EM3588-M-AN-C-K

TS8 EMBER® EM3 X M ODULE TECHNICAL SPECIFICATION Silicon Labs’ EM3x development kits contain various modules designed around the EM3x family of ICs. All of these modules are designed and sold by Silicon Labs’ module partners Telegesis (UK) Limited and California Eastern Laboratories (CEL). The module designs allow them to be integrated into any product without the need for RF experience and expertise. Utilizing stacks such as Silicon Labs’ certified ZigBee network stack EmberZNet, these modules enable a developer to add powerful wireless networking capability to products and quickly bring them to market. This document provides the technical specification of the EM3x modules on its Silicon Labs-specific carrier board. For more information on the other Telegesis modules, contact Telegesis, Ltd directly at www.telegesis.com. For more information on other CEL modules, contact CEL directly at meshconnect.cel.com. New in This Revision Added CEL CE compliance information. Contents 1 EM3x Module Definitions................................................................................................................................. 2 2 EM3x Module Features ................................................................................................................................... 3 3 Performance Characteristics ........................................................................................................................... 3 4 EM3x Configurations ....................................................................................................................................... 5 5 Mechanical Details .......................................................................................................................................... 7 5.1 Rev 1.4 EM3x Module Interface Connector ........................................................................................................... 8 Copyright © 2015 by Silicon Laboratories TS8 TS8 1 EM3x Module Definitions To accommodate the requirements of the different markets, Telegesis and CEL have developed a series of pincompatible modules based on the Ember EM341, EM346, EM357, and EM3588 chipsets. Table 1 defines the Telegesis, CEL, and Silicon Labs part numbers for each module as well as describes the differences (Power Amplifier (PA), Low Noise Amplifier (LNA), and RF connection) between each module. Table 1. Silicon Labs and Module Partner Part Numbers RF Connection PA / LNA? (Long Range) ZICM341SP0-1 Antenna No ZICM341SP0-1C Connector No ZICM346SP0-1 Antenna No ZICM346SP0-1C Connector No ETRX357 SMT Antenna No ETRX357HR Mini-RF Connector No ETRX357HR-LRS Mini-RF Connector Yes Telegesis ETRX357-LRS SMT Antenna Yes CEL ZICM357SP0-1 SMT Antenna No EM357 CEL ZICM357SP0-1C Mini-RF Connector No EM357 CEL ZICM357SP2-1C Mini-RF Connector Yes EM357-MOD-LR-ANT-C EM357 CEL ZICM357SP2-1 SMT Antenna Yes EM3588-M-AN-C EM3588 CEL ZICM3588SP0-1 SMT Antenna No 110-0735-000 EM3588-MOD-RF-C EM3588 CEL ZICM3588SP0-1C Mini-RF Connector No 110-0736-000 EM3588-MLR-RF-C EM3588 CEL ZICM3588SP2-1C Mini-RF Connector Yes 110-0737-000 EM3588-MLR-AN-C EM3588 CEL ZICM3588SP2-1 SMT Antenna Yes Silicon Labs P/N Silicon Labs Orderable Part Number (OPN) EM3x IC Module Partner 110-0740-000 