L6718

L6718 Digitally controlled dual PWM with embedded drivers for VR12 processors Datasheet - production data Applications • High-current VRM / VRD for desktop / server / new generation workstation CPUs VFQFPN56 -7x7 mm • DDR3 DDR4 memory supply for VR12 Description Features • VR12 compliant with 25 MHz SVID bus rev. 1.5 • Second generation LTB Technology™ • Very compact dual controller: – Up to 4 phases for core section with 2 internal drivers – 1 phase for GFX section with internal driver • Input voltage up to 12 V • SMBus interface for power management • SWAP, Jmode, multi-rail only support • Programmable offset voltage • Single NTC design for TM, LL and IMON thermal compensation (for each section) • VFDE for efficiency optimization • DPM - dynamic phase management • Dual differential remote sense • 0.5% output voltage accuracy • Full-differential current sense across DCR • AVP - adaptive voltage positioning The L6718 is a very compact, digitally controlled and cost effective dual controller designed to power Intel® VR12 processors. Dedicated pinstrapping is used to program the main parameters. The device features from 2 to 4-phase programmable operation for the core section providing 2 embedded drivers. A single-phase with embedded driver and with independent control loop is used for GFX. The L6718 supports power state transitions featuring VFDE and a programmable DPM, maintaining the best efficiency over all loading conditions without compromising transient response. Second generation LTB Technology™ allows a minimal cost output filter providing fast load transient response. The controller assures fast and independent protection against load overcurrent, under/overvoltage and feedback disconnections. The device is available in VFQFPN56, 7x7 mm compact package with exposed pad. • Programmable switching frequency Table 1. Device summary • Dual current monitor • Pre-biased output management • High-current embedded drivers optimized for 7 V operation • OC, OV, UV and FB disconnection protection Order code Package Packaging L6718 VFQFPN56 7x7 mm Tray L6718TR VFQFPN56 7x7 mm Tape and reel • Dual VR_READY • VFQFPN56 7x7 mm package with exposed pad April 2013 This is information on a product in full production. DocID023399 Rev 3 1/71 www.st.com 71 Contents L6718 Contents 1 2 3 Typical application circuit and block diagram . . . . . . . . . . . . . . . . . . . . 7 1.1 Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin description and connection diagrams . . . . . . . . . . . . . . . . . . . . . . 11 2.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4 VID tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5 Device description and operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 6 Device configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 6.1 CPU mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 6.2 DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 6.3 SWAP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 6.3.1 7 6.4 Jmode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 6.5 Phase number configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 6.6 Pinstrapping configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6.6.1 CONFIG0 in CPU mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 6.6.2 CONFIG0 in DDR mode (STCOMP=GND) . . . . . . . . . . . . . . . . . . . . . . 34 6.6.3 CONFIG1 in CPU mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 6.6.4 CONFIG1 in DDR mode (STCOMP=GND) . . . . . . . . . . . . . . . . . . . . . . 37 6.6.5 CONFIG2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 6.6.6 CONFIG3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 L6718 power manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.1 2/71 MRO - multi-phase rail only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 SMBus power manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 DocID023399 Rev 3 L6718 Contents 7.1.1 8 9 10 SMBus sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 7.2 SMBus tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 7.3 DPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 7.4 VFDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 7.5 Power state indicator (PSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Output voltage positioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 8.1 Multi-phase section - current reading and current sharing loop . . . . . . . . 50 8.2 Multi-phase section - defining load-line . . . . . . . . . . . . . . . . . . . . . . . . . . 51 8.3 Single-phase section - current reading . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 8.4 Single-phase section - defining load-line . . . . . . . . . . . . . . . . . . . . . . . . . 52 8.5 Dynamic VID transition support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 8.6 DVID optimization: REF/SREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Output voltage monitoring and protection . . . . . . . . . . . . . . . . . . . . . . 55 9.1 Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 9.2 Overcurrent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 9.2.1 Multi-phase section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 9.2.2 Overcurrent and power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 9.2.3 Single-phase section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Single NTC thermal monitor and compensation . . . . . . . . . . . . . . . . . 59 10.1 Thermal monitor and VR_HOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 10.2 Thermal compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 10.3 TM and TCOMP design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 11 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 12 System control loop compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 13 12.1 Compensation network guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 12.2 LTB technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Power dissipation and application details . . . . . . . . . . . . . . . . . . . . . . 65 13.1 High-current embedded drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 13.2 Boot diode and capacitor design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 DocID023399 Rev 3 3/71 Contents L6718 13.3 14 Device power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Layout guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 14.1 Power components and connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 14.2 Small signal components and connections . . . . . . . . . . . . . . . . . . . . . . . 67 15 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 4/71 DocID023399 Rev 3 L6718 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 VID table, both sections, commanded through serial bus . . . . . . . . . . . . . . . . . . . . . . . . . 24 Phase number programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 CONFIG0/PSI0 pinstrapping in CPU MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 CONFIG0/PSI0 pinstrapping in DDR MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 CONFIG1/PSI1 pinstrapping in CPU MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 CONFIG1/PSI1 pinstrapping in DDR MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 CONFIG2/SDA pinstrapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 CONFIG3/SCL pinstrapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 SMBus addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 SMBus interface commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 SMBus VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Power status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 L6718 protection at a glance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Multi-phase section OC scaling and power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 VFQFPN56 7x7 mm mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 DocID023399 Rev 3 5/71 List of figures L6718 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. 6/71 Typical 4-phase application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Typical 3-phase application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Typical 2-phase application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Device initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 SWAP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 SMBus communication format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Output current vs. switching frequency in PSK mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Voltage positioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Current reading. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 DVID optimization circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Thermal monitor connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 ROSC [KOhm] vs. switching frequency [kHz] per phase . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Equivalent control loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Control loop Bode diagram and fine tuning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 VFQFPN56 7x7 mm package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 DocID023399 Rev 3 L6718 Typical application circuit and block diagram 1 Typical application circuit and block diagram 1.1 Application circuit Figure 1. Typical 4-phase application circuit +5V +7V VCC5 GND CONF0/PSI0 (PAD) CONF1/PSI1 TCOMP STCOMP/DDR VCC12 +12V SBOOT RGate SHGATE CHF Cboot HSs Rboot Ls SPHASE RGate SLGATE LSs Rtcm_s Ctcm_s SDA/CONFIG2 SCL/CONFIG3 Rg_s SVREADY VREADY VR_HOT SCSP SCSN VRHOT +5V +12V BOOT1 TM STM RGate HGATE1 CHF Cboot HS1 Rboot L1 PHASE1 EN ENABLE SOSC/SFLT RGate LGATE1 LS1 Rtcm Ctcm OSC/FLT Rg SIMON CS1P CS1N ST L6718 SCOMP +12V CSF BOOT2 RSF HGATE2 CSP RGate SFB CHF Cboot HS2 Rboot PHASE2 L2 CSI RSFB RGate LGATE2 LS2 RSI Rtcm Ctcm SVSEN Rg CS2P CS2N SRGND SREF/JEN CSREF RSREF +12V IMON CDEC RIMON +12V VCC EN CF CP PWM3 PWM L6743 BOOT COMP UGATE RGate CHF Cboot HS3 Rboot L3 PHASE RF FB CS3P SC3N CI LGATE RGate LS3 Rtcm Ctcm GND RFB Rg RI +12V CDEC +12V VCC BOOT CREF RREF EN PWM L6743 REF PWM4 CS4N CLTB RLTB CS4P VSEN RGND LTB SVCLK ALERT# SVDATA UGATE RGate HS4 Rboot PHASE LGATE CHF Cboot RGate L4 LS4 Rtcm Ctcm GND VR12 SVID CORE RG VR12 μ P LOAD CMLCC COUT GPU +5V RSIMON CSOUT CSMLCC ST L6718 (4+1) Reference schematic AM12875v1 DocID023399 Rev 3 7/71 Typical application circuit and block diagram L6718 Figure 2. Typical 3-phase application circuit +5V +7V VCC5 GND CONF0/PSI0 (PAD) CONF1/PSI1 TCOMP STCOMP/DDR VCC12 +12V SBOOT RGate SHGATE Cboot CHF HSs Rboot Ls SPHASE RGate SLGATE LSs Rtcm_s Ctcm_s SDA/CONFIG2 SCL/CONFIG3 Rg_s SVREADY VREADY SCSP SCSN VRHOT +5V +12V BOOT1 TM STM RGate HGATE1 ENABLE SOSC/SOVP CHF HS1 L1 Rboot PHASE1 EN Cboot RGate LGATE1 LS1 Rtcm Ctcm OSC/OVP ST L6718 SIMON Rg CS1P CS1N RSIMON +5V SCOMP +12V BOOT2 CSF CSP RSF RGate HGATE2 SFB RGate LGATE2 RSFB CHF HS2 Rboot PHASE2 CSI RSI Cboot L2 LS2 Rtcm Ctcm SVSEN Rg CS2P CS2N SRGND SREF/JEN CSREF RSREF +12V IMON CDEC RIMON +12V VCC BOOT COMP CF PWM3 CP RF PWM L6743B EN UGATE RGate CHF Cboot HS3 Rboot L3 PHASE FB RGate CS3P SC3N CI LGATE LS2 Rtcm Ctcm GND RFB Rg VSEN RGND LTB CS4P CS4N SVDATA VR12 SVID CORE REF CREF RREF PWM4 ALERT# CLTB RLTB SVCLK RI VR12 μP LOAD COUT GPU CMLCC CSOUT CSMLCC ST L6718 (3+1) Reference Schematic AM12876v1 8/71 DocID023399 Rev 3 L6718 Typical application circuit and block diagram Figure 3. Typical 2-phase application circuit +5V +7V VCC5 GND CONF0/PSI0 (PAD) CONF1/PSI1 TCOMP STCOMP/DDR VCC12 +12V SBOOT RGate SHGATE CHF Cboot HSs Rboot SPHASE RGate SLGATE Ls LSs Rtcm_s Ctcm_s SDA/CONFIG2 SCL/CONFIG3 Rg_s SVREADY VREADY SCSP SCSN VRHOT +5V +12V BOOT1 TM STM RGate HGATE1 ENABLE SOSC/SFLT HS1 Rboot PHASE1 EN CHF Cboot RGate LGATE1 L1 LS2 Rtcm Ctcm OSC/FLT SIMON RSIMON Rg ST L6718 CS1P CS1N +5V SCOMP +12V BOOT2 CSF CSP RGate HGATE2 RSF SFB CHF Cboot HS2 Rboot PHASE2 L2 CSI RSFB RGate LGATE2 LS2 Rtcm Ctcm RSI SVSEN Rg CS2P CS2N SRGND SREF/JEN CSREF RSREF IMON RIMON COMP CF CP PWM3 RF FB CS3N SC3P CI Rg RFB RI RREF CS4P CS4N Rg VR12 SVID CORE REF CREF VR12 μP LOAD CMLCC COUT GPU CLTB RLTB PWM4 SVCLK ALERT# SVDATA VSEN RGND LTB CSOUT CSMLCC ST L6718 (2+1) Reference Schematic AM12877v1 DocID023399 Rev 3 9/71 Typical application circuit and block diagram 1.2 L6718 Block diagram CONFIG0/PSI0 CONFIG1/PSI1 FLT JEN SImon Imon SMBus Manager SCL/CONF3 SDA/CONF2 TempZone DDR SWAP ENABLE OSC /FLT To SinglePhase FLT Manager VREADY GND (PAD) Figure 4. Block diagram L6718 S_EN VCC5 VCC12 Startup Logic EN LTB SVCLK ALERT# SVDATA FLT Ramp & Clock Generator with VFDE LTB Technology Modulator & Frequency Limiter Dual DAC & Ref Generator OV BOOT1 HGATE1 PHASE1 Anti Cross Conduction VR12 Bus Manager VSEN MultiPhase Fault Manager VR12 registers LGATE1 S S VSEN RGND BOOT2 HGATE2 PHASE2 Anti Cross Conduction PWM1 SREF PWM2 LGATE2 +OVP_Trk S IREF PWM3 PMW3/SPWM S PWM4 PWM4/PH#N REF Current balance & Peak Curr Limit COMP OCP FB OC PH#N IMON IDROOP Thermal compensation and Gain adjust IMON Chan # CS1P CS1N Differential Current Sense IREF ERROR AMPLIFIER SWAP CS2P CS2N CS3P CS3N CS4P CS4N TCOMP TempZone SVSEN SRGND TM VRHOT STM Thermal sensing and monitor SOV VCC12 SREF SPWM Anti Cross Conduction ISREF +OVP_Trk SLGATE SREF/JEN SCOMP S_EN SFLT ISREF ERROR AMPLIFIER Ramp & Clock Generator withVFDE LTB Technology Modulator & Frequency Limiter SOSC/SFLT SFB OCP SOC SIMON SinglePhase Fault Manager To MultiPhase FLT Manage SFLT Differential current sense Th SCSP SCSN DDR SVREADY ISMON Thermal compensation and Gain adjust STCOMP/DDR ISDROOP 10/71 SBOOT SHGATE SPHASE DocID023399 Rev 3 AM12878v1 L6718 Pin description and connection diagrams HGATE1 BOOT1 VCC12 BOOT2 HGATE2 PHASE2 LGAE2 LGATE1 SVREADY VREADY CS4N CS4P CS2P CS2N Figure 5. Pin connection (top view) 56 55 54 53 52 51 50 49 48 47 46 45 44 43 CS1N 1 42 PHASE1 CS1P 2 41 PMW3//SPWM CS3P 3 40 PWM4/PH# CS3N 4 39 SLGATE TM 5 38 SPHASE VRHOT 6 37 SHGATE SVCLK 7 36 SBOOT SVDATA 8 35 CONF0/PSI0 ALERT# 9 34 STM RGND 10 33 SCSN VSEN 11 32 SCSP LTB 12 31 SOSC/SFLT FB 13 30 OSC/FLT VCC5 CONF3/SCL CONF2/SDA CONF1/PSI1 TCOMP STCOMP/DDR ENABLE SREF/JEN SIMON SFB SCOMP SVSEN SRGND 14 29 15 16 17 18 19 20 21 22 23 24 25 26 27 28 REF COMP L6718 IMON 2 Pin description and connection diagrams AM12879v1 DocID023399 Rev 3 11/71 Pin description and connection diagrams 2.1 L6718 Pin description Table 2. Pin description Pin# Function CS1N 2 CS1P Channel 1 current sense positive input. Connect through an R-C filter to the phase-side of channel 1 inductor. See Section 14 for proper layout of this connection. CS3P Channel 3 current sense positive input. Connect through an R-C filter to the phase-side of channel 3 inductor. Short to VOUT when not using channel 3. See Section 14 for proper layout of this connection. 