CGA5H2X8R1H224KT0Y0H

SPECIFICATION SPEC. No. A-150°C-c D A T E : 2016 Oct. To Non-Controlled Copy Upon the acceptance of this spec. previous spec. (C2014-0057) shall be abolished. CUSTOMER’S PRODUCT NAME TDK'S PRODUCT NAME Multilayer Ceramic Chip Capacitors CGA Series/ Automotive grade High Temperature Application Please return this specification to TDK representatives with your signature. If orders are placed without returned specification, please allow us to judge that specification is accepted by your side. RECEIPT CONFIRMATION DATE: YEAR MONTH DAY Test conditions in this specification based on AEC-Q200 for automotive application. TDK Corporation Sales Electronic Components Sales & Marketing Group APPROVED Person in charge Engineering Electronic Components Business Company Ceramic Capacitors Business Group APPROVED CHECKED Person in charge 1. SCOPE This specification is applicable to chip type multilayer ceramic capacitors with a priority over the other relevant specifications. Production places defined in this specification shall be TDK Corporation Japan, TDK(Suzhou)Co.,Ltd and TDK Components U.S.A. Inc. EXPLANATORY NOTE: This specification warrant the quality of the ceramic chip capacitor. The chips should be evaluated or confirmed a state of mounted on your product. If the use of the chips go beyond the bounds of this specification, we can not afford to guarantee. 2. CODE CONSTRUCTION (Example) Catalog Number (Web) Item Description CGA (1) 2 (2) B (3) 2 (4) X8R (5) 1 E (6) 103 (7) K (8) 050 (9) CGA (1) 2 (2) B (3) 2 (4) X8R (5) 1 E (6) 103 (7) K (8) T ○○○○ (12) (13) (1) Series (2) Case size symbol B (10) Symbol Series CGA For automotive application Terminal electrode B L G W B T Internal electrode Ceramic dielectric Symbol 2 3 4 5 Type (EIA style) CC0402 CC0603 CC0805 CC1206 Symbol 6 8 9 Type (EIA style) CC1210 CC1812 CC2220 *As for dimensions of each product, please refer to detailed inforamtion on TDK web. (3) Thickness Symbol B C E F H J Dimension(mm) 0.50 0.60 0.80 0.85 1.15 1.25 —1— A (11) Symbol L M N P Q R Dimension(mm) 1.60 2.00 2.30 2.50 2.80 3.20 (4) Voltage condition in the life test (Details are shown in table 1 No.16 at 8.PERFORMANCE.) Condition Symbol 1 Rated Voltage 2 Rated Voltage x 2 3 Rated Voltage x 1.5 4 Rated Voltage x 1.2 (5) Temperature Characteristics (Details are shown in table 1 No.6 and No.7 at 8.PERFORMANCE.) (6) Rated Voltage Symbol Rated Voltage Symbol Rated Voltage 2J DC 630 V 1H DC 50 V 2W DC 450 V 1E DC 25 V 2E DC 250 V 1C DC 16 V 2A DC 100 V Symbol Rated Capacitance (7) Rated Capacitance Stated in three digits and in units of pico farads (pF). The first and Second digits identify the first and second significant figures of the capacitance, the third digit identifies the multiplier. R is designated for a decimal point. (8) Capacitance tolerance 2R2 2.2pF 105 1,000,000pF (=1μF) Symbol Tolerance C ± 0.25 pF D ± 0.5 pF J ±5% K ± 10 % M ± 20 % Capacitance 10pF and under Over 10pF (9) Thickness code (Only catalog number) (10) Package code (Only catalog number) (11) Special code (Only catalog number) (12) Packaging (Only item description) (Bulk is not applicable for CGA2(CC0402) type.) (13) TDK internal code (Only item description) —2— Symbol Packaging B Bulk T Taping 3. RATED CAPACITANCE AND TOLERANCE 3.1 Standard combination of rated capacitance and tolerances Class Temperature Characteristics Capacitance tolerance 10pF and under 1 NP0 2 12pF to 10,000pF Over 10,000pF C (±0.25pF) 1, 1.5, 2, 2.2, 3, 3.3, 4, 4.7, 5 D (±0.5pF) 6, 6.8, 7, 8, 9, 10 E – 12 series J (± 5 %) E – 6 series K (± 10 %) M (± 20 %) X8R Rated capacitance E – 6 series 3.2 Capacitance Step in E series Capacitance Step E series E- 6 E-12 1.0 1.0 1.5 1.2 1.5 1.8 2.2 2.2 2.7 4. OPERATING TEMPERATURE RANGE Min. operating Max. operating T.C. Temperature Temperature NP0,X8R -55°C 150°C 3.3 3.3 4.7 3.9 4.7 5.6 6.8 6.8 8.2 Reference Temperature 25°C 5. STORING CONDITION AND TERM 5 to 40°C at 20 to 70%RH 6 months Max. 6. P.C. BOARD When mounting on an aluminum substrate, large case size such as CGA6(CC1210), CGA8(CC1812) and CGA9(CC2220) types are more likely to be affected by heat stress from the substrate. Please inquire separate specification for the large case sizes when mounted on the substrate. 7. INDUSTRIAL WASTE DISPOSAL Dispose this product as industrial waste in accordance with the Industrial Waste Law. —3— 8. PERFORMANCE table 1 No. Item Performance Test or inspection method 1 External Appearance No defects which may affect performance. 2 Insulation Resistance Apply rated voltage for 60s. 10,000MΩ or 500MΩ·μF min. (As for the capacitors of rated As for the capacitor of rated voltage 630V DC, voltage 16V DC and,10,000 MΩ or apply 500V DC. 100MΩ·μF min.,) whichever smaller. 