C8051F551-IMR

C8051F55x/56x/57x Mixed Signal ISP Flash MCU Family Up to 200 ksps Up to 32 external single-ended inputs VREF from on-chip VREF, external pin or VDD Internal or external start of conversion source Built-in temperature sensor intrusive in-system debug (no emulator required) Provides breakpoints, single stepping, inspect/modify memory and registers Superior performance to emulation systems using ICE-chips, target pods, and sockets Low cost, complete development kit - - instructions in 1 or 2 system clocks Up to 50 MIPS throughput with 50 MHz clock Expanded interrupt handler ec om m - tR ANALOG PERIPHERALS IQ Ve rs io n no A M U X Rev. 1.2 9/14 12-bit 200 ksps ADC Clock Sources - Internal 24 MHz with ±0.5% accuracy for CAN and - master LIN operation External oscillator: Crystal, RC, C, or clock (1 or 2 pin modes) Can switch between clock sources on-the-fly; useful in power saving modes Packages - 40-pin QFN (C8051F568-9 and ‘F570-5) - 32-pin QFP/QFN (C8051F560-7) - 24-pin QFN (C8051F550-7) Automotive Qualified - Temperature Range: –40 to +125 °C - Compliant to AEC-Q100 en Supply Voltage 1.8 to 5.25 V - Typical operating current: 19 mA at 50 MHz - Typical stop mode current: 1 µA High-Speed 8051 µC Core - Pipelined instruction architecture; executes 70% of crystal required Hardware enhanced UART, SMBus™, and enhanced SPI™ serial ports Four general purpose 16-bit counter/timers 16-bit programmable counter array (PCA) with six capture/compare modules and enhanced PWM functionality de - D es - rN On-Chip Debug - On-chip debug circuitry facilitates full speed, non- ew Programmable hysteresis and response time Configurable as interrupt or reset source Low current fo Two Comparators • • • ig n 512-byte Sectors Digital Peripherals - 33, 25, or 18 Port I/O; All 5 V tolerant - CAN 2.0 Controller—no crystal required - LIN 2.1 Controller (Master and Slave capable); no d • • • • • - Memory - 2304 bytes internal data RAM (256 + 2048 XRAM) - 32 or 16 kB Flash; In-system programmable in s Analog Peripherals - 12-Bit ADC TEMP SENSOR VREG Voltage Comparators 0-1 VREF 24 MHz PRECISION INTERNAL OSCILLATOR DIGITAL I/O UART 0 SMBus SPI PCA Timers 0-3 CAN LIN Ports 0-4 Crossbar External Memory Interface 2x Clock Multiplier HIGH-SPEED CONTROLLER CORE 32 kB ISP FLASH FLEXIBLE INTERRUPTS 8051 CPU (50 MIPS) DEBUG CIRCUITRY 2 kB XRAM POR Copyright © 2014 by Silicon Laboratories WDT C8051F55x, C8051F56x, C8051F57x IQ n io rs Ve no en m om ec tR d de fo ew rN s ig n D es C8051F55x/56x/57x 2 Rev. 1.2 C8051F55x/56x/57x Table of Contents IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s 1. System Overview ..................................................................................................... 16 2. Ordering Information ............................................................................................... 20 3. Pin Definitions.......................................................................................................... 22 4. Package Specifications ........................................................................................... 28 4.1. QFN-40 Package Specifications........................................................................ 28 4.2. QFP-32 Package Specifications........................................................................ 30 4.3. QFN-32 Package Specifications........................................................................ 32 4.4. QFN-24 Package Specifications........................................................................ 34 5. Electrical Characteristics ........................................................................................ 36 5.1. Absolute Maximum Specifications..................................................................... 36 5.2. Electrical Characteristics ................................................................................... 37 6. 12-Bit ADC (ADC0) ................................................................................................... 47 6.1. Modes of Operation ........................................................................................... 48 6.1.1. Starting a Conversion................................................................................ 48 6.1.2. Tracking Modes......................................................................................... 48 6.1.3. Timing ....................................................................................................... 49 6.1.4. Burst Mode................................................................................................ 50 6.2. Output Code Formatting .................................................................................... 52 6.2.1. Settling Time Requirements...................................................................... 52 6.3. Selectable Gain ................................................................................................. 53 6.3.1. Calculating the Gain Value........................................................................ 53 6.3.2. Setting the Gain Value .............................................................................. 55 6.4. Programmable Window Detector....................................................................... 61 6.4.1. Window Detector In Single-Ended Mode .................................................. 63 6.5. ADC0 Analog Multiplexer .................................................................................. 65 6.6. Temperature Sensor.......................................................................................... 67 7. Voltage Reference.................................................................................................... 68 8. Comparators............................................................................................................. 70 8.1. Comparator Multiplexer ..................................................................................... 76 9. Voltage Regulator (REG0) ....................................................................................... 79 10. CIP-51 Microcontroller........................................................................................... 81 10.1. Performance .................................................................................................... 81 10.2. Instruction Set.................................................................................................. 83 10.2.1. Instruction and CPU Timing .................................................................... 83 10.3. CIP-51 Register Descriptions .......................................................................... 87 10.4. Serial Number Special Function Registers (SFRs) ......................................... 91 11. Memory Organization ............................................................................................ 92 11.1. Program Memory............................................................................................. 92 11.1.1. MOVX Instruction and Program Memory ................................................ 93 11.2. Data Memory ................................................................................................... 93 11.2.1. Internal RAM ........................................................................................... 93 12. Special Function Registers................................................................................... 95 12.1. SFR Paging ..................................................................................................... 95 Rev. 1.2 3 C8051F55x/56x/57x IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s 12.2. Interrupts and SFR Paging .............................................................................. 95 12.3. SFR Page Stack Example ............................................................................... 97 13. Interrupts .............................................................................................................. 112 13.1. MCU Interrupt Sources and Vectors.............................................................. 112 13.1.1. Interrupt Priorities.................................................................................. 113 13.1.2. Interrupt Latency ................................................................................... 113 13.2. Interrupt Register Descriptions ...................................................................... 115 13.3. External Interrupts INT0 and INT1................................................................. 122 14. Flash Memory....................................................................................................... 124 14.1. Programming The Flash Memory .................................................................. 124 14.1.1. Flash Lock and Key Functions .............................................................. 124 14.1.2. Flash Erase Procedure ......................................................................... 125 14.1.3. Flash Write Procedure .......................................................................... 125 14.1.4. Flash Write Optimization ....................................................................... 126 14.2. Non-volatile Data Storage ............................................................................. 127 14.3. Security Options ............................................................................................ 127 14.4. Flash Write and Erase Guidelines ................................................................. 129 14.4.1. VDD Maintenance and the VDD monitor ................................................ 129 14.4.2. PSWE Maintenance .............................................................................. 130 14.4.3. System Clock ........................................................................................ 130 15. Power Management Modes................................................................................. 135 15.1. Idle Mode....................................................................................................... 135 15.2. Stop Mode ..................................................................................................... 136 15.3. Suspend Mode .............................................................................................. 136 16. Reset Sources ...................................................................................................... 138 16.1. Power-On Reset ............................................................................................ 139 16.2. Power-Fail Reset/VDD Monitor ..................................................................... 139 16.3. External Reset ............................................................................................... 141 16.4. Missing Clock Detector Reset ....................................................................... 141 16.5. Comparator0 Reset ....................................................................................... 142 16.6. PCA Watchdog Timer Reset ......................................................................... 142 16.7. Flash Error Reset .......................................................................................... 142 16.8. Software Reset .............................................................................................. 142 17. External Data Memory Interface and On-Chip XRAM ....................................... 144 17.1. Accessing XRAM........................................................................................... 144 17.1.1. 16-Bit MOVX Example .......................................................................... 144 17.1.2. 8-Bit MOVX Example ............................................................................ 144 17.2. Configuring the External Memory Interface ................................................... 145 17.3. Port Configuration.......................................................................................... 145 17.4. Multiplexed Mode .......................................................................................... 149 17.5. Memory Mode Selection................................................................................ 150 17.5.1. Internal XRAM Only .............................................................................. 150 17.5.2. Split Mode without Bank Select............................................................. 150 17.5.3. Split Mode with Bank Select.................................................................. 151 17.5.4. External Only......................................................................................... 151 4 Rev. 1.2 C8051F55x/56x/57x IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s 17.6. Timing .......................................................................................................... 151 17.6.1. Multiplexed Mode .................................................................................. 153 18. Oscillators and Clock Selection ......................................................................... 157 18.1. System Clock Selection................................................................................. 157 18.2. Programmable Internal Oscillator .................................................................. 159 18.2.1. Internal Oscillator Suspend Mode ......................................................... 159 18.3. Clock Multiplier .............................................................................................. 162 18.4. External Oscillator Drive Circuit..................................................................... 164 18.4.1. External Crystal Example...................................................................... 166 18.4.2. External RC Example............................................................................ 167 18.4.3. External Capacitor Example.................................................................. 167 19. Port Input/Output ................................................................................................. 169 19.1. Port I/O Modes of Operation.......................................................................... 170 19.1.1. Port Pins Configured for Analog I/O...................................................... 170 19.1.2. Port Pins Configured For Digital I/O...................................................... 170 19.1.3. Interfacing Port I/O in a Multi-Voltage System ...................................... 171 19.2. Assigning Port I/O Pins to Analog and Digital Functions............................... 171 19.2.1. Assigning Port I/O Pins to Analog Functions ........................................ 171 19.2.2. Assigning Port I/O Pins to Digital Functions.......................................... 171 19.2.3. Assigning Port I/O Pins to External Digital Event Capture Functions ... 172 19.3. Priority Crossbar Decoder ............................................................................. 172 19.4. Port I/O Initialization ...................................................................................... 174 19.5. Port Match ..................................................................................................... 179 19.6. Special Function Registers for Accessing and Configuring Port I/O ............. 183 20. Local Interconnect Network (LIN0)..................................................................... 193 20.1. Software Interface with the LIN Controller..................................................... 194 20.2. LIN Interface Setup and Operation................................................................ 194 20.2.1. Mode Definition ..................................................................................... 194 20.2.2. Baud Rate Options: Manual or Autobaud ............................................. 194 20.2.3. Baud Rate Calculations: Manual Mode................................................. 194 20.2.4. Baud Rate Calculations—Automatic Mode ........................................... 196 20.3. LIN Master Mode Operation .......................................................................... 197 20.4. LIN Slave Mode Operation ............................................................................ 198 20.5. Sleep Mode and Wake-Up ............................................................................ 199 20.6. Error Detection and Handling ........................................................................ 199 20.7. LIN Registers................................................................................................. 200 20.7.1. LIN Direct Access SFR Registers Definitions ....................................... 200 20.7.2. LIN Indirect Access SFR Registers Definitions ..................................... 202 21. Controller Area Network (CAN0) ........................................................................ 210 21.1. Bosch CAN Controller Operation................................................................... 211 21.1.1. CAN Controller Timing .......................................................................... 211 21.1.2. CAN Register Access............................................................................ 212 21.1.3. Example Timing Calculation for 1 Mbit/Sec Communication ................ 212 21.2. CAN Registers............................................................................................... 214 21.2.1. CAN Controller Protocol Registers........................................................ 214 Rev. 1.2 5 C8051F55x/56x/57x IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s 21.2.2. Message Object Interface Registers ..................................................... 214 21.2.3. Message Handler Registers.................................................................. 214 21.2.4. CAN Register Assignment .................................................................... 215 22. SMBus................................................................................................................... 218 22.1. Supporting Documents .................................................................................. 219 22.2. SMBus Configuration..................................................................................... 219 22.3. SMBus Operation .......................................................................................... 219 22.3.1. Transmitter Vs. Receiver....................................................................... 220 22.3.2. Arbitration.............................................................................................. 220 22.3.3. Clock Low Extension............................................................................. 220 22.3.4. SCL Low Timeout.................................................................................. 220 22.3.5. SCL High (SMBus Free) Timeout ......................................................... 221 22.4. Using the SMBus........................................................................................... 221 22.4.1. SMBus Configuration Register.............................................................. 221 22.4.2. SMB0CN Control Register .................................................................... 225 22.4.3. Data Register ........................................................................................ 228 22.5. SMBus Transfer Modes................................................................................. 228 22.5.1. Write Sequence (Master) ...................................................................... 229 22.5.2. Read Sequence (Master) ...................................................................... 230 22.5.3. Write Sequence (Slave) ........................................................................ 231 22.5.4. Read Sequence (Slave) ........................................................................ 232 22.6. SMBus Status Decoding................................................................................ 232 23. UART0 ................................................................................................................... 235 23.1. Baud Rate Generator .................................................................................... 235 23.2. Data Format................................................................................................... 237 23.3. Configuration and Operation ......................................................................... 238 23.3.1. Data Transmission ................................................................................ 238 23.3.2. Data Reception ..................................................................................... 238 23.3.3. Multiprocessor Communications ........................................................... 240 24. Enhanced Serial Peripheral Interface (SPI0) ..................................................... 246 24.1. Signal Descriptions........................................................................................ 247 24.1.1. Master Out, Slave In (MOSI)................................................................. 247 24.1.2. Master In, Slave Out (MISO)................................................................. 247 24.1.3. Serial Clock (SCK) ................................................................................ 247 24.1.4. Slave Select (NSS) ............................................................................... 247 24.2. SPI0 Master Mode Operation ........................................................................ 248 24.3. SPI0 Slave Mode Operation .......................................................................... 250 24.4. SPI0 Interrupt Sources .................................................................................. 250 24.5. Serial Clock Phase and Polarity .................................................................... 251 24.6. SPI Special Function Registers ..................................................................... 252 25. Timers ................................................................................................................... 259 25.1. Timer 0 and Timer 1 ...................................................................................... 261 25.1.1. Mode 0: 13-bit Counter/Timer ............................................................... 261 25.1.2. Mode 1: 16-bit Counter/Timer ............................................................... 262 25.1.3. Mode 2: 8-bit Counter/Timer with Auto-Reload..................................... 262 6 Rev. 1.2 C8051F55x/56x/57x IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s 25.1.4. Mode 3: Two 8-bit Counter/Timers (Timer 0 Only)................................ 263 25.2. Timer 2 .......................................................................................................... 269 25.2.1. 16-bit Timer with Auto-Reload............................................................... 269 25.2.2. 8-bit Timers with Auto-Reload............................................................... 269 25.2.3. External Oscillator Capture Mode ......................................................... 270 25.3. Timer 3 .......................................................................................................... 275 25.3.1. 16-Bit Timer with Auto-Reload .............................................................. 275 25.3.2. 8-Bit Timers with Auto-Reload .............................................................. 275 25.3.3. External Oscillator Capture Mode ......................................................... 276 26. Programmable Counter Array............................................................................. 281 26.1. PCA Counter/Timer ....................................................................................... 282 26.2. PCA0 Interrupt Sources................................................................................. 283 26.3. Capture/Compare Modules ........................................................................... 283 26.3.1. Edge-triggered Capture Mode............................................................... 284 26.3.2. Software Timer (Compare) Mode.......................................................... 285 26.3.3. High-Speed Output Mode ..................................................................... 286 26.3.4. Frequency Output Mode ....................................................................... 287 26.3.5. 8-bit, 9-bit, 10-bit and 11-bit Pulse Width Modulator Modes ................. 288 26.3.6. 16-Bit Pulse Width Modulator Mode...................................................... 290 26.4. Watchdog Timer Mode .................................................................................. 291 26.4.1. Watchdog Timer Operation ................................................................... 291 26.4.2. Watchdog Timer Usage ........................................................................ 292 26.5. Register Descriptions for PCA0..................................................................... 294 27. C2 Interface .......................................................................................................... 300 27.1. C2 Interface Registers................................................................................... 300 27.2. C2 Pin Sharing .............................................................................................. 303 Rev. 1.2 7 C8051F55x/56x/57x List of Figures IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s Figure 1.1. C8051F568-9 and ‘F570-5 (40-pin) Block Diagram .............................. 17 Figure 1.2. C8051F560-7 (32-pin) Block Diagram ................................................... 18 Figure 1.3. C8051F550-7 (24-pin) Block Diagram ................................................... 19 Figure 3.1. QFN-40 Pinout Diagram (Top View) ..................................................... 24 Figure 3.2. QFP-32 Pinout Diagram (Top View) ...................................................... 25 Figure 3.3. QFN-32 Pinout Diagram (Top View) ..................................................... 26 Figure 3.4. QFN-24 Pinout Diagram (Top View) ..................................................... 27 Figure 4.1. QFN-40 Package Drawing .................................................................... 28 Figure 4.2. QFN-40 Landing Diagram ..................................................................... 29 Figure 4.3. QFP-32 Package Drawing ..................................................................... 30 Figure 4.4. QFP-32 Landing Diagram ..................................................................... 31 Figure 4.5. QFN-32 Package Drawing .................................................................... 32 Figure 4.6. QFN-32 Landing Diagram ..................................................................... 33 Figure 4.7. QFN-24 Package Drawing .................................................................... 34 Figure 4.8. QFN-24 Landing Diagram ..................................................................... 35 Figure 5.1. Minimum VDD Monitor Threshold vs. System Clock Frequency ........... 39 Figure 6.1. ADC0 Functional Block Diagram ........................................................... 47 Figure 6.2. ADC0 Tracking Modes .......................................................................... 49 Figure 6.3. 12-Bit ADC Tracking Mode Example ..................................................... 50 Figure 6.4. 12-Bit ADC Burst Mode Example With Repeat Count Set to 4 ............. 51 Figure 6.5. ADC0 Equivalent Input Circuit ............................................................... 53 Figure 6.6. ADC Window Compare Example: Right-Justified Data ......................... 64 Figure 6.7. ADC Window Compare Example: Left-Justified Data ........................... 64 Figure 6.8. ADC0 Multiplexer Block Diagram .......................................................... 65 Figure 6.9. Temperature Sensor Transfer Function ................................................ 67 Figure 7.1. Voltage Reference Functional Block Diagram ....................................... 68 Figure 8.1. Comparator Functional Block Diagram ................................................. 70 Figure 8.2. Comparator Hysteresis Plot .................................................................. 71 Figure 8.3. Comparator Input Multiplexer Block Diagram ........................................ 76 Figure 9.1. External Capacitors for Voltage Regulator Input/Output— Regulator Enabled ............................................................................................. 79 Figure 9.2. External Capacitors for Voltage Regulator Input/Output—Regulator Disabled ............................................................................................................... 80 Figure 10.1. CIP-51 Block Diagram ......................................................................... 82 Figure 11.1. C8051F55x/56x/57x Memory Map ...................................................... 92 Figure 11.2. Flash Program Memory Map ............................................................... 93 Figure 12.1. SFR Page Stack .................................................................................. 96 Figure 12.2. SFR Page Stack While Using SFR Page 0x0 To Access SPI0DAT ... 97 Figure 12.3. SFR Page Stack After CAN0 Interrupt Occurs .................................... 98 Figure 12.4. SFR Page Stack Upon PCA Interrupt Occurring During a CAN0 ISR . 99 Figure 12.5. SFR Page Stack Upon Return From PCA Interrupt .......................... 100 Figure 12.6. SFR Page Stack Upon Return From CAN0 Interrupt ........................ 101 Figure 14.1. Flash Program Memory Map ............................................................. 127 Rev. 1.2 8 C8051F55x/56x/57x IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s Figure 16.1. Reset Sources ................................................................................... 138 Figure 16.2. Power-On and VDD Monitor Reset Timing ....................................... 139 Figure 17.1. Multiplexed Configuration Example ................................................... 149 Figure 17.2. EMIF Operating Modes ..................................................................... 150 Figure 17.3. Multiplexed 16-bit MOVX Timing ....................................................... 153 Figure 17.4. Multiplexed 8-bit MOVX without Bank Select Timing ........................ 154 Figure 17.5. Multiplexed 8-bit MOVX with Bank Select Timing ............................. 155 Figure 18.1. Oscillator Options .............................................................................. 157 Figure 18.2. Example Clock Multiplier Output ....................................................... 162 Figure 18.3. External 32.768 kHz Quartz Crystal Oscillator Connection Diagram 167 Figure 19.1. Port I/O Functional Block Diagram .................................................... 169 Figure 19.2. Port I/O Cell Block Diagram .............................................................. 170 Figure 19.3. Peripheral Availability on Port I/O Pins .............................................. 173 Figure 19.4. Crossbar Priority Decoder in Example Configuration ........................ 174 Figure 20.1. LIN Block Diagram ............................................................................ 193 Figure 21.1. Typical CAN Bus Configuration ......................................................... 210 Figure 21.2. CAN Controller Diagram .................................................................... 211 Figure 21.3. Four segments of a CAN Bit .............................................................. 213 Figure 22.1. SMBus Block Diagram ...................................................................... 218 Figure 22.2. Typical SMBus Configuration ............................................................ 219 Figure 22.3. SMBus Transaction ........................................................................... 220 Figure 22.4. Typical SMBus SCL Generation ........................................................ 222 Figure 22.5. Typical Master Write Sequence ........................................................ 229 Figure 22.6. Typical Master Read Sequence ........................................................ 230 Figure 22.7. Typical Slave Write Sequence .......................................................... 231 Figure 22.8. Typical Slave Read Sequence .......................................................... 232 Figure 23.1. UART0 Block Diagram ...................................................................... 235 Figure 23.2. UART0 Timing Without Parity or Extra Bit ......................................... 237 Figure 23.3. UART0 Timing With Parity ................................................................ 237 Figure 23.4. UART0 Timing With Extra Bit ............................................................ 237 Figure 23.5. Typical UART Interconnect Diagram ................................................. 238 Figure 23.6. UART Multi-Processor Mode Interconnect Diagram ......................... 240 Figure 24.1. SPI Block Diagram ............................................................................ 246 Figure 24.2. Multiple-Master Mode Connection Diagram ...................................... 249 Figure 24.3. 3-Wire Single Master and 3-Wire Single Slave Mode Connection Diagram ............................................................................................................. 249 Figure 24.4. 4-Wire Single Master Mode and 4-Wire Slave Mode Connection Diagram ............................................................................................................. 249 Figure 24.5. Master Mode Data/Clock Timing ....................................................... 251 Figure 24.6. Slave Mode Data/Clock Timing (CKPHA = 0) ................................... 252 Figure 24.7. Slave Mode Data/Clock Timing (CKPHA = 1) ................................... 252 Figure 24.8. SPI Master Timing (CKPHA = 0) ....................................................... 256 Figure 24.9. SPI Master Timing (CKPHA = 1) ....................................................... 256 Figure 24.10. SPI Slave Timing (CKPHA = 0) ....................................................... 257 Figure 24.11. SPI Slave Timing (CKPHA = 1) ....................................................... 257 9 Rev. 1.2 C8051F55x/56x/57x IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s Figure 25.1. T0 Mode 0 Block Diagram ................................................................. 262 Figure 25.2. T0 Mode 2 Block Diagram ................................................................. 263 Figure 25.3. T0 Mode 3 Block Diagram ................................................................. 264 Figure 25.4. Timer 2 16-Bit Mode Block Diagram ................................................. 269 Figure 25.5. Timer 2 8-Bit Mode Block Diagram ................................................... 270 Figure 25.6. Timer 2 External Oscillator Capture Mode Block Diagram ................ 271 Figure 25.7. Timer 3 16-Bit Mode Block Diagram ................................................. 275 Figure 25.8. Timer 3 8-Bit Mode Block Diagram ................................................... 276 Figure 25.9. Timer 3 External Oscillator Capture Mode Block Diagram ................ 277 Figure 26.1. PCA Block Diagram ........................................................................... 281 Figure 26.2. PCA Counter/Timer Block Diagram ................................................... 282 Figure 26.3. PCA Interrupt Block Diagram ............................................................ 283 Figure 26.4. PCA Capture Mode Diagram ............................................................. 285 Figure 26.5. PCA Software Timer Mode Diagram ................................................. 286 Figure 26.6. PCA High-Speed Output Mode Diagram ........................................... 287 Figure 26.7. PCA Frequency Output Mode ........................................................... 288 Figure 26.8. PCA 8-Bit PWM Mode Diagram ........................................................ 289 Figure 26.9. PCA 9, 10 and 11-Bit PWM Mode Diagram ...................................... 290 Figure 26.10. PCA 16-Bit PWM Mode ................................................................... 291 Figure 26.11. PCA Module 2 with Watchdog Timer Enabled ................................ 292 Figure 27.1. Typical C2 Pin Sharing ...................................................................... 303 Rev. 1.2 10 C8051F55x/56x/57x List of Tables IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s Table 2.1. Product Selection Guide ......................................................................... 21 Table 3.1. Pin Definitions for the C8051F55x/56x/57x ............................................ 22 Table 4.1. QFN-40 Package Dimensions ................................................................ 28 Table 4.2. QFN-40 Landing Diagram Dimensions ................................................... 29 Table 4.3. QFP-32 Package Dimensions ................................................................ 30 Table 4.4. QFP-32 Landing Diagram Dimensions ................................................... 31 Table 4.5. QFN-32 Package Dimensions ................................................................ 32 Table 4.6. QFN-32 Landing Diagram Dimensions ................................................... 33 Table 4.7. QFN-24 Package Dimensions ................................................................ 34 Table 4.8. QFN-24 Landing Diagram Dimensions ................................................... 35 Table 5.1. Absolute Maximum Ratings .................................................................... 36 Table 5.2. Global Electrical Characteristics ............................................................. 37 Table 5.3. Port I/O DC Electrical Characteristics ..................................................... 40 Table 5.4. Reset Electrical Characteristics .............................................................. 41 Table 5.5. Flash Electrical Characteristics .............................................................. 41 Table 5.6. Internal High-Frequency Oscillator Electrical Characteristics ................. 42 Table 5.7. Clock Multiplier Electrical Specifications ................................................ 43 Table 5.8. Voltage Regulator Electrical Characteristics .......................................... 43 Table 5.9. ADC0 Electrical Characteristics .............................................................. 44 Table 5.10. Temperature Sensor Electrical Characteristics .................................... 45 Table 5.11. Voltage Reference Electrical Characteristics ....................................... 45 Table 5.12. Comparator 0 and Comparator 1 Electrical Characteristics ................. 46 Table 10.1. CIP-51 Instruction Set Summary .......................................................... 84 Table 12.1. Special Function Register (SFR) Memory Map for Pages 0x00 and 0x0F 106 Table 12.2. Special Function Register (SFR) Memory Map for Page 0x0C .......... 107 Table 12.3. Special Function Registers ................................................................. 108 Table 13.1. Interrupt Summary .............................................................................. 114 Table 14.1. Flash Security Summary .................................................................... 128 Table 17.1. EMIF Pinout (C8051F568-9 and ‘F570-5) .......................................... 146 Table 17.2. AC Parameters for External Memory Interface ................................... 156 Table 19.1. Port I/O Assignment for Analog Functions ......................................... 171 Table 19.2. Port I/O Assignment for Digital Functions ........................................... 172 Table 19.3. Port I/O Assignment for External Digital Event Capture Functions .... 172 Table 20.1. Baud Rate Calculation Variable Ranges ............................................ 194 Table 20.2. Manual Baud Rate Parameters Examples ......................................... 196 Table 20.3. Autobaud Parameters Examples ........................................................ 197 Table 20.4. LIN Registers* (Indirectly Addressable) .............................................. 202 Table 21.1. Background System Information ........................................................ 212 Table 21.2. Standard CAN Registers and Reset Values ....................................... 215 Table 22.1. SMBus Clock Source Selection .......................................................... 222 Table 22.2. Minimum SDA Setup and Hold Times ................................................ 223 Rev. 1.2 11 C8051F55x/56x/57x IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s Table 22.3. Sources for Hardware Changes to SMB0CN ..................................... 227 Table 22.4. SMBus Status Decoding ..................................................................... 233 Table 23.1. Baud Rate Generator Settings for Standard Baud Rates ................... 236 Table 24.1. SPI Slave Timing Parameters ............................................................ 258 Table 26.1. PCA Timebase Input Options ............................................................. 282 Table 26.2. PCA0CPM and PCA0PWM Bit Settings for PCA Capture/Compare Modules ........................................................ 284 Table 26.3. Watchdog Timer Timeout Intervals1 ................................................... 293 12 Rev. 1.2 C8051F55x/56x/57x List of Registers IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s SFR Definition 6.4. ADC0CF: ADC0 Configuration ...................................................... 58 SFR Definition 6.5. ADC0H: ADC0 Data Word MSB .................................................... 59 SFR Definition 6.6. ADC0L: ADC0 Data Word LSB ...................................................... 