VN770K13TR

VN770K Quad smart power solid state relay for complete H-bridge configurations Features Type RDS(on) IOUT VCC VN770K 220 m(1) 9 A(2) 36 V ) s t( c u d 1. Total resistance of one side in bridge configuration 2. Typical current limitation value Suited as low voltage bridge ■ Linear current limitation ■ Very low standby power dissipation ■ Short circuit protected ■ Status flag diagnostic (open drain) ■ Integrated clamping circuits ■ Undervoltage protection ■ ESD protection Description e t le This device is suitable to drive a DC motor in a bridge configuration as well as to be used as a quad switch for any low voltage application. o s b ) s t( c u d ro -O The VN770K is a device formed by three monolithic chips housed in a standard SO-28 package: a double high side and two low side switches. Both the double high side and low side switches are made using STMicroelectronics VIPower™ M0-3 Technology. P e et l o s Ob Table 1. o r P SO-28 ■ The dual high side switches have built-in thermal shutdown to protect the chips from over temperature and current limiter blocks to protect the device from short circuit. Status output is provided to indicate open load in off and on-state and over temperature. The low side switches are two OMNIFET II types (fully auto protected Power MOSFET in VIPower™ technology). They have built-in thermal shutdown, linear current limitation and overvoltage clamping. Fault feedback for thermal intervention can be detected by monitoring the voltage at the input pin. Device summary Order codes Package SO-28 September 2013 Tube Tape and reel VN770K VN770K13TR Doc ID 8711 Rev 5 1/33 www.st.com 1 Contents VN770K Contents 1 Block diagrams and pins descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Electrical characteristics for dual high side switch . . . . . . . . . . . . . . . . . . . 9 2.4 Electrical characteristics for low side switches . . . . . . . . . . . . . . . . . . . . 11 2.5 Dual high-side switch timing data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.6 Electrical characterization for dual high side switch . . . . . . . . . . . . . . . . . 16 2.7 Electrical characterization for low side switches . . . . . . . . . . . . . . . . . . . . 19 ) s t( c u d e t le o r P 3 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 o s b O ) 4.1 SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.2 Thermal calculation in clockwise and anti-clockwise operation in steady state mode 27 u d o 4.2.1 4.2.2 r P e 4.2.3 5 bs t e l o O 6 2/33 4.2.4 s ( t c Thermal resistances definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Thermal calculation in transient mode . . . . . . . . . . . . . . . . . . . . . . . . . 27 Single pulse thermal impedance definition . . . . . . . . . . . . . . . . . . . . . . 27 Pulse calculation formula . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.1 SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.2 SO-28 tube shipment 5.3 Tape and reel shipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Doc ID 8711 Rev 5 VN770K List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin definition and function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Dual high side switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Low side switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power outputs (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching (per each channel) (VCC= 13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Logic input (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Status pin (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Protections (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Openload detection (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 On-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Source drain diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Thermal calculation in clockwise and anti-clockwise operation in steady state mode . . . . 