3 Voltage Proof Withstand test voltage without insulation breakdown or other damage. Inspect with magnifying glass (3×) T.C. NP0 X8R Rated voltage(RV) Apply voltage RV≦100V 3 × rated voltage 100V＜RV≦500V 1.5 × rated voltage 500V＜RV 1.3 × rated voltage RV≦100V 2.5 × rated voltage 100V＜RV≦500V 1.5 × rated voltage 500V＜RV 1.3 × rated voltage Above DC voltage shall be applied for 1s. Charge / discharge current shall not exceed 50mA. 4 Capacitance Within the specified tolerance. Q (NP0) Dissipation Factor (X8R) 6 Temperature Characteristics of Capacitance (NP0) As for spec of each product, please refer to detailed inforamtion on TDK web. Temperature Coefficient 0 ± 30 (ppm/°C) Capacitance drift within ± 0.2% or ± 0.05pF, whichever larger. —4— Measuring voltage Capacitance NP0 1000pF 1MHz±10% and under 0.5 - 5 Vrms. Over 1000pF 1kHz±10% X8R 5 Measuring frequency T.C. All 1kHz±10% 1.0±0.2Vrms For information which product has which measuring voltage, please contact with our sales representative. See No.4 in this table for measuring condition. Temperature coefficient shall be calculated based on values at 25°C and 85°C temperature. Measuring temperature below 20°C shall be -10°C and -25°C. (continued) No. 7 Item Temperature Characteristics of Capacitance (X8R) Performance Capacitance Change No voltage applied ±15(%) 8 Robustness of Terminations No sign of termination coming off, breakage of ceramic, or other abnormal signs. Test or inspection method Capacitance shall be measured by the steps shown in the following table after thermal equilibrium is obtained for each step. ∆C be calculated ref. STEP3 reading Step Temperature(°C) 1 25 ± 2 2 -55 ± 2 3 25 ± 2 4 150 ± 2 Reflow solder the capacitors on a P.C. board shown in Appendix2 and apply a pushing force of 17.7N with 10±1s. (2N is applied for CGA2(CC0402) type) Pushing force P.C. board Capacitor 9 Bending No mechanical damage. Reflow solder the capacitors on a P.C. board shown in Appendix1 and bend it for 2mm. (1mm is applied for 0.85mm thickness of X8R items.) 20 50 F R230 45 2 45 (Unit : mm) 10 Solderability New solder to cover over 75% of termination. 25% may have pin holes or rough spots but not concentrated in one spot. Ceramic surface of A sections shall not be exposed due to melting or shifting of termination material. A section —5— Completely soak both terminations in solder at the following conditions. Solder : Sn-3.0Ag-0.5Cu or Sn-37Pb Temperature : 245±5°C(Sn-3.0Ag-0.5Cu) 235±5°C(Sn-37Pb) Soaking time : 3±0.3s(Sn-3.0Ag-0.5Cu) 2±0.2s(Sn-37Pb) Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. (continued) No. 11 Item Performance Resistance External No cracks are allowed and to solder appearance terminations shall be covered at heat least 60% with new solder. Capacitance Q (NP0) 12 Vibration Characteristics Change from the value before test NP0 ± 2.5% or ± 0.25pF, whichever larger. X8R ± 7.5 % D.F. (X8R) Meet the initial spec. Insulation Resistance Meet the initial spec. Voltage proof No insulation breakdown or other damage. External appearance No mechanical damage. Q Preheating condition Temp.: 110 ~ 140°C Time : 30 ~ 60s. Solder : Sn-3.0Ag-0.5Cu or Sn-37Pb Leave the capacitors in ambient condition for 6 to 24h (NP0) or 24±2h (X8R) before measurement. Characteristics Change from the value before test NP0 ± 2.5% or ± 0.25pF, whichever larger. X8R ± 7.5 % Meet the initial spec. (NP0) D.F. (X8R) Completely soak both terminations in solder at the following conditions. 260±5°C for 10±1s. Flux : Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Meet the initial spec. Capacitance Test or inspection method Meet the initial spec. —6— Reflow solder the capacitors on a P.C. board shown in Appendix2 before testing. Vibrate the capacitors with following conditions. Applied force : 5G max. Frequency : 10-2,000Hz Duration : 20 min. Cycle : 12 cycles in each 3 mutually perpendicular directions. (continued) No. Item 13 Temperature External appearance cycle Performance Test or inspection method No mechanical damage. Capacitance Characteristics Change from the value before test NP0 ± 2.5% or ± 0.25pF, whichever larger. X8R ± 7.5 % Reflow solder the capacitors on a P.C. board shown in Appendix2 before testing. Expose the capacitors in the condition step1 through step 4 and repeat 1,000 times consecutively. Leave the capacitors in ambient condition for 6 to 24h (NP0) or 24±2h (X8R) before measurement. Step Q 1 Meet the initial spec. (NP0) 14 2 3 D.F. (X8R) Meet the initial spec. Insulation Resistance Meet the initial spec. Voltage proof No insulation breakdown or other damage. 