59 SFR Definition 6.7. ADC0CN: ADC0 Control ................................................................ 60 SFR Definition 6.8. ADC0TK: ADC0 Tracking Mode Select ......................................... 61 SFR Definition 6.9. ADC0GTH: ADC0 Greater-Than Data High Byte .......................... 62 SFR Definition 6.10. ADC0GTL: ADC0 Greater-Than Data Low Byte .......................... 62 SFR Definition 6.11. ADC0LTH: ADC0 Less-Than Data High Byte .............................. 63 SFR Definition 6.12. ADC0LTL: ADC0 Less-Than Data Low Byte ............................... 63 SFR Definition 6.13. ADC0MX: ADC0 Channel Select ................................................. 66 SFR Definition 7.1. REF0CN: Reference Control ......................................................... 69 SFR Definition 8.1. CPT0CN: Comparator0 Control ..................................................... 72 SFR Definition 8.2. CPT0MD: Comparator0 Mode Selection ....................................... 73 SFR Definition 8.3. CPT1CN: Comparator1 Control ..................................................... 74 SFR Definition 8.4. CPT1MD: Comparator1 Mode Selection ....................................... 75 SFR Definition 8.5. CPT0MX: Comparator0 MUX Selection ........................................ 77 SFR Definition 8.6. CPT1MX: Comparator1 MUX Selection ........................................ 78 SFR Definition 9.1. REG0CN: Regulator Control .......................................................... 80 SFR Definition 10.1. DPL: Data Pointer Low Byte ........................................................ 88 SFR Definition 10.2. DPH: Data Pointer High Byte ....................................................... 88 SFR Definition 10.3. SP: Stack Pointer ......................................................................... 89 SFR Definition 10.4. ACC: Accumulator ....................................................................... 89 SFR Definition 10.5. B: B Register ................................................................................ 89 SFR Definition 10.6. PSW: Program Status Word ........................................................ 90 SFR Definition 10.7. SNn: Serial Number n .................................................................. 91 SFR Definition 12.1. SFR0CN: SFR Page Control ..................................................... 102 SFR Definition 12.2. SFRPAGE: SFR Page ............................................................... 103 SFR Definition 12.3. SFRNEXT: SFR Next ................................................................ 104 SFR Definition 12.4. SFRLAST: SFR Last .................................................................. 105 SFR Definition 13.1. IE: Interrupt Enable .................................................................... 116 SFR Definition 13.2. IP: Interrupt Priority .................................................................... 117 SFR Definition 13.3. EIE1: Extended Interrupt Enable 1 ............................................ 118 SFR Definition 13.4. EIP1: Extended Interrupt Priority 1 ............................................ 119 SFR Definition 13.5. EIE2: Extended Interrupt Enable 2 ............................................ 120 SFR Definition 13.6. EIP2: Extended Interrupt Priority Enabled 2 .............................. 121 SFR Definition 13.7. IT01CF: INT0/INT1 Configuration .............................................. 123 SFR Definition 14.1. PSCTL: Program Store R/W Control ......................................... 131 SFR Definition 14.2. FLKEY: Flash Lock and Key ...................................................... 132 SFR Definition 14.3. FLSCL: Flash Scale ................................................................... 133 SFR Definition 14.4. CCH0CN: Cache Control ........................................................... 134 SFR Definition 14.5. ONESHOT: Flash Oneshot Period ............................................ 134 SFR Definition 15.1. PCON: Power Control ................................................................ 137 SFR Definition 16.1. VDM0CN: VDD Monitor Control ................................................ 141 Rev. 1.2 13 C8051F55x/56x/57x IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s SFR Definition 16.2. RSTSRC: Reset Source ............................................................ 143 SFR Definition 17.1. EMI0CN: External Memory Interface Control ............................ 147 SFR Definition 17.2. EMI0CF: External Memory Configuration .................................. 148 SFR Definition 17.3. EMI0TC: External Memory Timing Control ................................ 152 SFR Definition 18.1. CLKSEL: Clock Select ............................................................... 158 SFR Definition 18.2. OSCICN: Internal Oscillator Control .......................................... 160 SFR Definition 18.3. OSCICRS: Internal Oscillator Coarse Calibration ...................... 161 SFR Definition 18.4. OSCIFIN: Internal Oscillator Fine Calibration ............................ 161 SFR Definition 18.5. CLKMUL: Clock Multiplier .......................................................... 163 SFR Definition 18.6. OSCXCN: External Oscillator Control ........................................ 165 SFR Definition 19.1. XBR0: Port I/O Crossbar Register 0 .......................................... 176 SFR Definition 19.2. XBR1: Port I/O Crossbar Register 1 .......................................... 177 SFR Definition 19.3. XBR2: Port I/O Crossbar Register 1 .......................................... 178 SFR Definition 19.4. P0MASK: Port 0 Mask Register ................................................. 179 SFR Definition 19.5. P0MAT: Port 0 Match Register .................................................. 179 SFR Definition 19.6. P1MASK: Port 1 Mask Register ................................................. 180 SFR Definition 19.7. P1MAT: Port 1 Match Register .................................................. 180 SFR Definition 19.8. P2MASK: Port 2 Mask Register ................................................. 181 SFR Definition 19.9. P2MAT: Port 2 Match Register .................................................. 181 SFR Definition 19.10. P3MASK: Port 3 Mask Register ............................................... 182 SFR Definition 19.11. P3MAT: Port 3 Match Register ................................................ 182 SFR Definition 19.12. P0: Port 0 ................................................................................. 183 SFR Definition 19.13. P0MDIN: Port 0 Input Mode ..................................................... 184 SFR Definition 19.14. P0MDOUT: Port 0 Output Mode .............................................. 184 SFR Definition 19.15. P0SKIP: Port 0 Skip ................................................................. 185 SFR Definition 19.16. P1: Port 1 ................................................................................. 185 SFR Definition 19.17. P1MDIN: Port 1 Input Mode ..................................................... 186 SFR Definition 19.18. P1MDOUT: Port 1 Output Mode .............................................. 186 SFR Definition 19.19. P1SKIP: Port 1 Skip ................................................................. 187 SFR Definition 19.20. P2: Port 2 ................................................................................. 187 SFR Definition 19.21. P2MDIN: Port 2 Input Mode ..................................................... 188 SFR Definition 19.22. P2MDOUT: Port 2 Output Mode .............................................. 188 SFR Definition 19.23. P2SKIP: Port 2 Skip ................................................................. 189 SFR Definition 19.24. P3: Port 3 ................................................................................. 189 SFR Definition 19.25. P3MDIN: Port 3 Input Mode ..................................................... 190 SFR Definition 19.26. P3MDOUT: Port 3 Output Mode .............................................. 190 SFR Definition 19.27. P3SKIP: Port 3Skip .................................................................. 191 SFR Definition 19.28. P4: Port 4 ................................................................................. 191 SFR Definition 19.29. P4MDOUT: Port 4 Output Mode .............................................. 192 SFR Definition 20.1. LIN0ADR: LIN0 Indirect Address Register ................................. 200 SFR Definition 20.2. LIN0DAT: LIN0 Indirect Data Register ....................................... 200 SFR Definition 20.3. LIN0CF: LIN0 Control Mode Register ........................................ 201 SFR Definition 21.1. CAN0CFG: CAN Clock Configuration ........................................ 217 SFR Definition 22.1. SMB0CF: SMBus Clock/Configuration ...................................... 224 SFR Definition 22.2. SMB0CN: SMBus Control .......................................................... 226 14 Rev. 1.2 C8051F55x/56x/57x IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s SFR Definition 22.3. SMB0DAT: SMBus Data ............................................................ 228 SFR Definition 23.1. SCON0: Serial Port 0 Control .................................................... 241 SFR Definition 23.2. SMOD0: Serial Port 0 Control .................................................... 243 SFR Definition 23.3. SBUF0: Serial (UART0) Port Data Buffer .................................. 244 SFR Definition 23.4. SBCON0: UART0 Baud Rate Generator Control ...................... 244 SFR Definition 23.6. SBRLL0: UART0 Baud Rate Generator Reload Low Byte ........ 245 SFR Definition 23.5. SBRLH0: UART0 Baud Rate Generator Reload High Byte ....... 245 SFR Definition 24.1. SPI0CFG: SPI0 Configuration ................................................... 253 SFR Definition 24.2. SPI0CN: SPI0 Control ............................................................... 254 SFR Definition 24.3. SPI0CKR: SPI0 Clock Rate ....................................................... 255 SFR Definition 24.4. SPI0DAT: SPI0 Data ................................................................. 255 SFR Definition 25.1. CKCON: Clock Control .............................................................. 260 SFR Definition 25.2. TCON: Timer Control ................................................................. 265 SFR Definition 25.3. TMOD: Timer Mode ................................................................... 266 SFR Definition 25.4. TL0: Timer 0 Low Byte ............................................................... 267 SFR Definition 25.5. TL1: Timer 1 Low Byte ............................................................... 267 SFR Definition 25.6. TH0: Timer 0 High Byte ............................................................. 268 SFR Definition 25.7. TH1: Timer 1 High Byte ............................................................. 268 SFR Definition 25.8. TMR2CN: Timer 2 Control ......................................................... 272 SFR Definition 25.9. TMR2RLL: Timer 2 Reload Register Low Byte .......................... 273 SFR Definition 25.10. TMR2RLH: Timer 2 Reload Register High Byte ...................... 273 SFR Definition 25.11. TMR2L: Timer 2 Low Byte ....................................................... 274 SFR Definition 25.12. TMR2H Timer 2 High Byte ....................................................... 274 SFR Definition 25.13. TMR3CN: Timer 3 Control ....................................................... 278 SFR Definition 25.14. TMR3RLL: Timer 3 Reload Register Low Byte ........................ 279 SFR Definition 25.15. TMR3RLH: Timer 3 Reload Register High Byte ...................... 279 SFR Definition 25.16. TMR3L: Timer 3 Low Byte ....................................................... 280 SFR Definition 25.17. TMR3H Timer 3 High Byte ....................................................... 280 SFR Definition 26.1. PCA0CN: PCA Control .............................................................. 294 SFR Definition 26.2. PCA0MD: PCA Mode ................................................................ 295 SFR Definition 26.3. PCA0PWM: PCA PWM Configuration ....................................... 296 SFR Definition 26.4. PCA0CPMn: PCA Capture/Compare Mode .............................. 297 SFR Definition 26.5. PCA0L: PCA Counter/Timer Low Byte ...................................... 298 SFR Definition 26.6. PCA0H: PCA Counter/Timer High Byte ..................................... 298 SFR Definition 26.7. PCA0CPLn: PCA Capture Module Low Byte ............................. 299 SFR Definition 26.8. PCA0CPHn: PCA Capture Module High Byte ........................... 299 Rev. 1.2 15 C8051F55x/56x/57x 1. System Overview         ig n D es ew rN  fo  d  de  en  m  High-speed pipelined 8051-compatible microcontroller core (up to 50 MIPS) In-system, full-speed, non-intrusive debug interface (on-chip) Controller Area Network (CAN 2.0B) Controller with 32 message objects, each with its own indentifier mask (C8051F550/1/4/5, ‘F560/1/4/5/8/9, and ‘F572/3) LIN 2.1 peripheral (fully backwards compatible, master and slave modes) (C8051F550/2/4/6, ‘F560/2/4/6/8, and ‘F570/2/4) True 12-bit 200 ksps 32-channel single-ended ADC with analog multiplexer Precision programmable 24 MHz internal oscillator that is within ±0.5% across the temperature range and for VDD voltages greater than or equal to the on-chip voltage regulator minimum output at the low setting. The oscillator is within +1.0% for VDD voltages below this minimum output setting. On-chip Clock Multiplier to reach up to 50 MHz 32 kB (C8051F550-3, ‘F560-3, ‘F568-9, and ‘F570-1) or 16 kB (C8051F554-7, ‘F564-7, and ‘F572-5) of on-chip Flash memory 2304 bytes of on-chip RAM SMBus/I2C, Enhanced UART, and Enhanced SPI serial interfaces implemented in hardware Four general-purpose 16-bit timers External Data Memory Interface (C8051F568-9 and ‘F570-5) with 64 kB address space Programmable Counter/Timer Array (PCA) with six capture/compare modules and Watchdog Timer function On-chip Voltage Regulator On-chip Power-On Reset, VDD Monitor, and Temperature Sensor om  s C8051F55x/56x/57x devices are fully integrated mixed-signal System-on-a-Chip MCUs. Highlighted features are listed below. Refer to Table 2.1 for specific product feature selection and part ordering numbers.  no tR ec On-chip Voltage Comparator  33, 25, or 18 Port I/O (5 V push-pull) With on-chip Voltage Regulator, Power-On Reset, VDD monitor, Watchdog Timer, and clock oscillator, the C8051F55x/56x/57x devices are truly stand-alone System-on-a-Chip solutions. The Flash memory can be reprogrammed even in-circuit, providing non-volatile data storage, and also allowing field upgrades of the 8051 firmware. User software has complete control of all peripherals, and may individually shut down any or all peripherals for power savings. rs io n The on-chip Silicon Labs 2-Wire (C2) Development Interface allows non-intrusive (uses no on-chip resources), full speed, in-circuit debugging using the production MCU installed in the final application. This debug logic supports inspection and modification of memory and registers, setting breakpoints, single stepping, run and halt commands. All analog and digital peripherals are fully functional while debugging using C2. The two C2 interface pins can be shared with user functions, allowing in-system debugging without occupying package pins. IQ Ve The devices are specified for 1.8 V to 5.25 V operation over the automotive temperature range (–40 to +125 °C). The C8051F568-9 and ‘F570-5 are available in 40-pin QFN packages, the C8051F560-7 devices are available in 32-pin QFP and QFN packages, and the C8051F550-7 are available in 24-pin QFN packages. All package options are lead-free and RoHS compliant. See Table 2.1 for ordering information. Block diagrams are included in Figure 1.1, Figure 1.2, and Figure 1.3. Rev. 1.2 16 C8051F55x/56x/57x VIO Debug / Programming Hardware UART0 256 Byte RAM Timers 0, 1, 2, 3 2 kB XRAM 6 channel PCA/WDT C2D Port 0 Drivers Priority Crossbar Decoder LIN 2.1 Voltage Regulator (LDO) Port 1 Drivers CAN 2.0B ew VREGIN SPI VDD I2C rN GND SFR Bus System Clock Setup Crossbar Control fo Analog Peripherals Voltage Reference en VREF VREF 12-bit 200ksps ADC A M U X CP0, CP0A ec om m VDD Comparator 0 CP1, CP1A tR GNDA Port 3 Drivers P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 d External Oscillator Clock Multiplier VDDA Port 2 Drivers de Internal Oscillator (±0.5%) Comparator 1 VDD VREF P0 – P3 Temp Sensor GND Port 4 Driver + - + - IQ Ve rs io n no Figure 1.1. C8051F568-9 and ‘F570-5 (40-pin) Block Diagram 17 Rev. 1.2 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 External Memory Interface XTAL1 XTAL2 s 32 or 16 kB Flash Program Memory P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 ig n Digital Peripherals Reset C2CK/RST Port I/O Configuration CIP-51 8051 Controller Core (50 MHz) D es Power On Reset P4.0/C2D C8051F55x/56x/57x VIO UART0 256 Byte RAM Timers 0, 1, 2, 3 2 kB XRAM 6 channel PCA/WDT C2D Port 0 Drivers Priority Crossbar Decoder LIN 2.1 Voltage Regulator (LDO) Port 1 Drivers CAN 2.0B SPI VDD I2C GND SFR Bus rN System Clock Setup Crossbar Control fo XTAL1 XTAL2 Analog Peripherals External Oscillator Port 2 Drivers d Internal Oscillator (±0.5%) ew VREGIN de Voltage Reference Clock Multiplier om m en VDD ec VDDA tR GNDA VREF D es Debug / Programming Hardware 32 or 16 kB Flash Program Memory Port 3 Driver P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 s Digital Peripherals Reset C2CK/RST Port I/O Configuration CIP-51 8051 Controller Core (50 MHz) ig n Power On Reset P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 P3.0/C2D VREF 12-bit 200ksps ADC A M U X CP0, CP0A Comparator 0 CP1, CP1A Comparator 1 VDD VREF P0 – P3 Temp Sensor GND + - + - IQ Ve rs io n no Figure 1.2. C8051F560-7 (32-pin) Block Diagram Rev. 1.2 18 C8051F55x/56x/57x VIO UART0 256 Byte RAM Timers 0, 1, 2, 3 2 kB XRAM 6 channel PCA/WDT C2D Port 0 Drivers Priority Crossbar Decoder LIN 2.1 Voltage Regulator (LDO) Port 1 Drivers CAN 2.0B ew VREGIN SPI VDD I2C rN GND SFR Bus System Clock Setup Crossbar Control Analog Peripherals d External Oscillator de Voltage Reference en Clock Multiplier VREF VREF 12-bit 200ksps ADC om m VDD A M U X ec CP0, CP0A Comparator 0 CP1, CP1A tR GNDA Port 2 Drivers fo XTAL1 XTAL2 Internal Oscillator (±0.5%) Comparator 1 VDD VREF P0 – P2 Temp Sensor GND + - + - IQ Ve rs io n no Figure 1.3. C8051F550-7 (24-pin) Block Diagram 19 Rev. 1.2 D es Debug / Programming Hardware 32 or 16 kB Flash Program Memory P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 s Digital Peripherals Reset C2CK/RST Port I/O Configuration CIP-51 8051 Controller Core (50 MHz) ig n Power On Reset P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P2.0 P2.1/C2D C8051F55x/56x/57x 2. Ordering Information The following features are common to all devices in this family:       ig n D es  ew  SMBus/I2C, Enhanced SPI, Enhanced UART Four Timers Six Programmable Counter Array channels Internal 24 MHz oscillator Internal Voltage Regulator 12-bit, 200 ksps ADC Internal Voltage Reference and Temperature Sensor Two Analog Comparators rN  s 50 MHz system clock and 50 MIPS throughput (peak)  2304 bytes of RAM (256 internal bytes and 2048 XRAM bytes) IQ Ve rs io n no tR ec om m en de d fo Table 2.1 shows the feature that differentiate the devices in this family. Rev. 1.2 20 C8051F55x/56x/57x External Mem. Interface   25 — QFP-32  — 25 — QFN-32 16  — 25 — QFP-32 C8051F566-IM d 16 —  25 — QFN-32 C8051F566-IQ 16 —  25 — QFP-32 C8051F567-IM 16 — — 25 — QFN-32 C8051F567-IQ 16 — — 25 — QFP-32 QFN-32 C8051F568-IM 32   33  QFN-40 QFP-32 C8051F569-IM 32  — 33  QFN-40 QFN-32 C8051F570-IM 32 —  33  QFN-40 QFP-32 C8051F571-IM 32 — — 33  QFN-40 QFN-32 C8051F572-IM 16   33  QFN-40 25 — QFP-32 C8051F573-IM 16  — 33  QFN-40 25 — QFN-32 C8051F574-IM 16 —  33  QFN-40 25 — QFP-32 C8051F575-IM 16 — — 33  QFN-40 18 — QFN-24 C8051F564-IM 16 C8051F551-IM 32  — 18 — QFN-24 C8051F564-IQ 16 C8051F552-IM 32 —  18 — QFN-24 C8051F565-IM 16 C8051F553-IM 32 — — 18 — QFN-24 C8051F565-IQ C8051F554-IM 16   18 — QFN-24 C8051F555-IM 16  — 18 — QFN-24 C8051F556-IM 16 —  18 — QFN-24 C8051F557-IM 16 — — 18 — QFN-24 C8051F560-IM 32   25 — C8051F560-IQ 32   25 — C8051F561-IM 32  — 25 — C8051F561-IQ 32  — 25 — C8051F562-IM 32 —  25 — C8051F562-IQ 32 —  C8051F563-IM 32 — — 32 — — fo de en m om ec tR no C8051F563-IQ ig n Package D es ew Flash Memory (kB)  rN  s Digital Port I/Os QFN-32 32 LIN2.1 — C8051F550-IM CAN2.0B 25 Ordering Part Number  Package External Mem. Interface  Digital Port I/Os LIN2.1 CAN2.0B Flash Memory (kB) Ordering Part Number Table 2.1. Product Selection Guide n Note: The suffix of the part number indicates the device rating and the package. All devices are RoHS compliant. IQ Ve rs io All devices in Table 2.1 are also available in an automotive version. For the automotive version, the -I in the ordering part number is replaced with -A. For example, the automotive version of the C8051F550-IM is the C8051F550-AM. The -AM and -AQ devices receive full automotive quality production status, including AEC-Q100 qualification, registration with International Material Data System (IMDS) and Part Production Approval Process (PPAP) documentation. PPAP documentation is available at www.silabs.com with a registered and NDA approved user account. The -AM and -AQ devices enable high volume automotive OEM applications with their enhanced testing and processing. Please contact Silicon Labs sales for more information regarding –AM and -AQ devices for your automotive project. 21 Rev. 1.2 C8051F55x/56x/57x 3. Pin Definitions Pin Pin Pin Type Description D es 40-pin 32-pin 24-pin packages packages packages 4 4 3 Digital Supply Voltage. Must be connected. GND 6 6 4 Digital Ground. Must be connected. VDDA 5 5 — Analog Supply Voltage. Must be connected. GNDA 7 7 5 Analog Ground. Must be connected. VREGIN 3 3 2 Voltage Regulator Input VIO 2 2 1 Port I/O Supply Voltage. Must be connected. RST/ 10 10 8 — — d D I/O or A In Port 4.0. See SFR Definition 19.28. m 9 D I/O 9 C2D tR P3.0/ ec om C2D — — 7 no P2.1/ n C2D Bi-directional data signal for the C2 Debug Interface. D I/O or A In Port 3.0. See SFR Definition 19.24. D I/O Bi-directional data signal for the C2 Debug Interface. D I/O or A In Port 2.1. See SFR Definition 19.20. D I/O Bi-directional data signal for the C2 Debug Interface. 8 6 D I/O or A In Port 0.0. See SFR Definition 19.12. 1 1 24 D I/O or A In Port 0.1 40 32 23 D I/O or A In Port 0.2 P0.3 39 31 22 D I/O or A In Port 0.3 P0.4 38 30 21 D I/O or A In Port 0.4 P0.5 37 29 20 D I/O or A In Port 0.5 P0.6 36 28 19 D I/O or A In Port 0.6 P0.7 35 27 18 D I/O or A In Port 0.7 io 8 Clock signal for the C2 Debug Interface. en D I/O P4.0/ P0.0 Device Reset. Open-drain output of internal POR or VDD Monitor. de D I/O fo rN ew VDD C2CK rs P0.1 Ve P0.2 IQ ig n Name s Table 3.1. Pin Definitions for the C8051F55x/56x/57x Rev. 1.2 22 C8051F55x/56x/57x Table 3.1. Pin Definitions for the C8051F55x/56x/57x (Continued) Pin Pin Pin Type Description s Name 34 26 17 D I/O or A In Port 1.0. See SFR Definition 19.16. P1.1 33 25 16 D I/O or A In Port 1.1. P1.2 32 24 15 D I/O or A In Port 1.2. P1.3 31 23 14 D I/O or A In Port 1.3. P1.4 30 22 13 D I/O or A In Port 1.4. P1.5 29 21 12 D I/O or A In Port 1.5. P1.6 28 20 11 D I/O or A In Port 1.6. P1.7 27 19 10 D I/O or A In Port 1.7. P2.0 26 18 9 D I/O or A In Port 2.0. See SFR Definition 19.20. P2.1 25 17 — D I/O or A In Port 2.1. P2.2 24 16 — P2.3 23 15 — P2.4 22 14 — P2.5 21 13 P2.6 20 12 P2.7 19 P3.0 18 P3.1 17 ew rN fo d de D I/O or A In Port 2.2. m D I/O or A In Port 2.3. — D I/O or A In Port 2.6. 11 — D I/O or A In Port 2.7. — — D I/O or A In Port 3.0. See SFR Definition 19.24. — — D I/O or A In Port 3.1. — — D I/O or A In Port 3.2. 15 — — D I/O or A In Port 3.3. 14 — — D I/O or A In Port 3.4. 13 — — D I/O or A In Port 3.5. P3.6 12 — — D I/O or A In Port 3.6. P3.7 11 — — D I/O or A In Port 3.7. rs P3.4 IQ Ve P3.5 tR no 16 n P3.3 ec D I/O or A In Port 2.5. io om D I/O or A In Port 2.4. — P3.2 23 D es P1.0 en ig n 40-pin 32-pin 24-pin packages packages packages Rev. 1.2 VDDA 5 GND 6 GNDA 7 P0.0 / VREF 8 9 RST / C2CK 10 P0.3 / XTAL2 P0.4 / UART0 TX P0.5 / UART0 RX P0.6 / CAN TX P0.7 / CAN RX P1.0 P1.1 P1.2 P1.3 39 38 37 36 35 34 33 32 31 D es ig n s P0.2 / XTAL1 11 12 13 14 15 16 17 18 19 20 P3.7 P3.6 P3.5 P3.4 P3.3 P3.2 P3.1 P3.0 P2.7 P2.6 tR P1.4 29 P1.5 28 P1.6 27 P1.7 26 P2.0 25 P2.1 24 P2.2 23 P2.3 22 P2.4 21 P2.5 Figure 3.1. QFN-40 Pinout Diagram (Top View) IQ Ve rs io n no 30 GND ec P4.0 / C2D ew 4 rN VDD C8051F568-IM C8051F569-IM C8051F570-IM C8051F571-IM C8051F572-IM C8051F573-IM C8051F574-IM C8051F575-IM (Top View) fo 3 d VREGIN de 2 en VIO m 1 om P0.1 / CNVSTR 40 C8051F55x/56x/57x Rev. 1.2 24 5 GND 6 GNDA 7 P0.0 / VREF 8 P0.5 / UART0 RX P0.6 / CAN TX P0.7 / CAN RX P1.0 P1.1 29 28 27 26 25 10 11 12 13 14 15 16 RST / C2CK P2.7 P2.6 P2.5 P2.4 P2.3 P2.2 Rev. 1.2 D es ig n s P0.4 / UART0 TX P0.3 / XTAL2 31 30 P0.2 / XTAL1 9 P3.0 / C2D tR no n io Ve rs Figure 3.2. QFP-32 Pinout Diagram (Top View) IQ 25 ew VDDA rN 4 fo VDD d 3 de VREGIN en 2 m VIO C8051F560-IQ C8051F561-IQ C8051F562-IQ C8051F563-IQ C8051F564-IQ C8051F565-IQ C8051F566-IQ C8051F567-IQ (Top View) om 1 ec P0.1 / CNVSTR 32 C8051F55x/56x/57x 24 P1.2 23 P1.3 22 P1.4 21 P1.5 20 P1.6 19 P1.7 18 P2.0 17 P2.1 P0.3 / XTAL2 P0.4 / UART0 TX P0.5 / UART0 RX P0.6 / CAN TX P0.7 / CAN RX P1.0 P1.1 31 30 29 28 27 26 25 rN ew D es ig n s P0.2 / XTAL1 10 11 RST / C2CK P2.7 16 9 P3.0 / C2D tR no n io 24 P1.2 23 P1.3 22 P1.4 21 P1.5 20 P1.6 19 P1.7 18 P2.0 17 P2.1 Figure 3.3. QFN-32 Pinout Diagram (Top View) IQ Ve rs P2.2 8 fo P0.0 / VREF GND 15 7 P2.3 GNDA d 6 14 GND P2.4 5 de VDDA 13 4 P2.5 VDD en 3 12 VREGIN C8051F560-IM C8051F561-IM C8051F562-IM C8051F563-IM C8051F564-IM C8051F565-IM C8051F566-IM C8051F567-IM (Top View) P2.6 2 m VIO om 1 ec P0.1 / CNVSTR 32 C8051F55x/56x/57x Rev. 1.2 26 s P0.6/CAN0 TX 19 ig n P0.5/UART0 RX 20 D es P0.4/UART0 TX 21 ew P0.3/XTAL2 P0.2/XTAL1 23 22 P0.1/CNVSTR 1 GND 4 GNDA 5 P0.0/VREF 6 rN 3 P1.0 fo VDD P0.7/CAN0 RX 17 16 P1.1 15 P1.2 14 P1.3 13 P1.4 d 2 de VREGIN 18 C8051F550-IM C8051F551-IM C8051F552-IM C8051F553-IM C8051F554-IM C8051F555-IM C8051F556-IM C8051F557-IM (Top View) en VIO 24 C8051F55x/56x/57x 9 10 11 12 P2.0 P1.7 P1.6 P1.5 8 RST/C2CK P2.1/C2D no tR ec 7 om m GND IQ Ve rs io n Figure 3.4. QFN-24 Pinout Diagram (Top View) 27 Rev. 1.2 C8051F55x/56x/57x 4. Package Specifications m en de d fo rN ew D es ig n s 4.1. QFN-40 Package Specifications om Figure 4.1. QFN-40 Package Drawing Typ no 0.80 0.00 0.18 4.00 0.85 0.23 6.00 BSC 4.10 0.50 BSC 6.00 BSC Max Dimension Min Typ Max 0.90 0.05 0.28 E2 L L1 aaa bbb ddd eee 4.00 0.35 4.10 0.40 4.20 0.45 0.10 0.10 0.10 0.05 0.08 4.20 rs io n A A1 b D D2 e E Min tR Dimension ec Table 4.1. QFN-40 Package Dimensions IQ Ve Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to JEDEC Solid State Outline MO-220, variation VJJD-5, except for features A, D2, and E2 which are toleranced per supplier designation. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev. 1.2 28 fo rN ew D es ig n s C8051F55x/56x/57x d Figure 4.2. QFN-40 Landing Diagram Max C1 5.80 5.90 C2 5.80 Dimension Max X2 4.10 4.20 5.90 Y1 0.75 0.85 Y2 4.10 4.20 m en Min e Min om Dimension de Table 4.2. QFN-40 Landing Diagram Dimensions 0.50 BSC X1 0.25 ec 0.15 no tR Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimension and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-SM-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. rs io n Solder Mask Design 5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm minimum, all the way around the pad. IQ Ve Stencil Design 6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 7. The stencil thickness should be 0.125 mm (5 mils). 8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. 9. A 4x4 array of 0.80 mm square openings on a 1.05 mm pitch should be used for the center ground pad. Card Assembly 10. A No-Clean, Type-3 solder paste is recommended. 11. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 29 Rev. 1.2 C8051F55x/56x/57x tR ec om m en de d fo rN ew D es ig n s 4.2. QFP-32 Package Specifications no Figure 4.3. QFP-32 Package Drawing IQ Ve rs io n Dimension A A1 A2 b c D D1 e Min — 0.05 1.35 0.30 0.09 Table 4.3. QFP-32 Package Dimensions Typ — — 1.40 0.37 — 9.00 BSC. 7.00 BSC. 0.80 BSC. Max 1.60 0.15 1.45 0.45 0.20 Dimension E E1 L aaa bbb ccc ddd Min 0.45 θ 0° Typ 9.00 BSC. 7.00 BSC. 0.60 0.20 0.20 0.10 0.20 3.5° Max 0.75 7° Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC outline MS-026, variation BBA. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev. 1.2 30 de d fo rN ew D es ig n s C8051F55x/56x/57x en Figure 4.4. QFP-32 Landing Diagram C1 8.40 C2 8.40 E Max Dimension Min Max 8.50 X1 0.40 0.50 8.50 Y1 1.25 1.35 om Min ec Dimension m Table 4.4. QFP-32 Landing Diagram Dimensions tR 0.80 BSC no Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. rs io n Solder Mask Design 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm minimum, all the way around the pad. IQ Ve Stencil Design 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.125 mm (5 mils). 6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. Card Assembly 7. A No-Clean, Type-3 solder paste is recommended. 8. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 31 Rev. 1.2 C8051F55x/56x/57x m en de d fo rN ew D es ig n s 4.3. QFN-32 Package Specifications om Figure 4.5. QFN-32 Package Drawing Min A A1 b D D2 e E 0.80 0.00 0.18 Typ Max Dimension Min Typ Max 0.9 0.02 0.25 5.00 BSC. 3.30 0.50 BSC. 5.00 BSC. 1.00 0.05 0.30 E2 L L1 aaa bbb ddd eee 3.20 0.30 0.00 — — — — 3.30 0.40 — — — — — 3.40 0.50 0.15 0.15 0.15 0.05 0.08 io n no tR Dimension ec Table 4.5. QFN-32 Package Dimensions 3.20 3.40 IQ Ve rs Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-220, variation VHHD except for custom features D2, E2, and L which are toleranced per supplier designation. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev. 1.2 32 d fo rN ew D es ig n s C8051F55x/56x/57x de Figure 4.6. QFN-32 Landing Diagram C1 4.80 C2 4.80 e Max m Min 4.90 om Dimension en Table 4.6. QFN-32 Landing Diagram Dimensions 4.90 ec 0.50 BSC X1 Min Max X2 3.20 3.40 Y1 0.75 0.85 Y2 3.20 3.40 0.30 tR 0.20 Dimension no Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. rs io n Solder Mask Design 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm minimum, all the way around the pad. IQ Ve Stencil Design 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.125 mm (5 mils). 6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. 7. A 3x3 array of 1.0 mm openings on a 1.20 mm pitch should be used for the center ground pad. Card Assembly 8. A No-Clean, Type-3 solder paste is recommended. 9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 33 Rev. 1.2 C8051F55x/56x/57x en de d fo rN ew D es ig n s 4.4. QFN-24 Package Specifications om m Figure 4.7. QFN-24 Package Drawing Table 4.7. QFN-24 Package Dimensions A A1 b D D2 e E E2 0.70 0.00 0.18 Typ Max Dimension Min Typ Max 0.75 0.02 0.25 4.00 BSC 2.70 0.50 BSC 4.00 BSC 2.70 0.80 0.05 0.30 L L1 aaa bbb ddd eee Z Y 0.30 0.00 0.40 0.50 0.15 0.15 0.10 0.05 0.08 ec Min io n no tR Dimension 2.55 2.55 2.80 2.80 0.24 0.18 IQ Ve rs Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to JEDEC Solid State Outline MO-220, variation WGGD, except for custom features D2, E2, Z, Y, and L which are toleranced per supplier designation. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev. 1.2 34 fo rN ew D es ig n s C8051F55x/56x/57x de d Figure 4.8. QFN-24 Landing Diagram 3.90 C2 3.90 Dimension Min Max 4.00 X2 2.70 2.80 4.00 Y1 0.65 0.75 Y2 2.70 2.80 m C1 Max om Min E 0.50 BSC X1 ec Dimension en Table 4.8. QFN-24 Landing Diagram Dimensions 0.20 0.30 no tR Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. io n Solder Mask Design 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm minimum, all the way around the pad. IQ Ve rs Stencil Design 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.125 mm (5 mils). 6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. 7. A 2x2 array of 1.10 mm x 1.10 mm openings on a 1.30 mm pitch should be used for the center ground pad. Card Assembly 8. A No-Clean, Type-3 solder paste is recommended. 9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 35 Rev. 1.2 C8051F55x/56x/57x 5. Electrical Characteristics s 5.1. Absolute Maximum Specifications Typ Max Ambient Temperature under Bias –55 — 135 Storage Temperature –65 — Voltage on VREGIN with Respect to GND –0.3 — Voltage on VDD with Respect to GND –0.3 Voltage on VDDA with Respect to GND –0.3 Voltage on VIO with Respect to GND en Maximum Output Current Sunk by RST or any Port Pin °C 5.5 V V — 2.8 V — 5.5 V –0.3 — VIO + 0.3 V — — 500 mA — — 100 mA — — 100 mA m Maximum Output Current Sourced by any Port Pin 150 2.8 fo d de Maximum Total Current through VREGIN or GND °C — –0.3 Voltage on any Port I/O Pin or RST with Respect to GND Units D es Min ew Conditions rN Parameter ig n Table 5.1. Absolute Maximum Ratings IQ Ve rs io n no tR ec om Note: Stresses outside of the range of the “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions outside of those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Rev. 1.2 36 C8051F55x/56x/57x 5.2. Electrical Characteristics Table 5.2. Global Electrical Characteristics System Clock > 25 MHz Analog Supply Voltage (VDDA) System Clock < 25 MHz (Must be connected to VDD) System Clock > 25 MHz Port I/O Supply Voltage (VIO) Normal Operation Typ — Max 5.25 VRST1 — 2.75 2 — VRST1 — 2 — 2.75 — 5.25 V 1.5 — V 0 — 50 MHz 9 — — ns 9 — — ns rN 1.82 — Digital Supply RAM Data Retention Voltage fo SYSCLK (System Clock)3 TSYSH (SYSCLK High Time) d TSYSL (SYSCLK Low Time) Units V ig n System Clock < 25 MHz Min 1.8 D es Digital Supply Voltage (VDD) Conditions 2.75 V 2.75 ew Parameter Supply Input Voltage (VREGIN) V µA VDD = 2.1 V, F = 1.5 MHz — 660 — µA VDD = 2.1 V, F = 25 MHz — 9.2 11 mA VDD = 2.1 V, F = 50 MHz — 17 21 mA VDD = 2.6 V, F = 200 kHz — 120 — µA VDD = 2.6 V, F = 1.5 MHz — 920 — µA VDD = 2.6 V, F = 25 MHz — 13 21 mA VDD = 2.6 V, F = 50 MHz — 22 33 mA F = 25 MHz F = 1 MHz — — 68 77 — — %/V %/V en de Specified Operating –40 — +125 Temperature Range Digital Supply Current—CPU Active (Normal Mode, fetching instructions from Flash) VDD = 2.1 V, F = 200 kHz — 85 — I 4 om m DD no tR ec IDD4 IDD Supply Sensitivity 4 IQ Ve rs io n Notes: 1. Given in Table 5.4 on page 41. 2. VIO should not be lower than the VDD voltage. 3. SYSCLK must be at least 32 kHz to enable debugging. 4. Guaranteed by characterization. Does not include oscillator supply current. 5. IDD estimation for different frequencies. 6. Idle IDD estimation for different frequencies. 37 Rev. 1.2 s –40 to +125 °C, 24 MHz system clock unless otherwise specified. °C C8051F55x/56x/57x Table 5.2. Global Electrical Characteristics (Continued) Units mA/MHz ig n Conditions Min Typ Max VDD = 2.1 V, F < 12.5 MHz, T = — 0.43 — IDD Frequency Sensitivity 4,5 25 °C — 0.33 — VDD = 2.1 V, F > 12.5 MHz, T = 25 °C — 0.60 — VDD = 2.6 V, F < 12.5 MHz, T = 25 °C — 0.42 — VDD = 2.6 V, F > 12.5 MHz, T = 25 °C Digital Supply Current—CPU Inactive (Idle Mode, not fetching instructions from Flash) VDD = 2.1 V, F = 200 kHz — 50 — I 4 mA/MHz rN ew D es Parameter s –40 to +125 °C, 24 MHz system clock unless otherwise specified. DD VDD = 2.1 V, F = 1.5 MHz — µA — 6.5 8.0 mA — 13 16 mA — 67 — µA VDD = 2.6 V, F = 1.5 MHz — 530 — µA VDD = 2.6 V, F = 25 MHz — 8.0 15 mA VDD = 2.6 V, F = 50 MHz — 16 25 mA F = 25 MHz F = 1 MHz VDD = 2.1V, F < 12.5 MHz, T = 25 °C — — — 55 58 0.26 — — — VDD = 2.1V, F > 12.5 MHz, T = 25 °C — 0.26 — VDD = 2.6V, F < 12.5 MHz, T = 25 °C — 0.34 — VDD = 2.6V, F > 12.5 MHz, T = 25 °C — 0.34 — — — — 1 6 70 — — — fo en de d VDD = 2.6 V, F = 200 kHz m om tR ec IDD Frequency Sensitivity 4.6 n no Digital Supply Current4 (Stop or Suspend Mode) µA 410 VDD = 2.1 V, F = 50 MHz IDD Supply Sensitivity4 mA/MHz — VDD = 2.1 V, F = 25 MHz IDD4 mA/MHz %/V mA/MHz Oscillator not running, VDD Monitor Disabled Temp = 25 °C Temp = 60 °C Temp= 125 °C µA IQ Ve rs io Notes: 1. Given in Table 5.4 on page 41. 2. VIO should not be lower than the VDD voltage. 3. SYSCLK must be at least 32 kHz to enable debugging. 4. Guaranteed by characterization. Does not include oscillator supply current. 5. IDD estimation for different frequencies. 6. Idle IDD estimation for different frequencies. Rev. 1.2 38 tR ec om m en de d fo rN ew D es ig n s C8051F55x/56x/57x no Figure 5.1. Minimum VDD Monitor Threshold vs. System Clock Frequency IQ Ve rs io n Note: With system clock frequencies greater than 25 MHz, the VDD monitor level should be set to the high threshold (VDMLVL = 1b in SFR VDM0CN) to prevent undefined CPU operation. The high threshold should only be used with an external regulator powering VDD directly. See Figure 9.2 on page 80 for the recommended power supply connections. 39 Rev. 1.2 C8051F55x/56x/57x Table 5.3. Port I/O DC Electrical Characteristics rN — — 45 550 — — — — — 0.3 x VIO ±2 — 7 9 fo — — 0.7 x VIO — — mV 40 400 V V µA — 17 22 Weak Pullup On, VIO = 5.0 V, VIN = 0 V, VDD = 2.6 V — 49 115 m ig n 50 750 Weak Pullup On, VIO = 2.6 V, VIN = 0 V, VDD = 2.6 V IQ Ve rs io n no tR ec om Units V D es — — Max — — — ew — — — — en Weak Pullup On, VIO = 2.1 V, VIN = 0 V, VDD = 1.8 V Input Leakage Current Typ — — VIO – 0.7 de Weak Pullup Off Min VIO – 0.4 VIO – 0.02 — d Parameters Conditions Output High Voltage IOH = –3 mA, Port I/O push-pull IOH = –10 µA, Port I/O push-pull IOH = –10 mA, Port I/O push-pull Output Low Voltage VIO = 1.8 V: IOL = 70 µA IOL = 8.5 mA VIO = 2.7 V: IOL = 70 µA IOL = 8.5 mA VIO = 5.25 V: IOL = 70 µA IOL = 8.5 mA VREGIN = 5.25 V Input High Voltage VREGIN = 2.7 V Input Low Voltage s VDD = 1.8 to 2.75 V, –40 to +125 °C unless otherwise specified. Rev. 1.2 40 C8051F55x/56x/57x Table 5.4. Reset Electrical Characteristics –40 to +125 °C unless otherwise specified. Typ Max Units — — 40 mV RST Input High Voltage 0.7 x VIO — — RST Input Low Voltage — — — 49 VDD RST Threshold (VRST-LOW) 1.65 1.75 VDD RST Threshold (VRST-HIGH) 2.25 VIO = 5 V; IOL = 70 µA RST Input Pullup Current RST = 0.0 V, VIO = 5 V VREGIN Ramp Time for Power On VREGIN Ramp 0–1.8 V VDD = 2.1 V 2.45 V — 1 ms µs 250 600 — 155 175 µs 6 — — µs — 60 100 µs — 1 2 µA de en ec VDD Monitor Supply Current 2.30 200 om VDD Monitor Turn-on Time V 600 m Minimum RST Low Time to Generate a System Reset 1.80 340 Delay between release of any reset source and code execution at location 0x0000 Reset Time Delay µA 200 d VDD = 2.5 V 115 fo Time from last system clock rising edge to reset initiation Missing Clock Detector Timeout 0.3 x VIO rN — ig n RST Output Low Voltage Table 5.5. Flash Electrical Characteristics Ve rs io n Endurance Retention Erase Cycle Time Write Cycle Time VDD IQ Conditions C8051F550-3, ‘F560-3, ‘F568-9, and ‘F570-1 C8051F554-7, ‘F564-7, and ‘F572-5 Min Temperature during Programming Operations Typ Max Bytes 16384 125 °C 25 MHz System Clock 25 MHz System Clock 20 k 10 28 79 150 k — 30 84 — — 45 125 Erase/Write Years ms µs Write/Erase operations VRST-HIGH2 — — V 0 –40 — — +125 +125 °C –I Devices –A Devices 1. On the 32 kB Flash devices, 1024 bytes at addresses 0x7C00 to 0x7FFF are reserved. 2. See Table 5.4 for the VRST-HIGH specification. 41 Units 327681 no Flash Size tR VDD = 1.8 to 2.75 V, –40 to +125 °C unless otherwise specified. Parameter Rev. 1.2 s Min D es Conditions ew Parameter C8051F55x/56x/57x Table 5.6. Internal High-Frequency Oscillator Electrical Characteristics Typ Max Units IFCN = 111b; VDD > VREGMIN1 24 – 0.5% 242 24 + 0.5% MHz IFCN = 111b; VDD < VREGMIN1 24 – 1.0% 242 24 + 1.0% 1300 Oscillator Supply Current (from VDD) Internal Oscillator On OSCICN[7:6] = 11b — 880 Internal Oscillator Suspend OSCICN[7:6] = 00b ZTCEN = 1 Temp = 25 °C Temp = 85 °C Temp = 125 °C — 67 90 130 — Wake-up Time From Suspend OSCICN[7:6] = 00b — 1 — µs Power Supply Sensitivity Constant Temperature — rN Oscillator Frequency Min ig n Conditions D es Parameter 0.11 — %/V Temperature Sensitivity3 Constant Supply TC1 TC2 — — 5.0 –0.65 — — ppm/°C ppm/°C2 de d fo ew µA m en 1. VREGMIN is the minimum output of the voltage regulator for its low setting (REG0CN: REG0MD = 0b). See Table 5.8, “Voltage Regulator Electrical Characteristics,” on page 43. 2. This is the average frequency across the operating temperature range 3. Use temperature coefficients TC1 and TC2 to calculate the new internal oscillator frequency using the following equation: om f(T) = f0 x (1 + TC1 x (T - T0) + TC2 x (T - T0)2) IQ Ve rs io n no tR ec where f0 is the internal oscillator frequency at 25 °C and T0 is 25 °C. Rev. 1.2 s VDD = 1.8 to 2.75 V, –40 to +125 °C unless otherwise specified; Using factory-calibrated settings. 42 C8051F55x/56x/57x Table 5.7. Clock Multiplier Electrical Specifications Min 2 — — Typ — — 0.9 Min 1.8* — 2.0 Typ — 10 2.1 Table 5.8. Voltage Regulator Electrical Characteristics rN Units V mV/mA V 2.6 1 2.75 9 µA — –0.02 V — 0.29 — mV/°C — 450 — µs –0.21 d de en m om ec tR no n io rs Ve IQ Rev. 1.2 Max 5.25 — 2.25 2.5 — *Note: The minimum input voltage is 1.8 V or VDD + VDO(max load), whichever is greater 43 Units MHz MHz mA fo Parameter Conditions Input Voltage Range (VREGIN) Dropout Voltage (VDO) Maximum Current = 50 mA 2.1 V operation (REG0MD = 0) Output Voltage (VDD) 2.6 V operation (REG0MD = 1) Bias Current Dropout Indicator Detection With respect to VDD Threshold Output Voltage Temperature Coefficient 50 mA load with VREGIN = 2.4 V VREG Settling Time and VDD load capacitor of 4.8 µF ew VDD = 1.8 to 2.75 V, –40 to +125 °C unless otherwise specified. Max — 50 1.9 ig n Conditions D es Parameter Input Frequency (Fcmin) Output Frequency Power Supply Current s VDD = 1.8 to 2.75 V, –40 to +125 °C unless otherwise specified. C8051F55x/56x/57x Table 5.9. ADC0 Electrical Characteristics Conditions Min Typ Max — — –10 12 ±0.5 ±0.5 3.0 ±3 ±1 10 –20 — 5.7 7.7 Guaranteed Monotonic 1 Offset Error Full Scale Error Offset Temperature Coefficient 20 — ew Resolution Integral Nonlinearity Differential Nonlinearity bits LSB LSB LSB D es DC Accuracy Units ig n Parameter LSB ppm/°C Dynamic performance (10 kHz sine-wave single-ended input, 1 dB below Full Scale, 200 ksps) 63 — — Up to the 5th harmonic; fo Conversion Rate SAR Conversion Clock Track/Hold Acquisition Time3 en Throughput Rate4 VDDA > 2.0 V VDDA < 2.0 V VDDA > 2.0 V gain = 1.0 (default) gain = n Absolute Pin Voltage with respect to GND Sampling Capacitance Input Multiplexer Impedance ec tR Power Specifications m ADC Input Voltage Range5 om Analog Inputs n no Operating Mode, 200 ksps — — — dB dB dB — 13 — — 3.6 — MHz clocks 1.5 3.5 — — — — — — 200 µs 0 0 0 — V — VREF VREF / n VIO — — 31 3 — — pF kΩ — 1100 1500 µA — 5 — 1100 — –60 1500 — — µA µs mV/V d 2 de Conversion Time in SAR Clocks Power Supply Current (VDDA supplied to ADC0) Burst Mode (Idle) Power-On Time Power Supply Rejection 65 80 -82 rN Signal-to-Noise Plus Distortion Total Harmonic Distortion Spurious-Free Dynamic Range ksps V IQ Ve rs io Notes: 1. Represents one standard deviation from the mean. Offset and full-scale error can be removed through calibration. 