EM341-MOD-ANT-C EM341 CEL 110-0741-000 EM341-MOD-RF-C EM341 CEL 110-0742-000 EM346-MOD-ANT-C EM346 CEL 110-0743-000 EM346-MOD-RF-C EM346 CEL 110-0720-000 EM357-MOD-ANT-T EM357 Telegesis 110-0721-000 EM357-MOD-RF-T EM357 Telegesis 110-0722-000 EM357-MOD-LR-RF-T EM357 Telegesis 110-0723-000 EM357-MOD-LR-ANT-T EM357 110-0730-000 EM357-MOD-ANT-C EM357 110-0731-000 EM357-MOD-RF-C 110-0732-000 EM357-MOD-LR-RF-C 110-0733-000 110-0734-000 Module Partner P/N (Module only) All of these modules are available from Telegesis and CEL. Silicon Labs provides the CEL EM357 and EM3588 module types with the EM35x Development Kit (part number EM35X-DEV) and the EM341 and EM346 modules with the EM34x Development Kit (part number EM34X-DEV). For modules whose RF connection is a mini-RF connector, an RF adapter cable (Tyco/Amp part number 20324401) can be used to interface the module to external test equipment. One of these RF adapter cables is included with the development kits. To connect to the EM35x breakout board (Silicon Labs P/N: 130-0680-000), each module shown in Table 1 is soldered to a small carrier board. The carrier board connector is discussed in section 5.1, EM3x Module Interface Connector. 2 Rev. 1.4 TS8 2 EM3x Module Features Module features: • • • • • • • • Small form factor, SMT module (25 mm x 19 mm) Side castellation for easy soldering and inspection Industry standard JTAG Programming and real-time network level debugging via the Packet Trace Port. Wide supply voltage range (2.1 to 3.6 V) Low sleep current (< 1 µA for EM35x and EM34x, < 2 µA for EM3588) Access to all EM3x GPIO from the System-on-Chip (SoC) Access to either a U.FL RF Connector or a SMT antenna allows flexibility in antenna selection process FCC compliance Telegesis: FCC ID: S4GEM35XA CEL: • FCC ID: W7Z-ZICM357SPO FCC ID: W7Z-ZICM357SP2 CE compliance Telegesis: Radio: EN300 328 v1.7.1 EMC: EN301 489-17 v2.1.1 Safety: EN60950-1 CEL • Radio: EN 300 328 V1.8.1 (2006 ‐ 2012) EMC: EN 301 489‐1 V1.8.1, V1.9.1 EN 301 489‐17 V2.2.1 Long Range versions with a link budget of up to 124 dB Module with carrier board features: • • • Access to the Packet Trace Port connector (allows for direct connection to the Ember Debug Adapter (ISA3) for programming and debugging) Two debug LEDs Access to all EM3x GPIO through a robust 0.05” pitch connector 3 Performance Characteristics This section describes the characteristics of the module with carrier board. For more information on the EM35x and EM34x SoC performance, refer to the EM35x, EM358x, EM341 and EM346 data sheets. Unless specified, the data within each of the tables was gathered at room temperature (25 °C) and 3.0 V source potential. Table 2 summarizes the recommended operating conditions for the modules. Table 2. Recommended Operating Conditions for the EM3x Module Parameter Min Typ Max Unit VDD supply 2.1 — 3.6 V RF Input Frequency 2405 — 2480 MHz RF Input Power (at RF Port) — — 0 dBm Operating Temperature Range -40 — 85 °C Rev. 1.4 3 TS8 Table 3 summarizes the DC characteristics at 25 °C and VDD of 3 V of the EM3x Module. Table 3. DC Characteristics of the EM3x Module Parameter Min Typ Max Unit VDD supply 2.1 — 3.6 V Sleep Current (RC oscillator) — 0.4 — µA TX, Normal Mode, +3 dBm — 31 — mA TX, Boost Mode, +8 dBm — 39 — mA TX, Normal