800BJ-PBTL ...........................35 LQ057Q3DC12................................... 9 IR3Y29B1 .................................... 29/53 LH169H............................................. 26 LH28F800BJ-PTTL ...........................35 LQ057V3DG01 ................................... 9 IR3Y30M2.................................... 18/24 LH169J.............................................. 25 LH28F800BJE-PBTL90.....................38 LQ061T5GG01 ................................. 11 IR3Y31M1.................................... 29/53 LH16AD ............................................ 25 LH28F800BJE-PTTL90.....................38 LQ064V3DG01 ................................... 9 IR3Y34M1.................................... 29/53 LH16AE............................................. 25 LH28F800BJH-PBTL.........................35 LQ064V3DG04 ................................... 9 IR3Y37A1 .................................... 29/53 LH16AF............................................. 25 LH28F800BJH-PTTL.........................35 LQ065T5DG02 ................................. 11 IR3Y48A3 .................................... 18/23 LH16AM ............................................ 25 LH28F800BJHE-PBTL90 ..................38 LQ065T5GG61 ................................. 11 IR3Y48A5 .................................... 18/23 LH16AP............................................. 27 LH28F800BJHE-PTTL90 ..................38 LQ065T9DZ03.................................. 11 IR3Y48B1 .................................... 18/23 LH16AR ............................................ 26 IR3Y50U6 .................................... 18/24 LH16AV............................................. 26 LHF LQ070T5GG21 ................................. 12 IR3Y60U6 .................................... 18/23 LH16AW............................................ 25 LHF00L08.....................................36/39 LQ070Y5DE02 ................................. 12 IR3Y63M...................................... 29/53 LH16B5 ............................................. 25 LHF00L09.....................................36/39 LQ070Y5DG05 ................................. 12 LH16B6 ............................................. 25 LHF00L10.....................................36/39 LQ070Y5DG06 ................................. 12 LQ070T5DR05 ................................. 12 145 E_index.fm Page 146 Friday, July 20, 2007 3:20 PM INDEX INDEX LRS18BN ..........................................41 LZ0P393D ........................................ 15 LQ080Y5CGXX ................................ 12 LR3 LRS18BT...........................................41 LZ0P393M ........................................ 15 LQ080Y5DG03 ................................. 12 LR35501 ........................................... 31 LRS18C8C ........................................41 LZ0P394K......................................... 15 LQ080Y5DG04 ................................. 12 LR35501Y ......................................... 31 LRS18CCA........................................41 LZ0P3955 ......................................... 15 LQ084S3DG01 ................................... 9 LR366851 ............................... 18/23/24 LRS18CJ...........................................41 LZ0P395V......................................... 15 LQ084S3LG01.................................... 9 LR36687U......................................... 18 LRS18CK ..........................................41 LZ0P396K......................................... 15 LQ084V1DG21 ................................... 9 LR36687Y ......................................... 18 LRS18CP ..........................................41 LZ0P399A......................................... 15 LQ084V3DG01 ................................... 9 LR36689U......................................... 18 LRS5751 ......................................29/53 LZ0P39AG ........................................ 15 LQ085Y3DG03 ................................... 9 LR3697A ........................................... 26 LRS5752 ......................................29/53 LZ0P39DS ........................................ 15 LQ085Y3DG04 ................................... 9 LR36B11 ...................................... 18/20 LQ088H9DZ03 ................................. 12 LR385851 .................................... 18/24 LS LR386032 .................................... 19/23 LS022Q8UX05 ..................................13 LQ1 LR386071 .................................... 19/23 LS025A8DZ01...................................13 PC1 LQ104S1DG21 ................................... 