TLP2358
Photocouplers
GaAℓAs Infrared LED & Photo IC
TLP2358
1. Applications
•
Intelligent Power Module Signal Isolation
•
Programmable Logic Controllers (PLCs)
•
High-Speed Digital Interfacing for Instrumentation and Control Devices
2. General
The Toshiba TLP2358 consists of a GaAℓAs light-emitting diode coupled with a high-gain, high-speed photo
detector. It is housed in the SO6 package. The detector has a totem-pole output stage with current sourcing and
sinking capabilities. The TLP2358 has an internal Faraday shield that provides a guaranteed common-mode
transient immunity of ±20 kV/µs.The TLP2358 has an inverter output. A buffer output version, the TLP2355, is
also available.
3. Features
(1)
Inverter logic type (totem pole output)
(2)
Package: SO6
(3)
Supply voltage: 3 to 20 V
(4)
Threshold input current, high to low: IFHL = 1.6 mA (max)
(5)
Propagation delay time: 250 ns (max)
(6)
Pulse width distortion: 70 ns (max)
(7)
Common-mode transient immunity: ±20 kV/µs (min)
(8)
Operating temperature: -40 to 125
(9)
Isolation voltage: 3750 Vrms (min)
(10) Safety standards
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)
CQC-approved: GB4943.1, GB8898 Thailand Factory
Note 1: When a VDE approved type is needed, please designate the Option (V4)
(V4).
Start of commercial production
©2016 Toshiba Corporation
1
2011-09
2016-01-19
Rev.4.0
TLP2358
4. Packaging and Pin Configuration
1: Anode
3: Cathode
4: GND
5: VO (output)
6: VCC
11-4L1S
5. Internal Circuit (Note)
Note:
A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4.
6. Principle of Operation
6.1. Truth Table
Input
LED
Output
H
ON
L
L
OFF
H
6.2. Mechanical Parameters
Characteristics
Min
Unit
Creepage distances
5.0
mm
Clearance
5.0
Internal isolation thickness
0.4
©2016 Toshiba Corporation
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2016-01-19
Rev.4.0
TLP2358
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
LED
Symbol
Input forward current
Input forward current derating
(Ta ≥ 116 )
Unit
20
mA
-0.6
mA/
1
A
∆IFPT/∆Ta
-25
mA/
PD
40
mW
∆PD/∆Ta
-1.0
mW/
VR
5
V
mA
∆IF/∆Ta
IFPT
(Ta ≥ 110 )
Input power dissipation
Input power dissipation
derating
Rating
IF
Peak transient input forward
current
Peak transient input forward
current derating
Note
(Ta ≥ 110 )
Input reverse voltage
(Note 1)
Detector Output current
(Ta ≤ 25 )
IO
25/-15
Output current
(Ta = 125 )
IO
5/-5
VO
-0.5 to 20
V
Output voltage
Output power dissipation
(Ta ≤ 25 )
PO
75
mW
Output power dissipation
derating
(Ta ≥ 25 )
∆PO/∆Ta
-0.6
mW/
Supply voltage
Common Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
VCC
-0.5 to 20
V
Topr
-40 to 125
Tstg
-55 to 125
(10 s)
Tsol
AC, 60 s, R.H. ≤ 60 %
BVS
260
(Note 2)
3750
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 1 µs, 300 pps
Note 2: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4, 5 and 6 are
shorted together.
8. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Input on-state current
IF(ON)
(Note 1)
2
10
mA
Input off-state voltage
VF(OFF)
0
0.8
V
Supply voltage
VCC
(Note 2)
3
20
Operating temperature
Topr
(Note 2)
-40
125
Note:
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1 :The rise and fall times of the input on-current should be less than 0.5 µs.
Note 2: Denotes the operating range, not the recommended operating condition.
©2016 Toshiba Corporation
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2016-01-19
Rev.4.0
TLP2358
9. Electrical Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125 , VCC = 3 to 20 V)
Characteristics
Input forward voltage
Input forward voltage
temperature coefficient
Symbol
Note
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
VF
IF = 10 mA, Ta = 25
1.45
1.55
1.70
V
∆VF/∆Ta
IF = 10 mA
-2.0
mV/
Input reverse current
IR
VR = 5 V, Ta = 25
10
µA
Input capacitance
Ct
V = 0 V, f = 1 MHz
60
pF
Low-level output voltage
VOL
Fig.
12.1.1
IO = 3.5 mA, IF = 5 mA
0.2
0.6
V
High-level output voltage
VOH
Fig.
12.1.2
VCC = 3 V, IO = -2.6 mA,
VF = 0.8 V
1.78
2.1
VCC = 20 V, IO = -2.6 mA,
VF = 0.8 V
17.4
19.1
(Note 1)
Low-level supply current
ICCL
Fig.
