BAS86

BAS86 Vishay Semiconductors Small Signal Schottky Diode Features • For general purpose applications • This diode features low turn-on voltage. The devices are protected by a PN junction e2 guard ring against excessive voltage, such as electrostatic discharges. • Metal-on-silicon Schottky barrier device which is protected by a PN junction guard ring. • The low forward voltage drop and fast switching make it ideal for protection of MOS devices, steering, biasing and coupling diodes for fast switching and low logic level applications • This diode is also available in a DO35 case with type designation BAT86. • Lead (Pb)-free component • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC 94 9371 Mechanical Data Case: MiniMELF Glass case SOD80 Weight: approx. 31 mg Packaging Codes/Options: GS18 / 10 k per 13" reel (8 mm tape), 10 k/box GS08 / 2.5 k per 7" reel (8 mm tape), 12.5 k/box Applications • Applications where a very low forward voltage is required Parts Table Part BAS86 Ordering code BAS86-GS18 or BAS86-GS08 Marking Remarks Tape and Reel Absolute Maximum Ratings Tamb = 25 °C, unless otherwise specified Parameter Continuous reverse voltage Forward continuous current Repetitive peak forward current Power dissipation 1) 1) Test condition Tamb = 25 °C tp < 1 s, Tamb = 25 °C, ν ≤ 0.5 Tamb = 25 °C Symbol VR IF IFRM Ptot Value 50 200 1) Unit V mA mA mW 5001) 200 1) Valid provided that electrodes are kept at ambient temperature Thermal Characteristics Tamb = 25 °C, unless otherwise specified Parameter Thermal resistance junction to ambient air Junction temperature Ambient operating temperature range Storage temperature range 1) Test condition Symbol RthJA Tj Tamb TS Value 3001) 125 - 65 to + 125 - 65 to +150 Unit K/W °C °C °C Valid provided that electrodes are kept at ambient temperature Document Number 85511 Rev. 1.7, 03-Mar-06 www.vishay.com 1 BAS86 Vishay Semiconductors Electrical Characteristics Tamb = 25 °C, unless otherwise specified Parameter Reverse breakdown voltage Leakage current Forward voltage Test condition IR = 10 µA (pulsed) V R = 40 V Pulse test tp < 300 µs, IF = 0.1 mA, δ < 2 % Pulse test tp < 300 µs, IF = 1 mA, δ < 2 % Pulse test tp < 300 µs, IF = 10 mA, δ < 2 % Pulse test tp < 300 µs, IF = 30 mA, δ < 2 % Pulse test tp < 300 µs, IF = 100 mA, δ < 2 % Diode capacitance Reverse recovery time VR = 1 V, f = 1 MHz IF = 10 mA, IR = 10 mA, Irr = 1 mA, Symbol V(BR) IR VF VF VF VF VF Ctot trr 200 275 365 460 700 Min 50 5 300 380 450 600 900 8 5 Typ. Max Unit V µA mV mV mV mV mV pF ns Typical Characteristics Tamb = 25 °C, unless otherwise specified P - Reverse Power Dissipation (mW) R 500 450 400 350 300 250 200 150 100 50 0 25 50 75 R thJA = 540 K/W PR - Limit at 80 % VR 100 125 150 PR - Limit at 100 % V R V R = 50 V IF - Forward Current (A) 1000 Tj = 150 °C 100 Tj = 25 °C 10 1 0.1 0 15829 0.5 1.0 1.5 15827 Tj - Junction Temperature (°C) V F - Forward Voltage (V) Figure 1. Max. Reverse Power Dissipation vs. Junction Temperature Figure 3. Forward Current vs. Forward Voltage 10000 C D - Diode Capacitance (pF) V R = V RRM I R - Reverse Current (µA) 1000 10 9 8 7 6 5 4 3 2 1 0 50 75 100 125 150 15830 f = 1 MHz 100 10 1 25 15828 0.1 1 10 100 Tj - Junction Temperature (°C) V R - Reverse Voltage (V) Figure 2. Reverse Current vs. Junction Temperature www.vishay.com 2 Figure 4. Diode Capacitance vs. Reverse Voltage Document Number 85511 Rev. 1.7, 03-Mar-06 BAS86 Vishay Semiconductors Package Dimensions in mm (Inches) Cathode indification 0.47 max. (0.019) 3.7 (0.146) 3.3 (0.130) foot print recommendation: 2.5 (0.098) max 1.6 (0.063) 1.4 (0.055) 1.25 (0.049) min 2.0 (0.079) min 5.0 (0.197) ref Document no.: 6.560-5005.01-4 Rev. 7 - Date: 07.February.2005 96 12070 Document Number 85511 Rev. 1.7, 03-Mar-06 www.vishay.com 3 BAS86 Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany www.vishay.com 4 Document Number 85511 Rev. 1.7, 03-Mar-06 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1