®
SP3222EB/3232EB
True +3.0V to +5.5V RS-232 Transceivers
FEATURES ■ Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply ■ 250kbps Transmission Rate Under Load ■ 1µA Low-Power Shutdown with Receivers Active (SP3222EB) ■ Interoperable with RS-232 down to +2.7V power source ■ Enhanced ESD Specifications: ±15kV Human Body Model ±15kV IEC1000-4-2 Air Discharge ±8kV IEC1000-4-2 Contact Discharge
C1+ 1 V+ 2 C1C2+ C2VT2OUT R2IN 3 4 5 6 7 8 16 VCC 15 GND 14 T1OUT SP3232EB 13 R1IN 12 R1OUT 11 T1IN 10 9 T2IN R2OUT
Now Available in Lead Free Packaging
DESCRIPTION The SP3222EB/3232EB series is an RS-232 transceiver solution intended for portable or hand-held applications such as notebook or palmtop computers. The SP3222EB/3232EB series has a high-efficiency, charge-pump power supply that requires only 0.1µF capacitors in 3.3V operation. This charge pump allows the SP3222EB/3232EB series to deliver true RS232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3222EB/ 3232EB are 2-driver/2-receiver devices. This series is ideal for portable or hand-held applications such as notebook or palmtop computers. The ESD tolerance of the SP3222EB/ 3232EB devices are over ±15kV for both Human Body Model and IEC1000-4-2 Air discharge test methods. The SP3222EB device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1µA. SELECTION TABLE
MODEL SP3222EB SP3232EB Power Supplies +3.0V to +5.5V +3.0V to +5.5V RS-232 Drivers 2 2 RS-232 Receivers 2 2 External Components 4 4 Shutdown Yes No TTL 3-State Ye s No No. of Pins 18, 20 16
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
1
ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. VCC ...................................................... -0.3V to +6.0V V+ (NOTE 1) ...................................... -0.3V to +7.0V V- (NOTE 1) ....................................... +0.3V to -7.0V V+ + |V-| (NOTE 1) ........................................... +13V ICC (DC VCC or GND current) ......................... ±100mA Input Voltages TxIN, EN ............................................ -0.3V to +6.0V RxIN .................................................................. ±25V
Output Voltages TxOUT ........................................................... ±13.2V RxOUT ..................................... -0.3V to (VCC + 0.3V) Short-Circuit Duration TxOUT .................................................... Continuous Storage Temperature ...................... -65°C to +150°C
20-pin SSOP (derate 9.25mW/oC above +70oC) ........ 750mW 18-pin PDIP (derate 15.2mW/oC above +70oC) ....... 1220mW 18-pin SOIC (derate 15.7mW/oC above +70oC) ....... 1260mW 20-pin TSSOP (derate 11.1mW/oC above +70oC) ...... 890mW 16-pin SSOP (derate 9.69mW/oC above +70oC) ........ 775mW 16-pin PDIP (derate 14.3mW/oC above +70oC) ....... 1150mW 16-pin Wide SOIC (derate 11.2mW/oC above +70oC) .... 900mW 16-pin TSSOP (derate 10.5mW/oC above +70oC) ...... 850mW 16-pin nSOIC (derate 13.57mW/°C above +70°C) ...... 1086mW
Power Dissipation Per Package
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. NOTE 2: Driver Input hysteresis is typically 250mV.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX, C1 to C4=0.1µF PARAMETER DC CHARACTERISTICS Supply Current Shutdown Supply Current LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW Input Logic Threshold HIGH Input Leakage Current Output Leakage Current Output Voltage LOW Output Voltage HIGH DRIVER OUTPUTS Output Voltage Swing Output Resistance Output Short-Circuit Current Output Leakage Current ±5.0 300 ±35 ±60 ±25 mA µA ±5.4 V 3k load to ground at all driver outputs, TAMB = +25°C VCC = V+ = V- = 0V, TOUT = +2V VOUT = 0V VOUT = ±12V,VCC= 0V, or 3.0V to 5.5V, drivers disabled VCC-0.6 VCC-0.1 GND 2.0 2.4 ±0.01 ±0.05 0.8 VCC ±1.0 ±10 0.4 V V V µA µA V V TxIN, EN, SHDN, Note 2 VCC = 3.3V, Note 2 VCC = 5.0V, Note 2 TxIN, EN, SHDN, TAMB = +25°C, VIN = 0V to VCC receivers disabled, VOUT = 0V to VCC IOUT = 1.6mA IOUT = -1.0mA 0.3 1.0 1.0 10 mA µA no load, TAMB = +25°C, VCC = 3.3V, TxIN = VCC or GND SHDN = GND, TAMB = +25°C, VCC = +3.3V, TxIN = VCC or GND MIN. TYP. MAX. UNITS CONDITIONS
Date:11/02/05
Date:02/27/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers 2
© Copyright 2005 Sipex Corporation
© Copyright 2005 Sipex Corporation
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX , C1 to C4=0.1µF. Typical Values apply at VCC = +3.3V or +5.5V and TAMB = 25oC.