8 LR38627 ...................................... 19/24 LS027T3DG01 ..................................13 PC1231xNSZ0F ............................... 70 LQ104S1DG31 ................................... 8 LR386431 .................................... 18/22 LS028B7UX01...................................13 PC123J00000F................................. 70 LQ104S1DG61 ................................... 8 LR386433 .................................... 18/22 LQ104S1LG21.................................... 8 LR38653 ...................................... 18/21 LT1 PC2 LQ104S1LG31.................................... 8 LR38654 ...................................... 19/21 LT1D40A..........................................117 PC2SD11NTZAF .............................. 76 LQ104S1LG61.................................... 8 LR38667 ...................................... 18/20 LT1D67A..........................................117 LQ104V1DG21 ................................... 9 LR38675 ...................................... 18/20 LT1E40A..........................................117 PC3 LQ104V1DG51 ................................... 9 LR38677 ...................................... 18/20 LT1E67A..........................................117 PC352NJ000F .................................. 68 LQ104V1DG61 ................................... 9 LR38678 ...................................... 18/20 LT1ED67A .......................................118 PC354NJ0000F ................................ 68 LQ104V1DG64 ................................... 9 LR38822A ......................................... 27 LT1EH67A .......................................118 PC355NJ0000F ................................ 68 LQ104V1DW02................................... 9 LR38825 ........................................... 27 LT1F67A..........................................117 PC357NJ0000F ................................ 68 LQ104V1LG61.................................... 9 LR38826 ........................................... 27 LT1F67AF........................................117 PC364NJ0000F ................................ 68 LQ121S1DG41 ................................... 8 LR38844A ......................................... 28 LT1H40A..........................................117 PC365NJ0000F ................................ 68 LQ121S1DG61 ................................... 8 LR38869A ......................................... 27 LT1H67A..........................................117 PC367NJ0000F ................................ 68 LQ121S1LG41.................................... 8 LR388733 ......................................... 31 LT1JS67A........................................116 PC3H2J00000F ................................ 69 LQ121S1LG61.................................... 8 LR38875 ........................................... 31 LT1JV67A........................................116 PC3H3J00000F ................................ 69 LQ121S1LG64.................................... 8 LR38886 ........................................... 31 LT1K40A..........................................117 PC3H41xNIP0F ................................ 69 LQ121S1LW01 ................................... 8 LR38888 ........................................... 31 LT1K67A..........................................117 PC3H4J00000F ................................ 69 LQ121S7LY01..................................... 8 LR388B3 ........................................... 31 LT1KS67A .......................................118 PC3H510NIP0F................................ 69 LQ121S7LY11..................................... 8 LR388B6 ........................................... 31 LT1P40A..........................................117 PC3H5J00000F ................................ 69 LQ150X1LGB1 ................................... 8 LR388B61 ......................................... 31 LT1P67A..........................................117 PC3H71xNIP0F ................................ 69 LQ150X1LGB2 ................................... 8 LR388D0........................................... 27 LT1S40A..........................................117 PC3H7J00000F ................................ 69 LQ150X1LGN2A................................. 8 LR388D1...................................... 27/31 LT1S67A..........................................117 PC3HU7NYIP0F............................... 69 LT1U40A..........................................117 PC3Q41xNIP0F................................ 69 LT1U67A..........................................117 PC3Q510NIP0F................................ 69 LQ075V3DG01 ................................... 