EMIF06-MSD01F2

EMIF06-mSD01F2 IPAD™ Mini and micro SD Card - EMI filtering and 25 kV ESD protection Main application Mini and micro (T-Flash) Secure Digital memory card in mobile phones and communication systems Description The EMIF06-mSD01F2 is a highly integrated device based on IPAD technology with the following functions: ■ ESD protection to comply with IEC standard ■ EMI Filtering to reject mobile phone frequencies Flip-Chip (16 Bumps) Pin configuration (bump side) Benefits 4 ■ EMI Low-pass-filter ■ ESD protection ±25 kV (IEC 61000-4-2) ■ Integrated pull up resistors to prevent bus floating when no card is connected B ■ 50 Mhz clock frequency compatibility with Cline< 20 pF C ■ Low power consumption D ■ Easy Layout thanks to smart pin-out configuration ■ Very low PCB space consuming ■ 3 2 1 A A1 DATA0 C1 CMD High reliability offered by monolithic integration A2 DATA1 C2 Vss ■ Reduction of parasitic elements thanks to CSP integration A3 SDDATA1 C3 Vss A4 SDDATA0 C4 SDCMD ■ Lead free package B1 CLK D1 DATA3/CD ■ Coated version option upon request B2 Vcc D2 DATA2 Complies with the following standards: B3 Vss D3 SDDATA2 IEC 61000-4-2 level 4 B4 SDCLK D4 SDDATA3/CD 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3A SD Card Specification Ver. 1.01 MicroSD Card Specification Ver. 1.0 Physical layer specification, Part 1 vesion 1.1 Order code Part Number Marking EMIF06-mSD01F2 HJ TM: IPAD is a trademeark of STMicroelectronics February 2007 Rev 1 1/7 www.st.com 7 Characteristics 1 EMIF06-mSD01F2 Characteristics Table 1. Absolute ratings (limiting values) Symbol Parameter and test conditions Value Unit VPP ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge 25 25 kV Vin Maximum input voltage 5.5 V Tj Maximum junction temperature 125 °C - 40 to + 85 °C 125 °C Top Operating temperature range Tstg Storage temperature range Figure 1. EMIF06-mSD01F2 configuration Vcc R9 R10 R11 R12 R13 R1 Host Clk CMD Data0 SDClk SDCMD SDData0 R2 R3 R4 Data1 SDData1 R5 Data2 R6 Data3/CD SDData3/CD Vss Table 2. Vss Electrical characteristics Symbol Test conditions VBR IR = 1 mA IRM VRM = 3 V Min. Typ. 14 16 Max. Unit V 0.1 µA R1, R2, R3, R4, R5, R6 Tolerance ±20% 40 Ω R9, R10, R11, R12, R13 Tolerance ±30% 25 kΩ V = 0 V, F = 1 MHz Vosc = 30 mV 17 Cline 2/7 Card SDData2 20 pF EMIF06-mSD01F2 Figure 2. Characteristics Frequency response for line D3/D2 - VCC not connected Figure 3. dB dB 0.00 Frequency response for line C1/B4 - VCC not connected 0.00 -10.00 -10.00 -20.00 -30.00 -20.00 -40.00 -30.00 -50.00 -60.00 -40.00 -70.00 F (Hz) F (Hz) -50.00 -80.00 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G 1.0M D2-D3 Figure 4. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one imput (Vin) and one output (Vout) Figure 6. Junction capacitance versus reverse applied voltage CLK line (typical values) 14 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G C1-B4 Figure 5. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one imput (Vin) and one output (Vout) CLINE (pF) 12 10 8 6 4 2 VLINE (V) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 3/7 Technical information 2 EMIF06-mSD01F2 Technical information Figure 7. T-Flash connection diagram recommendation (MicroSD Specification Ver 1.0) RDAT RCMD CMD DAT0~3 CLK C 1 C2 C3 Pin Pin Pin Pin Pin Pin Pin Pin 1 2 3 4 5 6 7 8 EMIF06-mSD01F2 HOST Pull-up resistance RDAT and RCMD are implemented to prevent bus floating when no card is inserted or when all card drivers are in high impedance mode. Resistance values should be set between 10 kΩ and 100 kΩ . The pull-up resistors and capacitors described in the above recommendation are integrated in the EMIF06-mSD01F2. This makes the EMIF06-mSD01F2 an easy "plug and play" solution to implement secured T-flash, mini-SD card terminations. Figure 8. Layout recommendation DAT1 DAT0 VSS DAT1 CLK DAT0 VCC CLK NC CMD NC DAT3/CD VSS DAT2 Input Output CMD DAT3/CD Top level Second level Top View 4/7 DAT2 GND EMIF06-mSD01F2 3 Ordering information scheme Ordering information scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 2: Lead free Pitch = 500 µm, Bump = 315 µm Package information Figure 9. Flip-Chip Package dimensions 500 µm ± 50 650 µm ± 65 315 µm ± 50 1.92 mm ± 50 µm 500 µm ± 50 4 1.92 mm ± 50 µm Figure 10. Foot print recommendations Figure 11. Marking Copper pad Diameter: 250 µm recommended , 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E x x z y w w 5/7 Ordering information EMIF06-mSD01F2 Figure 12. Flip-Chip Tape and reel specification Dot identifying Pin A1 location Ø 1.5 +/- 0.1 1.75 +/- 0.1 4 +/- 0.1 3.5 +/- 0.1 STE xxz yww STE xxz yww STE xxz yww 8 +/- 0.3 0.73 +/- 0.05 4 +/- 0.1 User direction of unreeling All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: More packing information is available in the application notes: AN1235: “Flip-Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" 5 6 6/7 Ordering information Ordering code Marking Package Weight Base qty Delivery mode EMIF06-mSD01F2 HJ Flip-Chip 5.3 mg 5000 Tape and reel 7” Revision history Date Revision 02-Feb-2007 1 Description of Changes First issue. EMIF06-mSD01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7