5 CS3N TM 6 VRHOT 7 SVCLK 8 SVDATA 9 ALERT# Channel 3 current sense negative input. Connect through an RG resistor to the output-side of channel 3 inductor. Filter the output-side of RG with 100 nF (typ.) to GND. Connect to VOUT through an RG resistor when not using channel 3. See Section 14 for proper layout of this connection. Thermal monitor sensor. Connect with proper network embedding NTC to the multi-phase rail power section. The IC senses the power section temperature and uses the information to define the VRHOT signal and temperature zone register. By programming proper TCOMP gain, the IC also implements load-line thermal compensation for the multi-phase rail section. See Section 10 for details. Voltage regulator HOT. Open drain output, set free by controller when the temperature sensed through the TM pin exceeds TMAX (active low). See Section 10.1 for details. SVID BUS 4 MULTI-RAIL SECTION 1 Channel 1 current sense negative input. Connect through an RG resistor to the output-side of channel 1 inductor. Filter the output-side of RG with 100 nF (typ.) to GND. This pin is compared with VSEN for the feedback disconnection. See Section 14 for proper layout of this connection. 3 12/71 Name Serial clock Serial data Alert DocID023399 Rev 3 L6718 Pin description and connection diagrams Table 2. Pin description (continued) 10 11 12 Name Function RGND Remote ground sense pin. Connect to the negative side of the load to perform remote sense. See Section 14 for proper layout of this connection. VSEN Output voltage monitor pin. Manages OVP/UVP protection and feedback disconnection. Connect to the positive side of the load to perform remote sense. A fixed 50 uA current is sourced from this pin. See Section 14 for proper layout of this connection. LTB MULTI-RAIL SECTION Pin# Load transient boost technology input pin. Internally fixed at 1.67 V, connecting RLTB - CLTB vs. VOUT allows the load transient boost technology to be enabled, as soon as the device detects a transient load it turns on all the phases at the same time. Short to SGND to disable the function. See Section 12.2 for details. Error amplifier inverting input. Connect with an RFB to VSEN and (RF - CF)// CP to COMP. A current proportional to the load current is sourced from this pin in order to implement the droop effect. See Section 8.2 for details. 13 FB 14 COMP Error amplifier output. Connect with (RF - CF)// CP to FB. The device cannot be disabled by pulling down this pin. 15 IMON Current monitor output. A current proportional to the multi-phase rail output current is sourced from this pin. Connect through a resistor RIMON to GND to show a voltage proportional to the current load. Based on pin voltage level, DPM and overcurrent protection can be triggered. Filtering through CIMON to GND allows control of the delay. See Section 9.2 for RIMON definition. 16 REF The reference used for the regulation of the multi-phase rail section is available on this pin with -100 mV + offset. Connect through an RREFCREF to RGND to optimize DVID transitions. See Section 8.6 for details. DocID023399 Rev 3 13/71 Pin description and connection diagrams L6718 Table 2. Pin description (continued) 18 SVSEN Single-rail output voltage monitor. Manages OVP/UVP protection and feedback disconnection. Connect to the positive side of the load to perform remote sense. It is also the sense for the single-phase rail LTB. Connect to the positive side of the single-phase rail load to perform remote sense. See Section 14 for proper layout of this connection. SFB 20 SCOMP 22 23 24 14/71 SRGND Single-phase rail remote ground sense. Connect to the negative side of the single-phase rail load to perform remote sense. See Section 14 for proper layout of this connection. 19 21 Function SINGLE-RAIL SECTION 17 Name Error amplifier inverting input. Connect with a resistor RSFB to SVSEN and with (RSF - CSF)// CSP to SCOMP. A current proportional to the load current is supplied from this pin in order to implement the droop effect. See Section 8.4 for details. Error amplifier output. Connect with an (RSF - CSF)// CSP to SFB. The device cannot be disabled by pulling this pin low. SIMON Current monitor output. A current proportional to the output current is sourced from this pin. Connect through a resistor RSIMON to local GND. Based on pin voltage, overcurrent protection can be triggered. Filtering through CSIMON to GND allows control of the delay for OC intervention. See Section 9.2 for RSIMON definition. SREF/JEN The reference used for the regulation of the single-rail section is available on this pin with -100 mV + offset. Connect through an RSREF-CSREF to SRGND to optimize DVID transitions. See Section 8.6 for details. If Jmode is selected by Config1 pinstrapping, this pin is used as a logic input for the single-phase rail enable. Pulling this pin up above 0.8 V, the single-phase rail turns on. ENABLE Enable pin. External pull-up is needed on this pin. Forced low to disable the device with all MOSFETs OFF: all protection is disabled except for preliminary overvoltage. Over 0.65 V the device turns up. Cycle this pin to recover latch from protection, filter with 1 nF (typ.) to GND. STCOMP/ DDR SINGLE-RAIL SECTION Pin# Thermal monitor sensor gain and DDR selected. Connect proper resistor divider between VCC5 and GND to define the gain to apply to the signal sensed by ST to implement thermal compensation for the single-phase rail. See Section 10 for details. Short to GND to disable thermal compensation and set the device to DDR mode. DocID023399 Rev 3 L6718 Pin description and connection diagrams Table 2. Pin description (continued) 26 CONFIG1/ PSI1 27 SDA / CONFIG2 28 SCL / CONFIG3 29 VCC5 30 31 OSC/FLT SOSC / SFLT SMBus / PINSTRAPPING TCOMP Thermal monitor sensor gain. Connect proper resistor divider between VCC5 and GND to define the gain to apply to the signal sensed by TM to implement thermal compensation for the multi-phase rail. Short to GND to disable the single NTC thermal compensation for multiphase section. See Section 10 for details. Connect a resistor divider to GND and VCC5 to define power management configuration. See Section 6.6 for details. At the end of the soft-start, this pin is internally pulled up or pulled down to indicate the power status. See Table 17 for details. If SMBus power management is enabled through Config0 pinstrapping, connect to data signal of SMBus communicator. If SMBus power management is disabled through Config0 pinstrapping, connect a resistor divider to GND and VCC5 to define power management characteristics. See Section 6.6.5 for details. If SMBus power management is enabled through Config0 pinstrapping, connect to clock signal of SMBus communicator. If SMBus power management is disabled through Config0 pinstrapping, connect a resistor divider to GND and VCC5 to define power management characteristics. See Section 6.6.5 for details. Main IC power supply. Operative voltage is connected to 5 V filtered with 1 µF MLCC to GND. MULTI-RAIL SECTION 25 Function PINSTRAPPING MULTI-RAIL SECTION Name Oscillator pin for multi-phase rail. Allows the programming of the switching frequency FSW for multi-phase section. The equivalent switching frequency at the load side results in being multiplied by the number of phases active. The pin is internally set to 1.8 V, frequency is programmed according to a resistor connected to GND or VCC with a gain of 10 kHz/µA. Free running is set to 200 kHz. The pin is forced high (3.3 V) if a fault is detected on a multi-rail section. To recover from this condition, it is necessary to cycle VCC or enable. See Section 11 for details. SINGLE-RAIL SECTION Pin# Oscillator pin for single-phase. Allows the programming of the switching frequency FSW for the singlephase section. The pin is internally set to 1.8 V, frequency is programmed according to the resistor connected to GND or VCC with a gain of 10 kHz/µA. Free running is set to 200 kHz. The pin is forced high (3.3 V) if a fault is detected on a single-phase rail section. To recover from this condition, it is necessary to cycle VCC or enable. See Section 11 for details. DocID023399 Rev 3 15/71 Pin description and connection diagrams L6718 Table 2. Pin description (continued) SCSN 34 STM 35 CONFIG0 /PSI0 36 SBOOT 37 SHGATE 38 SPHASE 39 SLGATE 40 16/71 SCSP Single-phase rail current sense positive input. Connect through an R-C filter to the phase-side of single-phase rail inductor. See Section 14 for proper layout of this connection. SINGLE-RAIL SECTION 33 Function PINSTRAPPING 32 Name PWM4 / PH# SINGLE-RAIL SECTION Pin# Single-phase rail current sense negative input. Connect through an RG resistor to the output-side of single-phase rail inductor. Filter the output-side of RG with 100 nF (typ.) to GND. See Section 14 for proper layout of this connection. Thermal monitor sensor. Connect with proper network embedding NTC to the single-phase power section. The IC senses the hot spot temperature and uses the information to define the VRHOT signal and temperature zone register. By programming proper STCOMP gain, the IC also implements load-line thermal compensation for the single-phase section. Short to GND if not used. See Section 10 for details. Connect a resistor divider to GND and VCC5 to define power management characteristics. See Section 6.6 for details. At the end of the soft-start, this pin is internally pulled up or pulled down to indicate the power status. See Table 17 for details. Single-phase rail high-side driver supply. Connect through a capacitor (220 nF typ.) and a resistor (2.2 Ohm) to SPHASE and provide a Schottky bootstrap diode. A small resistor in series to the boot diode helps to reduce boot capacitor overcharge. Single-phase rail high-side driver output. It must be connected to the HS MOSFET gate. A small series resistor helps to reduce the device-dissipated power and the negative phase spike. Single-phase rail high-side driver return path. It must be connected to the HS MOSFET source and provides return path for the HS driver. Single-phase rail low-side driver output. It must be connected to the low-side MOSFET gate. A small series resistor helps to reduce device-dissipated power. Fourth phase PWM output of the multi-phase rail and phase number selection pin. Internally pulled up to 3.3 V, connect to external driver PWM4 when channel 4 is used. The device is able to manage the HiZ by setting the pin floating. Short to GND or leave floating to 3/2 phase operation, seeTable 7 for details. DocID023399 Rev 3 L6718 Pin description and connection diagrams Table 2. Pin description (continued) Pin# Name Function PWM3 / SPWM 42 PHASE1 Channel 1 HS driver return path. It must be connected to the HS1 MOSFET source and provides return path for the HS driver of channel 1. 43 HGATE1 MULTI-RAIL SECTION 41 Third phase PWM output of multi-phase rail or PWM output for singlephase rail. Connect to external driver PWM input if this channel is used. Internally pull up to 3.3 V, connect to external driver PWM3 when channel 3 is used (seeTable 7 for details). The device is able to manage HiZ status by setting the pin floating. If SWAP mode is selected by pinstrapping Config0, it must be connected to single-phase external driver SPWM, see Section 6.3 for details. Channel 1 HS driver output. It must be connected to the HS1 MOSFET gate. A small series resistor helps to reduce the device-dissipated power and the negative phase spike. Channel 1 HS driver supply. Connect through a capacitor (220 nF typ.) and a resistor (2.2 Ohm typ.) to PHASE1 and provide a Schottky bootstrap diode. A small resistor in series to the boot diode helps to reduce boot capacitor overcharge. BOOT1 45 VCC12 7 V supply. It is the low-side driver supply. It must be connected to the 7 V bus and filtered with 2 x 1 µf MLCC caps vs. GND. 46 BOOT2 Channel 2 high-side driver supply. Connect through a capacitor (220 nF typ.) and a resistor (2.2 Ohm typ.) to PHASE2 and provide a Schottky bootstrap diode. A small resistor in series to the boot diode helps to reduce boot capacitor overcharge. 47 HGATE2 Channel 2 high-side driver output. It must be connected to the HS2 MOSFET gate. A small series resistor helps to reduce the device-dissipated power and the negative phase spike 48 PHASE2 49 LGATE2 50 LGATE1 51 SVREADY MULTI-RAIL SECTION 44 Channel 2 HS driver return path. It must be connected to the HS2 MOSFET source and provides a return path for the HS driver of channel 2. Channel 2 low-side driver output. It must be connected to the LS2 MOSFET gate. A small series resistor helps to reduce device-dissipated power. Channel 1 low-side driver output. It must be connected to the LS1 MOSFET gate. A small series resistor helps to reduce device-dissipated power. Single-phase rail VREADY Open drain output set free after SS has finished and pulled low when triggering any protection on the single-phase rail. Pull up to a voltage lower than 3.3 V (typ.), if not used it can be left floating. DocID023399 Rev 3 17/71 Pin description and connection diagrams L6718 Table 2. Pin description (continued) 52 53 Function Multi-phase rail VREADY Open drain output set free after SS has finished and pulled low when triggering any protection on multi-phase rail. Pull up to a voltage lower than 3.3 V (typ.), if not used it can be left floating VREADY CS4N Channel 4 current sense negative input. Connect through an RG resistor to the output-side of channel 4 inductor. Filter the output-side of RG with 100 nF (typ.) to GND. Connect to VOUT through an RG resistor when not using channel 4. See Section 14 for proper layout of this connection. Channel 4 current sense positive input. Connect through an R-C filter to the phase-side of channel 3 inductor. Short to VOUT when not using channel 4. See Section 14 for proper layout of this connection. 54 CS4P 55 CS2P Channel 2 current sense positive input. Connect through an R-C filter to the phase-side of channel 2 inductor. See Section 14 for proper layout of this connection. CS2N Channel 2 current sense negative input. Connect through an RG resistor to the output-side of channel 2 inductor. Filter the output-side of RG with 100 nF (typ.) to GND. See Section 14 for proper layout of this connection. GND GND connection. Exposed pad connects also the silicon substrate. It makes a good thermal contact with the PCB to dissipate the internal power. All internal references and logic are referenced to this pin. Connect to power GND plane using 5.3 x 5.3 mm square area on the PCB and with 9 vias (uniformly distributed) to improve electrical and thermal conductivity. 