PARAMETER RECEIVER INPUTS Input Voltage Range Input Threshold LOW Input Threshold HIGH Input Hysteresis Input Resistance TIMING CHARACTERISTICS Maximum Data Rate Receiver Propagation Delay Receiver Output Enable Time Receiver Output Disable Time Driver Skew Receiver Skew Transition-Region Slew Rate
MIN.
TYP.
MAX.
UNITS
CONDITIONS
-25 0. 6 0.8 1.2 1.5 1.5 1.8 0. 3 3 5
+25
V V VCC=3.3V VCC=5.0V VCC=3.3V VCC=5.0V
2 .4 2 .4
V V
7
k
250 0 .1 5 0 .1 5 20 0 20 0 10 0 50 30
kbps µs ns ns ns ns V/µs
RL=3k , CL=1000pF, one driver switching tPHL, RxIN to RxOUT, CL=150pF tPLH, RxIN to RxOUT, CL=150pF
| tPHL - tPLH |, TAMB = 25oC | tPHL - tPLH | VCC = 3.3V, RL = 3K , TAMB = 25oC, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V
Date:11/02/05
Date: 02/27/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
© Copyright 2005 Sipex Corporation
3
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rates, all drivers loaded with 3k , 0.1µF charge pump capacitors, and TAMB = +25°C.
6 4
TxOUT +
TYPICAL PERFORMANCE CHARACTERISTICS
30 25
- Slew + Slew
Transmitter Output Voltage (V)
2 0 -2 -4 -6 0
TxOUT T1 at 250Kbps T2 at 15.6Kbps All TX loaded 3K // CLoad
Slew rate (V/µs)
20 15 10 5
T1 at 250Kbps T2 at 15.6Kbps All TX loaded 3K // CLoad
1000
2000
3000
4000
5000
0
0
500
1000
2000
3000
4000
5000
Load Capacitance (pF)
Load Capacitance (pF)
Figure 1. Transmitter Output Voltage vs Load Capacitance.
Figure 2. Slew Rate vs Load Capacitance.
35
All TX loaded 3K // CLoad 125Kbps 20Kbps
Supply Current (mA)
30
Supply Current (mA)
T1 at Full Data Rate T2 at 1/16 Data Rate
16
250Kbps
14 12 10 8 6 4 2 0
1 Transmitter at 250Kbps 1 Transmitter at 15.6Kbps All transmitters loaded with 3K // 1000pf
25 20 15 10 5 0 0
1000
2000
3000
4000
5000
2.7
3
3.5
4
4.5
5
Load Capacitance (pF)
Supply Voltage (V)
Figure 3. Supply Current vs Load Capacitance when Transmitting Data.
Figure 4. Supply Current vs Supply Voltage.
6
TxOUT +
Transmitter Output Voltage (V)
4 2 0 -2 -4 -6 2.7 3 3.5
TxOUT T1 at 250Kbps T2 at 15.6Kbps All TX loaded 3K // 1000 pF
4
4.5
5
Supply Voltage (V)
Figure 5. Transmitter Output Voltage vs Supply Voltage.
Date:11/02/05
Date:02/27/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
© Copyright 2005 Sipex Corporation
4
PIN DESCRIPTION
PIN NUMBER NAME FUNCTION SP3222EB DIP/SO EN C1+ V+ C1C2+ C2VT1OUT T2OUT R1IN R2IN R1OUT R2OUT T1IN T2IN GND VCC SHDN N.C. Receiver Enable. Apply logic LOW for normal operation. Apply logic HIGH to disable the receiver outputs (high-Z state). Positive terminal of the voltage doubler charge-pump capacitor. +5.5V generated by the charge pump. Negative terminal of the voltage doubler charge-pump capacitor. Positive terminal of the inverting charge-pump capacitor. Negative terminal of the inverting charge-pump capacitor. -5.5V generated by the charge pump. RS-232 driver output. RS-232 driver output. RS-232 receiver input. RS-232 receiver input. TTL/CMOS reciever output. TTL/CMOS reciever output. TTL/CMOS driver input. TTL/CMOS driver input. Ground. +3.0V to +5.5V supply voltage Shutdown Control Input. Drive HIGH for normal device operation. Drive LOW to shutdown the drivers (high-Z output) and the onboard power supply. No Connect. 1 2 3 4 5 6 7 15 8 14 9 13 10 12 11 16 17 18 SSOP TSSOP 1 2 3 4 5 6 7 17 8 16 9 15 10 13 12 18 19 20 11, 14 SP3232EB
