TC78H630FNG,EL

TC78H630FNG TOSHIBA CDMOS Integrated Circuit Silicon Monolithic TC78H630FNG DC brushed motors driver IC The TC78H630FNG is H-bridge driver IC for DC motor which incorporates DMOS in output transistors. P-TSSOP16-0505-0.65-001 Weight: 0.06 g(Typ.) Features • Power supply voltage for motor : VM=18 V(Absolute Maximum Ratings) • Power supply voltage for control : VCC=6 V(Absolute Maximum Ratings) • Output current : IOUT=2.1 A(Absolute Maximum Ratings) • Output ON resistance : Ron(upper and lower sum)=0.4 Ω(Typ.) • Internal pull-down resistors on inputs : 200 kΩ(Typ.) • Built-in over current detection(ISD), thermal shutdwon(TSD) circuit, and under voltage lockout(UVLO) circuit. • Small package • Built-in cross conduction protection circuit ©2017 TOSHIBA Corporation : P-TSSOP16-0505-0.65-001 1 2017-04-10 TC78H630FNG Block Diagram VCC VM UVLO IN1 ISD IN2 /STBY O1 Motor Control Logic Predriver H-Bridge O2 TSD GND * Please note that in the block diagram, functional blocks or constants may be omitted or simplified for explanatory purposes. 2 2017-04-10 TC78H630FNG Pin Functions Pin No. Pin name Functional description Remarks 1 NC Not connected Please do not connect any pattern 2 NC Not connected Please do not connect any pattern 3 IN2 Control input 2 pin See the Input/Output functions table. 4 IN1 Control input 1 pin See the Input/Output functions table. 5 VCC Power supply pin for logic block VCC=2.7 to 5.5 V 6 /STBY Standby input See the Input/Output functions table. 7 NC Not connected Please do not connect any pattern 8 NC Not connected Please do not connect any pattern 9 VM Power supply pin for output VM= 2.5 to 15.0 V 10 GND Ground pin 11 O2 Output 2 pin Please connect with a motor. 12 O2 Output 2 pin Please connect with a motor. 13 O1 Output 1 pin Please connect with a motor. 14 O1 Output 1 pin Please connect with a motor. 15 GND Ground pin 16 GND Ground pin * Please connect the pin of the same name near the terminal. Equivalent Input/Output Circuit Input pin(IN1, IN2, /STBY) Output pin(O1, O2) VM 200 kΩ O1 O2 Please note that in the equivalent input/output circuit, functional blocks or constants may be omitted or simplified for explanatory purposes. 3 2017-04-10 TC78H630FNG Pin Assignment (Top view) NC 1 16 GND NC 2 15 GND IN2 3 14 O1 IN1 4 13 O1 VCC 5 12 O2 /STBY 6 11 O2 NC 7 10 GND NC 8 9 VM 4 2017-04-10 TC78H630FNG Absolute Maximum Ratings (Ta =25°C) Characteristics Symbol Rating Unit VCC 6 V VM 18 V Output current IOUT 2.1 A Input voltage VIN -0.2 to VCC+0.2 V Power dissipation PD 0.78 (Note1) W Operation temperature Topr -30 to 85 °C Storage temperature Tstg -55 to 150 °C Power supply voltage Note 1: When mounted on a single-side glass epoxy board (50 mm × 50 mm × 1.6 mm, Cu area: 40 %, Cu thick: 35μm) The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed. Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. Applications using the device should be designed so that no absolute maximum ratings will ever be exceeded under any operating condition. Operating Range (Ta = -30 to 85°C) Characteristics Symbol Conditions Min Typ. Max Unit Controlled power supply voltage VCC ― 2.7 3.3 5.5 V Motor power supply voltage VM ― 2.5 5 15 V Output current IOUT ― ― ― 1.6 A Input voltage VIN ― ― ― 5.5 V Control logic frequency fPWM IN1, IN2 Duty50% condition 1 ― 500 kHz Maximum current is limited by power dissipation. It depends on the ambient temperature, excitation mode, and heat radiation of the board. Determine a realistic maximum current by calculating the heat generated under the operating environment. 5 2017-04-10 TC78H630FNG Electrical Characteristics (Ta=25°C, VCC=3.3 V, VM=5 V, unless otherwise specified.) Characteristics Input voltage Hysteresis voltage Input current Symbol Min Typ. Max Unit 2.0 ― 5.5 V -0.2 ― 0.8 V IN1, IN2, /STBY ― 200 ― mV IIN(H) VIN = 3.3 V 11 16.5 22 μA IIN(L) VIN = 0.8 V 2 4 8 μA ICC1 Stop mode IN1 = IN2 = L ― 0.5 1 mA ICC2 Forward/Reverse mode IN1 = L , IN2 = H ― 0.5 1 mA ICC3 Standby mode /STBY=L ― 0 1 μA IM1 Stop mode IN1 = IN2 = L ― 0.25 1 mA IM2 Forward/Reverse mode IN1 = L , IN2 = H ― 0.25 1 mA IM3 Standby mode /STBY=L ― 0 1 μA IOUT = 0.2 A ― 0.4 0.8 IOUT = 0.6 A ― 0.4 0.8 ― 1 1.2 ― 1 1.2 ― ― 1 ― ― 1 VIN(H) VIN(L) VIN(HYS) Consumption current Drain-source ON-resistance (The sum of high RON(U+L) side & low side) Diode forward voltage Output leakage current VFU VFL Upper IOH Lower IOL Test Condition IN1, IN2, /STBY IOUT = 0.6 A VM=15 V 6 Ω V μA 2017-04-10 TC78H630FNG (Reference) PD – Ta characteristics When mounted on a single-side glass epoxy board (50 mm × 50 mm × 1.6 mm, Cu area: 40 %, Cu thick: 35μm) * The above- characteristics is a reference value and is not a guaranteed. 