4 Moisture No mechanical damage. External appearance Resistance (Steady Capacitance Change from the Characteristics State) value before test Q (NP0) D.F. (X8R) Insulation Resistance NP0 ± 5% or ± 0.5pF, whichever larger. X8R ± 12.5 % Capacitance Q 30pF and over 350 min. 10pF and over under 30pF 275+5/2×C min. Under 10pF 200+10×C min. C : Rated capacitance (pF) 200% of initial spec. max. 1,000MΩ or 50MΩ·μF min. (As for the capacitors of rated voltage 16V DC, 1,000 MΩ or 10MΩ·μF min.,) whichever smaller. —7— Temperature(°C) -55 ±3 25 150 ±2 25 Time (min.) 30 ± 3 2-5 30 ± 2 2-5 Reflow solder the capacitors on a P.C. board shown in Appendix2 before testing. Leave at temperature 40±2°C, 90 to 95%RH for 500 +24,0h. Leave the capacitors in ambient condition for 6 to 24h (NP0) or 24±2h (X8R) before measurement. (continued) No. Item 15 Moisture External Resistance appearance Performance No mechanical damage. Capacitance Q (NP0) D.F. (X8R) 16 Life Test or inspection method Reflow solder the capacitors on a P.C. board shown in Appendix2 before testing. Characteristics Change from the value before test Apply the rated voltage at temperature 85°C and 85%RH for 1,000 +48,0h. NP0 ±7.5% or ±0.75pF, whichever larger. Charge/discharge current shall not X8R ± 12.5 % Capacitance Q 30pF and over 200 and over Under 30pF 100+10/3×C min. C : Rated capacitance (pF) 200% of initial spec. max. Insulation Resistance 500MΩ or 25MΩ·μF min. (As for the capacitors of rated voltage 16V DC, 500 MΩ or 5MΩ·μF min.,) whichever smaller. External appearance No mechanical damage. Capacitance Characteristics NP0 X8R Change from the value before test ± 3% or ± 0.3pF, whichever larger. ± 15 % exceed 50mA. Leave the capacitors in ambient condition for 6 to 24h (NP0) or 24±2h (X8R) before measurement. Voltage conditioning (only for X8R) Voltage treat the capacitors under testing temperature and voltage for 1 hour. Leave the capacitors in ambient condition for 24±2h before measurement. Use this measurement for initial value. Reflow solder the capacitors on a P.C. board shown in Appendix2 before testing. Below the voltage shall be applied at 150 ±2°C for 1,000 +48,0h. Applied Voltage Rated voltage x2 Q (NP0) Capacitance Q 30pF and over 350 and over 10pF and over to 275+5/2×C min. under 30pF Under 10pF D.F. (X8R) Insulation Resistance 200+10×C min. C : Rated capacitance (pF) 200% of initial spec. max. 1,000MΩ or 50MΩ·μF min. (As for the capacitors of rated voltage 16V DC,1,000 MΩ or 10MΩ·μF min.,) whichever smaller. Rated voltage x1.5 Rated voltage x1.2 Rated voltage x1 As for applied voltage, please contact with our sales representative. Charge/discharge current shall not exceed 50mA. Leave the capacitors in ambient condition for 6 to 24h (NP0) or 24±2h (X8R) before measurement. Voltage conditioning (only for X8R) Voltage treat the capacitors under testing temperature and voltage for 1 hour. Leave the capacitors in ambient condition for 24±2h before measurement. Use this measurement for initial value. *As for the initial measurement of capacitors (X8R) on number 7,11,12,13 and 14 leave capacitors at 150 –10,0°C for 1 hour and measure the value after leaving capacitors for 24±2h in ambient condition. —8— Appendix1 P.C. board for bending test (CGA2) (CGA3,CGA4,CGA5,CGA6,CGA8,CGA9) 100 100 b b 40 40 c 1.0 1.0 a a Solder resist Copper c Solder resist Copper Appendix2 P.C. Board for reliability test 100 40 a b c Slit Solder resist Copper (It is recommended to provide a slit on P.C. board for CGA6,CGA8 and CGA9.) （Unit：mm） Type Dimensions TDK(EIA style) a b c CGA2 (CC0402) 0.4 1.5 0.5 CGA3 (CC0603) 1.0 3.0 1.2 CGA4 (CC0805) 1.2 4.0 1.65 CGA5 (CC1206) 2.2 5.0 2.0 CGA6 (CC1210) 2.2 5.0 2.9 CGA8 (CC1812) 3.5 7.0 3.7 CGA9 (CC2220) 4.5 8.0 5.6 1. Material : Glass Epoxy(As per JIS C6484 GE4) 2. Thickness : Appendix 1 ― 0.8mm ― 1.6mm : Appendix 2 ― 1.6mm Copper(Thickness:0.035mm) Solder resist (CGA2) (CGA3,CGA4,CGA5,CGA6,CGA8,CGA9) —9— 9. INSIDE STRUCTURE AND MATERIAL 3 4 5 2 1 MATERIAL No. NAME 1 Dielectric 2 Electrode NP0 X8R CaZrO 3 BaTiO 3 Nickel (Ni) 3 Copper (Cu) 4 Nickel (Ni) Termination 5 Tin (Sn) 10. PACKAGING Packaging shall be done to protect the components from the damage during transportation and storing, and a label which has the following information shall be attached. 1) Total number of components in a plastic bag for bulk packaging : 1000pcs 2) Tape packaging is as per 14. TAPE PACKAGING SPECIFICATION. (CGA2 [CC0402] types are applicable only to tape packaging.) 1) 2) 3) 4) Inspection No. TDK P/N Customer's P/N Quantity *Composition of Inspection No. Example F 6 A (a) (b) (c) a) b) c) d) e) – ΟΟ (d) – ΟΟΟ (e) Line code Last digit of the year Month and A for January and B for February and so on. (Skip I) Inspection Date of the month. Serial No. of the day 11. RECOMMENDATION As for CGA6 [CC1210] and larger, It is recommended to provide a slit (about 1mm width) in the board under the components to improve washing Flux. And please make sure to dry detergent up completely before. 12. SOLDERING CONDITION As for CGA2 [CC0402], CGA6 [CC1210] and larger, reflow soldering only. — 10 — 13. Caution No. Process Condition 1 Operating Condition (Storage, Transportation) 1-1. Storage 1) The capacitors must be stored in an ambient temperature of 5 to 40°C with a relative humidity of 20 to 70%RH. The products should be used within 6 months upon receipt. 2) The capacitors must be operated and stored in an environment free of dew condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate, Chlorine, Ammonia and sulfur. 