2. An additional 2 FCLK cycles are required to start and complete a conversion 3. Additional tracking time may be required depending on the output impedance connected to the ADC input. See Section “6.2.1. Settling Time Requirements” on page 52. 4. An increase in tracking time will decrease the ADC throughput. 5. See Section “6.3. Selectable Gain” on page 53 for more information about the setting the gain. Rev. 1.2 s VDDA = 1.8 to 2.75 V, –40 to +125 °C, VREF = 1.5 V (REFSL=0) unless otherwise specified. 44 C8051F55x/56x/57x Table 5.10. Temperature Sensor Electrical Characteristics Typ Max Units Linearity — ±0.1 — °C Slope — 3.33 — Slope Error* — 88 µV/°C — mV — mV Temp = 0 °C — 856 Offset Error* Temp = 0 °C — ±14 Tracking Time 12 18 — µA — — µs rN — mV/°C — Offset Power Supply Current ig n Min D es Conditions ew Parameter s VDDA = 1.8 to 2.75 V, –40 to +125 °C unless otherwise specified. fo *Note: Represents one standard deviation from the mean. VDDA = 1.8 to 2.75 V, –40 to +125 °C unless otherwise specified. Conditions Min Typ Max 25 °C ambient (REFLV = 0) 1.45 1.50 1.55 25 °C ambient (REFLV = 1), VDD = 2.6 V 2.15 2.20 2.25 — 5 10 mA — 38 — ppm/°C Internal — 30 50 µA Load = 0 to 200 µA to AGND — 3 — µV/µA 4.7 µF tantalum and 0.1 µF bypass — 1.5 — ms 0.1 µF bypass — 46 — µs — 1.2 — mV/V 1.5 — VDDA V Sample Rate = 200 ksps; VREF = 1.5 V — 2.1 — µA REFBE = 1 or TEMPE = 1 — 21 40 µA de Parameter en Internal Reference (REFBE = 1) m Output Voltage om VREF Short-Circuit Current ec VREF Temperature Coefficient tR Power Consumption Load Regulation d Table 5.11. Voltage Reference Electrical Characteristics no VREF Turn-on Time 1 VREF Turn-on Time 2 V n Power Supply Rejection Units io External Reference (REFBE = 0) rs Input Voltage Range Ve Input Current Power Specifications IQ Reference Bias Generator 45 Rev. 1.2 C8051F55x/56x/57x Table 5.12. Comparator 0 and Comparator 1 Electrical Characteristics Conditions Min Typ Max CPn+ – CPn– = 100 mV — 330 — CPn+ – CPn– = –100 mV — 390 — Response Time: Mode 1, Vcm* = 1.5 V CPn+ – CPn– = 100 mV — 490 CPn+ – CPn– = –100 mV — 610 Response Time: Mode 2, Vcm* = 1.5 V CPn+ – CPn– = 100 mV — CP0+ – CP0– = –100 mV Response Time: Mode 3, Vcm* = 1.5 V ns ns D es Response Time: Mode 0, Vcm* = 1.5 V Units ig n Parameter ns — ns 590 — ns — 750 — ns CPn+ – CPn– = 100 mV — 2300 — ns CPn+ – CPn– = –100 mV — 3100 — ns fo rN ew — Common-Mode Rejection Ratio — 2.1 13 mV/V -2 0 2 mV 2 6 10 mV 5 11 20 mV CPnHYP1–0 = 00 Positive Hysteresis 2 CPnHYP1–0 = 01 Positive Hysteresis 3 CPnHYP1–0 = 10 Positive Hysteresis 4 CPnHYP1–0 = 11 13 21 40 mV Negative Hysteresis 1 CPnHYN1–0 = 00 -2 0 2 mV Negative Hysteresis 2 CPnHYN1–0 = 01 2 5 10 mV Negative Hysteresis 3 CPnHYN1–0 = 10 5 11 20 mV Negative Hysteresis 4 CPnHYN1–0 = 11 13 21 40 mV –0.25 — VIO + 0.25 V — 8 — pF –10 — +10 mV Power Supply Rejection — 0.18 — mV/V Power-up Time — 3 — µs Mode 0 — 6.3 20 µA Mode 1 — 3.4 10 µA Mode 2 — 2.6 7.5 µA Mode 3 — 0.6 3 µA ec om m en de d Positive Hysteresis 1 no Input Capacitance tR Inverting or Non-Inverting Input Voltage Range Input Offset Voltage Ve rs io n Power Supply IQ Supply Current at DC *Note: Vcm is the common-mode voltage on CP0+ and CP0–. Rev. 1.2 s VIO = 1.8 to 5.25 V, –40 to +125 °C unless otherwise noted. 46 C8051F55x/56x/57x 6. 12-Bit ADC (ADC0) n Temp Sensor io GND Timer 1 Overflow 10 CNVSTR Input 11 Timer 2 Overflow Accumulator AD0SC4 AD0SC3 AD0SC2 AD0SC1 AD0SC0 AD0RPT1 AD0RPT0 GAINEN no tR ADC0GNH ADC0GNL ADC0GNA 01 AD0TM1:0 AD0PRE AD0POST FCLK REF ADC ec 35-to-1 AMUX0 AD0BUSY (W) ADC0L 12-Bit SAR Selectable Gain 00 ADC0H om P1.7 P2.0 VDD fo d Burst Mode Logic m Burst Mode Oscillator 25 MHz Max Start Conversion en P0.7 P1.0 VDD FCLK SYSCLK ADC0LTH ADC0LTL ADC0CF ADC0GTH ADC0GTL AD0WINT 32 Window Compare Logic Figure 6.1. ADC0 Functional Block Diagram IQ Ve rs de Start Conversion P0.0 P2.7 P3.0 AD0EN BURSTEN AD0INT AD0BUSY AD0WINT AD0LJST AD0CM1 AD0CM0 AD0PWR3 AD0PWR2 AD0PWR1 AD0PWR0 AD0TM1 AD0TM0 AD0TK1 AD0TK0 P3.1-P3.7 available on 40pin packages P3.7 ADC0CN ADC0TK ADC0MX4 ADC0MX3 ADC0MX2 ADC0MX1 ADC0MX0 ADC0MX P2.2-P2.7, P3.0 available on 40-pin and 32-pin packages rN ew D es ig n s The ADC0 on the C8051F55x/56x/57x consists of an analog multiplexer (AMUX0) with 33, 25, or 18 total input selections and a 200 ksps, 12-bit successive-approximation-register (SAR) ADC with integrated track-and-hold, programmable window detector, programmable attenuation (1:2), and hardware accumulator. The ADC0 subsystem has a special Burst Mode which can automatically enable ADC0, capture and accumulate samples, then place ADC0 in a low power shutdown mode without CPU intervention. The AMUX0, data conversion modes, and window detector are all configurable under software control via the Special Function Registers shows in Figure 6.1. ADC0 inputs are single-ended and may be configured to measure P0.0-P3.7, the Temperature Sensor output, VDD, or GND with respect to GND. The voltage reference for ADC0 is selected as described in Section “6.6. Temperature Sensor” on page 67. ADC0 is enabled when the AD0EN bit in the ADC0 Control register (ADC0CN) is set to logic 1, or when performing conversions in Burst Mode. ADC0 is in low power shutdown when AD0EN is logic 0 and no Burst Mode conversions are taking place. Rev. 1.2 47 C8051F55x/56x/57x 6.1. Modes of Operation In a typical system, ADC0 is configured using the following steps: s 1. If a gain adjustment is required, refer to Section “6.3. Selectable Gain” on page 53. ig n 2. Choose the start of conversion source. 3. Choose Normal Mode or Burst Mode operation. D es 4. If Burst Mode, choose the ADC0 Idle Power State and set the Power-up Time. 5. Choose the tracking mode. Note that Pre-Tracking Mode can only be used with Normal Mode. 6. Calculate the required settling time and set the post convert-start tracking time using the AD0TK bits. 8. Choose the output word justification (Right-Justified or Left-Justified). ew 7. Choose the repeat count. 9. Enable or disable the End of Conversion and Window Comparator Interrupts. rN 6.1.1. Starting a Conversion fo A conversion can be initiated in one of four ways, depending on the programmed states of the ADC0 Start of Conversion Mode bits (AD0CM1–0) in register ADC0CN. Conversions may be initiated by one of the following: Writing a 1 to the AD0BUSY bit of register ADC0CN A rising edge on the CNVSTR input signal (pin P0.1)  A Timer 1 overflow (i.e., timed continuous conversions)  A Timer 2 overflow (i.e., timed continuous conversions) en de  d  tR ec om m Writing a 1 to AD0BUSY provides software control of ADC0 whereby conversions are performed "ondemand.” During conversion, the AD0BUSY bit is set to logic 1 and reset to logic 0 when the conversion is complete. The falling edge of AD0BUSY triggers an interrupt (when enabled) and sets the ADC0 interrupt flag (AD0INT). Note: When polling for ADC conversion completions, the ADC0 interrupt flag (AD0INT) should be used. Converted data is available in the ADC0 data registers, ADC0H:ADC0L, when bit AD0INT is logic 1. Note that when Timer 2 overflows are used as the conversion source, Low Byte overflows are used if Timer2 is in 8-bit mode; High byte overflows are used if Timer 2 is in 16-bit mode. See Section “25. Timers” on page 259 for timer configuration. no Important Note About Using CNVSTR: The CNVSTR input pin also functions as Port pin P0.1. When the CNVSTR input is used as the ADC0 conversion source, Port pin P0.1 should be skipped by the Digital Crossbar. To configure the Crossbar to skip P0.1, set to 1 Bit1 in register P0SKIP. See Section “19. Port Input/Output” on page 169 for details on Port I/O configuration. n 6.1.2. Tracking Modes IQ Ve rs io Each ADC0 conversion must be preceded by a minimum tracking time for the converted result to be accurate. ADC0 has three tracking modes: Pre-Tracking, Post-Tracking, and Dual-Tracking. Pre-Tracking Mode provides the minimum delay between the convert start signal and end of conversion by tracking continuously before the convert start signal. This mode requires software management in order to meet minimum tracking requirements. In Post-Tracking Mode, a programmable tracking time starts after the convert start signal and is managed by hardware. Dual-Tracking Mode maximizes tracking time by tracking before and after the convert start signal. Figure 6.2 shows examples of the three tracking modes. Pre-Tracking Mode is selected when AD0TM is set to 10b. Conversions are started immediately following the convert start signal. ADC0 is tracking continuously when not performing a conversion. Software must allow at least the minimum tracking time between each end of conversion and the next convert start signal. The minimum tracking time must also be met prior to the first convert start signal after ADC0 is enabled. 48 Rev. 1.2 C8051F55x/56x/57x ig n s Post-Tracking Mode is selected when AD0TM is set to 01b. A programmable tracking time based on AD0TK is started immediately following the convert start signal. Conversions are started after the programmed tracking time ends. After a conversion is complete, ADC0 does not track the input. Rather, the sampling capacitor remains disconnected from the input making the input pin high-impedance until the next convert start signal. D es Dual-Tracking Mode is selected when AD0TM is set to 11b. A programmable tracking time based on AD0TK is started immediately following the convert start signal. Conversions are started after the programmed tracking time ends. After a conversion is complete, ADC0 tracks continuously until the next conversion is started. rN ew Depending on the output connected to the ADC input, additional tracking time, more than is specified in Table 5.9, may be required after changing MUX settings. See the settling time requirements described in Section “6.2.1. Settling Time Requirements” on page 52. Pre-Tracking AD0TM = 10 Track Post-Tracking AD0TM= 01 Idle Track Convert Idle Track Convert.. Dual-Tracking AD0TM = 11 Track Track en fo Convert Start Track Track Convert.. Track Convert ... de d Convert m Convert om Figure 6.2. ADC0 Tracking Modes 6.1.3. Timing tR ec ADC0 has a maximum conversion speed specified in Table 5.9. ADC0 is clocked from the ADC0 Subsystem Clock (FCLK). The source of FCLK is selected based on the BURSTEN bit. When BURSTEN is logic 0, FCLK is derived from the current system clock. When BURSTEN is logic 1, FCLK is derived from the Burst Mode Oscillator, an independent clock source with a maximum frequency of 25 MHz. n no When ADC0 is performing a conversion, it requires a clock source that is typically slower than FCLK. The ADC0 SAR conversion clock (SAR clock) is a divided version of FCLK. The divide ratio can be configured using the AD0SC bits in the ADC0CF register. The maximum SAR clock frequency is listed in Table 5.9. IQ Ve rs io ADC0 can be in one of three states at any given time: tracking, converting, or idle. Tracking time depends on the tracking mode selected. For Pre-Tracking Mode, tracking is managed by software and ADC0 starts conversions immediately following the convert start signal. For Post-Tracking and Dual-Tracking Modes, the tracking time after the convert start signal is equal to the value determined by the AD0TK bits plus 2 FCLK cycles. Tracking is immediately followed by a conversion. The ADC0 conversion time is always 13 SAR clock cycles plus an additional 2 FCLK cycles to start and complete a conversion. Figure 6.3 shows timing diagrams for a conversion in Pre-Tracking Mode and tracking plus conversion in Post-Tracking or Dual-Tracking Mode. In this example, repeat count is set to one. Rev. 1.2 49 C8051F55x/56x/57x ig n s Convert Start Pre-Tracking Mode F S1 ... S2 ADC0 State S12 S13 F D es Time Convert rN ew AD0INT Flag Post-Tracking or Dual-Tracking Modes (AD0TK = ‘00') F S1 ADC0 State S2 F F S1 S2 S12 S13 F Convert d Track ... fo Time en de AD0INT Flag Key Equal to one period of FCLK. om Sn m F Each Sn is equal to one period of the SAR clock. tR 6.1.4. Burst Mode ec Figure 6.3. 12-Bit ADC Tracking Mode Example io n no Burst Mode is a power saving feature that allows ADC0 to remain in a very low power state between conversions. When Burst Mode is enabled, ADC0 wakes from a very low power state, accumulates 1, 4, 8, or 16 samples using an internal Burst Mode clock (approximately 25 MHz), then re-enters a very low power state. Since the Burst Mode clock is independent of the system clock, ADC0 can perform multiple conversions then enter a very low power state within a single system clock cycle, even if the system clock is slow (e.g., 32.768 kHz), or suspended. IQ Ve rs Burst Mode is enabled by setting BURSTEN to logic 1. When in Burst Mode, AD0EN controls the ADC0 idle power state (i.e. the state ADC0 enters when not tracking or performing conversions). If AD0EN is set to logic 0, ADC0 is powered down after each burst. If AD0EN is set to logic 1, ADC0 remains enabled after each burst. On each convert start signal, ADC0 is awakened from its Idle Power State. If ADC0 is powered down, it will automatically power up and wait the programmable Power-up Time controlled by the AD0PWR bits. Otherwise, ADC0 will start tracking and converting immediately. Figure 6.4 shows an example of Burst Mode Operation with a slow system clock and a repeat count of 4. Important Note: When Burst Mode is enabled, only Post-Tracking and Dual-Tracking modes can be used. When Burst Mode is enabled, a single convert start will initiate a number of conversions equal to the repeat count. When Burst Mode is disabled, a convert start is required to initiate each conversion. In both modes, the ADC0 End of Conversion Interrupt Flag (AD0INT) will be set after “repeat count” conversions have 50 Rev. 1.2 C8051F55x/56x/57x been accumulated. Similarly, the Window Comparator will not compare the result to the greater-than and less-than registers until “repeat count” conversions have been accumulated. ig n s Note: When using Burst Mode, care must be taken to issue a convert start signal no faster than once every four SYSCLK periods. This includes external convert start signals. D es System Clock Power-Up and Idle T C T C T C T C Dual-Tracking AD0TM = 11 AD0EN = 0 Powered Down Power-Up and Track T C T C T C T C Powered Down Power-Up and Idle T C.. Powered Down Power-Up and Track T C.. rN Powered Down fo Post-Tracking AD0TM = 01 AD0EN = 0 ew Convert Start (AD0BUSY or Timer Overflow) d AD0PWR Idle T C T C T C T C Dual-Tracking AD0TM = 11 AD0EN = 1 Track T C T C T C T C T C T C T C.. Track T C T C T C.. ec om T = Tracking C = Converting Idle m en de Post-Tracking AD0TM = 01 AD0EN = 1 Powered Down Power-Up and Idle T C Powered Down Power-Up and Idle T C.. Powered Down Power-Up and Track T C Powered Down Power-Up and Track T C.. no Post-Tracking AD0TM = 01 AD0EN = 0 tR Convert Start (CNVSTR) AD0PWR rs io n Dual-Tracking AD0TM = 11 AD0EN = 0 Idle T C Idle T C Idle.. Dual-Tracking AD0TM = 11 AD0EN = 1 Track T C Track T C Track.. IQ Ve Post-Tracking AD0TM = 01 AD0EN = 1 T = Tracking C = Converting Figure 6.4. 12-Bit ADC Burst Mode Example With Repeat Count Set to 4 Rev. 1.2 51 C8051F55x/56x/57x 6.2. Output Code Formatting D es ig n s The registers ADC0H and ADC0L contain the high and low bytes of the output conversion code. When the repeat count is set to 1, conversion codes are represented in 12-bit unsigned integer format and the output conversion code is updated after each conversion. Inputs are measured from 0 to VREF x 4095/4096. Data can be right-justified or left-justified, depending on the setting of the AD0LJST bit (ADC0CN.2). Unused bits in the ADC0H and ADC0L registers are set to 0. Example codes are shown below for both right-justified and left-justified data. Right-Justified ADC0H:ADC0L (AD0LJST = 0) Left-Justified ADC0H:ADC0L (AD0LJST = 1) VREF x 4095/4096 VREF x 2048/4096 VREF x 2047/4096 0 0x0FFF 0x0800 0x07FF 0x0000 0xFFF0 0x8000 0x7FF0 0x0000 rN ew Input Voltage Repeat Count = 4 VREF x 4095/4096 VREF x 2048/4096 VREF x 2047/4096 0 0x3FFC 0x2000 0x1FFC 0x0000 ec om Input Voltage m en de d fo When the ADC0 Repeat Count is greater than 1, the output conversion code represents the accumulated result of the conversions performed and is updated after the last conversion in the series is finished. Sets of 4, 8, or 16 consecutive samples can be accumulated and represented in unsigned integer format. The repeat count can be selected using the AD0RPT bits in the ADC0CF register. The value must be right-justified (AD0LJST = 0), and unused bits in the ADC0H and ADC0L registers are set to 0. The following example shows right-justified codes for repeat counts greater than 1. Notice that accumulating 2n samples is equivalent to left-shifting by n bit positions when all samples returned from the ADC have the same value. Repeat Count = 8 Repeat Count = 16 0x7FF8 0x4000 0x3FF8 0x0000 0xFFF0 0x8000 0x7FF0 0x0000 tR 6.2.1. Settling Time Requirements no A minimum tracking time is required before an accurate conversion is performed. This tracking time is determined by any series impedance, including the AMUX0 resistance, the ADC0 sampling capacitance, and the accuracy required for the conversion. IQ Ve rs io n Figure 6.5 shows the equivalent ADC0 input circuit. The required ADC0 settling time for a given settling accuracy (SA) may be approximated by Equation 6.1. When measuring the Temperature Sensor output, use the settling time specified in Table 5.10. When measuring VDD with respect to GND, RTOTAL reduces to RMUX. See Table 5.9 for ADC0 minimum settling time requirements as well as the mux impedance and sampling capacitor values. n 2 t = ln  -------- × R TOTAL C SAMPLE  SA Equation 6.1. ADC0 Settling Time Requirements Where: SA is the settling accuracy, given as a fraction of an LSB (for example, 0.25 to settle within 1/4 LSB). t is the required settling time in seconds. RTOTAL is the sum of the AMUX0 resistance and any external source resistance. n is the ADC resolution in bits (10). 52 Rev. 1.2 C8051F55x/56x/57x ig n s M U X S e le c t P x .x D es R MUX C SAM P LE rN Figure 6.5. ADC0 Equivalent Input Circuit ew R C In p u t = R M U X * C S A M P L E 6.3. Selectable Gain fo ADC0 on the C8051F55x/56x/57x family of devices implements a selectable gain adjustment option. By writing a value to the gain adjust address range, the user can select gain values between 0 and 1.016. m en de d For example, three analog sources to be measured have full-scale outputs of 5.0 V, 4.0 V, and 3.0 V, respectively. Each ADC measurement would ideally use the full dynamic range of the ADC with an internal voltage reference of 1.5 V or 2.2 V (set to 2.2 V for this example). When selecting the first source (5.0 V full-scale), a gain value of 0.44 (5 V full scale x 0.44 = 2.2 V full scale) provides a full-scale signal of 2.2 V when the input signal is 5.0 V. Likewise, a gain value of 0.55 (4 V full scale x 0.55 = 2.2 V full scale) for the second source and 0.73 (3 V full scale x 0.73 = 2.2 V full scale) for the third source provide full-scale ADC0 measurements when the input signal is full-scale. om Additionally, some sensors or other input sources have small part-to-part variations that must be accounted for to achieve accurate results. In this case, the programmable gain value could be used as a calibration value to eliminate these part-to-part variations. ec 6.3.1. Calculating the Gain Value no tR The ADC0 selectable gain feature is controlled by 13 bits in three registers. ADC0GNH contains the 8 upper bits of the gain value and ADC0GNL contains the 4 lower bits of the gain value. The final GAINADD bit (ADC0GNA.0) controls an optional extra 1/64 (0.016) of gain that can be added in addition to the ADC0GNH and ADC0GNL gain. The ADC0GNA.0 bit is set to 1 after a power-on reset. GAIN 1 gain =  --------------- + GAINADD ×  ------  4096   64 rs io n The equivalent gain for the ADC0GNH, ADC0GNL and ADC0GNA registers is as follows: IQ Ve Equation 6.2. Equivalent Gain from the ADC0GNH and ADC0GNL Registers Where: GAIN is the 12-bit word of ADC0GNH[7:0] and ADC0GNL[7:4] GAINADD is the value of the GAINADD bit (ADC0GNA.0) gain is the equivalent gain value from 0 to 1.016 Rev. 1.2 53 C8051F55x/56x/57x For example, if ADC0GNH = 0xFC, ADC0GNL = 0x00, and GAINADD = 1, GAIN = 0xFC0 = 4032, and the resulting equation is as follows: ig n s 4032 1 GAIN =  ------------- + 1 ×  ------ = 0.984 + 0.016 = 1.0  4096  64 ADC0GNL Value GAINADD Value GAIN Value 0xFC (default) 0x7C 0xBC 0x3C 0xFF 0xFF 0x00 (default) 0x00 0x00 0x00 0xF0 0xF0 1 (default) 1 1 1 0 1 4032 + 64 1984 + 64 3008 + 64 960 + 64 4095 + 0 4096 + 64 Equivalent Gain 1.0 (default) 0.5 0.75 0.25 ~1.0 1.016 rN ew ADC0GNH Value D es The table below equates values in the ADC0GNH, ADC0GNL, and ADC0GNA registers to the equivalent gain using this equation. fo For any desired gain value, the GAIN registers can be calculated by the following: de d 1 GAIN =  gain – GAINADD ×  ------  × 4096   64  en Equation 6.3. Calculating the ADC0GNH and ADC0GNL Values from the Desired Gain om m Where: GAIN is the 12-bit word of ADC0GNH[7:0] and ADC0GNL[7:4] GAINADD is the value of the GAINADD bit (ADC0GNA.0) gain is the equivalent gain value from 0 to 1.016 ec When calculating the value of GAIN to load into the ADC0GNH and ADC0GNL registers, the GAINADD bit can be turned on or off to reach a value closer to the desired gain value. tR For example, the initial example in this section requires a gain of 0.44 to convert 5 V full scale to 2.2 V full scale. Using Equation 6.3: no 1 GAIN =  0.44 – GAINADD ×  ------  × 4096   64  If GAINADD is set to 1, this makes the equation: rs io n 1 GAIN =  0.44 – 1 ×  ------  × 4096 = 0.424 × 4096 = 1738 = 0x06CA   64  IQ Ve The actual gain from setting GAINADD to 1 and ADC0GNH and ADC0GNL to 0x6CA is 0.4399. A similar gain can be achieved if GAINADD is set to 0 with a different value for ADC0GNH and ADC0GNL. 54 Rev. 1.2 C8051F55x/56x/57x 6.3.2. Setting the Gain Value ig n s The three programmable gain registers are accessed indirectly using the ADC0H and ADC0L registers when the GAINEN bit (ADC0CF.0) bit is set. ADC0H acts as the address register, and ADC0L is the data register. The programmable gain registers can only be written to and cannot be read. See Gain Register Definition 6.1, Gain Register Definition 6.2, and Gain Register Definition 6.3 for more information. The gain is programmed using the following steps: D es 1. Set the GAINEN bit (ADC0CF.0) 2. Load the ADC0H with the ADC0GNH, ADC0GNL, or ADC0GNA address. 3. Load ADC0L with the desired value for the selected gain register. ew 4. Reset the GAINEN bit (ADC0CF.0) rN Notes: 1. An ADC conversion should not be performed while the GAINEN bit is set. 2. Even with gain enabled, the maximum input voltage must be less than VREGIN and the maximum fo voltage of the signal after gain must be less than or equal to VREF. In code, changing the value to 0.44 gain from the previous example looks like: // GAINEN = 1 // Load the ADC0GNH address // Load the upper byte of 0x6CA to ADC0GNH // Load the ADC0GNL address // Load the lower nibble of 0x6CA to ADC0GNL // Load the ADC0GNA address // Set the GAINADD bit // GAINEN = 0 ; in assembly ORL ADC0CF,#01H MOV ADC0H,#04H MOV ADC0L,#06CH MOV ADC0H,#07H MOV ADC0L,#0A0H MOV ADC0H,#08H MOV ADC0L,#01H ANL ADC0CF,#0FEH ; GAINEN = 1 ; Load the ADC0GNH address ; Load the upper byte of 0x6CA to ADC0GNH ; Load the ADC0GNL address ; Load the lower nibble of 0x6CA to ADC0GNL ; Load the ADC0GNA address ; Set the GAINADD bit ; GAINEN = 0 IQ Ve rs io n no tR ec om m en de d // in ‘C’: ADC0CF |= 0x01; ADC0H = 0x04; ADC0L = 0x6C; ADC0H = 0x07; ADC0L = 0xA0; ADC0H = 0x08; ADC0L = 0x01; ADC0CF &= ~0x01; Rev. 1.2 55 C8051F55x/56x/57x 5 4 3 Name GAINH[7:0] Type W 1 Reset 1 1 1 1 Indirect Address = 0x04; Bit Name 1 1 0 0 0 Function GAINH[7:0] ADC0 Gain High Byte. rN 7:0 2 ig n 6 D es 7 ew Bit s Gain Register Definition 6.1. ADC0GNH: ADC0 Selectable Gain High Byte See Section 6.3.1 for details on calculating the value for this register. d fo Note: This register is accessed indirectly; See Section 6.3.2 for details for writing this register. 7 6 5 GAINL[3:0] Type W Indirect Address = 0x07; Bit Name 3 2 1 0 Reserved Reserved Reserved Reserved W W W W 0 0 0 0 0 0 Function GAINL[3:0] ADC0 Gain Lower 4 Bits. tR 7:4 om 0 ec 0 Reset m Name 4 en Bit de Gain Register Definition 6.2. ADC0GNL: ADC0 Selectable Gain Low Byte no See Figure 6.3.1 for details for setting this register. This register is only accessed indirectly through the ADC0H and ADC0L register. Reserved Must Write 0000b n 3:0 IQ Ve rs io Note: This register is accessed indirectly; See Section 6.3.2 for details for writing this register. 56 Rev. 1.2 C8051F55x/56x/57x 7 6 5 4 3 2 Name Reserved Reserved Reserved Reserved Reserved Reserved Type W W W W W W Reset 0 0 0 0 0 0 0 Reserved GAINADD W D es W 0 1 ew Indirect Address = 0x08; Bit Name 1 ig n Bit s Gain Register Definition 6.3. ADC0GNA: ADC0 Additional Selectable Gain Function Reserved Must Write 0000000b. 0 GAINADD ADC0 Additional Gain Bit. Setting this bit add 1/64 (0.016) gain to the gain value in the ADC0GNH and ADC0GNL registers. fo rN 7:1 IQ Ve rs io n no tR ec om m en de d Note: This register is accessed indirectly; See Section 6.3.2 for details for writing this register. Rev. 1.2 57 C8051F55x/56x/57x 5 4 Name AD0SC[4:0] Type R/W 1 Reset 1 3 1 AD0RPT[1:0] 1 1 1 SFR Address = 0xBC; SFR Page = 0x00 Bit Name R/W R/W 0 0 0 GAINEN R/W 0 Function AD0SC[4:0] ADC0 SAR Conversion Clock Period Bits. rN 7:3 2 ig n 6 D es 7 ew Bit s SFR Definition 6.4. ADC0CF: ADC0 Configuration de d fo SAR Conversion clock is derived from system clock by the following equation, where AD0SC refers to the 5-bit value held in bits AD0SC4–0. SAR Conversion clock requirements are given in the ADC specification table BURSTEN = 0: FCLK is the current system clock BURSTEN = 1: FCLK is a maximum of 30 MHz, independent of the current system clock.. en FCLK AD0SC = -------------------- – 1 CLK SAR 2:1 m Note: Round up the result of the calculation for AD0SC A0RPT[1:0] ADC0 Repeat Count. io GAINEN Gain Enable Bit. Controls the gain programming. Refer to Section “6.3. Selectable Gain” on page 53 for information about using this bit. IQ Ve rs 0 n no tR ec om Controls the number of conversions taken and accumulated between ADC0 End of Conversion (ADCINT) and ADC0 Window Comparator (ADCWINT) interrupts. A convert start is required for each conversion unless Burst Mode is enabled. In Burst Mode, a single convert start can initiate multiple self-timed conversions. Results in both modes are accumulated in the ADC0H:ADC0L register. When AD0RPT1–0 are set to a value other than '00', the AD0LJST bit in the ADC0CN register must be set to '0' (right justified). 00: 1 conversion is performed. 01: 4 conversions are performed and accumulated. 10: 8 conversions are performed and accumulated. 11: 16 conversions are performed and accumulated. 58 Rev. 1.2 C8051F55x/56x/57x 5 4 3 Name ADC0H[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xBE; SFR Page = 0x00 Bit Name 2 1 0 0 0 ig n 6 D es 7 0 ew Bit s SFR Definition 6.5. ADC0H: ADC0 Data Word MSB Function en de d fo rN 7:0 ADC0H[7:0] ADC0 Data Word High-Order Bits. For AD0LJST = 0 and AD0RPT as follows: 00: Bits 3–0 are the upper 4 bits of the 12-bit result. Bits 7–4 are 0000b. 01: Bits 4–0 are the upper 5 bits of the 14-bit result. Bits 7–5 are 000b. 10: Bits 5–0 are the upper 6 bits of the 15-bit result. Bits 7–6 are 00b. 11: Bits 7–0 are the upper 8 bits of the 16-bit result. For AD0LJST = 1 (AD0RPT must be 00): Bits 7–0 are the most-significant bits of the ADC0 12-bit result. Bit 7 om m SFR Definition 6.6. ADC0L: ADC0 Data Word LSB 6 5 Type 0 tR 0 Reset ec Name 0 3 2 1 0 0 0 0 ADC0L[7:0] R/W 0 0 Function ADC0L[7:0] ADC0 Data Word Low-Order Bits. For AD0LJST = 0: Bits 7–0 are the lower 8 bits of the ADC0 Accumulated Result. For AD0LJST = 1 (AD0RPT must be '00'): Bits 7–4 are the lower 4 bits of the 12-bit result. Bits 3–0 are 0000b. IQ Ve rs io n 7:0 no SFR Address = 0xBD; SFR Page = 0x00 Bit Name 4 Rev. 1.2 59 C8051F55x/56x/57x 6 5 4 Name AD0EN BURSTEN AD0INT Type R/W R/W R/W R/W Reset 0 0 0 0 3 2 AD0BUSY AD0WINT AD0CM[1:0] R/W R/W R/W 0 0 0 ew 0 ADC0 Enable Bit. rN AD0EN 0 AD0LJST SFR Address = 0xE8; SFR Page = 0x00; Bit-Addressable Bit Name Function 7 1 ig n 7 D es Bit 0: ADC0 Disabled. ADC0 is in low-power shutdown. 1: ADC0 Enabled. ADC0 is active and ready for data conversions. BURSTEN ADC0 Burst Mode Enable Bit. fo 6 AD0INT de 5 d 0: Burst Mode Disabled. 1: Burst Mode Enabled. ADC0 Conversion Complete Interrupt Flag. AD0WINT Write: 0: ADC0 conversion is not 0: No Effect. in progress. 1: Initiates ADC0 Conver1: ADC0 conversion is in sion if AD0CM[1:0] = 00b progress. ec 3 Read: m ADC0 Busy Bit. om AD0BUSY en 0: ADC0 has not completed a data conversion since AD0INT was last cleared. 1: ADC0 has completed a data conversion. 4 ADC0 Window Compare Interrupt Flag. no tR This bit must be cleared by software 0: ADC0 Window Comparison Data match has not occurred since this flag was last cleared. 1: ADC0 Window Comparison Data match has occurred. AD0LJST ADC0 Left Justify Select Bit. 0: Data in ADC0H:ADC0L registers is right-justified 1: Data in ADC0H:ADC0L registers is left-justified. This option should not be used with a repeat count greater than 1 (when AD0RPT[1:0] is 01b, 10b, or 11b). rs io n 2 IQ Ve 1:0 AD0CM[1:0] ADC0 Start of Conversion Mode Select. 60 00: ADC0 start-of-conversion source is write of 1 to AD0BUSY. 01: ADC0 start-of-conversion source is overflow of Timer 1. 10: ADC0 start-of-conversion source is rising edge of external CNVSTR. 11: ADC0 start-of-conversion source is overflow of Timer 2. Rev. 1.2 s SFR Definition 6.7. ADC0CN: ADC0 Control C8051F55x/56x/57x 7 6 5 4 3 2 1 0 ig n Bit AD0PWR[3:0] AD0TM[1:0] AD0TK[1:0] Type R/W R/W R/W 1 1 1 1 SFR Address = 0xBA; SFR Page = 0x00 Bit Name 1 1 Function AD0PWR[3:0] ADC0 Burst Power-up Time. rN 7:4 1 ew 1 D es Name Reset s SFR Definition 6.8. ADC0TK: ADC0 Tracking Mode Select de d fo For BURSTEN = 0: ADC0 Power state controlled by AD0EN For BURSTEN = 1, AD0EN = 1: ADC0 remains enabled and does not enter the very low power state For BURSTEN = 1, AD0EN = 0: ADC0 enters the very low power state and is enabled after each convert start signal. The Power-up time is programmed according the following equation: AD0TM[1:0] ADC0 Tracking Mode Enable Select Bits. m 3:2 en Tstartup AD0PWR = ------------------------ – 1 or Tstartup = ( AD0PWR + 1 )200ns 200ns 1:0 AD0TK[1:0] ec om 00: Reserved. 01: ADC0 is configured to Post-Tracking Mode. 10: ADC0 is configured to Pre-Tracking Mode. 11: ADC0 is configured to Dual Tracking Mode. ADC0 Post-Track Time. no tR 00: Post-Tracking time is equal to 2 SAR clock cycles + 2 FCLK cycles. 01: Post-Tracking time is equal to 4 SAR clock cycles + 2 FCLK cycles. 10: Post-Tracking time is equal to 8 SAR clock cycles + 2 FCLK cycles. 11: Post-Tracking time is equal to 16 SAR clock cycles + 2 FCLK cycles. n 6.4. Programmable Window Detector IQ Ve rs io The ADC Programmable Window Detector continuously compares the ADC0 output registers to user-programmed limits, and notifies the system when a desired condition is detected. This is especially effective in an interrupt-driven system, saving code space and CPU bandwidth while delivering faster system response times. The window detector interrupt flag (AD0WINT in register ADC0CN) can also be used in polled mode. The ADC0 Greater-Than (ADC0GTH, ADC0GTL) and Less-Than (ADC0LTH, ADC0LTL) registers hold the comparison values. The window detector flag can be programmed to indicate when measured data is inside or outside of the user-programmed limits, depending on the contents of the ADC0 Less-Than and ADC0 Greater-Than registers. Rev. 1.2 61 C8051F55x/56x/57x 5 4 3 Name ADC0GTH[7:0] Type R/W 1 Reset 1 1 1 1 SFR Address = 0xC4; SFR Page = 0x00 Bit Name 2 1 1 1 0 ig n 6 D es 7 1 ew Bit Function rN 7:0 ADC0GTH[7:0] ADC0 Greater-Than Data Word High-Order Bits. 6 5 4 3 ADC0GTL[7:0] Type R/W 1 1 om SFR Address = 0xC3; SFR Page = 0x00 Bit Name 1 Function Ve rs io n no tR ec ADC0GTL[7:0] ADC0 Greater-Than Data Word Low-Order Bits. IQ 62 1 m 1 Reset en Name 7:0 2 1 0 1 1 1 de 7 d fo SFR Definition 6.10. ADC0GTL: ADC0 Greater-Than Data Low Byte Bit Rev. 1.2 s SFR Definition 6.9. ADC0GTH: ADC0 Greater-Than Data High Byte C8051F55x/56x/57x 5 4 3 Name ADC0LTH[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xC6; SFR Page = 0x00 Bit Name 1 0 0 0 0 Function ADC0LTH[7:0] ADC0 Less-Than Data Word High-Order Bits. rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 6.11. ADC0LTH: ADC0 Less-Than Data High Byte 7 6 5 4 3 ADC0LTL[7:0] Type R/W 1 0 0 0 om SFR Address = 0xC5; SFR Page = 0x00 Bit Name 0 0 0 0 0 m 0 Reset en Name Function ADC0LTL[7:0] ADC0 Less-Than Data Word Low-Order Bits. ec 7:0 2 de Bit d fo SFR Definition 6.12. ADC0LTL: ADC0 Less-Than Data Low Byte tR 6.4.1. Window Detector In Single-Ended Mode IQ Ve rs io n no Figure 6.6 shows two example window comparisons for right-justified data with ADC0LTH:ADC0LTL = 0x0200 (512d) and ADC0GTH:ADC0GTL = 0x0100 (256d). The input voltage can range from 0 to VREF x (4095/4096) with respect to GND, and is represented by a 12-bit unsigned integer value. The repeat count is set to one. In the left example, an AD0WINT interrupt will be generated if the ADC0 conversion word (ADC0H:ADC0L) is within the range defined by ADC0GTH:ADC0GTL and ADC0LTH:ADC0LTL (if 0x0100 < ADC0H:ADC0L < 0x0200). In the right example, and AD0WINT interrupt will be generated if the ADC0 conversion word is outside of the range defined by the ADC0GT and ADC0LT registers (if ADC0H:ADC0L < 0x0100 or ADC0H:ADC0L > 0x0200). Figure 6.7 shows an example using left-justified data with the same comparison values. Rev. 1.2 63 C8051F55x/56x/57x ADC0H:ADC0L ADC0H:ADC0L Input Voltage (Px.x - GND) 0x0FFF 0x0FFF VREF x (1023/ 1024) ig n VREF x (4095/4096) s Input Voltage (Px.x - GND) AD0WINT not affected 0x0201 VREF x (512/4096) D es AD0WINT=1 0x0201 0x0200 ADC0LTH:ADC0LTL VREF x (512/4096) 0x0200 0x01FF ADC0GTH:ADC0GTL 0x01FF AD0WINT not affected AD0WINT=1 VREF x (256/4096) 0x0101 0x0100 ADC0GTH:ADC0GTL VREF x (256/4096) 0x0100 0x00FF 0x00FF 0x0000 AD0WINT=1 0x0000 0 fo 0 rN AD0WINT not affected ADC0LTH:ADC0LTL ew 0x0101 de d Figure 6.6. ADC Window Compare Example: Right-Justified Data ADC0H:ADC0L 0xFFF0 VREF x (4095/4096) om AD0WINT not affected 0x2010 VREF x (512/4096) 0x2000 VREF x (256/4096) 0x1000 VREF x (512/4096) no 0x2000 0x1FF0 AD0WINT=1 ADC0GTH:ADC0GTL 0x1010 VREF x (256/4096) 0x1000 ADC0GTH:ADC0GTL AD0WINT not affected ADC0LTH:ADC0LTL 0x0FF0 tR 0x0FF0 ec 0x1010 AD0WINT=1 0x2010 ADC0LTH:ADC0LTL 0x1FF0 0xFFF0 m VREF x (4095/4096) AD0WINT=1 AD0WINT not affected 0x0000 0 ADC0H:ADC0L Input Voltage (Px.x - GND) en Input Voltage (Px.x - GND) 0 0x0000 IQ Ve rs io n Figure 6.7. ADC Window Compare Example: Left-Justified Data 64 Rev. 1.2 C8051F55x/56x/57x 6.5. ADC0 Analog Multiplexer ew ADC0MX5 ADC0MX4 ADC0MX3 ADC0MX2 ADC0MX1 ADC0MX0 ADC0MX rN P0.0 P0.7 fo P1.0 d P1.7 de P2.0 en om m P3.0 Temp Sensor ec VDD GND ADC0 AMUX P2.7 P3.7 D es ig n s ADC0 includes an analog multiplexer to enable multiple analog input sources. Any of the following may be selected as an input: P0.0–P3.7, the on-chip temperature sensor, the core power supply (VDD), or ground (GND). ADC0 is single-ended and all signals measured are with respect to GND. The ADC0 input channels are selected using the ADC0MX register as described in SFR Definition 6.13. P2.2-P2.7, P3.0 available as inputs on 40-pin and 32-pin packages P3.1-P3.7 available as inputs on 48-pin and 40-pin packages tR Figure 6.8. ADC0 Multiplexer Block Diagram IQ Ve rs io n no Important Note About ADC0 Input Configuration: Port pins selected as ADC0 inputs should be configured as analog inputs, and should be skipped by the Digital Crossbar. To configure a Port pin for analog input, set to 0 the corresponding bit in register PnMDIN. To force the Crossbar to skip a Port pin, set to 1 the corresponding bit in register PnSKIP. See Section “19. Port Input/Output” on page 169 for more Port I/O configuration details. Rev. 1.2 65 C8051F55x/56x/57x 6 5 4 R 0 R 0 1 1 3 2 ADC0MX[5:0] R/W 1 1 SFR Address = 0xBB; SFR Page = 0x00; Bit Name 0 1 om m ew en de d fo rN P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P2.0 P2.1 P2.2 (Only available on 40-pin and 32-pin package devices) P2.3 (Only available on 40-pin and 32-pin package devices) P2.4 (Only available on 40-pin and 32-pin package devices) P2.5 (Only available on 40-pin and 32-pin package devices) P2.6 (Only available on 40-pin and 32-pin package devices) P2.7 (Only available on 40-pin and 32-pin package devices) P3.0 (Only available on 40-pin and 32-pin package devices) P3.1 (Only available on 40-pin package devices) P3.2 (Only available on 40-pin package devices) P3.3 (Only available on 40-pin package devices) P3.4 (Only available on 40-pin package devices) P3.5 (Only available on 40-pin package devices) P3.6 (Only available on 40-pin package devices) P3.7 (Only available on 40-pin package devices) Reserved Temp Sensor VDD GND ec tR no n io rs Ve IQ 66 1 Function 7:6 Unused Read = 00b; Write = Don’t Care. 5:0 AMX0P[5:0] AMUX0 Positive Input Selection. 000000: 000001: 000010: 000011: 000100: 000101: 000110: 000111: 001000: 001001: 001010: 001011: 001100: 001101: 001110: 001111: 010000: 010001: 010010: 010011: 010100: 010101: 010110: 010111: 011000: 011001: 011010: 011011: 011100: 011101: 011110: 011111: 100000–101111: 110000: 110001: 110010–111111: 1 ig n 7 D es Bit Name Type Reset Rev. 1.2 s SFR Definition 6.13. ADC0MX: ADC0 Channel Select C8051F55x/56x/57x 6.6. Temperature Sensor ew D es ig n s An on-chip temperature sensor is included on the C8051F55x/56x/57x devices which can be directly accessed via the ADC multiplexer in single-ended configuration. To use the ADC to measure the temperature sensor, the ADC multiplexer channel should be configured to connect to the temperature sensor. The temperature sensor transfer function is shown in Figure 6.9. The output voltage (VTEMP) is the positive ADC input is selected by bits AD0MX[4:0] in register ADC0MX. The TEMPE bit in register REF0CN enables/disables the temperature sensor, as described in SFR Definition 7.1. While disabled, the temperature sensor defaults to a high impedance state and any ADC measurements performed on the sensor will result in meaningless data. Refer to Table 5.10 for the slope and offset parameters of the temperature sensor. fo TempC = (VTEMP - Offset) / Slope rN VTEMP = (Slope x TempC) + Offset de Voltage d Slope (V / deg C) no tR ec om m en Offset (V at 0 Celsius) Temperature IQ Ve rs io n Figure 6.9. Temperature Sensor Transfer Function Rev. 1.2 67 C8051F55x/56x/57x 7. Voltage Reference D es ig n s The Voltage reference multiplexer on the C8051F55x/56x/57x devices is configurable to use an externally connected voltage reference, the on-chip reference voltage generator routed to the VREF pin, or the VDD power supply voltage (see Figure 7.1). The REFSL bit in the Reference Control register (REF0CN, SFR Definition 7.1) selects the reference source for the ADC. For an external source or the on-chip reference, REFSL should be set to 0 to select the VREF pin. To use VDD as the reference source, REFSL should be set to 1. ew The BIASE bit enables the internal voltage bias generator, which is used by the ADC, Temperature Sensor, and internal oscillator. This bias is automatically enabled when any peripheral which requires it is enabled, and it does not need to be enabled manually. The bias generator may be enabled manually by writing a 1 to the BIASE bit in register REF0CN. The electrical specifications for the voltage reference circuit are given in Table 5.11. de d fo rN The on-chip voltage reference circuit consists of a temperature stable bandgap voltage reference generator and a gain-of-two output buffer amplifier. The output voltage is selectable between 1.5 V and 2.25 V. The on-chip voltage reference can be driven on the VREF pin by setting the REFBE bit in register REF0CN to a 1. The maximum load seen by the VREF pin must be less than 200 µA to GND. Bypass capacitors of 0.1 µF and 4.7 µF are recommended from the VREF pin to GND. If the on-chip reference is not used, the REFBE bit should be cleared to 0. Electrical specifications for the on-chip voltage reference are given in Table 5.11. om m en Important Note about the VREF Pin: When using either an external voltage reference or the on-chip reference circuitry, the VREF pin should be configured as an analog pin and skipped by the Digital Crossbar. Refer to Section “19. Port Input/Output” on page 169 for the location of the VREF pin, as well as details of how to configure the pin in analog mode and to be skipped by the crossbar. If VDD is selected as the voltage reference in the REF0CN register and the ADC is enabled in the ADC0CN register, the P0.0/VREF pin cannot operate as a general purpose I/O pin in open-drain mode. With the above settings, this pin can operate in push-pull output mode or as an analog input. no tR REFSL TEMPE BIASE REFBE ec REF0CN VDD n External Voltage Reference Circuit R1 EN VREF Ve IQ Bias Generator To ADC, Internal Oscillators Temp Sensor To Analog Mux 0 rs io EN IOSCE N VREF (to ADC) GND VDD 1 REFBE 4.7μF + 0.1μF Recommended Bypass Capacitors EN Internal Reference Figure 7.1. Voltage Reference Functional Block Diagram Rev. 1.2 68 C8051F55x/56x/57x 7 6 Name 5 4 3 2 1 ZTCEN REFLV REFSL TEMPE BIASE REFBE R/W R R R R R/W R/W R/W Reset 0 0 0 0 0 0 0 Unused Read = 00b; Write = don’t care. 5 ZTCEN Zero Temperature Coefficient Bias Enable Bit. rN Function 7:6 0 ew SFR Address = 0xD1; SFR Page = 0x00 Bit Name D es Type 0 ig n Bit s SFR Definition 7.1. REF0CN: Reference Control REFLV Voltage Reference Output Level Select. de 4 d fo This bit must be set to 1b before entering oscillator suspend mode. 0: ZeroTC Bias Generator automatically enabled when required. 