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Application note
EVAL6226QR demonstration board using a dual full-bridge L6226Q
for motor control applications
Introduction
This application note describes the demonstration board of the DMOS dual full-bridge
L6226Q designed for motor control applications. The board implements a typical application
that can be used as a reference design to drive two-phase bipolar stepper motors with
currents up to 1A DC, multiple DC motors and a wide range of inductive loads.
Thanks to the small footprint of the L6226Q (QFN 5 x 5 mm, 32-lead) the PCB is very
compact (27 x 24.5 mm).
Figure 1.
January 2009
EVAL6226QR demonstration board
Rev 2
1/8
www.st.com
Demonstration board description
1
Demonstration board description
Table 1.
EVAL6226R pin connections
Name
Type
VS
Power supply
PGND
Ground
Power ground terminal
IN1A
Logic input
Bridge A logic input 1
IN2A
Logic Input
Bridge A logic input 2
ENA
Logic input
Bridge A enable (active high). When low, the power DMOSs
of bridge A are switched OFF.
IN1B
Logic input
Bridge B logic input 1
IN2B
Logic input
Bridge B logic input 2
ENB
Logic input
Bridge B enable (active high). When low, the power DMOSs
of bridge B are switched OFF.
Open drain output
Bridge A overcurrent detection and thermal protection pin.
An internal open drain transistor pulls to GND when
overcurrent on bridge A is detected or in case of thermal
protection.
DIAGB
Open drain output
Bridge B overcurrent detection and thermal protection pin.
An internal open drain transistor pulls to GND when
overcurrent on bridge B is detected or in case of thermal
protection.
SGND
Ground
OUT1A
Power output
Bridge A output 1
OUT2A
Power output
Bridge A output 2
OUT1B
Power output
Bridge B output 1
OUT2B
Power output
Bridge B output 2
DIAGA
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Function
Bridge A and bridge B power supply
Signal ground terminal
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Demonstration board description
Figure 2.
EVAL6226QR demonstration board description
ENA
IN2A
IN1A
DIAGA
PGND
VS
OUT1A
OUT2A
SGND
OUT2B
OUT1B
ENB
IN1B
IN2B
DIAGB
The INx input pins drive the corresponding half-bridge. When low logic level is applied the
low side MOS is switched on, whereas a high logic level turns on the high side MOS.
Pins ENA and ENB are used to implement overcurrent and thermal protection when
connected respectively to the outputs DIAGA and DIAGB.
The output current detection thresholds are selected by the resistor connected between the
IC dedicated pins and ground.
Table 2 summarizes the electrical specification of the application and Figure 3 shows the
electrical schematic.
Table 2.
EVAL6226QR electrical specification (recommended value)
Parameter
Value
Supply voltage range (VS)
8 to 52 Vdc
RMS output current rating (OUTx)
up to 1.4 A
Switching frequency
up to 100 kHz
Input and enable voltage range
0 to + 5 V
OCD pins voltage range
-0.3 to 10 V
Operating temperature range
-25 to +125°C
L6226Q thermal resistance junction to ambient
42°C/W
3/8
5
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Figure 3.
&
Demonstration board description
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EVAL6226QR demonstration board schematic
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Demonstration board description
Table 3.
EVAL6226QR part list
Part reference
Part value
Part description
C1
220 nF/25 V
Capacitor
C2
220 nF/63 V
Capacitor
C3
10 nF/25 V
Capacitor
C4
100 µF/63 V
Capacitor
C5, C6
5.6 nF
Capacitor
D1
BAT46SW
Diodes
R1, R2, R3, R4
100 kΩ 5% 0.25 W
Resistor
R5, R6
10 kΩ 1% 0.25 W
Resistor
R9, R10
0.4 kΩ 1 W
Resistor
U1
L6226Q
Dual full-bridge in VFQFPN5x5
D1, C1 and C3 constitute a charge pump circuit, which generates the supply voltage for the
high-side integrated MOSFETs. Due to voltage and current switching at relatively high
frequency, these components are connected through short paths in order to minimize
induced noise on other circuitries.
R1, R2 and C5, C6 are used by the overcurrent protection integrated circuitry (disable time
tDISABLE is about 200 µs and delay time tDELAY about 1 µs using the values in Table 3).
R5 and R6 are used to set the output current detection threshold at about 1.1 A typical
value. Figure 4, Figure 5 and Figure 6 show the placement of the components and the
layout of the two layers of the EVAL6226QR reference design board. A GND area has been
used to improve the IC power dissipation.
Figure 4.
Component placement
24.5 mm
27 mm
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Demonstration board description
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Figure 5.
Top layer layout
Figure 6.
Bottom layer layout
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Revision history
Revision history
Table 4.
Document revision history
Date
Revision
Changes
06-Oct-2008
1
Initial release
28-Jan-2009
2
Updated value in Table 2: EVAL6226QR electrical specification
(recommended value) on page 3
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