1 2 3 4 5 6 14 7 13 8 12 9 11 10 15 16 -
Table 1. Device Pin Description
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
5
EN V+ C1C2+ C2VT2OUT R2IN
1 3 4 5 6 7 8 9
20 SHDN 19 VCC 18 GND 17 SP3222EB 16 14 T1OUT R1IN N.C.
C1+ 2
EN V+ C1C2+ C2VT2OUT R2IN
1 3 4 5 6 7 8 9 DIP/SO
18 SHDN 17 VCC 16 GND 15 SP3222EB 14 T1OUT R1IN
C1+ 2
15 R1OUT
13 R1OUT 12 T1IN 11 T2IN 10 R2OUT
13 T1IN 12 T2IN 11 N.C.
R2OUT 10
SSOP/TSSOP
Figure 6. Pinout Configurations for the SP3222EB
C1+ 1 V+ 2 C1C2+ C2VT2OUT R2IN 3 4 5 6 7 8
16 VCC 15 GND 14 T1OUT SP3232EB 13 R1IN 12 R1OUT 11 T1IN 10 9 T2IN R2OUT
Figure 7. Pinout Configuration for the SP3232EB
Date:11/02/05
Date:02/27/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
6
© Copyright 2005 Sipex Corporation
© Copyright 2005 Sipex Corporation
VCC C5 C1 + + 0.1µF 2 C1+ 0.1µF 4 C15 C2+ 0.1µF 6 C213 T1IN 12 T2IN 15 R1OUT LOGIC OUTPUTS 5k 10 R2OUT 5k 1 EN GND 18 SHDN 20 *can be returned to either VCC or GND R2IN 9 19 VCC V+
+ +
VCC C5 0.1µF 2 C1+ 0.1µF 4 C15 C2+ 0.1µF 6 C212 T1IN 11 T2IN 13 R1OUT LOGIC OUTPUTS 5k 10 R2OUT 5k 1 EN GND 16 SHDN 18 *can be returned to either VCC or GND R2IN 9 17 VCC V+
3 *C3 7 C4 17 8
+
0.1µF
3 *C3 7 C4 15 8
C1
+
0.1µF
C2
+
SP3222EB SSOP TSSOP
V-
+
0.1µF
C2
+
SP3222EB DIP/SO
V-
+
0.1µF
LOGIC INPUTS
T1OUT T2OUT
RS-232 OUTPUTS
LOGIC INPUTS
T1OUT T2OUT
RS-232 OUTPUTS
R1IN
16 RS-232 INPUTS
R1IN
14 RS-232 INPUTS
Figure 8. SP3222EB Typical Operating Circuits
VCC C5 C1 + + 0.1µF 1 C1+ 0.1µF 3 C14 C2+ 0.1µF 5 C211 T1IN 10 T2IN 12 R1OUT LOGIC OUTPUTS 5k 9 R2OUT 5k R2IN 8 T1OUT T2OUT 14 7 16 VCC V+
2 *C3 6 C4
+
0.1µF
C2
+
SP3232EB
V-
+
0.1µF
LOGIC INPUTS
RS-232 OUTPUTS
R1IN
13 RS-232 INPUTS
GND 15 *can be returned to either VCC or GND
Figure 9. SP3232EB Typical Operating Circuit
Date:11/02/05
Date: 02/27/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
© Copyright 2005 Sipex Corporation
DESCRIPTION The SP3222EB/3232EB transceivers meet the EIA/TIA-232 and V.28/V.24 communication protocols and can be implemented in batterypowered, portable, or hand-held applications such as notebook or palmtop computers. The SP3222EB/3232EB devices all feature Sipex's proprietary on-board charge pump circuitry that generates 2 x VCC for RS-232 voltage levels from a single +3.0V to +5.5V power supply. This series is ideal for +3.3V-only systems, mixed +3.3V to +5.5V systems, or +5.0V-only systems that require true RS-232 performance. The SP3222EB/3232EB series have drivers that operate at a typical data rate of 250kbps fully loaded. The SP3222EB and SP3232EB are 2-driver/2receiver devices ideal for portable or hand-held applications. The SP3222EB features a 1µA shutdown mode that reduces power consumption and extends battery life in portable systems. Its receivers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1µA supply current. THEORY OF OPERATION The SP3222EB/3232EB series are made up of three basic circuit blocks: 1. Drivers, 2. Receivers, and 3. the Sipex proprietary charge pump. Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to ±5.0V EIA/TIA-232 levels inverted relative to the input logic levels. Typically, the RS-232 output voltage swing is ±5.5V with no load and at least ±5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. Driver outputs will meet EIA/TIA-562 levels of ±3.7V with supply voltages as low as 2.7V.