56 PAD 18/71 Name MULTI-RAIL SECTION Pin# DocID023399 Rev 3 L6718 2.2 Pin description and connection diagrams Thermal data Table 3. Thermal data Symbol Parameter Value Unit Rth(JA) Thermal resistance junction-to-ambient (device soldered on 2s2p PC board) 27 °C/W TMAX Maximum junction temperature 150 °C TSTG Storage temperature range -40 to 150 °C TJ Junction temperature range -25 to 125 °C Ptot Maximum power dissipation at Tamb = 25 °C 2.5 W DocID023399 Rev 3 19/71 Electrical specifications L6718 3 Electrical specifications 3.1 Absolute maximum ratings Table 4. Absolute maximum ratings Symbol Parameter Value Unit -0.3 to 7.5 V -0.3 to VCC12 + 0.3 V 15 V VUGATEx-VPHASEx -0.3 to VCC12 + 0.3 V LGATEx to GND -0.3 to VCC12 + 0.3 V Negative peak voltage to GND t< 400 ns. BOOT>3.5 V -8 V Positive peak voltage to GND t< 200 ns 35 V VCC12 To GND VBOOTX-VPHASEx Positive peak voltage t 0, from pinstrapping; multiphase section 2.5 2.8 3.1 mV/μs Vboot > 0, from pinstrapping; singlephase section 2.5 2.8 3.1 mV/μs 0.65 V SS time Turn-on VENABLE rising Turn-off VENABLE falling ENABLE 0.4 V 0.6 V SVI Serial Bus SVCLCK, SVDATA SVDATA, ALERT# Input high Input low Voltage low (ACK) ISINK = -5 mA 0.4 V 50 mV Reference and current reading KVID VOUT accuracy (MPhase) IOUT=0 A; N=4; RG= 810 Ω; RFB=2.125 kΩ -0.5 0.5 % KSVID VOUT accuracy (SPhase) IOUT=0 A RG=1.1 kΩ; RFB = 6.662 kΩ -0.5 0.5 % DROOP LL accuracy (MPhase) 0 to full load IINFOx=0; N=4; VID>1 V RG=810 Ω; RFB=2.125 kΩ -2.5 2 μA DROOP LL accuracy (MPhase) 0 to full load IINFOx=20 μA; N=4; VID>1 V RG=810 Ω; RFB=2.125 kΩ -3.5 4 μA SDROOP LL accuracy (SPhase) 0 to full load ISCSN=0; VID>1 V RG=1.1 kΩ; RFB=6.662 kΩ -0.75 0.75 μA SDROOP LL accuracy (SPhase) 0 to full load ISCSN=20 μA;VID>1 V RG=1.1 kΩ; RFB=6.662 kΩ -1.5 1.5 μA DocID023399 Rev 3 21/71 Electrical specifications L6718 Table 5. Electrical characteristics (continued) Symbol kIMON kSIMON Parameter IMON accuracy (MPhase) SIMON accuracy (SPhase) A0 EA DC gain SR Slew rate Test conditions Min. IINFOx=0 μA; N=4; RG=810 Ω; RFB=2.125 kΩ IINFOx=20 μA; N=4; RG=810 Ω; RFB=2.125 kΩ ISCSN=0 μA; RG=1.1 kΩ; RFB=6.662 kΩkΩ ISCSN=20 μA; RG=1.1 kΩ; RFB=6.662 Slew rate fast DVID Max. Unit -1.5 1.5 μA -2 2 μA -0.75 0.75 μA -1 1 μA COMP, SCOMP to GND = 10 pF Typ. 100 dB 20 V/μs 10 mV/μs 2.5 mV/μs 10 mV/μs 2.5 mV/μs Multi-phase section Slew rate slow Slew rate fast DVID Single-phase section Slew rate slow GetReg(15h) IMON ADC Accuracy CC VIMON = 0.992 V C0 Hex CF Hex PWM OUTPUTS PWM3 / SPWM Output high I = 1 mA Output low I = -1 mA 5 V 0.2 V 10 μA VSEN rising; wrt Ref. +175 mV VSEN rising; wrt Ref. +500 mV mV IPWM3,IPWM4 Pull-up current Protection (both sections) OVP Overvoltage protection UVP Undervoltage protection VSEN falling; wrt Ref; Ref > 500 mV -500 FBR DISC FB disconnection Vcs - rising above VSEN/SVSEN +700 FBG DISC FBG disconnection EA NI input wrt VID +500 VREADY, SVREADY, VRHOT Voltage low I = - 4 mA VOC_TOT Overcurrent threshold VIMON, VSIMON rising IOC_TH Constant current VRHOT Voltage low 0.4 V 1.70 V 1.55 V 35 μA ISINK = -5 mA 13 mΩ Gate drives control tRISE_UGATE 22/71 High-side rise time BOOTx - PHASEx =7 V CUGATE to GND=3.3 nF DocID023399 Rev 3 20 ns L6718 Electrical specifications Table 5. Electrical characteristics (continued) Symbol Parameter Test conditions Min. Typ. Max. Unit IUGATEx High-side source current BOOTx - PHASEx =7 V TBD A RUGATEx High-side sink resistance BOOTx - PHASEx =7 V; 100 mA 2.1 Ω tRISE_LGATE Low-side rise time VCC12 =7 V CLGATE to GND=5.6 nF 20 ns ILGATEx Low-side source current VCC12 = 7 V TBD A RLGATEx Low-side sink resistance VCC12 = 7 V; 100 mA 2 Ω DocID023399 Rev 3 23/71 VID tables 4 L6718 VID tables Table 6. VID table, both sections, commanded through serial bus HEX code 24/71 VOUT [V] HEX code VOUT [V] HEX code VOUT [V] HEX code VOUT [V] 0 0 0.000 4 0 0.565 8 0 0.885 C 0 1.205 0 1 0.250 4 1 0.570 8 1 0.890 C 1 1.210 0 2 0.255 4 2 0.575 8 2 0.895 C 2 1.215 0 3 0.260 4 3 0.580 8 3 0.900 C 3 1.220 0 4 0.265 4 4 0.585 8 4 0.905 C 4 1.225 0 5 0.270 4 5 0.590 8 5 0.910 C 5 1.230 0 6 0.275 4 6 0.595 8 6 0.915 C 6 1.235 0 7 0.280 4 7 0.600 8 7 0.920 C 7 1.240 0 8 0.285 4 8 0.605 8 8 0.925 C 8 1.245 0 9 0.290 4 9 0.610 8 9 0.930 C 9 1.250 0 A 0.295 4 A 0.615 8 A 0.935 C A 1.255 0 B 0.300 4 B 0.620 8 B 0.940 C B 1.260 0 C 0.305 4 C 0.625 8 C 0.945 C C 1.265 0 D 0.310 4 D 0.630 8 D 0.950 C D 1.270 0 E 0.315 4 E 0.635 8 E 0.955 C E 1.275 0 F 0.320 4 F 0.640 8 F 0.960 C F 1.280 1 0 0.325 5 0 0.645 9 0 0.965 D 0 1.285 1 1 0.330 5 1 0.650 9 1 0.970 D 1 1.290 1 2 0.335 5 2 0.655 9 2 0.975 D 2 1.295 1 3 0.340 5 3 0.660 9 3 0.980 D 3 1.300 1 4 0.345 5 4 0.665 9 4 0.985 D 4 1.305 1 5 0.350 5 5 0.670 9 5 0.990 D 5 1.310 1 6 0.355 5 6 0.675 9 6 0.995 D 6 1.315 1 7 0.360 5 7 0.680 9 7 1.000 D 7 1.320 1 8 0.365 5 8 0.685 9 8 1.005 D 8 1.325 1 9 0.370 5 9 0.700 9 9 1.010 D 9 1.330 1 A 0.375 5 A 0.705 9 A 1.015 D A 1.335 1 B 0.380 5 B 0.710 9 B 1.020 D B 1.340 1 C 0.385 5 C 0.715 9 C 1.025 D C 1.345 1 D 0.390 5 D 0.720 9 D 1.030 D D 1.350 1 E 0.395 5 E 0.725 9 E 1.035 D E 1.355 DocID023399 Rev 3 L6718 VID tables Table 6. VID table, both sections, commanded through serial bus (continued) HEX code VOUT [V] HEX code VOUT [V] HEX code VOUT [V] HEX code VOUT [V] 1 F 0.400 5 F 0.730 9 F 1.040 D F 1.360 2 0 0.405 6 0 0.735 A 0 1.045 E 0 1.365 2 1 0.410 6 1 0.740 A 1 1.050 E 1 1.370 2 2 0.415 6 2 0.745 A 2 1.055 E 2 1.375 2 3 0.420 6 3 0.750 A 3 1.060 E 3 1.380 2 4 0.425 6 4 0.755 A 4 1.065 E 4 1.385 2 5 0.430 6 5 0.760 A 5 1.070 E 5 1.390 2 6 0.435 6 6 0.765 A 6 1.075 E 6 1.395 2 7 0.440 6 7 0.770 A 7 1.080 E 7 1.400 2 8 0.445 6 8 0.775 A 8 1.085 E 8 1.405 2 9 0.450 6 9 0.780 A 9 1.090 E 9 1.410 2 A 0.455 6 A 0.785 A A 1.095 E A 1.415 2 B 0.460 6 B 0.790 A B 1.100 E B 1.420 2 C 0.465 6 C 0.795 A C 1.105 E C 1.425 2 D 0.470 6 D 0.800 A D 1.110 E D 1.430 2 E 0.475 6 E 0.805 A E 1.115 E E 1.435 2 F 0.480 6 F 0.810 A F 1.120 E F 1.440 3 0 0.485 7 0 0.815 B 0 1.125 F 0 1.445 3 1 0.490 7 1 0.820 B 1 1.130 F 1 1.450 3 2 0.495 7 2 0.825 B 2 1.135 F 2 1.455 3 3 0.500 7 3 0.830 B 3 1.140 F 3 1.460 3 4 0.505 7 4 0.835 B 4 1.145 F 4 1.465 3 5 0.510 7 5 0.840 B 5 1.150 F 5 1.470 3 6 0.515 7 6 0.845 B 6 1.155 F 6 1.475 3 7 0.520 7 7 0.850 B 7 1.160 F 7 1.480 3 8 0.525 7 8 0.855 B 8 1.165 F 8 1.485 3 9 0.530 7 9 0.860 B 9 1.170 F 9 1.490 3 A 0.535 7 A 0.865 B A 1.175 F A 1.495 3 B 0.540 7 B 0.870 B B 1.180 F B 1.500 3 C 0.545 7 C 0.875 B C 1.185 F C 1.505 3 D 0.550 7 D 0.880 B D 1.190 F D 1.510 3 E 0.555 7 E 0.905 B E 1.195 F E 1.515 3 F 0.560 7 F 0.880 B F 1.200 F F 1.520 DocID023399 Rev 3 25/71 Device description and operation 5 L6718 Device description and operation The L6718 dual output PWM controller provides an optimized solution for Intel VR12 CPUs and DDR memory. The three embedded high-current drivers guarantee high performance in a very compact motherboard design. Both sections feature a differential voltage sensing and provide complete control logic and protection for high performance stepdown DC-DC voltage regulators. The multi-phase rail is designed for Intel VR12 CORE or DDR section and features from 2 to 4 phases. The single-phase rail is designed for the GPU section or VTT, or as independent DC-DC voltage regulator. The multi-phase buck converter is the simplest and most cost-effective topology employable in order to satisfy the high-current requirements of the new microprocessors and modern high-current VRMs. It allows distribution of equal load and power between the phases using smaller and cheaper, and more common, external Power MOSFETs and inductors. The device features 2nd generation LTB Technology™: through a load transient detector, it is able to turn on simultaneously all the phases. This allows the minimization of the output voltage deviation and the system cost by providing the fastest response to a load transient. The device features an additional power management interface compliant with SMBus 2.0 specifications. This feature increases the system application flexibility; the main voltage regulation parameter (such as overclocking) can be modified while the application is running, assuring fast and reliable transition. The device can be run also as a DDR supply which uses the single-phase for the termination voltage. The L6718 is designed to run with 2 embedded drivers for the multi-phase rail and one for the single-phase rail. By using the SWAP mode, it is possible to move all 3 embedded drivers for the multi-phase rail while the single-phase rail is controlled by an external PWM. Single-phase rail can also be turned off. The device supports Jmode; with this feature the single-phase rail becomes an independent rail with an external enable and VREADY. The L6718 implements current reading across the inductor in fully differential mode. A sense resistor in series to the inductor can also be considered to improve reading precision. The current information read corrects the PWM output in order to equalize the average current carried by each phase of the multi-phase rail section. The controller supports VR12 specifications featuring a 25-MHz SVI bus and all the required registers. The platform can program the default registers through dedicated pinstrapping. A complete set of protections is available: overvoltage, undervoltage, overcurrent (perphase and total) and feedback disconnection guarantees the load to be safe for both rails under all circumstances. Special power management features like DPM and VFDE modify the phase number, and switching frequency to optimize the efficiency over the load range. The L6718 is available in VFQFPN56 with 7x7 mm body package. 26/71 DocID023399 Rev 3 L6718 Device description and operation Figure 6. Device initialization VCC5 UVLO VCC12 2 mSec POR UVLO 50 μ Sec ENABLE ENVTT SVI BUS Command ACK but not executed SVI Packet V_SinglePhase SVI Packet 64 μ Sec SVREADY V_MultiPhase 64 μ Sec VREADY AM12880v1 DocID023399 Rev 3 27/71 Device configuration 6 L6718 Device configuration The device is designed to provide power supply to the Intel VR12 CPUs, DDR memory and also for DC-DC power supply general purposes. It features a universal serial data bus fully compliant with Intel VR12/IMVP7 protocol rev. 1.5. document #456098. The controller can be set to work in 2 main configurations: CPU mode and DDR mode which include also the settings for DC-DC general purposes. In CPU mode the device is able to manage the multi-phase rail to supply the Intel CPU CORE section while single-phase rail can be used for the graphics section embedded on the VR12 CPUs. Setting the DDR mode, the device uses the multi-phase rail to provide the DDR memory power supply (or DC-DC for general purposes) and it is possible to select the single-phase rail to supply the VTT termination voltage. Setting SWAP mode moves all three embedded drivers to run for the multi-phase rail section while an external PWM provides the regulation for the single-phase. In this configuration the single-phase rail can also be disabled, therefore moving the device to run with the multi-phase rail only (MRO mode). Setting Jmode, the single-phase rail becomes an independent DC-DC converter with enable and Power Good (SVREADY. The 2 main configurations (CPU mode and DDR mode) can be combined with SWAP mode, MRO mode and Jmode in order to maximize the number of device configurations to fit any motherboard. 6.1 CPU mode The device enters CPU mode by connecting the STCOMP/DDR pin to an external divider. After the soft-start the controller uses the STCOMP pin for thermal monitoring (see Section 10.3). In this configuration the device provides the power supply for the VR12 CPU CORE section by using the multi-phase rail while, if Jmode and MRO are disabled, the single-phase rail is used to supply the VR12 CPU GPU section. The controller use 00h as SVID bus address for the multi-phase rail while the single-phase rail, if used for the GPU section, is addressed by 01h, following the SVID Intel specifications for VR12 CPUs. In MRO mode it is possible to address the CPU with 00h or 01h. In CPU mode it is possible to set up the Jmode, Swap mode and MRO mode in order to have maximum flexibility for the power supply solution. 6.2 DDR mode DDR mode can be enabled by shorting the STCOMP/DDR pin to GND. During the startup, the device reads the voltage on the STCOMP/DDR pin and, if it is under 0.3 V, the DDR mode is set up and the device is able to supply DDR memory or the DC-DC converter for general purposes. 28/71 DocID023399 Rev 3 L6718 Device configuration The multi-phase rail can be configured to supply DDR2, DDR3 and DDR4 while, if Jmode and MRO mode are disabled, the single-phase rail is set automatically to supply the DDR voltage termination VDDQ/2 (reference is to VSEN/2) and the SIMAX embedded register is fixed at 30 A. The main characteristics are fixed by pinstrapping (see Section 6.6) and the single NTC thermal compensation is disabled on the single-phase rail. In DDR mode it is possible to set up the Jmode, Swap mode and MRO mode in order to have maximum flexibility for the power supply solution. 6.3 SWAP mode SWAP mode can be configured by the CONFIG0 pinstrapping pin (see Section 6.6.1 and Section 6.6.2). If SWAP mode is selected, the device swaps the embedded driver of the single-phase rail PWM with the third phase PWM3. This means that the single-rail becomes the third phase driver for the multi-phase rail section. As a consequence, the single-rail PWM signal is provided on the PWM3/SPWM pin and the single-phase rail runs with an external driver. There is no change for PWM4. Using all three embedded drivers for the multi-phase rail section guarantees a very compact solution for high integrated VRM design while the external driver single-rail section can be the optimal solution VRM single-phase designed far from the controller. Once SWAP mode is enabled the VFDE on the single-phase rail is disabled and it can not be turned on by the SMBus or pinstrapping. Dr1 Dr2 Multiphase Rail Dr1 Multiphase Rail Dr2 Figure 7. SWAP mode PWM4 PWM4 Dr3 DrS PWMS PWM3 Singlephase Rail Singlephase Rail SWAP mode No SWAP mode AM12881v1 6.3.1 MRO - multi-phase rail only If SWAP mode is set and the PWM3/SPWM pin is left floating, the system is configured with the single-phase rail disabled. This configuration sets the controller to switch with only the multi-phase rail (MRO - multi-phase rail only) ignoring any event on the single-phase rail. The number of switching phase can be enabled by using PWM4 (see Table 7). If the device is configured in MRO mode and in CPU mode, it is possible to select the SVID bus addressing between 00h and 01h by the CONFIG0 pin (see Section 6.6.1 and DocID023399 Rev 3 29/71 Device configuration L6718 Section 6.6.2 ). This function can be useful in applications where the graphics section needs to be designed with a multi-phase rail. When setting MRO mode, the single-phase rail is off and Jmode can not be enabled. Jmode bitstrapping is still used to select the multi-phase number (see Table 7). 