9 LQ150X1LGN2E................................. 8 LQ150X1LW71N................................. 8 LR5 LQ150X1LW72 ................................... 8 LR550R03......................................... 34 146 LZ2326A3 .................................... 17/24 PC3Q62J0000F................................ 69 LT3 PC3Q63J0000F................................ 69 LRS LT3D31W.........................................113 PC3Q64QJ000F ............................... 69 LQ190E1LW01 ................................... 8 LQ190E1LW41 ................................... 8 LZ2316A3 .................................... 17/24 LRS1871A......................................... 41 LT3D65W.........................................113 PC3Q65J0000F................................ 69 LQ2 LRS1872A......................................... 41 LT3E31W.........................................113 PC3Q67QJ000F ............................... 69 LQ201U1LW11Z................................. 8 LRS18831 ......................................... 41 LT3E65W.........................................113 PC3Q71xNIP0F................................ 69 LQ201U1LW21 ................................... 8 LRS18841 ......................................... 41 LT3H31W.........................................113 PC3SD11NTZAF .............................. 76 LQ231U1LW01 ................................... 8 LRS1890A......................................... 41 LT3H65W.........................................113 PC3SD11NTZBF .............................. 76 LQ231U1LW21 ................................... 8 LRS1897 ........................................... 41 LT3P31W.........................................113 PC3SD11NTZCF.............................. 76 LQ281L1LW11.................................... 8 LRS18A6........................................... 41 LT3P65W.........................................113 PC3SD11YTZDF .............................. 76 LQ281L1LW14.................................... 8 LRS18AZ .......................................... 41 LT3S65W.........................................113 PC3SD12NTZAF .............................. 76 LQ283G1TW11 .................................. 8 LRS18B0........................................... 41 PC3SD21NTZBF .............................. 77 LRS18BK .......................................... 41 LZ PC3SD21NTZCF.............................. 77 LRS18BL........................................... 41 LZ0P392N .........................................15 PC3SD21NTZDF.............................. 77 E_index.fm Page 147 Friday, July 20, 2007 3:20 PM INDEX INDEX PC3SD21YTZEF .............................. 77 PC8171xNSZ0F................................ 70 PQ070XF02SZH ...............................42 PQ1RxxJ0000H series ..................... 44 PC3SD23YTZCF .............................. 77 PC817XJ0000F................................. 70 PQ070XH01ZPH...............................47 PQ1Uxx1M2ZPH series ................... 44 PC3SF11YVZAF .............................. 76 PC844XJ0000F................................. 70 PQ070XH02ZPH...............................47 PQ1XAxx1MZPH series ................... 44 PC3SF11YVZBF .............................. 76 PC845XJ0000F................................. 70 PQ070XN01ZPH...............................45 PQ1Xxx1M2ZPH series.................... 44 PC3SF21YVZAF .............................. 77 PC847XJ0000F................................. 70 PQ070XNA1ZPH...............................45 PC3SF21YVZBF .............................. 77 PC851XJ0000F................................. 70 PQ070XNAHZPH..............................45 PQ2 PC3SF23YVZSF .............................. 77 PC852XJ0000F................................. 70 PQ070XNB1ZPH...............................45 PQ200WN3MZPH ............................ 46 PC3SG11YIZ0F................................ 76 PC853XJ0000F................................. 70 PQ070XZ01ZPH ...............................45 PQ200WNA1ZPH............................. 46 PQ070XZ02ZPH ...............................46 PQ20RX05J00H ............................... 42 PC3SH11YFZAF .............................. 76 PC9 PQ070XZ1HZPH...............................46 PQ20RX11J00H ............................... 42 PC3SH13YFZAF .............................. 76 PC900V0NSZXF............................... 73 PQ070XZ5MZPH series....................45 PQ20VZ11J00H ............................... 46 PC3SH21YFZBF .............................. 77 PC901V0NSZXF............................... 73 PQ07VR5MAPH series .....................45 PQ20VZ51J00H ............................... 