7 2017-04-10 TC78H630FNG Input/Output functions Input IN1 /STBY IN2 O1 Output Mode O2 H H H L L Short brake H L H L H Forward/Reverse H H L H L Reverse/Forward H L L OFF (High impedance) Stop L ― ― OFF (High impedance) Standby Output waveform timing chart (voltage waveform) Input (IN1, IN2) 50% 50% tpLH tpHL Output (O1, O2) 90% 90% 50% 50% 10% 10% tr tf AC Electrical characteristics (Reference) Symbol Typical value tpLH 500 tpHL 500 tr 20 tf 20 Unit ns * The above- characteristics is a reference value and is not a guaranteed. Timing charts may be simplified for explanatory purpose. 8 2017-04-10 TC78H630FNG Explanation of operation to H-Bridge To prevent shoot-through current caused by simultaneous conduction of upper and lower transistors in the output stage, a dead time is internally generated when switching the upper and lower transistors. Therefore, synchronous rectification for high efficiency in control can be achieved without an off-time that is generated via an external input. VM O1 VM O2 M O1 VM O2 M GND O1 GND IN1=H, IN2=L t1 GND IN1=H, IN2=L → IN1=H, IN2=H t2 = 300 ns (Typ.) IN1=H, IN2=H t3 VM O1 O2 M M VM O2 O1 M GND O2 GND IN1=H, IN2=H → IN1=H, IN2=L t4 = 300 ns (Typ.) IN1=H, IN2=L t5 VM Output Voltage (O1) t5 t1 t3 GND t4 t2 A dead time (t2, t4) is a reference value. 9 2017-04-10 TC78H630FNG TSD (Thermal shut down) When the junction temperature (Tj) exceeds 170°C (typ.), all outputs are turned off. In the operating state of TSD, IC becomes stop mode (It is the same as the state of IN1/IN2=L conditions). When the junction temperature (Tj) falls by 40°C(typ.) or more, it returns to the normal mode. * The operative temperature and release temperature of the TSD are a reference value, and are not a guaranteed performance. ISD (Over current detection) When any of current which flows in output transistors exceeds 3.4 A (typ.), all outputs are turned off. In the operating state of ISD, IC becomes stop mode (It is the same as the state of IN1/IN2=L conditions). However, masking time of 4 μs (typ.) should be added in order to avoid detection error by the noise. The output transistors are turned on when one of the following controls is performed. 1. Re-turn on power supply 2. After setting to standby mode (/STBY = L), it sets to operational mode again. * The actuating current and masking term of the ISD are a reference value, and are not a guaranteed value. 3.4 A (typ.) Output current masking time 4 μs(typ.) Output OFF UVLO (Under voltage lockout) When VCC falls to less than 2.2 V (typ.), all outputs are turned off. In the operating state of UVLO, IC becomes stop mode (It is the same as the state of IN1/IN2=L conditions). By raising VCC more than 2.3 V (typ.), it returns to the normal mode. When VM falls to less than 2.0 V (typ.), all outputs are turned off. In the operating state of UVLO, IC becomes stop mode (It is the same as the state of IN1/IN2=L conditions). By raising VM more than 2.1 V (typ.), it returns to the normal mode. * The operating voltage and release voltage of the UVLO are a reference value, and are not a guaranteed value. 10 2017-04-10 TC78H630FNG Application circuit 0.1 μF VCC /STBY Controller I/O IN1 IN2 GND VM TC78H630FNG VCC GND O1 O2 10 μF + - VM DC brush motor GND Note 1: A power supply capacitor should be connected as close as possible to the IC. Note 2: Please set “IN1 and IN2” or “/STBY” as “L” at the time of power supply ON and OFF. If power supply ON and OFF is carried out in the state of H setup, unexpected current may be flown in the output pin depending on the situation. Caution for using Utmost care is necessary in the design of the output, VCC, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. Especially, power supply pins (VCC, VM) and output pins (O1, O2) might destroy the IC and the peripheral parts, cause smoke and ignition, and also do injury when they short-circuit an adjacent pin and other pins. The IC may be destroyed when mounted in the wrong orientation. Thus, please mount it with great care. Please use the power supply fuse. 11 2017-04-10 TC78H630FNG Package Dimensions Weight: 0.06 g (typ.) 12 2017-04-10 TC78H630FNG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 13 2017-04-10 TC78H630FNG Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 14 2017-04-10 TC78H630FNG RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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