6.4 Jmode Jmode is selectable during startup through the CONFIG1 pinstrapping pin (see Section 6.6.3 and Section 6.6.4). If Jmode is configured, the controller sets the single-phase rail to switch as a completely independent single-phase rail. As a consequence: 1. Single-phase rail is not addressed by the SVID bus. The device replies with a NACK to any request by the CPU to communicate with the single-phase rail. 2. Single-phase rail becomes the DC-DC controller with an internal reference fixed at 0.75 V, so it is possible to select the output voltage by using a divider. 3. Droop is disabled on the single-phase rail. 4. The SREF/JEN pin is configured as single-phase rail enable. As a consequence, this pin becomes a digital logic input. If it is set HIGH, the device turns on the single-phase rail, otherwise the single rail remains off. An embedded pull-up sets the pin floating to high. 5. The SVREADY is still used as single-phase Power Good. 6. Single-phase rail maximum current embedded register is fixed at 30 A. 7. In CPU mode, using the CONFIG0 pinstrapping, it is possible to set the used multiphase rail address to 01h (to supply the graphics section). 8. If a fault occurs on the multi-phase rail, the single-phase rail still runs. 9. If the device is set in a debug configuration (see Section 6.6), the multi-phase can turn on only if Jmode is on, while in operating configuration the multi-phase rail and singlephase rail can be turned on independently. Jmode is an option for motherboard designs which need the multi-phase rail section to supply the CPU CORE or DDR sections but they also need a single-phase high performance DC-DC converter to supply other rails on the motherboard (such as VCCIO). Jmode offers an advantage by having a free high performance single-phase buck controller with voltage and current remote differential sensing, LTB, and voltage and current protection. Output voltage can be increased with the use of an external divider or by adding offset with SMBus or pinstrapping. 6.5 Phase number configuration The multi-phase rail can be configured from 2 to 4-phase switching while the single-phase rail can be also set off in MRO only. By using pinstrapping it is also possible to select the number of embedded drivers used for the multi-phase rail (see Table 7). During soft-start the device is able to check the status of the PWMx pins and set the multiphase rail total phase number. Setting SWAP mode the device uses all the embedded drivers for the multi-phase rail section while external PWM is used for the single-phase rail (see Section 6.3 for details). Jmode can change the status of the total phase number only in MRO (see Section 6.3.1 for details). 30/71 DocID023399 Rev 3 L6718 Caution: Device configuration For the disabled phase(s), the current reading pins need to be properly connected to avoid errors in current-sharing and voltage-positioning: CSxP must be connected to the regulated output voltage while CSxN must be connected to CSxP through the same RG resistor used for the active phases. Table 7. Phase number programming Total solution (multi+single) Embedded driver assignment PWM4 / PHSEL PWM3 / SPWM SWAP(1) Jmode(2) (multi+single) 4+1 2+1 OFF Driver 4+1 3+0 ON Driver 3+1 2+1 OFF X(3) GND 3+1 3+0 2+1 2+1 ON Floating Floating OFF MRO(4) (multi-phase rail only) 4+0 3+0 3+0 3+0 Driver X Floating ON ON Floating/GND 2+0 2+0 OFF 1. SWAP mode can be enabled/disabled through Config0 pinstrapping (seeSection 6.6.1 and Section 6.6.2). 2. Jmode can be enabled/disabled through Config1 pinstrapping (see Section 6.6.3 and Section 6.6.4). 3. Jmode can be enabled/disabled. 4. In MRO the single-phase is disabled. 6.6 Pinstrapping configuration Pinstrapping is used to select different configuration settings. The pinstrapping must be connected through a divider to the VCC5 pin and to GND. During startup, the device reads the voltage level on the pinstrapping pins and selects the right configuration from 32 configurations (5 bitstrappings) for each pinstrapping. Pinstrapping configuration depends also on: • Device status (CPU or DDR mode) • Number of phases configured • Status of other pinstrappings DocID023399 Rev 3 31/71 Device configuration 6.6.1 L6718 CONFIG0 in CPU mode Config0/PSI0 is a multi-functional pin, during startup, it is used as CONFIG0 pinstrapping to select the device configuration. CONFIG0 select (see Table 8): 32/71 a) SWAP mode: Set SWAP ON to enter SWAP mode. As a consequence, all 3 embedded drivers run for the multi-phase rail (see Section 6.3). b) SMBus: Set SMBus OFF to disable SMBus function. As a consequence, pins CONFIG2/SDA and CONFIG3/SCL are used as pinstrapping CONFIG2 and CONFIG3 (see Section 6.6.5 and Section 6.6.6). If SMBus is set ON, pins CONFIG2/SDA and CONFIG3/SCL are set as serial data (SDA) and serial clock (SCL) used for the SMBus communication (see Section 7.1). c) If Jmode is set ON by CONFIG1 pinstrapping (see Section 6.6.3), it is possible to select the serial VID address of the rail between 00h and 01h. This option can be useful in designs where multi-phase rail is necessary for the graphics section. The boot voltage for the multi-phase rail can be selected from 0.9 V, 1 V and 1,1 V, which are for debug mode, while operating mode is set to 0 V. d) If Jmode is set OFF and the single-phase rail is used to supply the graphics (no MRO mode condition), it is possible to set the single-phase rail between 30 A and 35 A while the voltage boot can change between 0 V and 1 V for the multi-phase rail and 0 V, 0,9 V, 1 V and 1,1 V for the single-phase rail. The only operating mode configuration is 0 V for both rails. e) If the PMW3/SPMW pin is floating and CONFIG0 is set with SWAP to ON, the device is configured in multi-phase rail only (MRO). In MRO the single-phase rail is OFF so CONFIG0 is set as in point c. DocID023399 Rev 3 L6718 Device configuration Table 8. CONFIG0/PSI0 pinstrapping in CPU MODE Pinstrapping (1) divider (KOhm) SWAP mode SMBus SVID (2) status Jmode ON (3) Multi Jmode OFF & MRO disable (4) MRO enable (5) SIMA Multi Single SIMAX X Vboot Vboot / ADD Multi SVID ADD Vboot Debug 00h 1V 30 A 1V 1V OFF Debug 00h 0.9 V 30 A 0V 0.9 V OFF OFF Debug 00h 1.1 V 30 A 0V 1.1 V 100 OFF OFF Operating 00h 0V 30 A 0V 0V 16 51 OFF OFF Debug 01h 1V 35 A 1V 1V 16 39 OFF OFF Debug 01h 0.9 V 35 A 0V 0.9 V 13 18 OFF OFF Debug 01h 1.1 V 35 A 0V 1.1 V 18 110 OFF OFF Operating 01h 0V 35 A 0V 0V 91 12 OFF ON Debug 00h 1V 30 A 1V 1V 120 51 OFF ON Debug 00h 0.9 V 30 A 0V 0.9 V 91 15 OFF ON Debug 00h 1.1V 30 A 0V 1.1 V 120 39 OFF ON Operating 00h 0V 30 A 0V 0V 100 20 OFF ON Debug 01h 1V 35 A 1V 1V 14,7 15 OFF ON Debug 01h 0.9 V 35 A 0V 0.9 V 39 11 OFF ON Debug 01h 1.1 V 35 A 0V 1.1 V 43 16 OFF ON Operating 01h 0V 35 A 0V 0V 75 18 ON OFF Debug 00h 1V 30A 1V 1V 00h 1V 68 56 ON OFF Debug 00h 0.9 V 30A 0V 0.9 V 00h 0.9 V 47 43 ON OFF Debug 00h 1.1 V 30A 0V 1.1 V 00h 1.1 V 82 39 ON OFF Operating 00h 0V 30A 0V 0V 00h 0V 36 62 ON OFF Debug 01h 1V 35A 1V 1V 01h 1V 39 75 ON OFF Debug 01h 0.9 V 35A 0V 0.9 V 01h 0.9 V 33 51 ON OFF Debug 01h 1.1 V 35A 0V 1.1 V 01h 1.1 V 18 39 ON OFF Operating 01h 0V 35A 0V 0V 01h 0V 750 10 ON ON Debug 00h 1V 30A 1V 1V 00h 1V 56 30 ON ON Debug 00h 0.9 V 30A 0V 0.9 V 00h 0.9 V 20 12 ON ON Debug 00h 1.1 V 30A 0V 1.1 V 00h 1.1 V 390 16 ON ON Operating 00h 0V 30A 0V 0V 00h 0V 390 27 ON ON Debug 01h 1V 35A 1V 1V 01h 1V 36 24 ON ON Debug 01h 0.9 V 35A 0V 0.9 V 01h 0.9 V R up R down 13 36 OFF OFF 24 27 OFF 24 30 27 Vboot Not applicable DocID023399 Rev 3 33/71 Device configuration L6718 Table 8. CONFIG0/PSI0 pinstrapping in CPU MODE (continued) Pinstrapping (1) divider (KOhm) SWAP mode SMBus R up R down 27 20 ON ON 150 15 ON ON SVID (2) status Jmode ON (3) Jmode OFF & MRO disable (4) MRO enable (5) Multi Vboot SIMA Multi Single SIMAX X Vboot Vboot / ADD Vboot 01h 1.1 V 35 A 0V 1.1 V 01h 1.1 V 01h 0V 35 A 0V 0V 01h 0V SVID ADD Debug Operating Multi 1. Suggested values, divider need to be connected between VCC5 pin and GND. 2. The operating mode (SVID bus 25 MHz) is only with Vboot =0 V. 3. The 0 V multi-phase rail Vboot is the only operating mode. 4. If Jmode is OFF and MRO disabled, it is possible to select the single-phase rail maximum current and boot voltage. 5. To select MRO see Section 6.3.1. 6.6.2 CONFIG0 in DDR mode (STCOMP=GND) If the STCOM/DDR pin is short to GND, the device is set in DDR mode. During startup, the CONFIG0/PSI0 pin works as CONFIG0 pinstrapping, and it is possible to select the following (seeTable 9): 34/71 a) Output voltage: VOUT can be selected to support DDR3 (1.5 V/1.35 V) and DDR4 (1.2 V). The only debug mode is for DDR3. b) SVID address: the serial VID address can be selected between 02h and 04h for DDR3, while in DDR4 also the SVID address 06h or 08h can be selected. The status of the SVID address can be used with the Address_Domain (settable by CONFIG1 pinstrapping) to select also the SMBus address for the multi-phase rail and the single-phase rail. See Table 14 for details. c) In DDR mode the debug configuration is not settable and SVID is set only in operating mode (CLK to 25 MHz). d) SMBus: set SMBus OFF to disable SMBus function. As a consequence pins CONFIG2/SDA and CONFIG3/SCL are used as pinstrapping CONFIG2 and CONFIG3 (see Section 6.6.5 and Section 6.6.6). If SMBus is set ON, pins CONFIG2/SDA and CONFIG3/SCL are set as serial data (SDA) and serial clock (SCL) used for the SMBus communication (See Section 7.1). e) SWAP mode: set SWAP ON to enter SWAP mode. As a consequence all 3 embedded drivers run for the multi-phase rail (see Section 6.3). DocID023399 Rev 3 L6718 Device configuration Table 9. CONFIG0/PSI0 pinstrapping in DDR MODE (1) Pinstrapping divider (KOhm) Vboot SVID ADD SWAP mode SMBus R up R down 750 10 1.5 V 02h OFF OFF 390 16 1.5 V 02h OFF ON 390 27 1.5 V 02h ON OFF 150 15 1.5 V 02h ON ON 91 12 1.5 V 04h OFF OFF 91 15 1.5 V 04h OFF ON 100 20 1.5 V 04h ON OFF 75 18 1.5 V 04h ON ON 39 11 1.35 V 02h OFF OFF 120 39 1.35 V 02h OFF ON 43 16 1.35 V 02h ON OFF 120 51 1.35 V 02h ON ON 82 39 1.35 V 04h OFF OFF 56 30 1.35 V 04h OFF ON 20 12 1.35 V 04h ON OFF 36 24 1.35 V 04h ON ON 27 20 1.2 V 06h OFF OFF 68 56 1.2 V 06h OFF ON 47 43 1.2 V 06h ON OFF 14,7 15 1.2 V 06h ON ON 24 27 1.2 V 08h OFF OFF 24 30 1.2 V 08h OFF ON 13 18 1.2 V 08h ON OFF 33 51 1.2 V 08h ON ON 36 62 1.2 V 02h OFF OFF 39 75 1.2 V 02h OFF ON 18 39 1.2 V 02h ON OFF 16 39 1.2 V 02h ON ON 13 36 1.2 V 04h OFF OFF 16 51 1.2 V 04h OFF ON 27 100 1.2 V 04h ON OFF 18 110 1.2 V 04h ON ON 1. Suggested values, divider must be connected between VCC5 pin and GND. DocID023399 Rev 3 35/71 Device configuration 6.6.3 L6718 CONFIG1 in CPU mode Config1/PSI1 is a multi-functional pin, during startup it is used as pinstrapping. Setting the device in CPU mode it is possible to select: a) TMAX. Maximum temperature can be set from 90 °C, 100 °C, 110 °C and 120 °C. b) IMAX. Maximum current for the multi-phase rail can be selected by pinstrapping as required by Intel specifications. The maximum current can be selected by 4 values which can change depending on the number of the phases selected (see Section 6.5). c) Jmode. It is possible to set Jmode (see Section 6.4). In MRO mode the singlephase rail remains off and Jmode bitstrapping is used to change the number of switching phases (see Table 7). Table 10. CONFIG1/PSI1 pinstrapping in CPU MODE Pinstrapping (1) divider (KOhm) 36/71 R up R down 750 10 390 IMAX TMAX Jmode 2-phase 3-phase 4-phase 90 °C 55 A 65 A 100 A OFF 16 90 °C 55 A 65 A 100 A ON 390 27 90 °C 60 A 75 A 112 A OFF 150 15 90 °C 60 A 75 A 112 A ON 91 12 90 °C 65 A 95 A 120 A OFF 91 15 90 °C 65 A 95 A 120 A ON 100 20 90 °C 75 A 112 A 130 A OFF 75 18 90 °C 75 A 112 A 130 A ON 39 11 100 °C 55 A 65 A 100 A OFF 120 39 100 °C 55 A 65 A 100 A ON 43 16 100 °C 60 A 75 A 112 A OFF 120 51 100 °C 60 A 75 A 112 A ON 82 39 100 °C 65 A 95 A 120 A OFF 56 30 100 °C 65 A 95 A 120 A ON 20 12 100 °C 75 A 112 A 130 A OFF 36 24 100 °C 75 A 112 A 130 A ON 27 20 110 °C 55 A 65 A 100 A OFF 68 56 110 °C 55 A 65 A 100 A ON 47 43 110 °C 60 A 75 A 112 A OFF 14,7 15 110 °C 60 A 75 A 112 A ON 24 27 110 °C 65 A 95 A 120 A OFF 24 30 110 °C 65 A 95 A 120 A ON 13 18 110 °C 75 A 112 A 130 A OFF DocID023399 Rev 3 L6718 Device configuration Table 10. CONFIG1/PSI1 pinstrapping in CPU MODE (continued) Pinstrapping (1) divider (KOhm) R up R down 33 51 36 IMAX TMAX Jmode 2-phase 3-phase 4-phase 110 °C 75 A 112 A 130 A ON 62 120 °C 55 A 65 A 100 A OFF 39 75 120 °C 55 A 65 A 100 A ON 18 39 120 °C 60 A 75 A 112 A OFF 16 39 120 °C 60 A 75 A 112 A ON 13 36 120 °C 65 A 95 A 120 A OFF 16 51 120 °C 65 A 95 A 120 A ON 27 100 120 °C 75 A 112 A 130 A OFF 18 110 120 °C 75 A 112 A 130 A ON 1. Suggested values, divider must be connected between VCC5 pin and GND. 6.6.4 CONFIG1 in DDR mode (STCOMP=GND) If the STCOM/DDR pin is short to GND, the device is set in DDR mode. Using the CONFIG1 pin it is possible to select (see Table 14): a) TMAX. Maximum temperature can be set between 90 °C and 120 °C. b) Address_Domain. It is possible to select the SMBus address (see Table 14). c) IMAX. The multi-phase maximum current can be selected between 2 values according to the number of switching phases of the multi-phase rail. d) Droop. If the droop function is enabled, the current on the FB pin is 50% of the total current read (Section 8.2). e) Jmode. Jmode configuration can be set (see Section 6.4). In MRO mode singlephase rail remains off and by setting Jmode it is possible to change the multiphase rail switching phase number (see Table 7). Table 11. CONFIG1/PSI1 pinstrapping in DDR MODE Pinstrapping (1) divider (KOhm) TMAX R up R down 750 10 90 °C 390 16 390 IMAX Add/ DOM Droop Jmode 2-phase 3-phase 4-phase 0 54 A 66 A 76 A OFF