Mode, 0 dBm — 28.5 — RX, Normal Mode — 26 — mA RX, Boost Mode Active Current (TX) Active Current (RX) — 27 — mA Wake Time from Deep Sleep — 100 — us Shutdown Time — 5 — us Table 4 summarizes the digital I/Os at VCC = 3 V and 25 °C of the EM3x Module. Table 4. Digital I/O Characteristics of the EM3x Module Parameter Min Typ Max Unit Schmitt threshold (high to low) 0.42 x VDD — 0.5 x VDD V Schmitt threshold (low to high) 0.62 x VDD — 0.8 x VDD V Logic Low — — -0.5 µA Logic High — — 0.5 µA Output Voltage — — — Logic Low 0 — 0.18 x VDD V Logic High 0.82 x VDD — VDD V Source, Standard Pad — — 4 mA Sink, Standard Pad — — 4 mA Source, High Current Pad — — 8 mA Sink, High Current Pad — — 8 mA Total Output Current — — 40 mA Input Logic Threshold Input Current Output Current 4 Rev. 1.4 TS8 Table 5 summarizes the RF parameters of the EM3x Module. Table 5. RF Characteristics of the EM3x Module Parameter Min Typ Max Unit Frequency Range 2405 — 2480 MHz Channel Spacing — 5 — MHz Normal Mode — -100 -94 dBm Boost Mode — -101 -95 dBm — 35 — dB RX Sensitivity (1% PER, 20-byte packet) Adjacent Channel Rejection High Side Low Side — 35 — dB 2nd High Side — 43 — dB 2nd Low Side — 43 — dB All other channels — 40 — dB Boost Mode — 8 — dBm Normal Mode — 3 — dBm — 5 15 % Relative -20 — — dB Absolute -30 — — dBm TX Power (Maximum) Error Vector Magnitude (Offset EVM) (per IEEE 802.15.4-2003) PSD (3.5 MHz from carrier) 4 EM3x Configurations The IC on the EM3x Module can be set to different RF frequency channels as well as different power levels. When using the nodetest application on the module, the frequency channels and output power levels can be configured through a command line interface (CLI). In order to configure the output power, the setTXPower command can be used. Table 6 demonstrates the setTXPower command and the expected power output. Note that these are the typical expected power output levels based on the performance of the EM3x IC and actual results are dependent on the module provider design implementation. Note: Table 6 refers to the non-PA versions of the modules. For the version with a PA, the output power should be set to -5 dBm in order to achieve +20 dBm output power. Table 6: List of TX output powers when using SetTxPower SetTxPower [signed hexadecimal] Output Power (dBm) SetTxPower 9 +3 SetTxPower 8 +8 SetTxPower 7 +7 SetTxPower 6 +6 SetTxPower 5 +5 Rev. 1.4 5 TS8 SetTxPower [signed hexadecimal] 6 Output Power (dBm) SetTxPower 4 +4 SetTxPower 3 +3 SetTxPower 2 +2 SetTxPower 1 +1 SetTxPower 0 0 SetTxPower -1 -1 SetTxPower -2 -2 SetTxPower -3 -3 SetTxPower -4 -4 SetTxPower -5 -5 SetTxPower -6 -6 SetTxPower -7 -7 SetTxPower -8 -8 SetTxPower -9 -9 SetTxPower –a -9 SetTxPower –b -11 SetTxPower –c -12 SetTxPower –d -12 SetTxPower –e -14 SetTxPower –f -14 SetTxPower -10 -14 SetTxPower -11 -17 SetTxPower -12 -17 SetTxPower -13 -17 SetTxPower -14 -20 SetTxPower -15 -20 SetTxPower -16 -20 SetTxPower -17 -20 Rev. 1.4 TS8 To change the channel, the setChannel command can be used (assuming nodetest application is on the device). Table 7 lists the valid parameters to be used with setChannel command. Table 7: List of setChannel values for EM3x setChannel (decimal) Center Frequency (GHz) radioChannel (decimal) Center Frequency (GHz) 11 2.405 19 2.445 12 