Date:11/02/05
The drivers can guarantee a data rate of 250kbps fully loaded with 3K in parallel with 1000pF, ensuring compatibility with PC-to-PC communication software. The slew rate of the driver output is internally limited to a maximum of 30V/µs in order to meet the EIA standards (EIA RS-232D 2.1.7, Paragraph 5). The transition of the loaded output from HIGH to LOW also meets the monotonicity requirements of the standard. Figure 10 shows a loopback test circuit used to the RS-232 drivers. Figure 11 shows the test results of the loopback circuit with all drivers active at 120kbps with RS-232 loads in parallel with 1000pF capacitors. Figure 12 shows the test results where one driver was active at 250kbps and all drivers loaded with an RS-232 receiver in parallel with a 1000pF capacitor. A solid RS-232 data transmission rate of 250kbps provides compatibility with many designs in personal computer peripherals and LAN applications. The SP3222EB driver's output stages are turned off (tri-state) when the device is in shutdown mode. When the power is off, the SP3222EB device permits the outputs to be driven up to ±12V. The driver's inputs do not have pull-up resistors. Designers should connect unused inputs to VCC or GND. In the shutdown mode, the supply current falls to less than 1µA, where SHDN = LOW. When the SP3222EB device is shut down, the device's driver outputs are disabled (tri-stated) and the charge pumps are turned off with V+ pulled down to VCC and V- pulled to GND. The time required to exit shutdown is typically 100µs. Connect SHDN to VCC if the shutdown mode is not used.
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
VCC C5 C1 + + 0.1µF 0.1µF C1+ C1C2 + C2+ 0.1µF C2TxIN TxOUT
VCC V+ C3 + 0.1µF
SP3222EB SP3232EB
VC4 + 0.1µF
LOGIC INPUTS LOGIC OUTPUTS
RxOUT 5k EN* GND
RxIN
*SHDN
VCC
1000pF * SP3222EB only
Figure 10. SP3222EB/3232EB Driver Loopback Test Circuit
Figure 11. Driver Loopback Test Results at 120kbps
Figure 12. Driver Loopback Test Results at 250 kbps
Date:11/02/05
Date: 02/27/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
9
© Copyright 2005 Sipex Corporation
Receivers The receivers convert EIA/TIA-232 levels to TTL or CMOS logic output levels. The SP3222EB receivers have an inverting tri-state output. These receiver outputs (RxOUT) are tristated when the enable control EN = HIGH. In the shutdown mode, the receivers can be active or inactive. EN has no effect on TxOUT. The truth table logic of the SP3222EB driver and receiver outputs can be found in Table 2. Since receiver input is usually from a transmission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines. Should an input be left unconnected, a 5k pulldown resistor to ground will commit the output of the receiver to a HIGH state. Charge Pump The charge pump is a Sipex–patented design (5,306,954) and uses a unique approach compared to older less–efficient designs. The charge pump still requires four external capacitors, but uses a four–phase voltage shifting technique to attain symmetrical 5.5V power supplies. The internal power supply consists of a regulated dual charge pump that provides output voltages 5.5V regardless of the input voltage (VCC) over the +3.0V to +5.5V range. In most circumstances, decoupling the power supply can be achieved adequately using a 0.1µF bypass capacitor at C5 (refer to Figures 8 and 9). SHDN 0 0 1 1 EN 0 1 0 1 TxOUT Tri-state Tri-state Active Active RxOUT Active Tri-state Active Tri-state
In applications that are sensitive to power-supply noise, decouple VCC to ground with a capacitor of the same value as charge-pump capacitor C1. Physically connect bypass capacitors as close to the IC as possible. The charge pumps operate in a discontinuous mode using an internal oscillator. If the output voltages are less than a magnitude of 5.5V, the charge pumps are enabled. If the output voltage exceed a magnitude of 5.5V, the charge pumps are disabled. This oscillator controls the four phases of the voltage shifting. A description of each phase follows. Phase 1 — VSS charge storage — During this phase of the clock cycle, the positive side of capacitors C1 and C2 are initially charged to VCC. Cl+ is then switched to GND and the charge in C1– is transferred to C2–. Since C2+ is connected to VCC, the voltage potential across capacitor C2 is now 2 times VCC. Phase 2 — VSS transfer — Phase two of the clock connects the negative terminal of C2 to the VSS storage capacitor and the positive terminal of C2 to GND. This transfers a negative generated voltage to C3. This generated voltage is regulated to a minimum voltage of -5.5V. Simultaneous with the transfer of the voltage to C3, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND. Phase 3 — VDD charge storage — The third phase of the clock is identical to the first phase — the charge transferred in C1 produces –VCC in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C2+ is at VCC, the voltage potential across C2 is 2 times VCC. Phase 4 — VDD transfer — The fourth phase of the clock connects the negative terminal of C2 to GND, and transfers this positive generated voltage across C2 to C4, the VDD storage capacitor.