OFF 90 °C 0 54 A 66 A 76 A OFF ON 27 90 °C 0 54 A 66 A 76 A ON OFF 150 15 90 °C 0 54 A 66 A 76 A ON ON 91 12 90 °C 0 66 A 76 A 88 A OFF OFF 91 15 90 °C 0 66 A 76 A 88 A OFF ON 100 20 90 °C 0 66 A 76 A 88 A ON OFF DocID023399 Rev 3 37/71 Device configuration L6718 Table 11. CONFIG1/PSI1 pinstrapping in DDR MODE (continued) Pinstrapping (1) divider (KOhm) TMAX R up R down 75 18 90 °C 39 11 120 IMAX Add/ DOM Droop Jmode 2-phase 3-phase 4-phase 0 66 A 76 A 88 A ON ON 90 °C 1 54 A 66 A 76 A OFF OFF 39 90 °C 1 54 A 66 A 76 A OFF ON 43 16 90 °C 1 54 A 66 A 76 A ON OFF 120 51 90 °C 1 54 A 66 A 76 A ON ON 82 39 90 °C 1 66 A 76 A 88 A OFF OFF 56 30 90 °C 1 66 A 76 A 88 A OFF ON 20 12 90 °C 1 66 A 76 A 88 A ON OFF 36 24 90 °C 1 66 A 76 A 88 A ON ON 27 20 120 °C 0 54 A 66 A 76 A OFF OFF 68 56 120 °C 0 54A 66A 76A OFF ON 47 43 120 °C 0 54 A 66 A 76 A ON OFF 14,7 15 120 °C 0 54 A 66 A 76 A ON ON 24 27 120 °C 0 66 A 76 A 88 A OFF OFF 24 30 120 °C 0 66 A 76 A 88 A OFF ON 13 18 120 °C 0 66 A 76 A 88 A ON OFF 33 51 120 °C 0 66 A 76 A 88 A ON ON 36 62 120 °C 1 54 A 66A 76 A OFF OFF 39 75 120 °C 1 54 A 66 A 76 A OFF ON 18 39 120 °C 1 54 A 66 A 76 A ON OFF 16 39 120 °C 1 54 A 66 A 76 A ON ON 13 36 120 °C 1 66 A 76 A 88 A OFF OFF 16 51 120 °C 1 66 A 76 A 88 A OFF ON 27 100 120 °C 1 66 A 76 A 88 A ON OFF 18 110 120 °C 1 66 A 76 A 88 A ON ON 1. Suggested values, divider must be connected between VCC5 pin and GND. 6.6.5 CONFIG2 If the SMBus is disable by CONFIG0, the CONFIG2/SDA pin is set as pinstrapping CONFIG2. In this condition it is possible to select the OVP and OFFSET of the multi-phase and single rail (see Table 12). The overvoltage protection can be set in tracking mode. OVP = VID + OFFSET + Threshold. Threshold can be selected between +175 mV and +500 mV. 38/71 DocID023399 Rev 3 L6718 Device configuration External offset can be added to the internal voltage reference VID on both sections (no offset, 100 mV, 200 mV, 300 mV). Table 12. CONFIG2/SDA pinstrapping Pinstrapping (1) divider (KOhm) OVP Offset multi-rail Offset single-rail +500 mV No offset No offset 16 +500 mV No offset +100 mV 390 27 +500 mV No offset +200 mV 150 15 +500 mV No offset +300 mV 91 12 +500 mV +100 mV No offset 91 15 +500 mV +100 mV +100 mV 100 20 +500 mV +100 mV +200 mV 75 18 +500 mV +100 mV +300 mV 39 11 +500 mV +200 mV No offset 120 39 +500 mV +200 mV +100 mV 43 16 +500 mV +200 mV +200 mV 120 51 +500 mV +200 mV +300 mV 82 39 +500 mV +300 mV No offset 56 30 +500 mV +300 mV +100 mV 20 12 +500 mV +300 mV +200 mV 36 24 +500 mV +300 mV +300 mV 27 20 +175 mV No offset No offset 68 56 +175 mV No offset +100 mV 47 43 +175 mV No offset +200 mV 14,7 15 +175 mV No offset +300 mV 24 27 +175 mV +100 mV No offset 24 30 +175 mV +100 mV +100 mV 13 18 +175 mV +100 mV +200 mV 33 51 +175 mV +100 mV +300 mV 36 62 +175 mV +200 mV No offset 39 75 +175 mV +200 mV +100 mV 18 39 +175 mV +200 mV +200 mV 16 39 +175 mV +200 mV +300 mV 13 36 +175 mV +300 mV No offset 16 51 +175 mV +300 mV +100 mV (above VID+OFFSET) R up R down 750 10 390 DocID023399 Rev 3 39/71 Device configuration L6718 Table 12. CONFIG2/SDA pinstrapping (continued) Pinstrapping (1) divider (KOhm) OVP Offset multi-rail Offset single-rail +175 mV +300 mV +200 mV +175 mV +300 mV +300 mV (above VID+OFFSET) R up R down 27 100 18 110 1. Suggested values, divider must be connected between VCC5 pin and GND. 6.6.6 CONFIG3 If the SMBus is disabled by CONFIG0, it is possible to use the CONFIG3/SCL pin as pinstrapping CONFIG3. In this condition it is possible to select the OCP, VFDE, DPM strategy and enable. Using CONFIG3 pinstrapping it is possible to set: a) OCP - The average overcurrent can be selected between 125% and 137% of IMAX in both sections (see Section 9.2). b) DPM strategy - If DPM is enabled, the device performs the automatic phase shading on the multi-phase rail (seeSection 7.3). The phase cutting follows the strategy selected in percentage of IMAX based on voltage sensed on the IMON pin. c) VFDE - Variable frequency diode emulation can be enabled/disabled. ULTRASONIC limits the switching frequency to 30 KH (see Section 7.4). d) DPMEN - Automatic dynamic phase management (seeSection 7.3) of the multiphase rail can be enabled or disabled when the system runs in PS0. In PS1 the L6718 switches, from 2-phase to 1-phase, a threshold of 15% of IMAX even if DPMEN is disabled. With DPM off it is possible to disable the droop function. Table 13. CONFIG3/SCL pinstrapping Pinstrapping (1) divider (KOhm) 40/71 DPM strategy (2) VFDE OCP(2) 1ph>2ph R up R down 750 10 125% 15% 390 16 125% 15% 390 27 125% 15% 150 15 125% 15% 91 12 125% 15% 91 15 125% 20% 100 20 125% 20% 75 18 125% 20% 2ph>3ph 3ph>4ph 25% 25% 30% 30% DocID023399 Rev 3 40% 40% 45% 45% enable DPM enable DROOP OFF OFF ON OFF ON ON ON OFF OFF ON ON ON OFF OFF ON OFF ON ON ON OFF OFF ON ON ON L6718 Device configuration Table 13. CONFIG3/SCL pinstrapping (continued) Pinstrapping (1) divider (KOhm) DPM strategy (2) VFDE OCP(2) 1ph>2ph R up R down 39 11 125% 25% 120 39 125% 25% 43 16 125% 25% 120 51 125% 25% 82 39 125% 30% 56 30 125% 30% 20 12 125% 30% 36 24 125% 30% 27 20 137% 15% 68 56 137% 15% 47 43 137% 15% 14,7 15 137% 15% 24 27 137% 20% 24 30 137% 20% 13 18 137% 20% 33 51 137% 20% 36 62 137% 25% 39 75 137% 25% 18 39 137% 25% 16 39 137% 25% 13 36 137% 30% 16 51 137% 30% 27 100 137% 30% 18 110 137% 30% 2ph>3ph 3ph>4ph 35% 35% 40% 40% 25% 25% 30% 30% 35% 35% 40% 40% 50% 50% 55% 55% 40% 40% 45% 45% 50% 50% 55% 55% enable DPM enable DROOP OFF OFF ON OFF ON ON ON OFF OFF ON ON ON OFF OFF ON OFF ON ON ON OFF OFF ON ON ON OFF OFF ON OFF ON ON ON OFF OFF ON ON ON OFF OFF ON OFF ON ON ON OFF OFF ON ON ON OFF OFF ON OFF ON ON ON OFF OFF ON ON ON OFF OFF ON OFF ON ON ON OFF OFF ON ON ON 1. Suggested values, divider must be connected between VCC5 pin and GND. 2. In percentage of IMAX. DocID023399 Rev 3 41/71 L6718 power manager 7 L6718 L6718 power manager The L6718 power manager, configured by pins CONFIG2/SCL and CONFIG3/SDA, provides a large number of configuration settings and monitoring to increase the performance of both rails of the step-down DC-DC voltage regulator. These pins can be configured in 2 different modes by setting ON/OFF the SMBus by CONFIG0 pinstrapping (see Section 6.6.1 and Section 6.6.2 for details). 7.1 – SCL and SDA (if SMBus is set ON): power management is provided from a master with SMBus communication interface through two-wire clock (SCL) and data (SDA) which guarantee a high level programmability (setting and monitoring) while the system is running. – CONFIG2 and CONFIG 3 (if SMBus is set OFF): power management is provided with 2 pinstrappings set during the startup (see Section 6.6.5 and Section 6.6.6 for details). SMBus power manager The SMBus interface is set by CONFIG0 pinstrapping. The L6718 features a second power manager bus to easily implement power management features as well as overspeeding while the application is running. The power manager SMBus is operative after VREADY is driven high at the end of the soft-start. Once the controller is predisposed to use the SMBus interface, CONFIG2/SCL and CONFIG3/SDA pins are set as digital input clock (SCL) and data (SDA). SMBus interface communication is based on a two-wire clock and data which connect a master to one or more slaves addressed separately. The master starts the SMBus transaction and drives the clock and the data signals. The slave (L6718) receives the transaction and acts accordingly. In the case of a reading command, the slave drives the data signal to reply to the bus with a byte or a word. The L6718 SMBus address for multi-phase and single-phase rails can be selected at startup by the choice of the configuration mode and pinstrapping (see Table 14). In CPU mode the SMBus address depends on the choice of SVID address which is 00h typically but can be selected to 01h only in MRO (see Section 6.3.1). In DDR mode the SMBus address depends on the status of Add_Dom selectable from CONFIG1 pinstrapping (seeSection 6.6.4). The single-phase rail in DDR mode can be addressed only in Jmode. The L6718 SMBus commands are able to change dynamically the status of the voltage regulator, the DPM strategy, the VFDE, and some protection thresholds, as shown in Table 15. Power SMBus protocol is based on the system management bus (SMBus) specification ver. 2.0 which can run up to 400 kHz. Cycling VCC resets the register to the default configuration. 42/71 DocID023399 Rev 3 L6718 7.1.1 L6718 power manager SMBus sequence The bus master sends the start (START) sequence followed by 7 bits which identify the controller address. The bus master then sends READ/WRITE and the controller then sends the acknowledge (ACK) bit. The bus master sends the command code during the command phase. The controller sends the acknowledge bit after the command phase. If a READ command is sent by the master, the device drives the SDA wire in order to reply to the master request with DATA BYTE or DATA WORD (2 bytes) depending on the command. The controller sends the acknowledge (ACK) bit after the data stream. Finally, the bus master sends the stop (STOP) sequence. WRITE command: The master sends the data stream related to the command phase previously issued (if applicable). The controller achieves the data stream by the masters and sends the acknowledge (ACK). Finally the bus master sends the stop (STOP) sequence. After the controller has detected the STOP sequence, it performs operations according to the command issued by the master. Figure 8. SMBus communication format START SCL SLAVE ADDRESSING + R/W 7 6 5 4 3 COMMAND PHASE ACK 2 1 0 7 5 4 2 1 ACK 0 DATA PHASE 7 STOP 0 ACK ACK ACK ACK SDA START Addressing Phase (7 Clocks) R/W (1Ck) ACK (1Ck) Command Phase (8 Clocks) ACK (1Ck) Data Phase (8 Clocks) ACK STOP (1Ck) BUS DRIVEN BY MASTER BUS DRIVEN BY L6718 (SL AVE) AM12882v1 7.2 SMBus tables Table 14. SMBus addressing Mode VRM address Address domain SMBus SMBus multi-phase single-phase CPU mode 00h - CCh 8Ch CPU mode 01h - CEh 8Eh DDR mode 02h (06h in DDR4) 0 E0h E2h (Jmode only) DDR mode 02h (06h in DDR4) 1 E8h EAh (Jmode only) DDR mode 04h (08h in DDR4) 0 E4h E6h (Jmode only) DDR mode 04h (08h in DDR4) 1 ECh EEh (Jmode only) DocID023399 Rev 3 43/71 L6718 power manager L6718 Table 15. SMBus interface commands Command Command name code and type Description D0h SetVID Read/Write 8b byte Sets VOUT, refer to Table 16: SMBus VID Default 00h D1h VOUTMAX Read/Write 8b byte Sets maximum limit for VOUT = VID+OFFSET. It is not related to VR12 register. Default BFh (2.145 V) D2h DOMAIN Read/Write 1b byte If bit0=“0”, VR12 SVID sets VOUT. If bit0=“1”, SMBus interface is able to set VOUT through SetVID command and bypass the SVID bus indication. Default 00h D3h DPMTH1 Read/Write 8b byte Sets the DPM threshold from 1-phase switching to 2phase switching in percentage of IMAX. Default 26h (15% IMAX) D4h DPMTH2 Read/Write 8b byte Sets the DPM threshold from 2-phase switching to 3phase switching in percentage of IMAX. Default 40h (25% IMAX) D5h DPMTH3 Read/Write 8b byte Sets the DPM threshold from 3-phase switching to 4phase switching in percentage of IMAX. Default 66h (40% IMAX) 1b byte If bit0=“0” : OVP is set to VID+OFFSET+500 mV If bit0=“1” : OVP is set to VID+OFFSET+175 mV Default 00h (+500 mV) D6h OVP Read/Write D7h OCP Read/Write 1b byte If bit0=“0” : OCP is set to 125% of IMAX If bit0=“1” : OCP is set to 137% of IMAX Default 00h (125%) D8h DROOP Read/Write 2b byte If bit1 and bit0=“00” : DROOP is set ON to 100% If bit1 and bit0=“01” : DROOP is set ON to 50% If bit1 and bit0=“11” : DROOP is set OFF Default 00h (100%DROOP) 5b byte If bit0=“1”, a minimal switching frequency in VFDE is enabled, otherwise VFDE has no down limitation. If bit1=“1”, VFDE is enabled, otherwise VFDE is disabled. If bit2=“1”, DPM is enabled in PS0 with the default threshold, otherwise it is disabled (only core feature). If bit3=“1”, DPM is enabled in PS1 and the device can change from 2 to 1-phase switching with the default threshold (DPMTH1), otherwise it is disabled (only core feature). If bit4=“1”, the device uses 2-phase switching in PS1, otherwise the device uses 1-phase (only core feature). Default multi-phase rail 1Bh Default single-phase rail 0Bh D9h 44/71 Body type CONFIG Read/Write DocID023399 Rev 3 L6718 L6718 power manager Table 15. SMBus interface commands (continued) Command Command name code and type Body type Description DAh OFFSET Read/Write 8b byte Bit 0-6 adds an offset to VID with steps of 5 mV. If bit7=“1”, the offset is positive, otherwise the offset is negative. Default 80h (no offset) DBh VOUT Read 8b byte L6718 replies with the value of the VID setting following the VR12 tab. DCh IOUT Read 8b byte L6718 replies with the value IOUT as percentage of IMAX. FFh is 100%. DEh VR12_PS Read 2b byte Reports the actual power state configuration. 