SP3232EHEP-L

SP3232EH 3.3V, 460 kbps RS-232 Transceiver FEATURES ■ Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply ■ Interoperable with RS-232 down to a +2.7V power source ■ Enhanced ESD Specifications: +15kV Human Body Model +15kV IEC61000-4-2 Air Discharge +8kV IEC61000-4-2 Contact Discharge ■ 460kbps Minimum Transmission Rate ■ Ideal for Handheld, Battery Operated Applications C1+ 1 16 VCC V+ 2 15 GND C1- 3 C2+ 4 14 T1OUT SP3232EH 13 R1IN C2- 5 12 R1OUT V- 6 11 T1IN T2OUT 7 10 T2IN R2IN 8 9 R2OUT Now Available in Lead Free Packaging DESCRIPTION The SP3232EH is a 2 driver / 2 receiver RS-232 transceiver solution intended for portable or hand-held applications such as notebook or laptop computers. The data transmission rate of 460kbps can meet the demands of high speed RS-232 applications. This device has a highefficiency, charge-pump power supply that requires only 0.1µF capacitors in 3.3V operation. This charge pump allows the SP3232EH device to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The ESD tolerance of the SP3232EH device exceeds +/-15kV for both Human Body Model and IEC61000-4-2 Air discharge test methods. SELECTION TABLE Device Power Supplies SP3232EH +3.0V to +5.5V RS-232 Drivers RS-232 Receivers External Components Shutdown TTL 3-State # of Pins 2 2 4 No No 16 SP3232EH_103_031920  ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. Power Dissipation per package VCC.......................................................-0.3V to +6.0V V+ (NOTE 1).......................................-0.3V to +7.0V V- (NOTE 1)........................................+0.3V to -7.0V V+ + |V-| (NOTE 1)...........................................+13V ICC (DC VCC or GND current).........................+100mA 16-pin SSOP (derate 9.69mW/oC above +70oC)...............775mW 16-pin PDIP (derate 14.3mW/oC above +70oC)...............1150mW 16-pin Wide SOIC (derate 11.2mW/oC above +70oC)........900mW 16-pin TSSOP (derate 10.5mW/oC above +70oC)..............850mW Input Voltages TxIN, ...................................................-0.3V to +6.0V RxIN...................................................................+15V Output Voltages TxOUT.............................................................+13.2V RxOUT, .......................................-0.3V to (VCC +0.3V) Short-Circuit Duration TxOUT....................................................Continuous Storage Temperature......................-65°C to +150°C NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. ELECTRICAL CHARACTERISTICS Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX PARAMETER MIN. TYP. MAX. UNITS CONDITIONS 0.3 1.0 mA no load, VCC = 3.3V, TAMB = 25oC, TxIN = GND or VCC DC CHARACTERISTICS Supply Current LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW GND 0.8 V TxIN Input Logic Threshold HIGH 2.0 Vcc V Vcc = 3.3V Input Logic Threshold HIGH 2.4 Vcc V Vcc = 5.0V +1.0 µA TxIN, TAMB = +25oC 0.4 V IOUT = 1.6mA Input Leakage Current +0.01 Output Voltage LOW Output Voltage HIGH VCC -0.6 VCC -0.1 V IOUT = -1.0mA +5.0 +5.4 V All driver outputs loaded with 3kΩ to GND, TAMB = +25oC DRIVER OUTPUTS Output Voltage Swing SP3232EH_103_031920  ELECTRICAL CHARACTERISTICS Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX PARAMETER MIN. TYP. MAX. UNITS +35 +60 mA +25 µA 15 V CONDITIONS DRIVER OUTPUTS (continued) Output Resistance 300 Output Short-Circuit Current Ω Output Leakage Current VCC = V+ = V- = 0V, VOUT=+2V VOUT = 0V VCC = 0V, VOUT = +12V RECEIVER INPUTS Input Voltage Range -15 Input Threshold LOW 0.6 1.2 Input Threshold LOW 0.8 1.5 V Vcc = 3.3V V Vcc = 5.0V Input Threshold HIGH 1.5 2.4 V Vcc = 3.3V Input Threshold HIGH 1.8 2.4 V Vcc = 5.0V Input Hysteresis 0.3 Input Resistance 3 5 V 7 kΩ TIMING CHARACTERISTICS Maximum Data Rate 460 kbps RL = 3kΩ, CL = 1000pF, one driver switching Driver Propagation Delay, tPHL 1.0 µs RL = 3kΩ, CL = 1000pF Driver Propagation Delay, tPLH 1.0 µs RL = 3kΩ, CL = 1000pF Receiver Propagation Delay, tPHL 0.3 µs Receiver input to Receiver output, CL = 150pF Receiver Propagation Delay, tPLH 0.3 µs Receiver input to Receiver output, CL = 150pF Receiver Output Enable Time 200 ns Receiver Output Disable Time 200 Driver Skew 100 500 ns | tPHL - tPLH | Receiver Skew 200 1000 ns | tPHL - tPLH | Transition-Region