27 Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O Doc ID 8711 Rev 5 3/33 List of figures VN770K List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. Figure 48. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Open-load status timing (with external pull-up) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Over temperature status timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Openload on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Openload off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Static drain source on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Transfer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Turn-on current slope (Vin=5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Turn-on current slope (Vin=3.5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Input voltage vs input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Switching time resistive load (Vin=5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Switching time resistive load (Rg=10Ohm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Step response current limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Source drain diode forward characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Static drian source on resistance vs Id . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Static drain source on resistance vs input voltage (Id=7A) . . . . . . . . . . . . . . . . . . . . . . . . . 21 Static drain source on resistance vs input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Normalized input threshold voltage vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Normalized on resistance vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Turn-off drain source voltage slope (Vin=3.5V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Turn-off drain source voltage slope (Vin=5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Current limit vs junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Application diagram bridge drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Recommended motor operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 SO-28 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Chipset configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 ) s t( c u d e t le o s b O ) s ( t c u d o r P e t e l o s b O 4/33 Doc ID 8711 Rev 5 o r P VN770K Figure 49. Figure 50. Figure 51. Figure 52. Figure 53. Figure 54. Figure 55. List of figures Auto and mutual Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . 26 SO-28 HSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . 28 SO-28 LSD thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . 28 Thermal fitting model of an H-bridge in SO-28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 SO-28 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Tube dimensions (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Tape and reel dimensions (suffix “13TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O Doc ID 8711 Rev 5 5/33 Block diagrams and pins descriptions VN770K 1 Block diagrams and pins descriptions Figure 1. Block diagram ) s t( c u d e t le o s b O ) s ( t c u d o r P e t e l o s b O 6/33 Doc ID 8711 Rev 5 o r P VN770K Block diagrams and pins descriptions Table 2. Pin definition and function No Name 1, 3, 25, 28 DRAIN 3 Drain of switch 3 (low-side