3) Avoid storing in sun light and falling of dew. 4) Do not use capacitors under high humidity and high and low atmospheric pressure which may affect capacitors reliability. 5) Capacitors should be tested for the solderability when they are stored for long time. 1-2. Handling in transportation In case of the transportation of the capacitors, the performance of the capacitors may be deteriorated depending on the transportation condition. (Refer to JEITA RCR-2335C 9.2 Handling in transportation) 2 Circuit design  Caution 2-1. Operating temperature Operating temperature should be followed strictly within this specification, especially be careful with maximum temperature. 1) Do not use capacitors above the maximum allowable operating temperature. 2) Surface temperature including self heating should be below maximum operating temperature. (Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at high frequencies around its SRF, the heat might be so extreme that it may damage itself or the product mounted on. Please design the circuit so that the maximum temperature of the capacitors including the self heating to be below the maximum allowable operating temperature. Temperature rise at capacitor surface shall be below 20°C) 3) The electrical characteristics of the capacitors will vary depending on the temperature. The capacitors should be selected and designed in taking the temperature into consideration. 2-2. Operating voltage 1) Operating voltage across the terminals should be below the rated voltage. When AC and DC are super imposed, V0-P must be below the rated voltage. — (1) and (2) AC or pulse with overshooting, VP-P must be below the rated voltage. — (3), (4) and (5) When the voltage is started to apply to the circuit or it is stopped applying, the irregular voltage may be generated for a transit period because of resonance or switching. Be sure to use the capacitors within rated voltage containing these Irregular voltage. Voltage (1) DC voltage Positional Measurement V0-P (Rated voltage) 0 (4) Pulse voltage (A) (5) Pulse voltage (B) Positional Measurement VP-P (Rated voltage) 0 VP-P — 12 — (3) AC voltage VP-P V0-P 0 Voltage (2) DC+AC voltage 0 0 No. Process Condition 2 Circuit design  Caution 2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the reliability of the capacitors may be reduced. 3) The effective capacitance will vary depending on applied DC and AC voltages. The capacitors should be selected and designed in taking the voltages into consideration. 2-3. Frequency When the capacitors (Class 2) are used in AC and/or pulse voltages, the capacitors may vibrate themselves and generate audible sound. 3 Designing P.C. board The amount of solder at the terminations has a direct effect on the reliability of the capacitors. 1) The greater the amount of solder, the higher the stress on the chip capacitors, and the more likely that it will break. When designing a P.C. board, determine the shape and size of the solder lands to have proper amount of solder on the terminations. 2) Avoid using common solder land for multiple terminations and provide individual solder land for each terminations. 3) Size and recommended land dimensions. Chip capacitors Solder land C B Solder resist A Flow soldering Type (mm) CGA3 (CC0603) CGA4 (CC0805) CGA5 (CC1206) A 0.7 - 1.0 1.0 - 1.3 2.1 - 2.5 B 0.8 - 1.0 1.0 - 1.2 1.1 - 1.3 C 0.6 - 0.8 0.8 - 1.1 1.0 - 1.3 Symbol Reflow soldering CGA2 Type Symbol (CC0402) CGA3 (CC0603) (mm) CGA4 (CC0805) A 0.3 - 0.5 0.6 - 0.8 0.9 - 1.2 B 0.35 - 0.45 0.6 - 0.8 0.7 - 0.9 C 0.4 - 0.6 0.6 - 0.8 0.9 - 1.2 CGA5 (CC1206) CGA6 (CC1210) CGA8 (CC1812) CGA9 (CC2220) A 2.0 - 2.4 2.0 - 2.4 3.1 - 3.7 4.1 - 4.8 B 1.0 - 1.2 1.0 - 1.2 1.2 - 1.4 1.2 - 1.4 C 1.1 - 1.6 1.9 - 2.5 2.4 - 3.2 4.0 - 5.0 Type Symbol — 13 — No. 3 Process Designing P.C. board Condition 4) Recommended chip capacitors layout is as following. Disadvantage against bending stress Advantage against bending stress Perforation or slit Perforation or slit Mounting face Break P.C. board with mounted side up. Mount perpendicularly to perforation or slit Perforation or slit Break P.C. board with mounted side down. Mount in parallel with perforation or slit Perforation or slit Chip arrangement (Direction) Closer to slit is higher stress Away from slit is less stress ℓ2 ℓ1 Distance from slit ( ℓ1< ℓ2 ) — 14 — ( ℓ1< ℓ2 ) No. Process 3 Designing P.C. board Condition 5) Mechanical stress varies according to location of chip capacitors on the P.C. board. E Perforation D C B A Slit The stress in capacitors is in the following order. A>B=C>D>E 6) Layout recommendation Example Use of common solder land Soldering with chassis Lead wire Chassis chip Solder Use of common solder land with other SMD Solder land Excessive solder Need to avoid Excessive solder PCB Adhesive Solder land ℓ1 Missing solder Lead wire Solder land Solder resist Solder resist Recommendation Solder resist ℓ2 ℓ2 >ℓ1 — 15 — 4 Process Mounting Condition 4-1. Stress from mounting head If the mounting head is adjusted too low, it may induce excessive stress in the chip capacitors to result in cracking. Please take following precautions. 