80h STATUS Read 1b byte If bit0=“1”, VREADY is set. If bit1=“1”, Feedback disconnection latched. If bit2=“1”, OVP protection latched. If bit3=“1”, UVP protection latched. If bit4=“1”, VRHOT protection latched. If bit5=“1”, OCP protection latched. If bit6 and bit7 show the phase number (4ph=11). Default multi-phase rail running 41h(2ph); 81h(3ph); C1h(4ph) Default single-phase rail running 41h. E9h MODEL_ID Read 16b word Reports the internal model ID for GUI = C05Ah. Table 16. SMBus VID HEX Code VOUT [V] HEX Code VOUT [V] HEX Code VOUT [V] HEX Code 0 0 0.00 4 0 0.885 8 0 1.525 C 0 0 1 0.255 4 1 0.895 8 1 1.535 C 1 0 2 0.265 4 2 0.905 8 2 1.545 C 2 0 3 0.275 4 3 0.915 8 3 1.555 C 3 0 4 0.285 4 4 0.925 8 4 1.565 C 4 0 5 0.295 4 5 0.935 8 5 1.575 C 5 0 6 0.305 4 6 0.945 8 6 1.585 C 6 0 7 0.315 4 7 0.955 8 7 1.595 C 7 0 8 0.325 4 8 0.965 8 8 1.605 C 8 0 9 0.335 4 9 0.975 8 9 1.615 C 9 0 A 0.345 4 A 0.985 8 A 1.625 C A 0 B 0.355 4 B 0.995 8 B 1.635 C B DocID023399 Rev 3 45/71 L6718 power manager L6718 Table 16. SMBus VID (continued) HEX Code 46/71 VOUT [V] HEX Code VOUT [V] HEX Code VOUT [V] HEX Code 0 C 0.365 4 C 1.005 8 C 1.645 C C 0 D 0.375 4 D 1.015 8 D 1.655 C D 0 E 0.385 4 E 1.025 8 E 1.665 C E 0 F 0.395 4 F 1.035 8 F 1.675 C F 1 0 0.405 5 0 1.045 9 0 1.685 D 0 1 1 0.415 5 1 1.055 9 1 1.695 D 1 1 2 0.425 5 2 1.065 9 2 1.705 D 2 1 3 0.435 5 3 1.075 9 3 1.715 D 3 1 4 0.445 5 4 1.085 9 4 1.725 D 4 1 5 0.455 5 5 1.095 9 5 1.735 D 5 1 6 0.465 5 6 1.105 9 6 1.745 D 6 1 7 0.475 5 7 1.115 9 7 1.755 D 7 1 8 0.485 5 8 1.125 9 8 1.765 D 8 1 9 0.495 5 9 1.135 9 9 1.775 D 9 1 A 0.505 5 A 1.145 9 A 1.785 D A 1 B 0.515 5 B 1.155 9 B 1.795 D B 1 C 0.525 5 C 1.165 9 C 1.805 D C 1 D 0.535 5 D 1.175 9 D 1.815 D D 1 E 0.545 5 E 1.185 9 E 1.825 D E 1 F 0.555 5 F 1.195 9 F 1.835 D F 2 0 0.565 6 0 1.205 A 0 1.845 E 0 2 1 0.575 6 1 1.215 A 1 1.855 E 1 2 2 0.585 6 2 1.225 A 2 1.865 E 2 2 3 0.595 6 3 1.235 A 3 1.875 E 3 2 4 0.605 6 4 1.245 A 4 1.885 E 4 2 5 0.615 6 5 1.255 A 5 1.895 E 5 2 6 0.625 6 6 1.265 A 6 1.905 E 6 2 7 0.635 6 7 1.275 A 7 1.915 E 7 2 8 0.645 6 8 1.285 A 8 1.925 E 8 2 9 0.655 6 9 1.295 A 9 1.935 E 9 2 A 0.665 6 A 1.305 A A 1.945 E A 2 B 0.675 6 B 1.315 A B 1.955 E B 2 C 0.685 6 C 1.325 A C 1.965 E C 2 D 0.695 6 D 1.335 A D 1.975 E D 2 E 0.705 6 E 1.345 A E 1.985 E E DocID023399 Rev 3 L6718 L6718 power manager Table 16. SMBus VID (continued) HEX Code 7.3 VOUT [V] HEX Code VOUT [V] HEX Code VOUT [V] HEX Code 2 F 0.715 6 F 1.355 A F 1.995 E F 3 0 0.725 7 0 1.365 B 0 2.005 F 0 3 1 0.735 7 1 1.375 B 1 2.015 F 1 3 2 0.745 7 2 1.385 B 2 2.025 F 2 3 3 0.755 7 3 1.395 B 3 2.035 F 3 3 4 0.765 7 4 1.405 B 4 2.045 F 4 3 5 0.775 7 5 1.415 B 5 2.055 F 5 3 6 0.785 7 6 1.425 B 6 2.065 F 6 3 7 0.795 7 7 1.435 B 7 2.075 F 7 3 8 0.805 7 8 1.445 B 8 2.085 F 8 3 9 0.815 7 9 1.455 B 9 2.095 F 9 3 A 0.825 7 A 1.465 B A 2.105 F A 3 B 0.835 7 B 1.475 B B 2.115 F B 3 C 0.845 7 C 1.485 B C 2.125 F C 3 D 0.855 7 D 1.495 B D 2.135 F D 3 E 0.865 7 E 1.505 B E 2.145 F E 3 F 0.875 7 F 1.515 B F 2.155 F F DPM Dynamic phase management allows the number of working phases to be adjusted according to the delivered current while still maintaining the benefits of the multi-phase regulation in order to achieve high efficiency performance. Phase number is reduced by monitoring the voltage level across the IMON pin: the L6718 reduces the number of working phases according to the DPM strategy. In order to reach the right DPM threshold, the IMON resistor (between IMON pin and GND) must be designed to reach 1.24 V when IMAX is applied by the load. A hysteresis (50 mV typ.) is provided for each threshold in order to avoid multiple DPM actions triggering in steady load conditions. Different DPM thresholds can be selected by SMBus or CONFIG3 pinstrapping to match the application with the best efficiency performance. When DPM is enabled, the L6718 starts monitoring the IMON voltage for phase number modifications after VR_RDY has transition high: the soft-start is then implemented in interleaving mode with all the available phases enabled. DPM is reset in the case of a SetVID command that affects the CORE section and when LTB Technology detects a load transient. After being reset, if the voltage across IMON is compatible, DPM is re-enabled after a proper delay. DocID023399 Rev 3 47/71 L6718 power manager L6718 Delay in the intervention of DPM can be set using a filter capacitor on the IMON pin. Higher capacitance can be used to increase the DPM intervention delay. 7.4 VFDE In both rails, if the delivered current is low that the CCM/DCM boundary is reached, the controller is able to enter variable frequency diode emulation. As a consequence, the switching frequency decreases in order to reach high efficiency performance. In a common single-phase DC-DC converter, the boundary between CCM and DCM is when the delivered current is perfectly equal to 1/2 of the peak-to-peak ripple in the inductor (IOUT = Ipp/2). A further decrease of the load in this condition, maintaining CCM operation, would cause the current in the inductor to reverse, therefore sinking the current from the output for a part of the off-time. This results in a poor efficiency system. The L6718 is able (via CSPx/CSNx pins) to detect the sign of the current across the inductor (zero cross detection, ZCD) so it is able to recognize when the delivered current approaches the CCM/DCM boundary. In VFDE operation, the controller fires the high-side MOSFET for a TON and the low-side MOSFET for a TOFF (the same as when the controller works in CCM mode) and waits the necessary time until next firing in high-impedance (HiZ). The consequence of this behavior is a linear reduction of the “apparent” switching frequency that, in turn, results in an improvement of the efficiency of the converter when in very light load conditions. To prevent entering into the audible range, the “apparent” switching frequency is reduced to around 30 kHz by default, but this function can be disabled using the SMBus interface in order to reach an even lower switching frequency. Using the SMBus interface, VFDE (enable by default) can easily turn on/off on each rail while, with SMBus OFF, it is possible to enable/disable VFDE by CONFIG3 for both rails. When SWAP mode is enabled, the VFDE is disabled in the single-rail section and any configuration command for this rail (by SMBus or pinstrapping) is ignored. Figure 9. Output current vs. switching frequency in PSK mode Iout = Ipp/2 Iout < Ipp/2 t t Tsw Tsw 48/71 Tvfde DocID023399 Rev 3 AM12883v1 L6718 7.5 L6718 power manager Power state indicator (PSI) The L6718 offers the possibility to monitor the power state status of the multi-phase rail pins CONFIG0/PSI0 and CONFIG1/PSI1. Since the pinstrapping configuration is set during the startup, once VREADY is pulled high the L6718 uses an internal push/pull on these pins to monitor the device power status. From these pins, power state (PS0, PS1, PS2, PS3) is provided as digital output (see Table 17). Table 17. Power status PSI1 PSI0 PS 1 1 PS0 1 0 PS1 0 1 PS2 0 0 PS3 DocID023399 Rev 3 49/71 Output voltage positioning 8 L6718 Output voltage positioning Output voltage positioning is performed by selecting the controller operative-mode (CPU, DDR, GPU, Jmode, see Section 7 for details) for the two sections and by programming the droop function effect (see Figure 10). The controller reads the current delivered by each section by monitoring the voltage drop across the DCR inductors. The current (IDROOP / ISDROOP) sourced from the FB/SFB pins, directly proportional to the read current, causes the related section output voltage to vary according to the external RFB / RSFB resistor, therefore implementing the desired load-line effect. In DDR mode it is possible to disable or to decrease the droop effect by using CONFIG1 pinstrapping (see Section 6.6.4 for details). The L6718 embeds a dual remote-sense buffer to sense remotely the regulated voltage of each section without any additional external components. In this way, the output voltage programmed is regulated compensating for board and socket losses. Keeping the sense traces parallel and guarded by a power plane results in common mode coupling for any picked-up noise. Figure 10. Voltage positioning IDROOP REFERENCE from DAC... Protection Monitor FB COMP RF VSEN RGND CF To VddCORE (Remote sense) RFB ROS AM12884v1 8.1 Multi-phase section - current reading and current sharing loop The L6718 embeds a flexible, fully-differential current sense circuitry that is able to read across the inductor parasitic resistance or across a sense resistor placed in series to the inductor element. The fully-differential current reading rejects noise and allows the placing of sensing elements in different locations without affecting the measurement accuracy. The trans-conductance ratio is issued by the external resistor RG placed outside the chip between the CSxN pin toward the reading points. The current sense circuit always tracks the current information, the pin CSxP is used as a reference keeping the CSxN pin to this voltage. To correctly reproduce the inductor current, an R-C filtering network must be introduced in parallel to the sensing element. The current that flows from the CSxN pin is then given by the following equation (see Figure 11): 50/71 DocID023399 Rev 3 L6718 Output voltage positioning Equation 1 DCR 1 + s ⋅ L ⁄ DCR ICSxN = ------------- ⋅ -------------------------------------------- ⋅ I 1+s⋅ R⋅ C RG PHASEx Considering now the matching of the time constant between the inductor and the R-C filter applied (time constant mismatches cause the introduction of poles into the current reading network causing instability. In addition, it is also important for the load transient response and to let the system show resistive equivalent output impedance) it results: Equation 2 L ------------- = R ⋅ C DCR ⇒ RL I CSxN = -------- ⋅ I PHASEx = I INFOx RG Figure 11. Current reading IPHASEx Lx ICSxN=IINFOx DCRx VOUT R C CSxP CSxN RG Inductor DCR Current Sense AM12885v1 The current read through the CSxP / CSxN pairs is converted into a current IINFOx proportional to the current delivered by each phase and the information regarding the average current IAVG = ΣIINFOx / N is internally built into the device (N is the number of working phases). The error between the read current IINFOx and the reference IAVG is then converted into a voltage that, with a proper gain, is used to adjust the duty cycle whose dominant value is set by the voltage error amplifier in order to equalize the current carried by each phase. 8.2 Multi-phase section - defining load-line The L6718 introduces a dependence of the output voltage on the load current recovering part of the drop due to the output capacitor ESR in the load transient. Introducing a dependence of the output voltage on the load current, a static error, proportional to the output current, causes the output voltage to vary according to the sensed current. Figure 11 shows the current sense circuit used to implement the load-line. The current flowing across the inductor(s) is read through the R-C filter across the CSxP and CSxN pins. RG programs a trans-conductance gain and generates a current ICSx proportional to the current of the phase. The sum of the ICSx current is then sourced by the FB pin (IDROOP). RFB gives the final gain to program the desired load-line slope (Figure 10). DocID023399 Rev 3 51/71 Output voltage positioning L6718 Time constant matching between the inductor (L/DCR) and the current reading filter (RC) is required to implement a real equivalent output impedance of the system, therefore avoiding over and/or undershoot of the output voltage as a consequence of a load transient. The output voltage characteristic vs. load current is then given by: Equation 3 DCR V OUT = VID – R FB ⋅ I DROOP = VID – RFB ⋅ ------------- ⋅ IOUT = VID – R LL ⋅ I OUT RG where RLL is the resulting load-line resistance implemented by the multi-phase section. The RFB resistor can then be designed according to the RLL specifications, as follows: Equation 4 RG R FB = R LL ⋅ ------------DCR 8.3 Single-phase section - current reading The single-phase section performs the same differential current reading across DCR as the multi-phase section. According to Section 8.1, the current that flows from the SCSN pin is then given by the following equation (see Figure 11): Equation 5 DCR I SCSN = ------------- ⋅ ISOUT = ISDROOP R SG 8.4 Single-phase section - defining load-line This method introduces a dependence of the output voltage on the load current recovering part of the drop due to the output capacitor ESR in the load transient. Introducing a dependence of the output voltage on the load current, a static error, proportional to the output current, causes the output voltage to vary according to the sensed current. Figure 11 shows the current sense circuit used to implement the load-line. The current flowing across the inductor DCR is read through RSG. This resistor programs a transconductance gain and generates a current ISDROOP proportional to the current delivered by the single-phase section that is then sourced from the SFB pin. RSFB gives the final gain to program the desired load-line slope (Figure 10). The output characteristic vs. load current is then given by: Equation 6 V SOUT = VID – R SFB ⋅ I SDROOP where RSLL is the resulting load-line resistance implemented by the single-phase section. 52/71 DocID023399 Rev 3 L6718 Output voltage positioning The RSFB resistor can then be designed according to the RSLL, as follows: Equation 7 R SG R SFB = R SLL ⋅ ------------DCR 8.5 Dynamic VID transition support The L6718 manages dynamic VID transitions that allow the output voltage of both sections to be modified during normal device operation for power management purposes. When changing dynamically the regulated voltage (DVID), the system must charge or discharge the output capacitor accordingly. This means that an extra-current IDVID needs to be delivered (especially when increasing the output regulated voltage) and it must be considered when setting the overcurrent threshold of both the sections. This current results: Equation 8 dV OUT I DVID = C OUT ⋅ -----------------dT VID where dVOUT / dTVID depends on the specific command issued (10 mV/μsec. for SetVID_Fast and 2.5 mV/μsec. for SetVID_Slow). Overcoming the OC threshold during the dynamic VID causes the device to latch and disable. As soon as the controller receives a new valid command to set the VID level for one (or both) of the two sections, the reference of the involved section steps up or down according to the target-VID with the programmed slope until the new code is reached. If a new valid command is issued during the transition, the device updates the target-VID level and performs the dynamic transition up to the new code. Protection is increased during the transition and re-activated with proper delay after the end of the transition to prevent false triggering. 