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TMC1320-LA

TMC1320-LA

  • 厂商:

    TRINAMIC

  • 封装:

    PQFN8

  • 描述:

    N沟道+P沟道 VDS1=30V ID1=7.3A VDS2=-30V ID2=-5.3A VGS=±20V P=2.5W 2通路

  • 数据手册
  • 价格&库存
TMC1320-LA 数据手册
POWER MOSFETs FOR STEPPER MOTORS INTEGRATED CIRCUITS TMC1320-LA DATASHEET Dual N & P-Channel 30V Power MOSFET with low on-resistance and fast switching performance. High energy efficiency and good thermal performance. APPLICATIONS TMC1320 MOSFETs TRINAMIC 2-phase motor drivers: fit best with bipolar stepper TMC262: up to 3.5A RMS motor current with 4xTMC1320-LA TMC248: up to 3A RMS motor current with 4xTMC1320 TMC249: up to 3A RMS motor current with 4xTMC1320-LA PRODUCT SUMMARY BVDSS RDS(ON) ID FEATURES N-CH P-CH 30V 30mΩ 7.3A -30V 60mΩ -5.3A AND DESCRIPTION The advanced TMC1320-LA Power MOSFET provides the designer with the best combination of fast switching, low onresistance and cost-effectiveness. The highly energy efficient TMC1320 is intended for power conversion and power management applications that require high efficiency and power density. The PQFN 3x3 package has a backside heat sink. It is compatible with other DFN3 packages offering attractive thermal and electrical performance combined with a very small footprint. BENEFITS N & P-Channel MOSFET Half Bridge Device Simple Drive Requirement Good Thermal Performance Fast Switching Performance for quick motor reaction PQFN Package, 3x3mm; similar to DFN3x3 EP RoHS Compliant and Halogen-Free TMC262 WITH 4X TMC1320-LA MOSFETS TMC262 P D S N +VM S G D D N S P TMC1320 Motor coil B Description N and P-channel enhancement mode power MOSFET TRINAMIC Motion Control GmbH & Co. KG Hamburg, Germany TMC1320 P G Motor coil A Order code TMC1320-LA G D RSENSE G S HB1 RSENSE D HB2 TMC1320 S N +VM D BMB1 G S N G BMB2 D P S 10R G D LB2 TMC1320 LB1 SRB SRA LA1 LA2 BMA2 BMA1 HA2 HA1 10R G S Size 3.1 x 3.1 mm2 TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) Table of Contents TABLE OF CONTENTS ........................................................................................................................................................... 2 1 PIN ASSIGNMENTS ...................................................................................................................................................... 3 2 ABSOLUTE MAXIMUM RATINGS .............................................................................................................................. 3 3 THERMAL DATA ............................................................................................................................................................ 3 4 ELECTRICAL CHARACTERISTICS .............................................................................................................................. 4 4.1 N-CH @TJ=25°C (UNLESS OTHERWISE SPECIFIED) ................................................................................................... 4 Source-Drain Diode ....................................................................................................................................... 4 4.2 P-CH @TJ=25°C (UNLESS OTHERWISE SPECIFIED ) ................................................................................................... 4 4.2.1 Source-Drain Diode ....................................................................................................................................... 5 4.1.1 5 N-CHANNEL DIAGRAMS ............................................................................................................................................. 6 N-CHANNEL DIAGRAMS ...................................................................................................................................................... 7 6 P-CHANNEL DIAGRAMS .............................................................................................................................................. 8 P-CHANNEL DIAGRAMS ....................................................................................................................................................... 9 7 PACKAGE MECHANICAL DATA ............................................................................................................................... 10 7.1 7.2 DIMENSIONAL DRAWINGS ................................................................................................. 10 PACKAGE MARKING INFORMATION AND PACKAGE CODE .......................................................................................... 10 8 DISCLAIMER ................................................................................................................................................................ 11 9 ESD SENSITIVE DEVICE ........................................................................................................................................... 11 10 TABLE OF FIGURES .................................................................................................................................................... 12 11 REVISION HISTORY .................................................................................................................................................. 12 www.trinamic.com 2 TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) 3 1 Pin Assignments S1 D2 D1 D1/D2 G1 G2 G1 S2 G2 S1 S2 PQFN package 3x3mm Figure 1.1 TMC1320-LA pin assignments 2 Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances. Operating the circuit at or near more than one maximum rating at a time for extended periods shall be avoided by application design. Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current*2 Continuous Drain Current*2 Pulsed Drain Current*1 Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range Symbol VDS VGS ID@TA = 25°C ID@TA = 70°C IDM PD@TA = 25°C TSTG TJ N-channel 30 ±20 7.3 5.8 28 P-channel -30 ±20 -5.3 -4.2 -20 2.5 0.02 -55 to 150 -55 to 150 Unit V V A A A W W/°C °C °C *1 Pulse width is limited by maximum junction temperature. *2 Surface mounted on 1 in2 copper pad of FR4 board, t ≤ 10sec; 90˚C/W at steady state. 3 Thermal Data Parameter Max. Thermal Resistance, Junction-case Max. Thermal Resistance, Junction-ambient* Symbol Rthj-c Rthj-a Value 10 50 * Surface mounted on 1 in2 copper pad of FR4 board, t ≤ 10sec; 90˚C/W at steady state. www.trinamic.com Unit °C/W °C/W TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) 4 4 Electrical Characteristics 4.1 N-CH @Tj=25°C (unless otherwise specified) Parameter Drain-Source Breakdown Voltage Symbol BVDSS Static Drain-Source On-Resistance* RDS(ON) Gate Threshold Voltage Forward Transconductance Drain-Source Leakage Current Gate-Source Leakage Total Gate Charge* Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance * Pulse width ≤ 300µs, duty cycle ≤ VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss 2% Test Conditions VGS=0V, ID=250µA VGS=10V, ID=4A VGS=4.5V, ID=3A VDS= VGS, ID=250µA VDS= 10V, ID=4A VDS= 24V, VGS=0V VDS= 0V, VGS=±20V ID=4A VDS=15V VGS=4.5V VDS=15V ID=1A RG=3.3Ω VGS=10V VGS=0V VDS=25V f=1.0MHz Min 30 Test Conditions VGS=0V, IS=1.2A VGS=0V, IS=4A dl/dt=100A/µs Min Typ Max 30 48 3 1 8.5 4.5 1 2.5 8 9 16 3 250 55 50 1 ±100 7.2 400 Unit V mΩ mΩ V S mA mA nC nC nC ns ns ns ns pF pF pF 4.1.1 Source-Drain Diode Parameter Forward On Voltage* Reverse Recovery Time* Reverse Recovery Charge * Pulse width ≤ 300µs, duty cycle ≤ Symbol VSD trr Qrr 2% Typ Max 1.2 Unit V ns nC Max Unit V mΩ mΩ V S mA mA nC nC nC ns ns ns ns pF pF pF 15 7 4.2 P-CH @Tj=25°C (unless otherwise specified) Parameter Drain-Source Breakdown Voltage Symbol BVDSS Static Drain-Source On-Resistance* RDS(ON) Gate Threshold Voltage Forward Transconductance Drain-Source Leakage Current Gate-Source Leakage Total Gate Charge* Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time* Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance * Pulse width ≤ 300µs, duty cycle ≤ www.trinamic.com VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss 2% Test Conditions VGS=0V, ID=-250µA VGS=-10V, ID=-4A VGS=-4.5V, ID=-3A VDS= VGS, ID=-250µA VDS= -10V, ID=-4A VDS= -24V, VGS=0V VDS= 0V, VGS=±20V ID=-4A VDS=-15V VGS=-4.5V VDS=-15V ID=-1A RG=3.3Ω VGS=-10V VGS=0V VDS=-25V f=1.0MHz Min -30 Typ 60 80 -3 -1 9 7 1.5 3.5 10 11 22 9 570 80 75 -1 ±100 11.2 910 TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) 5 4.2.1 Source-Drain Diode Parameter Forward On Voltage* Reverse Recovery Time* Reverse Recovery Charge * Pulse width ≤ 300µs, duty cycle ≤ www.trinamic.com Symbol VSD trr Qrr 2% Test Conditions VGS=0V, IS=-1.2A VGS=0V, IS=-4A dl/dt=-100A/µs Min Typ 19 13 Max -1.2 Unit V ns nC TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) 6 5 N-Channel Diagrams Figure 5.1 Typical output characteristics Figure 5.2 Typical output characteristics Figure 5.3 On-resistance v.s. gate voltage Figure 5.4 Normalized on-resistance v.s. junction temperature Figure 5.5 Forward characteristic of reverse diode www.trinamic.com Figure 5.6 Gate threshold voltage v.s. junction temperature TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) 7 N-Channel Diagrams Figure 5.7 Gate charge characteristics Figure 5.8 Typical capacitance characteristics Figure 5.9 Maximum safe operating area Figure 5.10 impedance Figure 5.11 Switching time waveform www.trinamic.com Effective transient Figure 5.12 Gate charge waveform thermal TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) 8 6 P-Channel Diagrams Figure 6.1 Typical output characteristics Figure 6.2 Typical output characteristics Figure 6.3 On-resistance v.s. gate voltage Figure 6.4 Normalized on-resistance v.s. junction temperature Figure 6.5 Forward characteristic of reverse diode Figure 6.6 Gate Threshold voltage v.s. junction temperature www.trinamic.com TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) 9 P-Channel Diagrams Figure 6.7 Gate charge characteristics Figure 6.8 Typical capacitance characteristics Figure 6.9 Maximum safe operating area Figure 6.10 Effective transient thermal impedance Figure 6.11 Switching time waveform Figure 6.12 Gate charge waveform www.trinamic.com TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) 7 10 Package Mechanical Data 7.1 Dimensional Drawings e c1 Note: All dimensions are in millimeters. Drawings are not to scale. The dimensions do not include mold protrusions. b2 1 C c2 D c3 E d1 B A BOTTOM VIEW Figure 7.1 Dimensional drawings Symbols A B e b2 C c1 c2 C3 D d1 E Min Nom Max 2.90 2.20 0.60 0.20 2.90 0.10 1.20 0.10 0.65 0.00 0.10 3.10 2.45 0.65 0.30 3.10 0.30 1.70 0.38 0.80 0.10 0.18 3.40 2.80 0.70 0.40 3.40 0.50 2.20 0.65 1.05 0.20 0.25 7.2 Package Marking Information and Package Code Part number TMC1320 YWW SSS Date code Y: last digit of year WW: week SSS: sequence Figure 7.2 Package marking information Device TMC1320 Package PQFN 3 x3, I-type www.trinamic.com Temperature range -55° to +150°C Code/ Marking TMC1320-LA TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) 11 8 Disclaimer TRINAMIC Motion Control GmbH & Co. KG does not authorize or warrant any of its products for use in life support systems, without the specific written consent of TRINAMIC Motion Control GmbH & Co. KG. Life support systems are equipment intended to support or sustain life, and whose failure to perform, when properly used in accordance with instructions provided, can be reasonably expected to result in personal injury or death. Information given in this data sheet is believed to be accurate and reliable. However no responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. Specifications are subject to change without notice. All trademarks used are property of their respective owners. 