switch) 2 INPUT 3 Input of switch 3 (low-side switch) 4, 11 N.C. Not connected 5, 10, 19, 24 VCC Drain of switches 1 and 2 (high-side switches) and power supply voltage 6 GND Ground of switches 1 and 2 (high-side switches) 7 INPUT 1 8 DIAGNOSTIC 9 INPUT 2 Input of switch 2 (high-side switch) 12, 14, 15, 18 DRAIN 4 Drain of switch 4 (low-side switch) 13 INPUT 4 Input of switch 4 (low-side switch) 16, 17 SOURCE 4 Source of switch 4 (low-side switch) 20, 21 SOURCE 2 Source of switch 2 (high-side switch) 22, 23 SOURCE 1 Source of switch 1 (high-side switch) 26, 27 SOURCE 3 Source of switch 3 (low-side switch) Figure 2. Function ) s t( Input of switch 1 (high-side switches) Diagnostic of switches 1 and 2 (high-side switches) e t le c u d o r P o s b O ) Connection diagram s ( t c u d o r P e t e l o s b O Doc ID 8711 Rev 5 7/33 Electrical specifications VN770K 2 Electrical specifications 2.1 Thermal data Table 3. Thermal data Symbol Rthj-case Thermal resistance junction-case (high side switch) 20 Rthj-case Thermal resistance junction-case (low side switch) 20 Rthj-amb 2.2 Thermal resistance junction-ambient (with 6 cm2 DC supply voltage -VCC Reverse DC supply voltage -IGND DC reverse ground pin current IOUT DC output current -IOUT Reverse DC output current ISTAT DC status current t e l o Ptot so b O - t c u DC input current od r P e s b O ) s ( IIN VESD e t le Parameter VCC See Figure 49 c u d Dual high side switch Symbol ) s t( of Cu heat sink) Absolute maximum ratings Table 4. Electrostatic discharge (human body model: R = 1.5K; C = 100pF) – Input – Status – Output – VCC Power dissipation (TC =25°C) o r P Value Unit 41 V -0.3 V -200 mA Internally limited A -6 A ±10 mA ±10 mA 4000 4000 5000 5000 V V V V 6 W Internally limited °C Tj Junction operating temperature Tc Case operating temperature -40 to 150 °C Storage temperature -55 to 150 °C Value Unit Tstg Table 5. Low side switch Symbol 8/33 Value Max (°C/W) Parameter Parameter VDS Drain source voltage (VIN = 0V) Internally clamped V VIN Input voltage Internally clamped V IIN Input current ±20 mA Doc ID 8711 Rev 5 VN770K Electrical specifications Table 5. Low side switch (continued) Symbol RIN MIN Parameter Value Unit 150  Internally limited A Minimum input series impedance ID Drain current IR Reverse DC output current -10.5 A VESD1 Electrostatic discharge (R = 1.5K, C = 100pF) 4000 V VESD2 Electrostatic discharge on output pin only (human body model: R = 330, C = 150pF) 5000 V Ptot Power dissipation (TC = 25°C) 6 Tj Operating junction temperature Internally limited Tc Case operating temperature Internally limited Tstg W t c u od Storage temperature -55 to 150 r P Electrical characteristics for dual high side switch e t le o s b O ) s t( c u d o r P e et 2.3 ) s ( °C °C °C 8V < VCC< 36V; -40°C < Tj < 150°C, unless otherwise specified. Table 6. Symbol Parameter VCC(1) Operating supply voltage VUSD(1) VOV(1) Ob Test conditions Min Typ Max Unit 5.5 13 36 V Undervoltage shutdown 3 4 5.5 V Overvoltage shutdown 36 - - V - - 160 320 m m 12 40 µA 12 5 25 7 µA mA On-state resistance IOUT =1A; Tj =25°C IOUT =1A; VCC >8V IS(1) Supply current Off-state; VCC = 13V; VIN =VOUT =0V Off-state; VCC = 13V; VIN =VOUT =0V; Tj =25°C On-state; VCC = 13V; VIN = 5V; IOUT =0V - IL(off1) Off-state output current VIN =VOUT =0V 0 - 50 µA IL(off2) Off-state output current VIN =0V; VOUT =3.5V -75 - 0 µA IL(off3) Off-state output current VIN =VOUT =0V; VCC = 13V; Tj = 125°C - - 5 µA IL(off4) Off-state output current VIN =VOUT =0V; VCC = 13V; Tj = 25°C - - 3 µA RON l o s Power outputs (per each channel) 1. Per device. Doc ID 8711 Rev 5 9/33 Electrical specifications Table 