Si1912EDH
Vishay Siliconix
Dual N-Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
20
RDS(on) (Ω)
ID (A)
0.280 at VGS = 4.5 V
1.28
0.360 at VGS = 2.5 V
1.13
0.450 at VGS = 1.8 V
1.0
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFETs: 1.8 V Rated
• ESD Protected: 2000 V
• Thermally Enhanced SC-70 Package
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Load Switching
• PA Switch
• Level Switch
D1
SOT-363
SC-70 (6-LEADS)
1
6
D1
G1
2
5
G2
D2
3
4
S2
Marking Code
CA
XX
1k
1k
G1
YY
S1
D2
G2
Lot Traceability
and Date Code
Part # Code
Top View
S1
S2
Ordering Information: Si1912EDH-T1-E3 (Lead (Pb)-free)
Si1912EDH-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
5s
Steady State
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
± 12
TA = 25 °C
Continuous Drain Current (TJ = 150 °C)a
ID
TA = 85 °C
Continuous Diode-Current (Diode Conduction)a
Maximum Power Dissipationa
1.28
1.13
0.81
4
IS
TA = 25 °C
PD
TA = 85 °C
Operating Junction and Storage Temperature Range
V
0.92
IDM
Pulsed Drain Current
0.61
0.48
0.74
0.57
0.38
0.30
TJ, Tstg
Unit
- 55 to 150
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Symbol
t≤5s
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
130
170
170
220
80
100
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
Document Number: 71408
S10-1054-Rev. B, 03-May-10
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Si1912EDH
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS = VGS , ID = 100 µA
0.45
Typ.
Max.
Unit
VDS = 0 V, VGS = ± 4.5 V
±1
µA
VDS = 0 V, VGS = ± 12 V
± 10
mA
VDS = 16 V, VGS = 0 V
1
VDS = 16 V, VGS = 0 V, TJ = 85 °C
5
Static
Gate Threshold Voltage
VGS(th)
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
VDS = 5 V, VGS = 4.5 V
RDS(on)
µA
2
A
VGS = 4.5 V, ID = 1.13 A
Drain-Source On-State Resistancea
V
0.220
0.280
VGS = 2.5 V, ID = 0.99 A
0.281
0.360
VGS = 1.8 V, ID = 0.2 A
0.344
0.450
Forward Transconductancea
gfs
VDS = 10 V, ID = 1.13 A
2.6
Diode Forward Voltagea
VSD
IS = 0.48 A, VGS = 0 V
0.8
1.2
0.65
1
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
VDS = 10 V, VGS = 4.5 V, ID = 1.13 A
0.2
nC
Gate-Drain Charge
Qgd
0.23
Turn-On Delay Time
td(on)
45
70
85
130
350
530
210
320
Rise Time
tr
Turn-Off Delay Time
td(off)
Fall Time
VDD = 10 V, RL = 20 Ω
ID ≅ 0.5 A, VGEN = 4.5 V, Rg = 6 Ω
tf
ns
Notes
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
10
10 000
1000
I GSS - Gate Current (µA)
IGSS - Gate Current (mA)
8
6
4
100
10
T J = 150 °C
1
T J = 25 °C
0.1
2
0.01
0
0.001
0
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2
4
8
12
16
0
3
6
9
12
V GS - Gate-to-Source Voltage (V)
V GS - Gate-to-Source Voltage (V)
Gate Current vs. Gate-Source Voltage
Gate Current vs. Gate-Source Voltage
15
Document Number: 71408
S10-1054-Rev. B, 03-May-10
Si1912EDH
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2.0
2.0
T C = - 55 °C
V GS = 5 V thru 2 V
25 °C
1.5
I D - Drain Current (A)
I D - Drain Current (A)
1.5
1.5 V
1.0
125 °C
1.0
0.5
0.5
1V
0.0
0
1
2
3
0.0
0.0
4
1.0
1.5
V GS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
2.0
140
0.6
120
0.5
100
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
0.5
V DS - Drain-to-Source Voltage (V)
0.4
V GS = 1.8 V
V GS = 2.5 V
0.3
V GS = 4.5 V
0.2
Ciss
80
60
40
Coss
0.1
20
Crss
0.0
0.0
0
0.5
1.0
1.5
0
2.0
12
16
ID - Drain Current (A)
V DS - Drain-to-Source Voltage (V)
Capacitance
20
1.6
V GS = 4.5 V
ID = 1.13 A
V DS = 10 V
ID = 1.13 A
1.4
3
2
(Normalized)
4
R DS(on) - On-Resistance
V GS - Gate-to-Source Voltage (V)
8
On-Resistance vs. Drain Current
5
1.2
1.0
0.8
1
0
0.0
4
0.3
0.6
0.9
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 71408
S10-1054-Rev. B, 03-May-10
1.2
1.5
0.6
- 50
- 25
0
25
50
75
100
125
150
T J - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Si1912EDH
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.6
2
ID = 1.13 A
TJ = 150 °C
R DS(on) - On-Resistance (Ω)
0.5
I S - Source Current (A)
1
TJ = 25 °C
0.4
0.3
0.2
0.1
0.0
0.1
0
0.4
0.2
0.6
0.8
1.0
0
1.2
2
3
4
5
V GS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.2
5
0.1
4
ID = 100 µA
0
3
Power (W)
VGS(th) Variance (V)
1
- 0.1
2
- 0.2
1
- 0.3
- 0.4
- 50
- 25
0
25
50
75
100
125
0
0.01
150
0.1
1
10
100
600
T J - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
P DM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
2. Per Unit Base = R thJA = 170 °C/W
3. T JM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
10 -3
t1
t2
10 -2
10 -1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Document Number: 71408
S10-1054-Rev. B, 03-May-10
Si1912EDH
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71408.
Document Number: 71408
S10-1054-Rev. B, 03-May-10
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Revision: 01-Jan-2022
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Document Number: 91000