8.6 DVID optimization: REF/SREF High slew rate for dynamic VID transitions cause overshoot and undershoot on the regulated voltage, causing a violation of the microprocessor requirement. To compensate this behavior and to remove any over/undershoot in the transition, each section features a DVID optimization circuit. The reference used for the regulation is available on the REF/SREF pins (see Figure 12). Connect an RREF/CREF to GND (RSREF / CSREF for the single-phase) to optimize the DVID behavior. Components may be designed as follows (multi-phase, same equations apply to single-phase): DocID023399 Rev 3 53/71 Output voltage positioning L6718 Equation 9 ΔV OSC ⎞ C REF = C F ⋅ ⎛ 1 – ---------------------⎝ k ⋅ V ⎠ V R REF IN RF ⋅ CF = --------------------C REF where ΔVosc is the PWM ramp and kV the gain for the voltage loop (see Figure 12). During a DVID transition, the REF pin moves according to the command issued (SetVIDFast, SetVIDSlow); the current requested to charge/discharge the RREF/CREF network is mirrored and added to the droop current compensating for over/undershoot on the regulated voltage. If Jmode is enabled by CONFIG1 pinstrapping the SREF/JEN is set as the single-phase rail enable. IDROOP Figure 12. DVID optimization circuit RREF RF CREF RGND to Vout... ZF(s) ZFB(s) 54/71 CF RGND COMP FB REF VID VCOMP Ref VSEN Ref RFB DocID023399 Rev 3 AM12886v1 L6718 9 Output voltage monitoring and protection Output voltage monitoring and protection The L6718 includes a complete set of protections: overvoltage, undervoltage, feedback disconnection, overcurrent total and overcurrent per-phase. The device monitors the voltage on the VSEN pin in order to manage OV, UV and feedback disconnection while CS1- reads the voltage in order to detect VSEN disconnection. The IMON pin is used to monitor total overcurrent and it shows different thresholds for different operative conditions. The device shows different thresholds when in different operative conditions but the behavior in response to a protection event is still the same as described below. Protection is active also during soft-start while it is properly increased during DVID transitions with an additional delay to avoid false triggering. Once the protection latches the device, a VCC cycle or enable cycle is needed to restart the system. If protection occurs while the SMBus interface is used, a VCC cycle is necessary to discharge the embedded register and reboot the system. Table 18. L6718 protection at a glance Section Multi-phase Overvoltage (OV) VSEN, SVSEN = +175/500 mV above Vref + Offset Action: IC Latch; LS=ON & PWMx = 0 if required to keep the regulation to 250 mV; Other section: HiZ. Undervoltage (UV) VSEN, SVSEN = 500 mV below reference. Active after Ref > 500 mV Action: IC Latch; both sections HiZ. Overcurrent (OC) Current monitor across inductor DCR. Dual protection, per-phase and average. Action: UV-Like. Feedback disconnection VSEN & FBG 9.1 Single-phase VSEN or FBG not connected. Action: IC Latch HiZ. Overvoltage During the soft-start or DVID, OVP threshold is fixed to 1.8 V, or 2.4 V if any offset is present, until the VREADY is set, OVP then moves in tracking mode. The OVP threshold is in tracking mode for both sections and it considers also an offset set by SMBus or pinstrapping. OVP is fixed if VOUT is set lower than 0.5 V. In this case, the OVP is set to 1.8 V with no offset added or 2.4 V if offset is used. When the voltage sensed by VSEN and/or SVSEN overcomes the OV threshold, the controller acts in order to protect the load from excessive voltage levels, avoiding any DocID023399 Rev 3 55/71 Output voltage monitoring and protection L6718 possible undershoot. To reach this target, a special sequence is performed, as per the following: – The device turns on all low-side MOSFETs (and keeps to GND the PWMx) of the section where OV protection is triggered. At the same time the device performs a fast DVID moving the internal reference to 250 mV. – The section which triggered the protection switches between all MOSFETs OFF and all low-sides ON in order to follow the voltage imposed by the DVID_Fast ongoing. This limits the output voltage excursion, protects the load and assures no undershoot is generated (if VOUT < 250 mV, the section is HiZ). – The non-involved section turns off all the MOSFETs in order to realize a HiZ condition. Only if the non-involved section runs in Jmode does the rail keep switching. – xOSC/ FLT pin of the OVP involved section is driven high. If the cause of the failure is removed, the converter ends the transition with all PWMs in HiZ state and the output voltage of the section which triggered the protection lower than 250 mV. The enable or VCC cycle (VCC5 or VCC12) can restart the system but the enable cycle does not discharge the SMBus embedded register, in this case, a VCC cycle is necessary to restart the system with default value. 9.2 Overcurrent The overcurrent threshold can be programmed to a safe value to avoid the system not entering OC during normal operation of the device. This value must take into consideration also the extra current needed during the DVID transition (IDVID) and the process spread and temperature variations of the sensing elements (inductor DCR). Two OCP types (for average and for phase) can be detected on each rail. 9.2.1 Multi-phase section The L6718 performs two different OC protections for the multi-phase section: it monitors both the total current and the per-phase current and allows the setting of an OC threshold for both. 56/71 – Phase OC. Maximum information current phase (IINFOx) is internally limited to 35 μA. This end-of-scale current (IOC_TH) is compared with the information current generated for each phase (IINFOx). If the current information for the single-phase exceeds the end-of-scale current (i.e. if IINFOx > IOC_TH), the device turns on the LS MOSFET until the threshold is re-crossed (i.e. until IINFOx < IOC_TH). Skipping cycle, latch condition occurs when UVP is reached. – Total current OC. The IMON pin allows a maximum total output current for the system (IOC_TOT) to be defined. The total sum IMON of the current read on each phase (IINFOx) is sourced from the IMON pin. By connecting a resistor RIMON to SGND, a load indicator with VOC_TOT end-of-scale can be implemented. When the voltage present at the IMON pin crosses VOC_TOT, the device detects an OC and immediately latches with all the MOSFETs of all the sections OFF (HiZ). VOC_TOT can be selected through SMbus dynamically or using CONFIG2 as pinstrapping. It is possible to choose: a) OCP=125% of IMAX, so VOC_TOT =1.55 V b) OCP=137% of IMAX, so VOC_TOT =1.7 V (default) DocID023399 Rev 3 L6718 Output voltage monitoring and protection A typical design considers the intervention of the total current OC before the per-phase OC, leaving the latter as an extreme-protection in case of hardware failure in the external components. Total current OC depends on the IMON design and on the application TDC and max. current supported. A typical design flow is the following: – Define the maximum total output current (IOC_TOT) according to system requirements (IMAX, ITDC). Considering IMON design, IMAX must correspond to 1.24 V (for correct IMAX detection) so IOC_TOT results defined, as a consequence: Equation 10 I OC_TOT = IMAX ⋅ V OC_TOT ⁄ 1.24 – Design per-phase OC and RG resistor in order to have IINFOx = IOC_TH (35 μA) when IOUT is over the OCP in a worst-case condition considering the ripple current and the extra current related to the DVID transient IDVID. Usually it is 10% higher than the IOC_TOT current: Equation 11 ( 1.1 ⋅ IOC_TOT ) ⋅ DCR R G = ------------------------------------------------------------N ⋅ IOCTH where N is the number of phases and DCR the DC resistance of the inductors. RG should be designed in worst-case conditions. – Design the total current OC and RIMON in order to have the IMON pin voltage at 1.24 V at the IMAX current specified by the design. It results: Equation 12 1.24V ⋅ R G ⎛ DCR R IMON = -------------------------------- I = ------------- ⋅ I OUT⎞ ⎠ RG I MAX ⋅ DCR ⎝ MON where IMAX is max. current requested by the processor. – Adjust the defined values according to the bench-test of the application. – CIMON in parallel to RIMON can be added with proper time constant to prevent false OC tripping. Note: This is a typical design flow. Custom design and specifications may require different settings and ratios between the per-phase OC threshold and the total OC threshold. Applications with big ripple across inductors may be required to set per-phase OC to values different than 110%: design flow should be modified accordingly. 9.2.2 Overcurrent and power states When the controller receives a set PS command through the SVI interface or automatic DPM is set, the L6718 changes the number of working phases. In particular, the maximum number of phases which the L6718 may work in >PS1 is limited to 2 phases regardless of the number N configured in PS0. The OC level is then scaled as the controller enters >PS0, as per Table 19. DocID023399 Rev 3 57/71 Output voltage monitoring and protection L6718 Table 19. Multi-phase section OC scaling and power states N (active phases in PS0) OC level in PS0 4 3 0.800 V / 0.900 V 1.550 V / 1.700 V 2 9.2.3 OC level in PS1, PS2 1.050 V / 1.150 V 1.550 V / 1.700 V Single-phase section The single-phase section features the same protection for phase and for average, as per multi-phase section. All the previous relationships remain applicable upon updating variables, referencing them to the single-phase section and considering this is working in single-phase. 58/71 DocID023399 Rev 3 L6718 10 Single NTC thermal monitor and compensation Single NTC thermal monitor and compensation The L6718 features single NTC for thermal sensing for both thermal monitoring and compensation. The thermal monitor consists in monitoring the converter temperature, eventually reporting an alarm by asserting the VR_HOT signal. This is the base for the temperature zone register fill. Thermal compensation consists of compensating the inductor DCR derating with temperature and so preventing drifts in any variable correlated to the DCR: voltage positioning, overcurrent, IMON, current reporting. Both functions share the same thermal sensor (NTC) to optimize the overall application cost without compromising performance. TM and TCOMP are pins used for the multi-rail thermal compensation and monitoring while STM and STCOMP are used for single-rail, as a consequence every consideration for TM and TCOMP in Section 10.2 and Section 10.3 can be used for STM and STCOMP for the single-rail. Thermal monitor and VR_HOT The diagram for the thermal monitor is shown in Figure 13. NTC should be placed close to the power stage hot-spot in order to sense the regulator temperature. As the temperature of the power stage increases, the NTC resistive value decreases, therefore reducing the voltage observable at the TM pin. Recommended NTC is NTHS0805N02N6801 (or equivalent with β25/75 = 3500 +/-10%) for accurate temperature sensing and thermal compensation. Different NTC may be used: to reach the required accuracy in temperature reporting, a proper resistive network must be used in order to match the resulting characteristics with those coming from the recommended NTC. The voltage observed at the TM pin is internally converted and then used to fill in the temperature zone register. When the temperature observed exceeds TMAX (programmed via pinstrapping), the L6718 asserts VR_HOT (active low - as long as the overtemperature event lasts) and the ALERT# line (until reset by the GetReg command on the status register). Figure 13. Thermal monitor connections 2k TM TEMPERATURE DECODING VCC5 NTC 10.1 VR_HOT Temp. Zone AM12887v1 DocID023399 Rev 3 59/71 Single NTC thermal monitor and compensation 10.2 L6718 Thermal compensation The L6718 supports DCR sensing for output voltage positioning: the same current information used for voltage positioning is used to define the overcurrent protection and the current reporting (register 15h in SVI). Having imprecise and temperature-dependant information leads to a violation of the specifications and misleading information returned to the SVI master: positive thermal coefficient specific from DCR must be compensated to get stable behavior of the converter as the temperature increases. Un-compensated systems show temperature dependencies on the regulated voltage, overcurrent protection and current reporting (Reg 15h). The temperature information available on the TM pin and used for the thermal monitor may also be used for this purpose. In single NTC thermal compensation, the L6718 corrects the IDROOP and IMON current by comparing the voltage on the TM pin with the voltage present on the TCOMP pin and recovering the DCR temperature deviation. Depending on the NTC location and distance from the inductors and the available airflow, the correlation between NTC temperature and DCR temperature may be different: TCOMP adjustments allow the gain between the sensed temperature and the correction made on the IDROOP and IMON currents to be modified. Shorting TCOMP to GND disables single NTC thermal compensation on the multi-phase rail. In this case IDROOP and IMON can be still adjusted by adding one NTC on the compensation network for IDROOP and another NTC for the current monitoring network for IMON. Both NTCs must be positioned close to the inductor related to Phase1 as it is the only phase working in all PS status. If STCOMP/DDR is short to GND, the DDR mode is selected and the single NTC thermal compensation is disabled on the single-phase rail. In this case the two currents can be adjusted by adding an NTC close to the inductor on the compensation network for IDROOP and the current monitoring network for IMON. 10.3 TM and TCOMP design This procedure applies to both the single-phase and multi-phase section when using single NTC thermal compensation: 60/71 1. Properly choose the resistive network to be connected to the TM pin. The recommended values/network is given in Figure 13. 2. Connect the voltage generator to the TCOMP pin (default value 3.3 V). 3. Power on the converter and load the thermal design current (TDC) with the desired cooling conditions. Record the output voltage regulated as soon as the load is applied. 4. Wait for thermal steady-state. Adjust down the voltage generator on the TCOMP pin in order to get the same output voltage recorded at point #3. 5. Design the voltage divider connected to TCOMP (between VCC5 and GND) in order to get the same voltage set to TCOMP at point #4. 6. Repeat the test with the TCOMP divider designed at point #5 and verify the thermal drift is acceptable. In the case of positive drift (i.e. output voltage at thermal steadystate is bigger than the output voltage immediately after loading TDC current), change the divider at the TCOMP pin in order to reduce the TCOMP voltage. In the case of negative drift (i.e. output voltage at thermal steady-state is smaller than the output DocID023399 Rev 3 L6718 Main oscillator voltage immediately after loading TDC current), change the divider at the TCOMP pin in order to increase the TCOMP voltage. 7. 