7. VN770K Switching (per each channel) (VCC= 13V) Symbol Parameter Test conditions Min Typ Max Unit td(on) Turn-on delay time RL =13 from VIN rising edge to VOUT =1.3V - 30 - µs td(off) Turn-off delay time RL =13 from VIN falling edge to VOUT = 11.7V - 30 - µs dVOUT/dt(on) Turn-on voltage slope RL =13 from VOUT = 1.3V to VOUT = 10.4V - (1) - V/µs dVOUT/dt(off) Turn-off voltage slope RL =13 from VOUT = 11.7V to VOUT =1.3V - (1) - V/µs Typ Max Unit - - 1.25 V 1 - - µA 3.25 - - V - - 10 µA 0.5 - - V 6 6.8 -0.7 8 V V Min Typ Max Unit - - 0.5 V ) s t( 1. See relative diagram Table 8. Symbol Parameter Input low level IIL Low level input current VIN = 1.25V VIH Input high level IIH High level input current VIN = 3.25V VICL Input hysteresis voltage t e l o Symbol s b O eP t e l o ) s ( t c u d o r -O IIN = 1mA IIN = -1mA Status pin (per each channel) Parameter Test conditions VSTAT Status low output voltage ILSTAT Status leakage current Normal operation; VSTAT = 5V - - 10 µA CSTAT Status pin input capacitance Normal operation; VSTAT = 5V - - 100 pF VSCL Status clamp voltage ISTAT = 1mA ISTAT = -1mA 6 6.8 -0.7 8 V V Table 10. ISTAT = 1.6 mA Protections (per each channel) Symbol Parameter TTSD TR 10/33 Min bs Input clamp voltage eP Table 9. ro Test conditions VIL VI(hyst) c u d Logic input (per each channel) Test conditions Min Typ Max Unit Shutdown temperature 150 175 200 °C Reset temperature 135 - - °C Doc ID 8711 Rev 5 VN770K Electrical specifications Table 10. Protections (per each channel) (continued) Symbol Parameter Thyst Thermal hysteresis tSDL Status delay in overload conditions Vdemag Typ Max Unit 7 15 - °C - - 20 µs 7 8 10 13 13 13 A A A Tj = 125°C 5.5V < VCC TTSD Current limitation Ilim 2.4 Test conditions Test conditions Min Typ Max Unit 20 40 80 mA IOUT = 0A O ) - - 200 µs VIN = 0V 1.5 2.5 3.5 V - - 1000 µs Min Typ Max Unit VIN = 5V s ( t c u d o o r P o s b Pr Electrical characteristics for low side switches -40°C < Tj < 150°C, unless otherwise specified. Table 12. Symbol Off-state Parameter Test conditions VCLAMP Drain source clamp voltage VIN =0V; ID = 3.5A 40 45 55 V VCLTH Drain source clamp threshold voltage VIN =0V; ID =2mA 36 - - V VINTH Input threshold voltage VDS =VIN; ID =1mA 0.5 - 2.5 V Supply current from input pin VDS =0V; VIN = 5V - 100 150 µA IISS Doc ID 8711 Rev 5 11/33 Electrical specifications Table 12. Symbol VN770K Off-state (continued) Parameter Test conditions VINCL Input-source clamp voltage IIN =1mA IIN =-1mA IDSS Zero input voltage drain current (VIN =0V) VDS = 13V; VIN =0V; Tj =25°C VDS = 25V; VIN =0V Table 13. Symbol RDS(on) Symbol Typ Max Unit 6 -1.0 6.8 8 -0.3 V - - 30 75 µA Min Typ Max Unit 60 120 m On-state Parameter Test conditions Static drain source on VIN =5V; ID =3.5A; Tj = 25°C resistance VIN =5V; ID =3.5A Tj = 25°C, unless otherwise specified. Table 14. Min ol Test conditions uc - d o r P e et Dynamic Parameter - ) s t( Min Typ Max Unit - 9 - S - 220 - pF Min Typ Max Unit - 100 300 ns - 470 1500 ns - 500 1500 ns Fall time - 350 1000 ns Turn-on delay time - 0.75 2.3 µs - 4.6 14 µs - 5.4 16 µs - 3.6 11 µs bs gfs(1) Forward trans conductance VDD =13V; ID =3.5A COSS Output capacitance VDS = 13V; f = 1 MHz; VIN = 0V ) s t( -O 1. Pulsed: Pulse duration = 300µs, duty cycle 1.5% Table 15. Symbol td(on) e t e tr l o s Ob tf td(on) tr td(off) tf (dI/dt)on 12/33 Parameter o r P td(off) Qi c u d Switching Test conditions Turn-on delay time Rise time Turn-off delay time Rise time Turn-off delay time VDD =15V; ID =3.5A Vgen =5V; Rgen = RIN MIN =150 VDD =15V; ID =3.5A Vgen =5V; Rgen =2.2K Fall time Turn-on current slope VDD =15V; ID =3.5A Vgen =5V; Rgen = RIN MIN =150 - 6.5 - A/µs Total input charge VDD =12V; ID =3.5A; VIN =5V Igen = 2.13mA - 18 - nC Doc ID 8711 Rev 5 VN770K Electrical specifications Table 16. Source drain diode Symbol VSD(1) Parameter Test conditions Forward on voltage ISD =3.5A; VIN =0V trr Reverse recovery time Qrr Reverse recovery charge IRRM Reverse recovery current ISD = 3.5A; dI/dt = 20A/µs VDD = 30V; L = 200µH Min Typ Max Unit - 0.8 - V - 220 - ns - 0.28 - µC - 2.5 - A ) s t( 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5% c u d -40°C < Tj < 150°C, unless otherwise specified. Table 17. Protections Symbol Parameter Test conditions e t e Ilim Drain current limit VIN =5V; VDS =13V VIN =5V; VDS =13V; Tj =125°C tdlim Step response current limit VIN =5V; VDS = 13V Tjsh Over temperature shutdown Tjrs Over temperature reset Igf Fault sink current Eas e t le Pr ) s t( uc od l o s Single pulse avalanche energy b O - VIN = 5V; VDS =13V; Tj =Tjsh Starting Tj =25°C; VDD = 24V VIN =5V; Rgen = RIN MIN =150; L=24mH o r P Typ Max Unit 6 6.5 9 12 12 A A - 4 - µs 150 175 - °C 135 - - °C - 15 - mA 200 - - mJ Min o s b O Doc ID 8711 Rev 5 13/33 Electrical specifications 2.5 VN770K Dual high-side switch timing data Figure 3. Switching time waveforms ) s t( c u d Table 18. e t le Conditions Input Output Status L H H H L H H L X X H (Tj < TTSD) H (Tj > TTSD) L Over temperature L H L L H L Undervoltage L H L L X X Overvoltage L H L L H H Output voltage > VOL L H H H L H Output current < IOL L H L H H L Normal operation ro P e et Ob 14/33 ) s t( c u d Current limitation l o s o s b Truth table o r P -O L H Doc ID 8711 Rev 5 VN770K Electrical specifications Figure 4. Open-load status timing (with external pull-up) ) s t( Figure 5. c u d Over temperature status timing e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O Doc ID 8711 Rev 5 15/33 Electrical specifications VN770K 2.6 Electrical characterization for dual high side switch Figure 6. Off-state output current Figure 7. Input clamp voltage ) s t( c u d Figure 8. High level input current e t le Figure 9. o r P Input high level voltage o s b O ) s ( t c u d o r P e t e l o bs Figure 10. Input low level voltage Figure 11. Input hysteresis voltage O 16/33 Doc ID 8711 Rev 5 VN770K Electrical specifications Figure 12. Overvoltage shutdown Figure 13. ILIM vs Tcase ) s t( c u d Figure 14. Turn-on voltage slope o r P Figure 15. Turn-off voltage slope e t le o s b O ) s ( t c u d o r P e t e l o Figure 16. On-state resistance vs Tcase s b O Figure 17. On-state resistance vs VCC Doc ID 8711 Rev 5 17/33 Electrical specifications VN770K Figure 18. Status leakage current Figure 19. Status low output voltage ) s t( c u d Figure 20. Openload on-state detection threshold e t le o s b O ) s ( t c u d o r P e t e l o Figure 22. Status clamp voltage s b O 18/33 o r P Figure 21. Openload off-state voltage detection threshold Doc ID 8711 Rev 5 VN770K 2.7 Electrical specifications Electrical characterization for low side switches Figure 23. Static drain source on resistance Figure 24. Derating curve ) s t( c u d e t le Figure 25. Transconductance o r P Figure 26. Transfer characteristics o s b O ) s ( t c u d o r P e t e l o Figure 27. Turn-on current slope (Vin=5V) bs Figure 28. Turn-on current slope (Vin=3.5V) O Doc ID 8711 Rev 5 19/33 Electrical specifications VN770K Figure 29. Input voltage vs input charge Figure 30. Capacitance variations ) s t( Figure 31. Switching time resistive load (Vin=5V) c u d o r P Figure 32. Switching time resistive load (Rg=10Ohm) e t le o s b O ) s ( t c u d o r P e t e l o Figure 33. Output characteristics Figure 34. Step response current limit s b O 20/33 Doc ID 8711 Rev 