1: ZeroTC Bias Generator forced on. REFSL Voltage Reference Select. m 3 en This bit selects the output voltage level for the internal voltage reference 0: Internal voltage reference set to 1.5 V. 1: Internal voltage reference set to 2.20 V. 2 TEMPE tR ec om This bit selects the ADCs voltage reference. 0: VREF pin used as voltage reference. 1: VDD used as voltage reference. If VDD is selected as the voltage reference and the ADC is enabled in the ADC0CN register, the P0.0/VREF pin cannot operate as a general purpose I/O pin in open-drain mode. With the above settings, this pin can operate in push-pull output mode or as an analog input. Temperature Sensor Enable Bit. no 0: Internal Temperature Sensor off. 1: Internal Temperature Sensor on. BIASE Internal Analog Bias Generator Enable Bit. 0: Internal Bias Generator off. 1: Internal Bias Generator on. REFBE On-chip Reference Buffer Enable Bit. 0: On-chip Reference Buffer off. 1: On-chip Reference Buffer on. Internal voltage reference driven on the VREF pin. IQ Ve rs 0 io n 1 69 Rev. 1.2 C8051F55x/56x/57x 8. Comparators ig n s The C8051F55x/56x/57x devices include two on-chip programmable voltage Comparators. A block diagram of the comparators is shown in Figure 8.1, where “n” is the comparator number (0 or 1). The two Comparators operate identically except that Comparator0 can also be used a reset source. For input selection details, refer to SFR Definition 8.5 and SFR Definition 8.6. ew D es Each Comparator offers programmable response time and hysteresis, an analog input multiplexer, and two outputs that are optionally available at the Port pins: a synchronous “latched” output (CP0, CP1), or an asynchronous “raw” output (CP0A, CP1A). The asynchronous signal is available even when the system clock is not active. This allows the Comparators to operate and generate an output with the device in STOP mode. When assigned to a Port pin, the Comparator outputs may be configured as open drain or push-pull (see Section “19.4. Port I/O Initialization” on page 174). Comparator0 may also be used as a reset source (see Section “16.5. Comparator0 Reset” on page 142). fo rN The Comparator0 inputs are selected in the CPT0MX register (SFR Definition 8.5). The CMX0P1-CMX0P0 bits select the Comparator0 positive input; the CMX0N1-CMX0N0 bits select the Comparator0 negative input. The Comparator1 inputs are selected in the CPT1MX register (SFR Definition 8.6). The CMX1P1CMX1P0 bits select the Comparator1 positive input; the CMX1N1-CMX1N0 bits select the Comparator1 negative input. en de d Important Note About Comparator Inputs: The Port pins selected as Comparator inputs should be configured as analog inputs in their associated Port configuration register, and configured to be skipped by the Crossbar (for details on Port configuration, see Section “19.1. Port I/O Modes of Operation” on page 170). CPTnCN om CPnEN CPnRIF CPnFIF m CPnOUT CPnHYP1 CPnHYP0 CPnHYN1 CPnHYN0 no tR ec VIO + CPn - CPn D - D Q SET CLR Q Q Crossbar io CPnA rs GND CPnRIE CPnFIE CPnMD1 Ve Q (SYNCHRONIZER) CPTnMD CPnMD0 IQ SET CLR n Comparator Input Mux CPn + Reset Decision Tree CPnRIF CPnFIF 0 CPnEN EA 1 0 0 0 1 1 CPn Interrupt 1 Figure 8.1. Comparator Functional Block Diagram Rev. 1.2 70 C8051F55x/56x/57x D es ig n s Comparator outputs can be polled in software, used as an interrupt source, and/or routed to a Port pin. When routed to a Port pin, Comparator outputs are available asynchronous or synchronous to the system clock; the asynchronous output is available even in STOP mode (with no system clock active). When disabled, the Comparator output (if assigned to a Port I/O pin via the Crossbar) defaults to the logic low state, and the power supply to the comparator is turned off. See Section “19.3. Priority Crossbar Decoder” on page 172 for details on configuring Comparator outputs via the digital Crossbar. Comparator inputs can be externally driven from –0.25 V to (VDD) + 0.25 V without damage or upset. The complete Comparator electrical specifications are given in Table 5.12. VIN- CPn+ CPn- + CPn _ rN VIN+ ew The Comparator response time may be configured in software via the CPTnMD registers (see SFR Definition 8.2). Selecting a longer response time reduces the Comparator supply current. See Table 5.12 for complete timing and supply current requirements. OUT de d fo CIRCUIT CONFIGURATION Positive Hysteresis Voltage (Programmed with CPnHYP Bits) en VIN- INPUTS om tR VOL ec VOH OUTPUT Negative Hysteresis Voltage (Programmed by CPnHYN Bits) m VIN+ Maximum Negative Hysteresis Maximum Positive Hysteresis Figure 8.2. Comparator Hysteresis Plot n no Positive Hysteresis Disabled Negative Hysteresis Disabled io Comparator hysteresis is software-programmable via its Comparator Control register CPTnCN. IQ Ve rs The amount of negative hysteresis voltage is determined by the settings of the CPnHYN bits. As shown in Figure 8.2, various levels of negative hysteresis can be programmed, or negative hysteresis can be disabled. In a similar way, the amount of positive hysteresis is determined by the setting the CPnHYP bits. Comparator interrupts can be generated on both rising-edge and falling-edge output transitions. (For Interrupt enable and priority control, see “13. Interrupts” .) The CPnFIF flag is set to 1 upon a Comparator falling-edge, and the CPnRIF flag is set to 1 upon the Comparator rising-edge. Once set, these bits remain set until cleared by software. The output state of the Comparator can be obtained at any time by reading the CPnOUT bit. The Comparator is enabled by setting the CPnEN bit to 1, and is disabled by clearing this bit to 0. 71 Rev. 1.2 C8051F55x/56x/57x ig n s Note that false rising edges and falling edges can be detected when the comparator is first powered on or if changes are made to the hysteresis or response time control bits. Therefore, it is recommended that the rising-edge and falling-edge flags be explicitly cleared to logic 0 a short time after the comparator is enabled or its mode bits have been changed. Bit 7 6 5 4 Name CP0EN CP0OUT CP0RIF CP0FIF CP0HYP[1:0] Type R/W R R/W R/W R/W Reset 0 0 0 0 Comparator0 Enable Bit. Comparator0 Output State Flag. Comparator0 Rising-Edge Flag. Must be cleared by software. m CP0RIF en 0: Voltage on CP0+ < CP0–. 1: Voltage on CP0+ > CP0–. 5 0 de CP0OUT 0 d 0: Comparator0 Disabled. 1: Comparator0 Enabled. 6 CP0HYN[1:0] fo CP0EN 0 R/W 0 Function 1 rN 0 SFR Address = 0x9A; SFR Page = 0x00 Bit Name 7 2 ew 3 D es SFR Definition 8.1. CPT0CN: Comparator0 Control CP0FIF Comparator0 Falling-Edge Flag. Must be cleared by software. ec 4 om 0: No Comparator0 Rising Edge has occurred since this flag was last cleared. 1: Comparator0 Rising Edge has occurred. tR 0: No Comparator0 Falling-Edge has occurred since this flag was last cleared. 1: Comparator0 Falling-Edge has occurred. 3:2 CP0HYP[1:0] Comparator0 Positive Hysteresis Control Bits. n no 00: Positive Hysteresis Disabled. 01: Positive Hysteresis = 5 mV. 10: Positive Hysteresis = 10 mV. 11: Positive Hysteresis = 20 mV. 00: Negative Hysteresis Disabled. 01: Negative Hysteresis = 5 mV. 10: Negative Hysteresis = 10 mV. 11: Negative Hysteresis = 20 mV. IQ Ve rs io 1:0 CP0HYN[1:0] Comparator0 Negative Hysteresis Control Bits. Rev. 1.2 72 C8051F55x/56x/57x 6 Name 5 4 3 CP0RIE CP0FIE 2 0 CP0MD[1:0] R R R/W R/W R R Reset 0 0 0 0 0 0 Read = 00b, Write = Don’t Care. 5 CP0RIE Comparator0 Rising-Edge Interrupt Enable. 0: Comparator0 Rising-edge interrupt disabled. 1: Comparator0 Rising-edge interrupt enabled. 4 CP0FIE Comparator0 Falling-Edge Interrupt Enable. 0: Comparator0 Falling-edge interrupt disabled. 1: Comparator0 Falling-edge interrupt enabled. 3:2 Unused Read = 00b, Write = don’t care. en CP0MD[1:0] Comparator0 Mode Select. These bits affect the response time and power consumption for Comparator0. 00: Mode 0 (Fastest Response Time, Highest Power Consumption) 01: Mode 1 10: Mode 2 11: Mode 3 (Slowest Response Time, Lowest Power Consumption) IQ Ve rs io n no tR ec om m 1:0 de d fo Unused 1 rN Function 7:6 R/W ew Type SFR Address = 0x9B; SFR Page = 0x00 Bit Name 1 ig n 7 D es Bit 73 Rev. 1.2 s SFR Definition 8.2. CPT0MD: Comparator0 Mode Selection 0 C8051F55x/56x/57x 7 6 5 4 Name CP1EN CP1OUT CP1RIF CP1FIF CP1HYP[1:0] CP1HYN[1:0] Type R/W R R/W R/W R/W R/W Reset 0 0 0 0 0 Function Comparator1 Enable Bit. 0: Comparator1 Disabled. 1: Comparator1 Enabled. CP1OUT Comparator1 Output State Flag. CP1RIF de 5 0 d 0: Voltage on CP1+ < CP1–. 1: Voltage on CP1+ > CP1–. 0 fo 6 0 rN CP1EN 1 ew 0 SFR Address = 0x9D; SFR Page = 0x00 Bit Name 7 2 D es 3 ig n Bit s SFR Definition 8.3. CPT1CN: Comparator1 Control Comparator1 Rising-Edge Flag. Must be cleared by software. CP1FIF Comparator1 Falling-Edge Flag. Must be cleared by software. m 4 en 0: No Comparator1 Rising Edge has occurred since this flag was last cleared. 1: Comparator1 Rising Edge has occurred. om 0: No Comparator1 Falling-Edge has occurred since this flag was last cleared. 1: Comparator1 Falling-Edge has occurred. 3:2 CP1HYP[1:0] Comparator1 Positive Hysteresis Control Bits. tR ec 00: Positive Hysteresis Disabled. 01: Positive Hysteresis = 5 mV. 10: Positive Hysteresis = 10 mV. 11: Positive Hysteresis = 20 mV. 00: Negative Hysteresis Disabled. 01: Negative Hysteresis = 5 mV. 10: Negative Hysteresis = 10 mV. 11: Negative Hysteresis = 20 mV. IQ Ve rs io n no 1:0 CP1HYN[1:0] Comparator1 Negative Hysteresis Control Bits. Rev. 1.2 74 C8051F55x/56x/57x 6 Name 5 4 3 CP1RIE CP1FIE 2 0 CP1MD[1:0] R R R/W R/W R R Reset 0 0 0 0 0 0 Read = 00b, Write = Don’t Care. 5 CP1RIE Comparator1 Rising-Edge Interrupt Enable. 0: Comparator1 Rising-edge interrupt disabled. 1: Comparator1 Rising-edge interrupt enabled. 4 CP1FIE Comparator1 Falling-Edge Interrupt Enable. 0: Comparator1 Falling-edge interrupt disabled. 1: Comparator1 Falling-edge interrupt enabled. 3:2 Unused Read = 00b, Write = don’t care. en CP1MD[1:0] Comparator1 Mode Select. These bits affect the response time and power consumption for Comparator1. 00: Mode 0 (Fastest Response Time, Highest Power Consumption) 01: Mode 1 10: Mode 2 11: Mode 3 (Slowest Response Time, Lowest Power Consumption) IQ Ve rs io n no tR ec om m 1:0 de d fo Unused 1 rN Function 7:6 R/W ew Type SFR Address = 0x9E; SFR Page = 0x00 Bit Name 1 ig n 7 D es Bit 75 Rev. 1.2 s SFR Definition 8.4. CPT1MD: Comparator1 Mode Selection 0 C8051F55x/56x/57x 8.1. Comparator Multiplexer D es ig n s C8051F55x/56x/57x devices include an analog input multiplexer for each of the comparators to connect Port I/O pins to the comparator inputs. The Comparator0 inputs are selected in the CPT0MX register (SFR Definition 8.5). The CMX0P3–CMX0P0 bits select the Comparator0 positive input; the CMX0N3–CMX0N0 bits select the Comparator0 negative input. Similarly, the Comparator1 inputs are selected in the CPT1MX register using the CMX1P3-CMX1P0 bits and CMX1N3–CMX1N0 bits. The same pins are available to both multiplexers at the same time and can be used by both comparators simultaneously. rN ew Important Note About Comparator Inputs: The Port pins selected as comparator inputs should be configured as analog inputs in their associated Port configuration register, and configured to be skipped by the Crossbar (for details on Port configuration, see Section “19.6. Special Function Registers for Accessing and Configuring Port I/O” on page 183). fo d CMXnN1 CMXnN0 de CMXnP3 CMXnP2 CMXnP1 en CPTnMX CMXnN3 CMXnN2 CMXnP0 P0.2 om P0.1 CPn + P0.4 P0.3 VDD m P0.0 P0.6 ec P0.5 tR P0.7 no P1.1 P1.0 + P1.2 - P1.4 P1.3 GND P1.6 n P1.5 P2.0 io P1.7 P2.2 IQ Ve rs P2.1 P2.4 P2.3 P2.6 P2.5 P2.7 CPn - Figure 8.3. Comparator Input Multiplexer Block Diagram Rev. 1.2 76 C8051F55x/56x/57x 7 6 5 4 3 2 1 CMX0N[3:0] CMX0P[3:0] Type R/W R/W 1 1 1 0 SFR Address = 0x9C; SFR Page = 0x00 Bit Name CMX0N[3:0] Comparator0 Negative Input MUX Selection. P0.1 0001: P0.3 0010: P0.5 0011: P0.7 0100: P1.1 0101: P1.3 0110: P1.5 0111: P1.7 1000: P2.1 1001: P2.3 (only available on 40-pin and 32-pin devices) fo d de ec P2.7 (only available on 40-pin and 32-pin devices) 1100–1111: None tR CMX0P[3:0] Comparator0 Positive Input MUX Selection. P0.0 0001: P0.2 no 0000: 0010: P0.4 0011: P0.6 n io rs Ve IQ en m P2.5 (only available on 40-pin and 32-pin devices) 1011: 77 rN 0000: 1010: 3:0 Function 1 om 7:4 1 ew 0 Reset D es Name 0100: P1.0 0101: P1.2 0110: P1.4 0111: P1.6 1000: P2.0 1001: P2.2 (only available on 40-pin and 32-pin devices) 1010: P2.4 (only available on 40-pin and 32-pin devices) 1011: P2.6 (only available on 40-pin and 32-pin devices) 1100–1111: None Rev. 1.2 0 ig n Bit s SFR Definition 8.5. CPT0MX: Comparator0 MUX Selection 1 C8051F55x/56x/57x 7 6 5 4 3 1 CMX1N[3:0] CMX1P[3:0] Type R/W R/W 1 1 1 0 SFR Address = 0x9F; SFR Page = 0x00 Bit Name CMX1N[3:0] Comparator1 Negative Input MUX Selection. 1 P0.1 0001: P0.3 0010: P0.5 0011: P0.7 0100: P1.1 0101: P1.3 0110: P1.5 0111: P1.7 1000: P2.1 1001: P2.3 (only available on 40-pin and 32-pin devices) m en de d fo rN 0000: 1010: P2.5 (only available on 40-pin and 32-pin devices) P2.7 (only available on 40-pin and 32-pin devices) ec 1011: 1100–1111: None tR CMX1P[3:0] Comparator1 Positive Input MUX Selection. 0000: P0.0 0001: P0.2 no 3:0 Function 1 om 7:4 1 ew 0 0 D es Name Reset 0010: P0.4 0011: P0.6 n io rs Ve IQ 2 ig n Bit s SFR Definition 8.6. CPT1MX: Comparator1 MUX Selection 0100: P1.0 0101: P1.2 0110: P1.4 0111: P1.6 1000: P2.0 1001: P2.2 (only available on 40-pin and 32-pin devices) 1010: P2.4 (only available on 40-pin and 32-pin devices) 1011: P2.6 (only available on 40-pin and 32-pin devices) 1100–1111: None Rev. 1.2 78 C8051F55x/56x/57x 9. Voltage Regulator (REG0) ig n s C8051F55x/56x/57x devices include an on-chip low dropout voltage regulator (REG0). The input to REG0 at the VREGIN pin can be as high as 5.25 V. The output can be selected by software to 2.1 V or 2.6 V. When enabled, the output of REG0 appears on the VDD pin, powers the microcontroller core, and can be used to power external devices. On reset, REG0 is enabled and can be disabled by software. D es The Voltage regulator can generate an interrupt (if enabled by EREG0, EIE2.0) that is triggered whenever the VREGIN input voltage drops below the dropout threshold voltage. This dropout interrupt has no pending flag and the recommended procedure to use it is as follows: 1. Wait enough time to ensure the VREGIN input voltage is stable ew 2. Enable the dropout interrupt (EREG0, EIE2.0) and select the proper priority (PREG0, EIP2.0) rN 3. If triggered, inside the interrupt disable it (clear EREG0, EIE2.0), execute all procedures necessary to protect your application (put it in a safe mode and leave the interrupt now disabled. fo 4. In the main application, now running in the safe mode, regularly checks the DROPOUT bit (REG0CN.0). Once it is cleared by the regulator hardware the application can enable the interrupt again (EREG0, EIE1.6) and return to the normal mode operation. en de d The input (VREGIN) and output (VDD) of the voltage regulator should both be bypassed with a large capacitor (4.7 µF + 0.1 µF) to ground as shown in Figure 9.1. This capacitor will eliminate power spikes and provide any immediate power required by the microcontroller. The settling time associated with the voltage regulator is shown in Table 5.8 on page 43. no tR ec om m Note: The output of the internal voltage regulator is calibrated by the MCU immediately after any reset event. The output of the un-calibrated internal regulator could be below the high threshold setting of the VDD Monitor. If this is the case and the VDD Monitor is set to the high threshold setting and if the MCU receives a non-power on reset (POR), the MCU will remain in reset until a POR occurs (i.e., VDD Monitor will keep the device in reset). A POR will force the VDD Monitor to the low threshold setting which is guaranteed to be below the un-calibrated output of the internal regulator. The device will then exit reset and resume normal operation. It is for this reason Silicon Labs strongly recommends that the VDD Monitor is always left in the low threshold setting (i.e. default value upon POR). n REG0 VREGIN .1 µF IQ Ve rs io 4.7 µF VDD VDD 4.7 µF .1 µF Figure 9.1. External Capacitors for Voltage Regulator Input/Output— Regulator Enabled Rev. 1.2 79 C8051F55x/56x/57x ig n s If the internal voltage regulator is not used, the VREGIN input should be tied to VDD, as shown in Figure 9.2. VDD VDD rN .1 µF fo 4.7 µF ew D es VREGIN de d Figure 9.2. External Capacitors for Voltage Regulator Input/Output—Regulator Disabled Name REGDIS Reserved Type R/W R/W Reset 0 1 m 6 5 4 3 R R/W R R R R 0 1 0 0 0 0 Function Voltage Regulator Disable Bit. Read = 1b; Must Write 1b. Unused Read = 0b; Write = Don’t Care. io Reserved rs 5 n 0: Voltage Regulator Enabled 1: Voltage Regulator Disabled 6 REG0MD IQ Ve 4 Voltage Regulator Mode Select Bit. 0: Voltage Regulator Output is 2.1 V. 1: Voltage Regulator Output is 2.6 V. 3:1 Unused 0 DROPOUT Read = 000b. Write = Don’t Care. Voltage Regulator Dropout Indicator. 0: Voltage Regulator is not in dropout. 1: Voltage Regulator is in or near dropout. 80 1 Rev. 1.2 0 DROPOUT no REGDIS tR SFR Address = 0xC9; SFR Page = 0x00 Bit Name 7 2 REG0MD om 7 ec Bit en SFR Definition 9.1. REG0CN: Regulator Control C8051F55x/56x/57x 10. CIP-51 Microcontroller D es ig n s The MCU system controller core is the CIP-51 microcontroller. The CIP-51 is fully compatible with the MCS-51™ instruction set; standard 803x/805x assemblers and compilers can be used to develop software. The MCU family has a superset of all the peripherals included with a standard 8051. The CIP-51 also includes on-chip debug hardware (see description in Section 27), and interfaces directly with the analog and digital subsystems providing a complete data acquisition or control-system solution in a single integrated circuit. The CIP-51 Microcontroller core implements the standard 8051 organization and peripherals as well as additional custom peripherals and functions to extend its capability (see Figure 10.1 for a block diagram). The CIP-51 includes the following features:     ew rN  fo  Fully Compatible with MCS-51 Instruction Set 50 MIPS Peak Throughput with 50 MHz Clock 0 to 50 MHz Clock Frequency Extended Interrupt Handler Reset Input Power Management Modes On-chip Debug Logic Program and Data Memory Security d  de  en 10.1. Performance IQ Ve rs io n no tR ec om m The CIP-51 employs a pipelined architecture that greatly increases its instruction throughput over the standard 8051 architecture. In a standard 8051, all instructions except for MUL and DIV take 12 or 24 system clock cycles to execute, and usually have a maximum system clock of 12 MHz. By contrast, the CIP-51 core executes 70% of its instructions in one or two system clock cycles, with no instructions taking more than eight system clock cycles. Rev. 1.2 81 C8051F55x/56x/57x D8 STACK POINTER s D8 SRAM ADDRESS REGISTER PSW D8 D8 D8 ALU D es TMP2 SRAM D8 TMP1 ig n ACCUMULATOR DATA BUS B REGISTER D8 D8 D8 DATA BUS DATA BUS ew SFR_ADDRESS BUFFER D8 D8 SFR BUS INTERFACE SFR_WRITE_DATA rN D8 DATA POINTER SFR_CONTROL SFR_READ_DATA PROGRAM COUNTER (PC) PRGM. ADDRESS REG. MEM_ADDRESS D8 fo DATA BUS PC INCREMENTER MEM_CONTROL A16 MEMORY INTERFACE MEM_WRITE_DATA CONTROL LOGIC de RESET D8 CLOCK SYSTEM_IRQs EMULATION_IRQ D8 m POWER CONTROL REGISTER INTERRUPT INTERFACE en D8 STOP IDLE d MEM_READ_DATA PIPELINE om Figure 10.1. CIP-51 Block Diagram no Clocks to Execute tR ec With the CIP-51's maximum system clock at 50 MHz, it has a peak throughput of 50 MIPS. The CIP-51 has a total of 109 instructions. The table below shows the total number of instructions that require each execution time. Number of Instructions 1 2 2/3 3 3/4 4 4/5 5 8 26 50 5 14 7 3 1 2 1 io n Programming and Debugging Support In-system programming of the Flash program memory and communication with on-chip debug support logic is accomplished via the Silicon Labs 2-Wire Development Interface (C2). IQ Ve rs The on-chip debug support logic facilitates full speed in-circuit debugging, allowing the setting of hardware breakpoints, starting, stopping and single stepping through program execution (including interrupt service routines), examination of the program's call stack, and reading/writing the contents of registers and memory. This method of on-chip debugging is completely non-intrusive, requiring no RAM, Stack, timers, or other on-chip resources. C2 details can be found in Section “27. C2 Interface” on page 300. The CIP-51 is supported by development tools from Silicon Labs and third party vendors. Silicon Labs provides an integrated development environment (IDE) including editor, debugger and programmer. The IDE's debugger and programmer interface to the CIP-51 via the C2 interface to provide fast and efficient in-system device programming and debugging. Third party macro assemblers and C compilers are also available. 82 Rev. 1.2 C8051F55x/56x/57x 10.2. Instruction Set ig n s The instruction set of the CIP-51 System Controller is fully compatible with the standard MCS-51™ instruction set. Standard 8051 development tools can be used to develop software for the CIP-51. All CIP-51 instructions are the binary and functional equivalent of their MCS-51™ counterparts, including opcodes, addressing modes and effect on PSW flags. However, instruction timing is different than that of the standard 8051. D es 10.2.1. Instruction and CPU Timing In many 8051 implementations, a distinction is made between machine cycles and clock cycles, with machine cycles varying from 2 to 12 clock cycles in length. However, the CIP-51 implementation is based solely on clock cycle timing. All instruction timings are specified in terms of clock cycles. IQ Ve rs io n no tR ec om m en de d fo rN ew Due to the pipelined architecture of the CIP-51, most instructions execute in the same number of clock cycles as there are program bytes in the instruction. Conditional branch instructions take one less clock cycle to complete when the branch is not taken as opposed to when the branch is taken. Table 10.1 is the CIP-51 Instruction Set Summary, which includes the mnemonic, number of bytes, and number of clock cycles for each instruction. Rev. 1.2 83 C8051F55x/56x/57x Description Bytes Clock Cycles Arithmetic Operations IQ Ve rs io n fo d de en m om ec no tR Logical Operations ANL A, Rn ANL A, direct ANL A, @Ri ANL A, #data ANL direct, A ANL direct, #data ORL A, Rn ORL A, direct ORL A, @Ri ORL A, #data ORL direct, A ORL direct, #data XRL A, Rn XRL A, direct XRL A, @Ri AND Register to A AND direct byte to A AND indirect RAM to A AND immediate to A AND A to direct byte AND immediate to direct byte OR Register to A OR direct byte to A OR indirect RAM to A OR immediate to A OR A to direct byte OR immediate to direct byte Exclusive-OR Register to A Exclusive-OR direct byte to A Exclusive-OR indirect RAM to A 1 2 1 2 2 3 1 2 1 2 2 3 1 2 1 1 2 2 2 1 2 2 2 1 2 2 2 1 1 2 2 1 1 2 2 1 4 8 1 D es 1 2 1 2 1 2 1 2 1 2 1 2 1 1 2 1 1 1 2 1 1 1 1 1 ew Add register to A Add direct byte to A Add indirect RAM to A Add immediate to A Add register to A with carry Add direct byte to A with carry Add indirect RAM to A with carry Add immediate to A with carry Subtract register from A with borrow Subtract direct byte from A with borrow Subtract indirect RAM from A with borrow Subtract immediate from A with borrow Increment A Increment register Increment direct byte Increment indirect RAM Decrement A Decrement register Decrement direct byte Decrement indirect RAM Increment Data Pointer Multiply A and B Divide A by B Decimal adjust A rN ADD A, Rn ADD A, direct ADD A, @Ri ADD A, #data ADDC A, Rn ADDC A, direct ADDC A, @Ri ADDC A, #data SUBB A, Rn SUBB A, direct SUBB A, @Ri SUBB A, #data INC A INC Rn INC direct INC @Ri DEC A DEC Rn DEC direct DEC @Ri INC DPTR MUL AB DIV AB DA A ig n Mnemonic s Table 10.1. CIP-51 Instruction Set Summary 1 2 2 2 2 3 1 2 2 2 2 3 1 2 2 Note: Certain instructions take a variable number of clock cycles to execute depending on instruction alignment and the FLRT setting (SFR Definition 14.3). 84 Rev. 1.2 C8051F55x/56x/57x Table 10.1. CIP-51 Instruction Set Summary (Continued) Data Transfer s 2 2 3 1 2 1 1 1 1 1 1 2 2 2 1 2 2 2 2 3 2 3 2 2 2 3 4-7* 3 3 3 3 3 2 2 1 2 2 2 Clear Carry Clear direct bit 1 2 1 2 om m en de d fo 1 2 1 2 1 2 2 2 2 3 2 3 1 2 2 3 1 1 1 1 1 1 2 2 1 2 1 1 ec no n io rs Ve IQ Clock Cycles Move Register to A Move direct byte to A Move indirect RAM to A Move immediate to A Move A to Register Move direct byte to Register Move immediate to Register Move A to direct byte Move Register to direct byte Move direct byte to direct byte Move indirect RAM to direct byte Move immediate to direct byte Move A to indirect RAM Move direct byte to indirect RAM Move immediate to indirect RAM Load DPTR with 16-bit constant Move code byte relative DPTR to A Move code byte relative PC to A Move external data (8-bit address) to A Move A to external data (8-bit address) Move external data (16-bit address) to A Move A to external data (16-bit address) Push direct byte onto stack Pop direct byte from stack Exchange Register with A Exchange direct byte with A Exchange indirect RAM with A Exchange low nibble of indirect RAM with A tR MOV A, Rn MOV A, direct MOV A, @Ri MOV A, #data MOV Rn, A MOV Rn, direct MOV Rn, #data MOV direct, A MOV direct, Rn MOV direct, direct MOV direct, @Ri MOV direct, #data MOV @Ri, A MOV @Ri, direct MOV @Ri, #data MOV DPTR, #data16 MOVC A, @A+DPTR MOVC A, @A+PC MOVX A, @Ri MOVX @Ri, A MOVX A, @DPTR MOVX @DPTR, A PUSH direct POP direct XCH A, Rn XCH A, direct XCH A, @Ri XCHD A, @Ri 2 2 3 1 1 1 1 1 1 1 ew Exclusive-OR immediate to A Exclusive-OR A to direct byte Exclusive-OR immediate to direct byte Clear A Complement A Rotate A left Rotate A left through Carry Rotate A right Rotate A right through Carry Swap nibbles of A rN XRL A, #data XRL direct, A XRL direct, #data CLR A CPL A RL A RLC A RR A RRC A SWAP A Bytes ig n Description D es Mnemonic Boolean Manipulation CLR C CLR bit Note: Certain instructions take a variable number of clock cycles to execute depending on instruction alignment and the FLRT setting (SFR Definition 14.3). Rev. 1.2 85 C8051F55x/56x/57x Table 10.1. CIP-51 Instruction Set Summary (Continued) rs io DJNZ Rn, rel DJNZ direct, rel NOP ec om m en Absolute subroutine call Long subroutine call Return from subroutine Return from interrupt Absolute jump Long jump Short jump (relative address) Jump indirect relative to DPTR Jump if A equals zero Jump if A does not equal zero Compare direct byte to A and jump if not equal Compare immediate to A and jump if not equal Compare immediate to Register and jump if not equal Compare immediate to indirect and jump if not equal Decrement Register and jump if not zero Decrement direct byte and jump if not zero No operation tR no n CJNE @Ri, #data, rel ig n 1 2 1 2 2 2 2 2 2 2 2/(4-6)* 2/(4-6)* 3/(5-7)* 3/(5-7)* 3/(5-7)* s Clock Cycles d de Program Branching ACALL addr11 LCALL addr16 RET RETI AJMP addr11 LJMP addr16 SJMP rel JMP @A+DPTR JZ rel JNZ rel CJNE A, direct, rel CJNE A, #data, rel CJNE Rn, #data, rel 1 2 1 2 2 2 2 2 2 2 2 2 3 3 3 ew Set Carry Set direct bit Complement Carry Complement direct bit AND direct bit to Carry AND complement of direct bit to Carry OR direct bit to carry OR complement of direct bit to Carry Move direct bit to Carry Move Carry to direct bit Jump if Carry is set Jump if Carry is not set Jump if direct bit is set Jump if direct bit is not set Jump if direct bit is set and clear bit fo SETB C SETB bit CPL C CPL bit ANL C, bit ANL C, /bit ORL C, bit ORL C, /bit MOV C, bit MOV bit, C JC rel JNC rel JB bit, rel JNB bit, rel JBC bit, rel Bytes D es Description rN Mnemonic 2 3 1 1 2 3 2 1 2 2 3 3 3 4-6* 5-7* 6-8* 6-8* 4-6* 5-7* 4-6* 3-5* 2/(4-6)* 2/(4-6)* 4/(6-8)* 3/(6-8)* 3/(5-7)* 3 4/(6-8)* 2 3 1 2/(4-6)* 3/(5-7)* 1 IQ Ve Note: Certain instructions take a variable number of clock cycles to execute depending on instruction alignment and the FLRT setting (SFR Definition 14.3). 86 Rev. 1.2 C8051F55x/56x/57x s Notes on Registers, Operands and Addressing Modes: ig n Rn—Register R0–R7 of the currently selected register bank. D es @Ri—Data RAM location addressed indirectly through R0 or R1. rel—8-bit, signed (two’s complement) offset relative to the first byte of the following instruction. Used by SJMP and all conditional jumps. rN ew direct—8-bit internal data location’s address. This could be a direct-access Data RAM location (0x00– 0x7F) or an SFR (0x80–0xFF). #data—8-bit constant fo #data16—16-bit constant de d bit—Direct-accessed bit in Data RAM or SFR en addr11—11-bit destination address used by ACALL and AJMP. The destination must be within the same 2 kB page of program memory as the first byte of the following instruction. om m addr16—16-bit destination address used by LCALL and LJMP. The destination may be anywhere within the 64 kB program memory space. ec There is one unused opcode (0xA5) that performs the same function as NOP. All mnemonics copyrighted © Intel Corporation 1980. 10.3. CIP-51 Register Descriptions IQ Ve rs io n no tR Following are descriptions of SFRs related to the operation of the CIP-51 System Controller. Reserved bits should not be set to logic l. Future product versions may use these bits to implement new features in which case the reset value of the bit will be logic 0, selecting the feature's default state. Detailed descriptions of the remaining SFRs are included in the sections of the datasheet associated with their corresponding system function. Rev. 1.2 87 C8051F55x/56x/57x 5 4 Name DPL[7:0] Type R/W 0 Reset 0 0 0 SFR Address = 0x82; SFR Page = All Pages Bit Name 7:0 DPL[7:0] 3 2 0 0 1 0 ig n 6 Function D es 7 0 0 ew Bit Data Pointer Low. fo rN The DPL register is the low byte of the 16-bit DPTR. DPTR is used to access indirectly addressed Flash memory or XRAM. 6 5 4 2 1 0 0 0 0 0 DPH[7:0] Type 0 0 om 0 Reset m Name R/W 0 SFR Address = 0x83; SFR Page = All Pages Bit Name DPH[7:0] Function ec 7:0 3 en 7 de d SFR Definition 10.2. DPH: Data Pointer High Byte Bit Data Pointer High. IQ Ve rs io n no tR The DPH register is the high byte of the 16-bit DPTR. DPTR is used to access indirectly addressed Flash memory or XRAM. 88 Rev. 1.2 s SFR Definition 10.1. DPL: Data Pointer Low Byte C8051F55x/56x/57x 5 4 Name SP[7:0] Type R/W 0 Reset 0 0 0 SFR Address = 0x81; SFR Page = All Pages Bit Name SP[7:0] 2 1 0 0 1 1 1 Function Stack Pointer. rN 7:0 3 ig n 6 D es 7 ew Bit s SFR Definition 10.3. SP: Stack Pointer fo The Stack Pointer holds the location of the top of the stack. The stack pointer is incremented before every PUSH operation. The SP register defaults to 0x07 after reset. 6 5 de 7 4 3 2 1 0 0 0 0 0 en Bit d SFR Definition 10.4. ACC: Accumulator ACC[7:0] Type 0 0 om 0 Reset m Name R/W 0 ACC[7:0] Accumulator. tR 7:0 ec SFR Address = 0xE0; SFR Page = All Pages; Bit-Addressable Bit Name Function no This register is the accumulator for arithmetic operations. 7 io Bit n SFR Definition 10.5. B: B Register 6 5 4 B[7:0] Type R/W Ve rs Name IQ Reset 0 0 0 0 3 2 1 0 0 0 0 0 SFR Address = 0xF0; SFR Page = All Pages; Bit-Addressable Bit Name Function 7:0 B[7:0] B Register. This register serves as a second accumulator for certain arithmetic operations. Rev. 1.2 89 C8051F55x/56x/57x 6 5 Name CY AC F0 Type R/W R/W R/W Reset 0 0 0 4 3 2 1 RS[1:0] OV F1 PARITY R/W R/W R/W R 0 0 0 0 CY Carry Flag. rN 7 0 ew SFR Address = 0xD0; SFR Page = All Pages; Bit-Addressable Bit Name Function 0 ig n 7 D es Bit s SFR Definition 10.6. PSW: Program Status Word This bit is set when the last arithmetic operation resulted in a carry (addition) or a borrow (subtraction). It is cleared to logic 0 by all other arithmetic operations. Auxiliary Carry Flag. AC fo 6 5 F0 de d This bit is set when the last arithmetic operation resulted in a carry into (addition) or a borrow from (subtraction) the high order nibble. It is cleared to logic 0 by all other arithmetic operations. User Flag 0. RS[1:0] Register Bank Select. m 4:3 en This is a bit-addressable, general purpose flag for use under software control. Overflow Flag. OV tR 2 ec om These bits select which register bank is used during register accesses. 00: Bank 0, Addresses 0x00-0x07 01: Bank 1, Addresses 0x08-0x0F 10: Bank 2, Addresses 0x10-0x17 11: Bank 3, Addresses 0x18-0x1F F1 rs 1 io n no This bit is set to 1 under the following circumstances:  An ADD, ADDC, or SUBB instruction causes a sign-change overflow.  A MUL instruction results in an overflow (result is greater than 255).  A DIV instruction causes a divide-by-zero condition. The OV bit is cleared to 0 by the ADD, ADDC, SUBB, MUL, and DIV instructions in all other cases. PARITY This is a bit-addressable, general purpose flag for use under software control. Parity Flag. This bit is set to logic 1 if the sum of the eight bits in the accumulator is odd and cleared if the sum is even. IQ Ve 0 User Flag 1. 90 Rev. 1.2 C8051F55x/56x/57x 10.4. Serial Number Special Function Registers (SFRs) ig n s The C8051F55x/56x/57x devices include four SFRs, SN0 through SN3, that are pre-programmed during production with a unique, 32-bit serial number. The serial number provides a unique identification number for each device and can be read from the application firmware. If the serial number is not used in the application, these four registers can be used as general purpose SFRs. Bit 7 6 5 4 3 D es SFR Definition 10.7. SNn: Serial Number n 2 SERNUMn[7:0] Type R/W Reset Varies—Unique 32-bit value 0 rN ew Name 1 fo SFR Addresses: SN0 = 0xF9; SN1 = 0xFA; SN2 = 0xFB; SN3 = 0xFC; SFR Page = 0x0F; Bit Name Function SERNUMn[7:0] Serial Number Bits. d 7:0 IQ Ve rs io n no tR ec om m en de The four serial number registers form a 32-bit serial number, with SN3 as the most significant byte and SN0 as the least significant byte. Rev. 1.2 91 C8051F55x/56x/57x 11. Memory Organization PROGRAM/DATA MEMORY (FLASH) D es ig n s The memory organization of the CIP-51 System Controller is similar to that of a standard 8051. There are two separate memory spaces: program memory and data memory. Program and data memory share the same address space but are accessed via different instruction types. The memory organization is shown in Figure 11.1 DATA MEMORY (RAM) INTERNAL DATA ADDRESS SPACE 0x80 0x7F RESERVED Upper 128 RAM (Indirect Addressing Only) Special Function Register's (Direct Addressing Only) ew 0xFF rN C8051F550/1/2/3 C8051F560/1/2/3/8/9 C8051F570/1 fo (Direct and Indirect Addressing) 0x7C00 0x7BFF 0x30 0x2F 0x20 0x1F (In-System Programmable in 512 Byte Sectors) d Bit Addressable de 32 kB FLASH Lower 128 RAM (Direct and Indirect Addressing) General Purpose Registers en 0x00 0x0000 ec C8051F554/5/6/7 C8051F564/5/6/7 C8051F572/3/4/5 tR 0x3FFF 0xFFFF om m EXTERNAL DATA ADDRESS SPACE Same 2048 bytes as from 0x0000 to 0x07FF, wrapped on 2048-byte boundaries 0x8000 0x07FF XRAM 2K Bytes no 16 kB FLASH (accessable using MOVX instruction) 0x0000 io n (In-System Programmable in 512 Byte Sectors) Figure 11.1. C8051F55x/56x/57x Memory Map Ve rs 0x0000 IQ 11.1. Program Memory The CIP-51 core has a 64 kB program memory space. The C8051F55x/56x/57x devices implement 32 kB or 16 kB of this program memory space as in-system, re-programmable Flash memory, organized in a contiguous block from addresses 0x0000 to 0x7FFF in 32 kB devices and addresses 0x0000 to 0x3FFF in 16 kB devices. The address 0x7BFF in 32 kB devices and 0x3FFF in 16 kB devices serves as the security lock byte for the device. Addresses above 0x7BFF are reserved in the 32 kB devices. Rev. 1.2 92 C8051F55x/56x/57x s C8051F550/1/2/3 C8051F560/1/2/3/8/9 C8051F570/1 ig n 0x7FFF Reserved Area 0x7C00 0x7BFE D es 0x7BFF 0x7A00 Lock Byte ew C8051F554/5/6/7 C8051F564/5/6/7 C8051F572/3/4/5 Lock Byte Page 0x3FFF rN 0x3FFE Lock Byte Page Flash Memory Space (32 kB Flash Device) fo 0x3E00 d Flash Memory Space (16 kB Flash Device) de 0x0000 FLASH memory organized in 512-byte pages Lock Byte 0x0000 en Figure 11.2. Flash Program Memory Map m 11.1.1. MOVX Instruction and Program Memory tR ec om The MOVX instruction in an 8051 device is typically used to access external data memory. On the C8051F55x/56x/57x devices, the MOVX instruction is normally used to read and write on-chip XRAM, but can be re-configured to write and erase on-chip Flash memory space. MOVC instructions are always used to read Flash memory, while MOVX write instructions are used to erase and write Flash. This Flash access feature provides a mechanism for the C8051F55x/56x/57x to update program code and use the program memory space for non-volatile data storage. Refer to Section “14. Flash Memory” on page 124 for further details. 11.2. Data Memory n no The C8051F55x/56x/57x devices include 2304 bytes of RAM data memory. 256 bytes of this memory is mapped into the internal RAM space of the 8051. The other 2048 bytes of this memory is on-chip “external” memory. The data memory map is shown in Figure 11.1 for reference. io 11.2.1. Internal RAM IQ Ve rs There are 256 bytes of internal RAM mapped into the data memory space from 0x00 through 0xFF. The lower 128 bytes of data memory are used for general purpose registers and scratch pad memory. Either direct or indirect addressing may be used to access the lower 128 bytes of data memory. Locations 0x00 through 0x1F are addressable as four banks of general purpose registers, each bank consisting of eight byte-wide registers. The next 16 bytes, locations 0x20 through 0x2F, may either be addressed as bytes or as 128 bit locations accessible with the direct addressing mode. The upper 128 bytes of data memory are accessible only by indirect addressing. This region occupies the same address space as the Special Function Registers (SFR) but is physically separate from the SFR space. The addressing mode used by an instruction when accessing locations above 0x7F determines whether the CPU accesses the upper 128 bytes of data memory space or the SFRs. Instructions that use direct addressing will access the SFR space. Instructions using indirect addressing above 0x7F access the upper 128 bytes of data memory. Figure 11.1 illustrates the data memory organization of the 93 Rev. 1.2 C8051F55x/56x/57x C8051F55x/56x/57x. 11.2.1.1. General Purpose Registers D es ig n s The lower 32 bytes of data memory, locations 0x00 through 0x1F, may be addressed as four banks of general-purpose registers. Each bank consists of eight byte-wide registers designated R0 through R7. Only one of these banks may be enabled at a time. Two bits in the program status word, RS0 (PSW.3) and RS1 (PSW.4), select the active register bank (see description of the PSW in SFR Definition 10.6). This allows fast context switching when entering subroutines and interrupt service routines. Indirect addressing modes use registers R0 and R1 as index registers. 11.2.1.2. Bit Addressable Locations rN ew In addition to direct access to data memory organized as bytes, the sixteen data memory locations at 0x20 through 0x2F are also accessible as 128 individually addressable bits. Each bit has a bit address from 0x00 to 0x7F. Bit 0 of the byte at 0x20 has bit address 0x00 while bit7 of the byte at 0x20 has bit address 0x07. Bit 7 of the byte at 0x2F has bit address 0x7F. A bit access is distinguished from a full byte access by the type of instruction used (bit source or destination operands as opposed to a byte source or destination). C, 22.3h de MOV d fo The MCS-51™ assembly language allows an alternate notation for bit addressing of the form XX.B where XX is the byte address and B is the bit position within the byte. For example, the instruction: en moves the Boolean value at 0x13 (bit 3 of the byte at location 0x22) into the Carry flag. m 11.2.1.3. Stack IQ Ve rs io n no tR ec om A programmer's stack can be located anywhere in the 256-byte data memory. The stack area is designated using the Stack Pointer (SP) SFR. The SP will point to the last location used. The next value pushed on the stack is placed at SP+1 and then SP is incremented. A reset initializes the stack pointer to location 0x07. Therefore, the first value pushed on the stack is placed at location 0x08, which is also the first register (R0) of register bank 1. Thus, if more than one register bank is to be used, the SP should be initialized to a location in the data memory not being used for data storage. The stack depth can extend up to 256 bytes. Rev. 1.2 94 C8051F55x/56x/57x 12. Special Function Registers D es ig n s The direct-access data memory locations from 0x80 to 0xFF constitute the special function registers (SFRs). The SFRs provide control and data exchange with the C8051F55x/56x/57x's resources and peripherals. The CIP-51 controller core duplicates the SFRs found in a typical 8051 implementation as well as implementing additional SFRs used to configure and access the sub-systems unique to the C8051F55x/56x/57x. This allows the addition of new functionality while retaining compatibility with the MCS-51™ instruction set. Table 12.3 lists the SFRs implemented in the C8051F55x/56x/57x device family. rN ew The SFR registers are accessed anytime the direct addressing mode is used to access memory locations from 0x80 to 0xFF. SFRs with addresses ending in 0x0 or 0x8 (e.g., P0, TCON, SCON0, IE, etc.) are bitaddressable as well as byte-addressable. All other SFRs are byte-addressable only. Unoccupied addresses in the SFR space are reserved for future use. Accessing unoccupied addresses in the SFR space will have an indeterminate effect and should be avoided. Refer to the corresponding pages of the data sheet, as indicated in Table 12.3, for a detailed description of each register. 