VS-10ETF0...-M3 Series
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Vishay Semiconductors
Fast Soft Recovery Rectifier Diode, 10 A
FEATURES
Base
cathode
2
2
• Glass passivated pellet chip junction
• 150 °C max operating junction temperature
• Low forward voltage drop and short reverse
recovery time
1
1
Cathode
3
• Designed and qualified
JEDEC®-JESD 47
3
Anode
TO-220AC 2L
according
to
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
APPLICATIONS
IF(AV)
10 A
VR
200 V, 400 V, 600 V
VF at IF
1.2 V
IFSM
130 A
trr
50 ns
TJ max.
150 °C
Snap factor
0.6
Package
TO-220AC 2L
Circuit configuration
Single
These devices are intended for use in output rectification
and freewheeling in inverters, choppers and converters as
well as in input rectification where severe restrictions on
conducted EMI should be met.
DESCRIPTION
The VS-10ETF0... fast soft recovery rectifier series has been
optimized for combined short reverse recovery time and low
forward voltage drop.
The glass passivation ensures stable reliable operation in
the most severe temperature and power cycling conditions.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
VRRM
IF(AV)
VALUES
UNITS
200 to 600
V
Sinusoidal waveform
10
A
130
IFSM
trr
1 A, 100 A/μs
50
VF
10 A, TJ = 25 °C
1.2
V
-40 to +150
°C
IRRM
AT 150 °C
mA
TJ
ns
VOLTAGE RATINGS
PART NUMBER
VRRM, MAXIMUM PEAK REVERSE
VOLTAGE
V
VRSM, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
VS-10ETF02-M3
200
300
VS-10ETF04-M3
400
500
VS-10ETF06-M3
600
700
3
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
Maximum average forward current
IF(AV)
TC = 128 °C, 180° conduction half sine wave
10
Maximum peak one cycle
non-repetitive surge current
IFSM
Maximum I2t for fusing
I2t
Maximum I2√t for fusing
I2√t
10 ms sine pulse, rated VRRM applied
110
10 ms sine pulse, no voltage reapplied
130
10 ms sine pulse, rated VRRM applied
60
10 ms sine pulse, no voltage reapplied
85
t = 0.1 to 10 ms, no voltage reapplied
850
UNITS
A
A2s
A2√s
Revision: 29-Nov-2021
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VS-10ETF0...-M3 Series
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ELECTRICAL SPECIFICATIONS
SYMBOL
PARAMETER
Maximum forward voltage drop
VFM
rt
Forward slope resistance
VF(TO)
Threshold voltage
Maximum reverse leakage current
IRM
TEST CONDITIONS
VALUES
10 A, TJ = 25 °C
TJ = 150 °C
TJ = 25 °C
V
23.5
mΩ
0.85
V
0.1
VR = Rated VRRM
TJ = 150 °C
UNITS
1.2
mA
3.0
RECOVERY CHARACTERISTICS
SYMBOL
PARAMETER
Reverse recovery time
trr
Reverse recovery current
Irr
Reverse recovery charge
Qrr
TEST CONDITIONS
IF at 10 Apk
25 A/μs
25 °C
S
Snap factor
VALUES
UNITS
200
ns
2.75
A
0.32
μC
IFM
trr
t
dir
dt
0.6
Qrr
IRM(REC)
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Maximum thermal resistance
junction to case
RthJC
Maximum thermal resistance
junction to ambient
RthJA
Typical thermal resistance,
case to heatsink
RthCS
DC operation
Marking device
UNITS
-40 to +150
°C
1.5
62
Mounting surface, smooth and greased
°C/W
0.5
2
g
0.07
oz.
minimum
6 (5)
maximum
12 (10)
kgf · cm
(lbf · in)
Approximate weight
Mounting torque
VALUES
Case style TO-220AC 2L (JEDEC)
10ETF02
10ETF04
10ETF06
Revision: 29-Nov-2021
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VS-10ETF0...-M3 Series
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Vishay Semiconductors
20
10ETF.. Series
RthJC (DC) = 1.5 °C/W
145
140
Maximum Average Forward
Power Loss (W)
Maximum Allowable Case
Temperature (°C)
150
Ø
Conduction angle
135
130
125
30°
60°
90° 120°
16
120°
180°
DC
30°
RMS limit
12
8
Ø
4
Conduction period
0
0
2
6
4
10
8
12
0
4
12
8
16
Average Forward Current (A)
Average Forward Current (A)
Fig. 1 - Current Rating Characteristics
Fig. 4 - Forward Power Loss Characteristics
120
150
10ETF.. Series
RthJC (DC) = 1.5 °C/W
140
Ø
Conduction period
135
130
120°
125
60°
DC
90°
At any rated load condition and with
rated Vrrm applied following surge.
Initial Tj = 150 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
110
Peak Half Sine Wave
Forward Current (A)
145
30°
100
90
80
70
60
50
40
VS-10ETF.. Series
30
180°
20
120
0
2
4
6
8
10
12
14
1
16
10
100
Average Forward Current (A)
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 2 - Current Rating Characteristics
Fig. 5 - Maximum Non-Repetitive Surge Current
150
16
120°
14
90°
130
60°
12
180°
30°
10
Peak Half Sine Wave
Forward Current (A)
Maximum Average Forward
Power Loss (W)
90°
60°
180°
120
Maximum Allowable Case
Temperature (°C)
10ETF.. Series
TJ = 150 °C
RMS limit
8
6
Ø
4
Conduction angle
2
10ETF.. Series
TJ = 150 °C
2
4
6
8
90
70
50
30
VS-10ETF.. Series
0
0
110
Maximum non-repetitive surge current
versus pulse train duration.
Initial Tj = Tj max.