5 VN770K Electrical specifications Figure 35. Source drain diode forward characteristics Figure 36. Static drian source on resistance vs Id v ) s t( c u d o r P Figure 37. Static drain source on resistance vs Figure 38. Static drain source on resistance vs input voltage (Id=7A) input voltage e t le o s b O ) s ( t c u d o r P e t e l o Figure 39. Normalized input threshold voltage Figure 40. Normalized on resistance vs vs temperature temperature s b O Doc ID 8711 Rev 5 21/33 Electrical specifications VN770K Figure 41. Turn-off drain source voltage slope Figure 42. Turn-off drain source voltage slope (Vin=3.5V) (Vin=5V) ) s t( c u d Figure 43. Current limit vs junction temperature e t le o s b O ) s ( t c u d o r P e t e l o s b O 22/33 Doc ID 8711 Rev 5 o r P VN770K 3 Application recommendations Application recommendations Figure 44. Application diagram bridge drivers ) s t( c u d e t le o r P o s b O ) Most motor bridge drivers use a reverse battery protection diode (D) inside the supply rail. This diode prevents a reverse current flow back to VBATT in case the bridge becomes disabled via the logic inputs while motor inductance still carries energy. In order to prevent a hazardous overvoltage at circuit supply terminal (VCC), a blocking capacitor (C) is needed to limit the voltage overshoot. As basic orientation, 50µF per 1A load current is recommended. As an alternative, a Zener protection (Z) is also suitable. s ( t c u d o Even if a reverse polarity diode is not present, it is recommended to use a capacitor or Zener at VCC because a similar problem appears in case the supply terminal of the module has intermittent electrical contact to the battery or gets disconnected while the motor is operating. r P e t e l o s b O Doc ID 8711 Rev 5 23/33 Application recommendations VN770K Figure 45. Recommended motor operation ) s t( c u d e t le o s b O ) s ( t c u d o r P e t e l o s b O 24/33 Doc ID 8711 Rev 5 o r P VN770K Application recommendations Figure 46. Waveforms ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O Doc ID 8711 Rev 5 25/33 Thermal data VN770K 4 Thermal data 4.1 SO-28 thermal data Figure 47. SO-28 PC board ) s t( c u d Note: o r P Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad layout to 6cm2). e t le Figure 48. Chipset configuration LOW SIDE CHIP RthAB channel 3 RthB o s b HIGH SIDE CHIP channel 1,2 O ) s ( t c du RthA RthAC LOW SIDE CHIP channel 4 RthC RthBC o r P Figure 49. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition(a) e t le o s b O a. see definitions in Section 5.2 on page 31 26/33 Doc ID 8711 Rev 5 VN770K Thermal data 4.2 Thermal calculation in clockwise and anti-clockwise operation in steady state mode Table 19. Thermal calculation in clockwise and anti-clockwise operation in steady state mode HS1 HS2 LS3 LS4 TjHS12 On Off Off On PdHS1 x RthHS + PdLS4 x RthHSLS + Tamb PdHS1 x RthHSLS + PdLS4 PdHS1 x RthHSLS + PdLS4 x x RthLSLS + Tamb RthLS + Tamb Off On On Off PdHS2 x RthHS + PdLS3 x RthHSLS + Tamb PdHS2 x RthHSLS + PdLS3 PdHS2 x RthHSLS + PdLS3 x x RthLS + Tamb RthLSLS + Tamb 4.2.1 TjLS3 TjLS4 ) s t( Thermal resistances definition c u d Values according to the PCB heatsink area. RthHS = RthHS1 = RthHS2 = high side chip thermal resistance junction to ambient (HS1 or HS2 in on-state) o r P RthLS = RthLS3 = RthLS4 = low side chip thermal resistance junction to ambient e t le RthHSLS = RthHS1LS4 = RthHS2LS3 = mutual thermal resistance junction to ambient between high side and low side chips o s b RthLSLS = RthLS3LS4 = mutual thermal resistance junction to ambient between low side chips O ) Thermal calculation in transient mode(b) 4.2.2 s ( t c