© Copyright 2005 Sipex Corporation © Copyright 2005 Sipex Corporation
Table 2. SP3222EB Truth Table Logic for Shutdown and Enable Control
Date:11/02/05 Date:02/27/05
SP3222EB/SP3232EB True to +5.5V RS-232 Transceivers SP3222EB/3232EB True +3.0 +3.0V to +5.5V RS-232 Transceivers
1010
This voltage is regulated to +5.5V. At this voltage, the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C4, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. Since both V+ and V– are separately generated from VCC; in a no–load condition V+ and V– will be symmetrical. Older charge pump approaches that generate V– from V+ will show a decrease in the magnitude of V– compared to V+ due to the inherent inefficiencies in the design. The clock rate for the charge pump typically operates at 250kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating. ESD Tolerance The SP3222EB/3232EB series incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electrostatic discharges and associated transients. The improved ESD tolerance is at least ±15kV without damage nor latch-up. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electrostatic energy and discharge it to an integrated circuit.
Date:11/02/05
The simulation is performed by using a test model as shown in Figure 18. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 19. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method. With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed.
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
11
VCC = +5V
+5V C1
+ –
C4
+ – – +
C2
+ –
VDD Storage Capacitor VSS Storage Capacitor
–5V
–5V
C3
Figure 13. Charge Pump — Phase 1
VCC = +5V
C4 C1
+ –
C2
+ –
+ –
– +
VDD Storage Capacitor VSS Storage Capacitor
–10V
C3
Figure 14. Charge Pump — Phase 2
[ +6V a) C2+ GND 1 GND 2 b) C2-6V T Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V T T ]
Figure 15. Charge Pump Waveforms
VCC = +5V
+5V C1
+ –
C4
+ – – +
C2
+ –
VDD Storage Capacitor VSS Storage Capacitor
–5V
–5V
C3
Figure 16. Charge Pump — Phase 3
VCC = +5V
+10V C1
+ –
C4
+ – – +
C2
+ –
VDD Storage Capacitor VSS Storage Capacitor
C3
Figure 17. Charge Pump — Phase 4
Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation
Date:11/02/05
12 SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
12
RC RC SW1 S W1
DC Power Source
RS RS SW2 S W2 CS CS
Device Under Test
Figure 18. ESD Test Circuit for Human Body Model
The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC.
The circuit models in Figures 18 and 19 represent the typical ESD testing circuits used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage.
Contact-Discharge Module Contact-Discharge Module
RC RC SW1 SW 1
DC Power Source
RS RS
RV SW2 S W2
CS CS
Device Under Test
and add up to 330 RS and RV add up to 330
or IEC1000-4-2. for IEC1000-4-2.
Figure 19. ESD Test Circuit for IEC1000-4-2
Date:11/02/05
Date: 02/27/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
13 13
© Copyright 2005 Sipex Corporation
For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5k an 100pF, respectively. For IEC-1000-4-2, the current limiting resistor (RS) and the source capacitor (CS) are 330 an 150pF, respectively. The higher CS value and lower RS value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point.