9 ESD Sensitive Device The TMC1320-LA is an ESD sensitive CMOS device sensitive to electrostatic discharge. Take special care to use adequate grounding of personnel and machines in manual handling. After soldering the devices to the board, ESD requirements are more relaxed. Failure to do so can result in defect or decreased reliability. www.trinamic.com TMC1320-LA DATASHEET (Rev. 1.01 / 2014-MAY-12) 12 10 Table of Figures Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure 1.1 TMC1320 pin assignments .............................................................................................................................. 3 5.1 Typical output characteristics ........................................................................................................................ 6 5.2 Typical output characteristics ........................................................................................................................ 6 5.3 On-resistance v.s. gate voltage ..................................................................................................................... 6 5.4 Normalized on-resistance v.s. junction temperature ............................................................................. 6 5.5 Forward characteristic of reverse diode .................................................................................................... 6 5.6 Gate threshold voltage v.s. junction temperature .................................................................................. 6 5.7 Gate charge characteristics ............................................................................................................................ 7 5.8 Typical capacitance characteristics ............................................................................................................... 7 5.9 Maximum safe operating area ...................................................................................................................... 7 5.10 Effective transient thermal impedance .................................................................................................... 7 5.11 Switching time waveform ........................................................................................................................... 7 5.12 Gate charge waveform .................................................................................................................................. 7 6.1 Typical output characteristics ........................................................................................................................ 8 6.2 Typical output characteristics ........................................................................................................................ 8 6.3 On-resistance v.s. gate voltage ..................................................................................................................... 8 6.4 Normalized on-resistance v.s. junction temperature ............................................................................. 8 6.5 Forward characteristic of reverse diode .................................................................................................... 8 6.6 Gate Threshold voltage v.s. junction temperature ................................................................................. 8 6.7 Gate charge characteristics ............................................................................................................................ 9 6.8 Typical capacitance characteristics ............................................................................................................... 9 6.9 Maximum safe operating area ...................................................................................................................... 9 6.10 Effective transient thermal impedance .................................................................................................... 9 6.11 Switching time waveform ........................................................................................................................... 9 6.12 Gate charge waveform .................................................................................................................................. 9 7.1 Dimensional drawings .................................................................................................................................. 10 7.2 Package marking information ..................................................................................................................... 10 11 Revision History Version Date Author Description SD – Sonja Dwersteg 0.92 1.00 2014-MAR-13 2014-MAR-18 SD SD 1.01 2014-MAY-12 SD www.trinamic.com Initial version RMS current corrected. Front picture added. Total gate charge corrected. RMS motor current values in combination with TMC262, TMC248, and TMC249 updated.
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