CHX2090-QDG

CHX2090-QDG RoHS COMPLIANT 12-24GHz Frequency Multiplier GaAs Monolithic Microwave IC in SMD leadless package Description The CHX2090-QDG is a cascadable frequency doubler monolithic circuit, which integrate an output buffer amplifier that produces a constant output power over a range of input powers. It is designed for a wide range of applications, from military to commercial communication systems. The circuit is manufactured with a PM-HEMT process, 0.25µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. typical measurement It is supplied in RoHS compliant SMD package. Main Features ■ Broadband performances: 11-13GHz ■ 13dBm output power for +14dBm input power ■ DC bias : Vd=3.5Volt@Id=60mA ■ 24L-QFN4x4 SMD package Main Characteristics Tamb. = 25° C Symbol Fin Fout Pin Pout Parameter Input frequency range Output frequency range Input power Output power for +14dBm input power Min 11 22 Typ Max 13 26 Unit GHz GHz dBm dBm 14 13 ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions! Ref. : DSCHX2090QDG6332 - 28 Nov 06 1/10 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHX2090-QDG Electrical Characteristics 12-24GHz Frequency Multiplier Tamb = +25° Vd = 3.5V, Vg1 = -0.9V, Vg2 tuned for Id=65mA. C, Symbol Fin Fout Pin Pout 2Fin Parameter Input frequency range Output frequency range Input power 2Fin Output power for (11 < Fin < 12GHz) for Fin = 13GHz Min 11 22 Typ Max 13 26 Unit GHz GHz dBm dBm dBm dBm dBm dBm 14 12 9 -10 0 -15 2.0:1 2.5:1 3.5 65 75 Is/Fin Fin level at the output for (11 < Fin < 12) for Fin = 13GHz Is/3Fin VSWRin 3Fin level at the output Input VSWR VSWRout Output VSWR Vd Id Drain voltage Bias current V mA Absolute Maximum Ratings Tamb. = 25° (1) C Symbol Vd Id Vg Tj Ta Tstg Drain bias current Gate bias voltage Parameter Drain bias voltage Values 5V 120 -2 to +0.4 175 -40 to +85 -55 to +155 Unit V mA V ° C ° C ° C Junction temperature (2) Operating temperature range Storage temperature range (1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Thermal Resistance channel to ground paddle =249° C/W for Tamb. = +85° with 3.5V & 65mA. C Ref. : DSCHX2090QDG6332 - 28 Nov 06 2/10 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 12-24GHz Multiplier Typical Measured performances CHX2090-QDG Measurements in the connector access planes, using the proposed land pattern & board 96270. Bias conditions : Vd = 3,5v, Vg1 = -0.9v, Vg2 tuned for Id# 65mA. Pout (2Fin) & Pout (Fin) vs Fin for Pin=14 dBm Pout 2Fin Pout Fin Pout (2Fin) & Pout (3Fin) vs Fin for Pin=14 dBm Pout 2Fin Pout 3Fin Ref. : DSCHX2090QDG6332 - 28 Nov 06 3/10 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHX2090-QDG 12-24GHz Frequency Multiplier Pout (2Fin) & Pout (Fin) vs Vg1 for Fin = 12 GHz, Pin=14dBm & Vg2= -0,7V Pout 2Fin Pout Fin Pout (2Fin) & Pout (Fin) vs Vg2 for Fin = 12 GHz, Pin=14dBm & Vg1= -0,9V Pout 2Fin Pout Fin Ref. : DSCHX2090QDG6332 - 28 Nov 06 4/10 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 12-24GHz Multiplier CHX2090-QDG CHX2090-QDG Drain current versus Vg2, for Fin=12GHz, Pin=14dBm, Vd=3.5V and Vg1=-0.9V 75 70 65 Id (mA) 60 55 50 45 40 -0.8 -0.7 -0.6 -0.5 Vg2 (Volt) -0.4 -0.3 -0.2 Ref. : DSCHX2090QDG6332 - 28 Nov 06 5/10 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHX2090-QDG Package outline: 12-24GHz Frequency Multiplier Matt tin, Lead Free Units From the standard Pin 25 (paddle) : GND (Green) mm JEDEC MO-220 1- NC 2- NC 3- GND 4- RF IN 5- GND 6- NC 7- NC 8- NC 9- NC 10- NC 11- NC 12- NC 13- NC 14- GND 15- RF OUT 16- GND 17- NC 18- NC 19- NC 20- Vd 21- NC 22- Vg2 23- Vg1 24- NC Ref. : DSCHX2090QDG6332 - 28 Nov 06 6/10 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 12-24GHz Multiplier CHX2090-QDG Application note The design of the motherboard has a strong impact on the over all performance since the transition from the motherboard to the package is comparably large. In case of the SMD type packages of United Monolithic Semiconductors the motherboard should be designed according to the information given in the following to achieve good performance. Other configurations are also possible but can lead to different results. If you need advise please contact United Monolithic Semiconductors for further information. SMD type packages of UMS should allow design and fabrication of micro- and mm-wave modules at low cost. Therefore, a suitable motherboard environment has been chosen. All tests and verifications have been performed on Rogers RO4003. This material exhibits a permittivity of 3.38 and has been used with a thickness of 200µm [8 mils] and a 1/2oz or less copper cladding. The corresponding 50Ohm transmission line has a strip width of about 460µm [approx. 18 mils]. The contact areas on the motherboard for the package connections should be designed according to the footprint given above. The proper via structure under the ground pad is very important in order to achieve a good RF and lifetime performance. All tests have been done by using a grid of plenty plated through vias with a diameter of less than 300µm [12 mils] and a spacing of less than 700µm [28 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias closest to the RF ports should be located near the edge of the pad to allow a good RF ground connection. Since the vias are important for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a grid of via’s is recommended. For the mounting process the SMD type package can be handled as a standard surface mount component. The use of either solder or conductive epoxy is possible. The solder thickness after reflow should be typical 50µm [2 mils] and the lateral alignment between the package and the motherboard should be within 50µm [2 mils]. Caution should be taken to obtain a good and reliable contact over the whole pad areas. Voids or other improper connections, in particular, between the ground pads of motherboard and package will lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the product. Ref. : DSCHX2090QDG6332 - 28 Nov 06 7/10 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHX2090-QDG 12-24GHz Frequency Multiplier (For production, design must be adapted with regard to PCB tolerances and assembly process) Basic footprint for a 24L-QFN4x4 (all units mm) (Please, refer to the UMS proposed footprint for optimum operation in the following “Proposed Assembly board” section) The RF ports are DC blocked on chip. The DC connection (Vd) does not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling on the PC board, as close as possible to the package. SMD mounting procedure The SMD leadless package has been designed for high volume surface mount PCB assembly process. The dimensions and footprint required for the PCB (motherboard) are given in the drawings above. For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Ref. : DSCHX2090QDG6332 - 28 Nov 06 8/10 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 12-24GHz Multiplier CHX2090-QDG Proposed Assembly board “96270” for the 24L-QFN4x4 products characterization. Compatible with the proposed footprint. Based on typically Ro4003 / 8mils or equivalent. Using a microstrip to coplanar transition to access the package. Recommended for the implementation of this product on a module board. - Ref. : DSCHX2090QDG6332 - 28 Nov 06 9/10 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHX2090-QDG 12-24GHz Frequency Multiplier Ordering Information QFN 4x4 RoHS compliant package: CHX2090-QDG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHX2090QDG6332 - 28 Nov 06 10/10 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09