2.410 20 2.450 13 2.415 21 2.455 14 2.420 22 2.460 15 2.425 23 2.465 16 2.430 24 2.470 17 2.435 25 2.475 18 2.440 26 2.480 5 Mechanical Details Figure 1 illustrates the ZICM35x Module carrier board from CEL, while Figure 2 illustrates the ETRX35x Module from Telegesis on a carrier board. Figure 1. CEL ZICM35x Module Carrier Board Rev. 1.4 7 TS8 LED2 20 32.768kHz 33 ETRX35x Module 22 mm Packet Trace Port 19 1 LED1 37.5 mm Figure 2. Telegesis ETRX35x Module with Carrier Board 5.1 EM3x Module Interface Connector EM35x_PB5 EM35x_PB6 EM35x_PB7 EM35x_PC0 EM35x_PC1 EM35x_PB0 EM35x_PC4 EM35x_PC3 EM35x_PC2 JCLK GND 29 28 27 26 25 24 23 22 21 20 10 11 12 13 14 15 16 17 18 19 EM35x_PA2 EM35x_PA3 GND EM35x_PA4 EM35x_PA5 EM35x_PA6 EM35x_PB1 EM35x_PB2 GND EM35x_PB4 EM35x_PA1 8 EM35x_PA0 GND 7 nRESET 30 VDD_3V_MOD 31 6 EM35x_PB3 9 GND 33 32 4 5 EM35x_PA7 3 EM35x_PC6 EM35x_PC7 1 2 GND EM35x_PC5 Two single-row, 0.05” pitch, connectors make up the EM3x module interface to the EM35x breakout board. In addition, two single-row, guide connectors on the EM35x breakout board assist with connecting the EM3x module to the breakout board. The board-to-board connector scheme allows access to all EM3x GPIO as well as nRESET and the JCLK signals. The connector is illustrated in Figure 3, while the connector dimensions are listed in Figure 4. Figure 3. Board-to-board connector for the EM3x module (top view) 8 Rev. 1.4 TS8 Figure 4. Board-to-Board Connector Dimensions for the EM3x Module (top view) Table 8 describes the pinout and signal names on the connector. For more information on the alternate functions of the GPIO connector, refer to the EM35x Data Sheet. Table 8. Pinout and Signal Names of the Interface Connector Signal name Direction1 Description 1 GND Power Ground Connection 2 PC5 I/O EM3x GPIO 3 PC6 I/O EM3x GPIO 4 PC7 I/O EM3x GPIO 5 PA7 I/O EM3x GPIO 6 PB3 I/O EM3x GPIO 7 nRESET I/O Active low chip reset (internal pull-up on EM3x) 8 PB4 I/O EM3x GPIO 9 PA0 I/O EM3x GPIO Pin # 10 PA1 I/O EM3x GPIO 11 PA2 I/O EM3x GPIO 12 PA3 I/O EM3x GPIO 13 GND Power Ground Connection 14 PA4 I/O EM3x GPIO 15 PA5 I/O EM3x GPIO 16 PA6 I/O EM3x GPIO (NC on EM346 module) 17 PB1 I/O EM3x GPIO 18 PB2 I/O EM3x GPIO 19 GND Power Ground connection 20 GND Power Ground connection 21 JCLK Input JTAG interface, serial clock 22 PC2 I/O EM3x GPIO 23 PC3 I/O EM3x GPIO Rev. 1.4 9 TS8 Signal name Direction1 Description 24 PC4 I/O EM3x GPIO 25 PB0 I/O EM3x GPIO 26 PC1 I/O EM3x GPIO 27 PC0 I/O EM3x GPIO 28 PB7 I/O EM3x GPIO (NC on EM346 module) 29 PB6 I/O EM3x GPIO (NC on EM346 module) 30 PB5 I/O EM3x GPIO (NC on EM346 module) 31 GND Power Ground connection 32 VDD Power 2.1 to 3.6 V Module Power Domain 33 GND Power Ground connection Pin # 1 with respect to the EM3x Module 10 Rev. 1.4 TS8 CONTACT INFORMATION Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 Tel: 1+(512) 416-8500 Fax: 1+(512) 416-9669 Toll Free: 1+(877) 444-3032 For additional information please visit the Silicon Labs Technical Support page: http://www.silabs.com/support/Pages/default.aspx Patent Notice Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size, analog-intensive mixed-signal solutions. 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Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders. Rev. 1.4 11