SUB75N06-07L

SUP/SUB75N06-07L Vishay Siliconix N-Channel 60-V (D-S) 175_C MOSFET PRODUCT SUMMARY V(BR)DSS (V) 60 0.0085 @ VGS = 4.5 V rDS(on) (W) 0.0075 @ VGS = 10 V ID (A) 75a TO-220AB D TO-263 G DRAIN connected to TAB G GDS Top View SUP75N06-07L DS S N-Channel MOSFET Top View SUB75N06-07L ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED) Parameter Gate-Source Voltage Continuous Drain Current (TJ = 175_C) Pulsed Drain Current Avalanche Current Repetitive Avalanche Energyb Power Dissipation Operating Junction and Storage Temperature Range L = 0.1 mH TC = 25_C (TO-220AB and TO-263) TA = 25_C (TO-263)d PD TJ, Tstg TC = 25_C TC = 125_C ID IDM IAR EAR Symbol VGS Limit "20 75a 55 240 60 280 250c 3.7 –55 to 175 Unit V A mJ W _C THERMAL RESISTANCE RATINGS Parameter PCB Mount (TO-263)d Junction-to-Ambient Junction-to-Case Notes a. Package limited. b. Duty cycle v 1%. c. See SOA curve for voltage derating. d. When mounted on 1” square PCB (FR-4 material). Document Number: 70776 S-05111—Rev. F, 10-Dec-00 www.vishay.com Free Air (TO-220AB) RthJA RthJC Symbol Limit 40 62.5 0.6 Unit _C/W 2-1 SUP/SUB75N06-07L Vishay Siliconix SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED) Parameter Static Drain-Source Breakdown Voltage Gate Threshold Voltage Gate-Body Leakage V(BR)DSS VGS(th) IGSS VGS = 0 V, ID = 250 mA VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 60 V, VGS = 0 V Zero Gate Voltage Drain Current IDSS VDS = 60 V, VGS = 0 V, TJ = 125_C VDS = 60 V, VGS = 0 V, TJ = 175_C On-State Drain Currenta ID(on) VDS = 5 V, VGS = 10 V VGS = 10 V, ID = 30 A Drain-Source On-State Resistancea rDS(on) VGS = 4.5 V, ID = 20A VGS = 10 V, ID = 30 A, TJ = 125_C VGS = 10 V, ID = 30 A, TJ = 175_C Forward Transconductancea gfs VDS = 15 V, ID = 30 A 30 120 0.0061 0.0071 0.0075 0.0085 0.012 0.015 S W 60 V 1.0 3.0 "100 1 50 250 A mA nA Symbol Test Condition Min Typ Max Unit Dynamicb Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Chargec Gate-Source Chargec Gate-Drain Chargec Turn-On Delay Timec Rise Timec Turn-Off Delay Timec Fall Timec Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf VDD = 30 V, RL = 0.47 W ID ^ 75 A, VGEN = 10 V, RG = 2.5 W VDS = 30 V, VGS = 10 V, ID = 75 A VGS = 0 V, VDS = 25 V, f = 1 MHz 6300 920 350 75 18 27 14 15 150 50 40 40 300 100 ns 120 nC pF Source-Drain Diode Ratings and Characteristics (TC = 25_C)b Continuous Current Pulsed Current Forward Voltagea Reverse Recovery Time Peak Reverse Recovery Current Reverse Recovery Charge IS ISM VSD trr IRM(REC) Qrr IF = 75 A, di/dt = 100 A/ms IF = 75 A , VGS = 0 V 1.0 67 6 0.2 75 A 240 1.3 120 8 0.48 V ns A mC Notes a. Pulse test: pulse width v 300 msec, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. www.vishay.com 2-2 Document Number: 70776 S-05111—Rev. F, 10-Dec-00 SUP/SUB75N06-07L Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) Output Characteristics 250 VGS = 10 thru 5 V 150 I D – Drain Current (A) 150 I D – Drain Current (A) 4V 200 Transfer Characteristics 200 100 100 50 TC = 125_C 25_C 50 3V –55_C 3 4 5 0 0 2 4 6 8 10 0 0 1 2 VDS – Drain-to-Source Voltage (V) VGS – Gate-to-Source Voltage (V) Transconductance 180 –55_C 25_C 0.010 On-Resistance vs. Drain Current 150 g fs – Transconductance (S) 0.008 r DS(on) – On-Resistance ( Ω ) VGS = 4.5 V 120 125_C 90 0.006 VGS = 10 V 0.004 60 30 0.002 0 0 20 40 60 80 100 0.000 0 20 40 60 80 100 VGS – Gate-to-Source Voltage (V) ID – Drain Current (A) Capacitance 10000 20 Gate Charge 8000 C – Capacitance (pF) Ciss 6000 V GS – Gate-to-Source Voltage (V) 16 VDS = 30 V ID = 75 A 12 4000 8 2000 Crss 0 0 10 20 30 Coss 4 0 40 50 60 0 25 50 75 100 125 VDS – Drain-to-Source Voltage (V) Qg – Total Gate Charge (nC) Document Number: 70776 S-05111—Rev. F, 10-Dec-00 www.vishay.com 2-3 SUP/SUB75N06-07L Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) On-Resistance vs. Junction Temperature 2.2 VGS = 10 V ID = 30 A I S – Source Current (A) TJ = 150_C TJ = 25_C 10 100 Source-Drain Diode Forward Voltage 1.9 r DS(on) – On-Resistance ( Ω ) (Normalized) 1.6 1.3 1.0 0.7 0.4 –50 1 –25 0 25 50 75 100 125 150 175 0 0.3 0.6 0.9 1.2 1.5 TJ – Junction Temperature (_C) VSD – Source-to-Drain Voltage (V) THERMAL RATINGS Maximum Avalanche and Drain Current vs. Case Temperature 100 500 Safe Operating Area 80 100 I D – Drain Current (A) I D – Drain Current (A) 60 Limited by rDS(on) 10 ms 100 ms 40 1 ms 10 TC = 25_C Single Pulse 20 10 ms 100 ms dc 0 0 25 50 75 100 125 150 175 TC – Case Temperature (_C) 2 1 Normalized Effective Transient Thermal Impedance 1 0.1 1 10 VDS – Drain-to-Source Voltage (V) 100 Normalized Thermal Transient Impedance, Junction-to-Case Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10–5 10–4 10–3 10–2 Square Wave Pulse Duration (sec) 10–1 1 3 www.vishay.com 2-4 Document Number: 70776 S-05111—Rev. F, 10-Dec-00