TjHS12 = ZthHS x PdHS12 + ZthHSLS x (PdLS3 + PdLS4) + Tamb TjLS3 = ZthHSLS x PdHS12 + ZthLS x PdLS3 + ZthLSLS x PdLS4 + Tamb u d o TjLS4 = ZthHSLS x PdHS12 + ZthLSLS x PdLS3 + ZthLS x PdLS4 + Tamb 4.2.3 r P e Single pulse thermal impedance definition t e l o Values according to the PCB heatsink area. s b O ZthHS = high side chip thermal impedance junction to ambient ZthLS = ZthLS3 = ZthLS4 = low side chip thermal impedance junction to ambient ZthHSLS = ZthHS12LS3 = ZthHS12LS4 = mutual thermal impedance junction to ambient between high side and low side chips ZthLSLS = ZthLS3LS4 = mutual thermal impedance junction to ambient between low side chips 4.2.4 Pulse calculation formula Z TH = R TH +Z THtp 1 –  where  = tP/T b. Calculation is valid in any dynamic operating condition. Pd values set by user. Doc ID 8711 Rev 5 27/33 Thermal data VN770K Figure 50. SO-28 HSD thermal impedance junction ambient single pulse Footprint 1 cm2 2 cm2 6 cm2 Footprint 1 cm2 2 cm2 6 cm2 ) s t( c u d e t le o r P o s b O ) Figure 51. SO-28 LSD thermal impedance junction ambient single pulse s ( t c u d o r P e t e l o s b O 28/33 Doc ID 8711 Rev 5 VN770K Thermal data Figure 52. Thermal fitting model of an H-bridge in SO-28 ) s t( c u d e t le Area/island (cm2) s ( t c R1 = R6 (°C/W) du R2 (°C/W) ro R12 = R17 (°C/W) eP t e l o O bs o s b O ) Thermal parameters(1) Table 20. o r P Footprint 1 2 6 52.28 44.28 32.28 1.61 1.7 3.25 2.6 3.5 3.5 R3 = R13 = R 18 (°C/W) 15.5 R4 = R14 = R19 (°C/W) 10.5 R5 = R15 = R20 (°C/W) 62.28 R7 = R8 = R9 = R10 (°C/W) 150 R11 = R16 (°C/W) 1.5 C1 = C5 (W.s/°C) 0.00025 C2 = C7 = C11 (W.s/°C) 0.024 C3 = C8 =C 12 (W.s/°C) 0.2 C4 = C9 = C13 (W.s/°C) 1.6 C6 = C10 (W.s/°C) 0.00075 1. The blank space means that the value is the same as the previous one. Doc ID 8711 Rev 5 29/33 Package mechanical data VN770K 5 Package mechanical data 5.1 SO-28 mechanical data Figure 53. SO-28 package outline ) s t( c u d e t le o r P o s b Table 21. O ) SO-28 mechanical data s ( t c mm DIM du Min. A a1 Ob Min. Typ. 2.65 Max. 0.104 0.3 0.004 0.012 b 0.35 0.49 0.013 0.019 b1 0.23 0.32 0.009 0.012 C 0.5 0.020 c1 45° (typ.) D 17.7 18.1 0.697 0.713 E 10 10.65 0.393 0.419 e 1.27 0.050 e3 16.51 0.650 F 7.4 7.6 0.291 0.299 L 0.4 1.27 0.016 0.050 S 30/33 Max. 0.1 e t le so o r P Typ inch 8° (max.) Doc ID 8711 Rev 5 VN770K 5.2 Package mechanical data SO-28 tube shipment Figure 54. Tube dimensions (no suffix) ) s t( 5.3 c u d Tape and reel shipment Figure 55. Tape and reel dimensions (suffix “13TR”) e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O Doc ID 8711 Rev 5 31/33 Revision history 6 VN770K Revision history Table 22. Document revision history Date Revision Changes 01-Dec-2002 1 Initial release. 30-Jun-2004 2 Added thermal characterization Revision history table added Disclaimers updated (last page) 3 Document formatted into new ST template Dimensions updated, see Figure 55: Tape and reel dimensions (suffix “13TR”) on page 31 Inserted Chapter 4: Thermal data on page 26 Application diagram updated, see Figure 44: Application diagram bridge drivers on page 23 Updated disclaimer (last page) to include a mention about the use of ST products in automotive applications ) s t( 31-Aug-2006 c u d e t le 30-Jun-2009 4 Updated Table 3: Thermal data. Updated note of Figure 47: SO-28 PC board. Updated Figure 48: Chipset configuration. 25-Sep-2013 5 Updated Disclaimer. o s b O ) s ( t c u d o r P e t e l o s b O 32/33 o r P Doc ID 8711 Rev 5 VN770K ) s t( Please Read Carefully: c u d Information in this document is provided solely in connection with ST products. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 8711 Rev 5 33/33