SSM6679GM
P-CHANNEL ENHANCEMENT MODE POWER MOSFET
PRODUCT SUMMARY
D D D D G
Simple Drive Requirement Low On-resistance Fast Switching Characteristic
BVDSS RDS(ON) ID
-30V 9mΩ -14A
SO-8
S S
S
DESCRIPTION
The advanced power MOSFETs from Silicon Standard Corp. provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SO-8 package is universally preferred for all commercialindustrial surface mount applications and suited for low voltage applications such as DC/DC converters.
D
G S
Pb-free; RoHS-compliant
ABSOLUTE MAXIMUM RATINGS
Symbol VDS VGS ID@TA=25℃ ID@TA=70℃ IDM PD@TA=25℃ TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current
1 3 3
Rating -30 ± 25 -14 -8.9 -50 2.5 0.02 -55 to 150 -55 to 150
Units V V A A A W W/ ℃ ℃ ℃
Continuous Drain Current Total Power Dissipation Linear Derating Factor
Storage Temperature Range Operating Junction Temperature Range
THERMAL DATA
Symbol Rthj-a Parameter Thermal Resistance Junction-ambient
3
Value Max. 50
Unit ℃/W
08/10/2007 Rev.1.00
www.SiliconStandard.com
1
SSM6679GM
ELECTRICAL CHARACTERISTICS
(TJ=25 C unless otherwise specified)
Symbol BVDSS
ΔBVDSS/ΔTj
o
Parameter Drain-Source Breakdown Voltage
Test Conditions VGS=0V, ID=-250uA
Min. -30 -1 -
Typ. -0.03 26 37 3 25 13 11 58 43 950 640
Max. Units 9 13 -3 -1 -25 ±100 60 V V/℃ mΩ mΩ V S uA uA nA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=-1mA
RDS(ON)
Static Drain-Source On-Resistance2
VGS=-10V, ID=-14A VGS=-4.5V, ID=-11A
VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=70 C)
o o
VDS=VGS, ID=-250uA VDS=-10V, ID=-14A VDS=-30V, VGS=0V VDS=-24V, VGS=0V VGS= ± 25V ID=-14A VDS=-24V VGS=-4.5V VDS=-15V ID=-1A RG=3.3Ω,VGS=-10V RD=15Ω VGS=0V VDS=-25V f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
2860 4580
SOURCE-DRAIN DIODE
Symbol VSD Parameter Forward On Voltage
2 2
Test Conditions IS=-2A, VGS=0V IS=-14A, VGS=0V, dI/dt=100A/µs
Min. -
Typ. 48 46
Max. Units -1.2 V ns nC
trr
Qrr
Reverse Recovery Time
Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature. 2.Pulse width
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