30A
15A
0A t=0ns t➙ t=30ns
Figure 20. ESD Test Waveform for IEC1000-4-2
Device Pin Tested
Driver Outputs Receiver Inputs
Human Body Model
±15kV ±15kV
I➙
Air Discharge
±15kV ±15kV
IEC1000-4-2 Direct Contact
±8kV ±8kV
Level
4 4
Table 3. Transceiver ESD Tolerance Levels
Date:11/02/05
Date:02/27/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
© Copyright 2005 Sipex Corporation
1 14
D N
SEE DETAIL “A”
E1
E
1
2
INDEX AREA D x E1 22
2 NX R R1
Gauge Plane Seaing Plane L1
L
A A
Ø
DETAIL A
20 Pin SSOP JEDEC MO-153 (AE) Variation MIN NOM MAX SYMBOL A 2 A1 0.05 A2 1.65 1.75 1.85 b 0.22 0.38 c 0.09 0.25 D 6.9 7.2 7.5 E 7.4 7.8 8.2 E1 5 5.3 5.6 L 0.55 0.75 0.95 L1 1.25 REF ø 0º 4º 8º Note: Dimensions in (mm)
A2
A
Seating Plane
b A1
WITH LEAD FINISH
c
BASE METAL
b
Section A-A
20 PIN SSOP
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
15
D N
SEE DETAIL “A”
E1
E
1
2
INDEX AREA D x E1 22
2 NX R R1
Gauge Plane Seaing Plane L1
L
A A
Ø
DETAIL A
16 Pin SSOP JEDEC MO-153 (AC) Variation MIN NOM MAX SYMBOL A 2 A1 0.05 A2 1.65 1.75 1.85 b 0.22 0.38 c 0.09 0.25 D 5.9 6.2 6.5 E 7.4 7.8 8.2 E1 5 5.3 5.6 L 0.55 0.75 0.95 L1 1.25 REF ø 0º 4º 8º Note: Dimensions in (mm)
c
A2
A
Seating Plane
b A1
WITH LEAD FINISH
BASE METAL
b
Section A-A
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
1
1
INDEX AREA
1 2 3
E1
E c eA eB
TOP VIEW
FRONT VIEW
SIDE VIEW
D
Base Plane A2 L A1 A
D1
b3
b2
e
b
Seating Plane
PDIP JEDEC MS-001 SYMBOL
VARIATION BB
N = 1 Pins
Dimensions in Inches: Controlling Dimension MIN NOM MAX
Dimensions in Millimeters Conversion Factor: 1 Inch = 25.0 mm MIN 0.3 2.2 0.3 1.1 0. 0.20 0.00 .2 .10 NOM MAX 5.33 .5 0.5 1. 1.1 0.3 .2 .11 3.30 0. 1.52 0. 0.25 . .35 0.004 BSC 0.012 BSC 2.2 3.30 1. 1.1 JL Nov21-05/ Rev A
© Copyright 2005 Sipex Corporation
A A1 A2 b b2 b3 c D1 E E1 e eA eB L
0.210 0.130 0.195 0.018 0.022 0.060 0.070 0.039 0.045 0.010 0.014 0.310 0.325 0.250 0.280 0.100 BSC 0.300 BSC 0.430 0.115 0.130 0.150 D 0.735 0.755 0.775 SIPEX Pkg Signoff Date/Rev:
0.015 0.115 0.014 0.045 0.030 0.008 0.005 0.300 0.240
10.2 3.1 1.
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
1
A1 D A D1 b3 e b2 b A2 L
INDEX AREA
N E1 E
123
N/2
E
c eA eB
18 PIN PDIP JEDEC MS-001 (AC) Variation SYMBOL MIN NOM MAX A 0.21 A1 0.15 A2 0.115 0.13 0.195 b 0.014 0.018 0.022 b2 0.045 0.06 0.07 b3 0.3 0.039 0.045 c 0.008 0.01 0.014 D 0.88 0.9 0.92 D1 0.005 E 0.3 0.31 0.325 E1 0.24 0.25 0.28 e .100 BSC eA .300 BSC eB 0.43 L 0.115 0.13 0.15 Note: Dimensions in (mm)
b
C
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
1
D
SIDE VIEW
E/2 E1 E1/2
INDEX AREA (0.25D X 0.5E1)
1 2 3
A E A1
A2 Seating Plane
(L1) e b
TOP VIEW
FRONT VIEW
h Gauge Plane L2 ø L
h
ø1 ø2 R1 R
Seating Plane
ø1
c
1 PIN WSOIC
SYMBOL
JEDEC MS-013
Variation AA
Dimensions in Millimeters: Controlling Dimension MIN 2.35 0.10 2.05 0.31 0.20
A A1 A2 b c E E1 e h L L1 L2 R R1 ø ø1 ø2
D
NOM MAX 2.65 0.30 2.55 0.51 0.33 10.30 BSC 7.50 BSC 1.27 BSC 0.25 0.75 0.40 1.27 1.40 REF 0.25 BSC 0.07 0.07 0º 8º 5º 15º 0º 10.30 REF SIPEX Pkg Signoff Date/Rev:
Dimensions in Inches Conversion Factor: 1 Inch = 25.0 mm MIN NOM MAX 0.093 0.104 0.004 0.012 0.081 0.100 0.012 0.020 0.008 0.013 0.406 BSC 0.295 BSC 0.050 BSC 0.010 0.030 0.016 0.050 0.055 REF 0.010 BSC 0.003 0.003 0º 8º 5º 15º 0º 0.405 REF JL Oct11-05/ Rev A
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
1
D Ø1
E/2
E1 E1/2
E L2 Seating Plane Ø1 L1 L
Gauge Plane
Ø
INDEX AREA (D/2 X E1/2)
123 e
b
VIEW C
TOP VIEW
B
B
SEE VIEW C