12.1.3
VCC = 3.6 V, IF = 5 mA
1.4
3.0
VCC = 20 V, IF = 5 mA
1.5
3.0
High-level supply current
ICCH
Fig.
12.1.4
VCC = 3.6 V, VF = 0 V
1.9
3.0
VCC = 20 V, VF = 0 V
2.0
3.0
Fig.
12.1.5
VCC = VO = 3.6 V, IF = 5 mA,
VO = GND
15
100
VCC = VO = 20 V, IF = 5 mA,
VO = GND
20
120
VCC = 3.6 V, VF = 0 V
-14
-5
VCC = 20 V, VF = 0 V
-24
-10
Low-level short-circuit output
current
High-level short-circuit output
current
IOSL
IOSH
(Note 2)
(Note 2)
Fig.
12.1.6
mA
Threshold input current (H/L)
IFHL
IO = 3.5 mA, VO < 0.4 V
0.5
1.6
Threshold input voltage (L/H)
VFLH
IO = -2.6 mA, VO > 2.4 V
0.8
V
Input current hysteresis
IHYS
VCC = 5 V
0.05
mA
Min
Typ.
Max
Unit
0.8
pF
1 × 1012
1014
Ω
Vrms
Note: All typical values are at Ta = 25 .
Note 1: VOH = VCC - VO (V)
Note 2: Duration of output short circuit time should not exceed 10 ms.
10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Conditions
Total capacitance (input to
output)
CS
(Note 1) VS = 0 V, f = 1 MHz
Isolation resistance
RS
(Note 1) VS = 500 V, R.H. ≤ 60 %
Isolation voltage
BVS
(Note 1) AC, 60 s
3750
AC, 1 s in oil
10000
DC, 60 s in oil
10000
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4, 5 and 6 are
shorted together.
©2016 Toshiba Corporation
4
2016-01-19
Rev.4.0
TLP2358
11. Switching Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125 , VCC = 3 to 20 V)
Characteristics
Propagation delay time (L/H)
Propagation delay time (H/L)
Pulse width distortion
Propagation delay skew
(device to device)
Symbol
Note
tpLH
tpHL
Test Circuit
Test Condition
Fig. 12.1.7, IF = 3 → 0 mA
Fig. 12.1.8
IF = 0 → 3 mA
|tpHL-tpLH|
IF = 3 mA
tpsk
Min
Typ.
Max
Unit
100
250
ns
120
250
20
70
-130
130
Rise time
tr
IF = 3 → 0 mA, VCC = 5 V
15
75
Fall time
tf
IF = 0 → 3 mA, VCC = 5 V
12
75
VCM = 1000 Vp-p, IF = 0 mA,
VCC = 20 V, Ta = 25
±20
±25
VCM = 1000 Vp-p, IF = 5 mA,
VCC = 20 V, Ta = 25
±20
±25
Common-mode transient
immunity at output high
CMH
Common-mode transient
immunity at output low
CML
Note:
Fig. 12.1.9
kV/µs
All typical values are at Ta = 25 .
©2016 Toshiba Corporation
5
2016-01-19
Rev.4.0
TLP2358
12. Test Circuits and Characteristics Curves
12.1. Test Circuits
Fig. 12.1.1 VOL Test Circuit
Fig. 12.1.2 VOH Test Circuit
Fig. 12.1.3 ICCL Test Circuit
Fig. 12.1.4 ICCH Test Circuit
Fig. 12.1.5 IOSL Test Circuit
Fig. 12.1.6 IOSH Test Circuit
Fig. 12.1.7 Switching Time Test Circuit and waveform
©2016 Toshiba Corporation
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2016-01-19
Rev.4.0
TLP2358
Fig. 12.1.8 Switching Time Test Circuit and waveform
Fig. 12.1.9 Common-Mode Transient Immunity Test Circuit and waveform
©2016 Toshiba Corporation
7
2016-01-19
Rev.4.0
TLP2358
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 13.1.1 An example of a temperature profile when lead(Pb)-free solder is used
•
When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2. Precautions for General Storage
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
•
Follow the precautions printed on the packing label of the device for transportation and storage.
•
Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
•
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
When restoring devices after removal from their packing, use anti-static containers.
•
Do not allow loads to be applied directly to devices while they are in storage.
•
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
©2016 Toshiba Corporation
8
2016-01-19
Rev.4.0
TLP2358
14. Land Pattern Dimensions for Reference Only
Unit: mm
15. Marking
Marking
©2016 Toshiba Corporation
9
2016-01-19
Rev.4.0
TLP2358
Package Dimensions
Unit: mm
Weight: 0.08 g (typ.)
Package Name(s)
TOSHIBA: 11-4L1S
©2016 Toshiba Corporation
10
2016-01-19
Rev.4.0
TLP2358
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
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• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
©2016 Toshiba Corporation
11
2016-01-19
Rev.4.0