Slew Rate 60 ns V/µs Vcc = 3.3V, RL = 3kΩ, CL = 1000pF, TAMB = 25°C, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V SP3232EH_103_031920  TYPICAL PERFORMANCE CHARACTERISTICS Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 460kbps data rate, all drivers loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C. 14 12 4 Slew Rate [V/ µs] Transmitter Output Voltage [V] 6 Vout+ Vout- 2 0 1000 500 0 1500 2000 -2 10 8 6 4 +Slew -Slew 2 -4 0 -6 Load Capacitance [pF] 0 500 1000 1500 Load Capacitance [pF] 2000 2330 Figure 2. Slew Rate vs Load Capacitance Figure 1. Transmitter Output Voltage vs Load Capacitance 40 460Kbps 120Kbps 20Kbps Supply Current (mA) 35 30 25 20 15 10 5 0 0 500 1000 1500 2000 2500 3000 Load Capacitance (pF) Figure 3. Supply Current VS. Load Capacitance when Transmitting Data SP3232EH_103_031920  Pin Function NAME C1+ PIN NUMBER FUNCTION SP3232EH Positive terminal of the voltage doubler charge-pump capacitor 1 V+ +5.5V output generated by the charge pump 2 C1- Negative terminal of the voltage doubler charge-pump capacitor 3 C2+ Positive terminal of the inverting charge-pump capacitor 4 C2- Negative terminal of the inverting charge-pump capacitor 5 -5.5V output generated by the charge pump 6 T1OUT V- RS-232 driver output. 14 T2OUT RS-232 driver output. 7 R1IN RS-232 receiver input 13 R2IN RS-232 receiver input 8 R1OUT TTL/CMOS receiver output 12 R2OUT TTL/CMOS receiver output 9 T1IN TTL/CMOS driver input 11 T2IN TTL/CMOS driver input 10 GND VCC Ground. 15 +3.0V to +5.5V supply voltage 16 Table 1. Device Pin Description SP3232EH_103_031920  PINOUT C1+ 1 16 VCC V+ 2 15 GND C1- 3 C2+ 4 14 T1OUT SP3232EH 13 R1IN C2- 5 12 R1OUT V- 6 11 T1IN T2OUT 7 10 T2IN R2IN 8 9 R2OUT Figure 4. Pinout Configuration for the SP3232EH SP3232EH_103_031920  TYPICAL OPERATING CIRCUITS VCC C5 C1 C2 LOGIC INPUTS + + + 0.1µF 1 C1+ 0.1µF V+ SP3232EH *C3 V- + 0.1µF 6 C4 5 C211 T1IN T1OUT 14 10 T2IN T2OUT 7 + 0.1µF RS-232 OUTPUTS R1IN 13 12 R1OUT LOGIC OUTPUTS 2 3 C14 C2+ 0.1µF 16 VCC 5kΩ R2IN 9 R2OUT 8 RS-232 INPUTS 5kΩ GND 15 *can be returned to either VCC or GND Figure 5. SP3232EH Typical Operating Circuit SP3232EH_103_031920  DESCRIPTION The SP3232EH is a 2-driver / 2-receiver devices ideal for portable or hand-held applications. The SP3232EH transceiver meets the EIA/TIA-232 and ITU-T V.28/V.24 communication protocols and can be implemented in battery-powered, portable, or hand-held applications such as notebook or palmtop computers. The SP3232EH device features Exar's proprietary on-board charge pump circuitry that generates ±5.5V for RS232 voltage levels from a single +3.0V to +5.5V power supply. This device is ideal for +3.3V-only systems, mixed +3.3V to +5.5V systems, or +5.0V-only systems that require true RS-232 performance. The SP3232EH device can operate at a minimum data rate of 460kbps when fully loaded. circuit with all drivers active at 120kbps with RS-232 loads in parallel with a 1000pF capacitor. Figure 8 shows the test results where one driver was active at 460kbps and all drivers loaded with an RS-232 receiver in parallel with 1000pF capacitor. Designers should connect unused inputs to Vcc or GND. Receivers The Receivers convert EIA/TIA-232 levels to TTL or CMOS logic output levels. Since receiver input is usually from a transmission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines. Should an input be left unconnected, an internal 5kΩ pulldown resistor to ground will commit the output of the receiver to a HIGH state. THEORY OF OPERATION The SP3232EH is made up of three basic circuit blocks: 1. Drivers 2. Receivers 3. The Exar proprietary charge pump Charge Pump The charge pump is an Exar-patended design (U.S. 5,306,954) and uses a unique approach compared to older less-efficient designs. The charge pump still requires four external capacitors, but uses a four-phase voltage shifting technique to attain symmetrical 5.5V power supplies. The internal power supply consists of a regulated dual charge pump that provides output voltages of +/-5.5V regardless of the input voltage (Vcc) over the +3.0V to +5.5V range. Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to +5.0V EIA/TIA-232 levels with an inverted sense relative to the input logic levels. Typically, the RS-232 output voltage swing is +5.4V with no load and +5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. Driver outputs will meet EIA/TIA-562 levels of +/-3.7V with supply voltages as low as 2.7V. In most circumstances, decoupling the power supply can be achieved adequately using a 0.1µF bypass capacitor at C5 (refer to figure 5) The drivers have a minimum data rate of 460kbps fully loaded with 3kΩ in parallel with 1000pF, ensuring compatibility with PC-to-PC communication software. In applications that are sensitive to powersupply noise, decouple Vcc to ground with a capacitor of the same value as charge-pump capacitor C1. Physically connect bypass capacitors as close to the IC as possible. Figure 6 shows a loopback test circuit used to test the RS-232 Drivers. Figure 7 shows the test results of the loopback The charge pump operates in a discontinuous mode using an internal oscillator. If the output voltages are less than a magnitude SP3232EH_103_031920  DESCRIPTION of 5.5V, the charge pump is enabled. If the output voltages exceed a magnitude of 5.5V, the charge pump is disabled. This oscillator controls the four phases of the voltage shifting. A description of each phase follows. VCC C5 C1 + + 0.1µF 0.1µF VCC C1+ V+ C3 + 0.1µF C1C2 + C2+ 0.1µF SP3232EH C4 C2LOGIC INPUTS LOGIC OUTPUTS Phase 1 — VSS charge storage — During this phase of the clock cycle, the positive side of capacitors C1 and C2 are initially charged to VCC. Cl+ is then switched to GND and the charge in C1– is transferred to C2–. Since C2+ is connected to VCC, the voltage potential across capacitor C2 is now 2 times VCC. V+ 0.1µF TxOUT TxIN RxIN RxOUT 5kΩ Phase 2 — VSS transfer — Phase two of the clock connects the negative terminal of C2 to the VSS storage capacitor and the positive terminal of C2 to GND. This transfers a negative generated voltage to C3. This generated voltage is regulated to a minimum voltage of -5.5V. Simultaneous with the transfer of the voltage to C3, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND. GND 1000pF Figure 6. SP3232EH Driver Loopback Test Circuit Phase 3 — VDD charge storage — The third phase of the clock is identical to the first phase — the charge transferred in C1 produces –VCC in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C2+ is at VCC, the voltage potential across C2 is 2 times VCC. Figure 7. Loopback Test results at 120kbps Phase 4 — VDD transfer — The fourth phase of the clock connects the negative terminal of C2 to GND, and transfers this positive generated voltage across C2 to C4, the VDD storage capacitor. This voltage is regulated to +5.5V. At this voltage, the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C4, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. T1 IN T1 OUT R1 OUT Figure 8. Loopback Test results at 460kbps SP3232EH_103_031920  DESCRIPTION Since both V+ and V– are separately generated from VCC, in a no–load condition V+ and V– will be symmetrical. Older charge pump approaches that generate V– from V+ will show a decrease in the magnitude of V– compared to V+ due to the inherent inefficiencies in the design. The clock rate for the charge pump typically operates at greater than 250kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating. VCC = +5V C4 +5V + C1 C2 – –5V + + – – – VDD Storage Capacitor + VSS Storage Capacitor C3 –5V Figure 9. Charge Pump — Phase 1 VCC = +5V C4 C1 + C2 – + – + – – + VDD Storage Capacitor VSS Storage Capacitor C3 -5.5V Figure 10. Charge Pump — Phase 2 [ T ] +6V a) C2+ T GND 1 GND 2 b) C2-6V T Ch1 2.00V Ch2 2.00V M 1.00ms Ch1 5.48V Figure 11. Charge Pump Waveforms SP3232EH_103_031920 10 DESCRIPTION VCC = +5V C4 +5V C1 + – C2 –5V + – + – VDD Storage Capacitor – + VSS Storage Capacitor C3 –5V Figure 12. Charge Pump — Phase 3 VCC = +5V +5.5V C1 + – C2 C4 + – + – – + VDD Storage Capacitor VSS Storage Capacitor C3 Figure 13. Charge Pump — Phase 4 SP3232EH_103_031920 11 DESCRIPTION ESD Tolerance The SP3232EH device incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least +15kV without damage nor latch-up. the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC61000-4-2 is shown on Figure 15. There are two methods within IEC61000-4-2, the Air Discharge method and the Contact Discharge method. There are different methods of ESD testing applied: With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. a) MIL-STD-883, Method 3015.7 b) IEC61000-4-2 Air-Discharge c) IEC61000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semi-conductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 14. