MQPI-18LP-01

PRELIMINARY ® MQPI-18 Typical Applications • Military mobile and fixed communications • Radar and Targeting • Missile and Launch systems • Airborne flight management systems 28 Volt Input, 7 Amp MIL COTS EMI Filter for V•I Chips Description The MQPI-18 attenuates conducted common-mode (CM) and differential mode (DM) noise for 28 V input MIL PRMs to comply with MIL-461E EMI requirements for conducted noise measurements. The filter operates within the full input operating range of a 28 V MIL PRM and supports 7 A loads up to 60°C without derating. Assembly process compatibility • Intended for Pb solder SMT assembly • Compatible with typical aqueous cleaning processes (open-frame only) • Compatible with most conformal coating compounds [after reflow] (open frame only). Features • 28 V input, compatible with MIL PRM • MIL-STD-461E compliant* CE101, CE102, CS101, CS114, C5115, and CS116 • 100 Vdc surge, 100 ms • 1,500 Vdc hi-pot hold off to shield plane • 7 A rating • Efficiency >99% • Low profile LGA package • -55°C to 100°C operation (PCB Temp.) • Pb solder construction *When combined with MP028 PRMs, and MV036 VTMs 12.9 x 25.3 x 5 mm Weight = 2.4 grams Cy1 Bus+ Cbus Bus+ Out+ Vi+ Cin Vo+ Vi+ Vo+ Load MQPI-18 QPI-12 Bus– Out– Shield PRM Vi– Vo– VTM Vi– Vo– Bus– Shield Cy2 Cin: Recommended input capacitance per V•I Chip requirement. Cy1 & Cy2: 4.7 nF, or recommended per V•I Chip requirement. Cbus: 47 uF, 50 V electrolytic in parallel with 2.2 µF, 100 V ceramic. Figure 1 – MQPI-18 Typical application schematic Figure 2 – MIL-STD-461, CE102 compliance with MQPI-18 using 28 V input MIL PRM and 12 V output MIL VTM Picor Corporation • www.picorpower.com MQPI-18 Data Sheet Rev. 1.0 Page 1 of 2 PRELIMINARY Absolute Maximum Ratings – Exceeding these parameters may result in permanent damage to the product. Pins Bus+ to Bus– Bus+ to Bus– BUS+ / BUS– to shield plane QPI+ to QPI– Package Package Package Package Package Package All Pins Parameter Input voltage Input voltage BUS inputs to shield hipot Input to output current Power dissipation Operating temperature Thermal resistance Thermal resistance Storage temperature Peak reflow temperature ESD 20 s exposure HBM -2 Continuous @ 25°C @ 25°C PCB to filter interface Free air PCB (1) Notes Continuous 100 ms transient Min -80 -100 -1500 Max 80 100 1500 7 1.50 Units Vdc Vdc Vdc Adc W °C °C/W °C/W °C °C kV -55 100 75 30 -65 125 225 +2 Note 1: PCB layout guidelines will be available in final version of this data sheet. Electrical Characteristics – Parameter limits apply over the operating PCB temperature range unless otherwise noted Parameter Bus+ to Bus- input range Bus+ to Out+ voltage drop Bus- to Out- voltage drop Common mode attenuation Differential mode attenuation Input bias current at 80 V Note 2: Derating curve TBD. Notes Measured at 7 A Measured at 7 A (2) (2) Min Typ 110 110 45 75 Max 80 Units Vdc mVdc mVdc dB dB Measured at 7 A VBUS = 28 V Frequency = 1.0 MHz@25ºC VBUS = 28 V Frequency = 1.0 MHz@25ºC Input current from Bus+ to Bus- 10 µA Pad Description Pin Number 8, 9 1, 10 6, 7 4, 5 2, 3 Name Bus + Bus – Out + Out – Shield Description Positive bus potential Negative bus potential Positive input to the converter Negative input to the converter Shield connects to system chassis or safety ground. Ordering Information Part Number MQPI-18LP MQPI-18LP-01 Description LGA, Pb solder, lidded package LGA, Pb solder, open-frame package Package Outline Drawing (lidded version) Top View 0.232" [5.89mm] 0.057" [1.45mm] 0.996"[25.28mm] 6 7 8 9 Bottom View 0.400" [10.16mm] 0.232" [5.89mm] 0.057" [1.45mm] 0.096" [2.44mm] 0.0900"[2.286mm] 0.508"[12.90mm] 5 4 3 2 1 10 0.200" [5.08mm] 0.132" [3.35mm] 0.1100"[2.794mm] Pad Detail: 10 Places (Dimensions indicate finished soldermask pad openings) Pin 1 0.196"[4.98mm] 0.15 [0.006] 0.200" [5.08mm] 0.200" [5.08mm] 0.200" [5.08mm] 0.060" [1.52mm] 0.190"[4.826mm] NOTES: 1. Demensions are all in inches [MM]. 2. Top & Bottom Package Planarity:0.15 [0.006] Picor Corporation • www.picorpower.com MQPI-18 Data Sheet Rev. 1.0 11-08 Page 2 of 2