1) Adjust the bottom dead center of the mounting head to reach on the P.C. board surface and not press it. 2) Adjust the mounting head pressure to be 1 to 3N of static weight. 3) To minimize the impact energy from mounting head, it is important to provide support from the bottom side of the P.C. board. See following examples. Not recommended Single sided mounting Recommended Crack Support pin Double-sides mounting Solder peeling Crack Support pin When the centering jaw is worn out, it may give mechanical impact on the capacitors to cause crack. Please control the close up dimension of the centering jaw and provide sufficient preventive maintenance and replacement of it. 4-2. Amount of adhesive a a c c b No. Example : CGA4 (CC0805), CGA5 (CC1206) a 0.2mm min. b 70 - 100μm c Do not touch the solder land — 16 — Soldering 5-1. Flux selection Although highly-activated flux gives better solderability, substances which increase activity may also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended following. 1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine). Strong flux is not recommended. 2) Excessive flux must be avoided. Please provide proper amount of flux. 3) When water-soluble flux is used, enough washing is necessary. 5-2. Recommended soldering profile by various methods Reflow soldering Wave soldering Soldering Preheating Peak Temp Peak Temp △T 0 Soldering Natural cooling Preheating Natural cooling Temp.. (°C) 5 Condition Temp. (°C) Process Over 60 sec. Over 60 sec. ∆T 0 Over 60 sec. Peak Temp time Peak Temp time Manual soldering (Solder iron) APPLICATION As for CGA3 (CC0603), CGA4 (CC0805) and Peak Temp CGA5 (CC1206), applied to wave soldering and reflow soldering. Temp.. (°C) No. As for CGA2 (CC0402), CGA6 (CC1210), ∆T CGA8 (CC1812) and CGA9 (CC2220), applied only to reflow soldering. Preheating 0 3sec. (As short as possible) ※ As for peak temperature of manual soldering, please refer“5-6. Solder repair by solder iron”. 5-3. Recommended soldering peak temp and peak temp duration Temp./Duration Wave soldering Reflow soldering Peak temp(°C) Duration(sec.) Peak temp(°C) Duration(sec.) Sn-Pb Solder 250 max. 3 max. 230 max. 20 max. Lead Free Solder 260 max. 5 max. 260 max. 10 max. Solder Recommended solder compositions Sn-37Pb (Sn-Pb solder) Sn-3.0Ag-0.5Cu (Lead Free Solder) — 17 — No. Process 5 Soldering Condition 5-4. Avoiding thermal shock 1) Preheating condition Soldering Type Wave soldering Reflow soldering Manual soldering 2) Temp. (°C) CGA3(CC0603), CGA4(CC0805), CGA5(CC1206) CGA2(CC0402), CGA3(CC0603), CGA4(CC0805), CGA5(CC1206) CGA6(CC1210), CGA8(CC1812), CGA9(CC2220) CGA2(CC0402), CGA3(CC0603), CGA4(CC0805), CGA5(CC1206) CGA6(CC1210), CGA8(CC1812), CGA9(CC2220) ∆T ≤ 150 ∆T ≤ 150 ∆T ≤ 130 ∆T ≤ 150 ∆T ≤ 130 Cooling condition Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temperature difference (∆T) must be less than 100°C. 5-5. Amount of solder Excessive solder will induce higher tensile force in chip capacitors when temperature changes and it may result in chip cracking. In sufficient solder may detach the capacitors from the P.C. board. Higher tensile force in chip capacitors to cause crack Excessive solder Maximum amount Minimum amount Adequate Low robustness may cause contact failure or chip capacitors come off the P.C. board. Insufficient solder 5-6. Solder repair by solder iron 1) Selection of the soldering iron tip Tip temperature of solder iron varies by its type, P.C. board material and solder land size. The higher the tip temperature, the quicker the operation. However, heat shock may cause a crack in the chip capacitors. Please make sure the tip temp. before soldering and keep the peak temp and time in accordance with following recommended condition. (Please preheat the chip capacitors with the condition in 5-4 to avoid the thermal shock.) Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder) Type Temp. (°C) CGA2(CC0402) CGA3(CC0603) CGA4(CC0805) CGA5(CC1206) 350 max. CGA6(CC1210) CGA8(CC1812) CGA9(CC2220) 280 max. — 18 — Duration (sec.) Wattage (W) Shape (mm) 3 max. 20 max. Ø 3.0 max. No. Process 5 Soldering Condition 2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors may cause crack. Do not touch the ceramic dielectric and the terminations by solder iron. 5-7.Soldering rework using spot heater Heat stress during rework may possibly be reduced by using a spot heater (also called a “blower”) rather than a soldering iron. It is applied only to adding solder in the case of insufficient solder amount. 1) Reworking using a spot heater may suppress the occurrence of cracks in the capacitor compared to using a soldering iron. A spot heater can heat up a capacitor uniformly with a small heat gradient which leads to lower thermal stress caused by quick heating and cooling or localized heating. Moreover, where ultra-small capacitors are mounted close together on a printed circuit board, reworking with a spot heater can eliminate the risk of direct contact between the tip of a soldering iron and a capacitor. 