12.1. SFR Paging de d fo The CIP-51 features SFR paging, allowing the device to map many SFRs into the 0x80 to 0xFF memory address space. The SFR memory space has 256 pages. In this way, each memory location from 0x80 to 0xFF can access up to 256 SFRs. The C8051F55x/56x/57x family of devices utilizes three SFR pages: 0x00, 0x0C, and 0x0F. SFR pages are selected using the Special Function Register Page Selection register, SFRPAGE (see SFR Definition 11.3). The procedure for reading and writing an SFR is as follows: 1. Select the appropriate SFR page number using the SFRPAGE register. en 2. Use direct accessing mode to read or write the special function register (MOV instruction). m 12.2. Interrupts and SFR Paging rs io n no tR ec om When an interrupt occurs, the SFR Page Register will automatically switch to the SFR page containing the flag bit that caused the interrupt. The automatic SFR Page switch function conveniently removes the burden of switching SFR pages from the interrupt service routine. Upon execution of the RETI instruction, the SFR page is automatically restored to the SFR Page in use prior to the interrupt. This is accomplished via a three-byte SFR Page Stack. The top byte of the stack is SFRPAGE, the current SFR Page. The second byte of the SFR Page Stack is SFRNEXT. The third, or bottom byte of the SFR Page Stack is SFRLAST. Upon an interrupt, the current SFRPAGE value is pushed to the SFRNEXT byte, and the value of SFRNEXT is pushed to SFRLAST. Hardware then loads SFRPAGE with the SFR Page containing the flag bit associated with the interrupt. On a return from interrupt, the SFR Page Stack is popped resulting in the value of SFRNEXT returning to the SFRPAGE register, thereby restoring the SFR page context without software intervention. The value in SFRLAST (0x00 if there is no SFR Page value in the bottom of the stack) of the stack is placed in SFRNEXT register. If desired, the values stored in SFRNEXT and SFRLAST may be modified during an interrupt, enabling the CPU to return to a different SFR Page upon execution of the RETI instruction (on interrupt exit). Modifying registers in the SFR Page Stack does not cause a push or pop of the stack. Only interrupt calls and returns will cause push/pop operations on the SFR Page Stack. IQ Ve On the C8051F55x/56x/57x devices, vectoring to an interrupt will switch SFRPAGE to page 0x00, except for the CAN0 interrupt which will switch SFRPAGE to page 0x0C. Rev. 1.2 95 C8051F55x/56x/57x s SFRPGCN Bit D es ig n Interrupt Logic ew SFRPAGE rN CIP-51 de d fo SFRNEXT m en SFRLAST om Figure 12.1. SFR Page Stack ec Automatic hardware switching of the SFR Page on interrupts may be enabled or disabled as desired using the SFR Automatic Page Control Enable Bit located in the SFR Page Control Register (SFR0CN). This function defaults to “enabled” upon reset. In this way, the autoswitching function will be enabled unless disabled in software. IQ Ve rs io n no tR A summary of the SFR locations (address and SFR page) are provided in Table 12.3 in the form of an SFR memory map. Each memory location in the map has an SFR page row, denoting the page in which that SFR resides. Certain SFRs are accessible from ALL SFR pages, and are denoted by the “(ALL PAGES)” designation. For example, the Port I/O registers P0, P1, P2, and P3 all have the “(ALL PAGES)” designation, indicating these SFRs are accessible from all SFR pages regardless of the SFRPAGE register value. 96 Rev. 1.2 C8051F55x/56x/57x 12.3. SFR Page Stack Example ew SFR Page Stack SFR's D es ig n s The following is an example that shows the operation of the SFR Page Stack during interrupts. In this example, the SFR Control register is left in the default enabled state (i.e., SFRPGEN = 1), and the CIP-51 is executing in-line code that is writing values to SPI Data Register (SFR “SPI0DAT”, located at address 0xA3 on SFR Page 0x00). The device is also using the CAN peripheral (CAN0) and the Programmable Counter Array (PCA0) peripheral to generate a PWM output. The PCA is timing a critical control function in its interrupt service and so its associated ISR that is set to high priority. At this point, the SFR page is set to access the SPI0DAT SFR (SFRPAGE = 0x00). See Figure 12.2. 0x0 rN SFRPAGE d fo (SPI0DAT) SFRLAST ec om m en de SFRNEXT IQ Ve rs io n no tR Figure 12.2. SFR Page Stack While Using SFR Page 0x0 To Access SPI0DAT Rev. 1.2 97 C8051F55x/56x/57x D es ig n s While CIP-51 executes in-line code (writing values to SPI0DAT in this example), the CAN0 Interrupt occurs. The CIP-51 vectors to the CAN0 ISR and pushes the current SFR Page value (SFR Page 0x00) into SFRNEXT in the SFR Page Stack. The SFR page needed to access CAN’s SFRs is then automatically placed in the SFRPAGE register (SFR Page 0x0C). SFRPAGE is considered the “top” of the SFR Page Stack. Software can now access the CAN0 SFRs. Software may switch to any SFR Page by writing a new value to the SFRPAGE register at any time during the CAN0 ISR to access SFRs that are not on SFR Page 0x0C. See Figure 12.3. ew SFR Page 0xC Automatically pushed on stack in SFRPAGE on CAN0 interrupt rN 0xC SFRPAGE d de 0x0 fo (CAN0) SFRPAGE pushed to SFRNEXT SFRNEXT om m en (SPI0DAT) ec SFRLAST IQ Ve rs io n no tR Figure 12.3. SFR Page Stack After CAN0 Interrupt Occurs 98 Rev. 1.2 C8051F55x/56x/57x D es ig n s While in the CAN0 ISR, a PCA interrupt occurs. Recall the PCA interrupt is configured as a high priority interrupt, while the CAN0 interrupt is configured as a low priority interrupt. Thus, the CIP-51 will now vector to the high priority PCA ISR. Upon doing so, the CIP-51 will automatically place the SFR page needed to access the PCA’s special function registers into the SFRPAGE register, SFR Page 0x00. The value that was in the SFRPAGE register before the PCA interrupt (SFR Page 0x0C for CAN0) is pushed down the stack into SFRNEXT. Likewise, the value that was in the SFRNEXT register before the PCA interrupt (in this case SFR Page 0x00 for SPI0DAT) is pushed down to the SFRLAST register, the “bottom” of the stack. Note that a value stored in SFRLAST (via a previous software write to the SFRLAST register) will be overwritten. See Figure 12.4. rN ew SFR Page 0x0 Automatically pushed on stack in SFRPAGE on PCA interrupt fo 0x0 SFRPAGE de d (PCA) SFRPAGE pushed to SFRNEXT en 0xC SFRNEXT m (CAN0) om SFRNEXT pushed to SFRLAST 0x0 ec SFRLAST tR (SPI0DAT) IQ Ve rs io n no Figure 12.4. SFR Page Stack Upon PCA Interrupt Occurring During a CAN0 ISR Rev. 1.2 99 C8051F55x/56x/57x ig n s On exit from the PCA interrupt service routine, the CIP-51 will return to the CAN0 ISR. On execution of the RETI instruction, SFR Page 0x00 used to access the PCA registers will be automatically popped off of the SFR Page Stack, and the contents of the SFRNEXT register will be moved to the SFRPAGE register. Software in the CAN0 ISR can continue to access SFRs as it did prior to the PCA interrupt. Likewise, the contents of SFRLAST are moved to the SFRNEXT register. Recall this was the SFR Page value 0x00 being used to access SPI0DAT before the CAN0 interrupt occurred. See Figure 12.5. ew D es SFR Page 0x0 Automatically popped off of the stack on return from interrupt rN 0xC SFRPAGE fo (CAN0) SFRNEXT popped to SFRPAGE de d 0x0 SFRNEXT en (SPI0DAT) ec om m SFRLAST popped to SFRNEXT SFRLAST IQ Ve rs io n no tR Figure 12.5. SFR Page Stack Upon Return From PCA Interrupt 100 Rev. 1.2 C8051F55x/56x/57x s On the execution of the RETI instruction in the CAN0 ISR, the value in SFRPAGE register is overwritten with the contents of SFRNEXT. The CIP-51 may now access the SPI0DAT register as it did prior to the interrupts occurring. See Figure 12.6. D es ig n SFR Page 0xC Automatically popped off of the stack on return from interrupt 0x0 ew SFRPAGE fo rN (SPI0DAT) SFRNEXT popped to SFRPAGE SFRLAST om m en de d SFRNEXT ec Figure 12.6. SFR Page Stack Upon Return From CAN0 Interrupt no tR In the example above, all three bytes in the SFR Page Stack are accessible via the SFRPAGE, SFRNEXT, and SFRLAST special function registers. If the stack is altered while servicing an interrupt, it is possible to return to a different SFR Page upon interrupt exit than selected prior to the interrupt call. Direct access to the SFR Page stack can be useful to enable real-time operating systems to control and manage context switching between multiple tasks. IQ Ve rs io n Push operations on the SFR Page Stack only occur on interrupt service, and pop operations only occur on interrupt exit (execution on the RETI instruction). The automatic switching of the SFRPAGE and operation of the SFR Page Stack as described above can be disabled in software by clearing the SFR Automatic Page Enable Bit (SFRPGEN) in the SFR Page Control Register (SFR0CN). See SFR Definition 12.1. Rev. 1.2 101 C8051F55x/56x/57x 7 6 5 4 3 2 1 SFRPGEN Name R R R R R R R Reset 0 0 0 0 0 0 0 Function rN Unused Read = 0000000b; Write = Don’t Care SFRPGEN SFR Automatic Page Control Enable. 1 ew SFR Address = 0x84; SFR Page = 0x0F Bit Name R/W D es Type 7:1 0 0 ig n Bit s SFR Definition 12.1. SFR0CN: SFR Page Control fo Upon interrupt, the C8051 Core will vector to the specified interrupt service routine and automatically switch the SFR page to the corresponding peripheral or function’s SFR page. This bit is used to control this autopaging function. de d 0: SFR Automatic Paging disabled. The C8051 core will not automatically change to the appropriate SFR page (i.e., the SFR page that contains the SFRs for the peripheral/function that was the source of the interrupt). IQ Ve rs io n no tR ec om m en 1: SFR Automatic Paging enabled. Upon interrupt, the C8051 will switch the SFR page to the page that contains the SFRs for the peripheral or function that is the source of the interrupt. 102 Rev. 1.2 C8051F55x/56x/57x 5 4 3 Name SFRPAGE[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xA7; SFR Page = All Pages Bit Name SFRPAGE[7:0] SFR Page Bits. 1 0 0 0 0 rN 7:0 Function 2 ig n 6 D es 7 ew Bit s SFR Definition 12.2. SFRPAGE: SFR Page Represents the SFR Page the C8051 core uses when reading or modifying SFRs. fo Write: Sets the SFR Page. d Read: Byte is the SFR page the C8051 core is using. IQ Ve rs io n no tR ec om m en de When enabled in the SFR Page Control Register (SFR0CN), the C8051 core will automatically switch to the SFR Page that contains the SFRs of the corresponding peripheral/function that caused the interrupt, and return to the previous SFR page upon return from interrupt (unless SFR Stack was altered before a returning from the interrupt). SFRPAGE is the top byte of the SFR Page Stack, and push/pop events of this stack are caused by interrupts (and not by reading/writing to the SFRPAGE register) Rev. 1.2 103 C8051F55x/56x/57x 5 4 3 Name SFRNEXT[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0x85; SFR Page = All Pages Bit Name SFRNEXT[7:0] SFR Page Bits. 1 0 0 0 0 rN 7:0 Function 2 ig n 6 D es 7 ew Bit s SFR Definition 12.3. SFRNEXT: SFR Next This is the value that will go to the SFR Page register upon a return from interrupt. d fo Write: Sets the SFR Page contained in the second byte of the SFR Stack. This will cause the SFRPAGE SFR to have this SFR page value upon a return from interrupt. de Read: Returns the value of the SFR page contained in the second byte of the SFR stack. IQ Ve rs io n no tR ec om m en SFR page context is retained upon interrupts/return from interrupts in a 3 byte SFR Page Stack: SFRPAGE is the first entry, SFRNEXT is the second, and SFRLAST is the third entry. The SFR stack bytes may be used alter the context in the SFR Page Stack, and will not cause the stack to “push” or “pop”. Only interrupts and return from interrupts cause pushes and pops of the SFR Page Stack. 104 Rev. 1.2 C8051F55x/56x/57x 5 4 3 Name SFRLAST[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xA7; SFR Page = All Pages Bit Name SFRLAST[7:0] SFR Page Stack Bits. 1 0 0 0 0 rN 7:0 Function 2 ig n 6 D es 7 ew Bit s SFR Definition 12.4. SFRLAST: SFR Last This is the value that will go to the SFRNEXT register upon a return from interrupt. fo Write: Sets the SFR Page in the last entry of the SFR Stack. This will cause the SFRNEXT SFR to have this SFR page value upon a return from interrupt. de d Read: Returns the value of the SFR page contained in the last entry of the SFR stack. IQ Ve rs io n no tR ec om m en SFR page context is retained upon interrupts/return from interrupts in a 3 byte SFR Page Stack: SFRPAGE is the first entry, SFRNEXT is the second, and SFRLAST is the third entry. The SFR stack bytes may be used alter the context in the SFR Page Stack, and will not cause the stack to “push” or “pop”. Only interrupts and return from interrupts cause pushes and pops of the SFR Page Stack. Rev. 1.2 105 C8051F55x/56x/57x 1(9) 2(A) 3(B) 4(C) 5(D) 6(E) 7(F) s 0(8) ig n Page Address Table 12.1. Special Function Register (SFR) Memory Map for Pages 0x00 and 0x0F IQ Ve rs io n no tR ec om m en de d fo rN ew D es F8 0 SPI0CN PCA0L PCA0H PCA0CPL0 PCA0CPH0 PCACPL4 PCACPH4 VDM0CN F SN0 SN1 SN2 SN3 F0 0 B P0MAT P0MASK P1MAT P1MASK EIP1 EIP2 F (All Pages) P0MDIN P1MDIN P2MDIN P3MDIN EIP1 EIP2 E8 0 ADC0CN PCA0CPL1 PCA0CPH1 PCA0CPL2 PCA0CPH2 PCA0CPL3 PCA0CPL3 RSTSRC F E0 0 ACC EIE1 EIE2 F (All Pages) XBR0 XBR1 CCH0CN IT01CF (All Pages) (All Pages) D8 0 PCA0CN PCA0MD PCA0CPM0 PCA0CPM1 PCA0CPM2 PCA0CPM3 PCA0CPM4 PCA0CPM5 F PCA0PWM D0 0 PSW REF0CN LIN0DATA LIN0ADDR F (All Pages) P0SKIP P1SKIP P2SKIP P3SKIP C8 0 TMR2CN REG0CN TMR2RLL TMR2RLH TMR2L TMR2H PCA0CPL5 PCA0CPH5 F LIN0CF C0 0 SMB0CN SMB0CF SMB0DAT ADC0GTL ADC0GTH ADC0LTL ADC0LTH F XBR2 B8 0 IP ADC0TK ADC0MX ADC0CF ADC0L ADC0H F (All Pages) B0 0 P3 P2MAT P2MASK P4 FLSCL FLKEY F (All Pages) EMI0CF (All Pages) (All Pages) (All Pages) A8 0 IE SMOD0 EMI0CN P3MAT P3MASK F (All Pages) EMI0TC SBCON0 SBRLL0 SBRLH0 P3MDOUT P4MDOUT A0 0 P2 SPI0CFG SPI0CKR SPI0DAT SFRPAGE F (All Pages) OSCICN OSCICRS P0MDOUT P1MDOUT P2MDOUT (All Pages) 98 0 SCON0 SBUF0 CPT0CN CPT0MD CPT0MX CPT1CN CPT1MD CPT1MX F OSCIFIN OSCXCN 90 0 P1 TMR3CN TMR3RLL TMR3RLH TMR3L TMR3H F (All Pages) CLKMUL 88 0 TCON TMOD TL0 TL1 TH0 TH1 CKCON PSCTL F (All Pages) (All Pages) (All Pages) (All Pages) (All Pages) (All Pages) (All Pages) CLKSEL 80 0 P0 SP DPL DPH SFRNEXT SFRLAST PCON F (All Pages) (All Pages) (All Pages) (All Pages) SFR0CN (All Pages) (All Pages) (All Pages) 0(8) 1(9) 2(A) 3(B) 4(C) 5(D) 6(E) 7(F) (bit addressable) 106 Rev. 1.2 C8051F55x/56x/57x Table 12.2. Special Function Register (SFR) Memory Map for Page 0x0C 0(8) 1(9) 2(A) 3(B) 4(C) 5(D) 6(E) 7(F) CAN0IF2DA2L CAN0IF2DA2H CAN0IF2DB1L CAN0IF2DB1H CAN0IF2DB2L CAN0IF2DB2H E8 ACC (All Pages) CAN0IF2M1L CAN0IF2M1H CAN0IF2M2L CAN0IF2M2H CAN0IF1DB1L CAN0IF1DB1H CAN0IF1DB2L CAN0IF1DB2H PSW (All Pages) C8 CAN0IF2DA1H CAN0IF2A1L CAN0IF2A1H CAN0IF2CRL CAN0IF2CRH CAN0IF1A1L CAN0IF2MCH CAN0IF1A1H CAN0IF1A2L CAN0IF1A2H CAN0IF1CML CAN0IF1CMH CAN0IF1M1L CAN0IF1M1H IP (All Pages) CAN0MV1L CAN0MV1H B0 P3 (All Pages) CAN0IP2L CAN0IP2H A8 IE (All Pages) CAN0ND1L CAN0ND1H CAN0ND2L CAN0ND2H A0 P2 CAN0BRPE (All Pages) CAN0TR1L CAN0TR1H CAN0TR2L CAN0TR2H 98 SCON0 (All Pages) CAN0BTL CAN0BTH CAN0IIDL CAN0IIDH 90 P1 (All Pages) CAN0CFG 88 TCON TMOD (All Pages) (All Pages) TL0 (All Pages) 80 P0 SP (All Pages) (All Pages) DPL (All Pages) DPH (All Pages) 2(A) 3(B) CAN0IF1CRH P4 (All Pages) FLSCL (All Pages) FLKEY (All Pages) CAN0IP1L CAN0IP1H en de d CAN0IF1CRL m om ec TH0 (All Pages) 4(C) CAN0IF1M2H CAN0MV2H CAN0STAT TL1 (All Pages) CAN0IF1M2L SFRPAGE (All Pages) CAN0TST CAN0ERRL CAN0ERRH TH1 (All Pages) CKCON (All Pages) SFRNEXT (All Pages) SFRLAST (All Pages) PCON (All Pages) 5(D) 6(E) 7(F) IQ Ve rs io n no tR CAN0MV2L CAN0IF2MCL fo B8 1(9) EIE2 (All Pages) CAN0IF1DA2H CAN0CN (bit addressable) EIE1 (All Pages) CAN0IF1MCL CAN0IF1MCH CAN0IF1DA1L CAN0IF1DA1H CAN0IF1DA2L C0 0(8) CAN0IF2DA1L CAN0IF2CML CAN0IF2CMH D8 D0 CAN0IF2A2H ew E0 CAN0IF2A2L D es B (All Pages) rN F0 ig n s F8 Rev. 1.2 107 C8051F55x/56x/57x SFRs are listed in alphabetical order. All undefined SFR locations are reserved Register Address Description Page ACC 0xE0 Accumulator ADC0CF 0xBC ADC0 Configuration ADC0CN 0xE8 ADC0 Control ADC0GTH 0xC4 ADC0 Greater-Than Compare High ADC0GTL 0xC3 ADC0 Greater-Than Compare Low ADC0H 0xBE ADC0 High ADC0L 0xBD ADC0 Low ADC0LTH 0xC6 ADC0 Less-Than Compare Word High ADC0LTL 0xC5 ADC0 Less-Than Compare Word Low ADC0MX 0xBB ADC0 Mux Configuration ADC0TK 0xBA ADC0 Tracking Mode Select B 0xF0 B Register CCH0CN 0xE3 Cache Control CKCON 0x8E Clock Control CLKMUL 0x97 Clock Multiplier CLKSEL 0x8F Clock Select CPT0CN 0x9A Comparator0 Control 72 CPT0MD 0x9B Comparator0 Mode Selection 73 CPT0MX 0x9C Comparator0 MUX Selection 77 CPT1CN 0x9D Comparator1 Control 72 CPT1MD 0x9E Comparator1 Mode Selection 73 CPT1MX 0x9F Comparator1 MUX Selection 77 DPH 0x83 Data Pointer High 88 DPL 0x82 Data Pointer Low 88 ig n 89 58 D es 60 62 59 59 63 63 66 61 89 134 260 163 no Extended Interrupt Enable 1 118 EIE2 0xE7 Extended Interrupt Enable 2 118 0xF6 Extended Interrupt Priority 1 119 EIP2 0xF7 Extended Interrupt Priority 2 120 EMI0CF 0xB2 External Memory Interface Configuration 148 EMI0CN 0xAA External Memory Interface Control 147 EMI0TC 0xAA External Memory Interface Timing Control 152 FLKEY 0xB7 Flash Lock and Key 132 FLSCL 0xB6 Flash Scale 133 IE 0xA8 Interrupt Enable 116 IP 0xB8 Interrupt Priority 117 IQ io n 0xE6 rs 158 Ve tR ec om m en de d fo rN ew 62 EIE1 EIP1 108 s Table 12.3. Special Function Registers Rev. 1.2 C8051F55x/56x/57x Table 12.3. Special Function Registers (Continued) SFRs are listed in alphabetical order. All undefined SFR locations are reserved Register Address Description INT0/INT1 Configuration LIN0ADR 0xD3 LIN0 Address LIN0CF 0xC9 LIN0 Configuration LIN0DAT 0xD2 LIN0 Data OSCICN 0xA1 Internal Oscillator Control OSCICRS 0xA2 Internal Oscillator Coarse Control OSCIFIN 0x9E Internal Oscillator Fine Calibration OSCXCN 0x9F External Oscillator Control P0 0x80 Port 0 Latch P0MASK 0xF2 Port 0 Mask Configuration P0MAT 0xF1 Port 0 Match Configuration P0MDIN 0xF1 Port 0 Input Mode Configuration P0MDOUT 0xA4 Port 0 Output Mode Configuration P0SKIP 0xD4 Port 0 Skip P1 0x90 Port 1 Latch P1MASK 0xF4 Port 1 Mask Configuration 180 P1MAT 0xF3 Port 1 Match Configuration 180 P1MDIN 0xF2 Port 1 Input Mode Configuration 186 P1MDOUT 0xA5 Port 1 Output Mode Configuration 186 P1SKIP 0xD5 Port 1 Skip 187 P2 0xA0 Port 2 Latch P2MASK 0xB2 ec 187 Port 2 Mask Configuration 181 P2MAT 0xB1 Port 2 Match Configuration 181 P2MDIN 0xF3 Port 2 Input Mode Configuration 188 0xA6 Port 2 Output Mode Configuration 188 0xD6 Port 2 Skip 189 0xB0 Port 3 Latch 189 P3MASK 0xAF Port 3 Mask Configuration 182 P3MAT rs 0xAE Port 3 Match Configuration 182 P3MDIN 0xF4 Port 3 Input Mode Configuration 190 P3MDOUT 0xAE Port 3 Output Mode Configuration 190 P3SKIP 0xD7 Port 3 Skip 191 P4 0xB5 Port 4 Latch 191 P4MDOUT 0xAF Port 4 Output Mode Configuration 192 PCA0CN 0xD8 PCA Control 294 PCA0CPH0 0xFC PCA Capture 0 High 299 200 D es 200 201 160 io Ve om m en de d fo rN ew 161 tR no n P2SKIP P3 123 s 0xE4 ig n IT01CF P2MDOUT IQ Page Rev. 1.2 161 165 183 179 179 184 184 185 185 109 C8051F55x/56x/57x Table 12.3. Special Function Registers (Continued) SFRs are listed in alphabetical order. All undefined SFR locations are reserved Register Address Description PCA Capture 1 High PCA0CPH2 0xEC PCA Capture 2 High PCA0CPH3 0xEE PCA Capture 3 High PCA0CPH4 0xFE PCA Capture 4 High PCA0CPH5 0xCF PCA Capture 5 High PCA0CPL0 0xFB PCA Capture 0 Low PCA0CPL1 0xE9 PCA Capture 1 Low PCA0CPL2 0xEB PCA Capture 2 Low PCA0CPL3 0xED PCA Capture 3 Low PCA0CPL4 0xFD PCA Capture 4 Low PCA0CPL5 0xCE PCA Capture 5 Low PCA0CPM0 0xDA PCA Module 0 Mode Register PCA0CPM1 0xDB PCA Module 1 Mode Register PCA0CPM2 0xDC PCA Module 2 Mode Register 297 PCA0CPM3 0xDD PCA Module 3 Mode Register 297 PCA0CPM4 0xDE PCA Module 4 Mode Register PCA0CPM5 0xDF en 297 PCA Module 5 Mode Register 297 PCA0H 0xFA PCA Counter High 298 PCA0L 0xF9 PCA Counter Low 298 PCA0MD 0xD9 PCA Mode 295 PCA0PWM 0xD9 PCA PWM Configuration PCON 0x87 ec 296 Power Control 137 PSCTL 0x8F Program Store R/W Control 131 PSW 0xD0 Program Status Word 90 0xD1 Voltage Reference Control 69 0xC9 Voltage Regulator Control 80 0xEF Reset Source Configuration/Status 143 SBCON0 0xAB UART0 Baud Rate Generator Control 244 SBRLH0 rs 0xAD UART0 Baud Rate Reload High Byte 245 SBRLL0 0xAC UART0 Baud Rate Reload Low Byte 245 SBUF0 0x99 UART0 Data Buffer 244 SCON0 0x98 UART0 Control 241 SFR0CN 0x84 SFR Page Control 102 SFRLAST 0x86 SFR Stack Last Page 105 SFRNEXT 0x85 SFR Stack Next Page 104 SFRPAGE 0xA7 SFR Page Select 103 299 D es 299 299 299 om m de d fo rN ew 299 tR no n REG0CN Ve io RSTSRC 110 299 s 0xEA ig n PCA0CPH1 REF0CN IQ Page Rev. 1.2 299 299 299 299 299 297 297 C8051F55x/56x/57x Table 12.3. Special Function Registers (Continued) SFRs are listed in alphabetical order. All undefined SFR locations are reserved Register Address Description SMBus0 Configuration SMB0CN 0xC0 SMBus0 Control SMB0DAT 0xC2 SMBus0 Data SMOD0 0xA9 UART0 Mode SN0 0xF9 Serial Number 0 SN1 0xFA Serial Number 1 SN2 0xFB Serial Number 2 SN3 0xFC Serial Number 3 SP 0x81 Stack Pointer SPI0CFG 0xA1 SPI0 Configuration SPI0CKR 0xA2 SPI0 Clock Rate Control SPI0CN 0xF8 SPI0 Control SPI0DAT 0xA3 SPI0 Data TCON 0x88 Timer/Counter Control TH0 0x8C Timer/Counter 0 High TH1 0x8D Timer/Counter 1 High 268 TL0 0x8A Timer/Counter 0 Low 267 TL1 0x8B Timer/Counter 1 Low 267 TMOD 0x89 Timer/Counter Mode TMR2CN 0xC8 Timer/Counter 2 Control 272 TMR2H 0xCD TMR2L 0xCC TMR2RLH 0xCB Timer/Counter 2 Reload High 273 TMR2RLL 0xCA Timer/Counter 2 Reload Low 273 TMR3CN 0x91 no Timer/Counter 3 Control 278 0x95 Timer/Counter 3 High 280 0x94 Timer/Counter 3 Low 280 TMR3RLH 0x93 Timer/Counter 3 Reload High 279 TMR3RLL rs 0x92 Timer/Counter 3 Reload Low 279 VDM0CN 0xFF VDD Monitor Control 141 XBR0 0xE1 Port I/O Crossbar Control 0 176 XBR1 0xE2 Port I/O Crossbar Control 1 177 XBR2 0xC7 Port I/O Crossbar Control 2 178 Ve 226 D es 228 243 91 91 91 89 253 255 254 255 265 268 266 Timer/Counter 2 High 274 Timer/Counter 2 Low 274 ec om m en de d fo rN ew 91 tR n io TMR3L 224 s 0xC1 ig n SMB0CF TMR3H IQ Page Rev. 1.2 111 C8051F55x/56x/57x 13. Interrupts ig n s The C8051F55x/56x/57x devices include an extended interrupt system supporting a total of 18 interrupt sources with two priority levels. The allocation of interrupt sources between on-chip peripherals and external inputs pins varies according to the specific version of the device. Each interrupt source has one or more associated interrupt-pending flag(s) located in an SFR. When a peripheral or external source meets a valid interrupt condition, the associated interrupt-pending flag is set to logic 1. rN ew D es If interrupts are enabled for the source, an interrupt request is generated when the interrupt-pending flag is set. As soon as execution of the current instruction is complete, the CPU generates an LCALL to a predetermined address to begin execution of an interrupt service routine (ISR). Each ISR must end with an RETI instruction, which returns program execution to the next instruction that would have been executed if the interrupt request had not occurred. If interrupts are not enabled, the interrupt-pending flag is ignored by the hardware and program execution continues as normal. (The interrupt-pending flag is set to logic 1 regardless of the interrupt's enable/disable state.) fo Each interrupt source can be individually enabled or disabled through the use of an associated interrupt enable bit in an SFR (IE, EIE1, or EIE2). However, interrupts must first be globally enabled by setting the EA bit (IE.7) to logic 1 before the individual interrupt enables are recognized. Setting the EA bit to logic 0 disables all interrupt sources regardless of the individual interrupt-enable settings. en de d Note: Any instruction that clears a bit to disable an interrupt should be immediately followed by an instruction that has two or more opcode bytes. Using EA (global interrupt enable) as an example: // in 'C': EA = 0; // clear EA bit. EA = 0; // this is a dummy instruction with two-byte opcode. om m ; in assembly: CLR EA ; clear EA bit. CLR EA ; this is a dummy instruction with two-byte opcode. tR ec For example, if an interrupt is posted during the execution phase of a "CLR EA" opcode (or any instruction which clears a bit to disable an interrupt source), and the instruction is followed by a single-cycle instruction, the interrupt may be taken. However, a read of the enable bit will return a 0 inside the interrupt service routine. When the bit-clearing opcode is followed by a multi-cycle instruction, the interrupt will not be taken. n no Some interrupt-pending flags are automatically cleared by the hardware when the CPU vectors to the ISR. However, most are not cleared by the hardware and must be cleared by software before returning from the ISR. If an interrupt-pending flag remains set after the CPU completes the return-from-interrupt (RETI) instruction, a new interrupt request will be generated immediately and the CPU will re-enter the ISR after the completion of the next instruction. io 13.1. MCU Interrupt Sources and Vectors IQ Ve rs The C8051F55x/56x/57x MCUs support 18 interrupt sources. Software can simulate an interrupt by setting any interrupt-pending flag to logic 1. If interrupts are enabled for the flag, an interrupt request will be generated and the CPU will vector to the ISR address associated with the interrupt-pending flag. MCU interrupt sources, associated vector addresses, priority order and control bits are summarized in Table 13.1. Refer to the datasheet section associated with a particular on-chip peripheral for information regarding valid interrupt conditions for the peripheral and the behavior of its interrupt-pending flag(s). Rev. 1.2 112 C8051F55x/56x/57x 13.1.1. Interrupt Priorities ig n s Each interrupt source can be individually programmed to one of two priority levels: low or high. A low priority interrupt service routine can be preempted by a high priority interrupt. A high priority interrupt cannot be preempted. Each interrupt has an associated interrupt priority bit in an SFR (IE, EIP1, or EIP2) used to configure its priority level. Low priority is the default. If two interrupts are recognized simultaneously, the interrupt with the higher priority is serviced first. If both interrupts have the same priority level, a fixed priority order is used to arbitrate, given in Table 13.1. D es 13.1.2. Interrupt Latency IQ Ve rs io n no tR ec om m en de d fo rN ew Interrupt response time depends on the state of the CPU when the interrupt occurs. Pending interrupts are sampled and priority decoded each system clock cycle. Therefore, the fastest possible response time is 5 system clock cycles: 1 clock cycle to detect the interrupt and 4 clock cycles to complete the LCALL to the ISR. If an interrupt is pending when a RETI is executed, a single instruction is executed before an LCALL is made to service the pending interrupt. Therefore, the maximum response time for an interrupt (when no other interrupt is currently being serviced or the new interrupt is of greater priority) occurs when the CPU is performing an RETI instruction followed by a DIV as the next instruction. In this case, the response time is 18 system clock cycles: 1 clock cycle to detect the interrupt, 5 clock cycles to execute the RETI, 8 clock cycles to complete the DIV instruction and 4 clock cycles to execute the LCALL to the ISR. If the CPU is executing an ISR for an interrupt with equal or higher priority, the new interrupt will not be serviced until the current ISR completes, including the RETI and following instruction. 113 Rev. 1.2 C8051F55x/56x/57x Reset 0x0000 Top None External Interrupt 0 (INT0) Timer 0 Overflow External Interrupt 1 (INT1) Timer 1 Overflow UART0 0x0003 0 IE0 (TCON.1) N/A N/A Always Always Enabled Highest Y Y EX0 (IE.0) PX0 (IP.0) 0x000B 0x0013 1 2 TF0 (TCON.5) IE1 (TCON.3) Y Y Y Y ET0 (IE.1) PT0 (IP.1) EX1 (IE.2) PX1 (IP.2) 0x001B 0x0023 3 4 Y Y Y N ET1 (IE.3) PT1 (IP.3) ES0 (IE.4) PS0 (IP.4) Timer 2 Overflow 0x002B 5 Y N ET2 (IE.5) PT2 (IP.5) SPI0 0x0033 6 Y N ESPI0 (IE.6) PSPI0 (IP.6) SMB0 0x003B 7 TF1 (TCON.7) RI0 (SCON0.0) TI0 (SCON0.1) TF2H (TMR2CN.7) TF2L (TMR2CN.6) SPIF (SPI0CN.7) WCOL (SPI0CN.6) MODF (SPI0CN.5) RXOVRN (SPI0CN.4) SI (SMB0CN.0) Y N ADC0 Window Compare ADC0 Conversion Complete Programmable Counter Array 0x0043 AD0WINT (ADC0CN.3) AD0INT (ADC0CN.5) Y N Y N Y N ESMB0 (EIE1.0) EWADC0 (EIE1.1) EADC0 (EIE1.2) EPCA0 (EIE1.3) PSMB0 (EIP1.0) PWADC0 (EIP1.1) PADC0 (EIP1.2) PPCA0 (EIP1.3) N N de m om ec 9 0x0053 10 11 0x0063 12 Timer 3 Overflow 0x006B 13 LIN0 0x0073 14 Voltage Regulator Dropout CAN0 0x007B 15 N/A 0x0083 16 Port Match 0x008B 17 CAN0INT (CAN0CN.7) None no tR 0x005B rs 0x004B CF (PCA0CN.7) CCFn (PCA0CN.n) COVF (PCA0PWM.6) CP0FIF (CPT0CN.4) CP0RIF (CPT0CN.5) CP1FIF (CPT1CN.4) CP1RIF (CPT1CN.5) TF3H (TMR3CN.7) TF3L (TMR3CN.6) LIN0INT (LINST.3) Comparator0 Ve io n Comparator1 IQ 8 Priority Control ew D es ig n Enable Flag rN d fo Pending Flag s Priority Order Cleared by HW? Interrupt Vector en Interrupt Source Bit addressable? Table 13.1. Interrupt Summary ECP0 (EIE1.4) N N ECP1 (EIE1.5) N N ET3 (EIE1.6) N N* ELIN0 (EIE1.7) N/A N/A EREG0 (EIE2.0) N Y ECAN0 (EIE2.1) N/A N/A EMAT (EIE2.2) PCP0 (EIP1.4) PCP1 (EIP1.5) PT3 (EIP1.6) PLIN0 (EIP1.7) PREG0 (EIP2.0) PCAN0 (EIP2.1) PMAT (EIP2.2) *Note: The LIN0INT bit is cleared by setting RSTINT (LINCTRL.3) Rev. 1.2 114 C8051F55x/56x/57x 13.2. Interrupt Register Descriptions IQ Ve rs io n no tR ec om m en de d fo rN ew D es ig n s The SFRs used to enable the interrupt sources and set their priority level are described in this section. Refer to the data sheet section associated with a particular on-chip peripheral for information regarding valid interrupt conditions for the peripheral and the behavior of its interrupt-pending flag(s). 115 Rev. 1.2 C8051F55x/56x/57x 6 5 4 3 2 1 Name EA ESPI0 ET2 ES0 ET1 EX1 ET0 Type R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 EX0 R/W 0 ew SFR Address = 0xA8; Bit-Addressable; SFR Page = All Pages Bit Name Function 0 ig n 7 D es Bit s SFR Definition 13.1. IE: Interrupt Enable 7 EA 6 ESPI0 5 ET2 Enable Timer 2 Interrupt. This bit sets the masking of the Timer 2 interrupt. 0: Disable Timer 2 interrupt. 1: Enable interrupt requests generated by the TF2L or TF2H flags. 4 ES0 Enable UART0 Interrupt. This bit sets the masking of the UART0 interrupt. 0: Disable UART0 interrupt. 1: Enable UART0 interrupt. 3 ET1 Enable Timer 1 Interrupt. This bit sets the masking of the Timer 1 interrupt. 0: Disable all Timer 1 interrupt. 1: Enable interrupt requests generated by the TF1 flag. 2 EX1 fo rN Enable All Interrupts. Globally enables/disables all interrupts. It overrides individual interrupt mask settings. 0: Disable all interrupt sources. 1: Enable each interrupt according to its individual mask setting. no tR ec om m en de d Enable Serial Peripheral Interface (SPI0) Interrupt. This bit sets the masking of the SPI0 interrupts. 0: Disable all SPI0 interrupts. 1: Enable interrupt requests generated by SPI0. n io rs 1 ET0 Enable Timer 0 Interrupt. This bit sets the masking of the Timer 0 interrupt. 0: Disable all Timer 0 interrupt. 1: Enable interrupt requests generated by the TF0 flag. 0 EX0 Enable External Interrupt 0. This bit sets the masking of External Interrupt 0. 0: Disable external interrupt 0. 1: Enable interrupt requests generated by the INT0 input. Ve IQ Enable External Interrupt 1. This bit sets the masking of External Interrupt 1. 0: Disable external interrupt 1. 1: Enable interrupt requests generated by the INT1 input. Rev. 1.2 116 C8051F55x/56x/57x 7 Name 6 5 4 3 2 1 PSPI0 PT2 PS0 PT1 PX1 PT0 R R/W R/W R/W R/W R/W R/W Reset 1 0 0 0 0 0 0 ew SFR Address = 0xB8; Bit-Addressable; SFR Page = All Pages Bit Name Function Unused Read = 1b, Write = Don't Care. 6 PSPI0 5 PT2 Timer 2 Interrupt Priority Control. This bit sets the priority of the Timer 2 interrupt. 0: Timer 2 interrupt set to low priority level. 1: Timer 2 interrupt set to high priority level. 4 PS0 UART0 Interrupt Priority Control. This bit sets the priority of the UART0 interrupt. 0: UART0 interrupt set to low priority level. 1: UART0 interrupt set to high priority level. 3 PT1 Timer 1 Interrupt Priority Control. This bit sets the priority of the Timer 1 interrupt. 0: Timer 1 interrupt set to low priority level. 1: Timer 1 interrupt set to high priority level. 2 PX1 External Interrupt 1 Priority Control. This bit sets the priority of the External Interrupt 1 interrupt. 0: External Interrupt 1 set to low priority level. 1: External Interrupt 1 set to high priority level. 1 PT0 rN 7 Ve rs io n no tR ec om m en de d fo Serial Peripheral Interface (SPI0) Interrupt Priority Control. This bit sets the priority of the SPI0 interrupt. 0: SPI0 interrupt set to low priority level. 1: SPI0 interrupt set to high priority level. IQ 0 117 PX0 Timer 0 Interrupt Priority Control. This bit sets the priority of the Timer 0 interrupt. 0: Timer 0 interrupt set to low priority level. 1: Timer 0 interrupt set to high priority level. External Interrupt 0 Priority Control. This bit sets the priority of the External Interrupt 0 interrupt. 0: External Interrupt 0 set to low priority level. 1: External Interrupt 0 set to high priority level. Rev. 1.2 PX0 R/W D es Type 0 ig n Bit s SFR Definition 13.2. IP: Interrupt Priority 0 C8051F55x/56x/57x s SFR Definition 13.3. EIE1: Extended Interrupt Enable 1 7 6 5 4 3 2 1 Name ELIN0 ET3 ECP1 ECP0 EPCA0 EADC0 EWADC0 ESMB0 Type R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 D es 0 ew SFR Address = 0xE6; SFR Page = All Pages Bit Name 0 ig n Bit Function 7 ELIN0 6 ET3 5 ECP1 Enable Comparator1 (CP1) Interrupt. This bit sets the masking of the CP1 interrupt. 0: Disable CP1 interrupts. 1: Enable interrupt requests generated by the CP1RIF or CP1FIF flags. 4 ECP0 Enable Comparator0 (CP0) Interrupt. This bit sets the masking of the CP0 interrupt. 0: Disable CP0 interrupts. 1: Enable interrupt requests generated by the CP0RIF or CP0FIF flags. 3 EPCA0 2 EADC0 fo rN Enable LIN0 Interrupt. This bit sets the masking of the LIN0 interrupt. 0: Disable LIN0 interrupts. 1: Enable interrupt requests generated by the LIN0INT flag. no Enable Programmable Counter Array (PCA0) Interrupt. This bit sets the masking of the PCA0 interrupts. 0: Disable all PCA0 interrupts. 1: Enable interrupt requests generated by PCA0. rs io n Enable ADC0 Conversion Complete Interrupt. This bit sets the masking of the ADC0 Conversion Complete interrupt. 0: Disable ADC0 Conversion Complete interrupt. 1: Enable interrupt requests generated by the AD0INT flag. EWADC0 Enable Window Comparison ADC0 Interrupt. This bit sets the masking of ADC0 Window Comparison interrupt. 0: Disable ADC0 Window Comparison interrupt. 1: Enable interrupt requests generated by ADC0 Window Compare flag (AD0WINT). IQ Ve 1 tR ec om m en de d Enable Timer 3 Interrupt. This bit sets the masking of the Timer 3 interrupt. 0: Disable Timer 3 interrupts. 1: Enable interrupt requests generated by the TF3L or TF3H flags. 0 ESMB0 Enable SMBus (SMB0) Interrupt. This bit sets the masking of the SMB0 interrupt. 0: Disable all SMB0 interrupts. 1: Enable interrupt requests generated by SMB0. Rev. 1.2 118 C8051F55x/56x/57x 7 6 5 4 3 2 1 Name PLIN0 PT3 PCP1 PCP0 PPCA0 PADC0 PWADC0 PSMB0 Type R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 Function PLIN0 6 PT3 Timer 3 Interrupt Priority Control. This bit sets the priority of the Timer 3 interrupt. 0: Timer 3 interrupts set to low priority level. 1: Timer 3 interrupts set to high priority level. 5 PCP1 Comparator0 (CP1) Interrupt Priority Control. This bit sets the priority of the CP1 interrupt. 0: CP1 interrupt set to low priority level. 1: CP1 interrupt set to high priority level. 4 PCP0 Comparator0 (CP0) Interrupt Priority Control. This bit sets the priority of the CP0 interrupt. 0: CP0 interrupt set to low priority level. 1: CP0 interrupt set to high priority level. 3 PPCA0 2 PADC0 fo no Programmable Counter Array (PCA0) Interrupt Priority Control. This bit sets the priority of the PCA0 interrupt. 0: PCA0 interrupt set to low priority level. 1: PCA0 interrupt set to high priority level. rs io n ADC0 Conversion Complete Interrupt Priority Control. This bit sets the priority of the ADC0 Conversion Complete interrupt. 0: ADC0 Conversion Complete interrupt set to low priority level. 1: ADC0 Conversion Complete interrupt set to high priority level. PWADC0 ADC0 Window Comparator Interrupt Priority Control. This bit sets the priority of the ADC0 Window interrupt. 0: ADC0 Window interrupt set to low priority level. 1: ADC0 Window interrupt set to high priority level. IQ Ve 1 tR ec om m en de d LIN0 Interrupt Priority Control. This bit sets the priority of the LIN0 interrupt. 0: LIN0 interrupts set to low priority level. 1: LIN0 interrupts set to high priority level. rN 7 D es ew SFR Address = 0xF6; SFR Page = 0x00 and 0x0F Bit Name 0 119 PSMB0 SMBus (SMB0) Interrupt Priority Control. This bit sets the priority of the SMB0 interrupt. 0: SMB0 interrupt set to low priority level. 1: SMB0 interrupt set to high priority level. Rev. 1.2 0 ig n Bit s SFR Definition 13.4. EIP1: Extended Interrupt Priority 1 0 C8051F55x/56x/57x 7 6 5 4 3 Name 2 1 EMAT ECAN0 EREG0 R/W R R R R R R/W R/W Reset 0 0 0 0 0 0 0 0 ew SFR Address = 0xE7; SFR Page = All Pages Bit Name D es Type 0 ig n Bit s SFR Definition 13.5. EIE2: Extended Interrupt Enable 2 Function Unused Read = 00000b; Write = Don’t Care. 2 EMAT 1 ECAN0 Enable CAN0 Interrupts. This bit sets the masking of the CAN0 interrupt. 0: Disable all CAN0 interrupts. 1: Enable interrupt requests generated by CAN0. 0 EREG0 Enable Voltage Regulator Dropout Interrupt. This bit sets the masking of the Voltage Regulator Dropout interrupt. 0: Disable the Voltage Regulator Dropout interrupt. 1: Enable the Voltage Regulator Dropout interrupt. rN 7:3 IQ Ve rs io n no tR ec om m en de d fo Enable Port Match Interrupt. This bit sets the masking of the Port Match interrupt. 0: Disable all Port Match interrupts. 1: Enable interrupt requests generated by a Port Match Rev. 1.2 120 C8051F55x/56x/57x 7 6 5 4 3 Name 2 1 PMAT PCAN0 PREG0 R/W R R R R R R/W R/W Reset 0 0 0 0 0 0 0 ew SFR Address = 0xF7; SFR Page = 0x00 and 0x0F Bit Name Function Unused Read = 00000b; Write = Don’t Care. 2 PMAT 1 PCAN0 CAN0 Interrupt Priority Control. This bit sets the priority of the CAN0 interrupt. 0: CAN0 interrupt set to low priority level. 1: CAN0 interrupt set to high priority level. 0 PREG0 Voltage Regulator Dropout Interrupt Priority Control. This bit sets the priority of the Voltage Regulator Dropout interrupt. 0: Voltage Regulator Dropout interrupt set to low priority level. 1: Voltage Regulator Dropout interrupt set to high priority level. IQ Ve rs io n no tR ec om m en de d fo rN 7:3 Port Match Interrupt Priority Control. This bit sets the priority of the Port Match interrupt. 0: Port Match interrupt set to low priority level. 1: Port Match interrupt set to high priority level. 121 Rev. 1.2 D es Type 0 ig n Bit s SFR Definition 13.6. EIP2: Extended Interrupt Priority Enabled 2 0 C8051F55x/56x/57x 13.3. External Interrupts INT0 and INT1 ig n s The INT0 and INT1 external interrupt sources are configurable as active high or low, edge or level sensitive. The IN0PL (INT0 Polarity) and IN1PL (INT1 Polarity) bits in the IT01CF register select active high or active low; the IT0 and IT1 bits in TCON (Section “25.1. Timer 0 and Timer 1” on page 261) select level or edge sensitive. The table below lists the possible configurations. IN0PL INT0 Interrupt IT1 IN1PL INT1 Interrupt 1 0 Active low, edge sensitive 1 0 Active low, edge sensitive 1 1 Active high, edge sensitive 1 1 Active high, edge sensitive 0 0 Active low, level sensitive 0 0 Active low, level sensitive 0 1 Active high, level sensitive 0 1 ew D es IT0 Active high, level sensitive d fo rN INT0 and INT1 are assigned to Port pins as defined in the IT01CF register (see SFR Definition 13.7). Note that INT0 and INT0 Port pin assignments are independent of any Crossbar assignments. INT0 and INT1 will monitor their assigned Port pins without disturbing the peripheral that was assigned the Port pin via the Crossbar. To assign a Port pin only to INT0 and/or INT1, configure the Crossbar to skip the selected pin(s). This is accomplished by setting the associated bit in register XBR0 (see Section “19.3. Priority Crossbar Decoder” on page 172 for complete details on configuring the Crossbar). IQ Ve rs io n no tR ec om m en de IE0 (TCON.1) and IE1 (TCON.3) serve as the interrupt-pending flags for the INT0 and INT1 external interrupts, respectively. If an INT0 or INT1 external interrupt is configured as edge-sensitive, the corresponding interrupt-pending flag is automatically cleared by the hardware when the CPU vectors to the ISR. When configured as level sensitive, the interrupt-pending flag remains logic 1 while the input is active as defined by the corresponding polarity bit (IN0PL or IN1PL); the flag remains logic 0 while the input is inactive. The external interrupt source must hold the input active until the interrupt request is recognized. It must then deactivate the interrupt request before execution of the ISR completes or another interrupt request will be generated. Rev. 1.2 122 C8051F55x/56x/57x 5 Name IN1PL IN1SL[2:0] IN0PL IN0SL[2:0] Type R/W R/W R/W R/W Reset 0 0 4 0 3 0 0 SFR Address = 0xE4; SFR Page = 0x0F Bit Name 0 Function INT1 Polarity. 0: INT1 input is active low. 1: INT1 input is active high. 0 0 0 fo IN1SL[2:0] INT1 Port Pin Selection Bits. These bits select which Port pin is assigned to INT1. Note that this pin assignment is independent of the Crossbar; INT1 will monitor the assigned Port pin without disturbing the peripheral that has been assigned the Port pin via the Crossbar. The Crossbar will not assign the Port pin to a peripheral if it is configured to skip the selected pin. 000: Select P1.0 001: Select P1.1 010: Select P1.2 011: Select P1.3 100: Select P1.4 101: Select P1.5 110: Select P1.6 111: Select P1.7 INT0 Polarity. 