18 Pin WSOIC JEDEC MS-013 (AB) Variation MIN NOM MAX SYMBOL A 2.350 2.650 A1 0.100 0.300 A2 2.050 2.550 b 0.310 0.510 c 0.200 0.330 D 11.55 BSC E 10.30 DSC E1 7.50 BSC e 1.27 BSC L 0.400 1.270 L1 1.04 REF L2 0.25 BSC ø 0º 8º ø1 5º 15º Note: Dimensions in (mm)
A
A2
A1
SIDE VIEW
Seating Plane
b WITH PLATING
c
BASE METAL
SECTION B-B
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
20
D
Ø1
E/2 E1 E1/2 Seating Plane 1 INDEX AREA (D/2 X E1/2) 2 3 e Ø1 L1
b
E L2 L Gauge Plane
Ø
VIEW C
TOP VIEW
B
16 Pin SOIC JEDEC MS-013 (AA) Variation MIN NOM MAX SYMBOL A 2.35 2.65 A1 0.1 0.3 A2 2.05 2.55 b 0.31 0.51 c 0.2 0.33 10.30 BSC D 10.30 DSC E 7.50 BSC E1 1.27 BSC e L 0.4 1.27 1.04 REF L1 0.25 BSC L2 ø 0º 8º ø1 5º 15º Note: Dimensions in (mm)
B
SEE VIEW C
A
A2
A1
SIDE VIEW
Seating Plane
WITH PLATING
b
c
BASE METAL
SECTION B-B
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
21
D e
Ø2
E1
E
Seaing Plane
Ø3
L L1
Ø1
1
2
DETAIL A
INDEX AREA D x E1 22
SEE DETAIL “A”
A2
A
b
A1
Seating Plane
B B
16 Pin TSSOP JEDEC MO-153 (AB) Variation MIN NOM MAX SYMBOL A 1.2 A1 0.05 0.15 A2 0.8 1 1.05 b 0.19 0.3 c 0.09 0.2 D 4.9 5 5.1 6.40 BSC E E1 4.3 4.4 4.5 0.65 BSC e Ø1 0º 4º 8º 12º REF ø2 12º REF ø3 L 0.45 0.6 0.75 1.00 REF L1 Note: Dimensions in (mm)
b
C
Section B-B
Date: 02/27/05 Date:11/02/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
19
© Copyright 2005 Sipex Corporation © Copyright 2005 Sipex Corporation
22
D e
Ø
E1
E
Seaing Plane
Ø L1
L Ø DETAIL A
1
2
INDEX AREA D x E1 22
SEE DETAIL “A”
B B
20 Pin TSSOP JEDEC MO-153 (AC) Variation MIN NOM MAX SYMBOL A 1.2 A1 0.05 0.15 A2 0.8 1 1.05 b 0.19 0.3 c 0.09 0.2 D 6.4 6.5 6.6 E 6.40 BSC E1 4.3 4.4 4.5 e 0.65 BSC Ø1 0º 8º ø2 12º REF ø3 12º REF L 0.45 0.6 0.75 L1 1.00 REF Note: Dimensions in (mm)
b
C
Section B-B
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
23
D
SIDE VIEW
A E1 A1 E A2 Seating Plane
E/2
INDEX AREA (D/2 X E1/2)
1 2 3
E1/2 (L1) e b
TOP VIEW
h h Gauge Plane L2 ø L Seating Plane ø1
ø1 ø2 R1 R
c
FRONT VIEW
1 Pin NSOIC
SYMBOL
JEDEC MS-012
Variation AC
Dimensions in Inches Conversion Factor: 1 Inch = 25.0 mm
Dimensions in Millimeters: Controlling Dimension MIN NOM 6.00 BSC 3.90 BSC 1.27 BSC MAX 1.75 0.25 1.65 0.51 0.25 MIN 0.053 0.004 0.049 0.012 0.007
NOM
MAX 0.069 0.010 0.065 0.020 0.010
A A1 A2 b c E E1 e h L L1 L2 R R1 ø ø1 ø2
1.35 0.10 1.25 0.31 0.17
1.04 REF 0.25 BSC 0.07 0.07 0º 5º 0º D .0 BSC SIPEX Pkg Signoff Date/Rev:
0.25 0.40
0.236 BSC 0.154 BSC 0.050 BSC 0.50 0.010 1.27 0.016 0.041 REF 0.010 BSC 0.003 0.003 8º 0º 15º 5º 0º 0.390 BSC JL Oct12 -05 / Rev A
0.020 0.050
8º 15º -
Date:11/02/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
2
ORDERING INFORMATION
Part Number Temperature Range Package Type SP3222EBCA .......................................... 0C to +70C .......................................... 20-Pin SSOP SP3222EBCA/TR ..................................... 0C to +70C .......................................... 20-Pin SSOP SP3222EBCP .......................................... 0C to +70C ............................................ 18-Pin PDIP SP3222EBCT ........................................... 0C to +70C ........................................ 18-Pin WSOIC SP3222EBCT/TR ..................................... 0C to +70C ........................................ 18-Pin WSOIC SP3222EBCY .......................................... 0C to +70C ........................................ 20-Pin TSSOP SP3222EBCY/TR ..................................... 0C to +70C ........................................ 20-Pin TSSOP SP3222EBEA .......................................... -40C to +85C ........................................ 