EMIF06-MSD02N16

EMIF06-MSD02N16 Datasheet 6-line IPAD EMI filter and ESD protection in micro QFN package Features Micro QFN 16L 3.5 mm x 1.2 mm (bottom view) 1 • • • • • • Vcc WP/CD R11 R7 R8 R9 R10 R12 DAT3 pull- up DAT2_In R1 DAT2_Ex DAT3_In R2 DAT3_Ex CMD_In R3 CMD_Ex R4 R5 DAT1_In R6 GND R13 CLK_In DAT0_In DAT3 pull- down CLK_Ex • • High design flexibility Lead free package Very low PCB space consuming: 3.5 mm x 1.2 mm Very thin package: 0.55 mm max. High efficiency in ESD suppression Complies with the following standards: – IEC 61000-4-2 level 4 on external pins High reliability offered by monolithic integration High reduction of parasitic elements through integration and μQFN packaging Applications DAT0_Ex DAT1_Ex GND Where EMI filtering in ESD sensitive equipment is required: • Portable devices • Navigation systems • Digital still cameras • Industrial and medical devices Description Product status EMIF06-MSD02N16 Product label The EMIF06-MSD02N16 is a 6-line, highly integrated product designed to suppress EMI/RFI noise and protect against ESD all the devices implementing a SD card or a T-Flash card. The EMIF06-MSD02N16 allows designers to choose either mechanical card detection of electrical card detection without any additional components. By integrating 20 discrete components in a single DFN package of 4 mm², the EMIF06-MSD02N16 provides a robust and immune space-saving solution to interface the connector and the controller of the SD cad slot. DS5979 - Rev 7 - February 2022 For further information contact your local STMicroelectronics sales office. www.st.com EMIF06-MSD02N16 Characteristics 1 Characteristics Figure 1. Pin configuration Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit ESD IEC 61000-4-2 Contact discharge: VPP • on DATx_In, CMD_In and CLK_In pins ±2 • On all other pins ±8 kV Air discharge: Tj DS5979 - Rev 7 • on DATx_In, CMD_In and CLK_In pins ±12 • On all other pins ±15 Maximum junction temperature 125 °C Top Operating temperature range - 40 to + 85 °C Tstg Storage temperature range - 55 to + 150 °C page 2/14 EMIF06-MSD02N16 Characteristics Figure 2. Electrical characteristics (definitions) I IF Symbol Parameter Breakdown voltage VBR IRM Leakage current at VRM VRM VCL VBR VCL Stand-off voltage Clamping voltage Rd IPP RI/O Cline VF VRM V IRM IR Dynamic resistance Peak pulse current Series resistance between Input and Output Input capacitance per line IPP Table 2. Electrical characteristics (Tamb = 25 °C) Symbol VBR IR = 1 mA IRM VRM = 3 V per line R1, R2, R3, R4, R5, R6 Min. Typ. 5 Max. Unit 8 V 200 nA Series resistors - tolerance ±20% 36 45 54 Ω Pull-up resistors 80 90 100 kΩ R13 Pull-down resistor - tolerance ±20% 375 470 565 kΩ Cline VLINE = 0 V dc, VOSC = 30 mV, F = 1 MHz 20 pF R7, R8, R9, R10, R11, R12 DS5979 - Rev 7 Test conditions page 3/14 EMIF06-MSD02N16 Characteristics (curves) 1.1 Characteristics (curves) Figure 4. Analog cross talk measurements Figure 3. S21 attenuation measurement 0.00 dB 0.00 -10.00 -20.00 -10.00 -30.00 -40.00 -50.00 -20.00 -60.00 -70.00 -80.00 -30.00 -90.00 -100.00 -40.00 -110.00 F (Hz) -50.00 F (Hz) -120.00 -130.00 100.0k DAT0 DAT2 CLK 1.0M 10.0M 100.0M 1.0G -140.00 DAT1 DAT3 CMD 100.0k 1.0M DAT2 -DAT3 Figure 5. ESD response to IEC 61000-4-2 (+12 kV air discharge) on one input (Vin) and on one output (Vout) 10.0M 100.0M DAT2 -DAT1 1.0G Figure 6. ESD response to IEC 61000-4-2 (- 12 kV air discharge) on one input (Vin) and on one output (Vout) IN 55V Max IN -41V Max OUT 39V Max -34V Max OUT Figure 7. Line capacitance versus reverse voltage applied on