46 PC3ST11NSZAF .............................. 76 PC910L0NSZ0F................................ 73 PC3SG21YIZ0F................................ 77 PQ20WZ11J00H .............................. 46 PC911L0NSZ0F................................ 73 PQ1 PQ20WZ51J00H .............................. 46 PC912L0NSZ0F................................ 73 PQ150RWA2SZH..............................42 PQ2CF1J0000H ............................... 49 PC4 PC923L0NSZ0F................................ 74 PQ150VB01FZH ...............................42 PQ2Lxxx2MSPQ .............................. 44 PC400J00000F................................. 72 PC924L0NSZ0F................................ 74 PQ150VB02FZH ...............................42 PC401J00000F................................. 72 PC925L0NSZ0F................................ 74 PQ15RW08J00H...............................42 PQ3 PC410L0NIP0F ................................ 72 PC928J00000F ................................. 74 PQ15RW11J00H...............................42 PQ30RV11J00H ............................... 42 PC410S0NIP0F ................................ 72 PC929J00000F ................................. 74 PQ15RW21J00H...............................42 PQ30RV21J00H ............................... 42 PC411L0NIP0F ................................ 72 PC942J00000F ................................. 74 PQ1CG2032FZH...............................49 PQ30RV31J00H ............................... 42 PC411S0NIP0F ................................ 72 PC956L0NSZ0F................................ 73 PQ1CG2032RZH ..............................49 PQ3DZ13J000H ............................... 45 PC412S0NIP0F ................................ 72 PC957L0NSZ0F................................ 74 PQ1CG21H2FZH ..............................49 PQ3DZ53J000H ............................... 45 PQ1CG21H2RZH..............................49 PQ3RD083J00H............................... 42 PC3ST21NSZBF .............................. 77 PC451J00000F................................. 68 PC456L0NIP0F ................................ 72 PD PQ1CG3032FZH...............................49 PQ3RD13J000H............................... 42 PC457L0NIP0F ................................ 73 PD100MC0MP .................................. 94 PQ1CG3032RZH ..............................49 PQ3RD23J000H............................... 42 PC457S0NIP0F ................................ 73 PD100MF0MP .................................. 94 PQ1CG38M2FZH..............................49 PQ3RF23J000H ............................... 42 PC4D10SNIP0F ............................... 72 PD101SC0SS0F ............................... 95 PQ1CG38M2RZH .............................49 PQ3RF33J000H ............................... 42 PC4H510NIP0F................................ 69 PD30CMC31MZ................................ 95 PQ1CG41H2FZH ..............................49 PC4H520NIP0F................................ 69 PD3122FE000F ................................ 94 PQ1CG41H2RZH..............................49 PQ5 PC4SD11NTZBF .............................. 76 PD410PI2E00F ................................. 94 PQ1CX12H2ZPQ ..............................48 PQ5CB11X1AP ................................ 48 PC4SD11NTZCF.............................. 76 PD411PI2E00F ................................. 94 PQ1CX22H2ZPQ ..............................48 PQ5EV3J0000H ............................... 43 PC4SD21NTZCF.............................. 77 PD412PI2E00F ................................. 94 PQ1CX41H2ZPQ ..............................48 PQ5EV5J0000H ............................... 43 PC4SD21NTZDF.............................. 77 PD413PI2E00F ................................. 94 PQ1CY1032ZPH...............................48 PQ5EV7J0000H ............................... 43 PC4SF11YVZAF .............................. 76 PD49PIE0000F ................................. 94 PQ1CYxx3HZPH series ....................48 PC4SF11YVZBF .............................. 76 PD60T............................................... 94 PQ1CYxx3LZPH series.....................48 PQ6 PQ1CZ21H2ZPH...............................48 PQ6CB11X1AP ........................... 48/51 PQ0 PQ1CZ38M2ZPH series ...................48 PQ6CB11X1CP ........................... 48/51 PQ015YZ01ZPH ............................... 46 PQ1CZ41H2ZPH...............................48 PQ6CU11X1APQ ........................ 48/51 PC7 PQ015YZ5MZPH .............................. 46 PQ1DX095MZPQ..............................47 PQ6CU12X2APQ ............................. 48 PC713V0NSZXF .............................. 71 PQ033ES1MXPQ ............................. 