20-Pin SSOP SP3222EBEA/TR .................................... -40C to +85C ........................................ 20-Pin SSOP SP3222EBEP .......................................... -40C to +85C .......................................... 18-Pin PDIP SP3222EBET .......................................... -40C to +85C ...................................... 18-Pin WSOIC SP3222EBET/TR .................................... -40C to +85C ...................................... 18-Pin WSOIC SP3222EBEY .......................................... -40C to +85C ...................................... 20-Pin TSSOP SP3222EBEY/TR .................................... -40C to +85C ...................................... 20-Pin TSSOP SP3232EBCA .......................................... 0C to +70C .......................................... 16-Pin SSOP SP3232EBCA/TR ..................................... 0C to +70C .......................................... 16-Pin SSOP SP3232EBCP .......................................... 0C to +70C ............................................ 16-Pin PDIP SP3232EBCT ........................................... 0C to +70C ........................................ 16-Pin WSOIC SP3232EBCT/TR ..................................... 0C to +70C ........................................ 16-Pin WSOIC SP3232EBCN .......................................... 0C to +70C ......................................... 16-Pin NSOIC SP3232EBCN/TR .................................... 0C to +70C ......................................... 16-Pin NSOIC SP3232EBCY .......................................... 0C to +70C ........................................ 16-Pin TSSOP SP3232EBCY/TR ..................................... 0C to +70C ........................................ 16-Pin TSSOP SP3232EBEA .......................................... -40C to +85C ........................................ 16-Pin SSOP SP3232EBEA/TR .................................... -40C to +85C ........................................ 16-Pin SSOP SP3232EBEP .......................................... -40C to +85C .......................................... 16-Pin PDIP SP3232EBET .......................................... -40C to +85C ...................................... 16-Pin WSOIC SP3232EBET .......................................... -40C to +85C ...................................... 16-Pin WSOIC SP3232EBEN ......................................... -40C to +85C ....................................... 16-Pin NSOIC SP3232EBEN/TR .................................... -40C to +85C ....................................... 16-Pin NSOIC SP3232EBEY .......................................... -40C to +85C ...................................... 16-Pin TSSOP SP3232EBEY/TR .................................... -40C to +85C ...................................... 16-Pin TSSOP
Available in lead free packaging. To order add "-L" suffix to part number. Example: SP3232EBEN/TR = standard; SP3232EBEN-L/TR = lead free /TR = Tape and Reel Pack quantity is 1,500 for WSOIC, SSOP or 20 pin TSSOP and 2,500 for NSOIC or 16 pin TSSOP.
CLICK HERE TO ORDER SAMPLES
Corporation
ANALOG EXCELLENCE
Headquarters and Sales Office 233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600 Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
Date:11/02/05
Date:02/27/05
SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
© Copyright 2005 Sipex Corporation
25 20
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