EMIF08-LCD04M16

EMIF08-LCD04M16 Datasheet 8-line L-C IPAD EMI filter and ESD protection in micro QFN package Features • High cut off frequency low-pass filter: FC = 400 MHz at -6 dB • High efficiency in EMI filtering: better than -35 dB from 900 MHz to 2 GHz • Very low PCB space consuming with plastic micro-package 3.3 x 1.35 mm • Very thin package: 0.55 mm max. • High efficiency in ESD (IEC 61000-4-2 level 4) • High reliability offered by monolithic integration • High reduction of parasitic elements through integration and μQFN packaging • ECOPACK2 compliant Complies with the following standards • IEC 61000-4-2, level 4 on external pins: – ±15 kV (air discharge) – ±8 kV (contact discharge) Applications Where EMI filtering in ESD sensitive equipment is required: • Mobile POS • Human machine interface (HMI): STEVAL-PLC001V1 • Home automation HMI Product status EMIF08-LCD04M16 Description The EMIF08-LCD04M16 is an 8-line inductor capacitor (LC) EMI filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences requiring a large bandwidth. This filter includes an ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up 15 kV contact discharge. DS6256 - Rev 3 - September 2022 For further information contact your local STMicroelectronics sales office. www.st.com EMIF08-LCD04M16 Characteristics 1 Characteristics Figure 1. Pin configuration Pin 1 Output 1 Pin 16 Input 1 Output 2 Pin 15 Pin 2 Input 2 Pin 3 Input 3 Output 3 Pin 14 Pin 4 Input 4 Output 4 Pin 13 Pin 5 Input 5 Output 5 Pin 12 Pin 6 Input 6 Output 6 Pin 11 Pin 7 Input 7 Output 7 Pin 10 Pin 8 Input 8 Output 8 Pin 9 Exposed pad (GND) Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol VPP Tj DS6256 - Rev 3 Parameter Value Unit ESD IEC 61000-4-2, contact discharge: ±15 kV Maximum junction temperature 125 °C Top Operating temperature range - 40 to + 85 °C Tstg Storage temperature range - 55 to + 150 °C page 2/11 EMIF08-LCD04M16 Characteristics Figure 2. Electrical characteristics (definitions) I IF Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Parameter Breakdown voltage Leakage current at VRM Stand-off voltage Clamping voltage VBR VCL VF VRM V IRM IR Dynamic resistance Peak pulse current Series resistance between Input and Output Input capacitance per line IPP Table 2. Electrical characteristics (Tamb = 25 °C) Symbol VBR IR = 1 mA IRM VRM = 3 V per line L Inductance R Parasitic resistance of the inductance FC 50 Ω source and 50 Ω load termination at -6 dB Cline DS6256 - Rev 3 Test conditions VR = 3 V dc, VOSC = 30 mV, F = 1 MHz Min. Typ. Max. 6 V 100 12 9 12.5 18 nA nH 20 400 17 Unit Ω MHz 19 pF page 3/11 EMIF08-LCD04M16 Characteristics (curves) 1.1 Characteristics (curves) Figure 3. S21 attenuation measurements Figure 4. Analog cross talk measurements Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) Figure 6. ESD response to IEC 61000-4-2 (-15 kV air discharge) Figure 7. Line capacitance versus applied voltage DS6256 - Rev 3 page 4/11 EMIF08-LCD04M16 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 Micro QFN-16L 3.5x1.35 mm package information • • Epoxy meets UL94, V0 Lead-free package Figure 8. Micro QFN-16L 3.5x1.35 mm package outline DS6256 - Rev 3 page 5/11 EMIF08-LCD04M16 Micro QFN-16L 3.5x1.35 mm package information Table 3. Micro QFN-16L 3.5x1.35 mm mechanical data Dimensions Millimeters Ref. Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.10 D D2 3.30 2.65 E E2 2.80 0.25 0.40 0.104 k 0.20 L 0.15 0.110 0.114 0.053 0.50 0.010 0.40 0.016 0.020 0.016 0.008 0.25 Figure 9. Footprint (dimensions in mm) DS6256 - Rev 3 2.90 1.35 e Note: 0.13 0.35 0.006 0.010 0.014 Figure 10. Marking Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. page 6/11 EMIF08-LCD04M16 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. 2. General recommendation on stencil opening design a. Stencil opening dimensions: L (Length), W (Width), T (Thickness). General design rule a. Stencil thickness (T) = 75 ~ 125 μm b. c. 3. Aspect ratio = W T ≥ 1.5 Aspect area = L  ×  W ≥ 0.66 2T L  + W Reference design a. Stencil opening thickness: 100 μm b. Stencil opening for central exposed pad: Opening to footprint ratio is 50%. c. Stencil opening for leads: Opening to footprint ratio is 90% Figure 11. Stencil opening dimensions L T W Figure 12. Recommended stencil window position DS6256 - Rev 3 page 7/11 EMIF08-LCD04M16 Solder paste 3.2 Solder paste 1. 2. 3. 4. 3.3 Placement 1. 2. 3. 4. 5. 6. 3.4 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 3.5 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-45 μm. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 13. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS6256 - Rev 3 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. page 8/11 EMIF08-LCD04M16 Ordering information 4 Ordering information Figure 14. Ordering information scheme Table 4. Ordering information Part number Marking Package Weight Base qty. Delivery mode EMIF08-LCD04M16 JA(1) Micro QFN 6.74 mg 3000 Tape and reel 1. The marking can be rotated by 90° to differentiate assembly location DS6256 - Rev 3 page 9/11 EMIF08-LCD04M16 Revision history Table 5. Document revision history DS6256 - Rev 3 Date Revision Changes 20-May-2009 1 Initial release. 10-Nov-2009 2 Updated Features on page 1. Added Figure 2 on page 2. 14-Sep-2022 3 Added Figure 1. Pin configuration. Minor text changes. page 10/11 EMIF08-LCD04M16 IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS6256 - Rev 3 page 11/11