0: INT0 input is active low. 1: INT0 input is active high. no IN0SL[2:0] INT0 Port Pin Selection Bits. These bits select which Port pin is assigned to INT0. Note that this pin assignment is independent of the Crossbar; INT0 will monitor the assigned Port pin without disturbing the peripheral that has been assigned the Port pin via the Crossbar. The Crossbar will not assign the Port pin to a peripheral if it is configured to skip the selected pin. 000: Select P1.0 001: Select P1.1 010: Select P1.2 011: Select P1.3 100: Select P1.4 101: Select P1.5 110: Select P1.6 111: Select P1.7 IQ Ve rs io n 2:0 IN0PL tR 3 ec om m en de d 6:4 IN1PL 1 rN 7 2 ew 6 ig n 7 D es Bit s SFR Definition 13.7. IT01CF: INT0/INT1 Configuration 123 Rev. 1.2 C8051F55x/56x/57x 14. Flash Memory D es ig n s On-chip, re-programmable Flash memory is included for program code and non-volatile data storage. The Flash memory can be programmed in-system, a single byte at a time, through the C2 interface or by software using the MOVX instruction. Once cleared to logic 0, a Flash bit must be erased to set it back to logic 1. Flash bytes would typically be erased (set to 0xFF) before being reprogrammed. The write and erase operations are automatically timed by hardware for proper execution; data polling to determine the end of the write/erase operation is not required. Code execution is stalled during a Flash write/erase operation. Refer to Table 5.5 for complete Flash memory electrical characteristics. 14.1. Programming The Flash Memory d fo rN ew The simplest means of programming the Flash memory is through the C2 interface using programming tools provided by Silicon Labs or a third party vendor. This is the only means for programming a non-initialized device. For details on the C2 commands to program Flash memory, see Section “27. C2 Interface” on page 300. To ensure the integrity of Flash contents, it is strongly recommended that the on-chip VDD Monitor be enabled in any system that includes code that writes and/or erases Flash memory from software. See Section 14.4 for more details. Before performing any Flash write or erase procedure, set the FLEWT bit in Flash Scale register (FLSCL) to 1. Also, note that 8-bit MOVX instructions cannot be used to erase or write to Flash memory at addresses higher than 0x00FF. en de For –I (Industrial Grade) parts, parts programmed at a cold temperature below 0 °C may exhibit weakly programmed flash memory bits. If programmed at 0 °C or higher, there is no problem reading Flash across the entire temperature range of -40 °C to 125 °C. This temperature restriction does not apply to –A (Automotive Grade) devices. m 14.1.1. Flash Lock and Key Functions IQ Ve rs io n no tR ec om Flash writes and erases by user software are protected with a lock and key function. The Flash Lock and Key Register (FLKEY) must be written with the correct key codes, in sequence, before Flash operations may be performed. The key codes are: 0xA5, 0xF1. The timing does not matter, but the codes must be written in order. If the key codes are written out of order, or the wrong codes are written, Flash writes and erases will be disabled until the next system reset. Flash writes and erases will also be disabled if a Flash write or erase is attempted before the key codes have been written properly. The Flash lock resets after each write or erase; the key codes must be written again before a following Flash operation can be performed. The FLKEY register is detailed in SFR Definition 14.2. Rev. 1.2 124 C8051F55x/56x/57x 14.1.2. Flash Erase Procedure ig n s The Flash memory can be programmed by software using the MOVX write instruction with the address and data byte to be programmed provided as normal operands. Before writing to Flash memory using MOVX, Flash write operations must be enabled by doing the following: (1) setting the PSWE Program Store Write Enable bit (PSCTL.0) to logic 1 (this directs the MOVX writes to target Flash memory); and (2) Writing the Flash key codes in sequence to the Flash Lock register (FLKEY). The PSWE bit remains set until cleared by software. ew D es A write to Flash memory can clear bits to logic 0 but cannot set them; only an erase operation can set bits to logic 1 in Flash. A byte location to be programmed should be erased before a new value is written. The Flash memory is organized in 512-byte pages. The erase operation applies to an entire page (setting all bytes in the page to 0xFF). To erase an entire 512-byte page, perform the following steps: 1. Disable interrupts (recommended). rN 2. Set the FLEWT bit (register FLSCL). 3. Set the PSEE bit (register PSCTL). fo 4. Set the PSWE bit (register PSCTL). 5. Write the first key code to FLKEY: 0xA5. d 6. Write the second key code to FLKEY: 0xF1. de 7. Using the MOVX instruction, write a data byte to any location within the 512-byte page to be erased. 8. Clear the PSWE and PSEE bits. en 14.1.3. Flash Write Procedure 1. Disable interrupts (recommended). m Flash bytes are programmed by software with the following sequence: om 2. Erase the 512-byte Flash page containing the target location, as described in Section 14.1.2. 3. Set the FLEWT bit (register FLSCL). 4. Set the PSWE bit (register PSCTL). ec 5. Clear the PSEE bit (register PSCTL). tR 6. Write the first key code to FLKEY: 0xA5. 7. Write the second key code to FLKEY: 0xF1. 8. Using the MOVX instruction, write a single data byte to the desired location within the 512-byte sector. no 9. Clear the PSWE bit. IQ Ve rs io n Steps 5–7 must be repeated for each byte to be written. After Flash writes are complete, PSWE should be cleared so that MOVX instructions do not target program memory. 125 Rev. 1.2 C8051F55x/56x/57x 14.1.4. Flash Write Optimization ig n s The Flash write procedure includes a block write option to optimize the time to perform consecutive byte writes. When block write is enabled by setting the CHBLKW bit (CCH0CN.0), writes to two consecutive bytes in Flash require the same amount of time as a single byte write. This is performed by caching the first byte that is written to Flash and then committing both bytes to Flash when the second byte is written. When block writes are enabled, if the second write does not occur, the first data byte written is not actually written to Flash. Flash bytes with block write enabled are programmed by software with the following sequence: D es 1. Disable interrupts (recommended). 2. Erase the 512-byte Flash page containing the target location, as described in Section 14.1.2. 3. Set the FLEWT bit (register FLSCL). ew 4. Set the CHBLKW bit (register CCH0CN). 5. Set the PSWE bit (register PSCTL). rN 6. Clear the PSEE bit (register PSCTL). 7. Write the first key code to FLKEY: 0xA5. fo 8. Write the second key code to FLKEY: 0xF1. 9. Using the MOVX instruction, write the first data byte to the desired location within the 512-byte sector. d 10.Write the first key code to FLKEY: 0xA5. de 11. Write the second key code to FLKEY: 0xF1. en 12.Using the MOVX instruction, write the second data byte to the desired location within the 512-byte sector. The location of the second byte must be the next higher address from the first data byte. 13.Clear the PSWE bit. IQ Ve rs io n no tR ec om m 14.Clear the CHBLKW bit. Rev. 1.2 126 C8051F55x/56x/57x 14.2. Non-volatile Data Storage ig n s The Flash memory can be used for non-volatile data storage as well as program code. This allows data such as calibration coefficients to be calculated and stored at run time. Data is written using the MOVX write instruction and read using the MOVC instruction. Note: MOVX read instructions always target XRAM. 14.3. Security Options ew D es The CIP-51 provides security options to protect the Flash memory from inadvertent modification by software as well as to prevent the viewing of proprietary program code and constants. The Program Store Write Enable (bit PSWE in register PSCTL) and the Program Store Erase Enable (bit PSEE in register PSCTL) bits protect the Flash memory from accidental modification by software. PSWE must be explicitly set to 1 before software can modify the Flash memory; both PSWE and PSEE must be set to 1 before software can erase Flash memory. Additional security features prevent proprietary program code and data constants from being read or altered across the C2 interface. en de d fo rN A Security Lock Byte located at the last byte of Flash user space offers protection of the Flash program memory from access (reads, writes, or erases) by unprotected code or the C2 interface. The Flash security mechanism allows the user to lock n 512-byte Flash pages, starting at page 0 (addresses 0x0000 to 0x01FF), where n is the ones complement number represented by the Security Lock Byte. Note that the page containing the Flash Security Lock Byte is unlocked when no other Flash pages are locked (all bits of the Lock Byte are 1) and locked when any other Flash pages are locked (any bit of the Lock Byte is 0). See example in Figure 14.1. Lock Byte Lock Byte Page Unlocked FLASH Pages tR ec om Locked when any other FLASH pages are locked m Reserved Area Locked Flash Pages rs io n no Access limit set according to the FLASH security lock byte IQ Ve Security Lock Byte: 1s Complement: Flash pages locked: 11111101b 00000010b 3 (First two Flash pages + Lock Byte Page) Figure 14.1. Flash Program Memory Map 127 Rev. 1.2 C8051F55x/56x/57x ig n s The level of Flash security depends on the Flash access method. The three Flash access methods that can be restricted are reads, writes, and erases from the C2 debug interface, user firmware executing on unlocked pages, and user firmware executing on locked pages. Table 14.1 summarizes the Flash security features of the C8051F55x/56x/57x devices. Table 14.1. Flash Security Summary C2 Debug Interface User Firmware executing from: D es Action a locked page Permitted Permitted Permitted Not Permitted Flash Error Reset Permitted Read or Write page containing Lock Byte (if no pages are locked) Permitted Permitted Permitted Read or Write page containing Lock Byte (if any page is locked) Not Permitted Flash Error Reset Permitted rN Read, Write or Erase locked pages (except page with Lock Byte) fo Read, Write or Erase unlocked pages (except page with Lock Byte) ew an unlocked page Permitted Read contents of Lock Byte (if any page is locked) Not Permitted Permitted Permitted Flash Error Reset Permitted de d Read contents of Lock Byte (if no pages are locked) Flash Error Reset Flash Error Reset C2 Device Erase Only Flash Error Reset Flash Error Reset Lock additional pages (change '1's to '0's in the Lock Byte) Not Permitted Flash Error Reset Flash Error Reset Unlock individual pages (change '0's to '1's in the Lock Byte) Not Permitted Flash Error Reset Flash Error Reset Read, Write or Erase Reserved Area Not Permitted Flash Error Reset Flash Error Reset tR ec om m Erase page containing Lock Byte—Unlock all pages (if any page is locked) en Permitted Erase page containing Lock Byte (if no pages are locked) C2 Device Erase—Erases all Flash pages including the page containing the Lock Byte. no Flash Error Reset—Not permitted; Causes Flash Error Device Reset (FERROR bit in RSTSRC is '1' after reset). - All prohibited operations that are performed via the C2 interface are ignored (do not cause device reset). n - Locking any Flash page also locks the page containing the Lock Byte. io - Once written to, the Lock Byte cannot be modified except by performing a C2 Device Erase. IQ Ve rs - If user code writes to the Lock Byte, the Lock does not take effect until the next device reset. Rev. 1.2 128 C8051F55x/56x/57x 14.4. Flash Write and Erase Guidelines ig n s Any system which contains routines which write or erase Flash memory from software involves some risk that the write or erase routines will execute unintentionally if the CPU is operating outside its specified operating range of VDD, system clock frequency, or temperature. This accidental execution of Flash modifying code can result in alteration of Flash memory contents causing a system failure that is only recoverable by re-Flashing the code in the device. D es The following guidelines are recommended for any system which contains routines which write or erase Flash from code. 14.4.1. VDD Maintenance and the VDD monitor ew 1. If the system power supply is subject to voltage or current "spikes," add sufficient transient protection devices to the power supply to ensure that the supply voltages listed in the Absolute Maximum Ratings table are not exceeded. fo rN 2. Make certain that the minimum VREGIN rise time specification of 1 ms is met. If the system cannot meet this rise time specification, then add an external VDD brownout circuit to the RST pin of the device that holds the device in reset until VDD reaches the minimum threshold and re-asserts RST if VDD drops below the minimum threshold. en de d 3. Enable the on-chip VDD monitor in the high setting and enable the VDD monitor as a reset source as early in code as possible. This should be the first set of instructions executed after the Reset Vector. For C-based systems, this will involve modifying the startup code added by the C compiler. See your compiler documentation for more details. Make certain that there are no delays in software between enabling the VDD monitor in the high setting and enabling the VDD monitor as a reset source. Code examples showing this can be found in “AN201: Writing to Flash from Firmware", available from the Silicon Laboratories web site. om m 4. As an added precaution, explicitly enable the VDD monitor in the high setting and enable the VDD monitor as a reset source inside the functions that write and erase Flash memory. The VDD monitor enable instructions should be placed just after the instruction to set PSWE to a 1, but before the Flash write or erase operation instruction. IQ Ve rs io n no tR ec Note: The output of the internal voltage regulator is calibrated by the MCU immediately after any reset event. The output of the un-calibrated internal regulator could be below the high threshold setting of the VDD Monitor. If this is the case and the VDD Monitor is set to the high threshold setting and if the MCU receives a non-power on reset (POR), the MCU will remain in reset until a POR occurs (i.e., VDD Monitor will keep the device in reset). A POR will force the VDD Monitor to the low threshold setting which is guaranteed to be below the un-calibrated output of the internal regulator. The device will then exit reset and resume normal operation. It is for this reason Silicon Labs strongly recommends that the VDD Monitor is always left in the low threshold setting (i.e. default value upon POR). When programming the Flash in-system, the VDD Monitor must be set to the high threshold setting. For the highest system reliability, the time the VDD Monitor is set to the high threshold setting should be minimized (e.g., setting the VDD Monitor to the high threshold setting just before the Flash write operation and then changing it back to the low threshold setting immediately after the Flash write operation). 5. Make certain that all writes to the RSTSRC (Reset Sources) register use direct assignment operators and explicitly DO NOT use the bit-wise operators (such as AND or OR). For example, "RSTSRC = 0x02" is correct. "RSTSRC |= 0x02" is incorrect. 6. Make certain that all writes to the RSTSRC register explicitly set the PORSF bit to a 1. Areas to check are initialization code which enables other reset sources, such as the Missing Clock Detector or Comparator, for example, and instructions which force a Software Reset. A global search on "RSTSRC" can quickly verify this. 129 Rev. 1.2 C8051F55x/56x/57x 14.4.2. PSWE Maintenance D es ig n 2. Minimize the number of variable accesses while PSWE is set to a 1. Handle pointer address updates and loop variable maintenance outside the "PSWE = 1;... PSWE = 0;" area. Code examples showing this can be found in ”AN201: Writing to Flash from Firmware" available from the Silicon Laboratories web site. s 1. Reduce the number of places in code where the PSWE bit (b0 in PSCTL) is set to a 1. There should be exactly one routine in code that sets PSWE to a 1 to write Flash bytes and one routine in code that sets PSWE and PSEE both to a 1 to erase Flash pages. 3. Disable interrupts prior to setting PSWE to a 1 and leave them disabled until after PSWE has been reset to '0'. Any interrupts posted during the Flash write or erase operation will be serviced in priority order after the Flash operation has been completed and interrupts have been re-enabled by software. rN ew 4. Make certain that the Flash write and erase pointer variables are not located in XRAM. See your compiler documentation for instructions regarding how to explicitly locate variables in different memory areas. 5. Add address bounds checking to the routines that write or erase Flash memory to ensure that a routine called with an illegal address does not result in modification of the Flash. fo 14.4.3. System Clock de d 1. If operating from an external crystal, be advised that crystal performance is susceptible to electrical interference and is sensitive to layout and to changes in temperature. If the system is operating in an electrically noisy environment, use the internal oscillator or use an external CMOS clock. en 2. If operating from the external oscillator, switch to the internal oscillator during Flash write or erase operations. The external oscillator can continue to run, and the CPU can switch back to the external oscillator after the Flash operation has completed. IQ Ve rs io n no tR ec om m Additional Flash recommendations and example code can be found in “AN201: Writing to Flash from Firmware" available from the Silicon Laboratories web site. Rev. 1.2 130 C8051F55x/56x/57x 7 6 5 4 3 2 1 Name PSEE PSWE R/W R R R R R R R/W Reset 0 0 0 0 0 0 0 1 PSEE ew Unused 0 Function Read = 000000b, Write = don’t care. rN 7:2 D es Type SFR Address = 0x8F; SFR Page = 0x00 Bit Name 0 ig n Bit s SFR Definition 14.1. PSCTL: Program Store R/W Control Program Store Erase Enable. 0 PSWE en de d fo Setting this bit (in combination with PSWE) allows an entire page of Flash program memory to be erased. If this bit is logic 1 and Flash writes are enabled (PSWE is logic 1), a write to Flash memory using the MOVX instruction will erase the entire page that contains the location addressed by the MOVX instruction. The value of the data byte written does not matter. 0: Flash program memory erasure disabled. 1: Flash program memory erasure enabled. Program Store Write Enable. IQ Ve rs io n no tR ec om m Setting this bit allows writing a byte of data to the Flash program memory using the MOVX write instruction. The Flash location should be erased before writing data. 0: Writes to Flash program memory disabled. 1: Writes to Flash program memory enabled; the MOVX write instruction targets Flash memory. 131 Rev. 1.2 C8051F55x/56x/57x 5 4 3 Name FLKEY[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xB7; SFR Page = All Pages Bit Name 1 0 0 0 0 Function FLKEY[7:0] Flash Lock and Key Register. rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 14.2. FLKEY: Flash Lock and Key IQ Ve rs io n no tR ec om m en de d fo Write: This register provides a lock and key function for Flash erasures and writes. Flash writes and erases are enabled by writing 0xA5 followed by 0xF1 to the FLKEY register. Flash writes and erases are automatically disabled after the next write or erase is complete. If any writes to FLKEY are performed incorrectly, or if a Flash write or erase operation is attempted while these operations are disabled, the Flash will be permanently locked from writes or erasures until the next device reset. If an application never writes to Flash, it can intentionally lock the Flash by writing a non-0xA5 value to FLKEY from software. Read: When read, bits 1–0 indicate the current Flash lock state. 00: Flash is write/erase locked. 01: The first key code has been written (0xA5). 10: Flash is unlocked (writes/erases allowed). 11: Flash writes/erases disabled until the next reset. Rev. 1.2 132 C8051F55x/56x/57x 7 6 5 4 3 2 1 Name Reserved Reserved Reserved FLRT Reserved Reserved FLEWT Reserved Type R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 4 FLRT Must Write 000b. Flash Read Time Control. D es 0 ew Reserved Function rN 7:5 ig n Bit SFR Address = 0xB6; SFR Page = All Pages Bit Name 0 s SFR Definition 14.3. FLSCL: Flash Scale 1 FLEWT Must Write 00b. de Reserved Flash Erase Write Time Control. en 3:2 d fo This bit should be programmed to the smallest allowed value, according to the system clock speed. 0: SYSCLK < 25 MHz (Flash read strobe is one system clock). 1: SYSCLK > 25 MHz (Flash read strobe is two system clocks). Must Write 0b. om Reserved IQ Ve rs io n no tR ec 0 m This bit should be set to 1b before Writing or Erasing Flash. 0: Short Flash Erase / Write Timing. 1: Extended Flash Erase / Write Timing. 133 Rev. 1.2 C8051F55x/56x/57x s SFR Definition 14.4. CCH0CN: Cache Control 7 6 5 4 3 2 1 Name Reserved Reserved CHPFEN Reserved Reserved Reserved Reserved CHBLKW Type R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 1 0 0 0 0 D es 0 ew SFR Address = 0xE3; SFR Page = 0x0F Bit Name 0 ig n Bit Function Reserved Must Write 00b 5 CHPFEN Cache Prefect Enable Bit. 0: Prefetch engine is disabled. 1: Prefetch engine is enabled. 4:1 Reserved Must Write 0000b. 0 CHBLKW Block Write Enable Bit. This bit allows block writes to Flash memory from firmware. 0: Each byte of a software Flash write is written individually. 1: Flash bytes are written in groups of two. m en de d fo rN 7:6 7 6 R Reset 0 4 3 n io 0 R R R/W R/W R/W R/W 0 0 0 1 1 1 1 Function Read = 0000b. Write = don’t care. PERIOD[3:0] Oneshot Period Control Bits. These bits limit the internal Flash read strobe width as follows. When the Flash read strobe is de-asserted, the Flash memory enters a low-power state for the remainder of the system clock cycle. IQ Ve rs 3:0 Unused 1 PERIOD[3:0] SFR Address = 0xBE; SFR Page = 0x0F Bit Name 7:4 2 R no Type tR Name 5 ec Bit om SFR Definition 14.5. ONESHOT: Flash Oneshot Period FLASH RDMAX = 5ns + ( PERIOD × 5ns ) Rev. 1.2 134 C8051F55x/56x/57x 15. Power Management Modes ig n s The C8051F55x/56x/57x devices have three software programmable power management modes: Idle, Stop, and Suspend. Idle mode and Stop mode are part of the standard 8051 architecture, while Suspend mode is an enhanced power-saving mode implemented by the high-speed oscillator peripheral. rN ew D es Idle mode halts the CPU while leaving the peripherals and clocks active. In Stop mode, the CPU is halted, all interrupts and timers (except the Missing Clock Detector) are inactive, and the internal oscillator is stopped (analog peripherals remain in their selected states; the external oscillator is not affected). Suspend mode is similar to Stop mode in that the internal oscillator and CPU are halted, but the device can wake on events such as a Port Match or Comparator low output. Since clocks are running in Idle mode, power consumption is dependent upon the system clock frequency and the number of peripherals left in active mode before entering Idle. Stop mode and Suspend mode consume the least power because the majority of the device is shut down with no clocks active. SFR Definition 15.1 describes the Power Control Register (PCON) used to control the C8051F55x/56x/57x devices’ Stop and Idle power management modes. Suspend mode is controlled by the SUSPEND bit in the OSCICN register (SFR Definition 18.2). de d fo Although the C8051F55x/56x/57x has Idle, Stop, and Suspend modes available, more control over the device power can be achieved by enabling/disabling individual peripherals as needed. Each analog peripheral can be disabled when not in use and placed in low power mode. Digital peripherals, such as timers or serial buses, draw little power when they are not in use. Turning off oscillators lowers power consumption considerably, at the expense of reduced functionality. 15.1. Idle Mode m en Setting the Idle Mode Select bit (PCON.0) causes the hardware to halt the CPU and enter Idle mode as soon as the instruction that sets the bit completes execution. All internal registers and memory maintain their original data. All analog and digital peripherals can remain active during Idle mode. tR ec om Idle mode is terminated when an enabled interrupt is asserted or a reset occurs. The assertion of an enabled interrupt will cause the Idle Mode Selection bit (PCON.0) to be cleared and the CPU to resume operation. The pending interrupt will be serviced and the next instruction to be executed after the return from interrupt (RETI) will be the instruction immediately following the one that set the Idle Mode Select bit. If Idle mode is terminated by an internal or external reset, the CIP-51 performs a normal reset sequence and begins program execution at address 0x0000. no Note: If the instruction following the write of the IDLE bit is a single-byte instruction and an interrupt occurs during the execution phase of the instruction that sets the IDLE bit, the CPU may not wake from Idle mode when a future interrupt occurs. Therefore, instructions that set the IDLE bit should be followed by an instruction that has two or more opcode bytes, for example: // set IDLE bit // ... followed by a 3-cycle dummy instruction ; in assembly: ORL PCON, #01h MOV PCON, PCON ; set IDLE bit ; ... followed by a 3-cycle dummy instruction IQ Ve rs io n // in ‘C’: PCON |= 0x01; PCON = PCON; If enabled, the Watchdog Timer (WDT) will eventually cause an internal watchdog reset and thereby terminate the Idle mode. This feature protects the system from an unintended permanent shutdown in the event of an inadvertent write to the PCON register. If this behavior is not desired, the WDT may be disabled by software prior to entering the Idle mode if the WDT was initially configured to allow this operation. This provides the opportunity for additional power savings, allowing the system to remain in the Idle mode indefinitely, waiting for an external stimulus to wake up the system. Refer to Section “16.6. PCA Watchdog Timer Reset” on page 142 for more information on the use and configuration of the WDT. Rev. 1.2 135 C8051F55x/56x/57x 15.2. Stop Mode D es ig n s Setting the Stop Mode Select bit (PCON.1) causes the controller core to enter Stop mode as soon as the instruction that sets the bit completes execution. In Stop mode the internal oscillator, CPU, and all digital peripherals are stopped; the state of the external oscillator circuit is not affected. Each analog peripheral (including the external oscillator circuit) may be shut down individually prior to entering Stop Mode. Stop mode can only be terminated by an internal or external reset. On reset, the device performs the normal reset sequence and begins program execution at address 0x0000. If enabled, the Missing Clock Detector will cause an internal reset and thereby terminate the Stop mode. The Missing Clock Detector should be disabled if the CPU is to be put to in STOP mode for longer than the MCD timeout of 100 µs. ew 15.3. Suspend Mode rN Setting the SUSPEND bit (OSCICN.5) causes the hardware to halt the CPU and the high-frequency internal oscillator, and go into Suspend mode as soon as the instruction that sets the bit completes execution. All internal registers and memory maintain their original data. Most digital peripherals are not active in Suspend mode. The exception to this is the Port Match feature. en de d fo Suspend mode can be terminated by three types of events, a port match (described in Section “19.5. Port Match” on page 179), a Comparator low output (if enabled), or a device reset event. When Suspend mode is terminated, the device will continue execution on the instruction following the one that set the SUSPEND bit. If the wake event was configured to generate an interrupt, the interrupt will be serviced upon waking the device. If Suspend mode is terminated by an internal or external reset, the CIP-51 performs a normal reset sequence and begins program execution at address 0x0000. IQ Ve rs io n no tR ec om m Note: Before entering suspend mode, firmware must set the ZTCEN bit in REF0CN (SFR Definition 7.1). 136 Rev. 1.2 C8051F55x/56x/57x 7 6 5 4 3 2 1 GF[5:0] STOP Type R/W R/W 0 0 0 0 SFR Address = 0x87; SFR Page = All Pages Bit Name GF[5:0] 0 0 0 Function General Purpose Flags 5–0. rN 7:2 R/W ew 0 Reset IDLE D es Name 0 ig n Bit s SFR Definition 15.1. PCON: Power Control These are general purpose flags for use under software control. STOP Stop Mode Select. Setting this bit will place the CIP-51 in Stop mode. This bit will always be read as 0. 1: CPU goes into Stop mode (internal oscillator stopped). 0 IDLE IDLE: Idle Mode Select. Setting this bit will place the CIP-51 in Idle mode. This bit will always be read as 0. 1: CPU goes into Idle mode. (Shuts off clock to CPU, but clock to Timers, Interrupts, Serial Ports, and Analog Peripherals are still active.) IQ Ve rs io n no tR ec om m en de d fo 1 Rev. 1.2 137 C8051F55x/56x/57x 16. Reset Sources s Reset circuitry allows the controller to be easily placed in a predefined default condition. On entry to this reset state, the following occur:  ew D es ig n CIP-51 halts program execution  Special Function Registers (SFRs) are initialized to their defined reset values  External Port pins are forced to a known state  Interrupts and timers are disabled. All SFRs are reset to the predefined values noted in the SFR detailed descriptions. The contents of internal data memory are unaffected during a reset; any previously stored data is preserved. However, since the stack pointer SFR is reset, the stack is effectively lost, even though the data on the stack is not altered. rN The Port I/O latches are reset to 0xFF (all logic ones) in open-drain mode. Weak pullups are enabled during and after the reset. For VDD Monitor and power-on resets, the RST pin is driven low until the device exits the reset state. m en de d fo Note: When VIO rises faster than VDD, which can happen when VREGIN and VIO are tied together, a delay created between GPIO power (VIO) and the logic controlling GPIO (VDD) results in a temporary unknown state at the GPIO pins. When VIO rises faster than VDD, the GPIO may enter the following states: floating, glitch low, or glitch high. Cross coupling VIO and VDD with a 4.7 µF capacitor mitigates the root cause of the problem by allowing VIO and VDD to rise at the same rate. On exit from the reset state, the program counter (PC) is reset, and the system clock defaults to the internal oscillator. The Watchdog Timer is enabled with the system clock divided by 12 as its clock source. Program execution begins at location 0x0000. ec om VDD Comparator 0 Px.x Px.x (wired-OR) /RST no PCA WDT (Software Reset) SWRSF io n EN Reset Funnel Errant FLASH Operation MCD Enable System Clock WDT Enable EN rs Ve '0' Enable C0RSEF Missing Clock Detector (oneshot) IQ + - tR + - Power On Reset Supply Monitor CIP-51 Microcontroller Core System Reset Extended Interrupt Handler Figure 16.1. Reset Sources Rev. 1.2 138 C8051F55x/56x/57x 16.1. Power-On Reset ig n s During power-up, the device is held in a reset state and the RST pin is driven low until VDD settles above VRST. A delay occurs before the device is released from reset; the delay decreases as the VDD ramp time increases (VDD ramp time is defined as how fast VDD ramps from 0 V to VRST). Figure 16.2. plots the power-on and VDD monitor reset timing. ew D es On exit from a power-on reset, the PORSF flag (RSTSRC.1) is set by hardware to logic 1. When PORSF is set, all of the other reset flags in the RSTSRC Register are indeterminate (PORSF is cleared by all other resets). Since all resets cause program execution to begin at the same location (0x0000) software can read the PORSF flag to determine if a power-up was the cause of reset. The content of internal data memory should be assumed to be undefined after a power-on reset. The VDD monitor is enabled following a power-on reset. 2.45 2.25 D om VD m VRST 2.0 VDD en volts de d fo rN Note: For devices with a date code before year 2011, work week 24 (1124), if the /RST pin is held low for more than 1 second while power is applied to the device, and then /RST is released, a percentage of devices may lock up and fail to execute code. Toggling the /RST pin does not clear the condition. The condition is cleared by cycling power. Most devices that are affected will show the lock up behavior only within a narrow range of temperatures (a 5 to 10 °C window). Parts with a date code of year 2011, work week 24 (1124) or later do not have any restrictions on /RST low time. The date code of a device is a four-digit number on the bottom-most line of each device with the format YYWW, where YY is the two-digit calendar year and WW is the two digit work week. tR ec 1.0 /RST no Logic HIGH t TPORDelay VDD Monitor Reset Power-On Reset Figure 16.2. Power-On and VDD Monitor Reset Timing IQ Ve rs io n Logic LOW 139 Rev. 1.2 C8051F55x/56x/57x 16.2. Power-Fail Reset/VDD Monitor rN ew D es ig n s When a power-down transition or power irregularity causes VDD to drop below VRST, the power supply monitor will drive the RST pin low and hold the CIP-51 in a reset state (see Figure 16.2). When VDD returns to a level above VRST, the CIP-51 will be released from the reset state. Note that even though internal data memory contents are not altered by the power-fail reset, it is impossible to determine if VDD dropped below the level required for data retention. If the PORSF flag reads 1, the data may no longer be valid. The VDD monitor is enabled after power-on resets. Its defined state (enabled/disabled) is not altered by any other reset source. For example, if the VDD monitor is disabled by code and a software reset is performed, the VDD monitor will still be disabled after the reset. To protect the integrity of Flash contents, the VDD monitor must be enabled to the higher setting (VDMLVL = 1) and selected as a reset source if software contains routines which erase or write Flash memory. If the VDD monitor is not enabled and set to the high level, any erase or write performed on Flash memory will cause a Flash Error device reset. de d fo Important Note: If the VDD monitor is being turned on from a disabled state, it should be enabled before it is selected as a reset source. Selecting the VDD monitor as a reset source before it is enabled and stabilized may cause a system reset. In some applications, this reset may be undesirable. If this is not desirable in the application, a delay should be introduced between enabling the monitor and selecting it as a reset source. The procedure for enabling the VDD monitor and configuring it as a reset source from a disabled state is as follows: en 1. Enable the VDD monitor (VDMEN bit in VDM0CN = 1). m 2. If necessary, wait for the VDD monitor to stabilize (see Table 5.4 for the VDD Monitor turn-on time). Note: This delay should be omitted if software contains routines that erase or write Flash memory. om 3. Select the VDD monitor as a reset source (PORSF bit in RSTSRC = 1). ec See Figure 16.2 for VDD monitor timing; note that the power-on-reset delay is not incurred after a VDD monitor reset. See Table 5.4 for complete electrical characteristics of the VDD monitor. IQ Ve rs io n no tR Note: The output of the internal voltage regulator is calibrated by the MCU immediately after any reset event. The output of the un-calibrated internal regulator could be below the high threshold setting of the VDD Monitor. If this is the case and the VDD Monitor is set to the high threshold setting and if the MCU receives a non-power on reset (POR), the MCU will remain in reset until a POR occurs (i.e., VDD Monitor will keep the device in reset). A POR will force the VDD Monitor to the low threshold setting which is guaranteed to be below the un-calibrated output of the internal regulator. The device will then exit reset and resume normal operation. It is for this reason Silicon Labs strongly recommends that the VDD Monitor is always left in the low threshold setting (i.e. default value upon POR). When programming the Flash in-system, the VDD Monitor must be set to the high threshold setting. For the highest system reliability, the time the VDD Monitor is set to the high threshold setting should be minimized (e.g., setting the VDD Monitor to the high threshold setting just before the Flash write operation and then changing it back to the low threshold setting immediately after the Flash write operation). Note: The VDD Monitor may trigger on fast changes in voltage on the VDD pin, regardless of whether the voltage increased or decreased. Rev. 1.2 140 C8051F55x/56x/57x 5 4 3 2 1 Name VDMEN VDDSTAT VDMLVL Type R/W R R/W R R R R Reset Varies Varies 0 0 0 0 0 SFR Address = 0xFF; SFR Page = 0x00 Bit Name VDMEN R 0 Function VDD Monitor Enable. rN 7 0 ig n 6 D es 7 ew Bit s SFR Definition 16.1. VDM0CN: VDD Monitor Control 6 VDDSTAT en de d fo This bit turns the VDD monitor circuit on/off. The VDD Monitor cannot generate system resets until it is also selected as a reset source in register RSTSRC (SFR Definition 16.2). Selecting the VDD monitor as a reset source before it has stabilized may generate a system reset. In systems where this reset would be undesirable, a delay should be introduced between enabling the VDD Monitor and selecting it as a reset source. See Table 5.4 for the minimum VDD Monitor turn-on time. 0: VDD Monitor Disabled. 1: VDD Monitor Enabled. VDD Status. 5 VDMLVL om m This bit indicates the current power supply status (VDD Monitor output). 0: VDD is at or below the VDD monitor threshold. 1: VDD is above the VDD monitor threshold. VDD Monitor Level Select. Unused Read = 00000b; Write = Don’t care. no 4:0 tR ec 0: VDD Monitor Threshold is set to VRST-LOW 1: VDD Monitor Threshold is set to VRST-HIGH. This setting is required for any system includes code that writes to and/or erases Flash. 16.3. External Reset rs io n The external RST pin provides a means for external circuitry to force the device into a reset state. Asserting an active-low signal on the RST pin generates a reset; an external pullup and/or decoupling of the RST pin may be necessary to avoid erroneous noise-induced resets. See Table 5.4 for complete RST pin specifications. The PINRSF flag (RSTSRC.0) is set on exit from an external reset. IQ Ve 16.4. Missing Clock Detector Reset The Missing Clock Detector (MCD) is a one-shot circuit that is triggered by the system clock. If the system clock remains high or low for more than the value specified in Table 5.4, “Reset Electrical Characteristics,” on page 41, the one-shot will time out and generate a reset. After a MCD reset, the MCDRSF flag (RSTSRC.2) will read 1, signifying the MCD as the reset source; otherwise, this bit reads 0. Writing a 1 to the MCDRSF bit enables the Missing Clock Detector; writing a 0 disables it. The state of the RST pin is unaffected by this reset. 141 Rev. 1.2 C8051F55x/56x/57x 16.5. Comparator0 Reset D es ig n s Comparator0 can be configured as a reset source by writing a 1 to the C0RSEF flag (RSTSRC.5). Comparator0 should be enabled and allowed to settle prior to writing to C0RSEF to prevent any turn-on chatter on the output from generating an unwanted reset. The Comparator0 reset is active-low: if the non-inverting input voltage (on CP0+) is less than the inverting input voltage (on CP0–), the device is put into the reset state. After a Comparator0 reset, the C0RSEF flag (RSTSRC.5) will read 1 signifying Comparator0 as the reset source; otherwise, this bit reads 0. The state of the RST pin is unaffected by this reset. 16.6. PCA Watchdog Timer Reset rN ew The programmable Watchdog Timer (WDT) function of the Programmable Counter Array (PCA) can be used to prevent software from running out of control during a system malfunction. The PCA WDT function can be enabled or disabled by software as described in Section “26.4. Watchdog Timer Mode” on page 291; the WDT is enabled and clocked by SYSCLK/12 following any reset. If a system malfunction prevents user software from updating the WDT, a reset is generated and the WDTRSF bit (RSTSRC.5) is set to 1. The state of the RST pin is unaffected by this reset. 16.7. Flash Error Reset fo If a Flash read/write/erase or program read targets an illegal address, a system reset is generated. This may occur due to any of the following:  tR ec om m en de d A Flash write or erase is attempted above user code space. This occurs when PSWE is set to 1 and a MOVX write operation targets an address in or above the reserved space.  A Flash read is attempted above user code space. This occurs when a MOVC operation targets an address in or above the reserved space.  A Program read is attempted above user code space. This occurs when user code attempts to branch to an address in or above the reserved space.  A Flash read, write or erase attempt is restricted due to a Flash security setting (see Section “14.3. Security Options” on page 127).  A Flash read, write, or erase is attempted when the VDD Monitor is not enabled to the high threshold and set as a reset source. The FERROR bit (RSTSRC.6) is set following a Flash error reset. The state of the RST pin is unaffected by this reset. 16.8. Software Reset IQ Ve rs io n no Software may force a reset by writing a 1 to the SWRSF bit (RSTSRC.4). The SWRSF bit will read 1 following a software forced reset. The state of the RST pin is unaffected by this reset. Rev. 1.2 142 C8051F55x/56x/57x 7 Name 6 5 4 3 2 1 FERROR C0RSEF SWRSF WDTRSF MCDRSF PORSF PINRSF R R R R/W R/W R R/W R/W Reset 0 Varies Varies Varies Varies Varies Varies ew Unused Write Read Don’t care. Unused. Varies 0 rN 7 D es Type SFR Address = 0xEF; SFR Page = 0x00 Bit Name Description FERROR Flash Error Reset Flag. N/A 5 C0RSEF Comparator0 Reset Enable and Flag. Writing a 1 enables Com- Set to 1 if Comparator0 parator0 as a reset source caused the last reset. (active-low). 