2) Rework condition If the blower nozzle of a spot heater is too close to a capacitor, a crack in the capacitor may occur due to heat stress. Below are recommendations for avoiding such an occurrence. Keep more than 5mm between a capacitor and a spot heater nozzle. The blower temperature of the spot heater shall be lower than 400°C. The airflow shall be set as weak as possible. The diameter of the nozzle is recommended to be 2mm(one-outlet type).The size is standard and common. Duration of blowing hot air is recommended to be 10s or less for CGA3 (CC0603), CGA4 (CC0805) and CGA5 (CC1206), and 30s or less for CGA6 (CC1210), CGA8(CC1812) and CGA9 (CC2220), considering surface area of the capacitor and melting temperature of solder. The angle between the nozzle and the capacitor is recommended to be 45degrees in order to work easily and to avoid partial area heating. As is the case when using a soldering iron, preheating reduces thermal stress on capacitors and improves operating efficiency. ・Recommended rework condition（Consult the component manufactures for details.） Distance from nozzle 5mm and over Nozzle angle 45degrees Nozzle temp. 400°C and less Set as weak as possible (The airflow shall be the minimum value necessary for solder to melt in the conditions mentioned above.) φ2mm（one-outlet type） Airflow Nozzle diameter Blowing duration 10s and less (CGA3 [CC0603], CGA4 [CC0805], CGA5 [CC1206]) 30s and less (CGA6 [CC1210], CGA8 [CC1812], CGA9 [CC2220]) ・Example of recommended spot heater use One-outlet type nozzle Angle : 45degrees — 19 — No. Process 5 Soldering Condition 3) Amount of solder should be suitable to from a proper fillet shape. Excess solder causes mechanical and thermal stress on a capacitor and results in cracks. Insufficient solder causes weak adherence of the capacitor to the substrate and may result in detachment of a capacitor and deteriorate reliability of the printed wiring board. See the example of appropriate solder fillet shape for 5-5.Amount of solder. 5-8. Sn-Zn solder Sn-Zn solder affects product reliability. Please contact TDK in advance when utilize Sn-Zn solder. 5-9. Countermeasure for tombstone The misalignment between the mounted positions of the capacitors and the land patterns should be minimized. The tombstone phenomenon may occur especially the capacitors are mounted (in longitudinal direction) in the same direction of the reflow soldering. (Refer to JEITA RCR-2335C Annex A (Informative) Recommendations to prevent the tombstone phenomenon) 6 Cleaning 1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may stick to chip capacitors surface to deteriorate especially the insulation resistance. 2) If cleaning condition is not suitable, it may damage the chip capacitors. 2)-1. Insufficient washing (1) Terminal electrodes may corrode by Halogen in the flux. (2) Halogen in the flux may adhere on the surface of capacitors, and lower the insulation resistance. (3) Water soluble flux has higher tendency to have above mentioned problems (1) and (2). 2)-2. Excessive washing When ultrasonic cleaning is used, excessively high ultrasonic energy output can affect the connection between the ceramic chip capacitor's body and the terminal electrode. To avoid this, following is the recommended condition. Power : 20 W/ max. Frequency : 40 kHz max. Washing time : 5 minutes max. 2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may bring the same result as insufficient cleaning. — 20 — No. 7 Process Coating and molding of the P.C. board Condition 1) When the P.C. board is coated, please verify the quality influence on the product. 2) Please verify carefully that there is no harmful decomposing or reaction gas emission during curing which may damage the chip capacitors. 3) Please verify the curing temperature. 8 Handling after chip mounted  Caution 1) Please pay attention not to bend or distort the P.C. board after soldering in handling otherwise the chip capacitors may crack. Bend Twist 2) Printed circuit board cropping should not be carried out by hand, but by using the proper tooling. Printed circuit board cropping should be carried out using a board cropping jig as shown in the following figure or a board cropping apparatus to prevent inducing mechanical stress on the board. (1)Example of a board cropping jig Recommended example: The board should be pushed from the back side, close to the cropping jig so that the board is not bent and the stress applied to the capacitor is compressive. Unrecommended example: If the pushing point is far from the cropping jig and the pushing direction is from the front side of the board, large tensile stress is applied to the capacitor, which may cause cracks. Outline of jig Printed circuit