DATx and CMD line CLINE (pF) 16 14 12 10 8 6 4 VLINE(V) 2 0 0.0 DS5979 - Rev 7 1.0 2.0 3.0 4.0 5.0 page 4/14 EMIF06-MSD02N16 Application information 2 Application information The EMIF06-mSD02N16 is a dedicated interface device for micro SD card/T-Flash card. The device provides: • ESD protection • EMI filterering • Pull-up resistors • Card detection circuit 2.1 ESD protection Each pin is connected to a TVS diode able to withstand 12 kV on all pins except on DATx_In, CMD_In and CLK_In. 2.2 EMI filtering DATx, CMD and CLK lines are immunized against EMI radiations thanks to pi-filters. To avoid any degradation of the signal integrity at high frequency, the total line capacitance stays lower than 20 pF making the device compatible with a clock frequency up to 52 MHz. 2.3 Pull-up resistors As recommended by the SD Specifications (Part 1 Physical Layer Version 2.00), all the data lines DATx and the CMD line must be pulled-up with resistors of 10 to 100 kΩ to avoid bus floating not only in SD 4-bit mode but also in SD 1-bit and SPI mode. For the EMIF06-MSD02N16 device the pull-up resistor value has been fixed at 90 kΩ. This value makes the EMIF06-MSD02N16 compatible with most of the level shifters that may be used in the circuit including auto direction-sensing translators known to exhibit a weak current output. 2.4 Card detection circuit The EMIF06-mSD02N16 provides the flexibility to use either mechanical card detection with a dedicated pin connected to the memory card slot or the electrical card detection using the internal pull-up resistor of DAT3 of the micro SD card/T-Flash card. In case of mechanical card detection, the user must add a pull-up on the circuit connected to the CD (Card Detect) of the micro-SD/T-Flash slot as shown in Figure 8. Figure 8. Mechanical card detection VDD Pull-u p resistor Host controller GND WP/CD GND Contact when insertingthe card SD card DS5979 - Rev 7 page 5/14 EMIF06-MSD02N16 Card detection circuit A pull-up of 90 kΩ is embedded into the EMIF06-MSD02N16. The routing corresponding to the mechanical card detection configuration is shown in Figure 9. Figure 9. Circuit routing for mechanical card detection Card detect host input Card detect host input NC Pin 1–DAT2 Pin 2–CD/DAT3 Pin 3–CMD Pin 4–VCC Pin 5–CLK Pin 6–GND Pin 7–DAT0 HO ST CONT RO LL ER HO ST CONT RO LLE R Card detect pin Card detect pi n NC DAT2 – Pin 1 CD/DAT3 – Pin 2 CMD – Pin 3 VCC – Pin 4 CLK – Pin 5 GND – Pin 6 DAT0 – Pin 7 DAT1– Pin 8 Pin 8–DAT1 Top level DAT3 pul l-up Card detect pull-up Top le vel DAT3 pul l-up Card detect pul l-up Bottom view Top view In case of electrical card detection, the user must add a pull-down on the circuit connected to the CD/DAT3 pin of the micro-SD/T-Flash pin as shown in Figure 10. Figure 10. Electrical card detection Host contr oller DAT3 (CD) Pull -d own resistor GND VDD 50 kΩ 0 SD card A pull-down of 470k is embedded into the EMIF06-mSD02N16. The routing corresponding to the electrical card detection configuration is shown in Figure 11. Figure 11. Circuit routing for electrical card detection NC Pin Pin 4––VCC 4VCC Pin Pin 5–CLK –CLK 5 PinPin 6 –GND –GND 6 Pin Pin 7–DAT0 –DAT0 7 HO ST CONT RO LLE R Pin Pin 3––CMD 3CMD Pin Pin 8–DAT1 –DAT1 8 HO ST CONT RO LLE R Pin Pin 1–DAT2 –DAT2 1 PinPin 2 –CD/DAT3 2 NC DAT2 –Pin – Pin 1 1 CD/DAT3 –Pin –2Pin 2 CMD –Pin – Pin 3 3 VCC –Pin – Pin 4 4 CLK –Pin – Pin 5 5 GND –Pin – Pin 6 6 DAT0 –Pin – Pin 7 7 DAT1 –Pin – Pin 8 8 Top le vel DAT3 pullpul l down Bottom view DS5979 - Rev 7 Top le vel DAT3 pul l-down Top vie w page 6/14 EMIF06-MSD02N16 Package information 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 3.1 Micro QFN 3.5x1.2-16L package information • Epoxy meets UL94, V0 Figure 12. Micro QFN 3.5x1.2-16L package outline A E Pin 1 Index area 1 D A1 M E2 D2 L k 1 b DS5979 - Rev 7 e b1 L1 page 7/14 EMIF06-MSD02N16 Micro QFN 3.5x1.2-16L package information Table 3. Micro QFN 3.5x1.2-16L package mechanical data Dimensions Millimeters Ref. Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.05 0.000 b 0.15 0.20 0.25 0.006 0.008 0.010 b1 0.25 0.30 0.35 0.010 0.012 0.014 0.002 D 3.45 3.50 3.55 0.136 0.138 0.140 D2 2.70 2.80 2.90 0.106 0.110 0.114 E 1.15 1.20 1.25 0.045 0.047 0.049 E2 0.20 0.30 0.40 0.008 0.012 0.016 e 0.40 0.016 k 0.20 0.008 L 0.20 0.25 0.30 0.008 0.010 L1 0.15 0.006 M 0.20 0.008 Figure 13. Micro QFN 3.5x1.2-16L footprint (dimensions in mm) 1.6 0.70 0.30 2.30 0.45 0.40 DS5979 - Rev 7 Figure 14. Marking Dot : Pin 1 Identification XX = Marking (see Table4) WW = Data code (week) Y = Data code (year) P = Assembly plant 3.00 0.012 XX WW YP 0.20 page 8/14 EMIF06-MSD02N16 Micro QFN 3.5x1.2-16L package information Figure 15. Tape and reel outline Dot identifying Pin A1 location 5.5 ± 0.1 12.00 ± 0.3 3.70 ± 0.1 All dimensions in mm 1.75 ± 0.1 4.00 ± 0.1 2.00 ± 0.1 0.80 ± 0.1 Ø 1.55 ± 0.05 N6 N6 1.70 ± 0.1 N6 N6 N6 N6 4.00 ± 0.1 User direction of unreeling In no case should the product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. DS5979 - Rev 7 page 9/14 EMIF06-MSD02N16 Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. 2. General recommendation on stencil opening design a. Stencil opening dimensions: L (Length), W (Width), T (Thickness). General design rule a. Stencil thickness (T) = 75 ~ 125 μm b. c. 3. Aspect ratio = W T ≥ 1.5 Aspect area = L  ×  W ≥ 0.66 2T L  + W Reference design a. Stencil opening thickness: 100 μm b. Stencil opening for central exposed pad: Opening to footprint ratio is 50%. c. Stencil opening for leads: Opening to footprint ratio is 90% Figure 16. Stencil opening dimensions L T W Figure 17. Recommended stencil window position 5µm 5µm 420 µm 450 µm 15 µm 3.00 190 µm 15 µm 1.6 0.70 0.30 200 µm 2.30 0.45 2800 µm 300 µm 200 µm 50 µm 2100 µm DS5979 - Rev 7 0.20 Footprint 50 µm 350 µm 0.40 350 µm Stencil window Footprint page 10/14 EMIF06-MSD02N16 Solder paste 4.2 Solder paste 1. 2. 3. 4. 4.3 Placement 1. 2. 3. 4. 5. 6. 4.4 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 4.5 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-45 μm. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 18. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS5979 - Rev 7 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 11/14 EMIF06-MSD02N16 Ordering information 5 Ordering information Figure 19. Ordering information scheme EMIF 06 - MSD02 N16 EMI Filter Number of lines Information MSD = application 02 = version Package N = narrow micro QFN 16 = 16 leads Table 4. Ordering information DS5979 - Rev 7 Part number Marking Package Weight Base qty. Delivery mode EMIF06-MSD02N16 N6 Micro QFN 6.17 mg 3000 Tape and reel (7”) page 12/14 EMIF06-MSD02N16 Revision history Table 5. Document revision history DS5979 - Rev 7 Date Version Changes 21-Nov-2008 1 Initial release. 06-Sep-2019 2 Updated Table 3. Minor text changed. 11-May-2020 3 Updated product links and product label. 05-Nov-2020 4 Updated Figure 1. 20-Jan-2021 5 Updated Table 1. 27-Apr-2021 6 Updated Table 1. 01-Feb-2022 7 Updated Description, Figure 14 and Table 4. page 13/14 EMIF06-MSD02N16 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS5979 - Rev 7 page 14/14