43 PQ1DX125MZPQ..............................47 PQ6RD083J00H............................... 42 PC714V0NSZXF .............................. 71 PQ033ES3MXPQ ............................. 43 PQ1KAxx3MZPH series....................44 PC715V0NSZXF .............................. 71 PQ035ZM02ZPH .............................. 46 PQ1Kxx3M2ZPH series ....................44 PQ7 PC724V0NSZXF .............................. 71 PQ035ZN01ZPH............................... 46 PQ1LAX95MSPQ..............................44 PQ7L2010BP............................... 48/51 PC725V0NSZXF .............................. 71 PQ035ZN1HZPH .............................. 46 PQ1LAxx3MSPQ...............................44 PQ7RV4J0000H ............................... 42 PC4SF21YVZBF .............................. 77 PC4SF21YVZCF .............................. 77 PQ050ES1MXPQ ............................. 43 PQ1LAxx5MSP series.......................44 PC8 PQ050ES3MXPQ ............................. 43 PQ1Lxx3M2SPQ...............................44 PQx PC81100NSZ0F ............................... 70 PQ05VY053ZPH............................... 47 PQ1MGX38MSPQ ............................44 PQxxDZ11J00H series ..................... 45 PC8141xNSZ0F ............................... 70 PQ05VY3H3ZPH .............................. 47 PQ1MGxx8MSPQ .............................44 PQxxDZ51J00H series ..................... 45 PC814XJ0000F ................................ 70 PQ070VK01FZH ............................... 42 PQ1MX55M2SPQ .............................44 PQxxRA11J00H series..................... 42 PC81510NSZ0F ............................... 70 PQ070VK02FZH ............................... 42 PQ1Mxx5M2SPQ..............................44 PQxxRD08J00H series..................... 42 PC815XJ0000F ................................ 70 PQ070XF01SZH ............................... 42 PQ1Nxx3MxSPQ...............................44 PQxxRD11J00H series..................... 42 147 E_index.fm Page 148 Friday, July 20, 2007 3:20 PM INDEX INDEX RJ23S3BD0ET.............................16/20 S202S15F......................................... 80 PQxxRF11J00H series ..................... 42 PT RJ23S3BE0BT .............................16/20 S202SE1F ........................................ 81 PQxxRF21J00H series ..................... 42 PT100MC0MP .................................. 93 RJ23S3CD0ET.............................16/20 S202SE2F ........................................ 81 PQxxRH11J00H series..................... 42 PT100MF0MP................................... 93 RJ23S3CE0BT.............................16/20 S202T01F......................................... 80 PQxxxDNA1ZPH series.................... 45 PT100MF1MP................................... 93 RJ23T3BB0ET .............................16/20 S202T02F......................................... 80 PQxxxDZ01ZPH series .................... 45 PT200MC0NP................................... 93 RJ23T3BC0BT .............................16/20 S208T01F......................................... 80 PQxxxEF01SZH series..................... 42 PT202MR0MP1 ................................ 93 RJ23T3CB0ET .............................16/20 S208T02F......................................... 80 PQxxxEF02SZH series..................... 42 PT380 ............................................... 93 RJ23T3CC0BT.............................16/20 S212S01F......................................... 80 PQxxxEH01ZPH............................... 47 PT380F ............................................. 93 RJ23U3BA0ET.............................16/20 S216S01F......................................... 80 PQxxxEH02ZPH............................... 47 PT381 ............................................... 93 RJ23U3BC0BT.............................16/20 S216S02F......................................... 80 PQxxxEN01ZPH series .................... 45 PT381F ............................................. 93 RJ23U3CA0ET.............................16/20 S216SE1F ........................................ 81 PQxxxENA1ZPH series.................... 45 PT4800E0000F................................. 93 RJ23U3CC0BT.............................16/20 S216SE2F ........................................ 81 PQxxxENA1ZPH series.................... 45 PT4800FE000F................................. 93 RJ23V3BA0BT .............................16/20 S2S3000F......................................... 76 PQxxxENAHZPH series ................... 45 PT480E00000F................................. 93 RJ23V3CA0BT.............................16/20 S2S4000F......................................... 77 PQxxxEZ01ZPH series..................... 