11 The same procedure can be implemented with a variable resistor in place of one of the resistors of the divider. In this case, once the compensated configuration is found, simply replace the variable resistor with a resistor of the same value. Main oscillator The internal oscillator generates the triangular waveform for the PWM charging and discharging with a constant current internal capacitor. The switching frequency for each channel, FSW, FSSW, is internally fixed at 200 kHz: the resulting switching frequency at the load side for the multi-phase section results in being multiplied by N (number of configured phases). The current delivered to the oscillator is typically 20 μA (corresponding to the free-running frequency FSW= 200 kHz) and it may be varied using an external resistor (ROSC, RSOSC) typically connected between the OSC, SOSC pins and GND. Since the OSC/SOSC pins are fixed at 1.8 V, the frequency is varied proportionally to the current sunk from the pin considering the internal gain of 10 kHz/μA (see Figure 14). Connecting ROSC to SGND, the frequency is increased (current is sunk from the pin), according to the following relationships: Equation 13 1.800V kHz F SW = 200kHz + --------------------------- ⋅ 10 ----------R OSC ( kΩ) μA Figure 14. ROSC [KOhm] vs. switching frequency [kHz] per phase DocID023399 Rev 3 61/71 System control loop compensation 12 L6718 System control loop compensation The multi-phase rail control system can be modeled with an equivalent single-phase rail converter with the only difference being the equivalent inductor L/N (where each phase has an L inductor and N is the number of the configured phases), see Figure 15. Figure 15. Equivalent control loop d VCOMP PWM L/N VOUT CF RGND FB COMP RF VID VCOMP Ref VSEN IDROOP CO RO ESR ZF(s) ZFB(s) RFB AM12889v1 The control loop gain results (obtained opening the loop after the COMP pin): Equation 14 PWM ⋅ ZF ( s ) ⋅ ( R LL + Z P ( s ) ) G LOOP ( s ) = – -----------------------------------------------------------------------------------------------------------------------ZF ( s ) ⎛ 1 -⎞ ⋅ R [ ZP ( s ) + Z L ( s ) ] ⋅ -------------+ 1 + ----------FB A(s) ⎝ A ( s )⎠ where: • RLL is the equivalent output resistance determined by the droop function (voltage positioning) • ZP(s) is the impedance resulting from the parallel of the output capacitor (and its ESR) and the applied load RO • ZF(s) is the compensation network impedance • ZL(s) is the equivalent inductor impedance • A(s) is the error amplifier gain • V IN 9 PWM = ------ ⋅ ------------------10 ΔV OSC is the PWM transfer function. The control loop gain is designed in order to obtain a high DC gain to minimize static error and to cross the 0dB axes with a constant -20 dB/dec slope with the desired crossover frequency ω T. Neglecting the effect of ZF(s), the transfer function has one zero and two 62/71 DocID023399 Rev 3 L6718 System control loop compensation poles; both poles are fixed once the output filter is designed (LC filter resonance ω LC) and the zero (ω ESR) is fixed by ESR and the droop resistance. Figure 16. Control loop Bode diagram and fine tuning dB dB CF GLOOP(s) GLOOP(s) K K ZF(s) RF[dB] RF[dB] ZF(s) RF wLC = wF wESR wT w wLC = wF wESR wT w AM12890v1 To obtain the desired shape, an RF - CF series network is considered for the ZF(s) implementation. A zero at ω F=1/RFCF is then introduced together with an integrator. This integrator minimizes the static error while placing the zero ωF in correspondence with the LC resonance assures a simple -20 dB/dec shape of the gain. In fact, considering the usual value for the output filter, the LC resonance results as a frequency lower than the above reported zero. The compensation network can be designed as follows: Equation 15 R FB ⋅ ΔV OSC 10 F SW ⋅ L R F = ------------------------------------- ⋅ ------ ⋅ ---------------------------------V IN 9 ( RLL + ESR ) Equation 16 CO ⋅ L C F = ---------------------RF 12.1 Compensation network guidelines The compensation network design assures a system that responds according to the crossover frequency selected and to the output filter considered: it is anyway possible to further fine-tune the compensation network modifying the bandwidth in order to get the best response of the system as follows (see Figure 15): – Increase RF to increase the system bandwidth accordingly. – Decrease RF to decrease the system bandwidth accordingly. – Increase CF to move ω F to low frequencies increasing as a consequence the system phase margin. Even with fast compensation network design the load requirement can be limited by the inductor value because it limits the maximum dI/dt that the system can afford. In fact, when a load transient is applied, the best that the controller can do is to “saturate” the duty cycle to its maximum (dMAX) or minimum (0) value. The output voltage dV/dt is then limited by the inductor charge/discharge time and by the output capacitance. In particular, the most DocID023399 Rev 3 63/71 System control loop compensation L6718 limiting transition corresponds to the load-removal since the inductor results as being discharged only by VOUT (while it is charged by VIN-VOUT during a load appliance). Note: The introduction of a capacitor (CI) in parallel to RFB significantly speeds up the transient response by coupling the output voltage dV/dt on the FB pin, therefore using the error amplifier as a comparator. The COMP pin suddenly reacts and, also thanks to the LTB Technology control scheme, all the phases can be turned on together to immediately give the output the required energy. A typical design considers starting from values in the range of 100 pF, validating the effect through bench testing. An additional series resistor (RI) can also be used. 12.2 LTB technology LTB Technology further enhances the performances of the controller by reducing the system latencies and immediately turning ON all the phases to provide the correct amount of energy to the load optimizing the output capacitor count. LTB Technology monitors the output voltage through a dedicated pin detecting loadtransients with selected dV/dt, it cancels the interleaved phase-shift, turning on simultaneously all phases. The LTB detector is able to detect output load transients by coupling the output voltage through an RLTB - CLTB network. After detecting a load transient, all the phases are turned on together and the EA latencies result as bypassed as well. Sensitivity of the load transient detector can be programmed in order to control precisely both the undershoot and the ring-back. LTB Technology design tips. – Decrease RLTB to increase the system sensitivity, making the system sensitive to smaller dVOUT. – Increase CLTB to increase the system sensitivity, making the system sensitive to higher dV/dt. – Increase Ri to increase the width of the LTB pulse. Increase Ci to increase the LTB sensitivity over frequency. Short LTB pin to GND to disable the function on multi-phase rail. Since LTB technology is embedded on single-phase rail, SVSEN pin needs to be filtered to disable this feature. 64/71 DocID023399 Rev 3 L6718 Power dissipation and application details 13 Power dissipation and application details 13.1 High-current embedded drivers The L6718 integrates 3 high-current drivers in control which can work for multi-rail and single-rail. By reducing the number of external components, this integration optimizes the cost and space of the motherboard solution. The driver for the high-side MOSFET uses the BOOTx pins for supply and the PHASEx pins for return. The driver for the low-side MOSFET uses the VCC12 pin for supply and the GND exposed pad for return. The embedded driver embodies an anti-shoot-through and adaptive deadtime control to minimize low-side body diode conduction time maintaining good efficiency and saving the use of diodes: when the high-side MOSFET turns off, the voltage on its source begins to fall; when the voltage reaches about 2 V, the low-side MOSFET gate drive voltage is suddenly applied. When the low-side MOSFET turns off, the voltage at the LGATE pin is sensed. When it drops below about 1 V, the high-side MOSFET gate drive voltage is suddenly applied. If the current flowing in the inductor is negative, the source of the high-side MOSFET never drops. To allow the low-side MOSFET to turn on even in this case, a watchdog controller is enabled: if the source of the high-side MOSFET does not drop, the low-side MOSFET is switched on, therefore allowing the negative current of the inductor to recirculate. This allows the system to regulate even if the current is negative. 13.2 Boot diode and capacitor design The bootstrap capacitor must be designed in order to show a negligible discharge due to the high-side MOSFET turn-on. In fact, it must give a stable voltage supply to the high-side driver during the MOSFET turn-on, also minimizing the power dissipated by the embedded boot diode. To prevent the bootstrap capacitor from extra-charging as a consequence of large negative spikes, an external series resistance RBOOT (in the range of few Ohm) may be required in series to the BOOTx pins. One external Schottky boot diode must be added to each channel, between the high-side driver power supply and the BOOTx pins. 13.3 Device power dissipation As the L6718 embeds three high-current MOSFET drivers for both high-side and low-side MOSFETs, it is important to consider the power the device is going to dissipate in driving them, in order to avoid the maximum junction operative temperature being exceeded. The exposed pad (PGND pin) must be soldered to the PCB power ground plane through several VIAs in order to facilitate the heat dissipation. Two main terms contribute to the device power dissipation: bias power and driver power. • Device power (PDC) depends on the static consumption of the device through the supply pins and it is simply quantifiable as follows (assuming HS and LS drivers are supplied with the same VCC of the device): DocID023399 Rev 3 65/71 Power dissipation and application details L6718 Equation 17 P DC = V CC ⋅ ICC + VVCCDR ⋅ I VCCDR • Driver power is the power needed by the driver to continuously switch ON and OFF the external MOSFETs; it is a function of the switching frequency and total gate charge of the selected MOSFETs. It can be quantified considering that the total power PSW dissipated to switch the MOSFETs is dissipated by three main factors: external gate resistance (when present), intrinsic MOSFET resistance and intrinsic driver resistance. This last term is the important one to be determined in order to calculate the device power dissipation. The total power dissipated to switch the MOSFETs for each phase featuring an embedded driver results: Equation 18 PSWx = F SW ⋅ ( Q GHSx ⋅ VCCDR + Q GLSx ⋅ VBOOTx ) where QGHSx is the total gate charge of the HS MOSFETs and QGLSx is the total gate charge of the LS MOSFETs for both CORE and NB sections (only Phase1 and Phase2 for CORE section); VBOOTx is the driving voltage for the HSx MOSFETs. External gate resistors help the device to dissipate the switching power as the same power (PSW) is shared between the internal driver impedance and the external resistor resulting in a general cooling of the device. When diving multiple MOSFETs in parallel, it is suggested to use one resistor on each MOSFET. 66/71 DocID023399 Rev 3 L6718 14 Layout guidelines Layout guidelines The layout is one of the most important factors to consider when designing high-current applications. A good layout solution can generate benefits by lowering power dissipation on the power paths; reducing radiation and a proper connection between signal and power ground can optimize the performance of the control loops. Two kinds of critical components and connections must be considered when laying out a VRM based on the L6718: power components and connections and small signal component connections. 14.1 Power components and connections These are the components and connections where switching and high continuous current flows from the input to the load. The first priority when placing components must be reserved for this power section, minimizing the length of each connection and loop as much as possible. To minimize noise and voltage spikes (EMI and losses) these interconnections must be part of a power plane and realized by wide and thick copper traces: loop must be minimized. The critical components, i.e. the power transistors, must be close to one another. The use of a multi-layer printed circuit board is recommended. As the L6718 uses external drivers to switch the Power MOSFETs, check the selected driver documentation for information related to the proper layout for this part. 14.2 Small signal components and connections These are small signal components and connections to critical nodes of the application as well as bypass capacitors for the device supply. Locate the bypass capacitor close to the device and refer sensitive components such as the frequency set-up resistor ROSC (both sections). The VSEN and SVSEN pins filtered vs. GND helps to reduce noise injection into the device and the ENABLE pin filtered vs. GND helps to reduce false tripping due to coupled noise: take care when routing the driving net for this pin in order to minimize coupled noise. Remote buffer connection must be routed as parallel nets from the VSEN/FBG and SVSEN/SFBG pins to the load in order to avoid the pick-up of any common mode noise. Connecting these pins in points far from the load causes a non-optimum load regulation, increasing output tolerance. Locate current reading components close to the device. The PCB traces connecting the reading points must use dedicated nets, routed as parallel traces in order to avoid the pickup of any common mode noise. It's also important to avoid any offset in the measurement and, to get a better precision, to connect the traces as close as possible to the sensing elements. Symmetrical layout is also suggested. A small filtering capacitor can be added, near the controller, between VOUT and GND, on the CSx-line when reading across the inductor to allow higher layout flexibility. DocID023399 Rev 3 67/71 Package mechanical data 15 L6718 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 20. VFQFPN56 7x7 mm mechanical data mm Dim. Min. Typ. Max. A 0.80 0.90 1.00 A1 0 0.02 0.05 D 6.90 7.00 7.10 D2 5.05 5.20 5.30 E 6.90 7.00 7.10 E2 5.05 5.20 5.30 b 0.15 0.20 0.25 e 68/71 0.40 k 0.20 L 0.40 0.50 aaa 0.10 bbb 0.10 ccc 0.10 DocID023399 Rev 3 0.60 L6718 Package mechanical data Figure 17. VFQFPN56 7x7 mm package dimensions DocID023399 Rev 3 69/71 Revision history 16 L6718 Revision history Table 21. Document revision history 70/71 Date Revision Changes 19-Jul-2012 1 Initial release. 08-Nov-2012 2 Minor text changes. Updated the value of the parameter BOOTx in Table 4. Updated Section 13.2. 19-Apr-2013 3 Changed Rth(JA), TJ and Ptot values in Table 3. Added tRISE_UGATE and tRISE_LGATE values to Table 5. Updated Table 20: VFQFPN56 7x7 mm mechanical data. 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