4 SWRSF Writing a 1 forces a system reset. WDTRSF Watchdog Timer Reset Flag. N/A 2 MCDRSF Missing Clock Detector Enable and Flag. tR ec om m 3 Power-On/VDD Monitor Writing a 1 enables the Reset Flag, and VDD monitor VDD monitor as a reset source. Reset Enable. Writing 1 to this bit before the VDD monitor is enabled and stabilized may cause a system reset. n io rs Ve 0 PINRSF HW Pin Reset Flag. N/A Note: Do not use read-modify-write operations on this register 143 Set to 1 if last reset was caused by a write to SWRSF. Set to 1 if Watchdog Timer overflow caused the last reset. Set to 1 if Missing Clock Writing a 1 enables the Detector timeout caused Missing Clock Detector. The MCD triggers a reset the last reset. if a missing clock condition is detected. no PORSF Set to 1 if Flash read/write/erase error caused the last reset. d de en Software Reset Force and Flag. fo 6 1 IQ 0 ig n Bit s SFR Definition 16.2. RSTSRC: Reset Source Rev. 1.2 Set to 1 anytime a poweron or VDD monitor reset occurs. When set to 1 all other RSTSRC flags are indeterminate. Set to 1 if RST pin caused the last reset. C8051F55x/56x/57x 17. External Data Memory Interface and On-Chip XRAM D es ig n s For C8051F55x/56x/57x devices, 2 kB of RAM are included on-chip and mapped into the external data memory space (XRAM). Additionally, an External Memory Interface (EMIF) is available on the C8051F5689 and ‘F570-5 devices, which can be used to access off-chip data memories and memory-mapped devices connected to the GPIO ports. The external memory space may be accessed using the external move instruction (MOVX) and the data pointer (DPTR), or using the MOVX indirect addressing mode using R0 or R1. If the MOVX instruction is used with an 8-bit address operand (such as @R1), then the high byte of the 16-bit address is provided by the External Memory Interface Control Register (EMI0CN, shown in SFR Definition 17.1). ew Note: The MOVX instruction can also be used for writing to the Flash memory. See Section “14. Flash Memory” on page 124 for details. The MOVX instruction accesses XRAM by default. 17.1. Accessing XRAM fo rN The XRAM memory space is accessed using the MOVX instruction. The MOVX instruction has two forms, both of which use an indirect addressing method. The first method uses the Data Pointer, DPTR, a 16-bit register which contains the effective address of the XRAM location to be read from or written to. The second method uses R0 or R1 in combination with the EMI0CN register to generate the effective XRAM address. Examples of both of these methods are given below. d 17.1.1. 16-Bit MOVX Example DPTR, #1234h A, @DPTR ; load DPTR with 16-bit address to read (0x1234) ; load contents of 0x1234 into accumulator A m MOV MOVX en de The 16-bit form of the MOVX instruction accesses the memory location pointed to by the contents of the DPTR register. The following series of instructions reads the value of the byte at address 0x1234 into the accumulator A: ec om The above example uses the 16-bit immediate MOV instruction to set the contents of DPTR. Alternately, the DPTR can be accessed through the SFR registers DPH, which contains the upper 8-bits of DPTR, and DPL, which contains the lower 8-bits of DPTR. 17.1.2. 8-Bit MOVX Example EMI0CN, #12h R0, #34h a, @R0 ; load high byte of address into EMI0CN ; load low byte of address into R0 (or R1) ; load contents of 0x1234 into accumulator A IQ Ve rs io n MOV MOV MOVX no tR The 8-bit form of the MOVX instruction uses the contents of the EMI0CN SFR to determine the upper 8-bits of the effective address to be accessed and the contents of R0 or R1 to determine the lower 8-bits of the effective address to be accessed. The following series of instructions read the contents of the byte at address 0x1234 into the accumulator A. Rev. 1.2 144 C8051F55x/56x/57x 17.2. Configuring the External Memory Interface Configuring the External Memory Interface consists of four steps: ig n s 1. Configure the Output Modes of the associated port pins as either push-pull or open-drain (push-pull is most common), and skip the associated pins in the crossbar. 2. Configure Port latches to “park” the EMIF pins in a dormant state (usually by setting them to logic 1). D es 3. Select the memory mode (on-chip only, split mode without bank select, split mode with bank select, or off-chip only). 4. Set up timing to interface with off-chip memory or peripherals. ew Each of these four steps is explained in detail in the following sections. The Port selection and Mode bits are located in the EMI0CF register shown in SFR Definition . 17.3. Port Configuration d fo rN The External Memory Interface appears on Ports 1, 2 and 3 when it is used for off-chip memory access. These ports are multiplexed so that low-order address lines are shared with the data lines. When the EMIF is used, the Crossbar should be configured to skip over the /RD control line (P1.6) and the /WR control line (P1.7) using the P1SKIP register and also skip over the ALE control line (P1.5). For more information about configuring the Crossbar, see Section “19.6. Special Function Registers for Accessing and Configuring Port I/O” on page 183. The EMIF pinout is shown inTable 17.1 on page 146. m en de The External Memory Interface claims the associated Port pins for memory operations ONLY during the execution of an off-chip MOVX instruction. Once the MOVX instruction has completed, control of the Port pins reverts to the Port latches or to the Crossbar settings for those pins. See Section “19. Port Input/Output” on page 169 for more information about the Crossbar and Port operation and configuration. The Port latches should be explicitly configured to “park” the External Memory Interface pins in a dormant state, most commonly by setting them to a logic 1. IQ Ve rs io n no tR ec om During the execution of the MOVX instruction, the External Memory Interface will explicitly disable the drivers on all Port pins that are acting as Inputs (Data[7:0] during a READ operation, for example). The Output mode of the Port pins (whether the pin is configured as Open-Drain or Push-Pull) is unaffected by the External Memory Interface operation, and remains controlled by the PnMDOUT registers. In most cases, the output modes of all EMIF pins should be configured for push-pull mode. 145 Rev. 1.2 C8051F55x/56x/57x Table 17.1. EMIF Pinout (C8051F568-9 and ‘F570-5) P1.7 ALE P1.5 D0/A0 P3.0 D1/A1 P3.1 D2/A2 P3.2 D3/A3 P3.3 D4/A4 P3.4 D5/A5 P3.5 D6/A6 P3.6 d P3.7 de D7/A7 P2.1 P2.3 A12 P2.4 A13 P2.5 A14 P2.6 A15 P2.7 IQ Ve rs io n no tR A11 om P2.2 ec m A10 P2.0 en A8 A9 ig n WR D es P1.6 ew RD rN Port Pin fo Signal Name s Multiplexed Mode Rev. 1.2 146 C8051F55x/56x/57x 5 4 3 Name PGSEL[7:0] Type R/W 0 Reset 0 0 0 2 0 SFR Address = 0xAA; SFR Page = 0x00 Bit Name 1 0 Function 0 ig n 6 D es 7 0 ew Bit s SFR Definition 17.1. EMI0CN: External Memory Interface Control 0 IQ Ve rs io n no tR ec om m en de d fo rN 7:0 PGSEL[7:0] XRAM Page Select Bits. The XRAM Page Select Bits provide the high byte of the 16-bit external data memory address when using an 8-bit MOVX command, effectively selecting a 256-byte page of RAM. 0x00: 0x0000 to 0x00FF 0x01: 0x0100 to 0x01FF ... 0xFE: 0xFE00 to 0xFEFF 0xFF: 0xFF00 to 0xFFFF 147 Rev. 1.2 C8051F55x/56x/57x 7 6 5 4 3 Reserved Name 2 1 EMD[1:0] EALE[1:0] 0 0 0 0 SFR Address = 0xB2; SFR Page = 0x0F Bit Name 0 Function 1 1 ew 0 Reset D es R/W Type 0 ig n Bit s SFR Definition 17.2. EMI0CF: External Memory Configuration Unused Read = 000b; Write = Don’t Care. 4 Reserved Read = 0b; Must Write 0b. 3:2 EMD[1:0] EMIF Operating Mode Select Bits. 00: Internal Only: MOVX accesses on-chip XRAM only. All effective addresses alias to on-chip memory space 01: Split Mode without Bank Select: Accesses below the 2 kB boundary are directed on-chip. Accesses above the 2 kB boundary are directed off-chip. 8-bit off-chip MOVX operations use current contents of the Address high port latches to resolve the upper address byte. To access off chip space, EMI0CN must be set to a page that is not contained in the on-chip address space. 10: Split Mode with Bank Select: Accesses below the 2 kB boundary are directed onchip. Accesses above the 2 kB boundary are directed off-chip. 8-bit off-chip MOVX operations uses the contents of EMI0CN to determine the high-byte of the address. 11: External Only: MOVX accesses off-chip XRAM only. On-chip XRAM is not visible to the CPU. 1:0 EALE[1:0] ALE Pulse-Width Select Bits. These bits only have an effect when EMD2 = 0. 00: ALE high and ALE low pulse width = 1 SYSCLK cycle. 01: ALE high and ALE low pulse width = 2 SYSCLK cycles. 10: ALE high and ALE low pulse width = 3 SYSCLK cycles. 11: ALE high and ALE low pulse width = 4 SYSCLK cycles. IQ Ve rs io n no tR ec om m en de d fo rN 7:5 Rev. 1.2 148 C8051F55x/56x/57x 17.4. Multiplexed Mode ig n s The External Memory Interface operates only in a Multiplexed mode. In Multiplexed mode, the Data Bus and the lower 8-bits of the Address Bus share the same Port pins: AD[7:0]. In this mode, an external latch (74HC373 or equivalent logic gate) is used to hold the lower 8-bits of the RAM address. The external latch is controlled by the ALE (Address Latch Enable) signal, which is driven by the External Memory Interface logic. An example of a Multiplexed Configuration is shown in Figure 17.1. ADDRESS BUS A[15:8] d A[15:8] fo rN See Section “17.6.1. Multiplexed Mode” on page 153 for more information. ew D es In Multiplexed mode, the external MOVX operation can be broken into two phases delineated by the state of the ALE signal. During the first phase, ALE is high and the lower 8-bits of the Address Bus are presented to AD[7:0]. During this phase, the address latch is configured such that the Q outputs reflect the states of the ‘D’ inputs. When ALE falls, signaling the beginning of the second phase, the address latch outputs remain fixed and are no longer dependent on the latch inputs. Later in the second phase, the Data Bus controls the state of the AD[7:0] port at the time RD or WR is asserted. de 74HC373 ALE ADDRESS/DATA BUS D tR I/O[7:0] CE WE OE no n 64 K X 8 SRAM 8 Figure 17.1. Multiplexed Configuration Example IQ Ve rs io A[7:0] (Optional) /WR /RD 149 Q VDD ec om m AD[7:0] en E M I F G Rev. 1.2 C8051F55x/56x/57x 17.5. Memory Mode Selection EMI0CF[3:2] = 01 EMI0CF[3:2] = 10 0xFFFF EMI0CF[3:2] = 11 0xFFFF 0xFFFF 0xFFFF D es EMI0CF[3:2] = 00 On-Chip XRAM Off-Chip Memory (No Bank Select) Off-Chip Memory (Bank Select) ew On-Chip XRAM ig n s The external data memory space can be configured in one of four modes, shown in Figure 17.2, based on the EMIF Mode bits in the EMI0CF register (SFR Definition 17.2). These modes are summarized below. More information about the different modes can be found in Section “17.6. Timing” on page 151. On-Chip XRAM rN Off-Chip Memory fo On-Chip XRAM On-Chip XRAM On-Chip XRAM d On-Chip XRAM 0x0000 de On-Chip XRAM 0x0000 0x0000 0x0000 en Figure 17.2. EMIF Operating Modes m 17.5.1. Internal XRAM Only om When bits EMI0CF[3:2] are set to 00, all MOVX instructions will target the internal XRAM space on the device. Memory accesses to addresses beyond the populated space will wrap on 2 kB boundaries. As an example, the addresses 0x800 and 0x1000 both evaluate to address 0x0000 in on-chip XRAM space.  tR ec 8-bit MOVX operations use the contents of EMI0CN to determine the high-byte of the effective address and R0 or R1 to determine the low-byte of the effective address.  16-bit MOVX operations use the contents of the 16-bit DPTR to determine the effective address. 17.5.2. Split Mode without Bank Select no When bit EMI0CF.[3:2] are set to 01, the XRAM memory map is split into two areas, on-chip space and offchip space.  IQ Ve rs io n Effective addresses below the internal XRAM size boundary will access on-chip XRAM space.  Effective addresses above the internal XRAM size boundary will access off-chip space.  8-bit MOVX operations use the contents of EMI0CN to determine whether the memory access is onchip or off-chip. However, in the “No Bank Select” mode, an 8-bit MOVX operation will not drive the upper 8-bits A[15:8] of the Address Bus during an off-chip access. This allows the user to manipulate the upper address bits at will by setting the Port state directly via the port latches. This behavior is in contrast with “Split Mode with Bank Select” described below. The lower 8-bits of the Address Bus A[7:0] are driven, determined by R0 or R1.  16-bit MOVX operations use the contents of DPTR to determine whether the memory access is on-chip or off-chip, and unlike 8-bit MOVX operations, the full 16-bits of the Address Bus A[15:0] are driven during the off-chip transaction. Rev. 1.2 150 C8051F55x/56x/57x 17.5.3. Split Mode with Bank Select When EMI0CF[3:2] are set to 10, the XRAM memory map is split into two areas, on-chip space and offchip space.  s Effective addresses below the internal XRAM size boundary will access on-chip XRAM space. Effective addresses above the internal XRAM size boundary will access off-chip space.  8-bit MOVX operations use the contents of EMI0CN to determine whether the memory access is onchip or off-chip. The upper 8-bits of the Address Bus A[15:8] are determined by EMI0CN, and the lower 8-bits of the Address Bus A[7:0] are determined by R0 or R1. All 16-bits of the Address Bus A[15:0] are driven in “Bank Select” mode.  16-bit MOVX operations use the contents of DPTR to determine whether the memory access is on-chip or off-chip, and the full 16-bits of the Address Bus A[15:0] are driven during the off-chip transaction. ew D es ig n  17.5.4. External Only rN When EMI0CF[3:2] are set to 11, all MOVX operations are directed to off-chip space. On-chip XRAM is not visible to the CPU. This mode is useful for accessing off-chip memory located between 0x0000 and the internal XRAM size boundary.  en de d fo 8-bit MOVX operations ignore the contents of EMI0CN. The upper Address bits A[15:8] are not driven (identical behavior to an off-chip access in “Split Mode without Bank Select” described above). This allows the user to manipulate the upper address bits at will by setting the Port state directly. The lower 8-bits of the effective address A[7:0] are determined by the contents of R0 or R1.  16-bit MOVX operations use the contents of DPTR to determine the effective address A[15:0]. The full 16-bits of the Address Bus A[15:0] are driven during the off-chip transaction. 17.6. Timing om m The timing parameters of the External Memory Interface can be configured to enable connection to devices having different setup and hold time requirements. The Address Setup time, Address Hold time, RD and WR strobe widths, and in multiplexed mode, the width of the ALE pulse are all programmable in units of SYSCLK periods through EMI0TC, shown in SFR Definition 17.3, and EMI0CF[1:0]. IQ Ve rs io n no tR ec The timing for an off-chip MOVX instruction can be calculated by adding 4 SYSCLK cycles to the timing parameters defined by the EMI0TC register. Assuming non-multiplexed operation, the minimum execution time for an off-chip XRAM operation is 5 SYSCLK cycles (1 SYSCLK for RD or WR pulse + 4 SYSCLKs). For multiplexed operations, the Address Latch Enable signal will require a minimum of 2 additional SYSCLK cycles. Therefore, the minimum execution time for an off-chip XRAM operation in multiplexed mode is 7 SYSCLK cycles (2 for /ALE + 1 for RD or WR + 4). The programmable setup and hold times default to the maximum delay settings after a reset. Table 17.2 lists the ac parameters for the External Memory Interface, and Figure 17.3 through Figure 17.5 show the timing diagrams for the different External Memory Interface modes and MOVX operations. 151 Rev. 1.2 C8051F55x/56x/57x 7 6 5 4 3 2 1 0 ig n Bit EAS[1:0] EWR[3:0] EAH[1:0] Type R/W R/W R/W 1 1 1 1 1 D es Name Reset 1 1 SFR Address = 0xAA; SFR Page = 0x0F Name Function 7:6 EAS[1:0] EMIF Address Setup Time Bits. 00: Address setup time = 0 SYSCLK cycles. 01: Address setup time = 1 SYSCLK cycle. 10: Address setup time = 2 SYSCLK cycles. 11: Address setup time = 3 SYSCLK cycles. 5:2 EWR[3:0] EMIF WR and RD Pulse-Width Control Bits. 0000: WR and RD pulse width = 1 SYSCLK cycle. 0001: WR and RD pulse width = 2 SYSCLK cycles. 0010: WR and RD pulse width = 3 SYSCLK cycles. 0011: WR and RD pulse width = 4 SYSCLK cycles. 0100: WR and RD pulse width = 5 SYSCLK cycles. 0101: WR and RD pulse width = 6 SYSCLK cycles. 0110: WR and RD pulse width = 7 SYSCLK cycles. 0111: WR and RD pulse width = 8 SYSCLK cycles. 1000: WR and RD pulse width = 9 SYSCLK cycles. 1001: WR and RD pulse width = 10 SYSCLK cycles. 1010: WR and RD pulse width = 11 SYSCLK cycles. 1011: WR and RD pulse width = 12 SYSCLK cycles. 1100: WR and RD pulse width = 13 SYSCLK cycles. 1101: WR and RD pulse width = 14 SYSCLK cycles. 1110: WR and RD pulse width = 15 SYSCLK cycles. 1111: WR and RD pulse width = 16 SYSCLK cycles. 1:0 EAH[1:0] 1 no tR ec om m en de d fo rN ew Bit s SFR Definition 17.3. EMI0TC: External Memory Timing Control IQ Ve rs io n EMIF Address Hold Time Bits. 00: Address hold time = 0 SYSCLK cycles. 01: Address hold time = 1 SYSCLK cycle. 10: Address hold time = 2 SYSCLK cycles. 11: Address hold time = 3 SYSCLK cycles. Rev. 1.2 152 C8051F55x/56x/57x 17.6.1. Multiplexed Mode 17.6.1.1. 16-bit MOVX: EMI0CF[4:2] = 001, 010, or 011 ig n EMIF ADDRESS (8 MSBs) from DPH EMIF ADDRESS (8 LSBs) from DPL T EMIF WRITE DATA T ALEH ALEL ew AD[7:0] D es ADDR[15:8] s Muxed 16-bit WRITE ALE T T WDH rN WDS T T ACS T ACW fo WR ACH de d RD Muxed 16-bit READ EMIF ADDRESS (8 MSBs) from DPH en ADDR[15:8] EMIF ADDRESS (8 LSBs) from DPL ALEH tR ec ALE m T T ALEL RDS T ACS rs Ve IQ 153 T ACW Figure 17.3. Multiplexed 16-bit MOVX Timing io n WR T no RD EMIF READ DATA om AD[7:0] Rev. 1.2 T RDH T ACH C8051F55x/56x/57x 17.6.1.2. 8-bit MOVX without Bank Select: EMI0CF[4:2] = 001 or 011 s Muxed 8-bit WRITE Without Bank Select EMIF ADDRESS (8 LSBs) from R0 or R1 T EMIF WRITE DATA D es AD[7:0] ig n ADDR[15:8] T ALEH ALEL T T WDS T WDH T ACW T ACH rN ACS ew ALE WR fo RD de d Muxed 8-bit READ Without Bank Select ADDR[15:8] T EMIF READ DATA m T en EMIF ADDRESS (8 LSBs) from R0 or R1 AD[7:0] T ALEL RDS T RDH om ALEH ec ALE ACS T ACW T ACH tR RD T no WR IQ Ve rs io n Figure 17.4. Multiplexed 8-bit MOVX without Bank Select Timing Rev. 1.2 154 C8051F55x/56x/57x 17.6.1.3. 8-bit MOVX with Bank Select: EMI0CF[4:2] = 010 EMIF ADDRESS (8 MSBs) from EMI0CN EMIF ADDRESS (8 LSBs) from R0 or R1 T EMIF WRITE DATA D es AD[7:0] ig n ADDR[15:8] s Muxed 8-bit WRITE with Bank Select T ALEH ALEL T T WDS T WDH T ACW T ACH rN ACS ew ALE WR fo RD ADDR[15:8] de d Muxed 8-bit READ with Bank Select EMIF ADDRESS (8 MSBs) from EMI0CN T T ALEL om ec ALE T RDS T ACS T ACW T RDH T ACH tR RD EMIF READ DATA m ALEH en EMIF ADDRESS (8 LSBs) from R0 or R1 AD[7:0] no WR IQ Ve rs io n Figure 17.5. Multiplexed 8-bit MOVX with Bank Select Timing 155 Rev. 1.2 C8051F55x/56x/57x Table 17.2. AC Parameters for External Memory Interface Description Min* Max* Units ns Address/Control Setup Time 0 3 x TSYSCLK TACW Address/Control Pulse Width 1 x TSYSCLK 16 x TSYSCLK TACH Address/Control Hold Time 0 3 x TSYSCLK TALEH Address Latch Enable High Time 1 x TSYSCLK 4 x TSYSCLK ns TALEL Address Latch Enable Low Time 1 x TSYSCLK 4 x TSYSCLK ns TWDS Write Data Setup Time 1 x TSYSCLK 19 x TSYSCLK ns TWDH Write Data Hold Time 0 3 x TSYSCLK ns TRDS Read Data Setup Time TRDH Read Data Hold Time ig n TACS ns rN ew D es ns 20 ns 0 ns fo s Parameter IQ Ve rs io n no tR ec om m en de d *Note: TSYSCLK is equal to one period of the device system clock (SYSCLK). Rev. 1.2 156 C8051F55x/56x/57x 18. Oscillators and Clock Selection CAL IFCN2 IFCN1 IFCN0 rN Option 3 XTAL2 EN IOSC Option 4 XTAL2 n fo Programmable Internal Clock Generator d CLOCK MULTIPLIER IOSC / 2 EXOSC / 2 IOSC EXTOSC de Option 2 VDD Option 1 en XTAL1 XTAL2 Input Circuit SYSCLK EXOSC MULEN MULINIT MULRDY MULDIV2 MULDIV1 MULDIV0 MULSEL1 MULSEL0 XFCN2 XFCN1 XFCN0 XTLVLD XOSCMD2 XOSCMD1 XOSCMD0 ec tR n OSC om XTAL2 x4 m 10MΩ no CLKSEL SEL1 SEL0 OSCICN ew OSCIFIN IOSCEN IFRDY SUSPEND OSCICRS D es ig n s C8051F55x/56x/57x devices include a programmable internal high-frequency oscillator, an external oscillator drive circuit, and a clock multiplier. The internal oscillator can be enabled/disabled and calibrated using the OSCICN, OSCICRS, and OSCIFIN registers, as shown in Figure 18.1. The system clock can be sourced by the external oscillator circuit or the internal oscillator. The clock multiplier can produce three possible base outputs which can be scaled by a programmable factor of 1, 2/3, 2/4 (or 1/2), 2/5, 2/6 (or 1/3), or 2/7: Internal Oscillator x 2, Internal Oscillator x 4, External Oscillator x 2, or External Oscillator x 4. OSCXCN CLKMUL Figure 18.1. Oscillator Options n 18.1. System Clock Selection IQ Ve rs io The CLKSL[1:0] bits in register CLKSEL select which oscillator source is used as the system clock. CLKSL[1:0] must be set to 01b for the system clock to run from the external oscillator; however the external oscillator may still clock certain peripherals (timers, PCA) when the internal oscillator is selected as the system clock. The system clock may be switched on-the-fly between the internal oscillator, external oscillator, and Clock Multiplier so long as the selected clock source is enabled and has settled. The internal oscillator requires little start-up time and may be selected as the system clock immediately following the register write which enables the oscillator. The external RC and C modes also typically require no startup time. External crystals and ceramic resonators however, typically require a start-up time before they are settled and ready for use. The Crystal Valid Flag (XTLVLD in register OSCXCN) is set to 1 by hardware when the external crystal or ceramic resonator is settled. In crystal mode, to avoid reading a false XTLVLD, software should delay at least 1 ms between enabling the external oscillator and checking XTLVLD. Rev. 1.2 157 C8051F55x/56x/57x 7 6 5 4 3 2 1 CLKSL[1:0] Name R R R R R Reset 0 0 0 0 0 0 SFR Address = 0x8F; SFR Page = 0x0F Bit Name Function 0 rN Unused Read = 000000b; Write = Don’t Care CLKSL[1:0] System Clock Source Select Bits. R/W D es R 0 ew Type 7:2 1:0 0 ig n Bit s SFR Definition 18.1. CLKSEL: Clock Select IQ Ve rs io n no tR ec om m en de d fo 00: SYSCLK derived from the Internal Oscillator and scaled per the IFCN bits in register OSCICN. 01: SYSCLK derived from the External Oscillator circuit. 10: SYSCLK derived from the Clock Multiplier. 11: reserved. 158 Rev. 1.2 C8051F55x/56x/57x 18.2. Programmable Internal Oscillator D es ig n s All C8051F55x/56x/57x devices include a programmable internal high-frequency oscillator that defaults as the system clock after a system reset. The internal oscillator period can be adjusted via the OSCICRS and OSCIFIN registers defined in SFR Definition 18.3 and SFR Definition 18.4. On C8051F55x/56x/57x devices, OSCICRS and OSCIFIN are factory calibrated to obtain a 24 MHz base frequency. Note that the system clock may be derived from the programmed internal oscillator divided by 1, 2, 4, 8, 16, 32, 64, or 128, as defined by the IFCN bits in register OSCICN. The divide value defaults to 128 following a reset. 18.2.1. Internal Oscillator Suspend Mode ew When software writes a logic 1 to SUSPEND (OSCICN.5), the internal oscillator is suspended. If the system clock is derived from the internal oscillator, the input clock to the peripheral or CIP-51 will be stopped until one of the following events occur:  Port 0 Match Event. Port 1 Match Event.  Port 2 Match Event.  Port 3 Match Event.  Comparator 0 enabled and output is logic 0. When one of the oscillator awakening events occur, the internal oscillator, CIP-51, and affected peripherals resume normal operation, regardless of whether the event also causes an interrupt. The CPU resumes execution at the instruction following the write to SUSPEND. de d fo rN  IQ Ve rs io n no tR ec om m en Note: Before entering suspend mode, firmware must set the ZTCEN bit in REF0CN (SFR Definition 7.1). Rev. 1.2 159 C8051F55x/56x/57x IOSCEN[1:0] Name 5 4 3 SUSPEND IFRDY Reserved IFCN[2:0] R/W Type R/W R/W R/W R R Reset 1 1 0 X 0 SFR Address = 0xA1; SFR Page = 0x0F Bit Name 2 1 0 ig n 6 D es 7 0 0 0 ew Bit s SFR Definition 18.2. OSCICN: Internal Oscillator Control Function rN 7:6 IOSCEN[1:0] Internal Oscillator Enable Bits. fo 00: Oscillator Disabled. 01: Reserved. 10: Reserved. 11: Oscillator enabled in normal mode and disabled in suspend mode. SUSPEND Internal Oscillator Suspend Enable Bit. d 5 IFRDY Internal Oscillator Frequency Ready Flag. m 4 en de Setting this bit to logic 1 places the internal oscillator in SUSPEND mode. The internal oscillator resumes operation when one of the SUSPEND mode awakening events occurs. Before entering suspend mode, firmware must set the ZTCEN bit in REF0CN. 3 Reserved Read = 0b; Must Write = 0b. 2:0 IFCN[2:0] tR ec om Note: This flag may not accurately reflect the state of the oscillator. Firmware should not use this flag to determine if the oscillator is running. 0: Internal oscillator is not running at programmed frequency. 1: Internal oscillator is running at programmed frequency. Internal Oscillator Frequency Divider Control Bits. IQ Ve rs io n no 000: SYSCLK derived from Internal Oscillator divided by 128. 001: SYSCLK derived from Internal Oscillator divided by 64. 010: SYSCLK derived from Internal Oscillator divided by 32. 011: SYSCLK derived from Internal Oscillator divided by 16. 100: SYSCLK derived from Internal Oscillator divided by 8. 101: SYSCLK derived from Internal Oscillator divided by 4. 110: SYSCLK derived from Internal Oscillator divided by 2. 111: SYSCLK derived from Internal Oscillator divided by 1. 160 Rev. 1.2 C8051F55x/56x/57x 7 6 5 4 3 2 1 Varies Varies R Reset 0 R/W Varies Varies Varies SFR Address = 0xA2; SFR Page = 0x0F Bit Name Unused 6:0 OSCICRS[6:0] Varies Function Read = 0; Write = Don’t Care rN 7 Varies ew Type D es OSCICRS[6:0] Name 0 ig n Bit s SFR Definition 18.3. OSCICRS: Internal Oscillator Coarse Calibration Internal Oscillator Coarse Calibration Bits. de d fo These bits determine the internal oscillator period. When set to 0000000b, the internal oscillator operates at its slowest setting. When set to 1111111b, the internal oscillator operates at its fastest setting. The reset value is factory calibrated to generate an internal oscillator frequency of 24 MHz. 6 Type R R Reset 0 0 5 4 Varies tR 1 0 Varies Varies OSCIFIN[5:0] Varies Varies Varies Function no Read = 00b; Write = Don’t Care OSCIFIN[5:0] Internal Oscillator Fine Calibration Bits. These bits are fine adjustment for the internal oscillator period. The reset value is factory calibrated to generate an internal oscillator frequency of 24 MHz. IQ Ve rs io n 5:0 Unused 2 R/W SFR Address = 0x9E; SFR Page = 0x0F Bit Name 7:6 3 om 7 ec Bit m en SFR Definition 18.4. OSCIFIN: Internal Oscillator Fine Calibration Rev. 1.2 161 IQ n io rs Ve no en m om ec tR d de fo ew rN s ig n D es C8051F55x/56x/57x 162 Rev. 1.2 C8051F55x/56x/57x 18.3. Clock Multiplier D es ig n s The Clock Multiplier generates an output clock which is 4 times the input clock frequency scaled by a programmable factor of 1, 2/3, 2/4 (or 1/2), 2/5, 2/6 (or 1/3), or 2/7. The Clock Multiplier’s input can be selected from the external oscillator, or the internal or external oscillators divided by 2. This produces three possible base outputs which can be scaled by a programmable factor: Internal Oscillator x 2, External Oscillator x 2, or External Oscillator x 4. See Section 18.1 on page 157 for details on system clock selection. The Clock Multiplier is configured via the CLKMUL register (SFR Definition 18.5). The procedure for configuring and enabling the Clock Multiplier is as follows: 1. Reset the Multiplier by writing 0x00 to register CLKMUL. ew 2. Select the Multiplier input source via the MULSEL bits. 4. Enable the Multiplier with the MULEN bit (CLKMUL | = 0x80). 5. Delay for >5 µs. fo 6. Initialize the Multiplier with the MULINIT bit (CLKMUL | = 0xC0). rN 3. Select the Multiplier output scaling factor via the MULDIV bits 7. Poll for MULRDY > 1. de d Important Note: When using an external oscillator as the input to the Clock Multiplier, the external source must be enabled and stable before the Multiplier is initialized. See “18.4. External Oscillator Drive Circuit” on page 164 for details on selecting an external oscillator source. no tR FCM in ec if FCM in >= FCM min om m en The Clock Multiplier allows faster operation of the CIP-51 core and is intended to generate an output frequency between 25 and 50 MHz. The clock multiplier can also be used with slow input clocks. However, if the clock is below the minimum Clock Multiplier input frequency (FCMmin), the generated clock will consist of four fast pulses followed by a long delay until the next input clock rising edge. The average frequency of the output is equal to 4x the input, but the instantaneous frequency may be faster. See Figure 18.2 below for more information. io n FCM out IQ Ve rs if FCMin < FCM min FCM in FCM out Figure 18.2. Example Clock Multiplier Output Rev. 1.2 162 C8051F55x/56x/57x 7 6 5 3 Name MULEN MULINIT MULRDY MULDIV[2:0] MULSEL[1:0] Type R/W R/W R R/W R/W Reset 0 0 0 0 SFR Address = 0x97; SFR Page = 0x0F Bit Name MULEN 0 Function Clock Multiplier Enable. 0: Clock Multiplier disabled. 1: Clock Multiplier enabled. MULINIT 0 0 Clock Multiplier Initialize. fo 6 0 rN 7 1 ew 0 2 D es 4 ig n Bit s SFR Definition 18.5. CLKMUL: Clock Multiplier de d This bit is 0 when the Clock Multiplier is enabled. Once enabled, writing a 1 to this bit will initialize the Clock Multiplier. The MULRDY bit reads 1 when the Clock Multiplier is stabilized. 5 MULRDY 4:2 MULDIV[2:0] 1:0 MULSEL[1:0] Clock Multiplier Input Select. m en Clock Multiplier Ready. 0: Clock Multiplier is not ready. 1: Clock Multiplier is ready (PLL is locked). IQ Ve rs io n no tR ec om Clock Multiplier Output Scaling Factor. 000: Clock Multiplier Output scaled by a factor of 1. 001: Clock Multiplier Output scaled by a factor of 1. 010: Clock Multiplier Output scaled by a factor of 1. 011: Clock Multiplier Output scaled by a factor of 2/3*. 100: Clock Multiplier Output scaled by a factor of 2/4 (1/2). 101: Clock Multiplier Output scaled by a factor of 2/5*. 110: Clock Multiplier Output scaled by a factor of 2/6 (1/3). 111: Clock Multiplier Output scaled by a factor of 2/7*. *Note: The Clock Multiplier output duty cycle is not 50% for these settings. These bits select the clock supplied to the Clock Multiplier MULSEL[1:0] Selected Input Clock Clock Multiplier Output for MULDIV[2:0] = 000b 00 Internal Oscillator Internal Oscillator x 2 01 External Oscillator External Oscillator x 2 10 Internal Oscillator Internal Oscillator x 4 11 External Oscillator External Oscillator x 4 Notes:The maximum system clock is 50 MHz, and so the Clock Multiplier output should be scaled accordingly. If Internal Oscillator x 2 or External Oscillator x 2 is selected using the MULSEL bits, MULDIV[2:0] is ignored. 163 Rev. 1.2 C8051F55x/56x/57x 18.4. External Oscillator Drive Circuit D es ig n s The external oscillator circuit may drive an external crystal, ceramic resonator, capacitor, or RC network. A CMOS clock may also provide a clock input. For a crystal or ceramic resonator configuration, the crystal/resonator must be wired across the XTAL1 and XTAL2 pins as shown in Option 1 of Figure 18.1. A 10 MΩ resistor also must be wired across the XTAL2 and XTAL1 pins for the crystal/resonator configuration. In RC, capacitor, or CMOS clock configuration, the clock source should be wired to the XTAL2 pin as shown in Option 2, 3, or 4 of Figure 18.1. The type of external oscillator must be selected in the OSCXCN register, and the frequency control bits (XFCN) must be selected appropriately (see SFR Definition 18.6). IQ Ve rs io n no tR ec om m en de d fo rN ew Important Note on External Oscillator Usage: Port pins must be configured when using the external oscillator circuit. When the external oscillator drive circuit is enabled in crystal/resonator mode, Port pins P0.2 and P0.3 are used as XTAL1 and XTAL2 respectively. When the external oscillator drive circuit is enabled in capacitor, RC, or CMOS clock mode, Port pin P0.3 is used as XTAL2. The Port I/O Crossbar should be configured to skip the Port pins used by the oscillator circuit; see Section “19.3. Priority Crossbar Decoder” on page 172 for Crossbar configuration. Additionally, when using the external oscillator circuit in crystal/resonator, capacitor, or RC mode, the associated Port pins should be configured as analog inputs. In CMOS clock mode, the associated pin should be configured as a digital input. See Section “19.4. Port I/O Initialization” on page 174 for details on Port input mode selection. Rev. 1.2 164 C8051F55x/56x/57x 7 5 Name XTLVLD XOSCMD[2:0] Type R R/W Reset 0 3 R 0 0 R/W 0 0 0 Function Crystal Oscillator Valid Flag. rN XTLVLD 1 XFCN[2:0] SFR Address = 0x9F; SFR Page = 0x0F Bit Name 7 2 fo (Read only when XOSCMD = 11x.) 0: Crystal Oscillator is unused or not yet stable. 1: Crystal Oscillator is running and stable. 6:4 XOSCMD[2:0] External Oscillator Mode Select. Unused 2:0 XFCN[2:0] om m en de d 00x: External Oscillator circuit off. 010: External CMOS Clock Mode. 011: External CMOS Clock Mode with divide by 2 stage. 100: RC Oscillator Mode. 101: Capacitor Oscillator Mode. 110: Crystal Oscillator Mode. 111: Crystal Oscillator Mode with divide by 2 stage. 3 Read = 0b; Write =0b External Oscillator Frequency Control Bits. tR ec Set according to the desired frequency for Crystal or RC mode. Set according to the desired K Factor for C mode. Crystal Mode RC Mode C Mode 000 f ≤ 32 kHz f ≤ 25 kHz K Factor = 0.87 001 32 kHz < f ≤ 84 kHz 25 kHz < f ≤ 50 kHz K Factor = 2.6 010 84 kHz < f ≤ 225 kHz 50 kHz < f ≤ 100 kHz K Factor = 7.7 011 225 kHz < f ≤ 590 kHz 100 kHz < f ≤ 200 kHz K Factor = 22 100 590 kHz < f ≤ 1.5 MHz 200 kHz < f ≤ 400 kHz K Factor = 65 101 1.5 MHz < f ≤ 4 MHz 400 kHz < f ≤ 800 kHz K Factor = 180 110 4 MHz < f ≤ 10 MHz 800 kHz < f ≤ 1.6 MHz K Factor = 664 111 10 MHz < f ≤ 30 MHz 1.6 MHz < f ≤ 3.2 MHz K Factor = 1590 Ve rs io n no XFCN IQ 165 Rev. 1.2 0 D es 0 4 ew 6 ig n Bit s SFR Definition 18.6. OSCXCN: External Oscillator Control 0 C8051F55x/56x/57x 18.4.1. External Crystal Example D es ig n s If a crystal or ceramic resonator is used as an external oscillator source for the MCU, the circuit should be configured as shown in Figure 18.1, Option 1. The External Oscillator Frequency Control value (XFCN) should be chosen from the Crystal column of the table in SFR Definition 18.6 (OSCXCN register). For example, an 11.0592 MHz crystal requires an XFCN setting of 111b and a 32.768 kHz Watch Crystal requires an XFCN setting of 001b. After an external 32.768 kHz oscillator is stabilized, the XFCN setting can be switched to 000 to save power. It is recommended to enable the missing clock detector before switching the system clock to any external oscillator source. ew When the crystal oscillator is first enabled, the oscillator amplitude detection circuit requires a settling time to achieve proper bias. Introducing a delay of 1 ms between enabling the oscillator and checking the XTLVLD bit will prevent a premature switch to the external oscillator as the system clock. Switching to the external oscillator before the crystal oscillator has stabilized can result in unpredictable behavior. The recommended procedure is: rN 1. Force XTAL1 and XTAL2 to a high state. This involves enabling the Crossbar and writing 1 to the port pins associated with XTAL1 and XTAL2. fo 2. Configure XTAL1 and XTAL2 as analog inputs using. 3. Enable the external oscillator. d 4. Wait at least 1 ms. de 5. Poll for XTLVLD => 1. 6. Enable the Missing Clock Detector. en 7. Switch the system clock to the external oscillator. om m Important Note on External Crystals: Crystal oscillator circuits are quite sensitive to PCB layout. The crystal should be placed as close as possible to the XTAL pins on the device. The traces should be as short as possible and shielded with ground plane from any other traces which could introduce noise or interference. ec The capacitors shown in the external crystal configuration provide the load capacitance required by the crystal for correct oscillation. These capacitors are "in series" as seen by the crystal and "in parallel" with the stray capacitance of the XTAL1 and XTAL2 pins. tR Note: The desired load capacitance depends upon the crystal and the manufacturer. Refer to the crystal data sheet when completing these calculations. IQ Ve rs io n no For example, a tuning-fork crystal of 32.768 kHz with a recommended load capacitance of 12.5 pF should use the configuration shown in Figure 18.1, Option 1. The total value of the capacitors and the stray capacitance of the XTAL pins should equal 25 pF. With a stray capacitance of 3 pF per pin, the 22 pF capacitors yield an equivalent capacitance of 12.5 pF across the crystal, as shown in Figure 18.3. Rev. 1.2 166 s C8051F55x/56x/57x ig n XTAL1 D es 10MΩ ew XTAL2 32.768 kHz 22pF* d * Capacitor values depend on crystal specifications fo rN 22pF* de Figure 18.3. External 32.768 kHz Quartz Crystal Oscillator Connection Diagram en 18.4.2. External RC Example tR ec om m If an RC network is used as an external oscillator source for the MCU, the circuit should be configured as shown in Figure 18.1, Option 2. The capacitor should be no greater than 100 pF; however for very small capacitors, the total capacitance may be dominated by parasitic capacitance in the PCB layout. To determine the required External Oscillator Frequency Control value (XFCN) in the OSCXCN Register, first select the RC network value to produce the desired frequency of oscillation, according to Equation 18.1, where f = the frequency of oscillation in MHz, C = the capacitor value in pF, and R = the pull-up resistor value in kΩ. 3 f = 1.23 × 10 ⁄ ( R × C ) no Equation 18.1. RC Mode Oscillator Frequency n For example: If the frequency desired is 100 kHz, let R = 246 kΩ and C = 50 pF: io f = 1.23(103)/RC = 1.23(103)/[246 x 50] = 0.1 MHz = 100 kHz rs Referring to the table in SFR Definition 18.6, the required XFCN setting is 010b. IQ Ve 18.4.3. External Capacitor Example If a capacitor is used as an external oscillator for the MCU, the circuit should be configured as shown in Figure 18.1, Option 3. The capacitor should be no greater than 100 pF; however for very small capacitors, the total capacitance may be dominated by parasitic capacitance in the PCB layout. To determine the required External Oscillator Frequency Control value (XFCN) in the OSCXCN Register, select the capacitor to be used and find the frequency of oscillation according to Equation , where f = the frequency of oscillation in MHz, C = the capacitor value in pF, and VDD = the MCU power supply in Volts. 167 Rev. 1.2 C8051F55x/56x/57x f = ( KF ) ⁄ ( R × V DD ) ig n s Equation 18.2. C Mode Oscillator Frequency D es For example: Assume VDD = 2.1 V and f = 75 kHz: f = KF / (C x VDD) ew 0.075 MHz = KF / (C x 2.1) fo rN Since the frequency of roughly 75 kHz is desired, select the K Factor from the table in SFR Definition 18.6 (OSCXCN) as KF = 7.7: d 0.075 MHz = 7.7 / (C x 2.1) en de C x 2.1 = 7.7 / 0.075 MHz m C = 102.6 / 2.0 pF = 51.3 pF IQ Ve rs io n no tR ec om Therefore, the XFCN value to use in this example is 010b. Rev. 1.2 168 C8051F55x/56x/57x 19. Port Input/Output ew D es ig n s Digital and analog resources are available through 33 (C8051F568-9 and ‘F570-5), 25 (C8051F550-7) or 18 (C8051F550-7) I/O pins. Port pins P0.0-P4.0 on the C8051F568-9 and ‘F570-5, port pins P0.0-P3.0 on theC8051F560-7, and port pins P0.0-P2.1 on the C8051F550-7 can be defined as general-purpose I/O (GPIO), assigned to one of the internal digital resources, or assigned to an analog function as shown in Figure 19.3. Port pin P4.0 on the C8051F568-9 and ‘F570-5 can be used as GPIO and is shared with the C2 Interface Data signal (C2D). Similarly, port pin P3.0 is shared with C2D on the C8051F560-7 and port pin P2.1 on the C8051F550-7. The designer has complete control over which functions are assigned, limited only by the number of physical I/O pins. This resource assignment flexibility is achieved through the use of a Priority Crossbar Decoder. Note that the state of a Port I/O pin can always be read in the corresponding Port latch, regardless of the Crossbar settings. rN The Crossbar assigns the selected internal digital resources to the I/O pins based on the Priority Decoder (Figure 19.3 and Figure 19.4). The registers XBR0, XBR1, XBR2 are defined in SFR Definition 19.1 and SFR Definition 19.2 and are used to select internal digital functions. de d fo The Port I/O cells are configured as either push-pull or open-drain in the Port Output Mode registers (PnMDOUT, where n = 0,1). Complete Electrical Specifications for Port I/O are given in Table 5.3 on page 40. PnMDOUT, PnDMIN Registers en XBR0, XBR1, XBR2, PnSKIP External Pins 2 UART0 2 CAN0 4 ec 2 CP0 no CP1 P0.0 P1 I/O Cells P1.0 Highest Priority P0.7 P1.7 8 2 P2 I/O Cells P2.0 P3 I/O Cells P3.0 P4 I/O Cell P4.0 P2.7 /SYSCLK 7 T0, T1, /INT0, /INT1 4 8 io rs Ve IQ Port Latches 8 P0 I/O Cells 2 PCA0 Lowest Priority Digital Crossbar tR SMBus0 n (Internal Digital Signals) SPI0 8 om Highest Priority m Priority Decoder 2 LIN0 8 33 P0 P1 P2 P3 P4 P3.7 Lowest Priority (Px.0-Px.7) PnMASK PnMATCH Registers Figure 19.1. Port I/O Functional Block Diagram Rev. 1.2 169 C8051F55x/56x/57x ig n s Note: When VIO rises faster than VDD, which can happen when VREGIN and VIO are tied together, a delay created between GPIO power (VIO) and the logic controlling GPIO (VDD) results in a temporary unknown state at the GPIO pins. When VIO rises faster than VDD, the GPIO may enter the following states: floating, glitch low, or glitch high. Cross coupling VIO and VDD with a 4.7 µF capacitor mitigates the root cause of the problem by allowing VIO and VDD to rise at the same rate. 19.1. Port I/O Modes of Operation D es Port pins P0.0–P4.0 use the Port I/O cell shown in Figure 19.2. Each Port I/O cell can be configured by software for analog I/O or digital I/O using the PnMDIN registers. On reset, all Port I/O cells default to a high impedance state with weak pull-ups enabled until the Crossbar is enabled (XBARE = 1). 19.1.1. Port Pins Configured for Analog I/O rN ew Any pins to be used as Comparator or ADC inputs, external oscillator inputs, or VREF should be configured for analog I/O (PnMDIN.n = 0). When a pin is configured for analog I/O, its weak pullup, digital driver, and digital receiver are disabled. Port pins configured for analog I/O will always read back a value of 0. fo Configuring pins as analog I/O saves power and isolates the Port pin from digital interference. Port pins configured as digital inputs may still be used by analog peripherals; however, this practice is not recommended and may result in measurement errors. 