45 PT480FE0000F................................. 93 RJ2411AA0PB ........................17/21/22 S2S5A00F ........................................ 76 PQxxxEZ02ZPH series..................... 45 PT4810E0000F................................. 93 RJ2411AB0PB ..............17/21/22/23/24 PQxxxEZ1HZPH series .................... 45 PT4810FJE00F................................. 93 RJ2411BA0PB ........................17/21/22 VA PQxxxEZ5MZPH series.................... 45 PT481E0000F................................... 93 RJ2411BB0PB ..............17/21/22/23/24 VA1H1ED5265................................ 126 PQxxxFZ01ZPH series..................... 45 PT481FE0000F................................. 93 RJ2411CA0PB ..................................21 VA1J5JF7007 ................................. 126 PQxxxFZ5MZPH series.................... 45 PT483F1E000F................................. 93 RJ2421AB0PB ..............17/21/22/23/24 VA1K5ED5255................................ 126 PQxxxGM02ZPH .............................. 45 PT4850FE000F................................. 93 RJ2421BB0PB ..............17/21/22/23/24 VA1R5JF7002................................. 125 PQxxxGN01ZPH series.................... 45 PT491FE0000F................................. 93 RJ2451AA0PB ..............17/21/22/23/24 VA1T1ED5065................................ 126 PQxxxGN1HZPH series ................... 45 PT493FE0000F................................. 93 RJ2451BA0PB ..............17/21/22/23/24 VA1Y2ED1401................................ 127 PQxxxRDA1SZH series.................... 42 PT501 ............................................... 93 RJ2461AA0PB ..............17/21/22/23/24 VA1Y2UF2307................................ 127 PQxxxRDA2SZH series.................... 42 PT510 ............................................... 93 RJ2461BA0PB ..............17/21/22/23/24 VA1Y2UF2312................................ 127 PQxxxY053ZPH ............................... 47 PT550 ............................................... 93 PQxxxY3H3ZPH............................... 47 PT550F ............................................. 93 RW PT600T ............................................. 93 RW-4020 ...........................................34 PT601T ............................................. 93 RW-4040 ...........................................34 PR23MF11NSZF .............................. 79 RB S1 VT1Y5ED211.................................. 128 PR26MF11NSZF .............................. 79 RB5P0010M2............................... 29/53 S101S05F .........................................80 VT1Y5JB201 .................................. 128 PR26MF12NSZF .............................. 79 RB5P0020M2............................... 29/53 S101S06F .........................................80 VT1Y5JF201................................... 128 PR26MF21NSZF .............................. 79 RB5P0050M2............................... 29/53 S101S16F .........................................80 VT1Y5UF201.................................. 128 PR29MF11NSZF .............................. 79 RB5P0060M2............................... 29/53 S102S01F .........................................80 VT2W5CD551 ................................ 127 PR29MF12NSZF .............................. 79 RB5P006AM2 .............................. 29/53 S102S02F .........................................80 PR29MF21NSZF .............................. 79 RB5P0070M................................. 29/53 S102S11F .........................................80 PR31MA11NTZF .............................. 79 RB5P0090M................................. 29/53 S102S12F .........................................80 PQxxRD21J00H series..................... 42 PR VA35JZ9904 ................................... 129 PR22MA11NTZF .............................. 79 VT VT1Y5CD201 ................................. 128 PR32MA11NTZF .............................. 79 148 VA35JZ9910 ................................... 129 S102T01F..........................................80 PR33MF51NSZF .............................. 79 RJ S102T02F..........................................80 PR36MF12NSZF .............................. 79 RJ21V3BC0ET............................. 16/20 S108T01F..........................................80 PR36MF21NSZF .............................. 79 RJ21W3BB0ET............................ 16/20 S108T02F..........................................80 PR36MF22NSZF .............................. 79 RJ21W3BC0ET............................ 16/20 S112S01F .........................................80 PR36MF51NSZF .............................. 