No voltage reapplied
Rated Vrrm reapplied
10
10
0.01
0.1
1
10
Average Forward Current (A)
Pulse Train Duration (s)
Fig. 3 - Forward Power Loss Characteristics
Fig. 6 - Maximum Non-Repetitive Surge Current
Revision: 29-Nov-2021
Document Number: 96210
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VS-10ETF0...-M3 Series
Vishay Semiconductors
100
1.4
Qrr - Typical Reverse
Recovery Charge (µC)
1.2
TJ = 150 °C
TJ = 25 °C
10
IFM = 20 A
1.0
IFM = 10 A
0.8
0.6
IFM = 5 A
0.4
IFM = 2 A
0.2
IFM = 1 A
1
0.5
0
1.0
1.5
2.0
2.5
0
3.0
40
80
120
160
200
Instantaneous Forward Voltage (V)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 7 - Forward Voltage Drop Characteristics
Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C
2.5
0.4
10ETF.. Series
TJ = 150 °C
8EWF..S Series
T J = 25 °C
0.3
I FM = 20 A
0.2
10 A
8A
5A
0.1
2A
IFM = 20 A
2.0
IFM = 10 A
1.5
IFM = 5 A
1.0
IFM = 2 A
0.5
IFM = 1 A
1A
0
0
0
40
80
120
160
200
0
40
80
120
160
200
Rate Of Fall Of Forward Current - dI/dt (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 8 - Recovery Time Characteristics, TJ = 25 °C
Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C
0.4
15
10ETF.. Series
TJ = 25 °C
Irr - Typical Reverse
Recovery Current (A)
10ETF.. Series
TJ = 150 °C
trr - Typical Reverse
Recovery Time (µs)
10ETF.. Series
TJ = 25 °C
10ETF.. Series
Qrr - Typical Reverse
Recovery Charge (µC)
Typical Reverse Recovery Time - Trr (µs)
Instantaneous Forward Current (A)
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0.3
IFM = 20 A
0.2
IFM = 10 A
IFM = 5 A
0.1
IFM = 2 A
IFM = 20 A
12
IFM = 10 A
IFM = 5 A
9
IFM = 2 A
6
IFM = 1 A
3
IFM = 1 A
0
0
0
40
80
120
160
200
0
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 9 - Recovery Time Characteristics, TJ = 150 °C
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C
Revision: 29-Nov-2021
Document Number: 96210
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-10ETF0...-M3 Series
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Vishay Semiconductors
20
Irr - Typical Reverse
Recovery Current (A)
10ETF.. Series
TJ = 150 °C
IFM = 20 A
16
IFM = 10 A
IFM = 5 A
12
IFM = 2 A
8
IFM = 1 A
4
0
0
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
ZthJC - Transient Thermal Impedance (°C/W)
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
10
Steady state value
(DC operation)
1
0.1
0.01
Single pulse
0.001
0.001
0.01
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
0.1
10ETF.. Series
1
10
Square Wave Pulse Duration (s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
Revision: 29-Nov-2021
Document Number: 96210
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VS-10ETF0...-M3 Series
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Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
10
E
T
F
06
-M3
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (10 = 10 A)
3
-
Circuit configuration:
E = single
4
-
Package:
T = 2L TO-220AC
5
-
Type of silicon:
F = fast soft recovery rectifier
02 = 200 V
04 = 400 V
06 = 600 V
6
-
Voltage code x 100 = VRRM
7
-
Environmental digit
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
BASE QUANTITY
PACKAGING DESCRIPTION
VS-10ETF02-M3
50
Antistatic plastic tube
VS-10ETF04-M3
50
Antistatic plastic tube
VS-10ETF06-M3
50
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96156
Part marking information
www.vishay.com/doc?95391
Revision: 29-Nov-2021
Document Number: 96210
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Outline Dimensions
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Vishay Semiconductors
2L TO-220AC
DIMENSIONS in millimeters and inches
A
0.014 M B A M
(6)
E
A
ØP
Q
B
A
(6)
(E)
A1
Thermal pad
1
(H1)
H1
C
D2
(6) D
2
D
D
L1 (2)
C
(6)
c
2xb
D1
2 x b2
Detail B
Detail B
A2
L
E1 (6)
C
(b, b2)
Base metal
A
c1 (4)
c
2x e
Plating
View A - A
e1
b1, b3
(4)
Section C - C and D - D
0.015 M B A M
Lead tip
Conforms to JEDEC® outline TO-220AC
SYMBOL
A
A1
A2
b
b1
b2
b3
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.25
4.65
1.14
1.40
2.50
2.92
0.69
1.01
0.38
0.97
1.20
1.73
1.14
1.73
0.36
0.61
0.36
0.56
14.85
15.35
8.38
9.02
INCHES
MIN.
MAX.
0.167
0.183
0.045
0.055
0.098
0.115
0.027
0.040
0.015
0.038
0.047
0.068
0.045
0.068
0.014
0.024
0.014
0.022
0.585
0.604
0.330
0.355
NOTES
4
4
4
3
SYMBOL
D2
E
E1
e
e1
H1
L
L1
ØP
Q
MILLIMETERS
MIN.
MAX.
11.68
13.30
10.11
10.51
6.86
8.89
2.41
2.67
4.88
5.28
6.09
6.48
13.52
14.02
3.32
3.82
3.54
3.91
2.60
3.00
INCHES
MIN.
MAX.
0.460
0.524
0.398
0.414
0.270
0.350
0.095
0.105
0.192
0.208
0.240
0.255
0.532
0.552
0.131
0.150
0.139
0.154
0.102
0.118
NOTES
6, 7
3, 6
6
6
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4) Dimension b1, b3, and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2, and E1
(7) Outline conforms to JEDEC® TO-220, except D2
Revision: 13-Jun-2019
Document Number: 96156
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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