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the IC's tend to be handled frequently. The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the The IEC-61000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC61000-4-2 is that RS RC SW1 DC Power Source SW2 CS Figure 14. ESD Test Circuit for Human Body Model Device Under Test SP3232EH_103_031920 12 DESCRIPTION Contact-Discharge Model RS RC RV SW1 SW2 Device Under Test CS DC Power Source R S and RV add up to 330Ω for IEC61000-4-2. Figure 15. ESD Test Circuit for IEC61000-4-2 equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. The higher CS value and lower RS value in the IEC61000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point. I→ The circuit models in Figures 14 and 15 represent the typical ESD testing circuit used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage. 30A 15A For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5kΩ an 100pF, respectively. For IEC-61000-4-2, the current limiting resistor (RS) and the source capacitor (CS) are 330Ω an 150pF, respectively. Device PIN TESTED Driver Outputs Receiver Inputs 0A t = 0ns t = 30ns Figure 16. ESD Test Waveform for IEC61000-4-2 Human Body MODEL Air Discharge +15kV +15kV t→ +15kV +15kV IEC61000-4-2 Direct Contact +8kV +8kV Level 4 4 Table 2. Transceiver ESD Tolerance Levels SP3232EH_103_031920 13 PACKAGE: 16 PIN TSSOP SP3232EH_103_031920 14 ORDERING INFORMATION Part Number SP3232EHCY-L/TR SP3232EHEY-L/TR (1) Temp. Range Package Packaging Method Lead-Free (2) 0°C to +70°C 16 Pin TSSOP -40°C to +85°C 16 Pin TSSOP Tape and Reel Tape and Reel Yes Yes Notes: 1. Refer to www.maxlinear.com/SP3232EH for most up-to-date Ordering Information. 2. Visit www.maxlinear.com for additional information on Environmental Rating. SP3232EH_103_031920 15 REVISION HISTORY DATE REVISION DESCRIPTION 01/18/06 -- Legacy Sipex Datasheet 01/06/11 1.0.0 Convert to Exar Format, Remove EOL device SP3222EH, update ordering information and change revision to 1.0.0. 06/07/11 1.0.1 Remove obsolete devices per PDN 110510-01. 03/14/13 1.0.2 Correct type error to RX input voltage ABS Maximum Rating and TX transition region slew rate condition. 03/19/20 1.0.3 Update to MaxLinear logo. Update Ordering Information. MaxLinear, Inc. 5966 La Place Court, Suite 100 Carlsbad, CA 92008 760.692.0711 p. 760.444.8598 f. www.maxlinear.com The content of this document is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by MaxLinear, Inc. MaxLinear, Inc. assumes no responsibility or liability for any errors or inaccuracies that may appear in the informational content contained in this guide. Complying with all applicable copyright laws is the responsibility of the user. Without limiting the rights under copyright, no part of this document may be reproduced into, stored in, or introduced into a retrieval system, or transmitted in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), or for any purpose, without the express written permission of MaxLinear, Inc. Maxlinear, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless MaxLinear, Inc. receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of MaxLinear, Inc. is adequately protected under the circumstances. MaxLinear, Inc. may have patents, patent applications, trademarks, copyrights, or other intellectual property rights covering subject matter in this document. Except as expressly provided in any written license agreement from MaxLinear, Inc., the furnishing of this document does not give you any license to these patents, trademarks, copyrights, or other intellectual property. MaxLinear, the MaxLinear logo, and any MaxLinear trademarks, MxL, Full-Spectrum Capture, FSC, G.now, AirPHY and the MaxLinear logo are all on the products sold, are all trademarks of MaxLinear, Inc. or one of MaxLinear’s subsidiaries in the U.S.A. and other countries. All rights reserved. Other company trademarks and product names appearing herein are the property of their respective owners. © 2006 - 2020 MaxLinear, Inc. All rights reserved. SP3232EH_103_031920 16