79 RJ21Y3BA0ET............................. 16/20 S116S01F .........................................80 PR39MF11NSZF .............................. 79 RJ2311AA0PB ......... 16/17/21/22/23/24 S116S02F .........................................80 PR39MF12NSZF .............................. 79 RJ2311BA0PB .............. 16/21/22/23/24 PR39MF21NSZF .............................. 79 RJ2321AA0PB .............. 16/21/22/23/24 S2 PR39MF22NSZF .............................. 79 RJ2321BA0PB .............. 16/21/22/23/24 S201S06F .........................................80 PR39MF51NSZF .............................. 79 RJ2351AA0BB .............. 16/21/22/23/24 S202S01F .........................................80 PR3BMF11NSZF.............................. 79 RJ2351BA0AB .............. 16/21/22/23/24 S202S02F .........................................80 PR3BMF21NSZF.............................. 79 RJ2361AA0BB .............. 16/21/22/23/24 S202S11F .........................................81 RJ2361BA0AB .............. 16/21/22/23/24 S202S12F .........................................81 Specifications are subject to change without notice. All screen images are simulated. 22-22, NAGAIKE-CHO, ABENO-KU, OSAKA 545-8522, JAPAN EUROPE ASIA SHARP MICROELECTRONICS OF THE AMERICAS North American Head Office U.S.A SHARP MICROELECTRONICS EUROPE a division of Sharp Electronics (Europe) GmbH European Head Office SHARP ELECTRONICS (SHANGHAI) CO., LTD. Microelectronics Sales & Marketing Division 5700 NW Pacific Rim Boulevard Camas, WA 98607 USA PHONE: +1-360-834-2500 FAX: +1-360-834-8903 http://www.sharpsma.com Sonninstrasse 3, 20097, Hamburg, Germany PHONE: +49-1805-073507 FAX: +49-40-2376-2232 http://www.sharpsme.com Registered Address Germany: Munich Office Western Area No. 273, De Bao Road, Xin Development BLDG 58 Wai Gao Qiao Free Trade Zone, Shanghai 200131, P.R. 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Rd., Taipei, Taiwan PHONE: +886-2-2577-7341 FAX: +886-2-2577-7326/2-2577-7328 SHARP ELECTRONICS (SINGAPORE) PTE., LTD. 491B River Valley Road, #09-02/03/04 Valley Point, Singapore 248373 PHONE: +65-63042500 FAX: +65-63042598 http://www.sesl-sharp.com SHARP ELECTRONIC COMPONENTS (KOREA) CORPORATION 5F, Jeil Pharm B/D, 745-5, Banpo 1-dong, Seocho-ku, Seoul 137-810 Korea PHONE: +82-2-711-5813 FAX: +82-2-711-5819 051 The following facilities of Sharp Corporation have been certified under the ISO 14001 international standard for environmental management systems. In our products and manufacturing processes, we are actively engaged in environmental preservation efforts. Facility Headquarters and Associated Companies Group Katsuragi Works Large-Scale IC Group (Fukuyama) Nara Plant Advanced Development and Planning Center Mie Factory Electronic Components (Elecom Group) Mihara Plant AVC Liquid Crystal Display Group Communication Systems Group Hiroshima Plant Appliance Systems Group Audio-Visual Systems Group Tochigi Plant Certificate No. EC97J1037 EC99J2006 EC99J2016 EC99J2021 EC99J2038 EC99J2051 EC03J0180 EC04J0284 JQA-EM5312 JQA-EM5554 JQA-EM0339 Registration Date June 24, 1997 June 25, 1996 September 24, 1996 September 24, 1996 December 3, 1996 January 28, 1997 November 17, 2003 October 12, 2004 April 14, 2006 November 10, 2006 February 26, 1999 The following facilities of Sharp Corporation have been certified under the ISO 9001:2000 international standard for quality management systems. The following facility of Sharp Corporation has been certified as a manufacturer under the IEC Quality Assessment System for Electronic Components. Applicable standards: ISO 9001:2000 and JIS Q 9001:2000 Certifying organization: Reliability Center for Electronic Components of Japan (RCJ) Facility Compound Semiconductor Systems Division Certificate No. RCJ-94M-23J The following facility of Sharp Corporation has been certified under the ISO 9001:2000 international standard for quality management systems. SHARP CORPORATION REGISTERED TO ISO 9001 CERTIFICATE NO.A7887 Certifying organization: IL Inc. [JAB certified] Facility Compound Semiconductor Systems Division Certificate No. A7887 Distributed by Certifying organization: Japan Quality Assurance Organization (JAQ) [JAB certified] Facility Certificate No. Mobile Liquid Crystal Display Group JQA-QM3776 AVC Liquid Crystal Display Group JQA-QMA11778 Large-Scale IC Group JQA-QM8688 The contents of this catalog are current as of June, 2007. This brochure uses recycled paper and soyoil ink approved by the American Soybean Association. Ref. No. HT9A4D SHARP CORP. July 2007 H2.3 Printed in Japan