board Recommended V-groove Printed circuit board Direction of load Components Load point Slot Board cropping jig V-groove — 21 — Slot Unrecommended Direction of load Load point Printed circuit board Components V-groove Slot No. 8 Process Handling after chip mounted  Caution Condition (2)Example of a board cropping machine An outline of a printed circuit board cropping machine is shown below. The top and bottom blades are aligned with one another along the lines with the V-grooves on printed circuit board when cropping the board. Unrecommended example: Misalignment of blade position between top and bottom, right and left, or front and rear blades may cause a crack in the capacitor. Outline of machine Principle of operation Top blade Top blade Printed circuit board Printed circuit board Bottom blade V-groove Cross-section diagram Top blade Printed circuit board Bottom blade V-groove Unrecommended Recommended Top-bottom misalignment Left-right misalignment Front-rear misalignment Top blade Top blade Top blade Bottom blade Bottom blade Bottom blade Top blade Board Bottom blade 3) When functional check of the P.C. board is performed, check pin pressure tends to be adjusted higher for fear of loose contact. But if the pressure is excessive and bend the P.C. board, it may crack the chip capacitors or peel the terminations off. Please adjust the check pins not to bend the P.C. board. Item Not recommended Termination peeling Board bending Check pin — 22 — Recommended Support pin Check pin No. 9 Process Handling of loose chip capacitors Condition 1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially, the large case sized chip capacitors are tendency to have cracks easily, so please handle with care. Crack Floor 2) Piling the P.C. board after mounting for storage or handling, the corner of the P.C. board may hit the chip capacitors of another board to cause crack. P.C.board Crack 10 Capacitance aging The capacitors (Class 2) have aging in the capacitance. They may not be used in precision time constant circuit. In case of the time constant circuit, the evaluation should be done well. 11 Estimated life and estimated failure rate of capacitors As per the estimated life and the estimated failure rate depend on the temperature and the voltage. This can be calculated by the equation described in JEITA RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule, Temperature acceleration coefficient : 10°C rule) The failure rate can be decreased by reducing the temperature and the voltage but they will not be guaranteed. — 23 — No. 12 Process Caution during operation of equipment Condition 1) A capacitor shall not be touched directly with bare hands during operation in order to avoid electric shock. Electric energy held by the capacitor may be discharged through the human body when touched with a bare hand. Even when the equipment is off, a capacitor may stay charged. The capacitor should be handled after being completely discharged using a resistor. 2) The terminals of a capacitor shall not be short-circuited by any accidental contact with a conductive object. A capacitor shall not be exposed to a conductive liquid such as an acid or alkali solution. A conductive object or liquid, such as acid and alkali, between the terminals may lead to the breakdown of a capacitor due to short circuit 3) Confirm that the environment to which the equipment will be exposed during transportation and operation meets the specified conditions. Do not to use the equipment in the following environments. (1) Environment where a capacitor is spattered with water or oil (2) Environment where a capacitor is exposed to direct sunlight (3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or radiation (4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen sulfide, sulfur dioxide, chlorine. ammonia gas etc.) (5) Environment where a capacitor exposed to vibration or mechanical shock exceeding the specified limits. (6) Atmosphere change with causes condensation 13 Others  Caution The products listed on this specification sheet are intended for use in general electronic equipment (AV equipment, telecommunications equipment, home appliances, amusement equipment, computer equipment, personal equipment, office equipment, measurement equipment, industrial robots) and automotive application under a normal operation and use condition. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to society, person or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below or for any other use exceeding the range or conditions set forth in this specification sheet. If you intend to use the products in the applications listed below or if you have special requirements exceeding the range or conditions set forth in this specification, please contact us. (1) Aerospace/Aviation equipment (2) Transportation equipment (electric trains, ships, etc. except automotive application) (3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2) (4) Power-generation control equipment (5) Atomic energy-related equipment (6) Seabed equipment (7) Transportation control equipment (8) Public information-processing equipment (9) Military equipment (10) Electric heating apparatus, burning equipment (11) Disaster prevention/crime prevention equipment (12) Safety equipment (13) Other applications that are not considered general-purpose applications When designing your equipment even for general-purpose applications, you are kindly requested to take into consideration securing protection circuit/device or providing backup circuits in your equipment. — 24 — 14. TAPE PACKAGING SPECIFICATION 1. CONSTRUCTION AND DIMENSION OF TAPING 1-1. Dimensions of carrier tape Dimensions of paper tape shall be according to Appendix 3, 4. Dimensions of plastic tape shall be according to Appendix 5, 6. 1-2. Bulk part and leader of taping Bulk Bulk 160mm min. Chips 160mm min. Leader Drawing direction 400mm min 1-3. Dimensions of reel Dimensions of Ø178 reel shall be according to Appendix 7, 8. Dimensions of Ø330 reel shall be according to Appendix 9, 10. 1-4. Structure of taping (a) Paper (b) Plastic Top cover tape Top cover tape Pitch hole Paper carrier tape Bottom cover tape (Bottom cover tape is not always applied.) Plastic carrier tape 2. CHIP QUANTITY As for chip quantity and taping material of each product, please refer to detailed inforamtion on TDK web. — 25 — 3. PERFORMANCE SPECIFICATIONS 3-1. Fixing peeling strength (top tape) 0.05-0.7N. (See the following figure.) 〈Paper〉 Direction of cover tape pulling Top cover tape Carrier tape 0～15° Direction of pulling Paper tape should not adhere to top cover tape when pull the cover tape. 〈Plastic〉 Direction of pulling Top cover tape Carrier tape 0～15° Direction of pulling 3-2. Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm with components in tape. 3-3. The missing of components shall be less than 0.1% 3-4. Components shall not stick to fixing tape. 3-5. The fixing tapes shall not protrude beyond the edges of the carrier tape not shall cover the sprocket holes. — 26 — Appendix 3 Paper Tape Pitch hole Cavity(Chip insert) J E A D B G H T F (Unit : mm) Symbol Type CGA2 (CC0402) Symbol Type CGA2 (CC0402) ( A B C D E F ( 0.65 ) ( 1.15 ) 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 2.00 ± 0.05 G H J T 2.00 ± 0.05 4.00 ± 0.10 Ø 1.50 +0.10 0 ) Reference value. — 27 — 0.60±0.15 Appendix 4 Paper Tape (Paper tape shall be used for parts having a thickness of less than 1.0mm) Pitch hole Cavity(Chip insert) J E A D B T H G C F (Unit : mm) Symbol Type CGA3 (CC0603) CGA4 (CC0805) CGA5 (CC1206) Symbol Type CGA3 (CC0603) CGA4 (CC0805) CGA5 (CC1206) ( A B ( 1.10 ) ( 1.90 ) ( 1.50 ) ( 2.30 ) ( 1.90 ) ( 3.50 ) G H 2.00 ± 0.05 4.00 ± 0.10 C D E F 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 4.00 ± 0.10 J T Ø 1.50 +0.10 0 ) Reference value. — 28 — 1.20 max. Appendix 5 Plastic Tape Pitch hole Cavity(Chip insert) J E A D C B t H K Q F G (Unit : mm) Symbol Type CGA4 (CC0805) CGA5 (CC1206) CGA6 (CC1210) Symbol Type CGA4 (CC0805) CGA5 (CC1206) CGA6 (CC1210) ( A B ( 1.50 ) ( 2.30 ) ( 1.90 ) ( 3.50 ) C D 8.00 ± 0.30 3.50 ± 0.05 E F 1.75 ± 0.10 4.00 ± 0.10 t Q 0.60 max. Ø 0.50 min. * 12.00 ± 0.30 * 5.50 ± 0.05 ( 2.90 ) ( 3.60 ) G H 2.00 ± 0.05 4.00 ± 0.10 J Ø 1.50 K +0.10 0 2.50 max. 3.40 max. ) Reference value. Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory. * Applied to thickness, 2.5mm products. — 29 — Appendix 6 Plastic Tape Pitch hole Cavity(Chip insert) J E A D B t H G C Q F K (Unit : mm) Symbol Type CGA8 (CC1812) CGA9 (CC2220) Symbol Type CGA8 (CC1812) CGA9 (CC2220) ( A B ( 3.60 ) ( 4.90 ) ( 5.40 ) ( 6.10 ) G H 2.00 ± 0.05 4.00 ± 0.10 C D E F 12.00 ± 0.30 5.50 ± 0.05 1.75 ± 0.10 8.00 ± 0.10 J K t Q 6.50 max. 0.60 max. Ø 1.50 min. Ø 1.50 +0.10 0 ) Reference value. — 30 — Appendix 7 CGA2, CGA3, CGA4, CGA5, CGA6 ( As for CGA6 type, any thickness of the item except 2.5mm ) (Material : Polystyrene) W2 E C B D r W1 A (Unit : mm) Symbol A B C D E W1 Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 9.0 ± 0.3 Symbol W2 r Dimension 13.0 ± 1.4 1.0 Appendix 8 CGA6, CGA8, CGA9 ( As for CGA6 type, applied to 2.5mm thickness products ) (Material : Polystyrene) W2 E C B D r W1 A (Unit : mm) Symbol A B C D E W1 Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 13.0 ± 0.3 Symbol W2 r Dimension 17.0 ± 1.4 1.0 — 31 — Appendix 9 CGA2, CGA3, CGA4, CGA5, CGA6 ( As for CGA6 type, any thickness of the item except 2.5mm ) (Material : Polystyrene) E C B D r t W A (Unit : mm) Symbol A B C D E W Dimension Ø382 max. (Nominal Ø330) Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 10.0 ± 1.5 Symbol t r Dimension 2.0 ± 0.5 1.0 Appendix 10 CGA6, CGA8, CGA9 ( As for CGA6 type, applied to 2.5mm thickness products ) (Material : Polystyrene) E C B D r W A t (Unit : mm) Symbol A B C D E W Dimension Ø382 max. (Nominal Ø330) Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 14.0 ± 1.5 Symbol t r Dimension 2.0 ± 0.5 1.0 — 32 —