19.1.2. Port Pins Configured For Digital I/O de d Any pins to be used by digital peripherals (UART, SPI, SMBus, etc.), external digital event capture functions, or as GPIO should be configured as digital I/O (PnMDIN.n = 1). For digital I/O pins, one of two output modes (push-pull or open-drain) must be selected using the PnMDOUT registers. om m en Push-pull outputs (PnMDOUT.n = 1) drive the Port pad to the VIO or GND supply rails based on the output logic value of the Port pin. Open-drain outputs have the high side driver disabled; therefore, they only drive the Port pad to GND when the output logic value is 0 and become high impedance inputs (both high low drivers turned off) when the output logic value is 1. PORT PAD io rs PxMDIN.x (1 for digital) (0 for analog) To/From Analog Peripheral IQ Ve GND Px.x – Input Logic Value (Reads 0 when pin is configured as an analog I/O) Figure 19.2. Port I/O Cell Block Diagram 170 VIO (WEAK) n Px.x – Output Logic Value (Port Latch or Crossbar) tR XBARE (Crossbar Enable) VIO no PxMDOUT.x (1 for push-pull) (0 for open-drain) ec WEAKPUD (Weak Pull-Up Disable) Rev. 1.2 C8051F55x/56x/57x ig n s When a digital I/O cell is placed in the high impedance state, a weak pull-up transistor pulls the Port pad to the VIO supply voltage to ensure the digital input is at a defined logic state. Weak pull-ups are disabled when the I/O cell is driven to GND to minimize power consumption and may be globally disabled by setting WEAKPUD to 1. The user should ensure that digital I/O are always internally or externally pulled or driven to a valid logic state to minimize power consumption. Port pins configured for digital I/O always read back the logic state of the Port pad, regardless of the output logic value of the Port pin. 19.1.3. Interfacing Port I/O in a Multi-Voltage System D es All Port I/O are capable of interfacing to digital logic operating at a supply voltage higher than VDD and less than 5.25 V. Connect the VIO pin to the voltage source of the interface logic. 19.2. Assigning Port I/O Pins to Analog and Digital Functions rN ew Port I/O pins P0.0–P3.7 can be assigned to various analog, digital, and external interrupt functions. P4.0 can be assigned to only digital functions. The Port pins assigned to analog functions should be configured for analog I/O, and Port pins assigned to digital or external interrupt functions should be configured for digital I/O. 19.2.1. Assigning Port I/O Pins to Analog Functions de d fo Table 19.1 shows all available analog functions that require Port I/O assignments. Port pins selected for these analog functions should have their corresponding bit in PnSKIP set to 1. This reserves the pin for use by the analog function and does not allow it to be claimed by the Crossbar. Table 19.1 shows the potential mapping of Port I/O to each analog function. en Table 19.1. Port I/O Assignment for Analog Functions Potentially Assignable Port Pins SFR(s) used for Assignment P0.0–P3.71 ADC0MX, PnSKIP m Analog Function om ADC Input 1 Comparator0 or Compartor1 Input ec Voltage Reference (VREF0)2 tR External Oscillator in Crystal Mode (XTAL1) External Oscillator in RC, C, or Crystal Mode (XTAL2) P0.0–P2.7 CPT0MX, CPT1MX, PnSKIP P0.0 REF0CN, PnSKIP P0.2 OSCXCN, PnSKIP P0.3 OSCXCN, PnSKIP io n no Notes: 1. P3.1–P3.7 are available on the 40-pin packages. P2.2-P3.0 are available 40-pin and 32-pin packages. 2. If VDD is selected as the voltage reference in the REF0CN register and the ADC is enabled in the ADC0CN register, the P0.0/VREF pin cannot operate as a general purpose I/O pin in open-drain mode. With the above settings, this pin can operate in push-pull output mode or as an analog input. rs 19.2.2. Assigning Port I/O Pins to Digital Functions IQ Ve Any Port pins not assigned to analog functions may be assigned to digital functions or used as GPIO. Most digital functions rely on the Crossbar for pin assignment; however, some digital functions bypass the Crossbar in a manner similar to the analog functions listed above. Port pins used by these digital functions and any Port pins selected for use as GPIO should have their corresponding bit in PnSKIP set to 1. Table 19.2 shows all available digital functions and the potential mapping of Port I/O to each digital function. Rev. 1.2 171 C8051F55x/56x/57x Digital Function Any Port pin available for assignment by the Crossbar. This includes P0.0–P4.0* pins which have their PnSKIP bit set to 0. Note: The Crossbar will always assign UART0 pins to P0.4 and P0.5 and always assign CAN0 to P0.6 and P0.7. XBR0, XBR1, XBR2 P0.0–P4.0* P0SKIP, P1SKIP, P2SKIP, P3SKIP ew Any pin used for GPIO ig n SFR(s) used for Assignment D es UART0, SPI0, SMBus, CAN0, LIN0, CP0, CP0A, CP1, CP1A, SYSCLK, PCA0 (CEX0-5 and ECI), T0 or T1. Potentially Assignable Port Pins s Table 19.2. Port I/O Assignment for Digital Functions rN *Note: P3.1–P3.7 are available on the 40-pin packages. P2.2-P3.0 are available 40-pin and 32-pin packages. 19.2.3. Assigning Port I/O Pins to External Digital Event Capture Functions de d fo External digital event capture functions can be used to trigger an interrupt or wake the device from a low power mode when a transition occurs on a digital I/O pin. The digital event capture functions do not require dedicated pins and will function on both GPIO pins (PnSKIP = 1) and pins in use by the Crossbar (PnSKIP = 0). External digital event capture functions cannot be used on pins configured for analog I/O. Table 19.3 shows all available external digital event capture functions. en Table 19.3. Port I/O Assignment for External Digital Event Capture Functions Digital Function m Potentially Assignable Port Pins External Interrupt 0 P1.0–P1.7 om External Interrupt 1 IT01CF P1.0–P1.7 IT01CF P0.0–P3.7* P0MASK, P0MAT P1MASK, P1MAT P2MASK, P2MAT P3MASK, P3MAT tR ec Port Match SFR(s) used for Assignment *Note: P3.1–P3.7 are available on the 40-pin packages. P2.2-P3.0 are available 40-pin and 32-pin packages no 19.3. Priority Crossbar Decoder Ve rs io n The Priority Crossbar Decoder (Figure 19.3) assigns a priority to each I/O function, starting at the top with UART0. When a digital resource is selected, the least-significant unassigned Port pin is assigned to that resource excluding UART0, which is always assigned to pins P0.4 and P0.5, and excluding CAN0 which is always assigned to pins P0.6 and P0.7. If a Port pin is assigned, the Crossbar skips that pin when assigning the next selected resource. Additionally, the Crossbar will skip Port pins whose associated bits in the PnSKIP registers are set. The PnSKIP registers allow software to skip Port pins that are to be used for analog input, dedicated functions, or GPIO. IQ Because of the nature of Priority Crossbar Decoder, not all peripherals can be located on all port pins. Figure 19.3 maps peripherals to the potential port pins on which the peripheral I/O can appear. Important Note on Crossbar Configuration: If a Port pin is claimed by a peripheral without use of the Crossbar, its corresponding PnSKIP bit should be set. This applies to P0.0 if VREF is used, P0.1 if the ADC is configured to use the external conversion start signal (CNVSTR), P0.3 and/or P0.2 if the external oscillator circuit is enabled, and any selected ADC or Comparator inputs. The Crossbar skips selected pins as if they were already assigned, and moves to the next unassigned pin. 172 Rev. 1.2 C8051F55x/56x/57x 3 4 5 6 7 0 1 2 3 5 6 7 4 P 2.2-P 2.7, P 3.0 available on 40-pin and 32-pin pac k ages 0 1 2 3 4 5 6 7 0 P4 P 3.1-P 3.7, P 4.0 available on 40-pin pac k ages 1 2 3 UA RT _T X 5 6 7 0 D es UA RT _R X 4 s 2 P3 ig n XTAL2 1 /WR XTAL1 0 P2 /RD VREF P IN I/O CNVSTR S p e cia l F u n ctio n S ig n a ls P1 ALE P0 P o rt CA N_T X CA N_R X S CK ew M IS O MOSI NS S rN S DA S CL CP 0 fo CP 0A CP 1 d CP 1A de S YS CL K CEX 0 en CEX 1 CEX 2 CEX 3 m CEX 4 om CEX 5 ECI T0 ec T1 L IN _T X tR L IN _RX Figure 19.3. Peripheral Availability on Port I/O Pins rs io n no Registers XBR0, XBR1, and XBR2 are used to assign the digital I/O resources to the physical I/O Port pins. Note that when the SMBus is selected, the Crossbar assigns both pins associated with the SMBus (SDA and SCL); and similarly when the UART, CAN or LIN are selected, the Crossbar assigns both pins associated with the peripheral (TX and RX). UART0 pin assignments are fixed for bootloading purposes: UART TX0 is always assigned to P0.4; UART RX0 is always assigned to P0.5. CAN0 pin assignments are fixed to P0.6 for CAN_TX and P0.7 for CAN_RX. Standard Port I/Os appear contiguously after the prioritized functions have been assigned. IQ Ve Important Note: The SPI can be operated in either 3-wire or 4-wire modes, pending the state of the NSSMD1–NSSMD0 bits in register SPI0CN. According to the SPI mode, the NSS signal may or may not be routed to a Port pin. As an example configuration, if CAN0, SPI0 in 4-wire mode, and PCA0 Modules 0, 1, and 2 are enabled on the crossbar with P0.1, P0.2, and P0.5 skipped, the registers should be set as follows: XBR0 = 0x06 (CAN0 and SPI0 enabled), XBR1 = 0x0C (PCA0 modules 0, 1, and 2 enabled), XBR2 = 0x40 (Crossbar enabled), and P0SKIP = 0x26 (P0.1, P0.2, and P0.5 skipped). The resulting crossbar would look as shown in Figure 19.4. Rev. 1.2 173 C8051F55x/56x/57x 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 P4 P3 P 2 . 2 -P 2 . 7 , P 3 . 0 a va i l a b l e o n 4 0 -p i n a n d 3 2 -p in p a c k a g e s /WR ALE XTAL2 P2 4 5 6 7 0 P 3 . 1 -P 3 . 7 , P 4 . 0 a va i la b l e o n 4 0 - p i n pac kages 1 2 3 4 UART_TX UART_RX 6 7 0 D es CAN_T X 5 s 1 P1 ig n 0 P IN I/O XTAL1 S p e cia l F u n c ti o n S ig n a ls CNVSTR VREF P0 /RD P o rt CAN_RX SCK M IS O MOSI NSS ew * N S S Is o n l y p i n n e d o u t i n 4 -w i re S P I M o d e SDA SCL rN CP0 CP 0A CP1 fo CP 1A S YS CLK CEX 0 d CEX 1 de CEX 2 CEX 3 CEX 4 en CEX 5 ECI T0 m T1 L IN _R X 0 1 1 0 0 1 0 P 0 S K I P [0 :7 ] 0 om L IN _T X 0 0 0 0 0 0 0 P 1 S K I P [0 :7 ] 0 0 0 0 0 0 0 0 P 2 S K I P [0 :7 ] 0 0 0 0 0 0 0 0 P 3 S K I P [0 :7 ] 0 ec Figure 19.4. Crossbar Priority Decoder in Example Configuration tR 19.4. Port I/O Initialization Port I/O initialization consists of the following steps: no 1. Select the input mode (analog or digital) for all Port pins, using the Port Input Mode register (PnMDIN). n 2. Select the output mode (open-drain or push-pull) for all Port pins, using the Port Output Mode register (PnMDOUT). io 3. Select any pins to be skipped by the I/O Crossbar using the Port Skip registers (PnSKIP). 4. Assign Port pins to desired peripherals. rs 5. Enable the Crossbar (XBARE = 1). IQ Ve All Port pins must be configured as either analog or digital inputs. Port 4 C8051F568-9 and ‘F570-5 is a digital-only Port. Any pins to be used as Comparator or ADC inputs should be configured as an analog inputs. When a pin is configured as an analog input, its weak pullup, digital driver, and digital receiver are disabled. This process saves power and reduces noise on the analog input. Pins configured as digital inputs may still be used by analog peripherals; however this practice is not recommended. Additionally, all analog input pins should be configured to be skipped by the Crossbar (accomplished by setting the associated bits in PnSKIP). Port input mode is set in the PnMDIN register, where a 1 indicates a digital input, and a 0 indicates an analog input. All pins default to digital inputs on reset. See SFR Definition 19.13 for the PnMDIN register details. 174 Rev. 1.2 C8051F55x/56x/57x ig n s The output driver characteristics of the I/O pins are defined using the Port Output Mode registers (PnMDOUT). Each Port Output driver can be configured as either open drain or push-pull. This selection is required even for the digital resources selected in the XBRn registers, and is not automatic. The only exception to this is the SMBus (SDA, SCL) pins, which are configured as open-drain regardless of the PnMDOUT settings. When the WEAKPUD bit in XBR2 is 0, a weak pullup is enabled for all Port I/O configured as open-drain. WEAKPUD does not affect the push-pull Port I/O. Furthermore, the weak pullup is turned off on an output that is driving a 0 to avoid unnecessary power dissipation. ew D es Registers XBR0, XBR1, and XBR2 must be loaded with the appropriate values to select the digital I/O functions required by the design. Setting the XBARE bit in XBR2 to 1 enables the Crossbar. Until the Crossbar is enabled, the external pins remain as standard Port I/O (in input mode), regardless of the XBRn Register settings. For given XBRn Register settings, one can determine the I/O pin-out using the Priority Decode Table; as an alternative, the Configuration Wizard utility of the Silicon Labs IDE software will determine the Port I/O pin-assignments based on the XBRn Register settings. IQ Ve rs io n no tR ec om m en de d fo rN The Crossbar must be enabled to use Port pins as standard Port I/O in output mode. Port output drivers are disabled while the Crossbar is disabled. Rev. 1.2 175 C8051F55x/56x/57x 7 6 5 4 3 2 1 Name CP1AE CP1E CP0AE CP0E SMB0E SPI0E CAN0E URT0E Type R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 CP1AE Function Comparator1 Asynchronous Output Enable. 0: Asynchronous CP1 unavailable at Port pin. 1: Asynchronous CP1 routed to Port pin. CP1E Comparator1 Output Enable. fo 6 de CP0AE d 0: CP1 unavailable at Port pin. 1: CP1 routed to Port pin. 5 D es rN 7 0 ew SFR Address = 0xE1; SFR Page = 0x0F Bit Name 0 ig n Bit Comparator0 Asynchronous Output Enable. Comparator0 Output Enable. m CP0E en 0: Asynchronous CP0 unavailable at Port pin. 1: Asynchronous CP0 routed to Port pin. 4 SMB0E om 0: CP0 unavailable at Port pin. 1: CP0 routed to Port pin. 3 SMBus I/O Enable. SPI I/O Enable. tR SPI0E ec 0: SMBus I/O unavailable at Port pins. 1: SMBus I/O routed to Port pins. 2 no 0: SPI I/O unavailable at Port pins. 1: SPI I/O routed to Port pins. Note that the SPI can be assigned either 3 or 4 GPIO pins. CAN0E CAN I/O Output Enable. rs io n 1 URT0E UART I/O Output Enable. 0: UART I/O unavailable at Port pin. 1: UART TX0, RX0 routed to Port pins P0.4 and P0.5. IQ Ve 0 0: CAN I/O unavailable at Port pins. 1: CAN_TX, CAN_RX routed to Port pins P0.6 and P0.7. 176 Rev. 1.2 s SFR Definition 19.1. XBR0: Port I/O Crossbar Register 0 C8051F55x/56x/57x 7 6 5 4 3 Name T1E T0E ECIE Type R/W R/W R/W R/W R/W Reset 0 0 0 0 0 T1 Enable. T0 Enable. R/W 0 0 D es R/W 0 de ECIE R d 0: T0 unavailable at Port pin. 1: T0 routed to Port pin. 5 Reserved fo T0E SYSCKE ew Function 0: T1 unavailable at Port pin. 1: T1 routed to Port pin. 6 0 rN T1E 1 PCA0ME[2:0] SFR Address = 0xE2; SFR Page = 0x0F Bit Name 7 2 ig n Bit s SFR Definition 19.2. XBR1: Port I/O Crossbar Register 1 PCA0 External Counter Input Enable. en 0: ECI unavailable at Port pin. 1: ECI routed to Port pin. m 4:2 PCA0ME[2:0] PCA Module I/O Enable Bits. /SYSCLK Output Enable. n io Reserved 0: /SYSCLK unavailable at Port pin. 1: /SYSCLK output routed to Port pin. Always Write to 0. IQ Ve rs 0 SYSCKE no 1 tR ec om 000: All PCA I/O unavailable at Port pins. 001: CEX0 routed to Port pin. 010: CEX0, CEX1 routed to Port pins. 011: CEX0, CEX1, CEX2 routed to Port pins. 100: CEX0, CEX1, CEX2, CEX3 routed to Port pins. 101: CEX0, CEX1, CEX2, CEX3, CEX4 routed to Port pins. 110: CEX0, CEX1, CEX2, CEX3, CEX4, CEX5 routed to Port pins. 111: RESERVED Rev. 1.2 177 C8051F55x/56x/57x 7 Name WEAKPUD 6 5 4 3 XBARE 2 1 Reserved LIN0E R/W R/W R/W R/W R/W R R/W Reset 0 0 0 0 0 0 0 0 ew WEAKPUD Function Port I/O Weak Pullup Disable. rN 7 R/W D es Type SFR Address = 0xC7; SFR Page = 0x0F Bit Name 0 ig n Bit XBARE fo 0: Weak Pullups enabled (except for Ports whose I/O are configured for analog mode). 1: Weak Pullups disabled. 6 Crossbar Enable. Always Write to 00000b. 0 LIN0E LIN I/O Output Enable. de Reserved en 5:1 d 0: Crossbar disabled. 1: Crossbar enabled. IQ Ve rs io n no tR ec om m 0: LIN I/O unavailable at Port pin. 1: LIN_TX, LIN_RX routed to Port pins. 178 Rev. 1.2 s SFR Definition 19.3. XBR2: Port I/O Crossbar Register 1 C8051F55x/56x/57x 19.5. Port Match 7 6 5 4 3 P0MASK[7:0] Type R/W 0 0 0 0 0 0 0 Function m P0MASK[7:0] 0 en SFR Address = 0xF2; SFR Page = 0x00 Bit Name 7:0 de 0 Reset 1 d Name 2 fo Bit rN SFR Definition 19.4. P0MASK: Port 0 Mask Register ew D es ig n s Port match functionality allows system events to be triggered by a logic value change on P0, P1, P2 or P3. A software controlled value stored in the PnMATCH registers specifies the expected or normal logic values of P0, P1, P2, and P3. A Port mismatch event occurs if the logic levels of the Port’s input pins no longer match the software controlled value. This allows Software to be notified if a certain change or pattern occurs on P0, P1, P2, or P3 input pins regardless of the XBRn settings. The PnMASK registers can be used to individually select which of the port pins should be compared against the PnMATCH registers. A Port mismatch event is generated if (Pn & PnMASK) does not equal (PnMATCH & PnMASK), where n is 0, 1, 2 or 3 A Port mismatch event may be used to generate an interrupt or wake the device from a low power mode, such as IDLE or SUSPEND. See the Interrupts and Power Options chapters for more details on interrupt and wake-up sources. Port 0 Mask Value. tR ec om Selects P0 pins to be compared to the corresponding bits in P0MAT. 0: P0.n pin logic value is ignored and cannot cause a Port Mismatch event. 1: P0.n pin logic value is compared to P0MAT.n. no SFR Definition 19.5. P0MAT: Port 0 Match Register Name io Type 7 rs Reset 6 5 1 Ve IQ P0MAT[7:0] 3 2 1 0 1 1 1 P0MAT[7:0] R/W 1 1 SFR Address = 0xF1; SFR Page = 0x00 Bit Name 7:0 4 n Bit 1 1 Function Port 0 Match Value. Match comparison value used on Port 0 for bits in P0MAT which are set to 1. 0: P0.n pin logic value is compared with logic LOW. 1: P0.n pin logic value is compared with logic HIGH. Rev. 1.2 179 C8051F55x/56x/57x 5 4 3 Name P1MASK[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xF4; SFR Page = 0x00 Bit Name P1MASK[7:0] 1 0 0 0 0 Function Port 1 Mask Value. rN 7:0 2 ig n 6 D es 7 ew Bit d fo Selects P1 pins to be compared to the corresponding bits in P1MAT. 0: P1.n pin logic value is ignored and cannot cause a Port Mismatch event. 1: P1.n pin logic value is compared to P1MAT.n. 7 6 en de SFR Definition 19.7. P1MAT: Port 1 Match Register Bit 5 4 2 1 0 1 1 1 P1MAT[7:0] m Name 1 Reset om Type 1 1 R/W 1 ec SFR Address = 0xF3; SFR Page = 0x00 Bit Name P1MAT[7:0] 1 Function tR 7:0 3 Port 1 Match Value. IQ Ve rs io n no Match comparison value used on Port 1 for bits in P1MAT which are set to 1. 0: P1.n pin logic value is compared with logic LOW. 1: P1.n pin logic value is compared with logic HIGH. 180 Rev. 1.2 s SFR Definition 19.6. P1MASK: Port 1 Mask Register C8051F55x/56x/57x 5 4 3 Name P2MASK[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xB2; SFR Page = 0x00 Bit Name P2MASK[7:0] 1 0 0 0 0 Function Port 2 Mask Value. rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 19.8. P2MASK: Port 2 Mask Register fo Selects P2 pins to be compared to the corresponding bits in P2MAT. 0: P2.n pin logic value is ignored and cannot cause a Port Mismatch event. 1: P2.n pin logic value is compared to P2MAT.n. de d Note: P2.2–P2.7 are available on 40-pin and 32-pin packages. 7 6 5 4 2 1 0 1 1 1 P2MAT[7:0] om Name Type 1 1 1 R/W 1 1 ec Reset Function Port 2 Match Value. n no P2MAT[7:0] tR SFR Address = 0xB1; SFR Page = 0x00 Bit Name 7:0 3 m Bit en SFR Definition 19.9. P2MAT: Port 2 Match Register Match comparison value used on Port 2 for bits in P2MAT which are set to 1. 0: P2.n pin logic value is compared with logic LOW. 1: P2.n pin logic value is compared with logic HIGH. IQ Ve rs io Note: P2.2–P2.7 are available on 40-pin and 32-pin packages. Rev. 1.2 181 C8051F55x/56x/57x 5 4 3 Name P3MASK[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xAF; SFR Page = 0x00 Bit Name P3MASK[7:0] 1 0 0 0 0 Function Port 1 Mask Value. rN 7:0 2 ig n 6 D es 7 ew Bit fo Selects P3 pins to be compared to the corresponding bits in P3MAT. 0: P3.n pin logic value is ignored and cannot cause a Port Mismatch event. 1: P3.n pin logic value is compared to P3MAT.n. de d Note: P3.0 is available on 40-pin and 32-pin packages. P3.1-P3.7 are available on 40-pin packages 6 5 4 2 1 0 1 1 1 P3MAT[7:0] om Name Type 1 1 1 R/W 1 1 ec Reset Function Port 3 Match Value. n no P3MAT[7:0] tR SFR Address = 0xAE; SFR Page = 0x00 Bit Name 7:0 3 m 7 en SFR Definition 19.11. P3MAT: Port 3 Match Register Bit Match comparison value used on Port 3 for bits in P3MAT which are set to 1. 0: P3.n pin logic value is compared with logic LOW. 1: P3.n pin logic value is compared with logic HIGH. IQ Ve rs io Note: P3.0 is available on 40-pin and 32-pin packages. P3.1-P3.7 are available on 40-pin packages 182 Rev. 1.2 s SFR Definition 19.10. P3MASK: Port 3 Mask Register C8051F55x/56x/57x 19.6. Special Function Registers for Accessing and Configuring Port I/O D es ig n s All Port I/O are accessed through corresponding special function registers (SFRs) that are both byte addressable and bit addressable, except for P4 which is only byte addressable. When writing to a Port, the value written to the SFR is latched to maintain the output data value at each pin. When reading, the logic levels of the Port's input pins are returned regardless of the XBRn settings (i.e., even when the pin is assigned to another signal by the Crossbar, the Port register can always read its corresponding Port I/O pin). The exception to this is the execution of the read-modify-write instructions that target a Port Latch register as the destination. The read-modify-write instructions when operating on a Port SFR are the following: ANL, ORL, XRL, JBC, CPL, INC, DEC, DJNZ and MOV, CLR or SETB, when the destination is an individual bit in a Port SFR. For these instructions, the value of the latch register (not the pin) is read, modified, and written back to the SFR. rN ew Ports 0–3 have a corresponding PnSKIP register which allows its individual Port pins to be assigned to digital functions or skipped by the Crossbar. All Port pins used for analog functions, GPIO, or dedicated digital functions such as the EMIF should have their PnSKIP bit set to 1. fo The Port input mode of the I/O pins is defined using the Port Input Mode registers (PnMDIN). Each Port cell can be configured for analog or digital I/O. This selection is required even for the digital resources selected in the XBRn registers, and is not automatic. The only exception to this is P4, which can only be used for digital I/O. 7 6 5 4 ec Bit om SFR Definition 19.12. P0: Port 0 m en de d The output driver characteristics of the I/O pins are defined using the Port Output Mode registers (PnMDOUT). Each Port Output driver can be configured as either open drain or push-pull. This selection is required even for the digital resources selected in the XBRn registers, and is not automatic. The only exception to this is the SMBus (SDA, SCL) pins, which are configured as open-drain regardless of the PnMDOUT settings. tR Name Type 1 1 2 1 0 1 1 1 1 P0[7:0] R/W 1 1 no Reset 3 io P0[7:0] Port 0 Data. Sets the Port latch logic value or reads the Port pin logic state in Port cells configured for digital I/O. 0: Set output latch to logic LOW. 1: Set output latch to logic HIGH. Read 0: P0.n Port pin is logic LOW. 1: P0.n Port pin is logic HIGH. IQ Ve rs 7:0 n SFR Address = 0x80; SFR Page = All Pages; Bit-Addressable Bit Name Description Write Rev. 1.2 183 C8051F55x/56x/57x 5 4 3 Name P0MDIN[7:0] Type R/W 1 Reset 1 1 1 1 SFR Address = 0xF1; SFR Page = 0x0F Bit Name P0MDIN[7:0] 1 1 1 0 1 Function Analog Configuration Bits for P0.7–P0.0 (respectively). rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 19.13. P0MDIN: Port 0 Input Mode de d fo Port pins configured for analog mode have their weak pull-up and digital receiver disabled. For analog mode, the pin also needs to be configured for open-drain mode in the P0MDOUT register. 0: Corresponding P0.n pin is configured for analog mode. 1: Corresponding P0.n pin is not configured for analog mode. 7 6 5 om Name 0 Reset 0 0 ec Type 4 m Bit en SFR Definition 19.14. P0MDOUT: Port 0 Output Mode 3 2 1 0 0 0 0 P0MDOUT[7:0] R/W 0 tR SFR Address = 0xA4; SFR Page = 0x0F Bit Name 0 Function These bits are ignored if the corresponding bit in register P0MDIN is logic 0. 0: Corresponding P0.n Output is open-drain. 1: Corresponding P0.n Output is push-pull. IQ Ve rs io n no 7:0 P0MDOUT[7:0] Output Configuration Bits for P0.7–P0.0 (respectively). 184 Rev. 1.2 C8051F55x/56x/57x 5 4 3 Name P0SKIP[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xD4; SFR Page = 0x0F Bit Name P0SKIP[7:0] 1 0 0 0 0 Function Port 0 Crossbar Skip Enable Bits. rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 19.15. P0SKIP: Port 0 Skip de d fo These bits select Port 0 pins to be skipped by the Crossbar Decoder. Port pins used for analog, special functions or GPIO should be skipped by the Crossbar. 0: Corresponding P0.n pin is not skipped by the Crossbar. 1: Corresponding P0.n pin is skipped by the Crossbar. 7 6 5 4 3 2 1 0 1 1 1 1 m Bit en SFR Definition 19.16. P1: Port 1 P1[7:0] om Name Type 1 1 1 1 ec Reset R/W 7:0 P1[7:0] tR SFR Address = 0x90; SFR Page = All Pages; Bit-Addressable Bit Name Description Write Port 1 Data. 0: P1.n Port pin is logic LOW. 1: P1.n Port pin is logic HIGH. IQ Ve rs io n no Sets the Port latch logic value or reads the Port pin logic state in Port cells configured for digital I/O. 0: Set output latch to logic LOW. 1: Set output latch to logic HIGH. Read Rev. 1.2 185 C8051F55x/56x/57x 5 4 3 Name P1MDIN[7:0] Type R/W 1 Reset 1 1 1 1 SFR Address = 0xF2; SFR Page = 0x0F Bit Name P1MDIN[7:0] 1 1 1 0 1 Function Analog Configuration Bits for P1.7–P1.0 (respectively). rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 19.17. P1MDIN: Port 1 Input Mode de d fo Port pins configured for analog mode have their weak pull-up and digital receiver disabled. For analog mode, the pin also needs to be configured for open-drain mode in the P1MDOUT register. 0: Corresponding P1.n pin is configured for analog mode. 1: Corresponding P1.n pin is not configured for analog mode. 7 6 5 om Name 0 Reset 0 0 ec Type 4 m Bit en SFR Definition 19.18. P1MDOUT: Port 1 Output Mode 3 2 1 0 0 0 0 P1MDOUT[7:0] R/W 0 tR SFR Address = 0xA5; SFR Page = 0x0F Bit Name 0 Function These bits are ignored if the corresponding bit in register P1MDIN is logic 0. 0: Corresponding P1.n Output is open-drain. 1: Corresponding P1.n Output is push-pull. IQ Ve rs io n no 7:0 P1MDOUT[7:0] Output Configuration Bits for P1.7–P1.0 (respectively). 186 Rev. 1.2 C8051F55x/56x/57x 5 4 3 Name P1SKIP[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xD5; SFR Page = 0x0F Bit Name P1SKIP[7:0] 1 0 0 0 0 Function Port 1 Crossbar Skip Enable Bits. rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 19.19. P1SKIP: Port 1 Skip de d fo These bits select Port 1 pins to be skipped by the Crossbar Decoder. Port pins used for analog, special functions or GPIO should be skipped by the Crossbar. 0: Corresponding P1.n pin is not skipped by the Crossbar. 1: Corresponding P1.n pin is skipped by the Crossbar. 7 6 5 4 3 2 1 0 1 1 1 1 m Bit en SFR Definition 19.20. P2: Port 2 P2[7:0] om Name Type 1 1 1 1 ec Reset R/W 7:0 P2[7:0] tR SFR Address = 0xA0; SFR Page = All Pages; Bit-Addressable Bit Name Description Write Port 2Data. 0: P2.n Port pin is logic LOW. 1: P2.n Port pin is logic HIGH. io n no Sets the Port latch logic value or reads the Port pin logic state in Port cells configured for digital I/O. 0: Set output latch to logic LOW. 1: Set output latch to logic HIGH. Read IQ Ve rs Note: P2.2-P2.7 are available on 40-pin and 32-pin packages. Rev. 1.2 187 C8051F55x/56x/57x 5 4 3 Name P2MDIN[7:0] Type R/W 1 Reset 1 1 1 1 SFR Address = 0xF3; SFR Page = 0x0F Bit Name P2MDIN[7:0] 1 1 1 0 1 Function Analog Configuration Bits for P2.7–P2.0 (respectively). rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 19.21. P2MDIN: Port 2 Input Mode en de Note: P2.2-P2.7 are available on 40-pin and 32-pin packages. d fo Port pins configured for analog mode have their weak pull-up and digital receiver disabled. For analog mode, the pin also needs to be configured for open-drain mode in the P2MDOUT register. 0: Corresponding P2.n pin is configured for analog mode. 1: Corresponding P2.n pin is not configured for analog mode. 7 6 5 om Bit 0 0 0 4 3 2 1 0 0 0 0 P2MDOUT[7:0] R/W 0 tR Reset ec Name Type m SFR Definition 19.22. P2MDOUT: Port 2 Output Mode SFR Address = 0xA6; SFR Page = 0x0F Bit Name 0 no Function These bits are ignored if the corresponding bit in register P2MDIN is logic 0. 0: Corresponding P2.n Output is open-drain. 1: Corresponding P2.n Output is push-pull. rs io n 7:0 P2MDOUT[7:0] Output Configuration Bits for P2.7–P2.0 (respectively). IQ Ve Note: P2.2-P2.7 are available on 40-pin and 32-pin packages. 188 Rev. 1.2 C8051F55x/56x/57x 5 4 3 Name P2SKIP[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xD6; SFR Page = 0x0F Bit Name P2SKIP[7:0] 1 0 0 0 0 Function Port 2 Crossbar Skip Enable Bits. rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 19.23. P2SKIP: Port 2 Skip de Note: P2.2-P2.7 are available on 40-pin and 32-pin packages. 5 m 6 4 Name 1 Reset 1 ec Type 1 3 2 1 0 1 1 1 1 P3[7:0] om 7 en SFR Definition 19.24. P3: Port 3 Bit d fo These bits select Port 2 pins to be skipped by the Crossbar Decoder. Port pins used for analog, special functions or GPIO should be skipped by the Crossbar. 0: Corresponding P2.n pin is not skipped by the Crossbar. 1: Corresponding P2.n pin is skipped by the Crossbar. R/W 1 Port 3 Data. no P3[7:0] Sets the Port latch logic value or reads the Port pin logic state in Port cells configured for digital I/O. io n 7:0 tR SFR Address = 0xB0; SFR Page = All Pages; Bit-Addressable Bit Name Description Write 0: Set output latch to logic LOW. 1: Set output latch to logic HIGH. Read 0: P3.n Port pin is logic LOW. 1: P3.n Port pin is logic HIGH. IQ Ve rs Note: P3.0 is available on 40-pin and 32-pin packages. P3.1-P3.7 are available on 40-pin packages Rev. 1.2 189 C8051F55x/56x/57x 5 4 3 Name P3MDIN[7:0] Type R/W 1 Reset 1 1 1 1 SFR Address = 0xF4; SFR Page = 0x0F Bit Name P3MDIN[7:0] 1 1 1 0 1 Function Analog Configuration Bits for P3.7–P3.0 (respectively). rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 19.25. P3MDIN: Port 3 Input Mode d fo Port pins configured for analog mode have their weak pull-up and digital receiver disabled. For analog mode, the pin also needs to be configured for open-drain mode in the P3MDOUT register. 0: Corresponding P3.n pin is configured for analog mode. 1: Corresponding P3.n pin is not configured for analog mode. en de Note: P3.0 is available on 40-pin and 32-pin packages. P3.1-P3.7 are available on 40-pin packages 7 6 5 om Bit 0 0 0 4 3 2 1 0 0 0 0 P3MDOUT[7:0] R/W 0 tR Reset ec Name Type m SFR Definition 19.26. P3MDOUT: Port 3 Output Mode SFR Address = 0xAE; SFR Page = 0x0F Bit Name 0 no Function These bits are ignored if the corresponding bit in register P3MDIN is logic 0. 0: Corresponding P3.n Output is open-drain. 1: Corresponding P3.n Output is push-pull. rs io n 7:0 P3MDOUT[7:0] Output Configuration Bits for P3.7–P3.0 (respectively). IQ Ve Note: P3.0 is available on 40-pin and 32-pin packages. P3.1-P3.7 are available on 40-pin packages 190 Rev. 1.2 C8051F55x/56x/57x 5 4 3 Name P3SKIP[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xD7; SFR Page = 0x0F Bit Name P3SKIP[7:0] 1 0 0 0 0 Function Port 3 Crossbar Skip Enable Bits. rN 7:0 2 ig n 6 D es 7 ew Bit s SFR Definition 19.27. P3SKIP: Port 3Skip fo These bits select Port 3 pins to be skipped by the Crossbar Decoder. Port pins used for analog, special functions or GPIO should be skipped by the Crossbar. 0: Corresponding P3.n pin is not skipped by the Crossbar. 1: Corresponding P3.n pin is skipped by the Crossbar. de d Note: P3.0 is available on 40-pin and 32-pin packages. P3.1-P3.7 are available on 40-pin packages 6 5 m 7 Name 1 Reset 1 ec Type 1 Port 4 Data. no P4[7:0] tR SFR Address = 0xB5; SFR Page = All Pages Bit Name Description Sets the Port latch logic value or reads the Port pin logic state in Port cells configured for digital I/O. io n 7:0 4 3 2 1 0 1 1 1 1 P4[7:0] om Bit en SFR Definition 19.28. P4: Port 4 R/W 1 Write 0: Set output latch to logic LOW. 1: Set output latch to logic HIGH. Read 0: P4.n Port pin is logic LOW. 1: P4.n Port pin is logic HIGH. IQ Ve rs Note: Port 4.0 is available on 40-pin packages. Rev. 1.2 191 C8051F55x/56x/57x 5 4 3 Name P4MDOUT[7:0] Type R/W 0 Reset 0 0 0 0 SFR Address = 0xAF; SFR Page = 0x0F Bit Name 2 1 0 0 Function 0: Corresponding P4.n Output is open-drain. 1: Corresponding P4.n Output is push-pull. IQ Ve rs io n no tR ec om m en de d fo Note: Port 4.0 is available on 40-pin packages. rN 7:0 P4MDOUT[7:0] Output Configuration Bits for P4.7–P4.0 (respectively). 192 Rev. 1.2 0 ig n 6 D es 7 ew Bit s SFR Definition 19.29. P4MDOUT: Port 4 Output Mode 0 C8051F55x/56x/57x 20. Local Interconnect Network (LIN0) ig n s Important Note: This chapter assumes an understanding of the Local Interconnect Network (LIN) protocol. For more information about the LIN protocol, including specifications, please refer to the LIN consortium (http://www.lin-subbus.org). D es LIN is an asynchronous, serial communications interface used primarily in automotive networks. The Silicon Laboratories LIN controller is compliant to the 2.1 Specification, implements a complete hardware LIN interface and includes the following features:  Selectable Master and Slave modes. Automatic baud rate option in slave mode.  The internal oscillator is accurate to within 0.5% of 24 MHz across the entire temperature range and for VDD voltages greater than or equal to the minimum output of the on-chip voltage regulator, so an external oscillator is not necessary for master mode operation for most systems. ew  fo rN Note: The minimum system clock (SYSCLK) required when using the LIN controller is 8 MHz. de d LIN Controller LIN Control Registers en LIN Data Registers 8051 MCU Core LIN0ADR LIN0DAT ec TX om m Indirectly Addressed Registers Figure 20.1. LIN Block Diagram io n no RX LIN0CF tR Control State Machine The LIN controller has four main components:  IQ Ve rs LIN Access Registers—Provide the interface between the MCU core and the LIN controller.  LIN Data Registers—Where transmitted and received message data bytes are stored.  LIN Control Registers—Control the functionality of the LIN interface.  Control State Machine and Bit Streaming Logic—Contains the hardware that serializes messages and controls the bus timing of the controller. Rev. 1.2 193 C8051F55x/56x/57x 20.1. Software Interface with the LIN Controller ig n s The selection of the mode (Master or Slave) and the automatic baud rate feature are done though the LIN0 Control Mode (LIN0CF) register. The other LIN registers are accessed indirectly through the two SFRs LIN0 Address (LIN0ADR) and LIN0 Data (LIN0DAT). The LIN0ADR register selects which LIN register is targeted by reads/writes of the LIN0DAT register. The full list of indirectly-accessible LIN registers is given in Table 20.4 on page 202. D es 20.2. LIN Interface Setup and Operation The hardware based LIN controller allows for the implementation of both Master and Slave nodes with minimal firmware overhead and complete control of the interface status while allowing for interrupt and polled mode operation. ew The first step to use the controller is to define the basic characteristics of the node: rN Mode—Master or Slave Baud Rate—Either defined manually or using the autobaud feature (slave mode only) fo Checksum Type—Select between classic or enhanced checksum, both of which are implemented in hardware. d 20.2.1. Mode Definition en 20.2.2. Baud Rate Options: Manual or Autobaud de Following the LIN specification, the controller implements in hardware both the Slave and Master operating modes. The mode is configured using the MODE bit (LIN0CF.6). m The LIN controller can be selected to have its baud rate calculated manually or automatically. A master node must always have its baud rate set manually, but slave nodes can choose between a manual or automatic setup. The configuration is selected using the ABAUD bit (LIN0CF.5). ec om Both the manual and automatic baud rate configurations require additional setup. The following sections explain the different options available and their relation with the baud rate, along with the steps necessary to achieve the required baud rate. 20.2.3. Baud Rate Calculations: Manual Mode no tR The baud rate used by the LIN controller is a function of the System Clock (SYSCLK) and the LIN timing registers according to the following equation: n SYSCLK baud_rate = --------------------------------------------------------------------------------------------------------------------( prescaler + 1 ) × divider × ( multiplier + 1 ) 2 IQ Ve rs io The prescaler, divider and multiplier factors are part of the LIN0DIV and LIN0MUL registers and can assume values in the following range: Table 20.1. Baud Rate Calculation Variable Ranges Factor Range prescaler 0…3 multiplier 0…31 divider 200…511 Important Note: The minimum system clock (SYSCLK) to operate the LIN controller is 8 MHz. Use the following equations to calculate the values for the variables for the baud-rate equation: 194 Rev. 1.2 C8051F55x/56x/57x ig n 1 -–1 × ------ln2 SYSCLK divider = -------------------------------------------------------------------------------------------------------------------------------------( prescaler + 1 ) (2 × ( multiplier + 1 ) × baud_rate ) ew In all of these equations, the results must be rounded down to the nearest integer. D es SYSCLK prescaler = ln -----------------------------------------------------------------------------------------------( multiplier + 1 ) × baud_rate × 200 s 20000 multiplier = ----------------------------- – 1 baud_rate ≅0 fo 20000 multiplier = ---------------- – 1 = 0.0417 19200 rN The following example shows the steps for calculating the baud rate values for a Master node running at 24 MHz and communicating at 19200 bits/sec. First, calculate the multiplier: d Next, calculate the prescaler: 1 - – 1 = 1.644 ≅ 1 × ------- de 24000000 prescaler = ln ----------------------------------------------------------( 0 + 1 ) × 19200 × 200 en Finally, calculate the divider: ln2 om m 24000000 divider = ----------------------------------------------------------------------- = 312.5 ≅ 312 (1 + 1) × ( 0 + 1 ) × 19200 2 These values lead to the following baud rate: tR ec 24000000 baud_rate = ---------------------------------------------------------------(1 + 1) × ( 0 + 1 ) × 312 2 ≅ 19230.77 The following code programs the interface in Master mode, using the Enhanced Checksum and enables the interface to operate at 19230 bits/sec using a 24 MHz system clock. = 0x80; |= 0x40; no LIN0CF LIN0CF // Activate the interface // Set the node as a Master IQ Ve rs io n LIN0ADR = 0x0D; // Point to the LIN0MUL register // Initialize the register (prescaler, multiplier and bit 8 of divider) LIN0DAT = ( 0x01 8 ); LIN0ADR = 0x0C; // Point to the LIN0DIV register LIN0DAT = (unsigned char)_0x138; // Initialize LIN0DIV LIN0ADR LIN0DAT = 0x0B; |= 0x80; LIN0ADR LIN0DAT = 0x08; = 0x0C; // Point to the LIN0SIZE register // Initialize the checksum as Enhanced // Point to LIN0CTRL register // Reset any error and the interrupt Table 20.2 includes the configuration values required for the typical system clocks and baud rates: Rev. 1.2 195 C8051F55x/56x/57x Table 20.2. Manual Baud Rate Parameters Examples 1 1 325 3 1 325 24.5 0 1 306 0 1 319 1 1 319 3 1 319 ig n 325 Div. 1 Pres. Pres. 0 D es Mult. 312 19 1 312 19 1 306 0 1 300 0 1 312 1 1 312 3 1 312 19 1 300 0 1 276 0 1 288 1 1 288 3 1 288 19 1 276 16 0 1 200 0 1 208 1 1 208 3 1 208 19 1 200 12.25 0 0 306 0 0 319 1 0 319 3 0 319 19 0 306 3 0 312 19 0 300 3 0 288 19 0 276 208 19 0 200 0 300 0 0 312 1 0 312 0 0 276 0 0 288 1 0 288 8 0 0 200 0 0 208 1 0 208 rN 0 3 0 d 12 11.0592 ew 24 22.1184 fo Div. Pres. 1 Div. Mult. 0 Div. 25 Div. Pres. 1K Mult. 4.8 K Pres. 9.6 K Mult. SYSCLK (MHz) 19.2 K Mult. 20 K s Baud (bits/sec) de 20.2.4. Baud Rate Calculations—Automatic Mode en If the LIN controller is configured for slave mode, only the prescaler and divider need to be calculated: 1 -–1 × ------ln2 om m SYSCLK prescaler = ln ------------------------4000000 tR ec SYSCLK divider = ---------------------------------------------------------------------( prescaler + 1 ) × 20000 2 The following example calculates the values of these variables for a 24 MHz system clock: 1 - – 1 = 1.585 ≅ 1 × ------- no 24000000 prescaler = ln -------------------------4000000 ln2 IQ Ve rs io n 24000000 divider = --------------------------------------------- = 300 (1 + 1) × 20000 2 Table 20.3 presents some typical values of system clock and baud rate along with their factors. 196 Rev. 1.2 C8051F55x/56x/57x Table 20.3. Autobaud Parameters Examples Prescaler Divider 25 1 312 24.5 1 306 16 1 200 12.25 0 306 0 300 0 276 8 0 200 rN 12 11.0592 ig n 300 276 D es 1 1 ew 24 22.1184 s System Clock (MHz) 20.3. LIN Master Mode Operation d fo The master node is responsible for the scheduling of messages and sends the header of each frame containing the SYNCH BREAK FIELD, SYNCH FIELD, and IDENTIFIER FIELD. The steps to schedule a message transmission or reception are listed below. de 1. Load the 6-bit Identifier into the LIN0ID register. en 2. Load the data length into the LIN0SIZE register. Set the value to the number of data bytes or "1111b" if the data length should be decoded from the identifier. Also, set the checksum type, classic or enhanced, in the same LIN0SIZE register. m 3. Set the data direction by setting the TXRX bit (LIN0CTRL.5). Set the bit to 1 to perform a master transmit operation, or set the bit to 0 to perform a master receive operation. om 4. If performing a master transmit operation, load the data bytes to transmit into the data buffer (LIN0DT1 to LIN0DT8). tR ec 5. Set the STREQ bit (LIN0CTRL.0) to start the message transfer. The LIN controller will schedule the message frame and request an interrupt if the message transfer is successfully completed or if an error has occurred. This code segment shows the procedure to schedule a message in a transmission operation: no = 0x08; |= 0x20; = 0x0E; = 0x11; = 0x0B; = ( LIN0DAT & 0xF0 ) | io n LIN0ADR LIN0DAT LIN0ADR LIN0DAT LIN0ADR LIN0DAT IQ Ve rs LIN0ADR = 0x00; for (i=0; i